CN112799489A - Liquid cooling heat dissipation system and server - Google Patents
Liquid cooling heat dissipation system and server Download PDFInfo
- Publication number
- CN112799489A CN112799489A CN202110123718.XA CN202110123718A CN112799489A CN 112799489 A CN112799489 A CN 112799489A CN 202110123718 A CN202110123718 A CN 202110123718A CN 112799489 A CN112799489 A CN 112799489A
- Authority
- CN
- China
- Prior art keywords
- liquid pump
- liquid flow
- liquid
- heating element
- flow rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 195
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 35
- 238000001816 cooling Methods 0.000 title abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 76
- 239000003507 refrigerant Substances 0.000 claims abstract description 35
- 239000012530 fluid Substances 0.000 claims abstract description 20
- 230000000717 retained effect Effects 0.000 claims abstract description 10
- 230000004044 response Effects 0.000 claims description 42
- 230000020169 heat generation Effects 0.000 claims description 8
- 230000003247 decreasing effect Effects 0.000 claims description 6
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Abstract
The invention discloses a liquid cooling heat dissipation system and a server, wherein the system comprises: the collector is configured to collect heating information of the heating element; the intelligent liquid pump is in fluid connection with the heating element and is electrically connected with the collector, and the intelligent liquid pump is configured to determine the liquid flow of the refrigerant pumped into the heating element based on the heating information and the working parameters of the intelligent liquid pump; the cold plate is in fluid connection with the heating element and the intelligent liquid pump and provides a closed loop for the refrigerant to flow in the heating element and the intelligent liquid pump in a circulating mode; and the heat exchanger is in thermal contact with the cold plate and is used for dissipating heat of the refrigerant retained in the cold plate. The liquid cooling heat dissipation device can dynamically adjust the liquid cooling heat dissipation strength, improve the heat dissipation performance efficiency and prolong the service life.
Description
Technical Field
The present invention relates to the field of liquid cooling heat dissipation, and more particularly, to a liquid cooling heat dissipation system and a server.
Background
With the continuous increase of the heat flux density of electronic components, the traditional air-cooled heat dissipation mode is about to reach the bottleneck, and in order to adapt to the heat dissipation risk brought by the subsequent heat-dissipating components with higher heat flux density, the current liquid-cooled heat dissipation is a development trend. Conventional liquid cooling is classified into a cold plate type and an immersion type. Basically, the far-away process is to take away the heat of the components through a liquid medium, then exchange heat with the outside, and circulate all the time to keep the components at the normal working temperature of one component.
Current liquid cooling heat dissipation control mode is comparatively simple, and fixed inlet temperature and flow dispel the heat, and fixed mode needs the biggest heat dissipation capacity that covers whole quick-witted system the biggest among this, then will lead to in the in-service use, and actual system resource usage rate has the height to have lowly, and big flow bumps the waste that low utilization will cause the liquid cooling resource.
Aiming at the problem that liquid cooling heat dissipation in the prior art is lack of dynamic adjustment, no effective solution is available at present.
Disclosure of Invention
In view of this, an object of the embodiments of the present invention is to provide a liquid cooling heat dissipation system and a server, which can dynamically adjust the liquid cooling heat dissipation strength, improve the heat dissipation performance efficiency, and prolong the service life.
In view of the above object, a first aspect of the embodiments of the present invention provides a liquid cooling heat dissipation system, including:
the collector is configured to collect heating information of the heating element;
the intelligent liquid pump is in fluid connection with the heating element and is electrically connected with the collector, and the intelligent liquid pump is configured to determine the liquid flow of the refrigerant pumped into the heating element based on the heating information and the working parameters of the intelligent liquid pump;
the cold plate is in fluid connection with the heating element and the intelligent liquid pump and provides a closed loop for the refrigerant to flow in the heating element and the intelligent liquid pump in a circulating mode;
and the heat exchanger is in thermal contact with the cold plate and is used for dissipating heat of the refrigerant retained in the cold plate.
