CN115652393A - Nickel-63 radioactive source preparation device, source preparation process and application - Google Patents
Nickel-63 radioactive source preparation device, source preparation process and application Download PDFInfo
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- CN115652393A CN115652393A CN202211279659.6A CN202211279659A CN115652393A CN 115652393 A CN115652393 A CN 115652393A CN 202211279659 A CN202211279659 A CN 202211279659A CN 115652393 A CN115652393 A CN 115652393A
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- barrel
- nickel
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- 230000002285 radioactive effect Effects 0.000 title claims abstract description 49
- PXHVJJICTQNCMI-RNFDNDRNSA-N nickel-63 Chemical compound [63Ni] PXHVJJICTQNCMI-RNFDNDRNSA-N 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 35
- 238000007747 plating Methods 0.000 claims abstract description 169
- 239000000758 substrate Substances 0.000 claims abstract description 95
- 238000009713 electroplating Methods 0.000 claims abstract description 62
- 230000007246 mechanism Effects 0.000 claims abstract description 34
- 238000006073 displacement reaction Methods 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims description 29
- 239000010949 copper Substances 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 238000003825 pressing Methods 0.000 claims description 27
- 239000007788 liquid Substances 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 15
- 238000004070 electrodeposition Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 7
- 239000004926 polymethyl methacrylate Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 239000000443 aerosol Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000005355 lead glass Substances 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- -1 Polytetrafluoroethylene Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000004428 fluoroalkoxy group Chemical group 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
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Abstract
The invention discloses a nickel-63 radioactive source preparation device, a source preparation process and application, wherein the nickel-63 radioactive source preparation device comprises a shielding box body, and a lifting mechanism, a substrate clamping tool and an electroplating bath which are arranged in the shielding box body; the lifting mechanism is used for realizing the displacement of the substrate clamping tool in the vertical direction; the substrate clamping tool comprises a rack plating clamping tool and a barrel plating clamping tool, and the rack plating clamping tool and the barrel plating clamping tool are both detachably connected with the lifting mechanism; the plating bath includes outer tank and inside groove, the inside groove is detachable installs in the outer tank, the inside groove include with hang plate centre gripping frock assorted square groove and with barrel plating centre gripping frock assorted circular groove. The device provided by the invention has two source-making modes of rack plating and barrel plating, has the capability of shielding radioactive rays, and can be used for electroplating substrates with different shapes, sizes and thicknesses.
Description
Technical Field
The invention relates to the technical field of electrodeposition, in particular to a nickel-63 radioactive source preparation device, a source preparation process and application.
Background
Nickel-63 emits low-energy pure beta rays, the half-life period is 100.2a, the beta particle energy is moderate, no damage is caused to a semiconductor energy conversion component, and the radioactive source has the advantages of long service life, good safety performance, easiness in miniaturization and integration and the like, and is the most widely used radioactive source in a radiant volt battery.
Currently, electroplating is one of the main methods for preparing nickel-63 radioactive sources by electroplating 63 Ni 2+ Conversion of ions to metals 63 And depositing Ni on the metal substrate to make the nickel layer and the metal substrate combined tightly, thereby preparing the nickel-63 radioactive source. Chinese patent 201810877653.6 electrodeposition method of Ni-63 radioactive sheet sourceThe electrodeposition method for preparing Ni-63 radioactive sheet source uses stainless steel as substrate and adopts electrodeposition liquid mainly containing nickel sulfate to prepare nickel-63 single-face source. Chinese patent 202110700586.2, a substrate-free ultra-thin nickel-63 radioactive source preparation technology, discloses a substrate-free ultra-thin nickel-63 radioactive source electrodeposition technology, which comprises preparing a copper substrate supported nickel-63 radioactive source by electrodeposition, and removing the film and the substrate to obtain the substrate-free ultra-thin nickel-63 radioactive source.
The existing mature process method adopts an electrodeposition method (electroplating method) to prepare the nickel-63 radioactive source, but the existing source preparation device is generally an electrodeposition instrument or a common electroplating bath. Due to equipment limitation, the existing electrodeposition instrument can only prepare round single-surface sources with phi 20mm and phi 25mm generally, and cannot meet the preparation of nickel-63 radioactive sources with different sizes and shapes, and cannot realize the preparation of double-surface sources. The common electroplating bath has low automation level, inconvenient operation and difficult regulation and control of electroplating parameters. More importantly, the radiation protection requirement is not considered in the conventional electrodeposition instrument and the conventional electroplating bath, and when the radioactive electroplating solution is operated, the personnel dosage level is high and the radiation protection difficulty is high.
