CN115668704A - Drive device with cooled terminal box - Google Patents

Drive device with cooled terminal box Download PDF

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Publication number
CN115668704A
CN115668704A CN202180035350.XA CN202180035350A CN115668704A CN 115668704 A CN115668704 A CN 115668704A CN 202180035350 A CN202180035350 A CN 202180035350A CN 115668704 A CN115668704 A CN 115668704A
Authority
CN
China
Prior art keywords
circuit board
cooling plate
holder
drive device
power module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180035350.XA
Other languages
Chinese (zh)
Inventor
D·德根
S·约赫姆
M·哈默
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEW Eurodrive GmbH and Co KG
Original Assignee
SEW Eurodrive GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEW Eurodrive GmbH and Co KG filed Critical SEW Eurodrive GmbH and Co KG
Publication of CN115668704A publication Critical patent/CN115668704A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K5/00Casings; Enclosures; Supports
    • H02K5/04Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/22Auxiliary parts of casings not covered by groups H02K5/06-H02K5/20, e.g. shaped to form connection boxes or terminal boxes
    • H02K5/225Terminal boxes or connection arrangements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0026Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049Pressing means used to urge contact, e.g. springs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209Heat transfer by conduction from internal heat source to heat radiating structure

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a drive device having a terminal box, wherein the terminal box has a lower part (1) and a cover part (2) connected to the lower part (1). The power module is arranged on the circuit board stack (22) and is connected to the cooling plate (20). Furthermore, the cooling plate (20) is connected to a holding element (21) which is arranged in a manner pressed against the cover element (2) by at least one spring element (51) supported on the lower part (1).

