CN115656226A - Device and method for detecting defects of insulating layer of conductive copper bar - Google Patents
Device and method for detecting defects of insulating layer of conductive copper bar Download PDFInfo
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- CN115656226A CN115656226A CN202211181193.6A CN202211181193A CN115656226A CN 115656226 A CN115656226 A CN 115656226A CN 202211181193 A CN202211181193 A CN 202211181193A CN 115656226 A CN115656226 A CN 115656226A
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Abstract
The invention discloses a device and a method for detecting defects of an insulating layer of a conductive copper bar, wherein the device comprises: an object stage, an X-ray radiation device and an image receiving device; the object stage is used for bearing the insulating copper bar; the X-ray radiation device is used for irradiating the insulated copper bar borne on the objective table and forming an image; the image receiving device is used for receiving images. In this scheme, adopt X ray detection mode to detect defects such as the inside bubble hole of copper bar insulating layer, the density difference that just also produces through the inside bubble of copper bar insulating layer detects remaining bubble to help solving the small defect of copper bar and can't detect or artifical detection precision poor, measuring error is big, often appear misjudgement, seriously influence production qualification rate scheduling problem.
Description
Technical Field
The invention relates to the technical field of electric automobile and battery pack production, in particular to a device and a method for detecting defects of an insulating layer of a conductive copper bar.
Background
The copper bar connection is a high-conductivity, quick in heat dissipation and easy to bend, is widely applied to new energy automobiles, energy storage batteries and high-speed rail projects of motor cars, and is used as a conductive connection accessory among the batteries. In these applications, high voltages and large currents are required to be carried, and therefore the selection of the insulating layer is of great importance, if the quality of the insulating layer is not too critical, it is likely that the current will break down the insulating layer, putting the device at risk. In the design of products, strict external insulation requirements are required for copper bar connection.
Because the structures of the products are different, the shapes and the sizes of the copper bars are different, and the selection and the processing mode of the insulating layers are different. The processing method of the insulation layer of the general copper bar connection comprises the following steps:
1. the common method is that the copper bar connection adopts a shrinkage insulation sleeve, the PVC sleeve is directly wrapped on the connection surface of the copper bar, and then the copper bar is subjected to shrinkage molding by a high-temperature furnace; the defect is that the copper bar is not applicable to most of special-shaped copper bars and cannot resist high temperature.
2. The plastic dipping processing is suitable for the special-shaped copper bar, the plastic dipping processing can be generally adopted under the condition that the insulating sleeve cannot be wrapped, the insulating layer is made of the high-temperature insulating layer material, if the PVC material is in a liquid state, the copper bar is put into the copper bar and taken out after a certain time, the copper bar is wrapped by one set of PVC material, and the copper bar is formed after cooling.
3. And (4) injection molding, namely processing and producing by using injection molding equipment. For the injection molding processing of the copper bar, a set of injection mold with product appearance is developed, and the insulation material is wrapped through one-step molding of injection molding equipment. The injection molding processing materials are wide, and PVC, TPE and TPU can be used as long as the injection molding equipment can be used.
In addition, the development of electric vehicles puts higher demands on the safety performance thereof. Besides the insulating property of the copper bar, the copper bar has the characteristic of high temperature resistance, and a better solution is to use a high temperature resistant material for injection molding. In the processing method of plastic dipping and injection molding, the defects of bubbles, cavities and the like are inevitably generated in the material forming process, if the volumes of the defects exceed a certain proportion, the insulation performance of the copper bar is reduced, and a short circuit is generated in serious cases.
In the manufacturing step of the copper bar insulating layer, air bubbles are possibly generated in the flowing inner part of the insulating material, and the air bubbles generated in the inner part are transferred to the surface of the copper bar through the plastic dipping or injection molding process and remain in the inner part to form the air bubbles with shapes of strips, circles and the like. Therefore, in the manufacture of the copper bar insulation layer, the defect of the air bubble remained in the material must be detected by the inspection step.