Disclosure of Invention
The invention aims to provide a nickel-63 radioactive source preparation device which has two source preparation modes of rack plating and barrel plating, has the shielding capability on radioactive rays and can be used for electroplating substrates with different shapes, sizes and thicknesses.
In addition, the invention also provides a source preparation process based on the nickel-63 radioactive source preparation device and application thereof.
The invention is realized by the following technical scheme:
a nickel-63 radioactive source preparation device comprises a shielding box body, and a lifting mechanism, a substrate clamping tool and an electroplating bath which are arranged in the shielding box body;
the lifting mechanism is used for realizing the displacement of the substrate clamping tool in the vertical direction;
the substrate clamping tool comprises a rack plating clamping tool and a barrel plating clamping tool, the rack plating clamping tool comprises a pole piece and a substrate pressing plate, the upper part of the pole piece is detachably connected with the lifting mechanism, and the lower part of the pole piece is connected with the substrate pressing plate for mounting a substrate; the barrel-plating clamping tool comprises a barrel-plating support column, a copper bar and a barrel-plating electrode, the top of the barrel-plating support column is detachably connected with a lifting mechanism, the barrel-plating electrode and the copper bar are both installed on the barrel-plating support column, one end of the copper bar is connected with a barrel-plating head on the barrel-plating electrode, and the barrel-plating electrode is used for installing a substrate;
the electroplating bath comprises an outer bath and an inner bath, wherein the inner bath is detachably installed in the outer bath, and the inner bath comprises a square groove matched with a rack-plating clamping tool and a circular groove matched with a barrel-plating clamping tool.
The plating tank comprises an outer tank and an inner tank, the inner tank is detachably arranged in the outer tank, the inner tank matched with the rack plating clamping tool or the barrel plating clamping tool can be selected according to the requirement, and the device has two source-making modes of rack plating and barrel plating.
The rack plating clamping tool and the barrel plating clamping tool can be used for simultaneously mounting a plurality of substrates, and substrates with different shapes and sizes can be mounted.
The lifting mechanism, the substrate clamping tool and the electroplating bath are all arranged in the shielding box body, and the shielding box body has a shielding function on radioactive rays, so that the exposure dose of personnel can be reduced, and the radiation protection requirement is met.
Furthermore, the shielding box body is made of shielding materials and is provided with a glove box door; the shielding box body is provided with a ventilation pipe.
Further, the lifting mechanism comprises a module mounting piece, a first servo motor, a second servo motor, a module mounting piece and an up-and-down moving planker;
the module mounting part is provided with a movable sliding table, the up-and-down moving carriage is arranged on the movable sliding table in a sliding manner, and the second servo motor is arranged on the module mounting part and used for driving the up-and-down moving carriage to move on the movable sliding table; the utility model discloses a substrate clamping tool, including base, planker, servo motor, mounting plate, base centre gripping frock, it is provided with the mount pad on the planker moves up and down, install first servo motor on the mount pad, first servo motor's output shaft sets up down, first servo motor's output shaft has the mounting plate through rotation axis connection, the detachable connection of substrate centre gripping frock and mounting plate.
The up-and-down moving planker can move up and down on the moving sliding table under the driving of a screw rod connected with a second servo motor, and the barrel plating clamping tool can rotate along the axis of the barrel plating clamping tool under the driving of a first servo motor.
Furthermore, a rotating seat is installed on the installation seat, a central through hole is formed in the rotating seat, and the rotating shaft is arranged in the central through hole in a penetrating mode through a bearing.
Furthermore, the lifting mechanism further comprises a lower mechanical limiting conductive sliding ring rotation stopping piece and a conductive sliding ring, wherein the lower mechanical limiting conductive sliding ring rotation stopping piece and the conductive sliding ring are both arranged below the upper dragging plate and the lower dragging plate.
Further, the substrate pressing plate comprises an annular rack plating pressing plate and a copper plate, the copper plate is connected with the pole piece, a vertical side wall of the copper plate is provided with a groove for placing the substrate, and the annular rack plating pressing plate is detachably connected with the copper plate and used for compressing the substrate.
The annular rack plating pressing plate can be made of PMMA plates.
