CN112444210A - Plane relative position detection tool and detection method thereof - Google Patents
Plane relative position detection tool and detection method thereof Download PDFInfo
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- CN112444210A CN112444210A CN201910818880.6A CN201910818880A CN112444210A CN 112444210 A CN112444210 A CN 112444210A CN 201910818880 A CN201910818880 A CN 201910818880A CN 112444210 A CN112444210 A CN 112444210A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
Abstract
The application relates to a plane relative position detection tool and a detection method thereof, which are used for detecting the relative height between an adjustable plane and a reference plane which are parallel to each other, wherein the detection tool comprises: a substrate; a first distance sensor integrated in the substrate for detecting a first distance between the first distance sensor and the reference plane along a first direction, the first direction being a direction perpendicular to the reference plane; and a second distance sensor integrated in the substrate for detecting a second distance between the second distance sensor and the adjustable plane along the first direction. According to the first distance, the second distance and the reference relative distance of the first distance sensor and the second distance sensor in the first direction, the relative heights of the reference plane and the adjustable plane which are parallel to each other can be obtained.
Description
Technical Field
The invention relates to the field of semiconductor equipment, in particular to a plane relative position detection tool and a detection method thereof.
Background
In semiconductor etching equipment assembly alignment, which usually involves alignment of multiple device planes, the offset of the plane positions affects the semiconductor process, and thus the product yield. When plasma bombardment is performed on a silicon wafer, the silicon wafer needs to be fixed by using an electrostatic chuck, and in order to avoid leakage of plasma at the edge of the electrostatic chuck, the middle area and the edge area of the silicon wafer are bombarded by plasma close to equivalent amount, a ring of focus ring is generally arranged around the edge of the electrostatic chuck, and the upper surface of the focus ring and the upper surface of the electrostatic chuck need to be kept flush. Therefore, it is necessary to design a convenient detection tool for detecting the relative position of the plane, which is beneficial to adjusting the plane to a proper position.
Disclosure of Invention
Based on the above, the application provides a plane relative position detection tool and a detection method thereof, which are beneficial to realizing plane alignment.
A planar relative position detection tool for detecting the relative height of an adjustable plane and a reference plane that are parallel to each other, the detection tool comprising:
a substrate;
a first distance sensor integrated within the substrate for detecting a first distance between the first distance sensor and the reference plane along a first direction, the first direction being a direction perpendicular to the reference plane; and
a second distance sensor integrated within the substrate for detecting a second distance between the second distance sensor and the adjustable plane along the first direction. .
The first distance sensor and the second distance sensor are integrated in the relative position detection tool, the first distance sensor is used as a first reference point, the first distance detected by the first distance sensor is actually the vertical distance between the first reference point and the reference plane, the second distance sensor is used as a second reference point, when the adjustable plane is parallel to the reference plane, the second distance detected by the second distance sensor is actually the vertical distance between the second reference point and the adjustable plane, the reference relative distance between the first distance sensor and the second distance sensor in the first direction is known, and the relative position relationship between the two parallel planes in the vertical direction can be detected by combining the known reference relative distance after the first distance and the second distance are obtained.
In one embodiment, the first distance sensor includes a first light emitting diode and a first phototransistor, the first light emitting diode is used for emitting light signals to the reference plane, the light signals reach the first phototransistor after being reflected by the reference plane, and the first distance sensor obtains the first distance according to the propagation time of the light signals from the first light emitting diode to the first phototransistor;
the second distance sensor comprises a second light emitting diode and a second phototriode, the second light emitting diode is used for emitting optical signals towards the adjustable plane, the optical signals reach the second phototriode after being reflected by the adjustable plane, and the second distance sensor obtains the second distance according to the propagation time of the optical signals from the second light emitting diode to the second phototriode.
In one embodiment, the first distance sensor includes a first light emitting diode and a first phototransistor, the first light emitting diode is used for emitting light signals to the reference plane, the light signals reach the first phototransistor after being reflected by the reference plane, and the first distance sensor obtains the first distance according to the propagation time of the light signals from the first light emitting diode to the first phototransistor;
the second distance sensor comprises a second light emitting diode and a second phototriode, the second light emitting diode is used for emitting optical signals towards the adjustable plane, the optical signals reach the second phototriode after being reflected by the adjustable plane, and the second distance sensor obtains the second distance according to the propagation time of the optical signals from the second light emitting diode to the second phototriode.
In one embodiment, the method further comprises the following steps:
and the control assembly is respectively in communication connection with the first distance sensor and the second distance sensor and is used for acquiring the first distance and the second distance and judging the relative position of the adjustable plane and the datum plane according to the first distance, the second distance and the reference relative distance of the first distance sensor and the second distance sensor in the first direction.
In one embodiment, the control assembly is independent of the substrate, and the inspection tool further comprises:
the first distance sensor and the second distance sensor are in wireless communication connection with the control component through the signal sensing component.
