Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
The cooling control system and method for computing equipment provided by the embodiment of the invention are applied to a liquid-cooled cabinet, the liquid-cooled cabinet comprises the cooling control system for computing equipment, the cooling control system for computing equipment and the method for computing equipment are used for cooling control of computing equipment in the liquid-cooled cabinet, please refer to fig. 1, and fig. 1 is a partial structural schematic diagram of the liquid-cooled cabinet provided by the embodiment of the invention.
The liquid-cooled cabinet 100 includes at least one computing device 11, each computing device 11 includes a cooling unit (not shown), each cooling unit includes a water inlet a (ij) and a water outlet b (ij), the liquid-cooled cabinet 100 includes a total water inlet 12 and a total water outlet 13, the total water inlet 12 is connected to the water inlets a (ij) of the cooling units of all computing devices 11 in the liquid-cooled cabinet 100, and the total water outlet 13 is connected to the water outlets b (ij) of the cooling units of all computing devices 11 in the liquid-cooled cabinet 100.
Wherein i represents a water inlet corresponding to the computing device 11 in the ith row in fig. 1, and i is 1,2,3, 4; j denotes the outlet corresponding to the computing device 11 in the jth column of fig. 1, and j is 1,2,3, 4.
Where the 4 rows and 4 columns of computing devices 11 illustrated in fig. 1 are merely an example, the liquid-cooled cabinet 100 may include computing devices 11 in any number and arrangement as desired, for example, in some embodiments, the liquid-cooled cabinet 100 may include computing devices 11 in 6 rows and 5 columns. In this application, the rows refer to the arrangement direction of one row of computing devices 11 and are parallel to the bearing surfaces on which the liquid-cooled cabinet 100 is placed, and the columns refer to the arrangement direction of one row of computing devices 11 and are perpendicular to the bearing surfaces on which the liquid-cooled cabinet 100 is placed.
Referring to fig. 1 and fig. 2 together, fig. 2 is a schematic diagram illustrating a cooling control system for a computing device according to an embodiment of the present invention.
The computing device cooling control system 20 includes a water pump 21, a parameter acquisition unit 22, and a main control unit 23.
The water pump 21 is connected between the total water inlet 12 of the liquid-cooling cabinet 100 and the water inlet a (ij) of each cooling unit, and is configured to receive cold water input from the total water inlet 12 of the liquid-cooling cabinet 100, and output the cold water to the water inlet a (ij) of the cooling unit of each computing device 11 to cool each computing device 11, so that hot water obtained by cooling the computing device 11 is output to the total water outlet 13 of the liquid-cooling cabinet 100 through the water outlet b (ij) of the cooling unit of each computing device 11.
The parameter obtaining unit 22 is configured to obtain relevant parameters of the liquid-cooled cabinet 100.
The main control unit 23 is connected to the water pump 21 and the parameter obtaining unit 22, and is configured to obtain the relevant parameters obtained by the parameter obtaining unit 22, and control the water flow rate of the cold water output by the water pump 21 according to the relevant parameters of the liquid-cooling cabinet 100 and the current working mode of the liquid-cooling cabinet 100.
Therefore, in the cooling control system 20 for computing equipment provided in the embodiment of the present invention, the parameter obtaining unit 22 obtains the relevant parameters of the liquid-cooling cabinet 100, and the main control unit 23 controls the water flow rate of the cold water output by the water pump 21 according to the obtained relevant parameters of the liquid-cooling cabinet 100 and the current working mode of the liquid-cooling cabinet 100, so that the cooling effect on the computing equipment 11 is matched with the working mode of the computing equipment 11, and the computing equipment 11 works in the optimal working state in the current working mode.
The water pump 21 may be a variable frequency water pump, and the main control unit 23 may change the flow rate of water output by the variable frequency water pump by adjusting the frequency of the variable frequency water pump.
In some embodiments, the parameters associated with the liquid-cooled cabinet 100 include at least one of parameters of a power system that powers the computing equipment 11 in the liquid-cooled cabinet 100, parameters of each computing equipment 11 in the liquid-cooled cabinet 100, and environmental parameters of the liquid-cooled cabinet 100.
Referring to fig. 3, fig. 3 is a schematic diagram illustrating a cooling control system for computing equipment according to another embodiment of the present invention.
