CN115642394A

CN115642394A - Antenna module and communication equipment

Info

Publication number: CN115642394A
Application number: CN202110818158.XA
Authority: CN
Inventors: 钟永卫
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-07-19
Filing date: 2021-07-19
Publication date: 2023-01-24
Also published as: WO2023000824A1

Abstract

The application provides an antenna module and communication equipment. The antenna module includes: the antenna comprises a bearing plate, a first antenna array, a second antenna array and a radio frequency chip. The first antenna array is carried on the bearing plate; the second antenna array is supported on the supporting plate, wherein an angle formed by the main lobe direction of the first antenna array and the main lobe direction of the second antenna array in a three-dimensional space is greater than or equal to 45 degrees; the radio frequency chip is supported on the bearing plate or arranged on one side of the bearing plate, and the radio frequency chip is used for providing radio frequency signals to the first antenna array and the second antenna array. The antenna module of this application's communication effect is better.

Description

Antenna module and communication equipment

Technical Field

The application relates to the technical field of communication, in particular to an antenna module and communication equipment.

Background

With the development of communication technology, communication devices generally communicate with other communication devices to realize information interaction. An antenna module is typically included in a communication device to communicate with an antenna module of another communication device. However, in the related art, the performance of the antenna module for transmitting and receiving electromagnetic wave signals is not good, which results in the poor communication performance of the communication device.

Disclosure of Invention

A first aspect of an embodiment of the present application provides an antenna module, which includes:

a carrier plate;

a first antenna array carried on the carrier;

the second antenna array is borne on the bearing plate, wherein an angle formed by the main lobe direction of the first antenna array and the main lobe direction of the second antenna array in a three-dimensional space is greater than or equal to 45 degrees; and

the radio frequency chip is borne on the bearing plate and used for providing radio frequency signals to the first antenna array and the second antenna array.

A second aspect of embodiments of the present application provides a communication device, which includes the antenna module provided in the first aspect.

In the antenna module provided by the embodiment of the application, the angle formed by the main lobe direction of the first antenna array and the main lobe direction of the second antenna array in the three-dimensional space is greater than or equal to 45 degrees, so that the electromagnetic wave signals received and transmitted by the first antenna array and the electromagnetic wave signals received and transmitted by the second antenna array can cover different directions in the space and have a wider coverage range, the spatial coverage rate of the electromagnetic wave signals received and transmitted by the antenna module is improved, and the antenna module has a better communication effect.

In addition, in the antenna module provided by the embodiment of the application, one radio frequency chip is adopted to control the first antenna array and the second antenna array, so that compared with the case that the first antenna array and the second antenna array are both controlled by one radio frequency chip, one radio frequency chip can be saved, and the cost of the antenna module is reduced.

In addition, in the antenna module provided by the embodiment of the application, the first antenna array and the second antenna array are both supported on the same bearing plate, so that the antenna module is high in integration level, low in section and small in size. When the antenna module is applied to communication equipment, the antenna module is convenient to assemble with other devices in the communication equipment, and the integration level of the communication equipment is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an antenna module according to an embodiment of the present disclosure.

Fig. 2 is a cross-sectional view of a portion of the antenna module shown in fig. 1 along the line I-I.

Fig. 3 is a top view of a first antenna in the first antenna array of fig. 1.

Fig. 4 is a perspective view of the first antenna in fig. 3.

Fig. 5 is a schematic view of fig. 4 with the first conductive layer removed.

Fig. 6 is a schematic cross-sectional view of the first antenna shown in fig. 3 along II-II according to an embodiment of the present application.

Fig. 7 is a schematic cross-sectional view of the first antenna shown in fig. 3 along II-II according to another embodiment of the present application.

Fig. 8 is a schematic cross-sectional view of the first antenna shown in fig. 3 along II-II according to still another embodiment of the present application.

Fig. 9 is a top view of a first antenna according to another embodiment of the present application.

Fig. 10 is a perspective view of the first antenna shown in fig. 9.

Fig. 11 is a partial structural schematic diagram of the first antenna shown in fig. 10.

Fig. 12 is a cross-sectional view taken along line IV-IV of fig. 9.

Fig. 13 is a schematic cross-sectional view illustrating a structure of a first antenna according to an embodiment of the present application.

Fig. 14 is a schematic cross-sectional view illustrating a structure of a first antenna according to another embodiment of the present application.

Fig. 15 is a cross-sectional view of an antenna module according to another embodiment of the present application taken along the line I-I.

Fig. 16 is a cross-sectional view of an antenna module according to still another embodiment of the present disclosure taken along the line I-I.

Fig. 17 is a schematic structural view of the first power feeding line shown in fig. 5.

Fig. 18 is a schematic structural view of the second power feeding line shown in fig. 5.

Fig. 19 is a schematic diagram of a communication device according to an embodiment of the present application.

Fig. 20 isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A of fig. 19.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present disclosure.

Reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment or implementation can be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Furthermore, it should be noted that the terms "first", "second", and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing different objects and are not used for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions.

Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic structural diagram of an antenna module according to an embodiment of the present application; fig. 2 is a cross-sectional view of a portion of the antenna module shown in fig. 1 along the line I-I. The present embodiment provides an antenna module 10. The antenna module 10 includes a carrier 110, a first antenna array 120, a second antenna array 130, and an rf chip 140. The first antenna array 120 is supported on the carrier 110. The second antenna array 130 is supported on the supporting board 110, wherein an angle formed between the main lobe direction of the first antenna array 120 and the main lobe direction of the second antenna array 130 in a three-dimensional space is greater than or equal to 45 °. The rf chip 140 is supported on the carrier 110 or disposed at one side of the carrier 110, and the rf chip 140 is used for providing an rf signal to the first antenna array 120 and the second antenna array 130.

It should be noted that, since there are many connection lines in the first antenna array 120, only some of the connection lines are illustrated in fig. 2.

The carrier plate 110 may be, but not limited to, a Circuit Board (PCB) prepared by a printing process or a Board prepared by a High Density Interconnection (HDI) process. When the carrier plate 110 is a printed circuit board, the carrier plate 110 may be, but not limited to, a motherboard or a stacked board.

The first antenna array 120 is supported in the carrier 110, and may be, but not limited to, embedded in the carrier 110, or disposed on a surface of the carrier 110. The second antenna array 130 is carried in the carrier 110, and may be, but not limited to, embedded in the carrier 110, or disposed on the surface of the carrier 110. The embodiment of the present invention will be described with reference to the following embodiments, wherein the first antenna array 120 and the second antenna array 130 are carried in the carrier 110.