In one embodiment, the control assembly is further configured to communicate with an adjustment mechanism for adjusting the height of the adjustable surface, and the control assembly is configured to:
when the levelable surface is higher than the reference plane, controlling an adjusting mechanism to enable the adjustable plane to descend until the adjustable plane is level with the reference plane;
when the adjustable plane is lower than the reference plane, controlling an adjusting mechanism to enable the adjustable plane to ascend until the adjustable plane is flush with the reference plane.
In one embodiment, the reference plane is an upper surface of an electrostatic chuck, a focus ring is surrounded by an edge of the electrostatic chuck, and the adjustable plane is an upper surface of the focus ring.
In one embodiment, N different regions of the adjustable plane are respectively controlled by N adjusting mechanisms, N second distance sensors are integrated in the substrate, each second distance sensor is used for detecting a second distance between one region of the adjustable plane and the corresponding second distance sensor, and N is greater than or equal to 2;
the control assembly is respectively in communication connection with the N adjusting mechanisms and is used for judging the relative position of the corresponding area of the adjustable plane and the reference plane according to the second distance measured by each second distance sensor and adjusting the height of the corresponding area through the adjusting mechanism of the corresponding area.
In one embodiment, the method further comprises the following steps:
the charging base is independent from the substrate, a first charging circuit is integrated in the charging base, and the first charging circuit comprises a power supply interface, an overload protection device and a primary coil which are connected in series at two ends of the power supply interface, and a first capacitor connected in parallel with the primary coil;
a battery and a second charging circuit integrated within the substrate, the battery electrically connected to the first and second distance sensors to provide operating power to the first and second distance sensors; the second charging circuit comprises a secondary coil and a charging diode which are connected in series with the two ends of the battery, and a second capacitor which is connected with the secondary coil in parallel, when the substrate is arranged on the charging base, the secondary coil and the primary coil generate electromagnetic induction to obtain current, and the charging base is used for wirelessly charging the battery.
In one embodiment, the substrate is a dummy wafer, and the inspection tool further comprises:
the charging base is arranged in the wafer transfer box, and the wafer transfer box is used for loading the substrate.
In one embodiment, the reference plane and the adjustable plane are located in a process chamber, the process chamber has a transfer window, the substrate is a dummy wafer, and the inspection tool further comprises:
a robot to transfer the substrate into the process chamber through the transfer window and to remove the substrate from the process chamber through the transfer window.
A plane relative position detection method is used for detecting the relative height of an adjustable plane and a reference plane which are parallel to each other, and comprises the following steps:
setting a first reference point and a second reference point on the same side of the datum plane and the adjustable plane;
detecting a first distance between the first reference point and the reference plane and a second distance between the second reference point and the adjustable plane along a first direction, the first direction being a direction perpendicular to the reference plane; and
and acquiring the first distance and the second distance, and judging the relative position of the adjustable plane and the datum plane according to the first distance and the second distance and the reference relative position of the first reference point and the second reference point in the first direction.
The plane relative position detection method comprises the steps of setting a first reference point and a second reference point, wherein the reference relative distance between the first reference point and the second reference point in the first direction is known, detecting the first distance, namely actually detecting the vertical distance between the first reference point and a reference plane, and when an adjustable plane is in the plane with the reference plane, detecting the second distance, namely actually detecting the vertical distance between the second reference point and the adjustable plane. According to the acquired first distance, the acquired second distance and the acquired reference relative distance, the relative position relation of the adjustable plane and the reference plane in the first direction can be acquired.
In one embodiment, the adjustable plane is adjusted in height by an adjusting mechanism, and after the determining the relative positions of the adjustable plane and the reference plane, the method further includes:
when the levelable surface is higher than the reference plane, controlling an adjusting mechanism to enable the adjustable plane to descend until the adjustable plane is level with the reference plane;
when the adjustable plane is lower than the reference plane, controlling an adjusting mechanism to enable the adjustable plane to ascend until the adjustable plane is flush with the reference plane.
In one embodiment, the setting a first reference point and a second reference point on the same side of the reference plane and the adjustable plane includes: a substrate is arranged on the same side of the reference plane and the adjustable plane, a first distance sensor and a second distance sensor are integrated on the substrate, the position of the first distance sensor is used as a first reference point, and the position of the second distance sensor is used as a second reference point;
the detecting a first distance between the first reference point and the reference plane and a second distance between the second reference point and the adjustable plane along the first direction comprises: detecting, by the first distance sensor, a first distance between the first reference point and the reference plane in the first direction, and detecting, by the second distance sensor, a second distance between the second reference point and the adjustable plane in the first direction.
In one embodiment, the reference plane and the adjustable plane are both located in a process chamber, the process chamber has a transfer window, and the substrate is a dummy wafer;
set up a base in the homonymy of datum plane and adjustable plane, include: transferring the substrate into the process chamber through the transfer window by using a manipulator and placing the substrate on the same side of the reference plane and the adjustable plane;
after the detection is completed, the detection method further comprises the following steps: the substrate is removed from the process chamber through the transfer window using a robot.
