CN114727563A - Flow-control liquid cooling heat dissipation system and method thereof and liquid cooling cabinet - Google Patents
Flow-control liquid cooling heat dissipation system and method thereof and liquid cooling cabinet Download PDFInfo
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- CN114727563A CN114727563A CN202210483279.8A CN202210483279A CN114727563A CN 114727563 A CN114727563 A CN 114727563A CN 202210483279 A CN202210483279 A CN 202210483279A CN 114727563 A CN114727563 A CN 114727563A
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- 238000001816 cooling Methods 0.000 title claims abstract description 216
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000000110 cooling liquid Substances 0.000 claims abstract description 139
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- 238000012545 processing Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims description 3
- 239000012809 cooling fluid Substances 0.000 claims description 2
- 230000001276 controlling effect Effects 0.000 description 26
- 238000013021 overheating Methods 0.000 description 7
- 230000033228 biological regulation Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
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- 239000011093 chipboard Substances 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
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Abstract
The application provides a flow control liquid cooling system for controlling the heat dissipation of at least one computing device in a liquid cooling cabinet. A plurality of liquid cooling sub-pipelines for flowing cooling liquid are arranged in the liquid cooling cabinet. The flow control liquid cooling heat dissipation system comprises at least one flow rate adjusting module, at least one parameter acquisition module and a control module. Each flow rate adjusting module is used for adjusting the flow rate of the cooling liquid of the corresponding liquid cooling sub-pipeline. Each parameter acquisition module is used for acquiring parameters of corresponding computing equipment, and the parameters comprise temperature or operand. The control module is used for controlling the corresponding flow rate adjusting module to adjust the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline according to the parameter. The application also provides a flow control liquid cooling heat dissipation method and a liquid cooling cabinet. According to the flow-control liquid cooling heat dissipation system and method and the liquid cooling cabinet, the flow rate of the cooling liquid is adjusted according to the temperature or the operand of each computing device, and the cooling liquid is provided for the computing devices as required.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a flow-control liquid cooling heat dissipation system and method and a liquid cooling cabinet.
Background
The existing pipeline system of the liquid cooling cabinet is single in function, cooling liquid is conveyed to computing equipment only according to preset flow, the difference of heat generated by each computing equipment and the difference of work load of each computing equipment are ignored, heat of certain computing equipment with large work load and large heat generation cannot be timely and fully absorbed, the working efficiency of a computer is affected and even damaged due to overheating, or the working performance of certain computing equipment is affected due to too low working temperature caused by too large flow of the cooling liquid.
Disclosure of Invention
In order to solve the technical problems, the application provides a flow control liquid cooling heat dissipation system, a method thereof and a liquid cooling cabinet, which realize that the flow of cooling liquid is provided for computing equipment as required by adjusting the flow rate of the cooling liquid input into the computing equipment according to the temperature or the operand of each computing equipment, and avoid that the computing equipment is damaged due to overheating or the working performance is influenced due to too low temperature.
A first aspect of the present application provides a flow-control liquid-cooled heat dissipation system for controlling heat dissipation of at least one computing device in a liquid-cooled cabinet. The liquid cooling cabinet is characterized in that a liquid cooling pipeline through which cooling liquid flows is arranged in the liquid cooling cabinet and comprises a plurality of liquid cooling sub-pipelines, each liquid cooling sub-pipeline is arranged in a corresponding computing device, and each liquid cooling sub-pipeline comprises a liquid inlet and a liquid outlet. The flow control liquid cooling heat dissipation system comprises at least one flow speed adjusting module, at least one parameter acquisition module and a control module. The at least one flow rate adjusting module corresponds to the at least one computing device one by one, and each flow rate adjusting module is arranged at the liquid inlet of a corresponding liquid cooling sub-pipeline and used for adjusting the flow rate of cooling liquid output to the corresponding computing device by the corresponding liquid cooling sub-pipeline. The parameter acquisition module is in one-to-one correspondence with the computing equipment, each parameter acquisition module is used for acquiring a parameter of the corresponding computing equipment, and the parameter comprises temperature or operand. The control module is used for acquiring the parameters of the computing equipment acquired by each parameter acquisition module and controlling the corresponding flow rate adjusting module to adjust the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline according to the acquired parameters of the corresponding computing equipment.
The second aspect of the present application provides a flow control liquid cooling heat dissipation method, which is applied to the flow control liquid cooling heat dissipation system, and the flow control liquid cooling heat dissipation method includes: collecting parameters of each computing device, wherein the parameters comprise temperature or operand; and acquiring the acquired parameters of any one computing device, and controlling and adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline according to the acquired parameters of any one computing device.
A third aspect of the present application provides a liquid-cooled cabinet comprising at least one computing device, a liquid-cooled conduit, and the aforementioned flow-controlled liquid-cooled heat dissipation system.
The flow control liquid cooling heat dissipation system, the flow control liquid cooling heat dissipation method and the liquid cooling cabinet provided by the application adjust the flow rate of the cooling liquid input into the computing equipment according to the temperature or the operation amount of each computing equipment, so that the flow of the cooling liquid is provided for the computing equipment as required, and the phenomenon that the computing equipment is damaged due to overheating or the working performance is influenced due to too low temperature is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings required to be used in the embodiments will be briefly described below, it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic diagram of functional modules of a flow-control liquid-cooling heat dissipation system according to an embodiment of the present disclosure.
Fig. 2 is a schematic structural diagram of a liquid-cooled cabinet according to an embodiment of the present application.
Fig. 3 is an enlarged schematic view of a in fig. 2.
Fig. 4 is a schematic connection diagram of a plurality of computing devices, a plurality of temperature acquisition modules, a control module, a plurality of flow rate adjustment modules, and a plurality of liquid cooling sub-pipes according to an embodiment of the present disclosure.
Fig. 5 is a flowchart of a method for controlling liquid cooling heat dissipation according to an embodiment of the present application.
Description of the main element symbols:
flow-controlled liquid cooling heat dissipation system 100
Liquid cooled cabinet 200
Flow rate regulating module 10
Computation acquisition module 22
Liquid inlet main pipe 52
Liquid inlet branch pipe 53
Liquid outlet main pipe 54
Liquid outlet branch pipe 55
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without any inventive step are within the scope of protection of the present application.