The power supply system for supplying power to the computing devices 11 in the liquid-cooled cabinet 100 includes a power grid 200, and the parameters of the power supply system for supplying power to the computing devices 11 in the liquid-cooled cabinet 100 include input power when the power grid 200 supplies power to each computing device 11. As shown in fig. 3, the parameter obtaining unit 22 includes an input power calculating unit 221, the input power calculating unit 221 is connected between each computing device 11 and the power grid 200, and is connected to the main control unit 23, and the input power calculating unit 221 is configured to calculate the input power when the power grid 200 supplies power for each computing device, and send the calculated input power to the main control unit 23.
Wherein, the input power calculating unit 221 is connected to the main control unit 23, and includes: the input power calculating unit 221 is communicatively connected to the main control unit 23, for example, by a wireless connection or a wired connection.
In some embodiments, as shown in fig. 4, fig. 4 is a schematic diagram of a composition of an input power calculation unit of a cooling control system of a computing device according to an embodiment of the present invention. The input power calculation unit 221 includes a voltage detection module 4, a current detection module 5, and a processing module 6, the voltage detection module 4 and the current detection module 5 are connected to the power grid 200 and the circuit of the computing device 11, the voltage detection module 4 and the current detection module 5 are both connected to the processing module 6, and the processing module 6 is connected to the main control unit 23. The voltage detection module 4 is configured to detect an input voltage when the power grid 200 supplies power to each computing device 11, the current detection module 5 is configured to detect an input current when the power grid 200 supplies power to each computing device 11, and the processing module 6 is configured to calculate the input power when the power grid 200 supplies power to each computing device 11 according to the input voltage and the input current, and send the input power to the main control unit 23.
The current detection module 5 may include a current meter, a current transformer, or another device for detecting current, the voltage detection module 4 may include a detection resistor located in a power supply path of the power grid, and the processing module 6 obtains an input voltage according to the detection resistor and the input current detected by the current detection module 5, specifically, if a resistance value of the detection resistor is R1 and the input current is I1, the processing module 6 may obtain the input voltage U1 — R1 — I1 according to an ampere theorem. The processing module 6 may be a single chip, a microcontroller, or the like.
In some embodiments, the power grid 200 not only provides power to the computing device 11, but also provides power to the master control unit 23.
The parameters of each computing device 11 in the liquid-cooled cabinet 100 include at least one of a working temperature, a calculation force value, and a calculation amount of each computing device 11.
In some embodiments, the parameter obtaining unit 22 includes a parameter obtaining module (not shown) disposed in each computing device 11, and the parameter obtaining module is configured to obtain at least one of the working temperature, the calculation force value, and the calculation amount of the corresponding computing device 11, and send the obtained value to the main control unit 23. In other embodiments, the parameter obtaining unit 22 is connected to each computing device 11, receives at least one of the working temperature, the calculation force value, and the calculation amount from each computing device 11, and sends the received value to the main control unit 23.
The parameter obtaining module may include at least one of a temperature sensor and an information reading module, which are disposed inside the computing device 11, where the temperature sensor is configured to obtain a working temperature of the corresponding computing device 11, and the information reading module is configured to read a computation value and a computation amount of the corresponding computing device 11. The calculation force value is the maximum calculable quantity of the computing equipment 11, namely the calculation capacity of the computing equipment 11, and is stored in the memory of the computing equipment 11 in advance, and the information reading module reads the information of the calculation force value stored in advance from the memory. The information reading module can detect the current process amount of the computing device 11 to obtain the operation amount. For example, the computation amount has a corresponding relationship with the number of processes, and the information reading module can obtain the computation amount according to the number of current processes and the corresponding relationship. The information reading module may be an embedded chip of the computing device 11.
The parameter obtaining module is connected to the main control unit 23 in a wired or wireless manner, and sends at least one of the obtained working temperature, calculation force value, and calculation amount of the corresponding computing device 11 to the main control unit 23 in a wired or wireless manner.
The environmental parameters of the liquid cooling cabinet 100 include at least one of an environmental temperature of the liquid cooling cabinet 100, an inlet water temperature of water input from the main water inlet 12, and an outlet water temperature of water output from the main water outlet 13. As shown in fig. 3, the parameter acquiring unit 22 further includes a temperature acquiring unit 222, where the temperature acquiring unit 222 is configured to acquire at least one of the ambient temperature, the water inlet temperature, and the water outlet temperature of the liquid-cooled cabinet 100, and send the acquired temperature to the main control unit 23.