Drawings
FIG. 1 is a diagram illustrating a detection state of a tool for detecting a relative position of a plane according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of the operation of a first distance sensor in an embodiment of the present application;
FIG. 3 is a schematic view of a planar relative position detection tool according to an embodiment of the present disclosure;
FIG. 4 is a diagram illustrating the connection of the internal components of the tool for detecting the relative position of the flat surfaces according to an embodiment of the present invention;
FIG. 5 is a graph illustrating a position distribution of a first distance sensor and a second distance sensor in accordance with an embodiment of the present application;
FIG. 6a is a diagram illustrating a relative position between an adjustable plane and a reference plane according to an embodiment of the present application;
FIG. 6b is a diagram illustrating the relative position of the adjustable plane and the reference plane according to another embodiment of the present application;
FIG. 7 is a circuit diagram of a planar relative position detection tool charging circuit according to an embodiment of the present application;
FIG. 8 is a flowchart illustrating a detecting step of the tool for detecting relative positions of planes according to an embodiment of the present disclosure.
Description of the symbols
100 an electrostatic chuck; 110 a reference plane; 200 a focus ring; 300 a substrate; 310 a flat plate structure; 311 a first distance sensor; 312 a second distance sensor; 313 a second charging circuit; 314 battery; 315 a signal sensing element; 320 a support seat; 400 a control component; 500 an adjustment mechanism; 600 first charging circuit.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, the reference plane 110 and the adjustable plane 210 are two planes to be aligned, and a direction perpendicular to the reference plane 110 is defined as a first direction, i.e., a Y direction shown in the figure, and a direction perpendicular to the Y direction is defined as an X direction. The plane relative position detection means includes a substrate (not shown in the figures) and a first distance sensor 311 and a second distance sensor 312 integrated in the substrate, the first distance sensor 311 is used for detecting a first distance d1 between the first distance sensor 311 and the reference plane 110 along the Y direction, and the first distance d1 represents a path from the first distance sensor 311 to the reference plane 110 along the Y direction; the second distance sensor 312 is used for detecting a second distance d2 between the second distance sensor 312 and the adjustable plane 210 along the Y direction, and the second distance d2 represents a distance from the second distance sensor 312 to the adjustable plane 210 along the Y direction.
In this application, with the position of the first distance sensor as the first reference point and the position of the second distance sensor as the second reference point, the reference relative distance between the first reference point and the second reference point in the Y direction is known during the measurement, and the reference relative distance between the first reference point and the second reference point in the Y direction refers to the difference between the Y coordinate of the first reference point and the Y coordinate of the second reference point in the same coordinate system with the Y direction as the Y axis, and the reference relative distance is defined as d 3. Since the Y direction is perpendicular to the reference plane, the first distance d1 measured by the first distance sensor is actually the perpendicular distance between the first reference point and the reference plane, and the second distance d2 measured by the second distance sensor is actually the perpendicular distance between the second reference point and the adjustable plane when the adjustable plane is parallel to the reference plane. After the first distance d1 and the second distance d2 are obtained, the relative height relationship between the parallel adjustable planes and the reference plane can be determined according to the first distance d1, the second distance d2 and the reference relative distance d3, which specifically includes:
when d1 < d2+ d3, the adjustable plane is lower than the reference plane;
when d1 > d2+ d3, the levelable surface is higher than the reference plane;
when d1 is d2+ d3, the adjustable plane is illustrated as being flush with the reference plane.
In an embodiment, during the detection, the first distance sensor 311 and the second distance sensor 312 are located on the same horizontal plane parallel to the reference plane 110, that is, the reference relative distance d3 of the first distance sensor 311 and the second distance sensor 312 in the Y direction is 0, and at this time, the relative height relationship between the parallel reference plane and the adjustable plane can be determined directly according to the first distance d1 and the second distance d2, specifically:
when d1 < d2, the adjustable plane is lower than the reference plane;
when d1 is greater than d2, the levelable surface is higher than the reference plane;
when d1 is d2, the adjustable plane is said to be flush with the reference plane.
In one embodiment, as shown in fig. 2, the first distance sensor 311 includes a first light emitting diode Q1 and a first phototransistor Q2, wherein the first light emitting diode Q1 is configured to emit a light signal toward the reference plane 110, the light signal is reflected by the reference plane 110 and reaches the first phototransistor Q2, and the first distance sensor 311 obtains the first distance according to a propagation time of the light signal from the first light emitting diode Q1 to the first phototransistor Q2. Similarly, the second distance sensor includes a second light emitting diode and a second phototransistor, the second light emitting diode is configured to emit a light signal toward the adjustable plane, the light signal is reflected by the adjustable plane and reaches the second phototransistor, and the second distance sensor obtains the second distance according to a propagation time of the light signal from the second light emitting diode to the second phototransistor.
