CN115662939A

CN115662939A - Wafer bearing device of heat treatment equipment

Info

Publication number: CN115662939A
Application number: CN202211246898.1A
Authority: CN
Inventors: 马兰; 杨锋; 吴承岩; 马白玲
Original assignee: Quantum Semiconductor Equipment Shanghai Co ltd
Current assignee: Quantum Semiconductor Equipment Shanghai Co ltd
Priority date: 2022-10-12
Filing date: 2022-10-12
Publication date: 2023-01-31

Abstract

The invention provides a wafer bearing device of heat treatment equipment, which comprises: at least one carrying disc is movably arranged in the heat treatment equipment, a sheet groove is formed in the upper side of the carrying disc, and a plurality of through holes are formed in the carrying disc; the jacking structure is arranged below the carrying disc and can be driven by the telescopic driving part to lift; the jacking disc is movably arranged between the jacking structure and the carrying disc; the lower ends of the guide posts are connected with the top disc, the upper end of each guide post movably penetrates through one through hole, a positioning piece is arranged on the end face of the upper end of each guide post, the positioning piece is in a conical table shape with the upper end diameter smaller than the lower end diameter, the lower end diameter of the positioning piece is smaller than the diameter of each guide post, the positioning piece is coaxial with the guide posts, and the periphery of the lower end of the positioning piece is tangent to the groove wall of the sheet groove. The problem of the wafer yields decline because the edge effect of the wafer is increased when the wafer is subjected to heat treatment in the wafer groove due to the fact that the difference between the inner diameter of the wafer groove and the outer diameter of the wafer is too large is solved, and the yields of the wafers after the heat treatment are improved.

Description

Wafer bearing device of heat treatment equipment

Technical Field

The invention belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a wafer bearing device of heat treatment equipment.

Background

In the field of semiconductor integrated circuit fabrication, integrated circuits are typically fabricated on a wafer (wafer), and the fabrication of a complete chip requires multiple steps. In each process step, the wafer needs to be placed in the process cavity of the corresponding semiconductor device, the wafer is placed automatically, and the wafer lifting device needs to be adopted in the process of automatically taking and placing the wafer, so that the wafer in the process cavity is lifted and lowered through the wafer lifting device.

The polycrystalline circular bearing disc can realize the taking and placing of a plurality of wafers, but due to the processing, assembly, structure and other reasons of the polycrystalline circular bearing disc, when the wafer grooves are only slightly larger than the outer diameter of the wafers, the wafer grooves can be accurately placed into the wafers difficultly. In order to ensure that a plurality of wafers can be normally placed in the wafer slots through the robot, the conventional method adopts a scheme of enlarging the wafer slots, but the enlarged wafer slots cause an increased edge effect of the wafers during heat treatment, which is very undesirable for the heat treatment of the wafers.

Disclosure of Invention

The invention aims to overcome the defects in the prior art, and provides a wafer bearing device of heat treatment equipment, wherein a top disc is movably arranged between a jacking structure and a carrying disc, the carrying disc is provided with a wafer groove for placing a wafer, the lower end of a guide post is contacted with the jacking structure, the upper end of the guide post movably penetrates through a through hole and can be driven by a telescopic driving part to lift, the upper end of the guide post is provided with a positioning part, the periphery of the lower end of the positioning part is tangent to the groove wall of the wafer groove, and the positioning part is provided with a conical outer peripheral surface which is tangent to the periphery of a received wafer so as to accurately position the wafer and enable the wafer borne by the positioning part to just fall into the corresponding wafer groove, so that the problem that the yield of the wafer is reduced due to the fact that the edge effect of the wafer is increased when the wafer is subjected to heat treatment in the wafer groove in the traditional mode is solved, and the yield of the wafer after heat treatment is improved.