Conventionally, the detection of bubbles is generally performed by visually inspecting the surface of the insulating layer by a skilled person. If there is a bubble on the surface, it can be judged that the inside is certainly present. However, the visual inspection requires time and labor, and this hinders the improvement of productivity. Next, in the inspection of the copper bar insulating layer, it is necessary to inspect the fine holes having an outer diameter of about 2 to 4mm using a microscope, and thus, a great deal of time and labor are required. More importantly, the content of the bubbles cannot be determined by surface detection, and the product yield cannot be judged.
Moreover, even a skilled person cannot find the bubbles generated inside the copper bar insulating layer, and it is difficult to avoid the occurrence of detection errors due to the missing of the micro bubbles or erroneous detection of bubbles such as flaws or dirt which are not considered as defects.
Disclosure of Invention
In view of the above, the invention provides a device for detecting defects of an insulating layer of a conductive copper bar, which detects defects such as bubble holes in the insulating layer of the copper bar by using an X-ray detection method, that is, detects residual bubbles by using density differences generated by bubbles in the insulating layer of the copper bar, thereby being beneficial to solving the problems that tiny defects of the copper bar cannot be detected or the precision of manual detection is poor, the measurement error is large, misjudgment often occurs, the production yield is seriously affected, and the like.
In order to achieve the purpose, the invention provides the following technical scheme:
a defect detection device for an insulating layer of a conductive copper bar comprises: an object stage, an X-ray radiation device and an image receiving device;
the object stage is used for bearing the insulated copper bar;
the X-ray radiation device is used for irradiating the insulated copper bar borne on the objective table and forming an image;
the image receiving device is used for receiving the image.
Preferably, the X-ray radiation device comprises a microfocus X-ray source;
the object stage is arranged between the micro-focus X-ray source and the image receiving device.
Preferably, the stage is a rotary stage;
the rotary object stage can bear and drive the insulation copper bar to rotate;
the microfocus X-ray source can irradiate the insulating copper bar borne on the rotary object stage once per rotation and form a plurality of different images;
the image receiving device can receive a plurality of different images;
the device for detecting the defects of the insulating layer of the conductive copper bar further comprises an image processing module; the image processing module is in communication connection with the image receiving device and can reconstruct a plurality of different images received by the image receiving device to obtain a three-dimensional image.
Preferably, the image processing module reconstructs the image data set received by the image receiving device through a tomography reconstruction algorithm to obtain a three-dimensional image.
Preferably, the tomographic reconstruction algorithm includes: filtered backprojection, algebraic reconstruction techniques and variations thereof or iterative statistical methods.
Preferably, the rotary stage comprises: a ball bearing rotating table or a roller bearing rotating table.
Preferably, the microfocus X-ray source, the rotary stage and the image receiving device are sequentially distributed along the same straight line.
Preferably, the lifting device further comprises a lifting column;
the rotary object stage is arranged at the top of the lifting column.
Preferably, the lifting column comprises a vertical telescopic conversion mechanism.
The method for detecting the defects of the insulating layer of the conductive copper bar adopts the device for detecting the defects of the insulating layer of the conductive copper bar, and comprises the following steps:
s1, driving an insulated copper bar to rotate by adopting a rotary object stage, irradiating the insulated copper bar once per rotation by adopting a microfocus X-ray source to form a plurality of different images, and receiving the plurality of different images by adopting an image receiving device;
s2, reconstructing a plurality of different images by adopting an image processing module to obtain three-dimensional images of the insulated copper bar;
s3, identifying the porous structure of the insulating layer in the insulated copper bar by measuring the absorption characteristic or the phase contrast of the three-dimensional image of the insulated copper bar, and determining the spatial distribution of the porous structure of the insulating layer of the insulated copper bar;
and S4, determining the porosity of the insulating layer of the insulating copper bar according to the spatial distribution of the porous structure of the insulating layer of the insulating copper bar.