In an embodiment, the shape of the substrate is further defined for convenience of operation, and in conjunction with fig. 1 and 3, the substrate 300 includes a bottom support base 320 and a flat plate structure 310 formed on the support base, the flat plate structure 310 has a larger coverage area than the support base 320 in a direction perpendicular to the plane of the flat plate structure 310, and the first distance sensor 311 and the second distance sensor 312 are integrated in a region of the flat plate structure 310 not covered by the support base 320. In the embodiment, the supporting base 320 is provided, and during measurement, the substrate is supported on the reference plane 110 by the supporting base 320, so that the detection can be performed. In one embodiment, the supporting base 320 is disposed in a central region of the flat plate structure 310 in order to make the supporting base 320 support the flat plate structure 310 smoothly. In one embodiment, when the supporting seat 320 is placed on a horizontal plane, the first distance sensor 311 and the second distance sensor 312 are located on the same horizontal plane, so that, when the supporting seat 320 is placed on the reference plane 110 for detection, the reference relative distance d3 of the first distance sensor 311 and the second distance sensor 312 in the Y direction is 0. It will be appreciated that when the support base 320 is supported on the datum plane 110, the first distance sensor 311 is located within the footprint of the datum plane 110 in the Y-direction and the second distance sensor 312 is located within the footprint of the adjustable plane 210 in the Y-direction.
When the detection tool detects the first distance and the second distance, the relative height between the adjustable plane and the reference plane can be manually analyzed, and automatic analysis can also be carried out. In an embodiment, as shown in fig. 4, the detection tool further includes a control component 400, and the control component 400 is respectively connected in communication with the first distance sensor 311 and the second distance sensor 312, and is configured to obtain the first distance d1 and the second distance d2, and determine the relative height between the adjustable plane 210 and the base plane 110 according to the first distance d1, the second distance d2, and the reference relative distance d3, and the specific determination logic is described above and is not described herein again. The analysis process is automatically completed by the control component 400 and the analysis result is directly displayed, so that the operation is more intelligent. Further, the control device 400 is disposed outside the substrate 300 and is independent from the substrate 300, and may be a computer terminal, the detection tool further includes a signal sensing device 315, the signal sensing device 310 may be integrated in the substrate 300, and the first distance sensor 311 and the second distance sensor 312 are connected to the signal sensing device 315, and are wirelessly connected to the control device 400 through the signal sensing device 315.
In an embodiment, the height of the adjustable plane 210 can be adjusted by an adjusting mechanism, which may be a stepping motor, as shown in fig. 4, when the detection tool has a control component 400, the control component 400 is further communicatively connected to the adjusting mechanism 500 for controlling the adjusting mechanism according to the determination result, so as to adjust the ascending and descending of the adjustable plane 210, and the relative height of the adjustable plane 210 and the reference plane 110 is within the target range. In this embodiment, the detection tool is connected with the adjusting mechanism, and can automatically control the adjusting mechanism when the position of the adjustable plane deviates, so as to correct the position of the adjustable plane. In one embodiment, when it is desired that the adjustable plane 210 be aligned with the reference plane 110, the control of the adjustment mechanism by the control assembly 400 is embodied as:
when the adjustable plane 210 is higher than the reference plane 110, controlling the adjusting mechanism to enable the adjustable plane 210 to descend until the adjustable plane is level with the reference plane;
when the adjustable plane 210 is lower than the reference plane 110, the adjusting mechanism is controlled to raise the adjustable plane 210 until the adjustable plane 210 is flush with the reference plane 110.
In one embodiment, the reference plane 110 is an upper surface of the electrostatic chuck 100, the focusing ring 200 is disposed around an edge of the electrostatic chuck 100, and the adjustable plane 210 is an upper surface of the focusing ring 200. When the focus ring 200 is disposed on the edge of the electrostatic chuck 100, ideally, the upper surface of the focus ring 200 is parallel to the upper surface plane of the electrostatic chuck 100, i.e., the leveling surface 210 is parallel to the reference plane 110. However, in practice, the following two abnormal situations occur:
the first abnormal situation is an assembly abnormality, i.e. when the focusing ring is assembled, the upper surface of the focusing ring is not aligned with the upper surface of the electrostatic chuck, and the upper surface of the focusing ring is parallel to but not flush with the upper surface of the electrostatic chuck, and the upper surface of the focusing ring is entirely higher or lower than the upper surface of the electrostatic chuck, or when the focusing ring is sleeved on the edge of the electrostatic chuck, as shown in fig. 6a, the focusing ring may be inclined, that is, the leveling surface 210 is not parallel to the reference plane 110, so that the relative position relationship between different areas on the adjustable plane 210 and the reference plane 110 is not the same, as shown in fig. 6a, an area a is higher than the reference plane 110, and an area B is lower than the reference plane 110. The second anomaly is a use anomaly, i.e., the upper surface of the focus ring is flush with the upper surface of the electrostatic chuck during assembly, but during long-term use, the upper surface of the focus ring is consumed after long-term plasma bombardment, as shown in fig. 6b, and the upper surface of the focus ring is lower than the upper surface of the electrostatic chuck, i.e., the leveling surface 210 is lower than the reference plane 110. Whether