Description

Drive device with cooled terminal box
Background
DE 103 28 B4 discloses a drive, in particular a compact drive, which is designed as a variable current motor with a reduction gear.
An electronic device with a power module is known from DE 10 2018 000 961 A1.
An electronic device with a circuit carrier in a card housing is known from DE 10 2011 005 890 A1.
A semiconductor device is known from DE 10 2012 202 785 A1.
DE 102 39 A1 discloses a device for mounting the power and control electronics of an electric machine.
A motor control device is known from DE 11 2007 002 019 T5.
A heat sink in a PC is known from US 2006/0 275 100 A1.
A power converter is known from US 2015/0 123 261 A1.
A cooling device is known from US 2013/0 250 523 A1.
Disclosure of Invention
It is therefore an object of the present invention to provide a simple production of the drive device.
According to the invention, this object is achieved by a drive device according to the features specified in claim 1 or 2.
In a drive device, in particular a compact drive device, having a terminal box, an important feature of the invention is that the terminal box has a lower part and a cover connected to the lower part,
wherein power modules, in particular heat-generating power modules, are connected to the cooling plate,
wherein the cooling plate is connected with the holding piece,
the holding element is arranged pressed by at least one spring element supported on the lower element against the cover element, in particular against the inner side of the cover element.
The advantage here is that the power module, together with the cooling plate, can be designed to be preassembled. The cover is thus removable and the power module is nevertheless held by the holder, to which the cooling plate is also connected. In this way, particularly after removal of the cover, simple production, particularly wiring within the junction box, can be carried out. By preassembling, the power module is also held by a holder fixed at the lower part. Thus ensuring a strong structure. Furthermore, the holding part encloses the circuit board stack connected to the power module in a form-fitting manner. In this way, the electronic components mounted on the circuit board stack are also arranged in a protected manner.
In an advantageous embodiment, the power module is mounted on a first circuit board of the circuit board stack,
the circuit board stack has at least one second circuit board, which is parallel to the first circuit board. The advantage here is that simple production is possible.
In an advantageous embodiment, the first printed circuit board and the second printed circuit board are connected at least by means of pins which pass through the printed circuit boards, in particular and are soldered to the printed circuit boards. The advantage here is that simple production is possible.
In an advantageous embodiment, the cover part has cooling ribs/cooling fins and/or cooling fingers on its surface, in particular on its outer surface. The advantage here is that an improved heat dissipation can be achieved.
In an advantageous embodiment, the holder has a cutout, wherein the power module passes through the cutout, in particular towards the cooling plate. The advantage here is that an improved heat dissipation can be achieved. Since the cooling plate can be made of a thermally conductive material as a holder and thus a direct introduction of the heat generated by the power module, i.e. not indirectly via the holder, can be achieved. The holder can thus be made of a material which has a higher load-bearing capacity than the cooling plate.
In an advantageous embodiment, the first printed circuit board is arranged on a side of the holder facing away from the cooling plate. The advantage here is that the holder is arranged in the middle and therefore the power module is spaced apart from the holder in the cutout. Therefore, expansion due to heat can be absorbed.
In an advantageous embodiment, the cooling plate covers, covers and/or closes the recess. The advantage here is that it extends further in a transverse direction transverse to the stacking direction of the circuit board stack than in a direction parallel to the stacking direction.
In an advantageous embodiment, the spring element is arranged between the holding element and the lower element. The spring element can be supported on the lower part and the holding element can be acted upon by the spring element with a spring force generated by the spring element toward the cover element, i.e. away from the lower part. That is, the spring element is arranged in the terminal box with a pretension between the holding element and the lower element.
In an advantageous embodiment, the movement of the holder is guided by means of a guide. The advantage here is that a robust operating mode can be achieved.
In an advantageous embodiment, the movement of the holding element is limited by means of a limiting element. The advantage here is that the preassembled unit can be held together by means of the retaining mechanism, since the retaining mechanism is retained on the lower part by the stop element, i.e. in particular cannot be removed from the lower part to a greater extent than is predetermined by the stop element.
In an advantageous embodiment, the sleeve serves as a guide. The advantage here is that the spring element can be moved back and forth along the sleeve.
In an advantageous embodiment, a screw with a screw head that is screwed into a threaded bore of the lower part or a screw that is inserted or screwed into a bore of the lower part together with a nut that is screwed onto the threaded region of the screw serves as a stop. The advantage here is that simple and cost-effective production can be achieved. In particular, very inexpensive components can be used.
In an advantageous embodiment, a spring element, in particular a spring element designed as an annular spring, is fitted onto the or a sleeve,
wherein the sleeve passes through the other notch of the holding piece,
in particular, the sleeve rests against a stop, in particular a washer, a nut or a screw head. The advantage here is that the spring element is guided and therefore a device that can be produced in a simple manner can be used, in which a reliable mode of operation can be implemented.
In an advantageous embodiment, one or the bolts pass through the sleeve, in particular and therefore also through the holder,