Wherein, temperature acquisition unit 222 includes temperature sensor 1, play water temperature sensor 2, ambient temperature sensor 3 of intaking, wherein, please refer to and draw together fig. 1 and fig. 3, temperature sensor 1 of intaking set up in liquid cooling rack 100 total water inlet 12, play water temperature sensor 2 set up in liquid cooling rack 100 total delivery port 13, ambient temperature sensor 3 set up in liquid cooling rack 100 and expose in the internal environment of liquid cooling rack 100, just intake temperature sensor 1 play water temperature sensor 2 and ambient temperature sensor 3 respectively with main control unit 23 is connected through wired or wireless mode.
The inlet water temperature sensor 1 is used for acquiring the inlet water temperature and sending the inlet water temperature to the main control unit 23; the water outlet temperature sensor 2 is used for acquiring the water outlet temperature and sending the water outlet temperature to the main control unit 23; the ambient temperature sensor 3 is configured to collect the ambient temperature and send the ambient temperature to the main control unit 23. Specifically, the inlet water temperature sensor 1 is disposed inside the total water inlet 12 of the liquid cooling cabinet 100, for example, disposed on an inner wall of the total water inlet 12, and is configured to contact with water flowing through the total water inlet 12 when water flows through the total water inlet 12, so as to acquire the inlet water temperature; the outlet temperature sensor 2 is disposed inside the main water outlet 13 of the liquid cooling cabinet 100, for example, disposed on an inner wall of the main water outlet 13, and is configured to contact with water flowing through the main water outlet 13 when water flows through the main water outlet 13, so as to collect the outlet temperature. The ambient temperature sensor 3 is disposed in the liquid-cooled cabinet 100 and exposed to the internal environment of the liquid-cooled cabinet 100, specifically, the ambient temperature sensor 3 is not sealed by other devices, and can be directly contacted with the internal air of the liquid-cooled cabinet 100 and the like to obtain the internal ambient temperature of the liquid-cooled cabinet 100.
Wherein, intake temperature sensor 1, go out water temperature sensor 2 and ambient temperature sensor 3 respectively with main control unit 23 is connected, includes: the water inlet temperature sensor 1, the water outlet temperature sensor 2 and the environment temperature sensor 3 are respectively in communication connection with the main control unit 23.
In some embodiments, the operation modes of the liquid-cooling cabinet 100 include a calculation power optimizing mode, when the liquid-cooling cabinet 100 is in the calculation power optimizing mode, the related parameters of the liquid-cooling cabinet 100 include the operating temperature of each computing device 11, and the main control unit 23 controls the water flow rate of the cold water output by the water pump 21 according to the operating temperature of each computing device 11, so that the average calculation power value of each computing device 11 in the liquid-cooling cabinet 100 reaches a first preset target value, where the first preset target value is a maximum value of the average calculation power value on the premise that each computing device 11 does not overload an excessive temperature, and the average calculation power value is an average value of the calculation power values of each computing device 11 in the liquid-cooling cabinet 100.
Wherein, the computing device 11 operates in the optimal operating state in the current operating mode, including: the average calculation force value of each computing device 11 of the liquid cooling cabinet 100 in the calculation force optimizing mode reaches the first preset target value. When the liquid-cooled cabinet 100 is in the optimal computing power mode, the average computing power of each computing device 11 in the liquid-cooled cabinet 100 reaches the maximum value on the premise that the overload and the over-temperature are not generated.
Since the actual calculated force value of the computing device 11 is related to the operating temperature of the computing device 11, generally speaking, the highest calculated force value is actually achieved when the computing device 11 is at an optimal operating temperature, which in turn is related to the incoming water flow rate, generally speaking, the greater the incoming water flow rate, the better the cooling of the computing device 11, and the lower the operating temperature. Therefore, the main control unit 23 controls and adjusts the water flow of the cold water output by the water pump 21 according to the relationship between the working temperature and the optimal working temperature in the relevant parameters of the liquid-cooling cabinet 100, so that the working temperature is maintained at the optimal working temperature, and the average calculation value of each computing device 11 in the liquid-cooling cabinet 100 reaches a first preset target value. Wherein the optimum working temperature can be obtained by experiments and the like in advance.