the first anomaly or the second anomaly is detected, the relative heights of the adjustable plane 210 and the reference plane 110 can be detected through the detection, and then the adjusting mechanism is controlled according to the detection result, so that the height of the adjustable plane 210 is increased. Specifically, the height of the adjustable plane can be adjusted through one adjusting mechanism, and the height of the adjustable plane can also be adjusted through a plurality of adjusting mechanisms. In a specific embodiment, when the height of the adjustable plane is adjusted by a plurality of adjusting mechanisms, the adjustable plane can be divided into N different regions, N is greater than or equal to 2, each region is controlled by an independent adjusting mechanism, and correspondingly, in the detection tool, as shown in fig. 5, N second distance sensors 312 are integrated in the substrate 300, each second distance sensor 312 detects one region of the adjustable plane 210, and the N regions correspond to the N second sensors one by one; the control assembly 400 is respectively connected to the first distance sensors 311, the second distance sensors 312 and the adjusting mechanisms 500 in a communication manner, and is configured to determine a relative position relationship between the corresponding region of each adjustable plane 210 and the reference plane 110 according to the second distance measured by each second distance sensor 312, and adjust the height of the corresponding region through the adjusting mechanism 500 of the corresponding region. In this embodiment, the height of the adjustable plane 210 is adjusted by a plurality of adjusting mechanisms together, so that the lifting of the adjustable plane is more stable. Meanwhile, for the situation that the adjustable plane is inclined, if only the second distance of one region of the adjustable plane 210 is detected, the corrected adjustable plane 210 and the reference plane 110 still have deviation, and by arranging a plurality of adjusting mechanisms and a plurality of second distance sensors, the relative position relation between a plurality of regions of the adjustable plane and the reference plane can be detected, the lifting of each region can be independently controlled, the correction precision can be improved, and the accurate alignment of the upper surface of the focusing ring and the upper surface of the electrostatic chuck can be realized. Furthermore, N adjusting mechanisms are uniformly distributed on the concentric circular ring tracks of the substrate, so that the adjustable plane is uniformly divided into N areas, and the correction precision is further improved, wherein N can be 2, 3 or 4.
In an embodiment, when N second distance sensors are integrated in the substrate, the number of the first distance sensors may be 1, or may also be N, when only one first distance sensor is integrated in the substrate, the second distances measured by the N second distance sensors are all compared with the first distance measured by the same first distance sensor, when N first distance sensors are integrated in the substrate, one first distance sensor is disposed near each second distance sensor, and when performing analysis, the second distance measured by the second distance sensor is compared with the first distance measured by the adjacent first distance sensor. The electrostatic chuck may have different thickness in different regions after long-term plasma bombardment, i.e., some regions of the reference plane 110 may not be flat. In this embodiment, a plurality of sets of first distance sensors are provided, so that the flatness of the upper surface of the electrostatic chuck can be reflected, and the correction accuracy can be improved. Further, when the first distance sensors are uniformly distributed on the first concentric circular ring track, the track diameter is Φ 1, and the second distance sensors are also uniformly distributed on the second concentric circular ring track, the track diameter is Φ 2, Φ 2 is greater than Φ 1, the centers of the first concentric circular ring track and the second concentric circular ring track are the same, and the adjacent first distance sensor 311 and the second distance sensor 312 are located on the same diameter.
In one embodiment, as shown in fig. 7, the inspection tool further includes a charging base, independent from the substrate 300, and the charging base has a first charging circuit 600 integrated therein, the first charging circuit 600 includes a power interface, an overload protection device R1 and a primary coil L1 connected in series across the power interface, and a first capacitor C1 connected in parallel with the primary coil. Meanwhile, a second charging circuit 313 and a battery 314 which are connected are further integrated in the substrate 300, specifically, the second charging circuit 313 includes a secondary coil L2 and a charging diode D1 which are connected in series with both ends of the battery 314, and a second capacitor C2 which is connected in parallel with the secondary coil L2, wherein when the substrate 300 is placed on a charging base, the secondary coil L2 in the substrate 300 and the primary coil L1 in the charging base generate electromagnetic induction to enable the secondary coil L2 to generate current, wireless charging of the battery 314 by the charging base is realized, and the amount of electricity is stored in the battery 314. As shown in fig. 4, a battery 314 is connected to the first distance sensor 311 and the second distance sensor 312 to provide operating power for the first distance sensor 311 and the second distance sensor 312. Further, when the signal sensing component 315 is integrated into the base, the battery 314 is also connected to the signal sensing component 315 to provide operating power thereto.
In one embodiment, the substrate 300 is a dummy wafer, which refers to a substrate of a wafer of a type of topography, i.e., the thickness and size of the substrate is similar to a real wafer, and the inspection tool further includes a pod, wherein the substrate 300 is configured as a dummy wafer, such that the substrate 300 can be placed in the pod, i.e., the substrate 300 is placed in the pod when the substrate 300 is not being inspected. Further, the charging base is disposed in the wafer transfer box, and when the substrate 300 is disposed in the wafer transfer box, the battery inside the substrate can be charged wirelessly through the charging base.