the bolt is inserted or screwed into the lower part and has or is connected to a stop element on the side of the holding element facing away from the lower part. The bolt has the advantage that it supports a stop element, which limits the freedom of movement of the holding element, in particular the play. Thus, the retaining mechanism can reciprocate along the sleeve, but the movement is limited by the limit stop. The lower part connected to the circuit board stack is therefore constructed to be preassembled.
In an advantageous embodiment, the holder has a preferably planar base region,
wherein the holder has a cutout through which the power module passes, in particular toward the cooling plate,
wherein the arm region of the holding element adjoins the base region,
wherein the arm areas are all spaced apart from each other, in particular in a circumferential direction with reference to a normal direction of a plane receiving one circuit board of the stack of circuit boards,
in particular, each arm region has a respective recess through which the respective sleeve passes. The advantage here is that the arm region laterally delimits the circuit board stack and therefore the circuit board stack is held in a form-fitting manner. Furthermore, the curved embodiment of the arm region makes it possible to provide a large distance between the cover element and the lower part, in particular a distance greater than the extent of the contact region of the spring element with the lower part to the contact region of the cooling plate on the inside of the cover element.
In an advantageous embodiment, each arm region has at least two bending points which are in particular opposite one another,
in particular, the bending angle of each bending point has a value of between 70 ° and 110 °, in particular 90 °. The advantage here is that a large distance between the cover and the lower part can be bridged.
In an advantageous embodiment, the distance between the region of the spring element contacting the lower element and the region of the cooling plate contacting the cover element is:
larger than the extension of the circuit board stack together with the power module and the cooling plate,
or greater than the sum of the extension of the spring element and the extension of the circuit board stack together with the power module and the cooling plate,
wherein the extension is measured in a direction normal to a plane receiving one of the circuit boards of the stack of circuit boards. The advantage here is that sufficient free space can be provided for wires, cables, etc., and that fitting space for handling screws, etc., can be provided.
In an advantageous embodiment, the distance between the holes of the lower part receiving the bolts and the contact areas of the cooling plate and the cover is greater than the extension of the circuit board stack together with the power module and the cooling plate,
wherein the extension is measured in a direction normal to a plane receiving one of the circuit boards of the stack of circuit boards. The advantage here is that a larger distance is provided for establishing the electrical connection to the line and thus simpler production is possible.
In an advantageous embodiment, a plug connector is mounted on a third circuit board of the circuit board stack,
the plug-in connection can be plug-in connected with a mating plug-in connection, the stator winding conductor of the motor of the drive device is connected, in particular conductively connected, with the contact of the mating plug-in connection,
and/or bus lines and/or supply lines which are guided through the cable screw sleeve connection are connected, in particular conductively connected, to the contacts of the mating plug connector. The advantage here is that simple contacting can be achieved by means of a plug connection to the mating plug connector.
In an advantageous embodiment, the cooling plate is made of metal, in particular aluminum,
wherein the holding element is made of metal, in particular steel,
wherein the cover is made of metal, in particular aluminum. The advantage here is that a high thermal conductivity enables an effective dissipation of the heat flow of the power module and the holder transmits a high contact pressure. Since the power module passes through the notch of the holder and is connected with the aluminum cooling plate, the power module is spaced apart from the holder. The holder can therefore be made of another material, so that different thermal expansions caused by heat can be absorbed at intervals.
Further advantages are given by the dependent claims. The invention is not limited to the combination of features of the claims. Other possible combinations of the features of the claims and/or of the individual claims and/or of the features of the description and/or of the drawings can be derived by the person skilled in the art, in particular from the objects set forth and/or by comparison with the prior art.
Drawings
The invention will now be described in detail with reference to the schematic drawings:
fig. 1 shows a front view of a drive device according to the invention with a terminal box with a cover.
Fig. 2 shows a side view of the drive with the cover removed.
Fig. 3 shows a longitudinal section of the region of the terminal box.
Fig. 4 shows an oblique view of the drive with the cover removed.
Fig. 5 shows a front view of the holder 21 with the circuit board stack 22.
Fig. 6 shows a cross section of the holder 21 and the circuit board stack 22.
Fig. 7 shows a top view of the junction box with the cover 2 removed.
Detailed Description
As shown in the figures, the drive device has a motor, in particular with a reduction gear, wherein the terminal box of the motor has a lower part 1 and a cover 2 mounted on the lower part to form the terminal box.
The cover 2 has cooling ribs, in particular on its outer side facing away from the electric machine.
A circuit board stack 22 is arranged in the terminal block.
The first circuit board 61 is equipped with a power module 65 having controllable semiconductor switches, in particular MOSFETs or IGBTs. The semiconductor switches are preferably arranged in three half-bridges which are connected in parallel with one another, so that these half-bridges form an inverter from which the electric machine can be fed and thus operated with rotational speed regulation.
The second circuit board 62 of the circuit board stack 22 is equipped with signal electronics which generate control signals, in particular pulse-width modulated, for the controllable semiconductor switches of the first circuit board 61.
The third circuit board 63 of the circuit board stack 22 is fitted with a plug connector.