The material of the first antenna array 120 may be, but is not limited to, a metal or a non-metal conductive material; when the first antenna array 120 is made of a non-metallic conductive material, the first antenna array 120 may be opaque or transparent. Accordingly, the material of the second antenna array 130 may be, but is not limited to, a metal or a non-metal conductive material; when the second antenna array 130 is made of a non-metallic conductive material, the second antenna array 130 may be opaque or transparent. The material of the first antenna array 120 and the material of the second antenna array 130 may be the same or different.

In this embodiment, the first antenna array 120 is a directional antenna array, and the second antenna array 130 is a directional antenna array. For example, the first antenna array 120 may be, but not limited to, a horn antenna array, a patch antenna array, a dipole antenna array, etc. The second antenna array 130 may be, but is not limited to, a horn antenna array, a patch antenna array, a dipole antenna array, etc. The directional antenna array is easier to integrate on the carrier plate 110.

The rf chip 140 is configured to provide rf signals to the first antenna array 110, and includes that the rf chip 140 is directly connected to the first antenna array 110, or the rf chip 140 is coupled to the first antenna array 110. Accordingly, the rf chip 140 is configured to provide an rf signal to the second antenna array 120, and includes that the rf chip 140 is directly connected to the second antenna array 120, or the rf chip 140 is coupled to the second antenna array 120. The frequency band of the rf signal provided by the rf chip 140 to the first antenna array 110 may be the same as or different from the frequency band of the rf signal provided to the second antenna array 120, and is not limited herein.

The directional pattern of an antenna generally has two or more lobes, wherein the lobe with the highest radiation intensity is called a main lobe, the remaining lobes are called side lobes or side lobes, and the side lobe opposite to the main lobe is called a back lobe. In other words, the main lobe refers to the maximum radiation beam located on the antenna's pattern. The main lobe direction thus refers to the direction of the largest radiation beam on the antenna's pattern.

An angle formed by the main lobe direction of the first antenna array 120 and the main lobe direction of the second antenna array 130 in a three-dimensional space is greater than or equal to 45 °. For example, in one embodiment, the main lobe direction of the first antenna array 120 is towards the left, the main lobe direction of the second antenna array 130 is towards the top, and the angle between the main lobe direction of the first antenna array 120 and the main lobe direction of the second antenna array 130 is 90 °. In another embodiment, the main lobe direction of the first antenna array 120 is towards the left, the main lobe direction of the second antenna array 130 is towards the right, and the angle between the main lobe direction of the first antenna array 120 and the main lobe direction of the second antenna array 130 is 180 °. In another embodiment, the main lobe direction of the first antenna array 120 is towards the left, the main lobe direction of the second antenna array 130 is towards the bottom, and the angle between the main lobe direction of the first antenna array 120 and the main lobe direction of the second antenna array 130 is 90 °.

In one embodiment, the frequency band of the electromagnetic wave signals transmitted and received by the first antenna array 120 is the same as the frequency band of the electromagnetic wave signals transmitted and received by the second antenna array 130. In another embodiment, the frequency band of the electromagnetic wave signals transmitted and received by the first antenna array 120 is different from the frequency band of the electromagnetic wave signals transmitted and received by the second antenna array 130. For example, due to the limitation of the size of the carrier board 110, the size of one radiator array is limited, so that the frequency band of the electromagnetic wave signals received and transmitted by the first antenna array 120 is different from the frequency band of the electromagnetic wave signals received and transmitted by the second antenna array 130. In addition, even if the size of the supporting board 110 is not limited, the frequency bands of the electromagnetic wave signals received and transmitted by the first antenna array 120 and the second antenna array 130 in the antenna module 10 can be designed according to requirements, so that the frequency bands of the electromagnetic wave signals received and transmitted by the first antenna array 120 are different from the frequency bands of the electromagnetic wave signals received and transmitted by the second antenna array 130.

In the following embodiments, the first antenna array 120 is taken as a feedhorn array and the second antenna array 130 is taken as a patch antenna array, but the present application should not be construed as limiting the antenna module 10.

In this embodiment, the first antenna array 120 may receive electromagnetic wave signals, or may radiate electromagnetic wave signals. That is, the first antenna array 120 can transmit and receive electromagnetic wave signals. In one embodiment, the first antenna array 120 may receive electromagnetic wave signals and may radiate electromagnetic wave signals. Accordingly, in other embodiments, the second antenna array 130 may receive electromagnetic wave signals and may also radiate electromagnetic wave signals. In other words, the second antenna array 130 is capable of transceiving electromagnetic wave signals.

The electromagnetic wave signals transmitted and received by the first antenna array 120 and the second antenna array 130 may be, but are not limited to, electromagnetic wave signals supported by fourth generation mobile communication technology (4 th generation wireless systems, 4g), electromagnetic wave signals supported by fifth generation mobile communication technology (5 th generation wireless systems, 5g), and the like. The frequency bands of the electromagnetic wave signals transmitted and received by the first antenna array 120 and the second antenna array 130 should not be construed as limiting the antenna module 10 according to the present embodiment. The signals transmitted and received by the first antenna array 120 and the second antenna array 130 may be, but not limited to, radio frequency signals in the millimeter wave band or terahertz band. Currently, in 5G, according to the specification of the 3gpp TS 38.101 protocol, a New Radio (NR) of 5G mainly uses two sections of frequencies: the FR1 band and the FR2 band. Wherein the frequency range of the FR1 frequency band is 450 MHz-6 GHz, which is called as sub-6GHz frequency band; the frequency range of the FR2 frequency band is 24.25GHz to 52.6GHz, and belongs to a millimeter Wave (mm Wave) frequency band. The 3gpp Release 15 specification specifies that the current 5G millimeter wave frequency band includes: n257 (26.5 to 29.5 GHz), n258 (24.25 to 27.5 GHz), n261 (27.5 to 28.35 GHz) and n260 (37 to 40 GHz).

In the antenna module 10 provided in the embodiment of the present application, an angle formed between the main lobe direction of the first antenna array 120 and the main lobe direction of the second antenna array 130 in a three-dimensional space is greater than or equal to 45 °, so that the electromagnetic wave signals received and transmitted by the first antenna array 120 and the electromagnetic wave signals received and transmitted by the second antenna array 130 can cover different directions in the space and cover a wider range, the spatial coverage of the electromagnetic wave signals received and transmitted by the antenna module 10 is improved, and the antenna module 10 has a better communication effect.