Furthermore, an electrode clamping groove for detachably placing a barrel-plating electrode is formed in the barrel-plating supporting column, and the barrel-plating electrode is fixed in the clamping groove through an annular barrel-plating pressing plate;
the barrel-plating electrode comprises a groove-shaped structure with one end being an open end, substrate clamping grooves used for placing substrates are symmetrically formed in two vertical symmetrical side walls of the groove-shaped structure, and a barrel-plating head is arranged at the top of the groove-shaped structure.
Further, still include the cantilever operation box, the cantilever operation box passes through the bracing piece and installs on the shielding box body, the cantilever operation box is used for controlling elevating system and plating bath.
The source preparation process based on the nickel-63 radioactive source preparation device comprises the following steps:
s1, mounting a rack plating clamping tool or a barrel plating clamping tool on a lifting mechanism, and mounting a substrate on the rack plating clamping tool or the barrel plating clamping tool;
s2, selecting an inner groove matched with the rack plating clamping tool or the barrel plating clamping tool, installing the inner groove in the outer groove, injecting plating solution into the inner groove, and connecting the plating bath with a power supply;
and S3, controlling the lifting mechanism to enable the rack plating clamping tool or the barrel plating clamping tool to move downwards, enabling the substrate to be immersed in electroplating liquid, electrifying and electroplating, wherein in the electroplating process, the first servo motor drives the barrel plating clamping tool to rotate.
The nickel-63 radioactive source preparing device is applied to preparing an electroplated layer on a substrate.
Compared with the prior art, the invention has the following advantages and beneficial effects:
1. the invention is provided with the shielding box body, is provided with the glove hole and the ventilation opening, has the function of shielding radioactive rays, can discharge radioactive aerosol, reduces the irradiated dose of personnel, meets the radiation protection requirement, and is suitable for batch preparation of nickel-63 radioactive sources.
2. The invention has two functions of rack plating and barrel plating, can meet the electroplating requirements of substrates with different sizes, sizes and shapes, and can realize simultaneous electroplating of a plurality of substrates in a barrel plating mode.
3. The invention has high automation degree, reduces manual operation steps and reduces the irradiation dose of personnel.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is an axonometric view of a rack plating clamping tool installed on a nickel-63 radioactive source preparation device;
FIG. 2 is a front view of a rack plating clamping tool installed on the nickel-63 radioactive source preparation device;
FIG. 3 is a first isometric view of the lift mechanism of the present invention;
FIG. 4 is a second isometric view of the lift mechanism of the present invention;
FIG. 5 is a front view of the lift mechanism of the present invention;
FIG. 6 isbase:Sub>A cross-sectional view of the rack plating clamping tool from FIG. 5A-A;
FIG. 7 is a schematic view of the connection of the rack plating clamping tool and the mounting plate;
FIG. 8 is a schematic structural view of a barrel plating clamping tool;
FIG. 9 is a schematic structural diagram of a barrel-plating support column;
FIG. 10 is a schematic structural view of a barrel-plated electrode;
fig. 11 is a schematic structural view of a copper bar;
fig. 12 is a schematic structural view of the outer tank.
Reference numbers and corresponding part names in the figures:
1-shielding box body, 2-lifting mechanism, 3-cantilever operation box, 4-substrate clamping tool, 5-electroplating tank, 6-distribution box, 7-glove box door, 8-ventilation pipe, 21-first servo motor, 22-up-down moving carriage, 23-drag chain support plate, 24-mounting seat, 25-bearing, 26-down mechanical limit, 27-rotating seat, 28-conductive slip ring rotation stopping piece, 29-rotating shaft, 30-second servo motor, 31-drag chain, 32-moving sliding table, 33-conductive slip ring, 210-module mounting piece, 211-mounting plate, 41-rack plating clamping tool, 42-barrel plating clamping tool, 51-outer groove, 52-inner groove, 411-substrate support plate, 412-substrate pressing plate, 421-barrel plating support column, 422-copper bar, 423-barrel plating, 424-barrel plating electrode, 4211-electrode clamping groove, 4241-barrel plating head, 4242-substrate clamping groove and 100-substrate clamping groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not used as limitations of the present invention.