In some embodiments, the heat generation information includes a current temperature of the heat generating component; the working parameters comprise the normal working temperature range of the heating element;
the smart liquid pump is further configured to: increasing the liquid flow rate in response to the current temperature exceeding the maximum value of the normal operating temperature range; decreasing the liquid flow in response to the current temperature being less than the minimum of the normal operating temperature range; the current flow rate of the liquid is maintained in response to the current temperature being within the normal operating temperature range.
In some embodiments, the smart liquid pump is further configured to: in response to the current temperature exceeding a maximum value of the normal operating temperature range, determining an increase rate of the liquid flow rate based on a difference between the current temperature and the maximum value in positive correlation to increase the liquid flow rate further based on the increase rate; in response to the current temperature being less than the minimum value of the normal operating temperature range, a rate of decrease of the liquid flow rate is determined based on a difference between the current temperature and the minimum value in positive correlation to decrease the liquid flow rate further based on the rate of decrease.
In some embodiments, the heat generation information includes a current power of the heat generating component; the working parameters comprise the rated power range of the heating element;
the smart liquid pump is further configured to: determining the maximum liquid flow rate which can be provided by the intelligent liquid pump as the liquid flow rate in response to the current power exceeding the maximum value of the rated power range; in response to the current power being less than the minimum value of the rated power range, determining the liquid flow provided by the intelligent liquid pump when the intelligent liquid pump is idling as the liquid flow; and determining the liquid flow rate provided by the intelligent liquid pump when the intelligent liquid pump operates normally as the liquid flow rate in response to the current power being within the rated power range.
In some embodiments, the operating parameter comprises an operating history of the intelligent fluid pump; the smart liquid pump is further configured to further reduce the liquid flow based on the liquid flow determined based on the heating information in response to determining that the smart liquid pump continues to provide the maximum liquid flow for a threshold historical time.
In some embodiments, the system further comprises a secondary side circulation device in thermal contact with the heat exchanger for further dissipating heat obtained by the heat exchanger from the refrigerant.
In some embodiments, the collector is a programmable logic controller.
A second aspect of an embodiment of the present invention provides a server, including:
a heat generating element;
the collector is configured to collect heating information of the heating element;
the intelligent liquid pump is in fluid connection with the heating element and is electrically connected with the collector, and the intelligent liquid pump is configured to determine the liquid flow of the refrigerant pumped into the heating element based on the heating information and the working parameters of the intelligent liquid pump;
the cold plate is in fluid connection with the heating element and the intelligent liquid pump and provides a closed loop for the refrigerant to flow in the heating element and the intelligent liquid pump in a circulating mode;
and the heat exchanger is in thermal contact with the cold plate and is used for dissipating heat of the refrigerant retained in the cold plate.
In some embodiments, the heat generation information includes a current temperature of the heat generating component; the working parameters comprise the normal working temperature range of the heating element;
the smart liquid pump is further configured to: increasing the liquid flow rate in response to the current temperature exceeding the maximum value of the normal operating temperature range; decreasing the liquid flow in response to the current temperature being less than the minimum of the normal operating temperature range; the current flow rate of the liquid is maintained in response to the current temperature being within the normal operating temperature range.
In some embodiments, the smart liquid pump is further configured to: in response to the current temperature exceeding a maximum value of the normal operating temperature range, determining an increase rate of the liquid flow rate based on a difference between the current temperature and the maximum value in positive correlation to increase the liquid flow rate further based on the increase rate; in response to the current temperature being less than the minimum value of the normal operating temperature range, a rate of decrease of the liquid flow rate is determined based on a difference between the current temperature and the minimum value in positive correlation to decrease the liquid flow rate further based on the rate of decrease.