In the description of the present application, the terms "first", "second", etc. are used for distinguishing different objects and not for describing a particular order, and in addition, the terms "upper", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and operate, and thus, should not be construed as limiting the present application.
Throughout the description of the present application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., as meaning fixedly attached, detachably attached, or integrally attached; the two components can be directly connected, indirectly connected through an intermediate medium, or communicated with each other inside the two components; may be a communication connection; may be an electrical connection. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.
Referring to fig. 1 to fig. 3 together, fig. 1 is a schematic functional block diagram of a flow-control liquid-cooling heat dissipation system 100 according to an embodiment of the present disclosure, fig. 2 is a schematic structural diagram of a liquid-cooling cabinet 200 according to an embodiment of the present disclosure, and fig. 3 is an enlarged schematic diagram of a in fig. 2. The flow-controlled liquid-cooled heat dissipation system 100 is used to control the heat dissipation of at least one computing device 40 in a liquid-cooled cabinet 200. As shown in fig. 2 and fig. 3, a liquid cooling duct 50 for flowing a cooling liquid is disposed in the liquid cooling cabinet 200, the liquid cooling duct 50 includes at least one liquid cooling sub-duct 51, each liquid cooling sub-duct 51 is disposed in a corresponding computing device 40, and each liquid cooling sub-duct 51 includes an inlet 511 and an outlet 512. As shown in fig. 1 and fig. 3, the flow-controlled liquid-cooled heat dissipation system 100 includes at least one flow rate adjustment module 10, at least one parameter acquisition module 20, and a control module 30. The at least one flow rate adjusting module 10 corresponds to the at least one computing device 40 one by one, and each flow rate adjusting module 10 is disposed at the liquid inlet 511 of a corresponding liquid cooling sub-pipe 51, and is configured to adjust a flow rate of the cooling liquid output by the corresponding liquid cooling sub-pipe 51 to the corresponding computing device 40. At least one parameter acquisition module 20 corresponds to at least one computing device 40 one to one, and each parameter acquisition module 20 is configured to acquire a parameter of a corresponding computing device 40, where the parameter includes a temperature or an operation amount. The control module 30 is configured to obtain the parameters of the corresponding computing device 40 acquired by each parameter acquiring module 20, and control the corresponding flow rate adjusting module 10 to adjust the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 according to the acquired parameters of the corresponding computing device 40.
The flow control liquid cooling heat dissipation system 100 provided in the embodiment of the present application adjusts the flow rate of the cooling liquid input to the computing device 40 according to the temperature or the calculation amount of each computing device 40, so as to provide the flow rate of the cooling liquid for the computing device 40 as needed, and avoid the influence on the working performance caused by the damage of the computing device 40 due to overheating or the low temperature.
The control module 30 controls the corresponding flow rate adjusting module 10 to adjust the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 according to the collected parameters of the corresponding computing device 40, and when the inner diameter of the corresponding liquid cooling sub-pipe 51 is not changed, the control module controls the corresponding flow rate adjusting module 10 to adjust the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 according to the collected parameters of the corresponding computing device 40, wherein the control module controls and adjusts the flow rate of the cooling liquid flowing through the corresponding computing device by controlling and adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51.
Wherein the control module 30 and the at least one parameter collecting module 20 and the at least one flow rate adjusting module 10 can be connected in a wired or wireless manner.
The control module 30 may be a single chip, a controller, a processor, or other processing chips. The flow rate adjusting module 10 can be an electric valve, a speed-regulating water pump, a throttle valve and the like.
Wherein, be provided with cooling module (not shown in the figure) in the computing equipment 40, be provided with the cooling runner in the cooling module, the cooling runner includes inlet end and play liquid end, and the inlet 511 department of each liquid cooling sub-pipeline 51 is provided with a velocity of flow regulation module 10, and the inlet 511 of each liquid cooling sub-pipeline 51 is connected with the inlet end of the computing equipment 40 that corresponds, the liquid outlet 512 of this liquid cooling sub-pipeline 51 with the play liquid end of the computing equipment 40 that corresponds is connected. As shown in fig. 2, the liquid cooling pipes 50 further include a liquid inlet main pipe 52, a plurality of liquid inlet branch pipes 53, a liquid outlet main pipe 54, and a plurality of liquid outlet branch pipes 55, the plurality of liquid inlet branch pipes 53 are connected to the liquid inlet main pipe 52, the plurality of liquid outlet branch pipes 55 are connected to the liquid outlet main pipe 54, liquid inlets 511 of all the liquid cooling sub pipes 51 are connected to the plurality of liquid inlet branch pipes 53 through the flow rate adjusting module 10, and liquid outlets 512 of all the liquid cooling sub pipes 51 are connected to the plurality of liquid outlet branch pipes 55. The cooling liquid enters the liquid inlet branch pipes 53 from the liquid inlet main pipe 52, then flows into each liquid cooling sub pipe 51 through each flow rate adjusting module 10 and the liquid inlet 511 of each liquid cooling sub pipe 51, and flows into the cooling assembly of the corresponding computing device 40, when flowing through the cooling assembly, the cooling liquid absorbs heat of the corresponding computing device 40 to generate the heated cooling liquid, and the heated cooling liquid flows out from the liquid outlet end of the corresponding computing device 40, flows into the liquid outlet branch pipes 55 through the liquid outlets 512 of the liquid cooling sub pipes 51, and flows out from the liquid outlet main pipe 54, so as to realize heat dissipation of the corresponding computing device 40.
Wherein the cooling liquid can be water, glycol, glycerol, etc.
In some embodiments, the parameter acquisition module 20 includes a temperature acquisition module 21, and the temperature acquisition module 21 is configured to acquire the temperature of the corresponding computing device 40. That is, in some embodiments, each parameter acquisition module 20 may include a temperature acquisition module 21, with the corresponding parameter of computing device 40 acquired by each parameter acquisition module 20 including temperature. The control module 30 is configured to control the corresponding flow rate adjusting module 10 to increase or decrease the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 when the temperature of the corresponding computing device 40, which is acquired by any one of the temperature acquisition modules 21, is outside the preset temperature range, and control the corresponding flow rate adjusting module 10 to maintain the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 when the temperature of the corresponding computing device 40, which is acquired by any one of the temperature acquisition modules 21, is within the preset temperature range.