Example 1:
as shown in fig. 1-12, a nickel-63 radioactive source preparation device comprises a shielding box body 1, and a lifting mechanism 2, a substrate clamping tool 4, an electroplating bath 5 and a cantilever operation box 3 which are arranged in the shielding box body 1;
the shielding box body 1 provides a closed space for the electroplating functional module, so that the electroplating operation can be performed in the shielding box body in a closed mode. The upper half part of the shielding box body 1 is a working box body which has a ray shielding function and certain sealing performance, the main material of the shielding box body is stainless steel, the front door observation window is made of lead glass, the thickness of the stainless steel and the lead glass is 5-10 mm, and the thickness of the stainless steel and the lead glass is adjusted according to the radioactivity intensity of a nickel-63 raw material. The shielding box body 1 is provided with a glove box door 7; the glove box door 7 is provided with a glove hole for installing the radiation-proof glove for electroplating operation. The upper part of the work box is provided with a ventilation opening which is connected with a ventilation pipe 8 and can discharge radioactive aerosol generated in the box body.
The lower part of the shielding box body 1 is a distribution box 6, a power supply circuit, a control circuit and a switch are arranged in the distribution box 6, and a pulse power supply required by electroplating is also arranged in the distribution box.
The lifting mechanism 2 is used for realizing the displacement and the rotation of the substrate clamping tool 4 in the vertical direction.
The lifting mechanism 2 comprises a module mounting piece 210, a first servo motor 21, an up-and-down movement module, a module mounting piece 210 and an up-and-down moving carriage 22;
wherein, be provided with on the module installed part 210 and remove slip table 32, the up-and-down motion module is installed on module installed part 210 for the drive moves planker 22 from top to bottom and removes on removing slip table 32, specifically: the up-and-down movement module is composed of a second servo motor 30, a driver, a hand wheel and a screw rod, the second servo motor 30 rotates and outputs through the driver, the second servo motor 30 rotates to drive the screw rod to rotate, and the screw rod rotates to drive the movable sliding table 33 to move up and down.
Move about and be provided with mount pad 24 and tow chain backup pad 23 on planker 22 (the effect of tow chain backup pad 23 is fixed tow chain 31, and tow chain 31 is used for putting together all kinds of electric tube package, puts in order), install first servo motor 21 on the mount pad 24, first servo motor 21's output shaft sets up down, and first servo motor 21's output shaft is connected with mounting panel 211 through axis of rotation 29, and mounting panel 211 is used for detachable connection substrate centre gripping frock 4, specifically can be provided with the screw hole on mounting panel 211, adopts bolted connection between mounting panel 211 and the substrate centre gripping frock 4, more specifically, installs roating seat 27 on the mount pad 24, be provided with central through-hole in the roating seat 27, axis of rotation 29 wears to establish in the central through-hole through bearing 25.
In order to limit the lower stroke of the substrate clamping tool 4, the lifting mechanism 2 further comprises a lower mechanical limit 26, a conductive slip ring rotation stopping member 28 and a conductive slip ring 33, the lower mechanical limit 26, the conductive slip ring rotation stopping member 28 and the conductive slip ring 33 are all mounted below the upper and lower dragging plate 22, the conductive slip ring 33 is sleeved on the rotating shaft 29 and is located between the rotating base 27 and the mounting plate 211, the conductive slip ring 33 is divided into an outer ring and an inner ring, the structure is similar to a bearing, 8 points are arranged between the inner ring and the outer ring, and the conductive slip ring rotation stopping member 28 is used for fixing the outer ring to keep the outer ring immovable.
The substrate clamping tool 4 is used for fixing and clamping the substrate 100, can clamp substrates 100 with different thick walls and shapes, and comprises a rack plating clamping tool 41 and a barrel plating clamping tool 42, wherein the rack plating clamping tool 41 is used for a rack plating process, and the barrel plating clamping tool 42 is used for a barrel plating process.
The rack plating clamping tool 41 comprises a pole piece 411 and a substrate pressing plate used for fixing the substrate 100, the upper portion of the pole piece 411 is connected with the mounting plate 211 through a bolt, the lower portion of the pole piece 411 is connected with the substrate pressing plate used for mounting the substrate 100, the substrate pressing plate comprises an annular rack plating pressing plate 412 and a copper plate 413, the copper plate 413 is connected with the pole piece 411 in a specific connection mode: the top of the copper plate 413 can be connected with the bottom of the pole piece 411, or one vertical side wall of the copper plate 413 can be connected with the pole piece 411, the other vertical side wall of the copper plate 413 is provided with a groove for placing the substrate 100, the annular rack plating pressing plate 412 can be connected with the copper plate 413 through a bolt for pressing the substrate 100, so that no wrinkle is generated when the ultrathin substrate 100 is used, different substrate pressing plates can be customized according to different shapes, sizes and thicknesses of the substrate 100, and the function of electroplating different substrates 100 is realized; the annular rack plating pressure plate 412 is made of PMMA.