In some embodiments, the calculation value, the working temperature, and the first mathematical relationship model between the inflow rates may also be obtained through a predetermined experiment and calculation, the main control unit 23 calculates a first target inflow rate according to the working temperature, the first preset target value, and the first mathematical relationship model, and controls the water pump 21 to make the current inflow rate of the liquid-cooled cabinet 100 reach the first target inflow rate, so that the average calculation value of each computing device 11 in the liquid-cooled cabinet 100 reaches the first preset target value, that is, the average calculation value of each computing device 11 in the liquid-cooled cabinet 100 reaches the maximum value on the premise that the average calculation value is not overloaded and over-heated.
The aforementioned calculation force values pre-stored in the memory of the computing device 11 may include calculation force values corresponding to a plurality of temperature levels, and after the information reading module reads the calculation force values corresponding to the plurality of temperature levels from the memory, the information reading module determines a current calculation force value according to the current temperature of the computing device 11.
The water inlet flow is the flow of the cold water output by the water pump 21.
In other embodiments, the working mode of the liquid cooling cabinet 100 includes a hot water optimal mode, when the liquid cooling cabinet 100 is in the hot water optimal mode, the related parameters of the liquid cooling cabinet include a calculation value, an input power, the water inlet temperature, and the ambient temperature of each computing device, and the main control unit 23 controls the water flow rate of the cold water output by the water pump 21 according to the calculation value, the input power, the water inlet temperature, the water outlet temperature, and the ambient temperature of each computing device 11, so that the water outlet temperature of the total water outlet 13 of the liquid cooling cabinet 100 reaches a second preset target value, where the second preset target value is a maximum value of the water outlet temperature on the premise that each computing device 11 is not overloaded with excessive temperature.
Wherein, the computing device 11 operates in the optimal operating state in the current operating mode, including: the outlet water temperature of the liquid cooling cabinet 100 in the hot water optimal mode reaches the second preset target value. When the liquid-cooled cabinet 100 is in the hot water optimal mode, the outlet water temperature of the total water outlet 13 of the liquid-cooled cabinet 100 reaches a maximum value on the premise that each computing device 11 is not overloaded and overheated.
Because a certain complex mathematical relationship exists between the water outlet temperature and the force calculation value, the input power, the water inlet temperature, the environment temperature and the water inlet flow, a second mathematical relationship model between the water outlet temperature and the force calculation value, the input power, the water inlet temperature, the environment temperature and the water inlet flow can be obtained through pre-experiments and calculation. Furthermore, the main control unit 23 calculates a second target inflow according to the calculation value, the input power, the inflow temperature, the ambient temperature, the second preset target value, and the first mathematical relationship model to obtain a second target inflow, and controls the water pump 21 to make the current inflow of the liquid cooling cabinet 100 reach the second target inflow, so that the outflow temperature of the total water outlet 13 of the liquid cooling cabinet 100 reaches the second preset target value, that is, the outflow temperature of the total water outlet 13 of the liquid cooling cabinet 100 reaches a maximum value on the premise that the respective computing devices 11 are not overloaded and over-heated.
In some embodiments, the main control unit 23 is further configured to control the water pump 21 to increase the water flow of the output cold water when the parameter value of at least one parameter of the related parameters of the liquid-cooling cabinet 100 collected by the parameter obtaining unit 22 is abnormal.
The inlet flow rate and the relevant parameters of the liquid-cooled cabinet 100 have a complex mathematical relationship, which may be obtained through preliminary experiments or calculations. And then when the acquired parameter value of at least one parameter in the related parameters of the liquid cooling cabinet 100 is abnormal, the inflow rate of water can be increased so that the abnormal value in the related parameters of the liquid cooling cabinet 100 can be recovered to be normal.
In some embodiments, as shown in fig. 3, the parameter obtaining unit 22 further includes a flow sensor 223, where the flow sensor 223 is disposed at an output end of the water pump 21 and configured to collect the inflow water and send the inflow water to the main control unit 23, and the main control unit 23 controls the water pump 21 to increase or decrease the water flow according to a relationship between a current inflow water and a target inflow water, so that the inflow water reaches the target inflow water, where the inflow water is a water flow of cold water output by the water pump 21.