In addition, in the antenna module 10 provided in the embodiment of the present application, one rf chip 140 is used to control the first antenna array 120 and the second antenna array 130, which can save one rf chip and reduce the cost of the antenna module 10 compared to the case where one rf chip is used to control both the first antenna array 120 and the second antenna array 130.

In addition, in the antenna module 10 provided in the embodiment of the present invention, the first antenna array 120 and the second antenna array 130 are both supported on the same supporting board 110, so that the antenna module 10 has a higher integration level, a lower profile, and a smaller volume. When the antenna module 10 is applied to the communication device 1, the assembly is simple and is convenient to assemble with other devices in the communication device 1, which is beneficial to improving the integration level of the communication device 1.

Further, in the present embodiment, the carrier plate 110 includes a first surface 110a and a second surface 110b. The first surface 110a faces a first direction d1, the second surface 110b is connected to and intersects with the first surface 110a, and the second surface 110b faces a second direction d2, wherein a main lobe direction of the first antenna array 120 is the first direction d1, and a main lobe direction of the second antenna array 130 is the second direction d2.

In the present embodiment, the carrier plate 110 is illustrated as a rectangular parallelepiped or a similar rectangular parallelepiped. The first surface 110a may be any one of the surfaces of the loading plate 110, the second surface 110b is one of the surfaces of the loading plate 110, and the second surface 110b is connected to and intersects with the first surface 110 a. In the present embodiment, the first surface 110a is taken as an example of the left side surface of the carrier plate 110, and the second surface 110b is taken as an example of the upper surface of the carrier plate 110.

The main lobe direction of the first antenna array 120 is the same as the orientation of the first surface 110a, and the main lobe direction of the second antenna array 130 is the same as the orientation of the second surface 110b, which can facilitate the arrangement of the first antenna array 120 and the second antenna array 130 on the carrier plate 110. In addition, the orientation of the first antenna array 120 and the orientation of the second antenna array 130 also enable the electromagnetic wave signals radiated by the first antenna array 120 and the electromagnetic wave signals radiated by the second antenna array 130 to cover different directions in a space, so that the antenna module 10 has a higher spatial coverage rate, and further the antenna module 10 has a better communication effect.

In one embodiment, the first direction d1 is perpendicular or approximately perpendicular to the second direction d2. That is, the first surface 110a intersects the second surface 110b and forms an angle of 90 ° or approximately 90 °. When the first direction d1 is perpendicular to the second direction d2, an intersecting area of the electromagnetic wave signals received and transmitted by the first antenna array 120 and the electromagnetic wave signals received and transmitted by the second antenna array 130 is smaller, so that an area covered by the electromagnetic wave signals received and transmitted by the antenna module 10 is larger, that is, the antenna module 10 has a higher spatial coverage rate, and further the antenna module 10 has a better communication effect.

Referring to fig. 1, fig. 3, fig. 4, fig. 5 and fig. 6, fig. 3 is a top view of a first antenna in the first antenna array of fig. 1; fig. 4 is a perspective view of the first antenna in fig. 3; FIG. 5 is the schematic view of FIG. 4 with the first conductive layer removed; fig. 6 is a schematic cross-sectional view of the first antenna shown in fig. 3 along II-II according to an embodiment of the present application. In this embodiment, for the sake of convenience in showing the positional relationship among the first conductive layer 111, the second conductive layer 112, the plurality of third conductive layers 113, and the plurality of fourth conductive layers 114, the plurality of first insulating layers 115 and the plurality of second insulating layers 116 are omitted in fig. 4 and 5. The first antenna array 120 includes a plurality of first antennas 121. Specifically, the plurality of first antennas 121 are spaced and regularly arranged to form the first antenna array 120. The second antenna array 130 includes a plurality of second antennas 131. Specifically, the plurality of second antennas 131 are arranged at intervals and regularly to form the second antenna array 130. The carrier plate 110 includes a first conductive layer 111, a second conductive layer 112, a plurality of third conductive layers 113, a plurality of first insulating layers 115, a plurality of fourth conductive layers 114, and a plurality of second insulating layers 116. The second conductive layer 112 is opposite to the first conductive layer 111 and is disposed at an interval. The plurality of third conductive layers 113 are sequentially stacked along the first extending direction D1 and disposed at intervals between the first conductive layer 111 and the second conductive layer 112. The first insulating layer 115 is disposed between the first conductive layer 111 and the plurality of third conductive layers 113, between the second conductive layer 112 and the plurality of third conductive layers 113, and between two adjacent third conductive layers 113. The plurality of fourth conductive layers 114 are sequentially stacked along a first extending direction D1 and disposed at intervals between the first conductive layer 111 and the second conductive layer 112, and the plurality of fourth conductive layers 114 and the plurality of third conductive layers 113 are disposed at intervals along a second extending direction D2. The second insulating layer 116 is disposed between the first conductive layer 111 and the fourth conductive layer 114 closest to the first conductive layer 111, between the second conductive layer 112 and the fourth conductive layer 114 closest to the second conductive layer 112, and between two adjacent fourth conductive layers 114.

In this embodiment, the second conductive layers 112 and the first conductive layers 111 are arranged at intervals along the first extending direction D1.

Referring to fig. 4 and 6, in the present embodiment, the first extending direction D1 is a positive direction of the Z axis, and the second extending direction D2 is a positive direction of the Y axis. It should be understood that the above reference to the first extending direction D1 and the second extending direction in the XYZ coordinate axes is only a description of the case of the first extending direction D1 and the second extending direction D2, and is for convenience of understanding the present application and does not limit the present application, and it should be understood that in other embodiments, the first extending direction D1 may be a positive direction of the Z axis, and the second extending direction D2 may be a positive direction of the X axis; or, the first extending direction D1 is a positive direction of the X axis, and the second extending direction D2 is a positive direction of the Y axis; as long as it is satisfied that the first extending direction D1 and the second extending direction D2 are different.