The first, second and third printed circuit boards 61, 62, 63 are connected by means of pins which pass through these printed circuit boards 61, 62, 63, in particular are soldered to the printed circuit boards. The circuit board stack 22 thus formed is pressed with its power module 65 onto the cooling plate 20.
The heat flow generated by the power module 65 is thus diffused in the cooling plate 20 and discharged to the surroundings by pressing the cooling plate 20 onto the cover 2, in particular onto the inner side of the cover 2.
The cover 2 has cooling ribs on its outer side, so that heat is discharged to the surroundings via the thus enlarged surface.
The pressing of the circuit board stack 22 is effected by a spring element 51 which is fitted onto the sleeve 60 and which is supported on the one hand on the lower part 1 and on the other hand on the holding element 21, against which the cooling plate 20 bears, so that the holding element 21, to which a force is applied by the spring element 51, presses the cooling plate 20 onto the cover element 2, in particular onto the inner side of the cover element 2.
Preferably, a thermally conductive paste can also be arranged between the cooling plate 20 and the cover member 2.
The holder 21 is thus arranged on the side of the cooling plate 20 facing away from the cover 2.
The first end region of the screw 50, which projects through the corresponding sleeve 60, is at least partially inserted into the bore of the lower part 1 or is designed as a threaded region and is screwed into a threaded bore of the lower part 1. The other end region of the bolt 50 has a threaded region, onto which a nut 52 is screwed, against which an orifice plate 53 bearing against a sleeve 60 bears. Thus, by screwing the nut 52 onto the threaded region of the bolt 50, the sleeve 60 is fixed on the lower part 1 and the working region of the spring element 51, which is fitted onto the sleeve 60, is defined.
The spring element 51 thus presses the holding element 21 in the direction of the perforated plate 53, in particular the washer. However, the holder 21 is thus pressed in the direction towards the cover 2 and thus the cooling plate 20 is pressed onto the inside of the cover 2.
As shown in fig. 7, the cooling plate 20 is connected to the holder 21 by means of first screws 71. The cooling plate 20 is connected with the power module 65 of the circuit board stack 22 by means of second screws 72.
The holding part 21 is preferably designed as a punch-out part.
The holder 21 has a cutout, through which the power module 65 passes, in order to be able to be connected in particular to the cooling plate 20 placed on the holder 21.
The first screw 71 is screwed with its threaded region into the holding part 21, in particular into a bore machined therein. The heads of the respective screws 71 press the cooling plate 20 onto the holder 21.
The second screw 72 is screwed with its threaded region into the power module 65, in particular into a hole machined therein. The heads of the respective screws 72 press the cooling plate 20 onto the power module 65.
The holder 21 has a preferably flat base region with a cutout, through which the power module 65 projects toward the cooling plate.
Connected to the base region are arm regions which are all spaced apart from one another and each have a recess through which the respective sleeve 60 passes, wherein the respective screw 50 passes through the respective sleeve 60.
The circuit board stack 22 together with the power module 65 is therefore arranged in a protected manner inside the terminal box of the drive device, so that the cover 2 and the lower part 1 enclose the circuit board stack in such a way that a housing is formed. A mating plug connection can be connected to the plug connection 64 mounted on the third circuit board 63, so that the lines of the stator winding from the motor of the drive device can be electrically connected and/or the lines from the ac voltage source can be electrically connected.
The circuit board stack 22 preferably functions as a current transformer so that the rotational speed or torque of the motor is adjustable.
Each arm region has two bending points, each of which has a 90 ° bend, in particular wherein the first bending point is designed opposite the second bending point. Thus, spring elements 51 can be used which extend in the direction of the center axis of the bolt 50 or the sleeve 60 less than the circuit board stack.
It is in any case important that the spacing between the holes of the lower part 1 receiving the bolts 50 and the contact areas of the cooling plate 20 and the cover 2 is greater than the extension of the circuit board stack 22 together with the power module 65 and the cooling plate 20.
Preferably, the central axis is oriented parallel to the normal direction of the plane containing one of the circuit boards 61, 62, 63 oriented parallel to each other.
The data bus lines are routed to the plug connectors 64 of the circuit board stack 22 via cable leadthroughs arranged in the wall of the lower part 1.
As shown in fig. 4, the holding part 21 encompasses the circuit board stack 22 with its arm regions in a spider-like and/or claw-like manner. The circuit boards 61, 62, 63 are therefore preferably received in the holding part 21 in a form-fitting manner, since at least one arm region is arranged on each of the sides of the circuit board stack 22 that do not face the lower part 1.
In other embodiments according to the invention, instead of a nut with a washer, a limitation implemented in other ways is implemented with regard to the freedom of movement of the holder. For example, the sleeve 60 is eliminated and the bolt has a widening instead of the screwed nut 52 and the sleeved perforated plate 53. Instead of the screw 50, a screw with a screw head can therefore also be screwed into the threaded hole of the lower part 1.
Therefore, a sleeve for guiding the spring element 51 is also not required, since the screw or bolt 50 can be guided. For this purpose, a smooth surface is preferably formed on the screw or bolt 50.
List of reference numerals:
1. lower part
2. Cover member
20. Cooling plate
21. Holding member
22. Circuit board stack connected with pins
50. Bolt
51. Spring element
52. Nut
53. Orifice plate, in particular gasket
60. Sleeve barrel
61. First circuit board of circuit board stack 22
62. Second circuit board of the circuit board stack 22
63. Third circuit board of circuit board stack 22
64. Plug-in connection
65. Power module
71. First screw for connecting holder 21 to cooling plate 20
72. Second screw for connecting holder 21 to power module 65

