CN115666088A - Electronic equipment and liquid cooling heat dissipation flow control method thereof - Google Patents

Electronic equipment and liquid cooling heat dissipation flow control method thereof Download PDF

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Publication number
CN115666088A
CN115666088A CN202211343019.7A CN202211343019A CN115666088A CN 115666088 A CN115666088 A CN 115666088A CN 202211343019 A CN202211343019 A CN 202211343019A CN 115666088 A CN115666088 A CN 115666088A
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China
Prior art keywords
liquid
temperature
electronic device
flow
outlet
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CN202211343019.7A
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CN115666088B (en
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郭良银
陈亚梯
赵志浩
甘绍朋
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SHENZHEN HANQIANG TECHNOLOGY CO LTD
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SHENZHEN HANQIANG TECHNOLOGY CO LTD
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The application provides electronic equipment and a liquid cooling heat dissipation flow control method thereof. The cold drawing is adjacent with electron device sets up, and the cold drawing is used for circulating the coolant liquid, for electron device heat dissipation, and the cold drawing includes inlet and liquid outlet. The flow regulating unit is arranged at the liquid inlet and used for regulating the flow of the cooling liquid flowing into the cold plate. The operation parameter acquisition unit is used for acquiring the operation parameters of the electronic device. The control unit is used for acquiring the operation parameters of the electronic device acquired by the operation parameter acquisition unit and controlling the flow regulation unit to regulate the flow of the cooling liquid flowing into the cold plate at least according to the acquired operation parameters. The application provides an electronic equipment can adjust the flow of coolant liquid according to electronic equipment's in-service use operating mode to the heat scheduling problem that is down because of the not enough arouses of coolant liquid flow has been avoided.

Description

Electronic equipment and liquid cooling heat dissipation flow control method thereof
Technical Field
The application relates to the technical field of heat dissipation of power electronic equipment, in particular to electronic equipment and a liquid cooling heat dissipation flow control method thereof.
Background
In the existing liquid cooling heat dissipation method for electronic equipment, cooling liquid is usually input into a cold plate at a fixed flow rate to dissipate heat of the electronic equipment, and the actual use condition of the electronic equipment is ignored in the heat dissipation mode, so that failure or even fault may be caused due to insufficient heat dissipation caused by insufficient cooling liquid.
Disclosure of Invention
In order to solve the technical problems, the application provides the electronic device and the liquid cooling heat dissipation flow control method thereof, which can adjust the flow of the cooling liquid according to the actual use working condition of the electronic device, so that downtime and even faults caused by insufficient cooling liquid are avoided.
The application provides an electronic device in a first aspect, the electronic device includes an electronic device, a cold plate, a flow regulating unit, an operation parameter acquiring unit and a control unit. The cold drawing with the electron device is adjacent to be set up, the cold drawing is used for circulating the coolant liquid, for the electron device heat dissipation, the cold drawing includes inlet and liquid outlet. The flow regulating unit is arranged at the liquid inlet and used for regulating the flow of the cooling liquid flowing into the cold plate. The operation parameter acquisition unit is used for acquiring the operation parameters of the electronic device. The control unit is used for acquiring the operating parameters of the electronic device acquired by the operating parameter acquisition unit and controlling the flow regulation unit to regulate the flow of the cooling liquid flowing into the cold plate at least according to the acquired operating parameters.
A second aspect of the present application provides a liquid cooling heat dissipation flow control method, which is applied to the electronic device, and the liquid cooling heat dissipation flow control method includes: collecting operating parameters of the electronic device; and acquiring the collected operating parameters of the electronic device, and controlling and adjusting the flow of the cooling liquid flowing into the cold plate at least according to the collected operating parameters.
According to the electronic equipment and the liquid cooling heat dissipation flow control method thereof, the operation parameters of the electronic device in the electronic equipment are collected in real time, and the flow of the cooling liquid is controlled and adjusted at least according to the collected operation parameters, so that the flow of the cooling liquid is adjusted according to the actual use working condition of the electronic device, and the problems of downtime or machine failure caused by insufficient flow of the cooling liquid and low working efficiency of the electronic device caused by overlarge flow of the cooling liquid can be solved.
Drawings
In order to more clearly illustrate the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and obviously, the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a block diagram of an electronic device according to an embodiment of the present disclosure.
Fig. 2 is a connection schematic diagram of a part of components of an electronic device according to an embodiment of the present application.
Fig. 3 is a schematic diagram of a first preset corresponding relationship provided in the embodiment of the present application.
Fig. 4 is a flowchart of a liquid cooling heat dissipation flow control method according to an embodiment of the present application.
Description of the main element symbols:
electronic device 100
Electronic device 10
Specific electronic device 11
Cold plate 20
Liquid inlet 21
Liquid outlet 22
Flow rate adjusting unit 30
Operating parameter acquisition unit 40
Control unit 50
First temperature acquisition unit 60
Second temperature collecting unit 70
Flow rate acquisition unit 80
Cooling liquid temperature adjusting assembly 90
Third temperature collecting unit 95
Liquid supply line 110
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present disclosure.
In the description of the present application, the terms "first", "second", "third", etc. are used for distinguishing different objects, not for describing a particular order, and further, the terms "upper", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present application.