The temperature acquisition module 21 is disposed on the corresponding computing device 40 to acquire the temperature of the computing device 40. The temperature acquisition module 21 may be a temperature sensor, such as a thermistor temperature sensor, a thermocouple temperature sensor, or the like.
Wherein the computing device 40 further comprises a computing assembly (not shown), the computing assembly may comprise a computing chip board, the computing chip board comprising a plurality of computing chips. In some embodiments, the temperature acquisition module 21 may be disposed on the computing component for acquiring the temperature of the computing component.
The preset temperature range may be a temperature range in which the computing device 40 is located during normal operation, and the user may previously determine the temperature range in which the computing device 40 is located during normal operation through an experiment, and use the temperature range as the preset temperature range. In some embodiments, the preset temperature range may be a temperature range at which the computing device 40 is in an optimal operating state.
After the control module 30 obtains the temperature of the corresponding computing device 40 collected by any one of the temperature collection modules 21, the temperature is compared with the preset temperature range, and when the temperature is outside the preset temperature range, the corresponding flow rate regulation module 10 is controlled to increase or decrease the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51, and when the temperature is within the preset temperature range, the corresponding flow rate regulation module 10 is controlled to maintain the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51.
In this embodiment, by adjusting the flow rate of the cooling liquid input to each computing device 40 according to the temperature of each computing device 40, it is achieved to provide an appropriate flow rate of the cooling liquid according to the temperature of different computing devices 40, so that the computing devices 40 are maintained in an appropriate working temperature range, an accurate temperature control is achieved, temperature management of each computing device 40 is facilitated, flow adjustment of the cooling liquid is more intelligent, and influence or even damage to the computing performance of the computing device 40 due to too high or too low temperature of the computing device 40 is avoided.
In some embodiments, the control module 30 is configured to control the corresponding flow rate adjusting module 10 to increase the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 when the temperature of the corresponding computing device 40, which is acquired by any one of the temperature acquiring modules 21, is higher than the upper limit value of the preset temperature range, and control the corresponding flow rate adjusting module 10 to decrease the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 when the temperature of the corresponding computing device 40, which is acquired by any one of the temperature acquiring modules 21, is lower than the lower limit value of the preset temperature range.
When the temperature of the computing device 40 is higher than the upper limit value of the preset temperature range, the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 is controlled to be increased, that is, the flow rate of the cooling liquid flowing into the corresponding computing device 40 is increased, so that when the cooling liquid flows through the cooling component of the corresponding computing device 40, more heat can be absorbed to reduce the temperature of the corresponding computing device 40, and the corresponding computing device 40 is prevented from being damaged due to overheating.
When the temperature of the computing device 40 is lower than the lower limit value of the preset temperature range, the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 is reduced by controlling, that is, the flow rate of the cooling liquid flowing into the corresponding computing device 40 is reduced, so that when the cooling liquid flows through the cooling component of the corresponding computing device 40, more heat can be absorbed to increase the temperature of the corresponding computing device 40, and the temperature of the corresponding computing device 40 is prevented from being too low to affect the computing performance.
The process of the control module 30 controlling the corresponding flow rate adjustment module 10 to adjust the flow rate of the cooling liquid in the corresponding liquid cooling daughter pipe 51 according to the collected temperature of the corresponding computing device 40 will be further described in detail with reference to fig. 4. Fig. 4 illustrates the connection relationship among the plurality of computing devices 40, the plurality of temperature acquisition modules 21, the control module 30, the plurality of flow rate adjustment modules 10, and the plurality of liquid cooling daughter pipes 51.
As shown in fig. 4, the description will be given by taking an example in which the plurality of computing devices 40 include a computing device 40a and a computing device 40b, the plurality of temperature acquisition modules 21 include a temperature acquisition module 21a and a temperature acquisition module 21b, the plurality of flow rate adjustment modules 10 include a flow rate adjustment module 10a and a flow rate adjustment module 10b, and the plurality of liquid cooling sub-pipes 51 include a liquid cooling sub-pipe 51a and a liquid cooling sub-pipe 51 b. The flow rate adjusting module 10a is connected between the liquid inlet branch pipe 53 and the liquid cooling sub-pipeline 51a and connected with the control module 30, the flow rate adjusting module 10b is connected between the liquid inlet branch pipe 53 and the liquid cooling sub-pipeline 51b and connected with the control module 30, the temperature collecting module 21a is connected with the computing device 40a and the control module 30 respectively, and the temperature collecting module 21b is connected with the computing device 40b and the control module 30 respectively. The liquid cooling sub pipe 51a and the liquid cooling sub pipe 51b are connected to the liquid outlet branch pipe 55. The temperature acquisition module 21a and the temperature acquisition module 21b acquire the temperature of the computing device 40a and the temperature of the computing device 40b respectively, the temperature acquired by the control module 30 to the computing device 40a and the temperature acquired by the computing device 10b are 30 ℃ and 60 ℃ respectively, the preset temperature range is 40 ℃ -50 ℃, and then the control module 30 controls the flow rate adjustment module 10a to reduce the flow rate of the cooling liquid in the liquid cooling sub-pipeline 51a and controls the flow rate adjustment module 10b to increase the flow rate of the cooling liquid in the liquid cooling sub-pipeline 51 b.
In some embodiments, the control module 30 and the at least one temperature acquisition module 21 and the at least one flow rate adjustment module 10 may be connected by wire or wirelessly.
The control module 30 obtains the temperature of the computing device 40 collected by each temperature collection module 21, and also obtains the identification of the temperature collection module 21, determines the corresponding flow rate regulation module 10 according to the identification and the preset corresponding relationship between the temperature collection module 21 and the flow rate regulation module 10, and controls the corresponding flow rate regulation module 10 according to the obtained temperature. The correspondence between the temperature acquisition module 21 and the flow rate adjustment module 10 may be preset and burned in the control module 30, or may be stored in a memory of the flow control liquid cooling heat dissipation system 100, and the control module 30 obtains the correspondence between the temperature acquisition module 21 and the flow rate adjustment module 10 by reading data stored in the memory. For example, the control module 30 obtains the temperature of the computing device 40a collected by the temperature collection module 21a, and also obtains the identity of the temperature collection module 21a, determines the corresponding flow rate adjustment module 10a according to the identity and the preset corresponding relationship between the temperature collection module 21a and the flow rate adjustment module 10a, and controls the corresponding flow rate adjustment module 10a according to the obtained temperature.