According to the technical scheme, the defect detection device for the insulating layer of the conductive copper bar provided by the invention detects the defects such as air bubble holes in the insulating layer of the copper bar in an X-ray detection mode, namely detects residual air bubbles through density difference generated by the air bubbles in the insulating layer of the copper bar, so that the problems that the tiny defects of the copper bar cannot be detected or the precision of manual detection is poor, the measurement error is large, misjudgment frequently occurs, the production yield is seriously influenced and the like are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic view of a pore imaging apparatus for cladding a copper bar with an insulating layer according to an embodiment of the present invention;
fig. 2 is a flowchart of a process for analyzing the porosity of a copper bar sample according to an embodiment of the present invention.
Wherein 101 is a microfocus X-ray source, 102 is an insulated copper bar, 103 is an image receiving device, 104 is an object stage, 105 is a lifting column, 106 is a pore and 107 is an image.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The device for detecting the defects of the insulating layer of the conductive copper bar, provided by the embodiment of the invention, as shown in fig. 1, comprises: an object stage 104, an X-ray radiation device, and an image receiving device 103;
the object stage 104 is used for bearing the insulated copper bar 102; the insulated copper bar 102 is a copper bar wrapped with an insulating layer;
the X-ray radiation device is used for irradiating the insulated copper bar 102 carried on the object stage 104 and forming an image 107;
the image receiving device 103 is used for receiving an image 107.
It should be noted that, as shown in fig. 1, the present embodiment adopts a computer tomography method, that is, the insulating copper bar 102 carried on the stage 104 is irradiated by the X-ray of the X-ray irradiation device, and the aperture 106 in the insulating copper bar 102 is determined as a low absorption region in the sample, so that the contrast of the projection presented on the image receiving device 103 can be significantly different, that is, the image 107 of the aperture 106 can be formed. That is to say, this scheme adopts the X ray light source to shine the copper bar of parcel insulating layer, detects remaining bubble through the density difference that inside bubble produced to the realization adopts the X ray light source to the detection of defects such as the inside bubble hole of copper bar insulating layer.
In addition, the X-ray radiation device can also generate a plurality of different images by radiation when the insulated copper bar 102 is switched to different positions, and at this time, the image receiving device 103 can receive a plurality of different images generated by the X-ray radiation device, that is, the image receiving device 103 is equivalent to a "data acquisition" device, and the image receiving device 103 can also be in communication connection with the image processing module. The image processing module reconstructs the multi-position two-dimensional image acquired by the image receiving device 103 by using an algorithm to obtain a three-dimensional image, which is described in detail below. Of course, the detection device of the scheme can also be used for the yield inspection and defect screening of the semiconductor chips. The method comprises the steps of firstly adopting an X-ray source to radiate a semiconductor chip, then acquiring a multi-position two-dimensional image generated by radiation from the X-ray source through an image receiving device, and finally constructing a structural three-dimensional image of the semiconductor chip through an image processing module by utilizing an algorithm on the multi-position two-dimensional image.
According to the technical scheme, the defect detection device for the insulating layer of the conductive copper bar provided by the embodiment of the invention detects defects such as bubble holes in the insulating layer of the copper bar in an X-ray detection mode, namely detects residual bubbles through density difference generated by bubbles in the insulating layer of the copper bar, so that the problems that tiny defects of the copper bar cannot be detected or manual detection precision is poor, measurement errors are large, misjudgment frequently occurs, production yield is seriously influenced and the like are solved.
In the present scheme, as shown in fig. 1, the X-ray radiation device includes a microfocus X-ray source 101; that is to say, the scheme adopts the micro-focus X-ray source 101 so as to better detect the defects such as bubble holes and the like in the copper bar insulating layer; certainly, the micro-focus X-ray source 101 has a smaller light source size, so that the projection image generated by the micro-focus X-ray source 101 on the insulated copper bar 102 can reach a resolution of 1 micron or better;
the stage 104 is disposed between the microfocus X-ray source 101 and the image receiving device 103. The scheme is designed so that the projection image generated by the microfocus X-ray source 101 on the insulated copper bar 102 can be better received by the image receiving device 103.
