CN115598034A - Method and system for detecting holes of insulating layer of conductive copper bar through X-ray microscopic imaging - Google Patents
Method and system for detecting holes of insulating layer of conductive copper bar through X-ray microscopic imaging Download PDFInfo
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- 229910052802 copper Inorganic materials 0.000 title claims abstract description 165
- 239000010949 copper Substances 0.000 title claims abstract description 165
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 164
- 238000003384 imaging method Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 43
- 239000011148 porous material Substances 0.000 claims abstract description 20
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- G01N23/046—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using tomography, e.g. computed tomography [CT]
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Abstract
The invention discloses a method and a system for detecting pores of an insulating layer of a conductive copper bar by X-ray microscopic imaging, wherein the method comprises the following steps: s1, irradiating a copper bar sample to be detected from different visual angles by adopting an X-ray imaging system and acquiring a plurality of different projection images; s2, reconstructing the plurality of different projection images to obtain a three-dimensional image of the copper bar sample to be detected. In the scheme, the X-ray imaging system is adopted to provide accurate three-dimensional images for the copper bar sample to be detected, so that accurate detection of defects of the copper bar sample to be detected is facilitated, and detection misjudgment is avoided.
Description
Technical Field
The invention relates to the technical field of electric vehicles and battery pack production, in particular to a method and a system for detecting holes of an insulating layer of a conductive copper bar by X-ray microscopic imaging.
Background
The copper bar connection is high in conductivity, fast in heat dissipation and easy to bend, is widely applied to new energy automobiles, energy storage batteries and high-speed rail projects of motor cars, and is used as a conductive connection accessory among the batteries. In these applications, high voltage and large current are carried, so the selection of the insulating layer is important, and if the quality of the insulating layer is not too critical, the insulating layer is likely to be broken down by the current, so that the equipment is in danger. In the design of products, strict external insulation requirements are required for copper bar connection. The development of electric automobiles puts higher demands on the safety performance of the electric automobiles. In the existing processing method for copper bars coated with insulating layers, the defects such as bubbles and cavities are inevitably generated in the material forming process, if the volumes of the defects exceed a certain proportion, the insulating property of the copper bars is reduced, and short circuit can be generated in serious cases.
However, the existing defect detection technology for the copper bar coated with the insulating layer is manual visual, is usually inaccurate and is easy to misjudge.
Disclosure of Invention
In view of the above, the invention provides a method for detecting the holes of the insulating layer of the conductive copper bar by using X-ray microscopic imaging, which provides an accurate three-dimensional image for a copper bar sample to be detected by using an X-ray imaging system, thereby facilitating accurate detection of the defects of the copper bar sample to be detected and avoiding detection misjudgment.
In order to achieve the purpose, the invention provides the following technical scheme:
a method for detecting the pores of an insulating layer of a conductive copper bar by X-ray microscopic imaging comprises the following steps:
s1, irradiating a copper bar sample to be detected from different visual angles by adopting an X-ray imaging system and acquiring a plurality of different projection images;
s2, reconstructing the plurality of different projection images to obtain a three-dimensional image of the copper bar sample to be detected.
Preferably, in the step S2, reconstructing the plurality of different projection images to obtain a three-dimensional image of the copper bar sample to be detected includes:
and reconstructing the plurality of different projection images by adopting a computer tomography algorithm to obtain a three-dimensional image of the copper bar sample to be detected.
Preferably, the computed tomography algorithm includes: filtered backprojection, algebraic reconstruction techniques and variations thereof or iterative statistical methods.
Preferably, after the step S2, the following steps are further included:
s3, identifying the porous structure of the insulating layer in the copper bar sample to be detected by measuring the absorption characteristic or the phase contrast of the three-dimensional image of the copper bar sample to be detected, and determining the spatial distribution of the porous structure of the insulating layer of the copper bar sample to be detected;
and S4, determining the porosity of the insulating layer of the copper bar sample to be detected according to the spatial distribution of the porous structure of the insulating layer of the copper bar sample to be detected.