In some embodiments, the control module 30 is further configured to control the corresponding flow rate adjusting module 10 to adjust the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 to be 0 when the temperature of the corresponding computing device, which is acquired by any one of the temperature acquiring modules 21, is lower than a first preset temperature value, where the first preset temperature value is smaller than a lower limit value of the preset temperature range.
In some embodiments, the control module 30 is further configured to control the corresponding flow rate adjusting module 10 to adjust the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 to a preset flow rate when the temperature of the corresponding computing device 40, acquired by any one of the temperature acquiring modules 21, is higher than or equal to the first preset temperature value and lower than a second preset temperature value, where the second preset temperature value is smaller than a lower limit value of the preset temperature range; the control module 30 is further configured to control the corresponding flow rate adjusting module 10 to reduce the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 when the temperature of the corresponding computing device 40, which is acquired by any one of the temperature acquisition modules 21, is higher than or equal to the second preset temperature value and is lower than the lower limit value of the preset temperature range.
Wherein the preset flow rate may be set to a lower flow rate. When the temperature of the computing device 40 is higher than or equal to the second preset temperature value and lower than the lower limit value of the preset temperature range, the temperature corresponds to the standby state of the computing device 40, that is, the temperature of the computing device 40 in the standby state is higher than or equal to the first preset temperature value and lower than the second preset temperature value. When the temperature of the corresponding computing device 40 acquired by the temperature acquisition module 21 is higher than or equal to the first preset temperature value and lower than the second preset temperature value, the control module 30 determines that the computing device 40 is in a standby state, and controls to adjust the flow rate of the cooling liquid to the preset flow rate. When the computing device 40 is in the standby state, the computing device 40 keeps operating with the lowest power, at this time, the flow of the cooling liquid that needs to be provided is small, the control module 30 controls the corresponding flow rate adjusting module 10 to adjust the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 to be the preset flow rate with a low flow rate, so that not only is the heat dissipation requirement of the computing device 40 in the standby state met, but also the heat dissipation energy consumption can be reduced, and the cost can be saved.
When the temperature of the computing device 40 is lower than the first preset temperature value, the temperature corresponds to a shutdown state of the computing device 40, that is, the temperature of the computing device 40 in the standby state is lower than the first preset temperature value. When the temperature of the corresponding computing device 40 acquired by the temperature acquisition module 21 is lower than the first preset temperature value, the control module 30 determines that the computing device 40 is in a shutdown state, and controls to adjust the flow rate of the cooling liquid to 0. When the computing device 40 is in the shutdown state, the supply of the cooling fluid to the computing device 40 may be stopped, reducing power consumption and saving cost.
When the temperature of the computing device 40 is higher than or equal to the second preset temperature value and lower than the lower limit value of the preset temperature range, the computing device 40 is in a load operation state, and the control module 30 controls to reduce the flow rate of the cooling liquid flowing into the computing device 40, so that the heat absorbed by the cooling liquid flowing through the computing device 40 is reduced, the temperature of the computing device 40 can be increased to the preset temperature range, and the computing device is in a better working state, thereby avoiding that the computing performance is influenced and the working efficiency is reduced due to the fact that the temperature of the computing device 40 is too low.
When the temperature of the computing device 40 is higher than or equal to the second preset temperature value, the load operation state of the computing device 40 is corresponded, that is, when the computing device 40 is in the load operation state, the temperature of the computing device 40 is higher than or equal to the second preset temperature value. When the temperature of the corresponding computing device 40 acquired by the temperature acquisition module 21 is higher than or equal to the second preset temperature value, the control module 30 determines that the computing device 40 is in the load operation state. When the temperature of the corresponding computing device 40 acquired by the temperature acquisition module 21 is higher than or equal to the second preset temperature value and lower than the lower limit value of the preset temperature range, the control module 30 determines that the computing device 40 is in the load operation state, and the control module 30 controls to reduce the flow rate of the cooling liquid flowing into the computing device 40, so that the heat absorbed by the cooling liquid flowing through the computing device 40 is reduced, and the temperature of the computing device 40 can be increased to the preset temperature range and is in a better working state, thereby avoiding that the working efficiency is reduced due to the influence on the computing performance caused by the excessively low temperature of the computing device 40.
In some embodiments, the control module 30 is configured to, when the temperature of the corresponding computing device 40 acquired by any one of the temperature acquisition modules 21 is outside a preset temperature range, control the corresponding flow rate adjustment module 10 to increase or decrease the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51, and after a preset time interval, acquire the temperature of the corresponding computing device 40 acquired by the temperature acquisition module 21 again, and use the temperature as a first feedback temperature, and when it is determined that the first feedback temperature is outside the preset temperature range, control the corresponding flow rate adjustment module 10 to increase or decrease the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 again, and after the preset time interval, acquire the temperature of the corresponding computing device 40 acquired by the temperature acquisition module 21 again, and use the temperature as a second feedback temperature, and when it is determined that the second feedback temperature is within the preset temperature range, the corresponding flow rate adjustment module 10 is controlled to maintain the flow rate of the cooling liquid in the corresponding liquid cooling daughter pipe 51.
The temperature acquisition module 21 may acquire the temperature of the corresponding computing device 40 in real time, and the control module 30 may control the flow rate adjustment module 10 to adjust the flow rate of the cooling liquid at intervals, and then acquire the temperature of the computing device 40 acquired by the temperature acquisition module 21 after a preset time period.
Wherein the control module 30 may control the acquiring of the acquired temperature of the computing device 40a plurality of times and the increasing or decreasing of the flow rate of the cooling liquid a plurality of times until the acquired temperature of the computing device 40 is within the preset temperature range.