The plurality of third conductive layers 113 are disposed between the first conductive layer 111 and the second conductive layer 112 as a whole, and the plurality of third conductive layers 113 are sequentially stacked and disposed at intervals in the first extending direction D1. It is understood that the first conductive layer 111 is spaced apart from the third conductive layer 113 of the plurality of third conductive layers 113 that is closest to the first conductive layer 111. That is, in this embodiment mode, the third conductive layer 113 located at the topmost layer is provided at a distance from the first conductive layer 111. The second conductive layer 112 is disposed at a distance from a third conductive layer 113, which is closest to the second conductive layer 112, among the plurality of third conductive layers 113. A first insulating layer 115 is provided between the first conductive layer 111 and the plurality of third conductive layers 113 (see fig. 6 and 7), in other words, the first insulating layer 115 is provided between the first conductive layer 111 and the third conductive layer 113 which is closest to the first conductive layer 111 among the plurality of third conductive layers 113. The first insulating layer 115 is also disposed between two adjacent third conductive layers 113 among the plurality of third conductive layers 113. A first insulating layer 115 is provided between the second conductive layer 112 and the plurality of third conductive layers 113, in other words, the first insulating layer 115 is provided between the second conductive layer 112 and the third conductive layer 113 of the plurality of third conductive layers 113 that is closest to the second conductive layer 112.

The plurality of fourth conductive layers 114 are disposed between the first conductive layer 111 and the second conductive layer 112 as a whole, and the plurality of fourth conductive layers 114 are sequentially stacked and disposed at intervals in the first extending direction D1. It is to be understood that the first conductive layer 111 is spaced apart from a fourth conductive layer 114, which is closest to the first conductive layer 111, among the plurality of fourth conductive layers 114. The second conductive layer 112 is spaced apart from a fourth conductive layer 114 of the plurality of fourth conductive layers 114 that is closest to the second conductive layer 112. Specifically, a second insulating layer 116 is provided between the first conductive layer 111 and the plurality of fourth conductive layers 114 (see fig. 6 and 7), in other words, the second insulating layer 116 is provided between the first conductive layer 111 and a fourth conductive layer 114, which is closest to the first conductive layer 111, of the plurality of fourth conductive layers 114. The second insulating layer 116 is also disposed between two adjacent fourth conductive layers 114 of the plurality of fourth conductive layers 114. A second insulating layer 116 is disposed between the second conductive layer 112 and the plurality of fourth conductive layers 114, in other words, the second insulating layer 116 is disposed between the second conductive layer 112 and a fourth conductive layer 114, which is closest to the second conductive layer 112, of the plurality of fourth conductive layers 114.

The first insulating layer 115 may be made of a material with a low Dissipation Factor (DF), so that the first insulating layer 115 has a small influence on the first antenna array 120 for receiving and transmitting electromagnetic wave signals; the thicknesses of the first insulating layers 115 may be equal or different. For example, the dissipation factor DF of the first insulating layer 115 may be, but is not limited to, DF =0.004; the thickness of the first insulating layer 115 may be, but is not limited to, 0.40mm to 0.45mm.

The Loss factor is a ratio of energy lost (Loss) to the insulating material in the signal line to energy still present (Stored) in the signal line. DF is an inherent property of insulating materials. The smaller the loss factor is, the smaller the ratio of the energy leaked into the insulating material in the signal wire to the energy still existing in the signal wire is; the greater the loss factor, the greater the ratio of the energy lost to the insulating material in the signal line to the energy still present in the signal line. Therefore, the smaller the DF is, the better the transmission performance of the signal line in the material is, and the smaller the proportion of the leaked energy is; conversely, the worse the performance of the signal line in transmitting in materials with larger DF, the greater the proportion of energy lost.

Correspondingly, the second insulating layer 116 may also be made of a material with a low loss factor DF, so that the second insulating layer 116 has a small influence on the second antenna array 130 for receiving and transmitting electromagnetic wave signals; the thicknesses of the second insulating layers 116 may be equal or different. For example, the loss factor DF of the second insulating layer 116 may be, but is not limited to, DF =0.004; the thickness of the second insulating layer 116 may be, but is not limited to, 0.40mm to 0.45mm. The thickness of the second insulating layer 116 may be equal to or different from the thickness of the first insulating layer 115. In this embodiment, taking the example that the thickness of the second insulating layer 116 is equal to the thickness of the first insulating layer 115, when the thickness of the second insulating layer 116 is equal to the thickness of the first insulating layer 115, the preparation of the carrier plate 110 is facilitated.

The distance between the plurality of third conductive layers 113 and the plurality of fourth conductive layers 114 in the second extending direction D2 gradually decreases from the end adjacent to the first surface 110a to the end away from the first surface 110a, and then keeps a predetermined distance, so as to form a structure similar to a horn. The first antenna 121 includes the first conductive layer 111, the second conductive layer 112, the plurality of third conductive layers 113, the plurality of fourth conductive layers 114, a plurality of first connection lines 1211 and a plurality of second connection lines 1212. The first connecting lines 1211 are electrically connected to the first conductive layer 111, the plurality of third conductive layers 113, and the second conductive layer 112, and the first connecting lines 1211 are disposed at intervals. The plurality of second connection lines 1212 are opposite to the plurality of first connection lines 1211 and are disposed at intervals, the second connection lines 1212 are used for electrically connecting the first conductive layer 111, the plurality of fourth conductive layers 114, and the second conductive layer 112, and the plurality of second connection lines 1212 are disposed at intervals.

Specifically, in one embodiment, through holes are opened on the plurality of first insulating layers 115, and the first connecting line 1211 is disposed in the through holes in the plurality of first insulating layers 115 to electrically connect the conductive layers on both sides of the first insulating layers 115. Specifically, the first conductive layer 111 and the top third conductive layer 113 (i.e., the third conductive layer 113 nearest to the first conductive layer 111) are respectively located at two sides of the top first insulating layer 115, and then the first connecting line 1211 located in the top first insulating layer 115 electrically connects the first conductive layer 111 and the third conductive layer 113 nearest to the first conductive layer 111; the third conductive layer 113 (i.e., the third conductive layer 113 closest to the second conductive layer 112) and the second conductive layer 112 are respectively located at two sides of the first insulating layer 115, and then the first connection line 1211 located in the first insulating layer 115 electrically connects the third conductive layer 113 and the second conductive layer 112; both sides of the first insulating layer 115 located in the middle layer are the third conductive layers 113, and the first connection lines 1211 located in the first insulating layer 115 located in the middle layer electrically connect the third conductive layers 113 located in both sides, respectively. It is to be understood that, in the present embodiment, the first conductive layer 111 is located at the top layer and the second conductive layer 112 is located at the bottom layer as an example, and the positional relationship between the conductive layers (the first conductive layer 111, the second conductive layer 112, and the third conductive layer 113) and the first insulating layer 115 may also change according to the different placement positions of the antenna module 10.