A system for detecting the pores of the insulating layer of the conductive copper bar by X-ray microscopic imaging adopts the method for detecting the pores of the insulating layer of the conductive copper bar by the X-ray microscopic imaging, and comprises an X-ray imaging system; the X-ray imaging system comprises: the X-ray source, the detector, the rotating platform and the sample rack;
the rotating platform is arranged at the top of the sample rack and is used for placing a copper bar sample to be tested; the X-ray source is used for irradiating the copper bar sample to be detected placed on the rotating table; the detector is used for receiving a projection image formed by irradiating the copper bar sample to be detected by the X-ray source.
Preferably, the X-ray source comprises a rotating anode X-ray source or a micro-focus X-ray source.
Preferably, the X-ray imaging system further comprises:
the condensing lens is used for projecting the X-ray beam of the X-ray source to the copper bar sample to be detected placed on the rotating table;
and the objective lens is used for amplifying a projection image formed by irradiating the copper bar sample to be detected by the X-ray source.
Preferably, the condenser lens comprises a fresnel zone plate lens, an ellipsoidal reflective capillary lens, a wolter lens, or a compound refractive lens.
Preferably, the objective lens comprises a fresnel zone plate lens.
Preferably, the X-ray imaging system is used for being arranged on a mobile platform of the copper bar production line.
According to the technical scheme, the method for detecting the holes of the insulating layer of the conductive copper bar by the X-ray microscopic imaging provided by the invention adopts the X-ray imaging system to provide accurate three-dimensional images for the copper bar sample to be detected, so that the accurate detection of the defects of the copper bar sample to be detected is facilitated, and the detection misjudgment is avoided.
The invention also provides a system for detecting the holes of the insulating layer of the conductive copper bar by adopting the X-ray microscopic imaging method, so that the method has corresponding beneficial effects, and specific reference can be made to the foregoing description, and the details are not repeated herein.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flowchart of a method for detecting pores of an insulating layer of a conductive copper bar by X-ray microscopic imaging according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for detecting pores in an insulating layer of a conductive copper bar by X-ray microscopic imaging according to another embodiment of the present invention;
fig. 3 is a schematic structural diagram of a system for detecting the pores of the insulating layer of the conductive copper bar by X-ray microscopic imaging according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a system for detecting pores in an insulating layer of a conductive copper bar by X-ray microscopic imaging according to another embodiment of the present invention.
Wherein 101 is an X-ray source, 102 is a copper bar sample to be detected, 103 is a detector, 104 is a sample holder, 105 is a rotating table, 106 is the distance from the X-ray source to the copper bar sample to be detected, 107 is the distance from the copper bar sample to be detected to the detector, 108 is a condenser lens, and 109 is an objective lens.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The method for detecting the pores of the insulating layer of the conductive copper bar by X-ray microscopic imaging, which is provided by the embodiment of the invention and shown in figure 1, comprises the following steps:
s1, irradiating a copper bar sample to be detected from different visual angles by adopting an X-ray imaging system and acquiring a plurality of different projection images;
s2, reconstructing the plurality of different projection images to obtain a three-dimensional image of the copper bar sample to be detected.
It should be noted that, the X-ray imaging system of the present disclosure adopts a Computed Tomography (CT) technique, can obtain X-ray images at different viewing angles, and can realize three-dimensional structure sample reconstruction from a series of two-dimensional projection images. In addition, the X-ray imaging system of the scheme also has the resolution ratio from nanometer to micrometer, which undoubtedly provides a nondestructive detection method for obtaining the accurate three-dimensional structure of the copper bar sample to be detected. Of course, the present solution is based on a direct projection technique using a spatially reconstructed X-ray detector to record the X-ray radiation passing through the copper bar sample to be measured, and can achieve a resolution of 1 micron or better.