Specifically, when the temperature of the corresponding computing device 40 acquired by a certain temperature acquisition module 21 is greater than the upper limit value of the preset temperature range, the control module 30 controls the flow rate adjustment module 10 corresponding to the computing device 40 to increase the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51, then after a preset time interval, the control module 30 acquires the temperature of the corresponding computing device 40 acquired by the temperature acquisition module 21 again, takes the temperature as a first feedback temperature, compares the first feedback temperature with the preset temperature range, when it is determined that the first feedback temperature is still greater than the upper limit value of the preset temperature range, controls the corresponding flow rate adjustment module 10 to increase the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 again, and then after a preset time interval, the control module 30 acquires the temperature of the corresponding computing device 40 acquired by the temperature acquisition module 21 again, taking the temperature as a second feedback temperature, comparing the second feedback temperature with the preset temperature range, and when determining that the second feedback temperature is still greater than the upper limit value of the preset temperature range, controlling the corresponding flow rate adjusting module 10 to increase the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 again, and repeating the above steps until the temperature of the corresponding computing equipment 40 acquired by the temperature acquiring module 21 is within the preset temperature range, and controlling the corresponding flow rate adjusting module 10 to keep the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51.
After the flow rate of the cooling liquid is increased, the heat absorption capacity of the cooling liquid is gradually increased and tends to be stable within the preset time period, so that the temperature of the computing device 40 is gradually reduced and tends to be stable, the temperature of the computing device 40 is acquired after the preset time period, and the acquired temperature of the computing device 40 is the temperature after the temperature is stable, so that the flow rate of the cooling liquid can be prevented from being continuously increased when the temperature of the computing device 40 is continuously reduced, and further the temperature of the computing device 40 can be prevented from being excessively reduced to enable the temperature of the computing device 40 to be lower than the lower limit value of the preset temperature range.
The temperature of the computing device 40 is acquired at intervals for multiple times, and the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 is increased or decreased for multiple times according to the temperature of the computing device 40 acquired at intervals for multiple times, so that the flow control liquid cooling heat dissipation system 100 can determine the increase or decrease of the flow rate according to the feedback temperature.
In some embodiments, the parameter acquisition module 20 includes an operand acquisition module 22, and the operand acquisition module 22 is configured to acquire the operand of the corresponding computing device 40, that is, in some embodiments, each parameter acquisition module 20 may include an operand acquisition module 22, and the parameter acquired by each parameter acquisition module 20 of the corresponding computing device 40 includes the operand. The control module 30 is configured to control the corresponding flow rate adjusting module 10 to adjust the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 according to the operand of the corresponding computing device 40 acquired by each operand acquisition module 22.
The operand acquisition module 22 obtains the CPU (Central Processing Unit) occupancy rate of the computing device 40, and multiplies the obtained CPU occupancy rate by the maximum operand of the computing device 40 to obtain the operand of the computing device 40. In some embodiments, the computation acquisition module 22 may be a software module running in a CPU or the like of the computing device 40, and reads a CPU (Central Processing Unit) occupancy rate of the computing device 40 in a software manner, and multiplies the obtained CPU occupancy rate by a maximum computation of the computing device 40 to obtain a computation of the computing device 40.
In this embodiment, the flow rate of the cooling liquid input to each computing device 40 is adjusted according to the calculation amount of each computing device 40, so that the flow rate can be finely adjusted according to the calculation amount of each computing device 40, the flow rate of the cooling liquid provided for each computing device 40 can meet the heat dissipation requirement of the computing device 40, when the calculation amount is large, the cooling liquid with the large flow rate can timely and fully absorb the heat generated by the computing device 40, the computing device 40 is prevented from being insufficiently dissipated, when the calculation amount is small, the cooling liquid with the small flow rate can reduce the absorbed heat, and the computing device 40 is in the better working range.
In some embodiments, the flow-control liquid-cooling heat dissipation system 100 further includes a storage module (not shown) that stores a corresponding relationship between at least one operand interval and at least one flow rate, where each operand interval corresponds to a flow rate, and the control module 30 is configured to determine a target operand interval in which an operand acquired by any operand acquisition module 22 is located, determine a target flow rate according to the corresponding relationship and the target operand interval, and control the corresponding flow rate adjustment module 10 to adjust the flow rate of the corresponding liquid-cooling sub-pipe 51 to the target flow rate.
For example, the correspondence relationship between the operation amount interval and the flow rate stored in the storage module includes: when the calculated amount is 0, the flow rate is 0; the operation amount interval [0,500] corresponds to the flow rate of 30L/min; the operand interval [500,2000) corresponds to a flow rate of 50L/min; the calculation amount interval [2000,3000) corresponds to the flow rate of 60L/min, the calculation amount interval [3000,4000] corresponds to the flow rate of 70L/min, and when the control module 30 obtains that the calculation amount of a computing device 40 is 1500, the control module determines that the target calculation amount interval in which the calculation amount of the computing device 40 is located is [500,2000 ], determines that the target flow rate is 50L/min, and controls the corresponding flow rate adjusting module 10 to adjust the flow rate of the corresponding liquid cooling sub-pipeline 51 to 50L/min.
The Memory module may include a Random Access Memory (ram Memory), a non-volatile Memory (non-volatile Memory), such as a flash Memory (flash Memory), a Read-Only Memory (Read-Only Memory), and the like.
Referring to fig. 5, fig. 5 is a flowchart of a method for controlling liquid cooling heat dissipation according to an embodiment of the present application. The flow-control liquid cooling heat dissipation method can be applied to the flow-control liquid cooling heat dissipation system in any embodiment. As shown in fig. 5, the method for controlling liquid cooling heat dissipation includes the following steps:
s101: parameters of each computing device 40 are collected, including temperature or operand. Specifically, the step S101 includes: the parameters of each computing device 40 are collected by a parameter collection module 20 connected to each computing device 40.
S102: and acquiring the acquired parameters of any one of the computing devices 40, and controlling and adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 according to the acquired parameters of any one of the computing devices 40. Specifically, the step S102 includes: the control module 30 obtains the collected parameters of each computing device 40, and controls the corresponding flow rate adjusting module 10 to adjust the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 according to the collected parameters of any computing device 40.