Barrel-plating centre gripping frock 42 include with barrel-plating support column 421, copper bar 422 and barrel-plating electrode 424, the top and the mounting panel 211 of barrel-plating support column 421 pass through bolted connection, barrel-plating electrode 424 and copper bar 422 are all installed on barrel-plating support column 421, and the one end of copper bar 422 is connected with barrel-plating head 4241 on the barrel-plating electrode 424, barrel-plating electrode 424 is used for installing substrate 100.
Specifically, the method comprises the following steps: an electrode clamping groove 4211 for detachably placing a barrel-plating electrode 424 is formed in the barrel-plating supporting column 421, the barrel-plating electrode 424 is fixed in the clamping groove through an annular barrel-plating pressing plate 423, and the annular barrel-plating pressing plate 423 is connected with the barrel-plating supporting column 421 through bolts;
the barrel-plating electrode 424 comprises a groove-shaped structure with one end being an open end, substrate clamping grooves 4242 for placing the substrate 100 are symmetrically arranged on two vertically symmetrical side walls of the groove-shaped structure, a barrel-plating head 4241 is arranged at the top of the groove-shaped structure, and in the embodiment, the upper, lower, left and right sides of the barrel-plating electrode 424 are defined according to the open end of the barrel-plating electrode 424.
The substrate clamping groove 4242 of the embodiment can be used for placing substrates 100 with different shapes and thicknesses, both the front and back surfaces of the substrate 100 can be electroplated, and no dead angle exists; the barrel-plating clamping tool 42 can be used for electroplating circular and square substrates 100, and can also be customized according to the size of the substrate 100, and the barrel-plating support column 421 and the annular barrel-plating pressing plate 423 can be made of PMMA (polymethyl methacrylate) or PFA (poly fluoro alkoxy).
Plating bath 5 is used for the splendid attire plating solution, including water bath and inside groove, the inside groove is detachable installs in the water bath, specifically can be for clearance fit between the bottom of inside groove and the water bath, and water bath heating environment is formed to water bath and inside groove, and the water bath environment that the temperature is controllable is provided to the water bath promptly in the outside groove, and the inside groove is used for electroplating. The inner tank and the outer tank are separated and can be directly separated.
As shown in fig. 12, the outer tank is a square tank, the tank body is made of PMMA, and a stainless steel heater is disposed at the bottom of the square tank for heating the water in the tank body, so as to provide a proper plating temperature for the plating solution in the inner tank. A temperature sensor is arranged in the outer groove, and the heating temperature can be set on the touch screen of the cantilever operation box 3.
The inner tank body is made of PMMA (polymethyl methacrylate) or PFA (Polytetrafluoroethylene), the inner tank body is quickly fixed, and can be in clearance fit, so that the inner tank body is taken out to recover electroplating solution, clean the tank body and the like after electroplating is completed conveniently. The inner tank body is internally provided with a platinum electrode as an anode. The inner grooves are divided into two types, namely a rack plating inner groove and a barrel plating inner groove according to the process, and are respectively used for the rack plating process and the barrel plating process, and specifically, the inner grooves comprise a square groove matched with a rack plating clamping tool 41 and a circular groove matched with a barrel plating clamping tool 42.
The source manufacturing process of the embodiment comprises the following steps:
s1, installing a rack plating clamping tool 41 or a barrel plating clamping tool 42 on a lifting mechanism 2, and installing a substrate 100 on the rack plating clamping tool 41 or the barrel plating clamping tool 42;
s2, selecting an inner groove matched with the rack plating clamping tool 41 or the barrel plating clamping tool 42, installing the inner groove in an outer groove, injecting electroplating liquid into the inner groove, and connecting the electroplating bath 5 with a power supply;
and S3, controlling the lifting mechanism 2 to enable the rack plating clamping tool 41 or the barrel plating clamping tool 42 to move downwards, enabling the substrate 100 to be immersed in the electroplating solution, and electrifying to carry out electroplating.
The following are two specific application cases of this embodiment: rack plating examples and barrel plating examples.