In another embodiment, the first insulating layer 115 is formed with a through hole, the plurality of third conductive layers 113 are formed with a through hole, the first conductive layer 111 and the second conductive layer 112 are not formed with a through hole, the through hole of the first insulating layer 115 is communicated with the through hole of the third conductive layer 113, and the first connecting line 1211 is disposed in the through hole of the first insulating layer 115 and the through hole of the third conductive layer 113. In another embodiment, the first insulating layer 115 is formed with a through hole, the plurality of third conductive layers 113 are formed with a through hole, at least one of the first conductive layer 111 and the second conductive layer 112 is formed with a through hole, the through hole of the first insulating layer 115, the through hole of the third conductive layer 113, and the through holes of the first conductive layer 111 and the second conductive layer 112 are connected, and the first connecting line 1211 is disposed in the through hole of the first insulating layer 115, the through hole of the third conductive layer 113, and the through hole of the at least one of the first conductive layer 111 and the second conductive layer 112. As long as the first connecting line 1211 electrically connects the first conductive layer 111, the plurality of third conductive layers 113, and the second conductive layer 112.

The extending direction of the first connecting lines 1211 is the first extending direction D1, and the arrangement direction of the first connecting lines 1211 is arranged at intervals in a plane including the second extending direction D2.

Accordingly, in an embodiment, through holes are opened on the plurality of second insulating layers 116, and the second connecting wires 1212 are disposed in the through holes in the plurality of second insulating layers 116 to electrically connect the conductive layers on both sides of the second insulating layers 116. Specifically, the first conductive layer 111 and the fourth conductive layer 114 on the top layer (i.e. the fourth conductive layer 114 closest to the first conductive layer 111) are respectively located at two sides of the second insulating layer 116 on the top layer, and then the second connection line 1212 located in the second insulating layer 116 on the top layer electrically connects the first conductive layer 111 and the fourth conductive layer 114 closest to the first conductive layer 111; the fourth conductive layer 114 (i.e., the fourth conductive layer 114 closest to the second conductive layer 112) and the second conductive layer 112 are respectively located at two sides of the first insulating layer 115, and then the second connection line 1212 located in the second insulating layer 116 electrically connects the fourth conductive layer 114 and the second conductive layer 112; the fourth conductive layers 114 are located on both sides of the middle second insulating layer 116, and the second connecting lines 1212 located in the middle second insulating layer 116 electrically connect the fourth conductive layers 114 on both sides, respectively. It is to be understood that, in the present embodiment, the first conductive layer 111 is located at the top layer and the second conductive layer 112 is located at the bottom layer, and the positional relationship between the conductive layers (the first conductive layer 111, the second conductive layer 112, and the third conductive layer 113) and the second insulating layer 116 may also be changed according to the different placement positions of the antenna module 10.

In another embodiment, the second insulating layer 116 is formed with a through hole, the plurality of fourth conductive layers 114 are formed with a through hole, the first conductive layer 111 and the second conductive layer 112 are not formed with a through hole, the through hole of the second insulating layer 116 is communicated with the through hole of the fourth conductive layer 114, and the second connecting wire 1212 is disposed in the through hole of the second insulating layer 116 and the through hole of the fourth conductive layer 114. In another embodiment, the second insulating layer 116 is formed with a through hole, the plurality of fourth conductive layers 114 are formed with a through hole, at least one of the first conductive layer 111 and the second conductive layer 112 is formed with a through hole, the through hole in the second insulating layer 116, the through hole in the fourth conductive layer 114, and the through holes in the first conductive layer 111 and the second conductive layer 112 are connected, and the second connecting wire 1212 is disposed in the through hole in the second insulating layer 116, the through hole in the fourth conductive layer 114, and the through hole in at least one of the first conductive layer 111 and the second conductive layer 112. As long as the second connection line 1212 electrically connects the first conductive layer 111, the plurality of fourth conductive layers 114, and the second conductive layer 112.

The extending direction of the plurality of second connecting lines 1212 is the first extending direction D1, and the arrangement direction of the plurality of second connecting lines 1212 is arranged at intervals in a plane including the second extending direction D2.

In this embodiment, the first connecting lines 1211 are electrically connected to the first conductive layer 111, the third conductive layer 113, and the second conductive layer 112, that is, the first connecting lines 1211 are embedded in the carrier substrate 110; accordingly, the second connecting wires 1212 are electrically connected to the first conductive layer 111, the plurality of fourth conductive layers 114 and the second conductive layer 112, that is, the second connecting wires 1212 are embedded in the carrier board 110. Therefore, compared with the way of attaching a discrete radiator to the carrier plate 110, the radiator of the first antenna 121 in the embodiment of the present application is integrated in the carrier plate 110, so that the profile height of the carrier plate 110 can be reduced, that is, the height of the carrier plate 110 in the first extending direction D1 is smaller, and in addition, the cost can be reduced, and the production speed is increased.

In one embodiment, at least one first insulating layer 115 is connected to a second insulating layer 116 located on the same layer. In other words, at least one first insulating layer 115 is connected with the second insulating layer 116 located on the same layer as the first insulating layer 115, so that the connected first insulating layer 115 and second insulating layer 116 can also be regarded as a whole insulating layer. The at least one first insulating layer 115 is connected to the second insulating layer 116 on the same layer, so that the carrier plate 110 has a strong structural strength.

Referring to fig. 6, in the present embodiment, each of the first insulating layers 115 is connected to each of the second insulating layers 116. Each first insulating layer 115 is connected to each second insulating layer 116, and it is understood that the nth first insulating layer 115 and the nth second insulating layer 116 are connected as a whole, and the connected first insulating layer 115 and second insulating layer 116 can be regarded as a whole insulating layer. Each first insulating layer 115 is connected to each second insulating layer 116, so that the structural strength of the carrier plate 110 can be further enhanced.

The first layer of the first insulating layer 115 is connected to the first layer of the second insulating layer 116; and/or, the last layer of the first insulating layer 115 is connected with the last layer of the second insulating layer 116; the remaining layers of the first insulating layer 115 are disposed at intervals opposite to the second insulating layer 116. In the present embodiment, please refer to fig. 7 together, wherein fig. 7 is a schematic cross-sectional view of the first antenna shown in fig. 3 along II-II according to another embodiment of the present application. A first insulating layer 115 and a first second insulating layer 116 are connected in the stacking direction of the third conductive layer 113; the last layer of the first insulating layer 115 is connected to the last layer of the second insulating layer 116; the first insulating layer 115 of the remaining layers is disposed opposite to and spaced apart from the second insulating layer 116. In other words, the remaining layers of the first insulating layer 115 and the second insulating layer 116 are not connected together.