According to the flow control liquid cooling heat dissipation method provided by the embodiment of the application, the flow rate of the cooling liquid input into the computing equipment 40 is adjusted according to the temperature or the calculation amount of each computing equipment 40, the flow of the cooling liquid is provided for the computing equipment 40 as required, and the phenomenon that the computing equipment 40 is damaged due to overheating or the working performance is influenced due to too low temperature is avoided.
In some embodiments, acquiring parameters of each computing device 40 in step S101 includes acquiring a temperature of each computing device 40. In the step S102, the acquired parameters of any one of the computing devices 40 are acquired, and the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 is controlled and adjusted according to the acquired parameters of any one of the computing devices 40, including acquiring the acquired temperature of any one of the computing devices 40, and controlling and adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 according to the acquired temperature of any one of the computing devices 40. Wherein the temperature of each computing device 40 may be collected by the temperature collection module 21.
The adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 according to the collected temperature of any one of the computing devices 40 may further specifically include controlling to increase or decrease the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 when the temperature of any one of the computing devices 40 is outside the preset temperature range, and controlling to maintain the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 when the temperature of any one of the computing devices 40 is within the preset temperature range.
In some embodiments, the controlling the flow rate of the cooling liquid in the corresponding liquid cooling daughter pipe 51 to be increased or decreased when the temperature of any of the computing devices 40 is outside the preset temperature range includes: when the temperature of any one of the computing devices 40 is higher than the upper limit value of the preset temperature range, the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 is controlled to be increased, and when the temperature of any one of the computing devices 40 is lower than the lower limit value of the preset temperature range, the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 is controlled to be decreased.
In some embodiments, the controlling to reduce the flow rate of the cooling liquid in the corresponding liquid cooling daughter pipe 51 when the temperature of any of the computing devices 40 is lower than the lower limit value of the preset temperature range includes: when the temperature of any one of the computing devices 40 is lower than a first preset temperature value, controlling and adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 to be 0, wherein the first preset temperature value is smaller than the lower limit value of the preset temperature range.
In some embodiments, the controlling to reduce the flow rate of the cooling liquid in the corresponding liquid cooling daughter pipe 51 when the temperature of any of the computing devices 40 is lower than the lower limit value of the preset temperature range further includes: when the temperature of any one of the computing devices 40 is higher than or equal to the first preset temperature value and lower than a second preset temperature value, controlling and adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 to be a preset flow rate; and when the temperature of any one of the computing devices 40 is higher than or equal to the second preset temperature value and lower than the lower limit value of the preset temperature range, controlling to reduce the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51.
In some embodiments, the controlling the flow rate of the cooling liquid in the corresponding liquid cooling daughter pipe 51 to be increased or decreased when the temperature of any of the computing devices 40 is outside the preset temperature range includes: when the temperature of any one of the computing devices 40 is outside the preset temperature range, the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 is controlled to be increased or reduced, the temperature of the computing device 40 is obtained again after the interval preset time, the temperature is used as the first feedback temperature, the first feedback temperature is determined to be outside the preset temperature range, the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 is controlled to be increased or reduced again, the interval is obtained again after the interval preset time, the temperature of the computing device 40 is used as the second feedback temperature, and the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 is controlled to be kept when the second feedback temperature is determined to be within the preset temperature range.
In some embodiments, the acquiring parameters of each computing device 40 of step S101 includes acquiring an operation amount of each computing device 40. The step S102 of acquiring the acquired parameters of any one of the computing devices 40, and controlling and adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 according to the acquired parameters of any one of the computing devices 40 includes acquiring the acquired computation amount of any one of the computing devices 40, and controlling and adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe 51 according to the acquired computation amount of any one of the computing devices 40. Wherein, the computation of each computing device 40 can be collected by the computation collection module 22.
In some embodiments, the flow-control liquid-cooled heat dissipation system 100 stores a corresponding relationship between at least one computation interval and at least one flow rate, where each computation interval corresponds to a flow rate. The controlling and adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 according to the collected operation amount of any one of the computing devices 40 includes: determining a target operation amount interval in which the operation amount of the computing equipment 40 is located; determining a target flow rate according to the corresponding relation and the target operand interval; and controlling and adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline 51 to the target flow rate.
The steps of the method in the foregoing embodiments may be executed by the control module 30, except that the step related to the parameter acquisition is executed by the temperature acquisition module 21 or the operand acquisition module 22, and the step related to the flow rate adjustment of the cooling liquid in the liquid cooling daughter pipe 51 is executed by the flow rate adjustment module 10. The flow-control liquid-cooling heat dissipation method corresponds to the flow-control liquid-cooling heat dissipation system 100, and for a more detailed description, reference may be made to the contents of each embodiment of the flow-control liquid-cooling heat dissipation system 100, and the contents of the flow-control liquid-cooling heat dissipation method and the flow-control liquid-cooling heat dissipation system 100 may also be referred to each other.
Referring to fig. 2 again, as shown in fig. 2, an embodiment of the present application provides a liquid-cooled cabinet 200, where the liquid-cooled cabinet 200 includes at least one computing device 40, a liquid-cooled duct 50, and the flow-control liquid-cooled heat dissipation system 100 according to any of the embodiments described above.
The liquid cooling pipeline 50 includes a plurality of liquid cooling sub-pipelines 51, a liquid inlet main pipe 52, a plurality of liquid inlet branch pipes 53, a liquid outlet main pipe 54 and a plurality of liquid outlet branch pipes 55, each liquid inlet branch pipe 53 is connected with a liquid inlet 511 of the liquid inlet main pipe 52 and at least one liquid cooling sub-pipeline 51, each flow rate adjusting module 10 is connected between a liquid inlet branch pipe 53 and a liquid inlet 511 of one liquid cooling sub-pipeline 51, and each liquid outlet branch pipe 55 is connected with a liquid outlet 512 of the liquid outlet main pipe 54 and at least one liquid cooling sub-pipeline 51.
The liquid cooling cabinet 200 provided by the embodiment of the application adjusts the flow rate of the cooling liquid input into the computing equipment 40 according to the temperature or the operation amount of each computing equipment 40, so that the flow of the cooling liquid is provided for the computing equipment 40 as required, and the phenomenon that the computing equipment 40 is damaged due to overheating or the working performance is influenced due to too low temperature is avoided.