Referring to fig. 5, fig. 5 is a schematic diagram illustrating a liquid-cooled cabinet according to an embodiment of the present invention.
The liquid-cooled cabinet 100 includes at least one computing device 11 and the computing device cooling control system 20.
In some embodiments, as shown in FIG. 4, the number of computing devices 11 is 16.
Referring to fig. 6, fig. 6 is a flowchart illustrating a cooling control method for a computing device according to an embodiment of the invention.
601. And acquiring relevant parameters of the liquid cooling cabinet.
602. And controlling the water inflow of the total water inlet of the liquid cooling cabinet according to the relevant parameters of the liquid cooling cabinet and the current working mode of the liquid cooling cabinet.
Therefore, according to the cooling control method for the computing equipment provided by the embodiment of the invention, the related parameters of the liquid cooling cabinet are obtained, and the water inflow is controlled according to the obtained related parameters of the liquid cooling cabinet and the current working mode of the liquid cooling cabinet, so that the cooling effect on the computing equipment is matched with the working mode of the computing equipment, and the computing equipment works in the optimal working state in the current working mode.
The method for controlling cooling of a computing device may be applied to the system 20 for controlling cooling of a computing device in any of the foregoing embodiments, and step 601 may specifically include: acquiring, by the parameter acquiring unit 22 in the computing equipment cooling control system 20, relevant parameters of the liquid-cooled cabinet. And step 602 may be performed by the master control unit 23 in the computing device cooling control system 20.
In some embodiments, the parameters associated with the liquid-cooled cabinet include at least one of parameters of a power system that powers computing devices in the liquid-cooled cabinet, parameters of computing devices in the liquid-cooled cabinet, and environmental parameters of the liquid-cooled cabinet.
In some embodiments, the power system for powering computing devices in the liquid-cooled cabinet comprises a power grid, and the parameters of the power system for powering computing devices in the liquid-cooled cabinet comprise input power for each computing device when the power grid is supplying power.
In some embodiments, the parameters of each computing device in the liquid-cooled cabinet include at least one of an operating temperature, a computing force value, and a computing load of each computing device.
In some embodiments, the environmental parameter of the liquid-cooled cabinet includes at least one of an ambient temperature of the liquid-cooled cabinet, an inlet temperature of water input from the main water inlet, and an outlet temperature of water output from the main water outlet.
In some embodiments, the working modes of the liquid cooling cabinet include a calculation optimal mode, when the liquid cooling cabinet is in the calculation optimal mode, the relevant parameters of the liquid cooling cabinet include the working temperature of each computing device, and the step of controlling the inflow of the total water inlet of the liquid cooling cabinet according to the relevant parameters of the liquid cooling cabinet and the current working mode of the liquid cooling cabinet includes:
and controlling the water inlet flow according to the working temperature of each computing device so that the average calculation force value of each computing device in the liquid cooling cabinet reaches a first preset target value, wherein the first preset target value is the maximum value of the average calculation force value on the premise that each computing device does not overload and overheat, and the average calculation force value is the average value of the calculation force values of each computing device in the liquid cooling cabinet.
Wherein the computing device operates in an optimal operating state in the current operating mode, including: and the average calculation force value of each calculation device of the liquid cooling cabinet in the calculation force optimal mode reaches the first preset target value. When the liquid cooling cabinet is in the calculation force optimal mode, the average calculation force value of each calculation device in the liquid cooling cabinet reaches the maximum value on the premise of not overloading and not overheating.
Because the actual computation value of the computing device is related to the operating temperature of the computing device, generally speaking, when the computing device is at an optimal operating temperature, the actual computation value is the highest, and the operating temperature is related to the inflow rate, generally speaking, the greater the inflow rate, the better the cooling of the computing device, and the lower the operating temperature. Therefore, the water inlet flow can be controlled and adjusted according to the relation between the working temperature and the optimal working temperature in the relevant parameters of the liquid cooling cabinet, so that the working temperature is maintained to be the optimal working temperature, and the average calculation force value of each calculation device in the liquid cooling cabinet reaches a first preset target value. Wherein the optimum working temperature can be obtained by experiments and the like in advance.