In addition, it should be further described that, in step S1, the copper bar sample to be detected is placed on a rotating mechanism (such as a rotating table below) of the X-ray imaging system, and the rotating mechanism drives the copper bar sample to be detected to rotate; and irradiating once and acquiring a projection image at the visual angle every time the copper bar sample rotates by 0.25 to 1 degree, and repeating the irradiation projection until the copper bar sample to be detected rotates to 180 degrees, thereby acquiring a plurality of different projection images of the copper bar sample to be detected at different visual angles. In addition, in the three-dimensional image of the copper bar sample to be detected obtained in the step S2, the hole of the insulating layer of the copper bar sample to be detected is a low absorption area in the copper bar sample to be detected, and then the defect characteristics such as the hole of the insulating layer of the copper bar sample to be detected can be visually displayed through the three-dimensional image of the copper bar sample to be detected. In addition, before step S1, the present solution further includes: s0, taking down the copper bar sample to be detected from the copper bar production line.
According to the technical scheme, the method for detecting the holes of the insulating layer of the conductive copper bar by the X-ray microscopic imaging provided by the embodiment of the invention adopts the X-ray imaging system to provide accurate three-dimensional images for the copper bar sample to be detected, so that the method is beneficial to realizing accurate detection of the defects of the copper bar sample to be detected and avoiding detection misjudgment.
In the scheme, a three-dimensional image of the copper bar sample to be detected is obtained for better reconstruction; correspondingly, in the step S2, reconstructing the plurality of different projection images to obtain a three-dimensional image of the copper bar sample to be detected includes:
and reconstructing the plurality of different projection images by adopting a computer tomography algorithm to obtain a three-dimensional image of the copper bar sample to be detected. Namely, the chromatographic reconstruction algorithm is adopted to reconstruct a plurality of different projection images to obtain a three-dimensional image of the copper bar sample to be detected. Namely, the computer simulation crystal form projection image is used for reconstruction, the three-dimensional image visualization is realized, the defects of cracks, air holes, pinholes, impurities and the like in the workpiece (copper bar sample to be detected) are conveniently checked, and the measurement of the internal size and material density of the workpiece and the assembly clearance of each part or the compression amount of a sealing element is realized.
Specifically, the computed tomography algorithm includes: filtered backprojection, algebraic reconstruction techniques and variations thereof or iterative statistical methods. Among them, iterative statistical methods such as bayesian technique. In addition, the filtering back projection algorithm is one of analytical reconstruction algorithms and is characterized by high reconstruction speed. The algebraic reconstruction technology is one kind of iterative algorithm, and has the advantages of being suitable for various scanning modes, adding various constraint conditions in iteration, and being superior to analytic algorithms for data with few scanning angles and large statistical fluctuation. Of course, filtered backprojection or algebraic reconstruction techniques can be selected as the computed tomography algorithm depending on the workpiece conditions.
Further, as shown in fig. 1, after the step S2, the following steps are further included:
s3, identifying the porous structure of the insulating layer in the copper bar sample to be detected by measuring the absorption characteristic or the phase contrast of the three-dimensional image of the copper bar sample to be detected, and determining the spatial distribution of the porous structure of the insulating layer of the copper bar sample to be detected;
and S4, determining the porosity of the insulating layer of the copper bar sample to be detected according to the spatial distribution of the porous structure of the insulating layer of the copper bar sample to be detected. That is to say, the physical characteristics of the copper bar sample to be detected can be obtained by analyzing the three-dimensional image of the copper bar sample to be detected, so that a larger original excavation sample is obtained. In the step S3, different component compositions in the copper bar sample to be detected can be determined by measuring the absorption performance under different volumes; for example, the metal copper will show higher attenuation than the cladding insulating layer, and the technology can quantitatively analyze and measure the component content and distribution of the copper bar sample to be measured. In step S4, the porosity may be measured by calculating the statistical characteristics of the porous structure according to the spatial distribution of the porous structure (pores) of the insulating layer of the copper bar sample to be measured. That is to say, this scheme is through adding step S3 and S4 to in the definite of the copper bar sample insulating layer porosity that realizes awaiting measuring, thereby make the defect detection information of copper bar sample that awaits measuring more comprehensive.