Throughout the description of the present application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., as meaning fixedly attached, detachably attached, or integrally attached; the two elements can be directly connected, indirectly connected through an intermediate medium, or communicated with each other inside; may be a communication connection; may be an electrical connection. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Referring to fig. 1, fig. 1 is a block diagram of an electronic device 100 according to an embodiment of the present disclosure. As shown in fig. 1, the electronic apparatus 100 includes an electronic device 10, a cold plate 20, a flow regulating unit 30, an operation parameter acquiring unit 40, and a control unit 50. The cold plate 20 is disposed adjacent to the electronic device 10, the cold plate 20 is used for circulating a cooling fluid to dissipate heat of the electronic device 10, and the cold plate 20 includes a liquid inlet and a liquid outlet. The flow rate adjusting unit 30 is disposed at the liquid inlet, and the flow rate adjusting unit 30 is used for adjusting the flow rate of the cooling liquid flowing into the cold plate 20. The operation parameter acquiring unit 40 is used for acquiring operation parameters of the electronic device 10. The control unit 50 is configured to obtain the operation parameters of the electronic device 10 collected by the operation parameter collecting unit 40, and control the flow rate adjusting unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 according to at least the collected operation parameters.
The embodiment of the application provides electronic equipment 100 is through gathering in real time electronic device 10's operating parameter to at least according to the operating parameter control who gathers and adjust the flow of the coolant liquid that flows into cold plate 20, realized adjusting the flow of coolant liquid according to electronic device 10's in-service use operating mode, thereby can avoid the problem that the machine trouble that arouses because of coolant liquid flow is not enough and electronic device 10 work efficiency is low because of coolant liquid flow is too big.
The control unit 50, the operation parameter collecting unit 40 and the flow rate adjusting unit 30 may be connected in a wired or wireless manner.
The control unit 50 may be a single chip, a digital signal processor, a central processing unit, or other processing chips. The flow regulating unit 30 may be an electric valve, a speed-regulating water pump, a throttle valve, etc.
In some embodiments, the operating parameter may include an output power, and the operating parameter acquiring unit 40 is configured to acquire the output power of the electronic device 10.
A cooling flow channel is disposed in the cold plate 20, a projection of the cooling flow channel on the electronic device 10 is located within a range of the electronic device 10, two ends of the cooling flow channel are respectively communicated with the liquid inlet and the liquid outlet, the liquid inlet is communicated with a liquid supply pipeline 110 (as shown in fig. 2) and is used for inputting cooling liquid into the cooling flow channel by the liquid supply pipeline 110, and the liquid outlet is used for allowing the cooling liquid in the cooling flow channel to flow out. The cooling liquid flows into the cooling flow channel from the liquid supply pipeline 110 through the flow rate adjusting unit 30 and the liquid inlet, and when flowing through the cooling flow channel, the cooling liquid absorbs heat generated by the electronic device 10 and flows out from the liquid outlet, so that heat dissipation of the electronic device 10 is achieved.
Wherein the cooling fluid may be, etc.
Referring to fig. 1 and fig. 2, fig. 2 is a schematic connection diagram of a portion of components of an electronic device 100 according to an embodiment of the present disclosure. In some embodiments, as shown in fig. 2, the electronic device 100 further includes a first temperature collecting unit 60 disposed at the liquid inlet 21 and configured to collect a liquid inlet temperature of the cooling liquid flowing into the cold plate 20, and the control unit 50 is further configured to obtain the liquid inlet temperature collected by the first temperature collecting unit 60, determine a target flow range according to the collected liquid inlet temperature and the collected operation parameters, and control the flow regulating unit 30 to regulate the flow rate of the cooling liquid flowing into the cold plate 20 to be within the target flow range.
Wherein, flow in through real-time collection the temperature of the coolant liquid of cold plate 20 reaches electron device 10's operating parameter to feed liquor temperature and the flow of operating parameter control regulation inflow that gather the flow of the coolant liquid of cold plate 20 make not only can adjust the flow of coolant liquid according to electron device 10's the in-service use operating mode, can also adjust the flow of coolant liquid according to the temperature of coolant liquid, wherein, the flow of coolant liquid is adjusted to the temperature that combines coolant liquid and electron device 10's use operating mode, can for electron device 10 provides more accurate and suitable coolant liquid of flow and dispels the heat, makes electron device 10's temperature can not be too high or cross lowly.
The first temperature collecting unit 60 may be a temperature sensor, such as a thermistor temperature sensor, a thermocouple temperature sensor, or the like. The first temperature collection unit 60 may be connected to the control unit 50 in a wired or wireless manner.
In some embodiments, the control unit 50 determines, according to a preset first preset corresponding relationship between the liquid inlet temperature, the operation parameter, and the flow range of the cooling liquid, that the flow range corresponding to the currently collected liquid inlet temperature and the currently collected operation parameter is the target flow range.
Wherein the flow range may be a flow range, such as 10-12L/min; the flow range may also include a flow value, such as 10L/min.
The electronic device 100 may include a memory (not shown), and the first predetermined correspondence may be stored in the memory in advance.
In some embodiments, the first preset corresponding relationship defines a corresponding relationship among a plurality of liquid inlet temperatures, a plurality of operating parameters, and a flow range of the cooling liquid, and when the control unit 50 obtains the currently collected liquid inlet temperature and the currently collected operating parameters, the control unit determines a target flow range corresponding to the current liquid inlet temperature and the current operating parameters according to the first preset corresponding relationship.
Exemplarily, please refer to fig. 3, which is a schematic diagram of a first preset corresponding relationship provided in an embodiment of the present application. Wherein the operating parameter is output power and the flow range includes a flow value. As shown in fig. 3, the abscissa is the output power, the ordinate is the flow rate value, and the curve represents the feed liquid temperature. If the currently collected inlet liquid temperature is 25 ℃ and the currently collected output power is 30kW, the control unit 50 determines that the target flow range includes a flow value, specifically 8L/min, according to the first preset correspondence.