The invention has the following beneficial technical effects: the liquid cooling heat dissipation system and the server provided by the embodiment of the invention are in fluid connection with the heating element and are electrically connected to the collector by using the intelligent liquid pump, and the intelligent liquid pump is configured to determine the liquid flow of a refrigerant pumped into the heating element based on heating information and working parameters of the intelligent liquid pump; the cold plate is in fluid connection with the heating element and the intelligent liquid pump, and provides a closed loop for the refrigerant to circularly flow in the heating element and the intelligent liquid pump; the heat exchanger is in thermal contact with the cold plate and used for enabling the refrigerant retained in the cold plate to dissipate heat, the liquid cooling heat dissipation strength can be dynamically adjusted, the heat dissipation performance efficiency is improved, and the service life is prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a liquid cooling heat dissipation system according to the present invention;
fig. 2 is a detailed structural diagram of a liquid cooling heat dissipation system provided by the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
In view of the above, a first aspect of the embodiments of the present invention provides an embodiment of a liquid cooling heat dissipation system that improves performance efficiency of heat dissipation and prolongs a service life of the system. Fig. 1 is a schematic flow chart of a liquid-cooling heat dissipation system according to the present invention.
As shown in fig. 1, the liquid cooling heat dissipation system includes:
a collector (not shown) configured to collect heat information of the heat generating component;
the intelligent liquid pump 1 is in fluid connection with the heating element and is electrically connected with a collector (not shown), and the intelligent liquid pump 1 is configured to determine the liquid flow of a refrigerant pumped into the heating element based on the heating information and the working parameters of the intelligent liquid pump 1;
the cold plate 2 is in fluid connection with the heating element and the intelligent liquid pump 1, and the cold plate 2 provides a closed loop for the refrigerant to flow in the heating element and the intelligent liquid pump 1 in a circulating manner;
and the heat exchanger 3 is in thermal contact with the cold plate 2 and is used for dissipating heat of the refrigerant retained in the cold plate 2.
In some embodiments, the heat generation information includes a current temperature of the heat generating component; the working parameters comprise the normal working temperature range of the heating element; the smart liquid pump 1 is further configured to: increasing the liquid flow rate in response to the current temperature exceeding the maximum value of the normal operating temperature range; decreasing the liquid flow in response to the current temperature being less than the minimum of the normal operating temperature range; the current flow rate of the liquid is maintained in response to the current temperature being within the normal operating temperature range.
In some embodiments, the smart liquid pump 1 is further configured to: in response to the current temperature exceeding a maximum value of the normal operating temperature range, determining an increase rate of the liquid flow rate based on a difference between the current temperature and the maximum value in positive correlation to increase the liquid flow rate further based on the increase rate; in response to the current temperature being less than the minimum value of the normal operating temperature range, a rate of decrease of the liquid flow rate is determined based on a difference between the current temperature and the minimum value in positive correlation to decrease the liquid flow rate further based on the rate of decrease.
In some embodiments, the heat generation information includes a current power of the heat generating component; the working parameters comprise the rated power range of the heating element; the smart liquid pump 1 is further configured to: in response to the current power exceeding the maximum value of the rated power range, determining the maximum liquid flow rate which can be provided by the intelligent liquid pump 1 as the liquid flow rate; in response to the current power being less than the minimum value of the rated power range, determining the liquid flow provided by the intelligent liquid pump 1 when idling as the liquid flow; the liquid flow rate provided when the smart liquid pump 1 is operating normally is determined as the liquid flow rate in response to the current power being within the rated power range.
In some embodiments, the operating parameters include an operating history of the smart liquid pump 1; the smart liquid pump 1 is further configured to: in response to determining that the smart liquid pump 1 continues to provide the maximum liquid flow for the threshold historical time, the liquid flow is further reduced based on the liquid flow determined based on the heating information.
In some embodiments, the system further comprises a secondary circulation device in thermal contact with the heat exchanger 3 for further dissipating heat obtained by the heat exchanger 3 from the refrigerant.
In some embodiments, the collector (not shown) is a programmable logic controller.
The following further illustrates embodiments of the invention in accordance with the specific example shown in fig. 2.
Firstly, a collector is arranged in a server, the temperature of each electronic component is obtained, and the temperature is transmitted to an intelligent liquid pump. The intelligent liquid pump reduces the temperature of electronic components in the server by controlling the flow of liquid flowing into the server through a PLC (programmable logic controller). After the temperature is reduced to a set point (such as normal working temperature), the flow rate is kept unchanged and the operation is stable.