The embodiment of the invention also provides a system for detecting the pores of the insulating layer of the conductive copper bar by adopting the X-ray microscopic imaging method, which comprises an X-ray imaging system; as shown in fig. 3, the X-ray imaging system includes: an X-ray source 101, a detector 103, a rotary stage 105 and a sample holder 104;
the rotating platform 105 is arranged at the top of the sample rack 104 and is used for placing the copper bar sample 102 to be tested; the X-ray source 101 is used for irradiating a copper bar sample 102 to be detected placed on the rotating platform 105; the detector 103 is used for receiving a projection image formed by irradiating the copper bar sample 102 to be detected by the X-ray source 101.
As shown in fig. 3, the rotary table 105 is disposed between the X-ray source 101 and the detector 103. In addition, the working principle of the X-ray imaging system is as follows: firstly, a copper bar sample 102 to be detected is placed on a rotating platform 105, and the rotating platform 105 drives the copper bar sample 102 to be detected to rotate. When the copper bar sample 102 to be detected rotates 0.25 to 1 degree, the X-ray source 101 irradiates once and forms a projection image at the visual angle, and the projection is repeatedly irradiated until the copper bar sample 102 to be detected rotates 108 degrees, so that the copper bar sample 102 to be detected forms a plurality of different projection images at a plurality of visual angles. Certainly, because this scheme has adopted the above-mentioned method that X ray microimaging detected conductive copper bar insulating layer hole to detect, it also has corresponding beneficial effect exactly, can refer to the preceding explanation specifically, and no longer repeated here.
In particular, the X-ray source 101 comprises a rotating anode X-ray source or a micro-focus X-ray source. Wherein, the rotary anode X-ray source has good heat dissipation effect and long service life. The micro-focus X-ray source has a focus smaller than 10 μm, high power density, higher spatial resolution and density resolution, and better imaging effect.
Further, as shown in fig. 4, the X-ray imaging system further includes:
a condenser lens 108 for projecting the X-ray beam of the X-ray source 101 to the copper bar sample 102 to be detected placed on the rotating platform 105; the condenser lens 108 is arranged between the X-ray source 101 and the rotating platform 105, so that the X-ray beam is projected from the X-ray source 101 to the copper bar sample 102 to be detected through the condenser lens 108;
and the objective lens 109 is used for amplifying a projection image formed by irradiating the copper bar sample 102 to be detected by the X-ray source 101, namely, the X-ray image is amplified by the objective lens 109. Wherein an objective lens 109 is arranged between the rotation stage 105 and the X-detector 103 in order to project the magnified projection image onto the X-detector 103. By adopting the design, the resolution of the X-ray imaging system is improved, and the detection of the large-size copper bar sample to be detected 102 is facilitated.
Further, the condenser lens 108 includes a fresnel zone plate lens, an ellipsoidal reflective capillary lens, a wolter lens, or a compound refractive lens. Among them, the condenser lens 108 is preferably an ellipsoidal reflective capillary lens. The ellipsoidal reflective capillary lens is a revolving body formed by a part of an ellipse rotating around a central axis, a light source is arranged at a first focus F1 of the ellipsoidal reflective capillary lens, light is converged at a second focus F2 of the ellipsoidal reflective capillary lens after being reflected by the ellipsoidal reflective capillary lens, and the ellipsoidal reflective capillary lens mainly plays a role in improving the utilization efficiency of the light source.
Preferably, the objective lens 109 comprises a fresnel zone plate lens. The Fresnel zone plate lens is simply provided with equidistant insections on one side of the lens, the insections can achieve the effect of light band passing (reflection or refraction) in a specified spectral range, the traditional band-pass optical filter of the polishing optical equipment is expensive in manufacturing cost, and the cost of the Fresnel zone plate lens can be greatly reduced.