In other embodiments, the control unit 50 determines the target flow range directly from the collected operating parameters. Specifically, according to a preset corresponding relationship between the operation parameter and the flow range of the cooling liquid, the currently collected liquid inlet temperature and the flow range corresponding to the currently collected operation parameter are determined as the target flow range.
In some embodiments, as shown in fig. 1 and fig. 2, the electronic device 10 includes a specific electronic device 11, and the electronic apparatus 100 further includes a second temperature collecting unit 70, where the second temperature collecting unit 70 is disposed on the specific electronic device 11 and is configured to collect a temperature of the specific electronic device 11. The control unit 50 is further configured to obtain the temperature of the electronic device 10 collected by the second temperature collecting unit 70, determine that the temperature of the specific electronic device 11 is abnormal when the collected temperature of the specific electronic device 11 is outside a first preset temperature range, and control the flow rate adjusting unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 according to the collected temperature of the electronic device 10 until the temperature of the specific electronic device 11 is within the first preset temperature range.
Wherein the specific electronic device 11 is an electronic device of which the importance level is higher than a preset level among the electronic devices 10.
In some embodiments, the electronic apparatus 100 includes a dc power source connected to the electronic device 10, the dc power source is configured to output a dc power signal to the electronic device 10, and the electronic device 10 is configured to convert the dc power signal into a predetermined electrical signal and output the predetermined electrical signal. The specific electronic device 11 may include a key device of the electronic device 10 that converts the dc electrical signal into the predetermined electrical signal. The preset electrical signal may be a square wave signal, a pulse signal, or the like.
The first preset temperature range can be set according to actual requirements.
The second temperature collecting unit 70 may be a temperature sensor, such as a thermistor temperature sensor, a thermocouple temperature sensor, or the like. The second temperature collecting unit 70 may be connected with the control unit 50 in a wired or wireless manner.
The temperature of the specific electronic device 11 with a higher importance level is collected, and whether the temperature of the specific electronic device 11 is abnormal or not is judged, so that whether the current flow of the cooling liquid can meet the heat dissipation requirement of the key device or not can be accurately determined. And when the temperature of the specific electronic device 11 is abnormal, the flow of the cooling liquid is timely adjusted to dissipate heat of the specific electronic device 11, so that the temperature of the specific electronic device 11 is in a normal range, the key device can be prevented from being protected due to overhigh temperature of the key device, and the working efficiency of the key device can be improved due to overlow temperature of the key device.
Wherein the control unit 50 determines that the temperature of the specific electronic device 11 is normal when the temperature of the specific electronic device 11 is within the first preset range.
In some embodiments, when the temperature of the specific electronic device 11 is abnormal, the control unit 50 controls the electronic device 10 to be powered off to protect the electronic device 10 until the temperature of the specific electronic device 11 is within the first temperature range, and the control unit 50 controls the electronic device 10 to be powered on again. In some embodiments, the control unit 50 may control the electronic device 10 to be powered off immediately or after a delay of a preset time when the temperature of the specific electronic device 11 is abnormal.
In some embodiments, as shown in fig. 1 and fig. 2, the electronic apparatus 100 further includes a flow collecting unit 80 disposed between the liquid inlet 21 and the flow regulating unit 30 and/or at the liquid outlet 22, for collecting a flow of the cooling liquid at the liquid inlet 21 and/or at the liquid outlet 22. The control unit 50 is further configured to obtain the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22, which is acquired by the flow rate acquisition unit 80, determine that the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal when the acquired flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is outside the target flow rate range, and determine that the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is normal when the acquired flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is within the target flow rate range.
Wherein, the flow collecting unit 80 may be a flow meter.
The flow collection unit 80 may be connected to the control unit 50 in a wired or wireless manner.
By collecting the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22, it can be determined whether the flow rate of the cooling liquid flowing through the cold plate 20 is within a target flow rate range, so that the flow rate of the cooling liquid can be timely adjusted by the flow rate adjusting unit 30 when the flow rate is abnormal, and the electronic device 10 is prevented from being too cold due to poor heat dissipation effect or too low temperature of the cooling liquid due to abnormal flow rate.
In some embodiments, when the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal, the control unit 50 controls the electronic device 10 to be powered off to protect the electronic device 10, until the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is normal, the control unit 50 controls to start the electronic device 10 again. In some embodiments, the control unit 50 may control the electronic device 10 to power off immediately or after a preset time delay when the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal.
In some embodiments, the control unit 50 controls the flow rate adjusting unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 when the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal, until the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is within the target flow rate range.
In some embodiments, the control unit 50 is further configured to control the flow rate adjusting unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 at a first adjustment amplitude when the temperature of the specific electronic device 11 is abnormal until the temperature of the specific electronic device 11 is within the first preset temperature range, and determine whether the flow rate of the cooling liquid flowing into the cold plate 20 needs to be adjusted at a preset time interval when the temperature of the specific electronic device 11 is normal and the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal.
In some embodiments, when the temperature of the specific electronic device 11 is normal and the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal, the control unit 50 controls the second temperature collecting unit 70 to re-collect the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 after a preset time interval, and when the re-collected flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is outside the target flow rate range, controls the flow rate regulating unit 30 to regulate the flow rate of the cooling liquid flowing into the cold plate 20 at a second regulation amplitude until the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is within the target flow rate range, and determines that the flow rate of the cooling liquid flowing into the cold plate 20 does not need to be regulated when the re-collected flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is within the target flow rate range, wherein the first regulation amplitude is different from the second regulation amplitude.
If, after the preset time interval, the flow of the coolant at the liquid inlet 21 and/or the flow of the coolant at the liquid outlet 22, which are collected again, are within the target flow range, it is described that the flow of the coolant at the liquid inlet 21 and/or the flow of the coolant at the liquid outlet 22 are outside the target flow range, which is caused by transient unstable infusion, and the flow of the coolant is kept unchanged at this time, which not only can avoid frequent adjustment of the flow of the coolant, so that the electronic device 100 keeps a stable and good working state, but also can reduce power consumption.