In one embodiment, the base plane 110 and the adjustable plane 210 are both located within a process chamber, such as the base plane 110 is an upper surface of an electrostatic chuck, the adjustable plane 210 is an upper surface of a focus ring, the substrate 300 is a wafer, and the inspection tool further comprises a robot configured to transfer the substrate 300 into the process chamber when inspection is required and remove the substrate 300 from the process chamber when inspection is complete. The etching or ion implantation process of the semiconductor process is carried out in a closed process chamber, the process chamber is provided with a transfer window special for transferring the silicon wafer, and the transfer of the target silicon wafer at the window is realized through a manipulator. In this embodiment, the substrate of the inspection tool is a virtual wafer, and the shape of the virtual wafer is similar to the shape of the real wafer transmitted through the window, so the robot can also grab the substrate 300, when the inspection is needed, the substrate 300 is sent into the process chamber through the transmission window of the process chamber, and when the inspection is completed, the substrate 300 is moved out of the process chamber through the transmission window of the process chamber. In the known device assembly plane detection process, a device reaction cavity needs to be disassembled firstly, then a detection tool is put on the focusing ring and the electrostatic chuck, and the alignment condition of a horizontal plane is judged according to the dial reading of the detection tool, so that the position of the focusing ring is adjusted. The machine table needs to be disassembled in the process of plane detection of the equipment assembly, and the process is complex, time-consuming and labor-consuming. In the embodiment, the virtual wafer is used as the substrate, the robot is used for grabbing the substrate, the substrate can be transmitted through the window for transmitting the silicon wafer in the process chamber, the top cover of the chamber does not need to be opened, and a large amount of cost is saved. Further, when the substrate is not used for detection, the substrate is placed in the wafer transfer box, a charging base is arranged in the wafer transfer box, when the substrate needs to be detected, the mechanical arm picks the substrate from the wafer transfer box, when the detection is completed, the mechanical arm returns the substrate to the wafer transfer box, and the substrate battery is charged through the wafer transfer box.
The present application also relates to a plane relative position detection method for detecting the relative height of an adjustable plane and a reference plane parallel to each other, as shown in fig. 1, and it is required to align the adjustable plane 210 with the reference plane 110, as shown in fig. 8, the detection method includes:
step S810: and setting a first reference point and a second reference point on the same side of the datum plane and the adjustable plane.
As shown in fig. 1, the first reference point and the second reference point are disposed on the same side of the base plane 110 and the adjustable plane 210, for example, both the first reference point and the second reference point are disposed above the base plane 110 and the adjustable plane 210.
Step S820: detecting a first distance between the first reference point and the reference plane and a second distance between the second reference point and the adjustable plane along a first direction, the first direction being a direction perpendicular to the reference plane.
Wherein, the first direction is defined as a Y direction in the figure, and a first distance between the first reference point and the datum plane 110 refers to a distance from the first reference point to the datum plane 110 along the Y direction, and is actually a vertical distance between the first reference point and the datum plane 110; a second distance between the second reference point and the adjustable plane 210 along the Y direction refers to a distance from the second reference point to the adjustable plane 210 along the Y direction, and when the adjustable plane 210 is parallel to the reference plane, the second distance is actually a perpendicular distance between the second reference point and the adjustable plane 210. In the detection, the reference relative position of the first reference point and the second reference point in the Y direction is known, the reference relative position refers to a difference between the Y coordinate of the first reference point and the Y coordinate of the second reference point in the same coordinate system, and the reference relative distance is defined as d 3.
In one embodiment, as shown in fig. 1, the setting the first reference point and the second reference point on the same side of the reference plane and the adjustable plane includes: a substrate is arranged on the same side of the reference plane 110 and the adjustable plane 210, and a first distance sensor 311 and a second distance sensor 312 are integrated on the substrate, wherein the position of the first distance sensor 311 is used as a first reference point, and the position of the second distance sensor 312 is used as a second reference point. At this time, the detecting the first distance specifically includes: detecting a first distance d1 between the first distance sensor 311 and the reference plane 110 in the first direction by the first distance sensor 311; the second distance detection specifically comprises: a second distance d2 between the second distance sensor 312 and the adjustable plane 210 in the first direction is detected by the second distance sensor 312.
Step S830: and acquiring the first distance and the second distance, and judging the relative position of the adjustable plane and the datum plane according to the first distance and the second distance and the reference relative position of the first reference point and the second reference point in the first direction.
After the first distance d1 and the second distance d2 are obtained, the relative height between the parallel adjustable planes 210 and the base plane 110 can be determined according to the first distance d1, the second distance d2 and the reference relative distance d3, specifically:
when d1 < d2+ d3, the adjustable plane is lower than the reference plane;
when d1 > d2+ d3, the levelable surface is higher than the reference plane;
when d1 is d2+ d3, the adjustable plane is illustrated as being flush with the reference plane.