In order to further optimize the technical scheme, the X-ray imaging system is used for being arranged on a mobile platform of the copper bar production line, so that the defect of the copper bar sample to be detected on site can be rapidly detected in a turnover mode. Wherein, the moving platform of copper bar production line can select for use conveyer.
The present solution is further described below with reference to specific embodiments:
the invention provides a method for determining the porosity of a copper bar sample coated with an insulating layer by using an X-ray CT system. As shown in fig. 3, in this configuration, the X-ray source 101 generates an X-ray radiation beam b, a copper bar sample (i.e. a copper bar sample 102 to be tested, the same applies below) is placed in the beam path b, and X-ray radiation passing through the copper bar sample is recorded by a spatial resolution detector (i.e. a detector 103, the same applies below), for example, the spatial resolution detector is a flat panel detector with 1024x1024 pixels. Wherein the copper bar sample is mounted on a sample holder 104 with an integrated rotation stage 105, which rotation stage 105 rotates the copper bar sample from-90 to +90 degrees from the optical axis. For copper bar samples, a high energy x-ray radiation beam is used, the energy of which exceeds several keV. This typically requires penetration of samples of several tens of microns or more in thickness. When the thickness of the copper bar sample is typically greater than one millimeter, higher energy radiation of tens of keV is used. Typically in the range of 5-160keV. The X-ray source 101 used in this configuration is preferably based on a laboratory source, such as a sealed tube, a rotating anode or a microfocus X-ray source. The target is preferably Cu, W, mo, ag or Rh. Synchrotron radiation x-ray sources may also be used. The rotating table 105 is preferably a mechanical ball bearing or roller bearing table, or preferably an air bearing platform, for reducing rotational errors.
In the configuration shown in fig. 3, the magnification is determined by the distance 106 from the X-ray source to the copper bar sample and the distance 107 from the copper bar sample to the detector. For detectors with coarse resolution, a smaller X-ray source spot size and high magnification are required to achieve high resolution. This means that the distance 107 from the copper bar sample to the detector will be much larger than the distance 106 from the X-ray source to the sample. This is typically accomplished by placing the copper bar sample very close to the X-ray source. On the other hand, with a high resolution detector, the magnification can be relatively low and the distance between the X-ray source, the copper bar sample and the detector can be relaxed. For this projection system configuration, the magnification is preferably between 2x-100 times.
The system shown in fig. 3 can be used to inspect a wide range of copper bar samples. After each copper bar sample is formed to a desired size, as shown in the second step of fig. 2, the copper bar sample is imaged using an X-ray imaging system, which typically records radiographs of each copper bar sample, which are magnified geometrically or by an X-ray lens, as described in detail below. In order to obtain the three-dimensional structure of the copper bar sample, a plurality of projection images were obtained at different viewing angles. A 180 degree range data set is typically used to acquire the full range of projection data. A step size of 0.25 degrees is typically used for a 1024x1024 pixel radiograph. Larger radiographs require finer angular stepping. Typically the step size is 0.25 to 1 degree.
Upon completion, as a third step shown in fig. 2, the projection data set is reconstructed using a tomographic reconstruction algorithm to obtain a 3D structure for each sample. Typical algorithms include filtered backprojection, algebraic Reconstruction Techniques (ART) and variations thereof, and iterative statistical methods such as bayesian techniques. Analysis of the three-dimensional data set can obtain the physical characteristics of each sample, thereby obtaining a larger original mined sample. The porosity is determined as a low absorption region in the sample and the porosity can be measured by calculating the statistical properties of the porosity in the sample. By measuring the absorption performance under different volumes, different composition compositions in the copper bar can be determined. For example, metallic copper will exhibit higher attenuation than the clad insulating layer. The technique can quantitatively analyze and measure the component content and distribution of the sample. In a fourth step, shown in fig. 2, the spatial distribution of the void content is measured in three dimensions using CT techniques. That is, as shown in fig. 2, the second step is to obtain x-ray images at different angles, the third step is to calculate a three-dimensional image using CT, inspect the copper bar cladding to measure porosity, distinguish the copper bar from the cladding by absorption characteristics or phase contrast in the CT image in the fourth step, three-dimensionally measure spatial distribution of the porosity using the CT technique of the fifth step, and determine porosity.