The rack plating example:
and (3) installing a rack plating clamping tool 41 and an inner groove, installing a phi 30 copper substrate in a groove of a copper plate 413 of the rack plating clamping tool 41, tightly pressing an annular rack plating pressing plate 412 on the substrate, and fixing by adopting screws or bolts to finish the installation of the substrate 100.
Connecting the positive pole of an electroplating pulse power supply to a binding post of an electroplating bath 5 through a lead, wherein an electroplating anode is a metal piece with a platinum-plated surface and is soaked in electroplating solution; and the cathode of the electroplating pulse power supply is connected to a cathode binding post of the rack-plating clamping tool through a circuit.
1.5L of a nickel-63 plating solution was added to the inner tank, the liquid level being calculated to be greater than the substrate 100.
Set up through cantilever control box 3 and electroplate the parameter, include: the current is 0.5A, the electroplating time is 40min, the electroplating temperature is 40 ℃, and the motor descending speed is 10cm/min. And starting an electroplating program, and driving the rack plating clamping tool 41 to move downwards by a second servo motor 30 in the lifting mechanism 2 so as to immerse the substrate 100 into the electroplating solution. The electric current is switched on to start electroplating, and the generated radioactive aerosol is discharged into the radioactive special discharge pipeline through the vent pipe 8.
After the electroplating is finished, the second servo motor 30 drives the rack plating clamping tool 41 to move upwards, the substrate 100 is taken out after the second servo motor 30 stops, and the nickel-63 radioactive source is prepared.
Barrel plating example:
and (3) installing a barrel plating clamping tool 42 and an inner groove, and installing 5 phi 20 copper substrates on a substrate clamping groove 4242 of the barrel plating clamping tool 42.
Connecting the positive electrode of an electroplating pulse power supply to a binding post of an electroplating tank 5 through a lead, wherein the electroplating anode is a metal piece with a platinum-plated surface and is soaked in electroplating solution; and the cathode of the electroplating pulse power supply is connected to a cathode binding post of the barrel-plating clamping tool through a circuit.
0.5L of a nickel-63 plating solution was added to the inner tank at a liquid level calculated to be greater than the height of the substrate 100.
Set up through cantilever control box 3 and electroplate the parameter, include: the current is 0.3A, the electroplating time is 60min, the electroplating temperature is 30 ℃, the motor descending speed is 5cm/min, and the motor rotating speed is 20r/min. And starting an electroplating program, and driving the barrel plating clamping tool 42 to move downwards by the lifting mechanism 2 so as to immerse the substrate 100 in the electroplating solution. The barrel plating clamping tool 42 is driven by the first servo motor 21 to rotate. And the current is switched on to start electroplating, and the generated radioactive aerosol is discharged into a radioactive special discharge pipeline through a vent pipe 8.
After the electroplating is finished, the second servo motor 30 drives the barrel plating clamping tool 42 to move upwards, the substrate 100 is taken out after the second servo motor 30 stops, and the nickel-63 radioactive source is prepared.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A nickel-63 radioactive source preparation device is characterized by comprising a shielding box body (1), a lifting mechanism (2), a substrate clamping tool (4) and an electroplating bath (5), wherein the lifting mechanism (2), the substrate clamping tool and the electroplating bath are arranged in the shielding box body (1);
the lifting mechanism (2) is used for realizing the displacement of the substrate clamping tool (4) in the vertical direction;
the substrate clamping tool (4) comprises a rack plating clamping tool (41) and a barrel plating clamping tool (42), the rack plating clamping tool (41) comprises a pole piece (411) and a substrate pressing plate, the upper part of the pole piece (411) is detachably connected with the lifting mechanism (2), and the lower part of the pole piece (411) is connected with the substrate pressing plate for mounting the substrate (100); the barrel plating clamping tool (42) comprises a barrel plating supporting column (421), a copper bar (422) and a barrel plating electrode (424), the top of the barrel plating supporting column (421) is detachably connected with the lifting mechanism (2), the barrel plating electrode (424) and the copper bar (422) are both installed on the barrel plating supporting column (421), one end of the copper bar (422) is connected with a barrel plating head (4241) on the barrel plating electrode (424), and the barrel plating electrode (424) is used for installing a substrate (100);
the electroplating bath (5) comprises an outer bath and an inner bath, the inner bath is detachably installed in the outer bath, and the inner bath comprises a square bath matched with the rack plating clamping tool (41) and a circular bath matched with the barrel plating clamping tool (42).