If the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22, which is acquired again after the preset time interval, is still outside the target flow rate range, it is determined that the flow rate of the cooling liquid is stabilized at the current value, and at this time, the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is within the target range by adjusting the flow rate of the cooling liquid, so that the problem that the heat dissipation function is not satisfied due to insufficient or excessive flow rate of the cooling liquid can be avoided.
In some embodiments, the first adjustment magnitude is greater than the second adjustment magnitude. The specific values of the first adjustment range and the second adjustment range may be set according to actual requirements, and are not limited herein.
In some embodiments, when the temperature of the specific electronic device 11 is abnormal and the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is normal, the control unit 50 controls the flow rate adjusting unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 at a first adjustment amplitude until the temperature of the specific electronic device 11 is within the first preset temperature range.
In some embodiments, when the temperature of the specific electronic device 11 is abnormal and the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal, the control unit 50 controls the flow rate adjusting unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 at a first adjustment amplitude until the temperature of the specific electronic device 11 is within the first preset temperature range.
Because the specific electronic device 11 is a key device, when the temperature of the specific electronic device 11 is abnormal, the flow of the cooling liquid is immediately controlled and adjusted so that the temperature of the specific electronic device 11 is in a normal range, and the specific electronic device 11 can be prevented from being damaged in time.
When the temperature of the specific electronic device 11 and the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 are abnormal, the control unit 50 preferentially controls the flow rate adjusting unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 at a first adjustment amplitude, so as to adjust the temperature of the specific electronic device 11 to a normal range more quickly, and avoid that the specific electronic device 11 is in an overheated or overcooled state for a long time, which may cause damage or insufficient efficiency of the specific electronic device 11.
In some embodiments, as shown in fig. 1, the electronic device 100 further includes a coolant temperature adjustment assembly 90, and the coolant temperature adjustment assembly 90 is connected to the flow rate adjustment unit 30 for adjusting the temperature of the intake liquid. The control unit 50 is configured to control the coolant temperature adjusting assembly 90 to heat or cool the coolant when the feed liquid temperature collected by the first temperature collecting unit 60 is outside a second preset temperature range, and the control unit 50 is configured to control the coolant to be input into the cold plate 20 when the feed liquid temperature is adjusted to be within the second preset temperature range by the coolant temperature adjusting assembly 90.
The coolant temperature adjustment assembly 90 may include a cooler and a heater, and when the inlet temperature of the coolant is lower than the lower limit value of the second preset temperature range, the control unit 50 controls the heater to heat the coolant until the inlet temperature of the coolant is within the second preset temperature range; when the feed liquid temperature of the cooling liquid is higher than the upper limit value of the second preset temperature range, the control unit 50 controls the cooler to cool the cooling liquid until the second temperature of the cooling liquid is within the second preset temperature range. The cooler and the heater may be connected to the control unit 50 by wire or wirelessly.
The second preset temperature range may be set according to actual requirements, and in some embodiments, the preset temperature range may be 25 to 30 ℃.
Before the cooling liquid is input into the cold plate 20, the temperature of the cooling liquid is adjusted to the second preset temperature range, so that the influence on the heat dissipation effect caused by too low or too high temperature of the cooling liquid input into the cold plate 20 can be avoided.
In some embodiments, during the operation of the electronic device 10, when the inlet temperature of the cooling liquid is outside the second preset temperature range, the control unit 50 determines that the inlet temperature is abnormal, and controls the electronic device 10 to be powered off to protect the electronic device 10, until the inlet temperature of the cooling liquid is adjusted to be within the second preset temperature range, the control unit 50 controls to start the electronic device 10 again. In some embodiments, the control unit 50 may control the electronic device 10 to be powered off immediately or after a preset time delay when the feed temperature of the cooling liquid is abnormal.
In some embodiments, before the electronic device 10 is started for the first time after the electronic apparatus 100 is powered on, the control unit 50 is configured to adjust the inlet temperature of the cooling fluid to be within the second preset temperature range through the cooling fluid temperature adjustment assembly 90, and control to start the electronic device 10 after the cooling fluid with the temperature within the second preset temperature range is input into the cold plate 20 at a preset flow rate.
The preset flow rate may be set according to an actual requirement, and in some embodiments, the preset flow rate may be a maximum flow rate, and obviously may also be other values.
Before the electronic device 10 is started for the first time, the cooling liquid is input to the cold plate 20 according to the preset flow, so that heat can be dissipated for devices in the electronic equipment 100 except the electronic device 10, the temperature in the electronic equipment 100 is not too high, the electronic device 10 can be prevented from being started at a higher temperature, and the electronic device 10 is protected.
After the electronic device 10 is started, the control unit 50 obtains the operation parameters collected by the operation parameter collection unit 40, determines a target flow range at least according to the collected operation parameters, and controls the flow adjustment unit 30 to adjust the flow of the coolant flowing into the cold plate 20 from the preset flow to a value within the target flow range, so as to realize heat dissipation of the electronic device 10 according to the actual working condition of the electronic device 10.
Wherein, in some embodiments, the control unit 50 determines the target flow range based on the collected operating parameters. In other embodiments, the control unit 50 determines the target flow range based on the collected operating parameters and the inlet temperature.