In an embodiment, during the detection, the first reference point and the second reference point are located on the same horizontal plane parallel to the reference plane 110, that is, the reference relative distance d3 of the first reference point and the second reference point in the Y direction is 0, and at this time, the relative height relationship between the parallel reference plane and the adjustable plane can be determined directly according to the first distance d1 and the second distance d2, specifically:
when d1 < d2, the adjustable plane is lower than the reference plane;
when d1 is greater than d2, the levelable surface is higher than the reference plane;
when d1 is d2, the adjustable plane is said to be flush with the reference plane.
In one embodiment, the reference plane 110 and the tunable plane 210 are located in the process chamber, for example, the reference plane 110 may be an upper surface of the electrostatic chuck 100, the tunable plane 210 may be an upper surface of the focus ring 200, and the focus ring 200 is particularly enclosed at an edge of the electrostatic chuck. In order to facilitate the substrate to be fed into the process chamber without opening the top cover of the chamber, a dummy wafer is selected as the substrate, and at this time, a substrate is disposed on the same side of the reference plane 110 and the adjustable plane 210, including: the substrate is transferred into the process chamber through the transfer window of the process chamber using a robot and placed on the same side of the reference plane 110 and the adjustable plane 210. Meanwhile, after the detection is finished, the substrate can be moved out of the process chamber by the manipulator through the transfer window of the process chamber in the same way.
In an embodiment, the adjustable plane 210 is adjusted in height by an adjusting mechanism, and after step S830, the method further includes:
step S840: and controlling the adjusting mechanism according to the judgment result to enable the relative height of the adjustable plane and the reference plane to be within a target range.
In one embodiment, when the adjustable plane 210 is required to be aligned with the reference plane 110, the control of the adjusting mechanism is specifically:
when the adjustable plane 210 is higher than the reference plane 110, controlling the adjusting mechanism to enable the adjustable plane 210 to descend until the adjustable plane is level with the reference plane;
when the adjustable plane 210 is lower than the reference plane 110, the adjusting mechanism is controlled to raise the adjustable plane 210 until the adjustable plane 210 is flush with the reference plane 110.
In this embodiment, when the position of the adjustable plane deviates, the adjusting mechanism can be automatically controlled, and then the position of the adjustable plane is corrected.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (15)
1. A plane relative position detection tool for detecting the relative height of an adjustable plane and a reference plane which are parallel to each other, the detection tool comprising:
a substrate;
a first distance sensor integrated within the substrate for detecting a first distance between the first distance sensor and the reference plane along a first direction, the first direction being a direction perpendicular to the reference plane; and
a second distance sensor integrated within the substrate for detecting a second distance between the second distance sensor and the adjustable plane along the first direction.
2. The inspection tool of claim 1,
the first distance sensor comprises a first light-emitting diode and a first phototriode, the first light-emitting diode is used for emitting optical signals towards the reference plane, the optical signals reach the first phototriode after being reflected by the reference plane, and the first distance sensor obtains the first distance according to the propagation time of the optical signals from the first light-emitting diode to the first phototriode;
the second distance sensor comprises a second light emitting diode and a second phototriode, the second light emitting diode is used for emitting optical signals towards the adjustable plane, the optical signals reach the second phototriode after being reflected by the adjustable plane, and the second distance sensor obtains the second distance according to the propagation time of the optical signals from the second light emitting diode to the second phototriode.
3. The inspection tool of claim 1, wherein the substrate includes a bottom support base and a plate structure formed on the support base, the plate structure having a coverage area larger than a coverage area of the support base, the first and second distance sensors being integrated in a region of the plate structure not covered by the support base, the first and second distance sensors being located in a horizontal plane when the support base is placed on the horizontal plane.
4. The inspection tool of claim 1, further comprising:
and the control assembly is respectively in communication connection with the first distance sensor and the second distance sensor and is used for acquiring the first distance and the second distance and judging the relative position of the adjustable plane and the datum plane according to the first distance, the second distance and the reference relative distance of the first distance sensor and the second distance sensor in the first direction.
5. The inspection tool of claim 4, wherein the control assembly is independent of the substrate, the inspection tool further comprising:
the first distance sensor and the second distance sensor are in wireless communication connection with the control component through the signal sensing component.
6. The inspection tool of claim 4, wherein the control assembly is further configured to communicate with an adjustment mechanism that adjusts the height of the adjustable surface, the control assembly configured to:
when the levelable surface is higher than the reference plane, controlling an adjusting mechanism to enable the adjustable plane to descend until the adjustable plane is level with the reference plane;
when the adjustable plane is lower than the reference plane, controlling an adjusting mechanism to enable the adjustable plane to ascend until the adjustable plane is flush with the reference plane.
7. The inspection tool of claim 6, wherein the reference plane is an upper surface of an electrostatic chuck, the electrostatic chuck has a focus ring peripherally disposed thereon, and the adjustable plane is an upper surface of the focus ring.
8. The inspection tool of claim 7,
n different areas of the adjustable plane are respectively controlled by N adjusting mechanisms, N second distance sensors are integrated in the substrate, each second distance sensor is used for detecting a second distance between one area of the adjustable plane and the corresponding second distance sensor, and N is more than or equal to 2;
the control assembly is respectively in communication connection with the N adjusting mechanisms and is used for judging the relative position of the corresponding area of the adjustable plane and the reference plane according to the second distance measured by each second distance sensor and adjusting the height of the corresponding area through the adjusting mechanism of the corresponding area.