Claims (15)

1. A drive device with a terminal box is provided,
the junction box has a lower part and a cover connected to the lower part,
the power module, in particular the heat-generating power module, is connected to the cooling plate,
the cooling plate is connected to the holder member,
the holding element is arranged pressed by at least one spring element supported on the lower part toward the cover element, in particular toward the inside of the cover element.
2. A driving device with a terminal box is provided,
the junction box has a lower part and a cover connected to the lower part,
the power module is connected with the cooling plate,
the cooling plate is connected to the holder member,
the holding member is arranged pressed toward the lid member by at least one spring member supported on the lower member,
the holder has a preferably flat base region,
the holder has a corresponding notch, through which the power module passes,
the arm region of the retaining member abuts the base region,
the arm regions are all spaced from each other,
each arm region has at least two, in particular mutually opposite, bending points.
3. The drive device according to claim 1 or 2,
it is characterized in that the preparation method is characterized in that,
the power module is mounted on a first circuit board of the circuit board stack,
the circuit board stack has at least one second circuit board, which is parallel to the first circuit board.
4. The drive device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
the first circuit board and the second circuit board are connected at least by means of pins which pass through the circuit boards (61, 62, 63), in particular which are soldered to the circuit boards (61, 62, 63),
and/or the presence of a gas in the atmosphere,
the cover part has cooling ribs and/or cooling fingers on its surface, in particular on its outer surface.
5. The drive device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
the holder has an opening, wherein the power module passes through the opening, in particular toward the cooling plate.
6. Drive arrangement according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
the first circuit board is arranged on a side of the holder facing away from the cooling plate.
7. The drive device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
the cooling plate covers, covers and/or closes the gap,
and/or the presence of a gas in the atmosphere,
a spring member is disposed between the retaining member and the lower member.
8. The drive device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
the movement of the holder is guided by means of a guide,
and/or the presence of a gas in the gas,
the movement of the retainer is limited by means of a limit stop.
9. The drive device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
the sleeve functions as a guide member and,
and/or the presence of a gas in the atmosphere,
a screw with a screw head, which is screwed into a threaded hole of the lower part, or a bolt, which is inserted or screwed into a hole of the lower part, together with a nut screwed onto the threaded region of the bolt, acts as a stop.
10. Drive arrangement according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
a spring element, in particular designed as an annular spring, is fitted onto the or a sleeve,
the sleeve passes through another notch of the holder,
in particular, the sleeve rests against a stop, in particular a washer, a nut or a screw head.
11. The drive device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
one or the bolts pass through the sleeve, in particular and therefore also through the holder,
the screw is inserted or screwed into the lower part, with or connected to one or more stop elements on the side of the holding element facing away from the lower part.
12. The drive device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
the holder has a preferably flat base region,
the holder has a corresponding recess through which the power module passes, in particular towards the cooling plate,
the arm region of the retaining member abuts the base region,
the arm areas are all spaced apart from each other, in particular in a circumferential direction with reference to a normal direction of a plane receiving one circuit board of the circuit board stack,
in particular, each arm region has a respective recess through which the respective sleeve passes.
13. The drive device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
each arm region has at least two, in particular oppositely directed, bending points,
in particular, the value of the bending angle of each bending point is between 70 ° and 110 °, in particular 90 °,
and/or the presence of a gas in the gas,
spacing between the region of the spring element contacting the lower element and the region of the cooling plate contacting the cover element
Larger than the extension of the stack of circuit boards together with the power module and the cooling plate,
or greater than the sum of the extension of the spring element and the extension of the circuit board stack together with the power module and the cooling plate,
the extension is measured in the direction of the normal to the plane of the one circuit board receiving the stack of circuit boards.
14. The drive device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
the spacing between the holes of the lower part receiving the bolts and the contact areas of the cooling plate and the cover is greater than the extension of the circuit board stack together with the power module and the cooling plate,
the extension is measured in a direction normal to a plane receiving one of the circuit boards of the stack of circuit boards.
15. Drive arrangement according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
a plug connector is mounted on a third circuit board of the circuit board stack,
the plug connector can be plug-connected to a mating plug connector, the stator winding conductors of the electric motor of the drive device being connected, in particular conductively connected, to the contacts of the mating plug connector, and/or the bus conductors and/or the supply conductors guided by the cable screw sleeve connections being connected, in particular conductively connected, to the contacts of the mating plug connector,
and/or the presence of a gas in the gas,
the cooling plate is made of metal, in particular of aluminium,
the holder is made of metal, in particular steel,
the cover is made of metal, in particular of aluminium.
CN202180035350.XA 2020-05-15 2021-04-28 Drive device with cooled terminal box Pending CN115668704A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102020002929.9 2020-05-15
DE102020002929 2020-05-15
PCT/EP2021/061168 WO2021228555A1 (en) 2020-05-15 2021-04-28 Drive having a cooled terminal box