In some embodiments, the electronic apparatus 100 further includes a third temperature collecting unit 95 disposed at the liquid outlet 22 for collecting an outlet temperature of the cooling liquid at the liquid outlet 22. The control unit 50 is further configured to obtain the liquid outlet temperature collected by the third temperature collecting unit 95, and determine whether the electronic device 100 is abnormal according to the liquid outlet temperature, the liquid inlet temperature and the operation parameter collected currently, and determine that the electronic device 100 is abnormal, control the electronic device 100 to send an abnormal prompt message so that the user can timely inspect the electronic device 100.
The electronic device 100 may include an alarm component, and when the electronic device 100 is abnormal, the control unit 50 controls the alarm component to send the abnormal prompt message. The alarm component can be a buzzer, a voice component, a prompting lamp and the like, and the control unit 50 can control the buzzer to buzz, the voice component to voice, the prompting lamp to light a red light and the like.
In some embodiments, the control unit 50 determines a target liquid inlet and outlet temperature difference interval corresponding to the currently acquired operation parameter according to a preset liquid inlet and outlet temperature difference interval and a second preset corresponding relationship of the operation parameter, determines a current liquid inlet and outlet temperature difference according to the currently acquired liquid outlet temperature and the currently acquired liquid inlet temperature, and determines that the electronic device 100 is abnormal when the current liquid inlet and outlet temperature difference is outside the target liquid inlet and outlet temperature difference interval.
When the electronic device 10 operates with a certain operating parameter, the temperature rise generated by the cooling liquid absorbing the heat of the electronic device 10 is within a range corresponding to the operating parameter, that is, the difference between the liquid outlet temperature and the liquid inlet temperature is within a range corresponding to the operating parameter, and if the difference between the liquid outlet temperature and the liquid inlet temperature is outside the range, the electronic device 10 generates heat abnormally. For example, if the difference between the outlet temperature and the inlet temperature is greater than the upper limit of the range, the electronic device 10 may generate heat excessively; if the difference between the temperature of the outlet liquid and the temperature of the inlet liquid is less than the lower limit of the range, the electronic device 10 may have insufficient power or insufficient efficiency. In the embodiment of the present application, whether the temperature difference between the liquid inlet and the liquid outlet is too large or too small is determined by comparing the current temperature difference between the liquid inlet and the liquid outlet with the target temperature difference between the liquid inlet and the liquid outlet, so as to determine whether the electronic device 100 is abnormal.
The second preset corresponding relation can be stored in the memory in advance. The second preset corresponding relationship defines corresponding relationships between a plurality of liquid inlet and outlet temperature difference intervals and a plurality of operating parameters, and each liquid inlet and outlet temperature difference interval corresponds to one operating parameter. Wherein the temperature difference interval between the inlet and the outlet can be within a temperature difference range, such as 10-12 ℃; the temperature differential zone may comprise a temperature differential, such as 10 ℃.
Fig. 4 is a flowchart of a liquid cooling heat dissipation flow control method according to an embodiment of the present application. The liquid cooling heat dissipation flow control method is applied to the electronic device 100 provided in any of the embodiments. As shown in fig. 4, the liquid-cooling heat dissipation flow control method includes the following steps:
s10: operating parameters of the electronic device 10 are collected.
S20: acquiring the collected operation parameters of the electronic device 10, and controlling and adjusting the flow of the cooling liquid flowing into the cold plate 20 according to at least the collected operation parameters.
Wherein the operating parameters of the electronic device 10 can be acquired by the aforementioned operating parameter acquiring unit 40.
The flow rate of the cooling fluid flowing into the cold plate 20 may be adjusted by controlling the flow rate adjusting unit 30 through the control unit 50.
According to the liquid cooling heat dissipation flow control method provided by the embodiment of the application, the operation parameters of the electronic device 10 in the electronic equipment 100 are acquired in real time, and the flow of the cooling liquid is controlled and adjusted at least according to the acquired operation parameters, so that the flow of the cooling liquid is adjusted according to the actual use working condition of the electronic device 10, and the problems of machine failure caused by insufficient flow of the cooling liquid and low working efficiency of the electronic device 10 caused by overlarge flow of the cooling liquid can be solved.
In some embodiments, the liquid-cooled heat dissipation flow control method further comprises: collecting the liquid inlet temperature of the cooling liquid flowing into the cold plate 20; the collected liquid inlet temperature is obtained, a target flow range is determined according to the collected liquid inlet temperature and the collected operation parameters, and the flow of the cooling liquid flowing into the cold plate 20 is controlled and adjusted to be within the target flow range.
The first temperature acquisition unit 60 may acquire the liquid inlet temperature, and the control unit 50 may acquire the acquired liquid inlet temperature, and the control unit 50 may control the flow rate adjustment unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 according to the acquired liquid inlet temperature and the acquired operation parameters.
In some embodiments, the controlling and adjusting the flow rate of the cooling fluid flowing into the cold plate 20 according to the collected inlet liquid temperature and the collected operating parameters includes: and determining the currently acquired liquid inlet temperature and the currently acquired flow range corresponding to the operating parameter as the target flow range according to a preset first preset corresponding relation among the liquid inlet temperature, the operating parameter and the flow range of the cooling liquid.
In some embodiments, the liquid-cooled heat dissipation flow control method further comprises: collecting the temperature of the specific electronic device 11; acquiring the collected temperature of the specific electronic device 11, determining that the temperature of the specific electronic device 11 is abnormal when the collected temperature of the specific electronic device 11 is out of a first preset temperature range, and controlling and adjusting the flow of the cooling liquid flowing into the cold plate 20 according to the collected temperature of the specific electronic device 11 until the temperature of the specific electronic device 11 is in the first preset temperature range.
Wherein the temperature of the specific electronic device 11 may be collected through the aforementioned second temperature collecting unit 70.