In the antenna module 10 provided in this embodiment, the weight of the carrier plate 110 is light, which facilitates the thinning of the antenna module 10.

Referring to fig. 8, fig. 8 is a schematic cross-sectional view of the first antenna shown in fig. 3 taken along the direction II-II according to another embodiment of the present disclosure. In this embodiment mode, in the stacking direction of the plurality of third conductive layers 113, the first insulating layer 115 is connected to the first insulating layer 116; the last layer of the first insulating layer 115 is not connected to the last layer of the second insulating layer 116; the remaining layers of the first insulating layer 115 are disposed at intervals opposite to the second insulating layer 116.

Referring to fig. 9, fig. 10, fig. 11, and fig. 12, fig. 9 is a top view of a first antenna according to another embodiment of the present disclosure; fig. 10 is a perspective view of the first antenna shown in fig. 9; fig. 11 is a partial structural schematic diagram of the first antenna shown in fig. 10; fig. 12 is a cross-sectional view taken along line IV-IV of fig. 9. For convenience of illustration of the respective conductive layers in the first antenna 110, the insulating layers between the respective conductive layers are omitted in fig. 9. The second antenna in fig. 10 is a schematic diagram of the second antenna in fig. 9 with the first conductive layer and the corresponding connecting lines removed. In this embodiment, the carrier plate 110 includes a first conductive layer 111, a second conductive layer 112, and a first insulating layer 115. The second conductive layer 112 is opposite to the first conductive layer 111 and is disposed at an interval. The first insulating layer 115 is disposed between the first conductive layer 111 and the second conductive layer 112. The first antenna array 120 includes a plurality of first antennas 121. The plurality of first antennas 121 are spaced and regularly arranged to form the first antenna array 120. The first antenna 121 includes a plurality of first connection lines 1211 and a plurality of second connection lines 1212. The first connecting lines 1211 are electrically connected to the first conductive layer 111 and the second conductive layer 112, and the first connecting lines 1211 are disposed at intervals. The plurality of second connecting lines 1212 are opposite to the plurality of first connecting lines 1211 and are spaced apart from each other to form a gap 121a, the second connecting lines 1212 are used for electrically connecting the first conductive layer 111 and the second conductive layer 112, and the plurality of second connecting lines 1212 are spaced apart from each other.

Referring to fig. 13, fig. 13 is a schematic cross-sectional view of a first antenna structure according to an embodiment of the present disclosure. The first antenna 121 according to this embodiment is substantially the same as the first antenna 121 shown in fig. 6, except that the first insulating layer 115 includes a first insulating portion 1151 and a second insulating portion 1152. The second insulating portion 1152 is connected to the first insulating portion 1151, and the first connection line 1211 passes through the second insulating portion 1152, wherein the second insulating portion 1152 has an electromagnetic characteristic superior to that of the first insulating portion 1151.

It is to be understood that, in the present embodiment, the first insulating layer 115 of the present embodiment including the first insulating portion 1151 and the second insulating portion 1152 is exemplified to be incorporated into the first antenna 121 shown in fig. 6, but should not be construed as limiting the first antenna 121 to which the first insulating layer 115 is applied in the present application.

In this embodiment, since the electromagnetic characteristics of the second insulating portion 1152 are better than the electromagnetic characteristics of the first insulating portion 1151, the radiation efficiency and the bandwidth of the electromagnetic wave signals transmitted and received by the first antenna 121 in the second insulating portion 1152 are better than the radiation efficiency and the bandwidth of the electromagnetic wave signals transmitted and received by the first antenna 121 in the first insulating portion 1151.

Wherein the electromagnetic properties include at least a loss factor (DF) and a dielectric constant (DK). In this embodiment, DF of the second insulating portion 1152 is smaller than DF of the first insulating portion 1151.

In a case where the dielectric constants of the first insulating portion 1151 and the second insulating portion 1152 are constant (e.g., equal), DF of the second insulating portion 1152 is smaller than DF of the first insulating portion 1151, which indicates that the electromagnetic performance of the second insulating portion 1152 is better than that of the first insulating portion 1151. For convenience of description, DF of the first insulating portion 1151 is named DF1, and DF of the second insulating portion 1152 is named DF2. Compared to the case where DF of the first insulating layer 115 is DF1, in the present embodiment, when DF2 is smaller than DF1, the loss of the signal transmitted on the first connection line 1211 is smaller, and when the rf chip 140 receives and transmits the electromagnetic wave signal through the first connection line 1211, the transmission power required by the rf chip 140 is smaller when the distance of transmission of the electromagnetic wave signal is fixed; if the power emitted by the rf chip 140 is constant, the transmission distance of the electromagnetic wave signal emitted by the rf chip 140 is long. Compared to the case where DF of the first insulating layer 115 is DF2, DF of the first insulating portion 1151 is DF1, and DF of the second insulating portion 1152 is DF2, which can reduce the cost of the carrier plate 110.

In the case where the loss factors of the first insulating portion 1151 and the second insulating portion 1152 are constant (for example, equal), if it is not necessary to miniaturize the antenna module 10 with a high dielectric constant, the smaller DK, the better the electromagnetic performance, that is, the smaller DK, and both the radiation efficiency and the bandwidth of the antenna module 10 are larger. Accordingly, under the condition that the loss factors of the first insulating portion 1151 and the second insulating portion 1152 are constant (for example, equal), if the design space of the antenna module 10 is not large enough, a material with a high DK is required to achieve miniaturization of the antenna module 10, and the DK needs to have a high dielectric constant under the condition of satisfying the radiation efficiency and bandwidth of the electromagnetic wave signals received and transmitted by the antenna module 10. However, the greater the DK, the lower the radiation efficiency and bandwidth of the antenna module 10. In this embodiment, the second insulating portion 1152 has an electromagnetic characteristic superior to that of the first insulating portion 1151, and includes: the DK of the second insulator 1152 is smaller than the DK of the first insulator 1151.

Referring to fig. 14, fig. 14 is a cross-sectional view of a first antenna according to another embodiment of the present disclosure. In this embodiment, when the carrier board 110 includes the second insulating layer 116, the second insulating layer 116 includes a third insulating portion 1161 and a fourth insulating portion 1162. The fourth insulation part 1162 is connected to the third insulation part 1161, and the second connection line 1212 passes through the fourth insulation part 1162, wherein the electromagnetic characteristics of the fourth insulation part 1162 are better than those of the third insulation part 1161.