In order to achieve the purpose, the technical scheme of the invention is as follows:

a wafer carrier of a thermal processing apparatus, comprising:

the carrying disc is movably arranged in the heat treatment equipment, a piece groove is formed in the upper side of the carrying disc, and a plurality of through holes are formed in the carrying disc along the circumferential direction of the piece groove;

the jacking structure is arranged below the carrying disc and can be driven by the telescopic driving component to lift;

the top disc is movably arranged between the jacking structure and the carrying disc;

the guide post, the guide post sets up to a plurality ofly, the lower extreme of guide post with the top dish is connected, every the upper end activity of guide post runs through one the through-hole, be provided with the setting element on the terminal surface of the upper end of guide post, the setting element is the toper platform form that upper end diameter is less than the lower extreme diameter, the lower extreme diameter of setting element is less than the diameter of guide post, the setting element with the guide post is coaxial, the periphery of the lower extreme of setting element with the cell wall of piece groove is tangent.

Preferably, the positioning device further comprises a positioning assembly, wherein the positioning assembly comprises:

the displacement part is connected with the carrying disc and is used for adjusting the carrying disc to displace in the horizontal direction;

the positioning detection module is electrically connected with the displacement part, arranged on the carrying disc and the top disc and used for detecting the relative position of the guide post and the through hole in real time when the guide post is ready to penetrate through the carrying disc to carry a wafer, so that the through hole is automatically aligned with the guide post.

Preferably, the positioning element is in a shape of a circular truncated cone, a quadrangular frustum, a quadrangular pyramid or a cone.

Preferably, the positioning detection module includes:

a plurality of infrared emitters disposed on the top plate;

the infrared receivers are arranged on one side of the carrying disc, which faces the top disc, correspond to the infrared transmitters in position and are used for receiving infrared signals of the infrared transmitters;

the controller, the controller with infrared receiver electric connection, the controller with displacement portion electric connection, just the controller is according to the guide post with the relative position control of through-hole displacement portion makes displacement portion is right carry the dish and adjust in the horizontal direction, when every infrared receiver receives and corresponds when the infrared signal of infrared transmitter transmission, every the guide post can with correspond coaxial automatic alignment of through-hole.

Preferably, the top disc is of a Y-shaped structure, the top disc is provided with three end portions, the number of the infrared emitters is three, and each infrared emitter is arranged on one end portion.

Preferably, a gap is formed between the through hole and the guide post.

Preferably, the jacking structure comprises:

the disc is arranged at one end of the ejector pin and is in contact with the top disc, and the other end of the ejector pin is connected with the telescopic driving part.

Preferably, the telescopic driving part comprises an air cylinder, and the output end of the air cylinder is connected with the ejector pin.

Preferably, the top plate, the guide post and the positioning piece are made of quartz, and the carrying plate is made of a ceramic tray.

Preferably, the displacement section comprises a robot arm.

The technical scheme of the invention has the beneficial effects that:

according to the invention, the jacking disc is movably arranged between the jacking structure and the carrying disc, the carrying disc is provided with a wafer groove for placing a wafer, the lower end of the guide post is contacted with the jacking structure, the upper end of the guide post movably penetrates through the through hole and can be driven by the telescopic driving part to lift, the upper end of the guide post is provided with the positioning part, the periphery of the lower end of the positioning part is tangent to the groove wall of the wafer groove, the positioning part is provided with the conical table-shaped peripheral surface which is tangent to the periphery of the received wafer so as to realize accurate positioning of the wafer, so that the wafer borne by the positioning part can just fall into the corresponding wafer groove, thereby avoiding the problem that the wafer groove needs to be enlarged in the traditional mode, solving the problem that the difference between the inner diameter of the wafer groove and the outer diameter of the wafer is too large, the wafer edge effect is increased when the wafer is subjected to heat treatment in the wafer groove, so as to cause the reduction of the wafer yield after the heat treatment, and improving the yield of the wafer after the heat treatment.