The foregoing is an implementation of the embodiments of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the embodiments of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.
Claims (19)
1. The utility model provides a flow control liquid cooling system for the heat dissipation to at least one computing device in the liquid cooling rack is controlled, be provided with the liquid cooling pipeline that is used for flowing through the coolant liquid in the liquid cooling rack, the liquid cooling pipeline includes a plurality of liquid cooling daughter pipes, and each liquid cooling daughter pipe sets up in a corresponding computing device, and each liquid cooling daughter pipe includes water inlet and delivery port, its characterized in that, flow control liquid cooling system includes:
the flow rate adjusting modules are in one-to-one correspondence with the computing equipment, and each flow rate adjusting module is arranged at a water inlet of a corresponding liquid cooling sub-pipeline and used for adjusting the flow rate of cooling liquid output to the corresponding computing equipment by the corresponding liquid cooling sub-pipeline;
the system comprises at least one parameter acquisition module, at least one data processing module and a data processing module, wherein the at least one parameter acquisition module corresponds to at least one piece of computing equipment one to one, each parameter acquisition module is used for acquiring a parameter of the corresponding computing equipment, and the parameter comprises temperature or operand;
and the control module is used for acquiring the parameters of the corresponding computing equipment acquired by each parameter acquisition module and controlling the corresponding flow rate adjusting module to adjust the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline according to the acquired parameters of the corresponding computing equipment.
2. The flow-controlled liquid cooling heat dissipation system of claim 1, wherein the parameter collection module comprises a temperature collection module, the temperature collection module is configured to collect a temperature of the corresponding computing device, the control module is configured to control the corresponding flow rate adjustment module to increase or decrease a flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe when the temperature of the corresponding computing device collected by any one of the temperature collection modules is outside a preset temperature range, and control the corresponding flow rate adjustment module to maintain the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe when the temperature of the corresponding computing device collected by any one of the temperature collection modules is within the preset temperature range.
3. The flow-controlled liquid-cooled heat dissipation system of claim 2, wherein the control module is configured to control the corresponding flow rate adjustment module to increase the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe when the temperature of the corresponding computing device, acquired by any one of the temperature acquisition modules, is higher than an upper limit value of the preset temperature range.
4. The flow-controlled liquid-cooled heat dissipation system of claim 2, wherein the control module is configured to control the corresponding flow rate adjustment module to decrease the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe when the temperature of the corresponding computing device, acquired by any one of the temperature acquisition modules, is lower than the lower limit of the preset temperature range.
5. The flow-controlled liquid cooling heat dissipation system of claim 4, wherein the control module is further configured to control the corresponding flow rate adjustment module to adjust the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe to 0 when the temperature of the corresponding computing device, which is acquired by any one of the temperature acquisition modules, is lower than a first preset temperature value, wherein the first preset temperature value is smaller than a lower limit of the preset temperature range.
6. The flow-controlled liquid-cooled heat dissipation system of claim 5, wherein the control module is further configured to control the corresponding flow rate adjustment module to adjust the flow rate of the cooling liquid in the corresponding liquid-cooled sub-pipe to a preset flow rate when the temperature of the corresponding computing device, which is acquired by any one of the temperature acquisition modules, is higher than or equal to the first preset temperature value and lower than a second preset temperature value, where the second preset temperature value is smaller than a lower limit of the preset temperature range; the control module is further used for controlling the corresponding flow speed adjusting module to reduce the flow speed of the cooling liquid in the corresponding liquid cooling sub-pipeline when the temperature of the corresponding computing equipment collected by any one temperature collecting module is higher than or equal to the second preset temperature value and lower than the lower limit value of the preset temperature range.
7. The flow-controlled liquid-cooled heat dissipation system according to claim 2, wherein the control module is configured to control the corresponding flow rate adjustment module to increase or decrease the flow rate of the cooling liquid in the corresponding liquid-cooled sub-pipe when the temperature of the corresponding computing device collected by any one of the temperature collection modules is outside the preset temperature range, and to obtain the temperature of the corresponding computing device collected by the temperature collection module again after a preset time interval, and to use the temperature as the first feedback temperature, and to control the corresponding flow rate adjustment module to increase or decrease the flow rate of the cooling liquid in the corresponding liquid-cooled sub-pipe when it is determined that the first feedback temperature is outside the preset temperature range, and to obtain the temperature of the corresponding computing device collected by the temperature collection module again after the preset time interval, and to use the temperature as the second feedback temperature, and when the second feedback temperature is determined to be within the first preset temperature range, controlling the corresponding flow rate adjusting module to keep the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline.
8. The flow-controlled liquid cooling heat dissipation system of claim 1, wherein the parameter collection module comprises an operand collection module, the operand collection module is configured to collect an operand of a corresponding computing device, and the control module is configured to control the corresponding flow rate adjustment module to adjust the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe according to the operand of the corresponding computing device collected by each operand collection module.
9. The flow-controlled liquid cooling heat dissipation system of claim 8, further comprising a storage module, wherein the storage module stores a corresponding relationship between at least one operand interval and at least one flow rate, wherein each operand interval corresponds to a flow rate, the control module is configured to determine a target operand interval in which an operand acquired by any operand acquisition module is located, determine a target flow rate according to the corresponding relationship and the target operand interval, and control the corresponding flow rate adjustment module to adjust the flow rate of the corresponding liquid cooling sub-pipe to the target flow rate.
10. The utility model provides a flow control liquid cooling heat dissipation method, is applied to flow control liquid cooling system, flow control liquid cooling system is used for controlling the heat dissipation of at least one computing device in the liquid cooling rack, be provided with the liquid cooling pipeline that is used for flowing through the coolant liquid in the liquid cooling rack, the liquid cooling pipeline includes a plurality of liquid cooling subducts, and each liquid cooling subduct sets up in a corresponding computing device, its characterized in that, flow control liquid cooling heat dissipation method includes:
collecting parameters of each computing device, wherein the parameters comprise temperature or operand;
and acquiring the acquired parameters of any one of the computing devices, and controlling and adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline according to the acquired parameters of any one of the computing devices.