In this embodiment, if the electromagnetic property of the fourth insulating portion 1162 is better than the electromagnetic property of the third insulating portion 1161, the radiation efficiency and the bandwidth of the electromagnetic wave signal transmitted and received by the first antenna 121 in the fourth insulating portion 116 are better than the radiation efficiency and the bandwidth of the electromagnetic wave signal transmitted and received by the first antenna 121 in the third insulating portion 1161.

Wherein the electromagnetic properties include at least a loss factor (DF) and a dielectric constant (DK). In the present embodiment, DF of the fourth insulating portion 1162 is smaller than DF of the third insulating portion 1161.

In a case where the dielectric constants of the third insulating part 1161 and the fourth insulating part 1162 are constant (for example, equal), and DF of the fourth insulating part 1162 is smaller than DF of the third insulating part 1161, it indicates that the electromagnetic performance of the fourth insulating part 1162 is better than that of the third insulating part 1161. For convenience of description, DF of the third insulation part 1161 is named DF3, and DF of the fourth insulation part 1162 is named DF4. Compared to the third insulating portion 1161 made of DF3, the provision of the second insulating layer 116 in this embodiment, and the DF4 is smaller than the DF3, so that the loss of the signal transmitted on the second connection line 1212 is smaller, and when the rf chip 140 receives and transmits the electromagnetic wave signal through the second connection line 1212, the transmission power required by the rf chip 140 is smaller when the distance for transmitting the electromagnetic wave signal is fixed; if the power transmitted by the rf chip 140 is constant, the transmission distance of the electromagnetic wave signal transmitted by the rf chip 140 is longer. Compared to the case where the DF of the second insulating layer 116 is DF4, the DF of the third insulating portion 1161 is DF1, and the DF of the second insulating portion 1152 is DF2, which can reduce the cost of the carrier board 110.

In a case where the loss factors of the third insulating portion 1161 and the fourth insulating portion 1162 are constant (for example, equal), if it is not necessary to miniaturize the antenna module 10 with a high dielectric constant, the smaller DK is, the better the electromagnetic performance is, that is, the smaller DK is, and the radiation efficiency and the bandwidth of the antenna module 10 are both large. Accordingly, under the condition that the loss factors of the third insulating part 1161 and the fourth insulating part 1162 are constant (for example, equal), if the design space of the antenna module 10 is not large enough, a material with a high DK needs to be used to achieve miniaturization of the antenna module 10, and the DK needs to select a higher dielectric constant under the condition that the radiation efficiency and the bandwidth of the electromagnetic wave signals transmitted and received by the antenna module 10 are satisfied. However, the greater the DK, the lower the radiation efficiency and bandwidth of the antenna module 10. In the present embodiment, the electromagnetic characteristic of the fourth insulating portion 1162 is better than that of the third insulating portion 1161, and includes: the DK of the fourth insulation part 1162 is smaller than the DK of the third insulation part 1161.

Referring to fig. 1 and 15 together, fig. 15 is a cross-sectional view of an antenna module according to another embodiment of the present disclosure along the line I-I. The carrier board 110 has an antenna arrangement region 11a and a non-antenna arrangement region 11b connected thereto. The first antenna array 120 and the second antenna array 130 are both located in the antenna arrangement region 11a, and the carrier plate 110 includes a plurality of layers of carrier insulation layers 118 stacked in sequence and disposed at intervals. Each carrier dielectric layer 118 includes a first carrier dielectric 1181 and a second carrier dielectric 1182. The first carrier insulation 1181 is located in the antenna arrangement region 11a. The second carrier insulation 1182 is located in the non-antenna arrangement region 11b, wherein at least a portion of the first carrier insulation 1181 has electromagnetic performance superior to that of the second carrier insulation 1182.

In the illustration of this embodiment, the second insulating portion 1182 is formed by connecting the first insulating layer 115 and the second insulating layer 116. In other embodiments, the first insulating layer 115 and the second insulating layer 116 are not connected.

In the present embodiment, the electromagnetic performance of at least a portion of the first carrier insulation 1181 is better than that of the second carrier insulation 1182, that is, the radiation efficiency and bandwidth of the first antenna array 120 and the second antenna array 130 in the antenna arrangement region 11a are better than those in the non-antenna arrangement region 11b.

Wherein the electromagnetic properties include at least a loss factor (DF) and a dielectric constant (DK). In the present embodiment, the DF of at least a portion of the first carrier insulator 1181 is smaller than the DF of the second carrier insulator 1182.

When the dielectric constants of first carrier insulator 1181 and second carrier insulator 1182 are constant (e.g., equal), in this embodiment, DF of first carrier insulator 1181 is smaller than DF of second carrier insulator 1182, which indicates that the electromagnetic performance of first carrier insulator 1181 is better than that of second carrier insulator 1182. For convenience of description, the DF of the first carrier insulation 1181 is named DF11, and the DF of the second carrier insulation 1182 is named DF12. Compared to the material of DF12 used for the first carrier insulating portion 1181 and the second carrier insulating portion 1182, the carrier insulating layer 118 in the present embodiment of the invention can reduce the loss of the signals transmitted in the first antenna array 120 and the second antenna array 130, and when the rf chip 140 utilizes the first antenna array 120 and the second antenna array 130 to transmit and receive electromagnetic wave signals, the required transmission power of the rf chip 140 is smaller under the condition of a fixed distance for transmitting the electromagnetic wave signals; if the power of the rf chip 140 for transceiving the electromagnetic wave signal is constant, the transmission distance of the electromagnetic wave signal transmitted by the rf chip 140 by using the first antenna array 120 and the second antenna array 130 is longer. Compared to the material of the DF11 used for the DF of the second carrier insulating part 1182 located in the non-antenna arrangement region 11b, the cost of the carrier board 110 according to the embodiment of the present disclosure is lower.

In this embodiment, the electromagnetic performance of at least a portion of the first carrier insulating part 1181 is better than that of the second carrier insulating part 1182, and the method includes: the DK of at least a portion of first carrier insulator 1181 is less than the DK of second carrier insulator 1182.