Furthermore, the top disc and the carrying disc are provided with positioning detection modules, the positioning detection modules are connected with the displacement portion, the carrying disc is connected with the displacement portion, when the guide post is ready to penetrate through the carrying disc through the through hole to carry a wafer, the positioning detection modules detect the relative positions of the guide post and the through hole in real time, and the displacement portion adjusts the displacement of the carrying disc in the horizontal direction, so that the through hole and the guide post are automatically aligned.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings, wherein like reference numerals generally represent like parts in the exemplary embodiments of the present invention.

FIG. 1 is a schematic exploded view of a wafer carrier of a thermal processing apparatus according to the present invention;

FIG. 2 shows an enlarged view of the structure at A in FIG. 1;

FIG. 3 shows an enlarged view of the structure at B in FIG. 1;

FIG. 4 is a diagram illustrating the jacking effect of the jacking structure of the wafer carrier of the heat treatment apparatus according to the present invention;

FIG. 5 shows an enlarged view of the structure at C in FIG. 4;

FIG. 6 is a diagram illustrating the falling effect of the jacking structure of the wafer carrier of the thermal processing equipment according to the present invention;

FIG. 7 shows an enlarged view of the structure at D in FIG. 6;

FIG. 8 is a top view of a wafer carrier of a thermal processing apparatus according to the present invention;

FIG. 9 is a schematic diagram illustrating a wafer carrier and a positioning assembly of a thermal processing apparatus according to the present invention;

fig. 10 shows an enlarged view of the structure at E in fig. 9.

Description of the reference numerals:

001. a carrying disc; 002. a guide post; 003. a top tray; 004. a thimble; 005. a sheet groove; 006. a through hole; 007. a positioning member; 008. a wafer; 009. a displacement section; 010. an infrared receiver; 011. an infrared emitter.

Detailed Description

Preferred embodiments of the present invention will be described in more detail below. While the following describes preferred embodiments of the present invention, it should be understood that the present invention may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

Referring to fig. 1 to 8, the present invention provides a wafer carrier of a thermal processing apparatus, including:

at least one carrier disc 001, wherein the carrier disc 001 is movably arranged inside the heat treatment equipment, a sheet groove 005 is arranged on the upper side of the carrier disc 001, and a plurality of through holes 006 are arranged on the carrier disc 001 along the circumferential direction of the sheet groove 005;

the jacking structure is arranged below the carrying disc 001 and can be driven by the telescopic driving part to lift;

the top disc 003 is movably arranged between the jacking structure and the carrying disc 001;

guide post 002, guide post 002 sets up to a plurality ofly, and guide post 002's lower extreme is connected with the roof dish 003, and a through-hole 006 is run through in the activity of the upper end of every guide post 002, is provided with setting element 007 on the terminal surface of guide post 002, and setting element 007 is the toper platform form that the upper end diameter is less than the lower extreme diameter, and the lower extreme diameter of setting element 007 is less than the diameter of guide post 002, and setting element 007 is coaxial with guide post 002, and the periphery of the lower extreme of setting element 007 is tangent with the cell wall of film trap 005.

Specifically, a plurality of through holes 006 are distributed on the circumferential surface of the carrying disc 001 in an annular array, the sheet groove 005 is circular, and the circle center of the sheet groove 005 and the annular array formed by the through holes 006 are coaxially arranged. Therefore, it is necessary to match the guiding posts 002 with the through holes 006, and the wafer can be supported by the guiding posts 002 and the positioning members 007, so as to improve the stability of wafer support. The jack-up structure drives a dish 003 and takes place the displacement, a dish 003 drives guide post 002 and goes up and down for carrying dish 001, guide post 002 that sets up on a dish 003 runs through a dish 001 through-hole 006 and is used for accepting the wafer, when guide post 002 displaces downwards, guide post 002 can bear the same displacement downwards of wafer, locating element 007 through setting up on the guide post 002, the edge of wafer is tangent with the periphery of locating element 007, the periphery of the lower extreme of locating element 007 is tangent with the cell wall of film trap 005, make the wafer enter into film trap 005 along with tangent plane gradually in the decline process, conflict with the interior bottom surface of film trap 005 up the bottom surface of wafer. The guide post 002 further drives the positioning part 007 to move downwards, the positioning part 007 is separated from the wafer, the wafer is completely positioned in the wafer slot 005, the wafer is guided to be accurately positioned to enter the wafer slot 005 with the size equal to that of the wafer in the mode, the problem that the wafer yield is reduced due to the fact that the wafer edge effect is increased when the wafer is subjected to heat treatment in the wafer slot due to the fact that the inner diameter of the wafer slot is too large and the difference between the outer diameter of the wafer is too large in the traditional mode is avoided, and the yield of the wafer after the heat treatment is improved.