11. The method for flow-controlled liquid cooling heat dissipation of claim 10, wherein collecting parameters for each computing device comprises collecting a temperature for each computing device;
the acquiring of the acquired parameters of any one computing device and the controlling and adjusting of the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline according to the acquired parameters of any one computing device comprise acquiring the acquired temperature of any one computing device and controlling and adjusting of the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline according to the acquired temperature of any one computing device;
the method comprises the steps of controlling and adjusting the flow rate of cooling liquid in a corresponding liquid cooling sub-pipeline according to the acquired temperature of any computing device, further comprising the steps of controlling and increasing or decreasing the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline when the temperature of any computing device is out of a preset temperature range, and controlling and maintaining the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline when the temperature of any computing device is within the preset temperature range.
12. The method for controlling liquid cooling heat dissipation according to claim 11, wherein the controlling of increasing or decreasing the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe when the temperature of any one of the computing devices is outside the predetermined temperature range comprises:
and when the temperature of any one piece of computing equipment is higher than the upper limit value of the preset temperature range, controlling and increasing the flow speed of the cooling liquid in the corresponding liquid cooling sub pipeline.
13. The method for controlling liquid cooling heat dissipation according to claim 11, wherein the controlling of increasing or decreasing the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe when the temperature of any one of the computing devices is outside the predetermined temperature range comprises:
and when the temperature of any one computing device is lower than the lower limit value of the preset temperature range, controlling and reducing the flow speed of the cooling liquid in the corresponding liquid cooling sub-pipeline.
14. The method for controlling liquid cooling heat dissipation according to claim 13, wherein controlling to reduce the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe when the temperature of any one of the computing devices is lower than the lower limit of the preset temperature range comprises:
when the temperature of any one piece of computing equipment is lower than a first preset temperature value, controlling and adjusting the flow rate of cooling liquid in the corresponding liquid cooling sub-pipeline to be 0, wherein the first preset temperature value is smaller than the lower limit value of the preset temperature range.
15. The method for controlling liquid cooling heat dissipation according to claim 14, wherein when the temperature of any computing device is lower than the lower limit of the preset temperature range, the method for controlling and reducing the flow rate of the cooling liquid in the corresponding liquid cooling electronic pipeline further comprises:
when the temperature of any one piece of computing equipment is higher than or equal to the first preset temperature value and lower than a second preset temperature value, controlling and adjusting the flow rate of cooling liquid in the corresponding liquid cooling sub-pipeline to be a preset flow rate, wherein the second preset temperature value is smaller than the lower limit value of the preset temperature range;
and when the temperature of any one piece of computing equipment is higher than or equal to the second preset temperature value and lower than the lower limit value of the preset temperature range, controlling and reducing the flow speed of the cooling liquid in the corresponding liquid cooling sub pipeline.
16. The method for controlling liquid cooling heat dissipation according to claim 11, wherein the controlling of increasing or decreasing the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipe when the temperature of any one of the computing devices is outside the predetermined temperature range comprises:
when the temperature of any computing equipment is located outside the preset temperature range, the flow rate of cooling liquid in the corresponding liquid cooling sub-pipeline is controlled to be increased or reduced, the temperature of the computing equipment is obtained again after the interval preset time is long, the temperature is used as first feedback temperature, the first feedback temperature is determined to be located when the interval preset temperature range is outside, the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline is controlled to be increased or reduced again, the interval preset time is long, the temperature of the computing equipment is obtained again, the temperature is used as second feedback temperature, and the second feedback temperature is determined to be located when the first preset temperature range is within, the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline is controlled to be kept.
17. The method for controlling liquid cooling heat dissipation according to claim 10, wherein the collecting parameters of each computing device comprises collecting an operand of each computing device;
and acquiring the acquired parameters of any one of the computing devices, and controlling and adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline according to the acquired parameters of any one of the computing devices, wherein the method comprises acquiring the acquired calculation amount of any one of the computing devices, and controlling and adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline according to the acquired calculation amount of any one of the computing devices.
18. The method of claim 17, wherein the flow-controlled liquid-cooled heat dissipation system further stores a corresponding relationship between at least one operand interval and at least one flow rate, wherein each operand interval corresponds to a flow rate, and wherein controlling and adjusting the flow rate of the cooling fluid in the corresponding liquid-cooled sub-pipe according to the collected operand of any computing device comprises:
determining a target operand interval in which the operand of the computing equipment is located;
determining a target flow rate according to the corresponding relation and the target operand interval; and
and controlling and adjusting the flow rate of the cooling liquid in the corresponding liquid cooling sub-pipeline to the target flow rate.
19. A liquid-cooled cabinet comprising at least one computing device, liquid-cooled ducts, and a flow-controlled liquid-cooled heat dissipation system as recited in any of claims 1-9.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115167569A (en) * | 2022-09-07 | 2022-10-11 | 中国电子科技集团公司第十五研究所 | Cooling working medium flow velocity adjusting system applied to VPX equipment |
| CN115666089A (en) * | 2022-10-28 | 2023-01-31 | 深圳市瀚强科技股份有限公司 | Electronic equipment and internal environment temperature regulation control method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115167569A (en) * | 2022-09-07 | 2022-10-11 | 中国电子科技集团公司第十五研究所 | Cooling working medium flow velocity adjusting system applied to VPX equipment |
| CN115666089A (en) * | 2022-10-28 | 2023-01-31 | 深圳市瀚强科技股份有限公司 | Electronic equipment and internal environment temperature regulation control method thereof |
| CN115666089B (en) * | 2022-10-28 | 2023-11-07 | 深圳市瀚强科技股份有限公司 | Electronic equipment and internal environment temperature regulation control method thereof |
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Address after: 1101, Building D1, Nanshan Zhiyuan, No. 1001 Xueyuan Avenue, Changyuan Community, Taoyuan Street, Nanshan District, Shenzhen City, Guangdong Province, 518055 Applicant after: SHENZHEN HANQIANG TECHNOLOGY Co.,Ltd. Address before: Unit ghijklm, block B, 7 / F, building 7, Baoneng Science Park, Qinghu village, Qinghu community, Longhua street, Shenzhen, Guangdong 518000 Applicant before: SHENZHEN HANQIANG TECHNOLOGY Co.,Ltd. |