Therefore, the intelligent liquid pump can automatically adjust the liquid flow by acquiring the temperature information, so that the temperature of the electronic component is in a normal working range; when the temperature is high, the flow is increased, and when the temperature is lower than a set value, the flow is contracted.
On the other hand, the refrigerant liquid naturally flows back to the cold plate, and the refrigerant liquid is cooled again by the heat exchanger on the cold plate side for the intelligent liquid pump to draw again for use.
As can be seen from the above embodiments, the liquid cooling heat dissipation system provided by the embodiments of the present invention is fluidly connected to the heating element through a pipeline by using the intelligent liquid pump, and is electrically connected to the collector, and the intelligent liquid pump is configured to determine a liquid flow based on heating information and working parameters of the intelligent liquid pump so as to pump a refrigerant into the heating element through the pipeline; the cold plate is in fluid connection with the heating element and the intelligent liquid pump through pipelines, and provides a closed loop for the refrigerant to circularly flow in the heating element and the intelligent liquid pump; the heat exchanger is arranged close to the cold plate and used for enabling the refrigerant retained in the cold plate to dissipate heat, the liquid cooling heat dissipation strength can be dynamically adjusted, the heat dissipation performance efficiency is improved, and the service life is prolonged.
In view of the above, a second aspect of the embodiments of the present invention provides an embodiment of a liquid cooling heat dissipation server, which improves performance efficiency of heat dissipation and prolongs a service life of the server. The server includes:
a heat generating element;
the collector is configured to collect heating information of the heating element;
the intelligent liquid pump is in fluid connection with the heating element and is electrically connected with the collector, and the intelligent liquid pump is configured to determine the liquid flow of the refrigerant pumped into the heating element based on the heating information and the working parameters of the intelligent liquid pump;
the cold plate is in fluid connection with the heating element and the intelligent liquid pump through pipelines, and provides a closed loop for the refrigerant to flow in the heating element and the intelligent liquid pump in a circulating manner;
and the heat exchanger is in thermal contact with the cold plate and is used for dissipating heat of the refrigerant retained in the cold plate.
In some embodiments, the heat generation information includes a current temperature of the heat generating component; the working parameters comprise the normal working temperature range of the heating element; the smart liquid pump is further configured to: increasing the liquid flow rate in response to the current temperature exceeding the maximum value of the normal operating temperature range; decreasing the liquid flow in response to the current temperature being less than the minimum of the normal operating temperature range; the current flow rate of the liquid is maintained in response to the current temperature being within the normal operating temperature range.
In some embodiments, the smart liquid pump is further configured to: in response to the current temperature exceeding a maximum value of the normal operating temperature range, determining an increase rate of the liquid flow rate based on a difference between the current temperature and the maximum value in positive correlation to increase the liquid flow rate further based on the increase rate; in response to the current temperature being less than the minimum value of the normal operating temperature range, a rate of decrease of the liquid flow rate is determined based on a difference between the current temperature and the minimum value in positive correlation to decrease the liquid flow rate further based on the rate of decrease.
It can be seen from the above embodiments that, in the server provided in the embodiments of the present invention, the intelligent liquid pump is fluidly connected to the heating element through the pipeline and electrically connected to the collector, and the intelligent liquid pump is configured to determine a liquid flow rate based on the heating information and a working parameter of the intelligent liquid pump so as to pump a refrigerant into the heating element through the pipeline; the cold plate is in fluid connection with the heating element and the intelligent liquid pump through pipelines, and provides a closed loop for the refrigerant to circularly flow in the heating element and the intelligent liquid pump; the heat exchanger is arranged close to the cold plate and used for enabling the refrigerant retained in the cold plate to dissipate heat, the liquid cooling heat dissipation strength can be dynamically adjusted, the heat dissipation performance efficiency is improved, and the service life is prolonged.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of an embodiment of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.