Specifically, in the aspect of the bubble detection method mentioned in this embodiment, if a detection method perpendicular to the width of the copper bar is adopted, the absorption of the copper bar on the X-ray is far higher than that of the insulating layer, so that the contrast difference on the image caused by the density difference of the bubbles is not obvious. In order to overcome the above problems, in the present embodiment, a Computer Tomography (CT) method may be adopted to rotate the insulated copper bar 102 along the beam-emitting direction of the X-ray of the microfocus X-ray source 101, so as to obtain a plurality of different images at different rotation angles, and then perform three-dimensional reconstruction on the plurality of different images to obtain a three-dimensional image, so as to obtain clearer image information. Accordingly, stage 104 is a rotary stage; wherein the rotary stage is driven to rotate around the vertical rotating shaft;
as shown in fig. 1, the rotary stage can bear and drive the insulated copper bar 102 to rotate;
the microfocus X-ray source 101 can irradiate the insulated copper bar 102 borne on the rotary object stage once per rotation to form a plurality of different images; wherein, the rotary objective table needs to drive the insulated copper bar 102 to rotate for 360 degrees, and the microfocus X-ray source 101 needs to perform repeated projection;
the image receiving device 103 can receive a plurality of different images;
the device for detecting the defects of the insulating layer of the conductive copper bar further comprises an image processing module; the image processing module is in communication connection with the image receiving device 103, and can reconstruct a plurality of different images received by the image receiving device 103 to obtain a three-dimensional image.
It should be noted that, this scheme drives insulating copper bar 102 through rotatory objective table and rotates, so that microfocus X ray source 101 forms a plurality of different projection images to insulating copper bar 102's different positions/direction, receive a plurality of different projection images by image receiving arrangement 103 again, and then further rebuild a plurality of different projection images through image processing module, then can obtain insulating copper bar 102's structure image, reach the purpose that detects each aspect structure of insulating copper bar 102, thereby help obtaining the size of defects such as inside bubble of insulating copper bar 102 and hole, quantitative information such as position distribution, be favorable to improving the accuracy that detects. That is to say, this scheme has three-dimensional imaging technique, can be used to detect copper bar insulating layer inside to can judge the existence of bubble and confirm defects such as bubble or flaw, dirt in inside with this to help improving the detection accuracy.
Further, the image processing module reconstructs a plurality of different images received by the image receiving device 103 through a tomographic reconstruction algorithm to obtain a three-dimensional image. That is to say, this scheme reconstruction 3D image is through the chromatography reconstruction algorithm reconstruction projection data in order to obtain the 3D structure of sample, is convenient for to defect inspection such as crackle, gas pocket, pinhole and inclusion in the insulating copper bar, realizes the measurement to insulating copper bar internal dimension, material density and each parts assembly clearance or sealing member decrement. Wherein the tomographic reconstruction algorithm comprises one of filtered back-projection, algebraic Reconstruction Technique (ART) and its variants, and iterative statistical methods. Such as bayesian techniques, among others. In addition, the filtering back projection algorithm is one of analytical reconstruction algorithms and is characterized by high reconstruction speed. The algebraic reconstruction technology is one kind of iterative algorithm, and has the advantages of being suitable for various scanning modes, adding various constraint conditions in iteration, and being superior to analytic algorithms for data with few scanning angles and large statistical fluctuation. Of course, filtered back projection or algebraic reconstruction techniques can be selected as tomographic reconstruction algorithms depending on the workpiece conditions.
In addition, it should be noted that the copper bar sample to be detected is a copper bar coated with an insulating layer, and the insulating layer can be obtained by using processing methods such as plastic dipping and injection molding. The insulating layer and the copper bar have obvious difference on the absorption of X-rays, so that the insulating layer can be distinguished from other materials in a CT image; the absorption difference of the pores can be used for measuring the space distribution of the pores of the insulating layer by using a CT image, and the porosity of the insulating layer can be calculated by calculating the statistical characteristics of the pores. The method for calculating the porosity of the copper bar sample comprises the steps of obtaining amplified radiographs from X-rays which penetrate through the copper bar sample from different visual angles, reconstructing a 3D image of the copper bar sample by using a computer tomography algorithm, identifying a porous structure in the copper bar sample by measuring absorption characteristics or phase contrast, determining the spatial distribution of the porous structure, and determining the porosity according to the spatial distribution, wherein the details can be described in the following.