Furthermore, an alternative configuration is used by the method shown in fig. 4. This configuration increases the resolution of the instrument. The X-ray lens 109 is used for magnifying an X-ray image of the copper bar sample, the copper bar sample is fixed on the rotating platform 205, the rotating platform 205 rotates the copper bar sample from-90 degrees to +90 degrees from an optical axis, and then the magnified image is projected onto the spatial resolution detector. Preferably, the detector comprises a sensor, a CCD camera (e.g. with 1024x1024 pixels) and a lens for imaging the visible light from the scintillator onto the CCD camera. The X-ray lens is preferably a fresnel zone plate lens or a compound refractive lens made of Si or the like. This configuration typically requires a condenser lens 108 to project the X-ray beam from the source to the copper bar sample. The condenser lens is preferably a fresnel zone plate lens, an ellipsoidal reflective capillary lens, a wolter lens, or a compound refractive lens.
Furthermore, a phase ring is added to the optical column and the system operates in phase contrast mode in addition to absorbing contrast.
In addition, by using an X-ray lens, higher magnification can be obtained. The magnification is usually set in the range of 5 times to 5000 times. The focal length of the zone plate is preferably in the range of 1 millimeter (mm) to 100 mm.
Meanwhile, the X-ray imaging system shown in fig. 3 and 4 is preferably mounted on a moving platform, such as a conveyor belt, in the copper bar on-site production line. Through this kind of mode, can realize the quick turnover analysis of copper bar.
More specifically, the method for determining the porosity of the copper bar sample coated with the insulating layer by using the X-ray imaging system comprises the following steps:
1. different copper bar samples of the overall inspection of the copper bar production line:
2. putting the copper bar sample into an X-ray imaging system, wherein the magnification is between 2X and 5000X;
3. acquiring magnified radiographs from X-rays passing through the copper bar sample from different visual angles;
4. and reconstructing a three-dimensional image of the copper bar sample by using a computer tomography algorithm.
The X-ray imaging system comprises a laboratory-based X-ray source, a condenser lens, a sample holder with a rotating table, an objective lens and a spatial resolution detector system.
The X-ray source is a rotating anode X-ray source or a micro-focus X-ray source.
The condenser lens is an ellipsoidal capillary lens.
The objective lens is a fresnel zone plate lens.
The X-ray imaging system is installed on a moving platform of the copper bar production line.
The detector comprises a flat panel detector.
The detector includes a scintillator, a CCD camera, and a lens that images a visible light image from the scintillator to the CCD camera.
The X-ray imaging system operates in an absorption contrast mode, recording magnified X-ray shadow radiography.
The X-ray imaging system includes a phase loop and operates in a phase contrast mode.
The copper bar samples were rotated through a range of-90 degrees and +90 degrees from the optical axis, where the rotation was performed in steps of 0.25 to 1 degree.
The X-ray imaging system generates X-rays with an energy of 5-160keV.
The copper bar sample is a sample coated with an insulating layer, and the insulating layer can be obtained by processing methods such as plastic dipping and injection molding.
The above process further includes distinguishing the insulating layer from other materials in the 3D computed tomography image.
The above process further includes measuring a spatial distribution of the pores of the insulating layer using the 3D image.
The above process further comprises locating pores in the core sample from low absorption regions in the 3D image.
The above process further comprises calculating the porosity of the insulating layer by calculating a statistical characteristic of the porosity.
That is, the scheme provides a method for determining the porosity of a copper bar sample coated with an insulating layer, which comprises the following steps: obtaining magnified radiographs from X-rays passing through the sample from different view angles; reconstructing a 3D image of the sample with a computed tomography algorithm; identifying a porous structure in the sample by measuring the absorption characteristic or the phase contrast, and determining the spatial distribution of the porous structure; and determining the porosity from the spatial distribution.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A method for detecting the pores of an insulating layer of a conductive copper bar by X-ray microscopic imaging is characterized by comprising the following steps:
s1, irradiating a copper bar sample to be detected from different visual angles by adopting an X-ray imaging system and acquiring a plurality of different projection images;
s2, reconstructing the plurality of different projection images to obtain a three-dimensional image of the copper bar sample to be detected.