Preferably, according to the process requirements of the equipment, the sizes of the cavities of the equipment with different models are different, so that the number of the loading disks which can be arranged according to the size of the cavity is 4, 9 or 16, and according to the scheme, a plurality of wafers can be accurately placed in the wafer grooves.

Furthermore, since the positioning member 007 is in a shape of a cone with an upper end diameter smaller than a lower end diameter, the outer diameter of the wafer that can be received by the positioning member 007 is within a certain range, which is the difference between the outer diameter of the lower end and the outer diameter of the upper end of the positioning member 007, so that the wafer specification that can be received by the wafer receiving device has a certain selectable range, and the applicable range of the wafers with different specifications is enlarged.

Further, the positioning member 007 is in a circular truncated cone shape, a quadrangular frustum shape, a quadrangular pyramid shape, or a conical shape.

A preferred example, shown with reference to fig. 9-10, further includes a positioning assembly comprising:

the displacement part 009, the displacement part 009 is connected with the carrier disc 001, and the displacement part 009 is used for adjusting the carrier disc 001 to displace in the horizontal direction;

location detection module, location detection module and displacement portion 009 electric connection, location detection module set up on year dish 001 and top dish 003, when guide post 002 prepares to run through year dish 001 and accepts the wafer, the relative position of real-time detection guide post 002 and through-hole 006 makes through-hole 006 and guide post 002 automatic alignment.

Specifically, because there are some factors such as vibration in the work of thermal treatment equipment, lead to relevant subassembly in the equipment to appear cooperation error, for example guide post 002 and through-hole 006 can not both accurate counterpoint at every turn, consequently need guide post 002 to aim at the through-hole 006 on the carrier disc 001 accurately when bearing the wafer, through be provided with the location detection module on set-top 003 and carrier disc 001, the location detection module is connected with displacement portion 009, carrier disc 001 is connected with displacement portion 009, when guide post 002 accepts the wafer through-hole 006, the location detection module detects the relative position of guide post 002 and through-hole 006 in real time, drive displacement portion 009 in the position that the horizontal direction adjustment carried disc 001, make the through-hole 006 and the guide post 002 of carrying disc 001 accomplish automatic alignment, guide post 002 can pass through-hole 006 accurately and be used for accepting the loaded wafer of robot, the condition that guide post 002 and through-hole 006 can not accurate counterpoint has been avoided appearing, thereby the work efficiency of thermal treatment equipment processing wafer has been improved. The temperature of the heat treatment equipment is higher in the working state, and the positioning detection module is generally provided with a heat insulation layer on the device shell for protecting components inside the device from being influenced by external high temperature.

A preferred example, as shown in fig. 10, the positioning detection module includes:

a plurality of infrared emitters 011, the infrared emitters 011 disposed on the top plate 003;

the infrared receivers 010 are arranged on one side, facing the top plate 003, of the carrier plate 001 in the same number as the infrared transmitters 011, correspond to the positions of the infrared transmitters 011, and are used for receiving infrared signals of the infrared transmitters 011;

the controller, controller and infrared receiver 010 electric connection, controller and displacement portion 009 electric connection, and the controller is according to guide post 002 and through-hole 006's relative position control displacement portion 009, makes displacement portion 009 adjust at the horizontal direction to carrying dish 001, and when every infrared receiver 010 received the infrared signal who corresponds infrared transmitter 011 transmission, every guide post 002 can with the coaxial automatic alignment of corresponding through-hole 006.