Still further, in order to better enable the micro-focus X-ray source 101 to form a plurality of different images at different positions/directions of the insulated copper bar 102, the micro-focus X-ray source 101, the rotary stage and the image receiving device 103 are sequentially distributed along the same straight line.
In the scheme, if the size of the insulated copper bar 102 is long, when the projection area of one-time imaging cannot cover all the insulated copper bars 102, step-by-step projection coverage can be realized through a lifting mode. Correspondingly, as shown in fig. 1, the apparatus for detecting defects of an insulating layer of a conductive copper bar according to an embodiment of the present invention further includes a lifting column 105;
the rotary stage is disposed on top of the lifting column 105.
In addition, according to the scheme, the spiral rising projection imaging or the spiral falling projection imaging of the insulated copper bar 102 can be realized through the matching of the lifting column 105 and the rotary object stage. Further, the elevating column 105 controls the elevating movement of the elevating column 105 by motor driving. Among them, the rotary stage is preferably a mechanical ball bearing rotary stage or a roller bearing rotary stage. The elevation column 105 is fixed to the center of the lower side of the rotary stage, and the horizontal height of the rotary stage can be adjusted by a vertical expansion/contraction conversion mechanism, that is, the elevation column 105 may preferably be a vertical expansion/contraction conversion mechanism. Of course, by using the lifting column 105 in cooperation with the rotary stage, the spiral-up projection imaging or the spiral-down projection imaging of the insulated copper bar 102 can be realized.
The embodiment of the invention also provides a method for detecting the defects of the insulating layer of the conductive copper bar, which adopts the device for detecting the defects of the insulating layer of the conductive copper bar to detect and comprises the following steps:
s1, driving an insulated copper bar to rotate by adopting a rotary objective table, irradiating the insulated copper bar once per rotation by adopting a microfocus X-ray source to form a plurality of different images, and receiving the plurality of different images by adopting an image receiving device;
s2, reconstructing a plurality of different images by adopting an image processing module to obtain three-dimensional images of the insulated copper bar;
s3, identifying the porous structure of the insulating layer in the insulating copper bar by measuring the absorption characteristic or the phase contrast of the three-dimensional image of the insulating copper bar, and determining the spatial distribution of the porous structure of the insulating layer of the insulating copper bar;
and S4, determining the porosity of the insulating layer of the insulating copper bar according to the spatial distribution of the porous structure of the insulating layer of the insulating copper bar.
It should be noted that, as shown in fig. 2, in step S1, the insulated copper bar is first placed on a rotary stage, then the rotary stage drives the insulated copper bar to rotate, and a microfocus X-ray source is used to irradiate the insulated copper bar once every time the insulated copper bar rotates 0.25 to 1 degree and acquire an image at the viewing angle, and the irradiation projection is repeated until the insulated copper bar rotates to 360 degrees, so that a plurality of different images are formed at different viewing angles, and then a plurality of different images are received by an image receiving device; in addition, in the step S2 of reconstructing the three-dimensional image of the insulated copper bar, the holes of the insulating layer of the insulated copper bar are low absorption areas in the insulated copper bar, and then the characteristics of the defects such as the holes of the insulating layer of the insulated copper bar can be visually displayed through the three-dimensional image of the insulated copper bar. In addition, before step S1, the present solution further includes: s0, taking down the insulated copper bar from the copper bar production line.
In addition, according to the scheme, the physical characteristics of the insulated copper bar can be obtained by analyzing the three-dimensional image of the insulated copper bar, so that a larger original excavation sample is obtained. In step S3, by measuring the absorption performance under different volumes, different composition of the insulated copper bar can be determined; for example, metallic copper will exhibit higher attenuation than the clad insulation, and this technique allows quantitative analysis and measurement of the constituent content and distribution of the insulated copper busbar. In step S4, the porosity may be measured by calculating statistical characteristics of the porous structure according to the spatial distribution of the porous structure (pores) of the insulating layer of the insulated copper bar. That is to say, the method is convenient to determine the porosity of the insulating layer of the insulated copper bar through the steps S3 and S4, so that the defect detection information of the insulated copper bar is more comprehensive. Certainly, because this scheme has adopted foretell conductive copper bar insulating layer defect detecting device to detect, it also has corresponding beneficial effect consequently, can refer to the preceding explanation specifically, no longer gives details here.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides a conductive copper bar insulating layer defect detecting device which characterized in that includes: an object stage (104), an X-ray radiation device and an image receiving device (103);
the object stage (104) is used for bearing an insulated copper bar (102);
the X-ray radiation device is used for irradiating the insulated copper bar (102) carried on the object stage (104) and forming an image (107);
the image receiving device (103) is used for receiving the image (107).