In some embodiments, the liquid-cooled heat dissipation flow control method further comprises: collecting the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22; acquiring the acquired flow of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22, and determining that the flow of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal when the acquired flow of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is out of the target flow range.
Wherein the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 can be collected by the aforementioned flow rate collecting unit 80.
In some embodiments, the liquid-cooled heat dissipation flow control method further comprises: when the temperature of the specific electronic device 11 is abnormal, controlling to adjust the flow rate of the cooling liquid flowing into the cold plate 20 by a first adjustment amplitude until the temperature of the specific electronic device 11 is within the first preset temperature range; and when the temperature of the specific electronic device 11 is normal and the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal, judging whether the flow rate of the cooling liquid flowing into the cold plate 20 needs to be adjusted or not after a preset time interval.
In some embodiments, the determining whether the flow rate of the cooling liquid flowing into the cold plate 20 needs to be adjusted after the interval of the preset time period includes: when the temperature of the specific electronic device 11 is normal and the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal, acquiring the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 again after a preset time interval; when the flow rate of the coolant at the liquid inlet 21 and/or the liquid outlet 22 collected again is outside the target flow rate range, controlling to adjust the flow rate of the coolant flowing into the cold plate 20 at a second adjustment amplitude until the flow rate of the coolant at the liquid inlet 21 and/or the liquid outlet 22 is within the target flow rate range, wherein the first adjustment amplitude is different from the second adjustment amplitude; and determining that there is no need to adjust the flow rate of the coolant flowing into the cold plate 20 when the flow rate of the coolant at the inlet port 21 and/or the outlet port 22 collected again is within the target flow rate range.
In some embodiments, the liquid-cooled heat dissipation flow control method further comprises: collecting the liquid inlet temperature of the cooling liquid flowing into the cold plate 20; when the collected liquid inlet temperature is out of a second preset temperature range, controlling to heat or cool the cooling liquid; and controlling the cooling liquid to be input into the cold plate 20 when the temperature of the inlet liquid is adjusted to be within the second preset temperature range.
Wherein the cooling liquid can be heated or cooled by the cooling liquid temperature adjusting assembly 90.
In some embodiments, during operation of the electronic device 10, when the inlet temperature of the cooling liquid is outside the second preset temperature range, the liquid-cooled heat dissipation flow control method further includes: and controlling the electronic device 10 to be powered off so as to protect the electronic device 10, and controlling the electronic device 10 to be started again until the liquid inlet temperature of the cooling liquid is adjusted to be within the second preset temperature range.
In some embodiments, before the electronic device 10 is initially started after the electronic apparatus 100 is powered on, the liquid-cooling heat dissipation flow control method further includes: and adjusting the liquid inlet temperature of the cooling liquid to be within the second preset temperature range, and controlling to start the electronic device 10 after the cooling liquid with the temperature within the second preset temperature range is input into the cold plate 20 at a preset flow rate.
Wherein, after the electronic device 10 is started for the first time, the controlling the flow rate adjusting unit 30 to adjust the flow rate of the cooling fluid flowing into the cold plate 20 according to at least the collected operation parameters includes: determining a target flow range at least according to the collected operation parameters; controlling the flow rate of the cooling fluid flowing into the cold plate 20 to be adjusted from the preset flow rate to a value within the target flow rate range.
In some embodiments, the liquid-cooled heat dissipation flow control method further comprises: collecting the liquid outlet temperature of the cooling liquid at the liquid outlet 22; acquiring a currently acquired liquid outlet temperature, a currently acquired liquid inlet temperature and a currently acquired operation parameter, and judging whether the electronic device 100 is abnormal or not according to the currently acquired liquid outlet temperature, the currently acquired liquid inlet temperature and the currently acquired operation parameter; and controlling the electronic device 100 to send out an abnormal prompt message when the electronic device 100 is determined to be abnormal.
The third temperature collecting unit 95 can be used for collecting the outlet temperature of the cooling liquid at the outlet 22.
In some embodiments, the determining whether the electronic device 100 is abnormal according to the currently collected liquid outlet temperature, liquid inlet temperature, and operation parameter includes: determining a target liquid inlet and outlet temperature difference interval corresponding to the currently acquired operation parameter according to a preset liquid inlet and outlet temperature difference interval and a second preset corresponding relation of the operation parameter; determining the current temperature difference between inlet and outlet liquid according to the current collected outlet liquid temperature and the current collected inlet liquid temperature; and determining that the electronic device 100 is abnormal when the current liquid inlet and outlet temperature difference is outside the target liquid inlet and outlet temperature difference interval.
In the aforementioned method embodiments, the step of not specifically designating the execution subject may be executed by the control unit 50.
The electronic device 100 may include a radio frequency power supply device or other types of electronic devices.
The liquid-cooling heat dissipation flow control method corresponds to the electronic device 100, and for a more detailed description, reference may be made to the contents of each embodiment of the electronic device 100, and the contents of the liquid-cooling heat dissipation flow control method and the electronic device 100 may also be referred to each other.
It should be noted that for simplicity of description, the above-mentioned embodiments of the method are described as a series of acts, but those skilled in the art should understand that the present application is not limited by the described order of acts, as some steps may be performed in other orders or simultaneously according to the present application. Further, those skilled in the art will recognize that the embodiments described in this specification are preferred embodiments and that acts or modules referred to are not necessarily required for this application.
The foregoing is an implementation of the embodiments of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the embodiments of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.