Publications (1)

Publication Number Publication Date
CN115668704A true CN115668704A (en) 2023-01-31

Family

ID=75769577

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180035350.XA Pending CN115668704A (en) 2020-05-15 2021-04-28 Drive device with cooled terminal box

Country Status (4)

Country Link
EP (1) EP4150744A1 (en)
CN (1) CN115668704A (en)
DE (1) DE102021002237A1 (en)
WO (1) WO2021228555A1 (en)

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DE10362240B4 (en) 2003-05-09 2017-11-30 Sew-Eurodrive Gmbh & Co Kg compact drive
US7342796B2 (en) 2005-06-03 2008-03-11 Southco, Inc. Captive shoulder nut assembly
JP4936019B2 (en) 2006-09-04 2012-05-23 株式会社安川電機 Motor control device
JP5510432B2 (en) 2011-02-28 2014-06-04 株式会社豊田自動織機 Semiconductor device
DE102011005890A1 (en) 2011-03-22 2012-09-27 Robert Bosch Gmbh Electronic device with circuit carrier in a plug-in housing
JP5725209B2 (en) 2012-01-23 2015-05-27 トヨタ自動車株式会社 Power converter and manufacturing method thereof
TWI479977B (en) 2012-03-23 2015-04-01 Wistron Corp Heat dissipation assembly and elastic fixing accessory thereof
JP6770863B2 (en) * 2016-09-26 2020-10-21 日立オートモティブシステムズ株式会社 Electric drive device and electric power steering device
DE102018000961A1 (en) 2017-02-20 2018-08-23 Sew-Eurodrive Gmbh & Co Kg Electronic arrangement with power module, circuit board and heat sink
CN111201699B (en) * 2017-09-29 2022-08-23 Lg伊诺特有限公司 Controller and motor part including the same
FR3074012B1 (en) * 2017-11-22 2019-12-06 Safran ELECTRONIC POWER MODULE

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Publication number Publication date
EP4150744A1 (en) 2023-03-22
WO2021228555A1 (en) 2021-11-18
DE102021002237A1 (en) 2021-11-18

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