Specifically, infra-red transmitter 011 sets up on the dish 003, infra-red receiver 010 sets up and is corresponding with infra-red transmitter 011 in one side of carrying dish 001 towards the dish 003, controller and infra-red receiver 010 electric connection, controller and displacement portion 009 electric connection, infra-red receiver 010 can receive the infrared ray that comes from infra-red transmitter 011 and send, the controller carries the position of dish 001 in the horizontal direction adjustment according to the infrared signal real-time control displacement portion 009 that infra-red receiver 010 accepted, only when every infra-red receiver can both receive the infrared signal that corresponds the infra-red transmitter transmission, carry dish 001 position automatic adjustment to target in place, also be exactly every guide post 002 can with the coaxial alignment of corresponding through-hole 006, the alignment precision between the subassembly has been improved.

In a preferred example, the top plate 003 is in a Y-shaped structure, the top plate 003 is provided with three end portions, the infrared emitters 011 are provided in three, and each infrared emitter 011 is provided on one end portion.

It is specific, make the circle through triangle-shaped, get the set point of three point conduct infra-red transmitter 011 for the circle in chip groove 005, carry the infra-red receiver 010 on the dish 001 to correspond the setting, when the infrared signal of three infra-red transmitter 011 transmission is received simultaneously to three infra-red receiver 010, guide post 002 and through-hole 006 coaxial alignment to the infrared device of receiving of triangle-shaped fixed point setting can play better supplementary effect to guide post 002 and the cooperation of carrying dish 001.

In a preferred example, a gap is provided between the through hole 006 and the guide post 002.

Specifically, because be equipped with the clearance between through-hole 006 and the guide post 002 to make guide post 002 conveniently assemble with through-hole 006, make guide post 002 can more smoothly carry out the displacement by relative through-hole 006.

In a preferred example, the jack-up structure includes:

the thimble 004 and the disc are arranged at one end of the thimble 004, the disc is in contact with the top disc 003, and the other end of the thimble 004 is connected with the telescopic driving part.

Specifically, when jack-up structure carries out jack-up and whereabouts to holding-up dish 003, can control thimble 004 through flexible driver part and carry out the displacement, the disc setting drives the disc simultaneously and carries out jack-up and displacement that falls in the one end of thimble 004, thereby the disc carries out the ascending displacement of vertical side with the guide post 002 that holds-up dish 003 contacted back drive holding-up dish 003.

In a preferred example, the telescopic driving part comprises a cylinder, and the output end of the cylinder is connected with the thimble 004.

Specifically, flexible drive unit uses the cylinder as flexible subassembly, and the operation is stable, convenient to use, and flexible drive unit can also use devices such as electric jar, pneumatic cylinder.

In a preferred example, the top plate 003, the guide posts 002 and the positioning members 007 are made of quartz, and the carrier plate 001 is made of a ceramic tray.

Specifically, the top plate 003, the guide post 002 and the positioning piece 007 are made of quartz, so that the high-temperature resistant characteristic is achieved, the service life of equipment components is prolonged, and other high-temperature resistant materials can be used; the material of the carrying disc 001 comprises a ceramic tray, and the zirconia ceramic has the characteristics of corrosion resistance, wear resistance, no static electricity, no reflection, no whitening and the like, and can replace other metals such as stainless steel, hard alloy, tungsten steel and the like.

In a preferred example, the displacement section 001 includes a robot arm.

Specifically, because displacement portion 001 includes the arm, when the location detection module detects that guide post 002 does not correspond with the through-hole 006 position on the year dish 001, carry out horizontal fine setting to the position of carrying dish 001 through the arm.