Claims (20)

1. An electronic device, characterized in that the electronic device comprises:
an electronic device;
the cold plate is arranged adjacent to the electronic device and used for circulating cooling liquid to dissipate heat of the electronic device, and comprises a liquid inlet and a liquid outlet;
the flow regulating unit is arranged at the liquid inlet and is used for regulating the flow of the cooling liquid flowing into the cold plate;
the operation parameter acquisition unit is used for acquiring operation parameters of the electronic device; and
and the control unit is used for acquiring the operating parameters of the electronic device acquired by the operating parameter acquisition unit and controlling the flow regulation unit to regulate the flow of the cooling liquid flowing into the cold plate at least according to the acquired operating parameters.
2. The electronic device according to claim 1, wherein the electronic device further comprises a first temperature collecting unit for collecting a feed temperature of the coolant flowing into the cold plate, and the control unit is further configured to obtain the feed temperature collected by the first temperature collecting unit, determine a target flow range according to the collected feed temperature and the collected operating parameters, and control the flow rate adjusting unit to adjust the flow rate of the coolant flowing into the cold plate within the target flow range.
3. The electronic device according to claim 2, wherein the control unit determines, according to a preset first preset correspondence relationship between the feed liquid temperature, the operation parameter, and a flow range of the coolant, that a flow range corresponding to a currently collected feed liquid temperature and a currently collected operation parameter is the target flow range.
4. The electronic device according to claim 2, wherein the electronic device includes a specific electronic device, the specific electronic device being an electronic device of which an importance level is higher than a preset level, the electronic device further including a second temperature acquisition unit disposed on the specific electronic device for acquiring a temperature of the specific electronic device; the control unit is further used for acquiring the temperature of the specific electronic device acquired by the second temperature acquisition unit, determining that the temperature of the specific electronic device is abnormal when the acquired temperature of the specific electronic device is out of a first preset temperature range, and controlling the flow regulation unit to regulate the flow of the cooling liquid flowing into the cold plate according to the acquired temperature of the specific electronic device until the temperature of the specific electronic device is in the first preset temperature range.
5. The electronic device according to claim 4, further comprising a flow rate collecting unit disposed between the liquid inlet and the flow rate adjusting unit and/or at the liquid outlet, for collecting a flow rate of the cooling liquid at the liquid inlet and/or at the liquid outlet; the control unit is further used for acquiring the flow of the cooling liquid collected by the flow collecting unit at the liquid inlet and/or at the liquid outlet, and determining that the flow of the cooling liquid at the liquid inlet and/or at the liquid outlet is abnormal when the flow of the cooling liquid collected at the liquid inlet and/or at the liquid outlet is beyond the target flow range.
6. The electronic apparatus according to claim 5, wherein the control unit is further configured to control the flow rate adjustment unit to adjust the flow rate of the cooling liquid flowing into the cold plate at a first adjustment amplitude when the temperature of the specific electronic device is abnormal until the temperature of the specific electronic device is within the first preset temperature range, and to determine whether the flow rate of the cooling liquid flowing into the cold plate needs to be adjusted at intervals of a preset time period when the temperature of the specific electronic device is normal and the flow rate of the cooling liquid at the liquid inlet and/or the liquid outlet is abnormal.
7. The electronic apparatus according to claim 6, wherein when the temperature of the specific electronic device is normal and the flow rate of the coolant at the inlet and/or the outlet is abnormal, the control unit controls the second temperature collection unit to collect the flow rate of the coolant at the inlet and/or the outlet again at intervals of a preset time period, and controls the flow rate adjustment unit to adjust the flow rate of the coolant flowing into the cold plate at a second adjustment magnitude when the flow rate of the coolant at the inlet and/or the outlet collected again is outside the target flow rate range until the flow rate of the coolant at the inlet and/or the outlet is within the target flow rate range, and determines that the flow rate of the coolant flowing into the cold plate does not need to be adjusted when the flow rate of the coolant at the inlet and/or the outlet collected again is within the target flow rate range, wherein the first adjustment magnitude is different from the second adjustment magnitude.
8. The electronic device according to claim 2, further comprising a coolant temperature adjusting unit connected to the flow rate adjusting unit for adjusting the temperature of the feed liquid; the control unit is used for controlling the cooling liquid temperature adjusting assembly to heat or cool the cooling liquid when the liquid inlet temperature collected by the first temperature collecting unit is out of a second preset temperature range, and the control unit is used for controlling the liquid inlet temperature adjusting assembly to be in the second preset temperature range and inputting the cooling liquid into the cold plate.
9. The electronic device according to claim 2, further comprising a third temperature collecting unit disposed at the liquid outlet for collecting a liquid outlet temperature of the cooling liquid at the liquid outlet; the control unit is further used for acquiring the liquid outlet temperature acquired by the third temperature acquisition unit, judging whether the electronic equipment is abnormal or not according to the currently acquired liquid outlet temperature, the currently acquired liquid inlet temperature and the currently acquired operation parameters, and controlling the electronic equipment to send abnormal prompt information when the electronic equipment is determined to be abnormal.
10. The electronic device of claim 9, wherein the control unit determines a target liquid inlet and outlet temperature difference interval corresponding to the currently collected operating parameter according to a preset liquid inlet and outlet temperature difference interval and a second preset corresponding relationship of the operating parameter, determines a current liquid inlet and outlet temperature difference according to the currently collected liquid outlet temperature and the currently collected liquid inlet temperature, and determines that the electronic device is abnormal when the current liquid inlet and outlet temperature difference is outside the target liquid inlet and outlet temperature difference interval.
11. A liquid cooling heat dissipation flow control method is applied to electronic equipment and is characterized in that the electronic equipment comprises an electronic device and a cold plate, the cold plate is arranged adjacent to the electronic device and used for circulating cooling liquid to dissipate heat of the electronic device, and the cold plate comprises a liquid inlet and a liquid outlet; the liquid cooling heat dissipation flow control method comprises the following steps:
collecting operating parameters of the electronic device;
and acquiring the collected operating parameters of the electronic device, and controlling and adjusting the flow of the cooling liquid flowing into the cold plate at least according to the collected operating parameters.