Claims (10)
1. A liquid-cooled heat dissipation system, comprising:
the collector is configured to collect heating information of the heating element;
the intelligent liquid pump is in fluid connection with the heating element and is electrically connected with the collector, and the intelligent liquid pump is configured to determine the liquid flow of a refrigerant pumped into the heating element based on the heating information and working parameters of the intelligent liquid pump;
the cold plate is in fluid connection with the heating element and the intelligent liquid pump and provides a closed loop for the refrigerant to flow in a circulating mode in the heating element and the intelligent liquid pump;
a heat exchanger in thermal contact with the cold plate for dissipating heat from the refrigerant retained in the cold plate.
2. The system of claim 1, wherein the heating information includes a current temperature of the heating component; the working parameters comprise the normal working temperature range of the heating element;
the smart liquid pump is further configured to: increasing the liquid flow rate in response to the current temperature exceeding a maximum value of the normal operating temperature range; decreasing the liquid flow rate in response to the current temperature being less than the minimum value of the normal operating temperature range; maintaining the current flow rate of the liquid in response to the current temperature being within the normal operating temperature range.
3. The system of claim 2, wherein the smart liquid pump is further configured to: in response to the current temperature exceeding a maximum value of the normal operating temperature range, determining an increase rate of the liquid flow rate based on a positive correlation between the current temperature and the maximum value to increase the liquid flow rate further based on the increase rate; in response to the current temperature being less than a minimum value of the normal operating temperature range, determining a reduction rate of the liquid flow rate based on a difference between the current temperature and the minimum value in positive correlation to reduce the liquid flow rate further based on the reduction rate.
4. The system of claim 1, wherein the heat generation information includes a current power of the heat generating component; the working parameters comprise the rated power range of the heating element;
the smart liquid pump is further configured to determine a maximum liquid flow rate that the smart liquid pump can provide as the liquid flow rate in response to the current power exceeding a maximum value of the rated power range; in response to the current power being less than the minimum value of the rated power range, determining the liquid flow rate provided by the intelligent liquid pump at idle speed as the liquid flow rate; and determining the liquid flow provided by the intelligent liquid pump in normal operation as the liquid flow in response to the current power being within the rated power range.
5. The system of claim 1, wherein the operating parameters include an operating history of the intelligent fluid pump; the smart liquid pump is further configured to further reduce the liquid flow based on the liquid flow determined based on the heating information in response to determining that the smart liquid pump continues to provide a maximum liquid flow for a threshold historical time.
6. The system of claim 1, further comprising:
and the secondary side circulation equipment is in thermal contact with the heat exchanger and is used for further dissipating the heat obtained by the heat exchanger from the refrigerant.
7. The system of claim 1, wherein the collector is a programmable logic controller.
8. A server, comprising:
a heat generating element;
the collector is configured to collect heating information of the heating element;
the intelligent liquid pump is in fluid connection with the heating element and is electrically connected with the collector, and the intelligent liquid pump is configured to determine the liquid flow of a refrigerant pumped into the heating element based on the heating information and working parameters of the intelligent liquid pump;
the cold plate is in fluid connection with the heating element and the intelligent liquid pump and provides a closed loop for the refrigerant to flow in a circulating mode in the heating element and the intelligent liquid pump;
a heat exchanger in thermal contact with the cold plate for dissipating heat from the refrigerant retained in the cold plate.
9. The server according to claim 8, wherein the heat generation information includes a current temperature of the heat generating component; the working parameters comprise the normal working temperature range of the heating element;
the smart liquid pump is further configured to: increasing the liquid flow rate in response to the current temperature exceeding a maximum value of the normal operating temperature range; decreasing the liquid flow rate in response to the current temperature being less than the minimum value of the normal operating temperature range; maintaining the current flow rate of the liquid in response to the current temperature being within the normal operating temperature range.