In some embodiments, the calculation value, the working temperature, and the first mathematical relationship model between the inflow rates can be obtained through a predetermined experiment and calculation, and then a first target inflow rate is obtained through calculation according to the working temperature, the first preset target value, and the first mathematical relationship model, and the current inflow rate of the liquid cooling cabinet is controlled to reach the first target inflow rate, so that the average calculation value of each computing device in the liquid cooling cabinet reaches the first preset target value, that is, the average calculation value of each computing device in the liquid cooling cabinet reaches the maximum value on the premise that the average calculation value of each computing device in the liquid cooling cabinet does not overload the excessive temperature.
Wherein the computation force value may include computation force values corresponding to a plurality of temperature levels, and further determine a current computation force value according to a current temperature of the computing device.
In other embodiments, the working mode of the liquid-cooling cabinet includes a hot-water optimal mode, when the liquid-cooling cabinet is in the hot-water optimal mode, the relevant parameters of the liquid-cooling cabinet include calculation values of each computing device, input power, the water inlet temperature, and the ambient temperature, and the controlling the water inlet flow of the total water inlet of the liquid-cooling cabinet according to the relevant parameters of the liquid-cooling cabinet and the current working mode of the liquid-cooling cabinet includes:
and controlling the water inlet flow according to the calculated force value, the input power, the water inlet temperature, the water outlet temperature and the environment temperature of each calculating device so as to enable the water outlet temperature of the liquid cooling cabinet to reach a second preset target value, wherein the second preset target value is the maximum value of the water outlet temperature on the premise that each calculating device is not overloaded and over-heated.
Wherein the computing device operates in an optimal operating state in the current operating mode, including: the outlet water temperature of the liquid cooling cabinet 100 in the hot water optimal mode reaches the second preset target value. When the liquid cooling cabinet is in the hot water optimal mode, the water outlet temperature of the total water outlet of the liquid cooling cabinet reaches the maximum value on the premise that each computing device is not overloaded and overheated.
Because a certain complex mathematical relationship exists between the water outlet temperature and the force calculation value, the input power, the water inlet temperature, the environment temperature and the water inlet flow, a second mathematical relationship model between the water outlet temperature and the force calculation value, the input power, the water inlet temperature, the environment temperature and the water inlet flow can be obtained through pre-experiments and calculation. And then, calculating according to the calculation value, the input power, the water inlet temperature, the environment temperature, the second preset target value and the first mathematical relationship model to obtain a second target water inlet flow, and controlling the current water inlet flow of the liquid cooling cabinet to reach the second target water inlet flow, so that the water outlet temperature of the total water outlet of the liquid cooling cabinet reaches the second preset target value, namely, the water outlet temperature of the total water outlet of the liquid cooling cabinet reaches the maximum value on the premise that each calculating device cannot be overloaded and overtemperature.
Referring to fig. 7, fig. 7 is a flowchart illustrating a cooling control method for a computing device according to another embodiment of the present invention.
701. And acquiring relevant parameters of the liquid cooling cabinet.
702. And controlling the water inflow of the total water inlet of the liquid cooling cabinet according to the relevant parameters of the liquid cooling cabinet and the current working mode of the liquid cooling cabinet.
703. And increasing the inflow when the parameter value of at least one parameter in the related parameters of the liquid cooling cabinet is acquired to be abnormal.
Steps 701 and 702 correspond to steps 601 and 602 in fig. 6, and the related descriptions may refer to each other.
In the cooling control method for computing equipment according to any of the embodiments, the step of obtaining the relevant parameters of the liquid-cooled cabinet may be performed by the parameter obtaining unit 22 in the cooling control system 20 for computing equipment provided in the embodiments of the present invention, and other steps may be performed by the main control unit 23 in the cooling control system 20 for computing equipment.
The water inlet flow and relevant parameters of the liquid cooling cabinet have a certain complex mathematical relationship, and the mathematical relationship can be obtained through preliminary experiments or calculation. And then when the parameter value of at least one parameter in the related parameters of the liquid cooling cabinet is collected to be abnormal, the inflow rate of water can be increased so as to enable the abnormal value in the related parameters of the liquid cooling cabinet to be recovered to be normal.
The method steps shown in fig. 6 to fig. 7 of the present application correspond to the functions of the foregoing system, and more specific contents can be referred to the related description of the foregoing system.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.