2. The apparatus for detecting the defect of the insulation layer of the copper busbar according to claim 1, wherein the X-ray radiation device comprises a micro-focus X-ray source (101);
the object stage (104) is arranged between the microfocus X-ray source (101) and the image receiving device (103).
3. The apparatus for detecting the defect of the insulation layer of the copper busbar according to claim 2, wherein the stage (104) is a rotary stage;
the rotary object stage can bear and drive the insulated copper bar (102) to rotate;
the microfocus X-ray source (101) can irradiate the insulated copper bar (102) borne on the rotary object stage once per rotation and form a plurality of different images;
the image receiving device (103) is capable of receiving a plurality of different images;
the device for detecting the defects of the insulating layer of the conductive copper bar further comprises an image processing module; the image processing module is in communication connection with the image receiving device (103), and can reconstruct a plurality of different images received by the image receiving device (103) to obtain a three-dimensional image.
4. The device for detecting the defect of the insulating layer of the copper busbar according to claim 3, wherein the image processing module reconstructs the image data set received by the image receiving device (103) into a three-dimensional image through a tomography reconstruction algorithm.
5. The apparatus for detecting the defect of the insulating layer of the copper busbar according to claim 4, wherein the tomographic reconstruction algorithm comprises: filtered back projection, algebraic reconstruction techniques and variations thereof or iterative statistical methods.
6. The apparatus according to claim 3, wherein the rotary stage comprises: a ball bearing rotating table or a roller bearing rotating table.
7. The apparatus for detecting the defect of the insulating layer of the copper busbar according to claim 3, wherein the micro-focus X-ray source (101), the rotary stage and the image receiving device (103) are sequentially distributed along the same straight line.
8. The apparatus for detecting the defect of the insulation layer of the copper busbar according to claim 3, further comprising a lifting column (105);
the rotary stage is arranged on the top of the lifting column (105).
9. The apparatus for detecting the defect of the insulating layer of the copper busbar according to claim 8, wherein the lifting column (105) comprises a vertical telescopic transformation mechanism.
10. A method for detecting the defects of the insulating layer of the conductive copper bar, which is characterized by adopting the device for detecting the defects of the insulating layer of the conductive copper bar according to any one of claims 3 to 9, and comprises the following steps:
s1, driving an insulated copper bar to rotate by adopting a rotary objective table, irradiating the insulated copper bar once per rotation by adopting a microfocus X-ray source to form a plurality of different images, and receiving the plurality of different images by adopting an image receiving device;
s2, reconstructing a plurality of different images by adopting an image processing module to obtain three-dimensional images of the insulated copper bar;
s3, identifying the porous structure of the insulating layer in the insulating copper bar by measuring the absorption characteristic or the phase contrast of the three-dimensional image of the insulating copper bar, and determining the spatial distribution of the porous structure of the insulating layer of the insulating copper bar;
and S4, determining the porosity of the insulating layer of the insulating copper bar according to the spatial distribution of the porous structure of the insulating layer of the insulating copper bar.
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| CN117523577A (en) * | 2023-11-22 | 2024-02-06 | 粤港澳大湾区(广东)国创中心 | Pin name upper scribing detection method and equipment based on longest horizontal straight line |
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| CN117523577A (en) * | 2023-11-22 | 2024-02-06 | 粤港澳大湾区(广东)国创中心 | Pin name upper scribing detection method and equipment based on longest horizontal straight line |
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