2. The nickel-63 radioactive source preparation device according to claim 1, wherein the shielding box body (1) is made of shielding material, and the shielding box body (1) is provided with a glove box door (7); the shielding box body (1) is provided with a ventilation pipe (8).
3. The nickel-63 radioactive source preparation device according to claim 1, wherein the lifting mechanism (2) comprises a module mounting member (210), a first servo motor (21) and a second servo motor (30), a module mounting member (210) and an up-and-down moving carriage (22);
the module mounting part (210) is provided with a movable sliding table (32), the up-and-down moving carriage (22) is arranged on the movable sliding table (32) in a sliding manner, and the second servo motor (30) is arranged on the module mounting part (210) and used for driving the up-and-down moving carriage (22) to move on the movable sliding table (32);
the substrate clamping device is characterized in that a mounting seat (24) is arranged on the up-and-down moving planker (22), a first servo motor (21) is installed on the mounting seat (24), an output shaft of the first servo motor (21) is arranged downwards, an output shaft of the first servo motor (21) is connected with a mounting plate (211) through a rotating shaft (29), and the substrate clamping tool (4) is detachably connected with the mounting plate (211).
4. The nickel-63 radioactive source preparation device according to claim 3, wherein the mounting seat (24) is provided with a rotating seat (27), a central through hole is formed in the rotating seat (27), and the rotating shaft (29) is inserted into the central through hole through a bearing (25).
5. The nickel-63 radioactive source preparation device according to claim 3, wherein the lifting mechanism (2) further comprises a lower mechanical limit (26), a conductive slip ring rotation stop member (28) and a conductive slip ring (33), and the lower mechanical limit (26), the conductive slip ring rotation stop member (28) and the conductive slip ring (33) are all mounted below the upper and lower dragging plate (22).
6. The nickel-63 radioactive source preparation device according to claim 1, wherein the substrate pressing plate comprises an annular rack plating pressing plate (412) and a copper plate (413), the copper plate (413) is connected with the pole piece (411), one vertical side wall of the copper plate (413) is provided with a groove for placing the substrate (100), and the annular rack plating pressing plate (412) is detachably connected with the copper plate (413) and is used for pressing the substrate (100).
7. The nickel-63 radioactive source preparation device according to claim 1, wherein the barrel plating support column (421) is provided with an electrode slot (4211) for detachably placing a barrel plating electrode (424), and the barrel plating electrode (424) is fixed in the slot through an annular barrel plating pressing plate (423);
the barrel-plating electrode (424) comprises a groove-shaped structure with one end being an open end, substrate clamping grooves (4242) used for placing a substrate (100) are symmetrically formed in two vertical symmetrical side walls of the groove-shaped structure, and a barrel-plating head (4241) is arranged at the top of the groove-shaped structure.
8. The nickel-63 radioactive source preparation device according to any one of claims 1 to 7, further comprising a cantilever operation box (3), wherein the cantilever operation box (3) is mounted on the shielding box body (1) through a support rod, and the cantilever operation box (3) is used for controlling the lifting mechanism (2) and the plating bath (5).
9. The source preparation process of the nickel-63 radioactive source preparation device based on any one of claims 1 to 8, characterized by comprising the following steps:
s1, installing a rack plating clamping tool (41) or a barrel plating clamping tool (42) on a lifting mechanism (2), and installing a substrate (100) on the rack plating clamping tool (41) or the barrel plating clamping tool (42);
s2, selecting an inner groove matched with the rack plating clamping tool (41) or the barrel plating clamping tool (42) to be installed in the outer groove, injecting electroplating liquid into the inner groove, and connecting the electroplating bath (5) with a power supply;
and S3, controlling the lifting mechanism (2) to enable the rack plating clamping tool (41) or the barrel plating clamping tool (42) to move downwards, enabling the substrate (100) to be immersed in the electroplating solution, and electrifying to carry out electroplating.
10. Use of a nickel-63 radioactive source preparation apparatus as claimed in any one of claims 1 to 8 for preparing a galvanic coating on a substrate.
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| CN202211279659.6A CN115652393B (en) | 2022-10-19 | 2022-10-19 | Nickel-63 radioactive source preparation device, source preparation process and application |
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| CN115652393B (en) | 2024-07-19 |
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