12. The liquid-cooled heat dissipation flow control method of claim 11, further comprising:
collecting the liquid inlet temperature of the cooling liquid flowing into the cold plate;
the collected liquid inlet temperature is obtained, a target flow range is determined according to the collected liquid inlet temperature and the collected operation parameters, and the flow of the cooling liquid flowing into the cold plate is controlled and adjusted to be within the target flow range.
13. The liquid-cooled heat dissipation flow control method of claim 12, wherein determining a target flow range based on the collected inlet liquid temperature and the collected operating parameters comprises:
and determining the currently acquired liquid inlet temperature and the currently acquired flow range corresponding to the operating parameter as the target flow range according to a preset first preset corresponding relation among the liquid inlet temperature, the operating parameter and the flow range of the cooling liquid.
14. The liquid-cooled heat dissipation flow control method of claim 12, wherein the electronic device comprises a specific electronic device, the specific electronic device being one of the electronic devices having a higher importance level than a preset level, the liquid-cooled heat dissipation flow control method further comprising:
collecting the temperature of the specific electronic device;
the method comprises the steps of acquiring the acquired temperature of the specific electronic device, determining the temperature abnormality of the specific electronic device when the acquired temperature of the specific electronic device is out of a first preset temperature range, and controlling and adjusting the flow of cooling liquid flowing into the cold plate according to the acquired temperature of the specific electronic device until the temperature of the specific electronic device is in the first preset temperature range.
15. The liquid-cooled heat dissipation flow control method of claim 14, further comprising:
collecting the flow of the cooling liquid at the liquid inlet and/or the liquid outlet;
the method comprises the steps of acquiring the collected flow of cooling liquid at the liquid inlet and/or the liquid outlet, and determining that the flow of the cooling liquid at the liquid inlet and/or the liquid outlet is abnormal when the collected flow of the cooling liquid at the liquid inlet and/or the liquid outlet is out of a target flow range.
16. The liquid-cooled heat dissipation flow control method of claim 15, further comprising:
when the temperature of the specific electronic device is abnormal, controlling to regulate the flow of the cooling liquid flowing into the cold plate by a first regulation amplitude until the temperature of the specific electronic device is within the first preset temperature range; and
and when the temperature of the specific electronic device is normal and the flow of the cooling liquid at the liquid inlet and/or the liquid outlet is abnormal, judging whether the flow of the cooling liquid flowing into the cold plate needs to be adjusted or not after a preset time interval.
17. The liquid-cooled heat dissipation flow control method of claim 16, wherein determining whether the flow of coolant flowing into the cold plate needs to be adjusted after a predetermined time interval comprises:
when the temperature of the specific electronic device is normal and the flow of the cooling liquid at the liquid inlet and/or the liquid outlet is abnormal, collecting the flow of the cooling liquid at the liquid inlet and/or the liquid outlet again after a preset time interval;
when the flow rate of the cooling liquid at the liquid inlet and/or the liquid outlet collected again is beyond the target flow rate range, controlling to regulate the flow rate of the cooling liquid flowing into the cold plate at a second regulation amplitude until the flow rate of the cooling liquid at the liquid inlet and/or the liquid outlet is within the target flow rate range, wherein the first regulation amplitude is different from the second regulation amplitude; and
determining that the flow rate of the cooling liquid flowing into the cold plate does not need to be adjusted when the flow rate of the cooling liquid at the liquid inlet and/or the liquid outlet collected again is within the target flow rate range.
18. The liquid-cooled heat dissipation flow control method of claim 11, further comprising:
collecting the liquid inlet temperature of the cooling liquid flowing into the cold plate;
when the collected liquid inlet temperature is out of a second preset temperature range, controlling to heat or cool the cooling liquid; and
and controlling the cooling liquid to be input into the cold plate when the temperature of the liquid inlet is adjusted to be within the second preset temperature range.
19. The liquid-cooled heat dissipation flow control method of claim 11, further comprising:
collecting the liquid outlet temperature of the cooling liquid at the liquid outlet;
acquiring the currently acquired liquid outlet temperature, liquid inlet temperature and operation parameters, and judging whether the electronic equipment is abnormal or not according to the currently acquired liquid outlet temperature, liquid inlet temperature and operation parameters; and
and when the electronic equipment is determined to be abnormal, controlling the electronic equipment to send out abnormal prompt information.
20. The liquid-cooled heat dissipation flow control method of claim 19, wherein said determining whether the electronic device is abnormal according to the currently collected outlet temperature, inlet temperature, and operating parameters comprises:
determining a target liquid inlet and outlet temperature difference interval corresponding to the currently acquired operation parameter according to a preset liquid inlet and outlet temperature difference interval and a second preset corresponding relation of the operation parameter;
determining the current temperature difference between inlet and outlet liquid according to the current collected outlet liquid temperature and the current collected inlet liquid temperature; and
and when the current liquid inlet and outlet temperature difference is outside the target liquid inlet and outlet temperature difference interval, determining that the electronic equipment is abnormal.
CN202211343019.7A 2022-10-29 2022-10-29 Electronic equipment and liquid cooling heat dissipation flow control method thereof Active CN115666088B (en)

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Publication number Priority date Publication date Assignee Title
CN107562155A (en) * 2017-09-07 2018-01-09 郑州云海信息技术有限公司 A kind of liquid-cooled suit business device and its flow-measuring method
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107562155A (en) * 2017-09-07 2018-01-09 郑州云海信息技术有限公司 A kind of liquid-cooled suit business device and its flow-measuring method
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