10. The server according to claim 9, wherein the smart liquid pump is further configured to: in response to the current temperature exceeding a maximum value of the normal operating temperature range, determining an increase rate of the liquid flow rate based on a positive correlation between the current temperature and the maximum value to increase the liquid flow rate further based on the increase rate; in response to the current temperature being less than a minimum value of the normal operating temperature range, determining a reduction rate of the liquid flow rate based on a difference between the current temperature and the minimum value in positive correlation to reduce the liquid flow rate further based on the reduction rate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110123718.XA CN112799489A (en) | 2021-01-29 | 2021-01-29 | Liquid cooling heat dissipation system and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110123718.XA CN112799489A (en) | 2021-01-29 | 2021-01-29 | Liquid cooling heat dissipation system and server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112799489A true CN112799489A (en) | 2021-05-14 |
Family
ID=75812713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110123718.XA Withdrawn CN112799489A (en) | 2021-01-29 | 2021-01-29 | Liquid cooling heat dissipation system and server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112799489A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113626291A (en) * | 2021-08-30 | 2021-11-09 | 苏州浪潮智能科技有限公司 | Liquid cooling monitoring method and device |
| CN115666088A (en) * | 2022-10-29 | 2023-01-31 | 深圳市瀚强科技股份有限公司 | Electronic equipment and liquid cooling heat dissipation flow control method thereof |
-
2021
- 2021-01-29 CN CN202110123718.XA patent/CN112799489A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113626291A (en) * | 2021-08-30 | 2021-11-09 | 苏州浪潮智能科技有限公司 | Liquid cooling monitoring method and device |
| CN113626291B (en) * | 2021-08-30 | 2023-07-14 | 苏州浪潮智能科技有限公司 | Liquid cooling monitoring method and device |
| CN115666088A (en) * | 2022-10-29 | 2023-01-31 | 深圳市瀚强科技股份有限公司 | Electronic equipment and liquid cooling heat dissipation flow control method thereof |
| CN115666088B (en) * | 2022-10-29 | 2023-07-21 | 深圳市瀚强科技股份有限公司 | Electronic equipment and liquid cooling heat dissipation flow control method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112799489A (en) | Liquid cooling heat dissipation system and server | |
| WO2021129757A1 (en) | Temperature control method and system and storage medium | |
| CN108601314A (en) | A kind of liquid cooling system and flow rate adjusting method | |
| US11612083B2 (en) | System and method for phase-change cooling of an electronic rack | |
| CN113206271A (en) | Immersed cooling system and method for fuel cell | |
| CN116546778A (en) | Active cold plate-based air-liquid hybrid server heat dissipation regulation and control system and method | |
| CN113038807B (en) | Control method of liquid-cooled electric energy system, liquid-cooled electric energy system and storage medium | |
| CN114007381A (en) | Immersed liquid cooling system | |
| CN109728325B (en) | Fuel cell thermal management method and system | |
| CN114929000A (en) | Power supply water cooling system with mixed WBG (work breakdown voltage) and Si (silicon on insulator) devices and control strategy thereof | |
| CN208462262U (en) | A kind of liquid cooling system | |
| CN113097597B (en) | Thermal management method of energy storage system, controller and energy storage system | |
| CN117239304B (en) | Liquid cooling energy storage thermal management system and method | |
| CN204131372U (en) | A kind of mine-used frequency-converter cooling device | |
| CN115866989A (en) | Electronic component heat dissipation system and method | |
| US20190150317A1 (en) | Data center rack mounted liquid conduction cooling apparatus and method | |
| US11930625B2 (en) | Thermal management system and method for power optimization for cooling an electronic rack | |
| CN213991483U (en) | Regulator cubicle heat abstractor, regulator cubicle and converter | |
| CN112947718B (en) | Cooling liquid temperature control method, system, equipment and medium | |
| CN114727554B (en) | Heat dissipation device, system and method | |
| CN112074151A (en) | Heat abstractor, converter, motor | |
| CN114760802A (en) | Converter cooling system, control method thereof and converter | |
| CN107979946B (en) | Cooling system and method | |
| CN217641303U (en) | Liquid cooling heat dissipation system | |
| CN217064358U (en) | Server cooling device and immersed cooling system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210514 |
|
| WW01 | Invention patent application withdrawn after publication |