9. The inspection tool of claim 1, further comprising:
the charging base is independent from the substrate, a first charging circuit is integrated in the charging base, and the first charging circuit comprises a power supply interface, an overload protection device and a primary coil which are connected in series at two ends of the power supply interface, and a first capacitor connected in parallel with the primary coil;
a battery and a second charging circuit integrated within the substrate, the battery electrically connected to the first and second distance sensors to provide operating power to the first and second distance sensors; the second charging circuit comprises a secondary coil and a charging diode which are connected in series with the two ends of the battery, and a second capacitor which is connected with the secondary coil in parallel, when the substrate is arranged on the charging base, the secondary coil and the primary coil generate electromagnetic induction to obtain current, and the charging base is used for wirelessly charging the battery.
10. The inspection tool of claim 9, wherein the substrate is a dummy wafer, the inspection tool further comprising:
the charging base is arranged in the wafer transfer box, and the wafer transfer box is used for loading the substrate.
11. The inspection tool of claim 1, wherein the reference plane and the adjustable plane are located within a process chamber, the process chamber having a transfer window, the substrate being a virtual wafer, the inspection tool further comprising:
a robot to transfer the substrate into the process chamber through the transfer window and to remove the substrate from the process chamber through the transfer window.
12. A plane relative position detection method is used for detecting the relative height between an adjustable plane and a reference plane which are parallel to each other, and is characterized by comprising the following steps:
setting a first reference point and a second reference point on the same side of the datum plane and the adjustable plane;
detecting a first distance between the first reference point and the reference plane and a second distance between the second reference point and the adjustable plane along a first direction, the first direction being a direction perpendicular to the reference plane; and
and acquiring the first distance and the second distance, and judging the relative position of the adjustable plane and the datum plane according to the first distance and the second distance and the reference relative position of the first reference point and the second reference point in the first direction.
13. The inspection method of claim 12, wherein the adjustable plane is height-adjusted by an adjustment mechanism, and after said determining the relative positions of the adjustable plane and the reference plane, the method further comprises:
when the levelable surface is higher than the reference plane, controlling an adjusting mechanism to enable the adjustable plane to descend until the adjustable plane is level with the reference plane;
when the adjustable plane is lower than the reference plane, controlling an adjusting mechanism to enable the adjustable plane to ascend until the adjustable plane is flush with the reference plane.
14. The detection method according to claim 12,
setting a first reference point and a second reference point on the same side of the datum plane and the adjustable plane, including: a substrate is arranged on the same side of the reference plane and the adjustable plane, a first distance sensor and a second distance sensor are integrated on the substrate, the position of the first distance sensor is used as a first reference point, and the position of the second distance sensor is used as a second reference point;
the detecting a first distance between the first reference point and the reference plane and a second distance between the second reference point and the adjustable plane along the first direction comprises: detecting, by the first distance sensor, a first distance between the first reference point and the reference plane in the first direction, and detecting, by the second distance sensor, a second distance between the second reference point and the adjustable plane in the first direction.
15. The inspection method of claim 14, wherein the reference plane and the adjustable plane are both located within a process chamber, the process chamber having a transfer window, the substrate being a virtual wafer;
set up a base in the homonymy of datum plane and adjustable plane, include: transferring the substrate into the process chamber through the transfer window by using a manipulator and placing the substrate on the same side of the reference plane and the adjustable plane;
after the detection is completed, the detection method further comprises the following steps: the substrate is removed from the process chamber through the transfer window using a robot.
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| CN201910818880.6A CN112444210A (en) | 2019-08-30 | 2019-08-30 | Plane relative position detection tool and detection method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114322772A (en) * | 2021-12-31 | 2022-04-12 | 拓荆科技股份有限公司 | Base adjusting device and method |
| WO2023279514A1 (en) * | 2021-07-07 | 2023-01-12 | 长鑫存储技术有限公司 | Measurement device, measurement compensation system, measurement method, and measurement compensation method |
| WO2023216821A1 (en) * | 2022-05-13 | 2023-11-16 | 上海集迦电子科技有限公司 | Wireless apparatus and measurement method for measuring gap between focus ring and wafer edge |
-
2019
- 2019-08-30 CN CN201910818880.6A patent/CN112444210A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023279514A1 (en) * | 2021-07-07 | 2023-01-12 | 长鑫存储技术有限公司 | Measurement device, measurement compensation system, measurement method, and measurement compensation method |
| CN114322772A (en) * | 2021-12-31 | 2022-04-12 | 拓荆科技股份有限公司 | Base adjusting device and method |
| WO2023216821A1 (en) * | 2022-05-13 | 2023-11-16 | 上海集迦电子科技有限公司 | Wireless apparatus and measurement method for measuring gap between focus ring and wafer edge |
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