2. The method for detecting the pores of the insulating layer of the copper bar according to claim 1, wherein in the step S2, reconstructing the plurality of different projection images to obtain a three-dimensional image of the sample of the copper bar to be detected comprises:
and reconstructing the plurality of different projection images by adopting a computer tomography algorithm to obtain a three-dimensional image of the copper bar sample to be detected.
3. The method for detecting the porosity of the insulating layer of the conducting copper bar according to the claim 2, wherein the computer tomography algorithm comprises: filtered backprojection, algebraic reconstruction techniques and variations thereof or iterative statistical methods.
4. The method for detecting the pores of the insulating layer of the copper busbar by X-ray microscopic imaging according to claim 1, wherein after the step S2, the method further comprises the following steps:
s3, identifying the porous structure of the insulating layer in the copper bar sample to be detected by measuring the absorption characteristic or the contrast of the three-dimensional image of the copper bar sample to be detected, and determining the spatial distribution of the porous structure of the insulating layer of the copper bar sample to be detected;
and S4, determining the porosity of the insulating layer of the copper bar sample to be detected according to the spatial distribution of the porous structure of the insulating layer of the copper bar sample to be detected.
5. A system for detecting the pores of the insulating layer of the conductive copper bar by X-ray microscopic imaging, which is characterized in that the detection is carried out by adopting the method for detecting the pores of the insulating layer of the conductive copper bar by X-ray microscopic imaging according to any one of claims 1 to 4, and the system comprises an X-ray imaging system; the X-ray imaging system comprises: an X-ray source (101), a detector (103), a rotary table (105) and a sample holder (104);
the rotating platform (105) is arranged at the top of the sample rack (104) and is used for placing a copper bar sample (102) to be tested; the X-ray source (101) is used for irradiating the copper bar sample (102) to be detected placed on the rotating table (105); the detector (103) is used for receiving a projection image formed by irradiating the copper bar sample (102) to be detected by the X-ray source (101).
6. The system for detecting the porosity of the insulating layer of the copper busbar according to the claim 5, wherein the X-ray source (101) comprises a rotating anode X-ray source or a micro-focusing X-ray source.
7. The system for detecting the porosity of the insulating layer of the copper busbar through X-ray microscopic imaging according to claim 5, wherein the X-ray imaging system further comprises:
a condenser lens (108) for projecting the X-ray beam of the X-ray source (101) to the copper bar sample (102) to be detected placed on the rotating table (105);
and the objective lens (109) is used for amplifying a projection image formed by irradiating the copper bar sample (102) to be detected by the X-ray source (101).
8. The system for detecting the porosity of the insulating layer of the copper busbar through X-ray microscopic imaging according to claim 7, wherein the condenser lens (108) comprises a Fresnel zone plate lens, an ellipsoidal reflective capillary lens, a Walter lens or a compound refractive lens.
9. The system for detecting the pores of the insulating layer of the copper busbar according to the claim 7, wherein the objective lens (109) comprises a Fresnel zone plate lens.
10. The system for detecting the pores of the insulating layer of the conductive copper bar through X-ray microscopic imaging according to claim 5, wherein the X-ray imaging system is used for a mobile platform arranged on a copper bar production line.
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| CN202211186750.3A CN115598034A (en) | 2022-09-27 | 2022-09-27 | Method and system for detecting holes of insulating layer of conductive copper bar through X-ray microscopic imaging |
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| CN202211186750.3A CN115598034A (en) | 2022-09-27 | 2022-09-27 | Method and system for detecting holes of insulating layer of conductive copper bar through X-ray microscopic imaging |
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