Example one

Referring to fig. 1 to 10, the present embodiment provides a wafer carrier of a thermal processing apparatus, including:

at least one carrying tray 001, the carrying tray 001 being movably disposed inside the heat treatment apparatus, a sheet groove 005 being provided on an upper side of the carrying tray 001, a plurality of through holes 006 being provided on the carrying tray 001 along a circumferential direction of the sheet groove 005;

In this embodiment, the positioning member 007 is conical.

In this embodiment, the apparatus further includes a positioning assembly, the positioning assembly includes:

In this embodiment, the positioning detection module includes:

the controller, controller and infrared receiver 010 electric connection, controller and displacement portion 009 electric connection, and the controller is according to guide post 002 and through-hole 006's relative position control displacement portion 009, makes displacement portion 009 adjust at the horizontal direction to carrying dish 001, when every infrared receiver 010 receives the infrared signal who corresponds the infrared transmitter 011 transmission, every guide post 002 can with the coaxial automatic alignment of corresponding through-hole 006.

In this embodiment, the top plate 003 is a Y-shaped structure, the top plate 003 is provided with three end portions, the number of the infrared emitters 011 is three, and each infrared emitter 011 is disposed on one end portion.

In this embodiment, a gap is provided between the through hole 006 and the guide post 002.

In this embodiment, the jack-up structure includes:

In this embodiment, flexible driver part includes the cylinder, and thimble 004 is connected to the output of cylinder.

In this embodiment, the top tray 003, the guide post 002 and the positioning member 007 are made of quartz, and the carrier tray 001 is made of a ceramic tray.

In this embodiment, the displacement section 001 includes a robot arm.

Having described embodiments of the present invention, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.

Claims

1. A wafer bearing device of heat treatment equipment is characterized by comprising:

the carrying disc is movably arranged in the heat treatment equipment, a sheet groove is formed in the upper side of the carrying disc, and a plurality of through holes are formed in the carrying disc along the circumferential direction of the sheet groove;

2. The wafer carrier device of thermal processing equipment as claimed in claim 1, wherein the positioning member is in the shape of a circular truncated cone, a quadrangular frustum, a quadrangular pyramid or a cone.

3. The wafer carrier of thermal processing equipment of claim 1, further comprising a positioning assembly, the positioning assembly comprising:

the displacement part is connected with the carrying disc and is used for adjusting the displacement of the carrying disc in the horizontal direction;

the positioning detection module is electrically connected with the displacement part, is arranged on the carrying disc and the top disc and is used for detecting the relative position of the guide post and the through hole in real time when the guide post is ready to penetrate through the carrying disc to carry a wafer, so that the through hole is automatically aligned with the guide post.

4. The wafer carrier device of thermal processing equipment of claim 3, wherein the positioning detection module comprises:

a plurality of infrared emitters disposed on the top plate;

5. The wafer carrier device of thermal processing equipment as claimed in claim 4, wherein the top plate is Y-shaped, the top plate has three ends, and the number of the infrared emitters is three, and each of the infrared emitters is disposed on one of the ends.

6. The wafer carrier device of thermal processing equipment as claimed in claim 1, wherein a gap is provided between the through hole and the guide post.

7. The wafer carrier device of thermal processing equipment of claim 1, wherein the jacking structure comprises:

the disc is arranged at one end of the ejector pin and is in contact with the top disc, and the other end of the ejector pin is connected with the telescopic driving component.

8. The wafer carrying device of the thermal processing apparatus as claimed in claim 7, wherein the retractable driving member comprises a cylinder, and an output end of the cylinder is connected to the ejector pin.

9. The wafer carrier device of claim 1, wherein the top plate, the guide posts and the positioning members are made of quartz, and the carrier plate is made of a ceramic tray.

10. The wafer carrier device of the thermal processing apparatus of claim 3, wherein the displacement portion comprises a robotic arm.