Referring to fig. 1 and 16 together, fig. 16 is a cross-sectional view of an antenna module according to another embodiment of the present disclosure along the line I-I. The carrier plate 110 includes a plurality of carrier insulating layers 118 stacked in sequence and disposed at intervals. The second antenna array 130 includes a plurality of second antennas 131, and specifically, the plurality of first antennas 121 are spaced and regularly arranged to form the first antenna array 120. Wherein the at least one second antenna 131 includes a third feeding line 170 electrically connected to the rf chip 140. The third power feeding line 170 includes a first power feeding portion 171, a connecting portion 172, and a second power feeding portion 173. One end of the first feeding portion 171 is electrically connected to the rf chip 140, and the first feeding portion 171 passes through at least one of the multiple carrier insulating layers 118. One end of the connection portion 172 is connected to the first feeding portion 171 in a bending manner, and the connection portion 172 is sandwiched between two adjacent layers of the carrier insulation layers 118. One end of the second feeding portion 173 is connected to the other end of the connecting portion 172 in a bent manner, and the second feeding portion 173 penetrates through at least one of the multiple layers of the carrier insulating layers 118, wherein the electromagnetic performance of at least one of the two layers of the carrier insulating layers 118 sandwiching the connecting portion 172 is better than that of the carrier insulating layers 118 of the remaining layers of the multiple layers of the carrier insulating layers 118.

In this embodiment, the electromagnetic performance of at least one of the two carrier insulating layers 118 sandwiching the connecting portion 172 is better than that of the carrier insulating layers 118 of the rest of the multiple carrier insulating layers 118, that is, the radiation efficiency and bandwidth of at least one of the two carrier insulating layers 118 sandwiching the connecting portion 172 are better than those of the carrier insulating layers 118 of the rest of the multiple carrier insulating layers 118.

Wherein the electromagnetic properties include at least a loss factor (DF) and a dielectric constant (DK). In the present embodiment, DF of at least one carrier insulating layer 118 of the two carrier insulating layers 118 sandwiching the connecting portion 172 is smaller than DF of the rest of the carrier insulating layers 118 of the multiple carrier insulating layers 118.

Since the second antenna array 130 includes a plurality of second antennas 131, the plurality of second antennas 131 are regularly arranged at intervals to form the second antenna array 130. There will be some instances where the second antenna 131 cannot be connected to the rf chip 140 through a relatively straight feed line. Therefore, in the present embodiment, the third feeding line 170, which is electrically connected to the rf chip 140, of the at least one second antenna 131 includes a first feeding portion 171, a connecting portion 172, and a second feeding portion 173. The two carrier insulating layers 118 sandwiching the connection portion 172 mean two carrier insulating layers 118 disposed on opposite sides of the connection portion 172 and closest to the connection portion 172. The two insulating layers 118 sandwiching the connecting portion 172 are respectively named as a carrier insulating layer 118a and a carrier insulating layer 118b, wherein the carrier insulating layer 118a is disposed adjacent to the rf chip 140 compared to the carrier insulating layer 118 b. Then, in a case that the dielectric constant of at least one of the two carrier insulating layers 118 sandwiching the connection portion 172 is constant (e.g., equal) to the dielectric constant of the rest of the carrier insulating layers 118, the DF of at least one of the two carrier insulating layers 118 sandwiching the connection portion 172 is smaller than the DF of the rest of the carrier insulating layers 118 in the rest of the multiple carrier insulating layers 118, which includes the following cases: the DF of the carrier insulating layer 118a and the DF of the carrier insulating layer 118b are both smaller than the DF of the carrier insulating layers 118 of the remaining layers; alternatively, only the DF of the carrier insulating layer 118a is smaller than the DF of the carrier insulating layers 118 of the remaining layers; alternatively, the DF of only the carrier insulating layer 118b is less than the DF of the carrier insulating layer 118 of the remaining layers.

The DF of at least one of the two carrier insulating layers 118 sandwiching the connecting portion 172 is smaller than the DF of the other carrier insulating layers 118 in the multiple carrier insulating layers 118, so that the loss of the radio frequency signal transmitted on the third power feed line 170 is smaller, and when the radio frequency chip 140 receives and transmits an electromagnetic wave signal through the third power feed line 170, the transmission power required by the radio frequency chip 140 is smaller under the condition that the transmission distance of the electromagnetic wave signal is fixed; if the power transmitted by the rf chip 140 is constant, the transmission distance of the electromagnetic wave signal transmitted by the rf chip 140 is longer. In addition, since the conductive layer and the insulating carrier layer 118 are usually formed at intervals in sequence when the carrier board 110 is manufactured, in this embodiment, the DF of at least one insulating carrier layer 118 of the two insulating carrier layers 118 sandwiching the connecting portion 172 is set to be smaller than the DF of the insulating carrier layers 118 of the remaining layers of the multiple insulating carrier layers 118, so that the carrier board 110 can be manufactured easily. It is only necessary to use a material with a small DF in the preparation of the insulating support layer 118 sandwiching the connection portion 172.

In the present embodiment, the DK of at least one of the two carrier insulating layers 118 sandwiching the connecting portion 172 is smaller than the DK of the carrier insulating layers 118 of the remaining layers of the multilayer carrier insulating layer 118.

Referring to fig. 9, 10, 14 and 15, the antenna module 10 further includes a first feeding line 150. The first feeding line 150 includes a first end 151 and a second end 152 connected to each other, the first end 151 is electrically connected to the rf chip 140, and the second end 152 is located in a gap 121a (see fig. 10 and 15) formed by the first connecting lines 1211 and the second connecting lines 1212.

In this embodiment, the first end 151 of the first power feeding line 150 is electrically connected to the rf chip 140, and the second end 152 is disposed in the gap, so that the first antenna 121 can transmit signals between the first power feeding line 150 and the rf signals. When the first antenna 121 is used for radiating an electromagnetic wave signal, the radio frequency signal generates a radio frequency signal, the radio frequency signal is transmitted to the second end 152 of the first power feeding line 150 through the first end 151 of the first power feeding line 150, and the first antenna 121 generates an electromagnetic wave signal according to the radio frequency signal transmitted to the second end 152 and radiates the electromagnetic wave signal. When the first antenna 121 is used for receiving an electromagnetic wave signal, the first antenna 121 generates an electrical signal according to the electromagnetic wave signal, and the electrical signal is transmitted to the rf chip 140 through the second end 152 of the first power feed line 150 and the first end 151 of the second power feed line 160.

In the present embodiment, the antenna module 10 includes a second power feeding line 160 in addition to the first power feeding line 150. Referring to fig. 9, 10, 17 and 18, fig. 17 is a schematic structural diagram of the first feeding line shown in fig. 5; fig. 18 is a schematic structural view of the second power feeding line shown in fig. 5. The first feeding line 150 includes a first end 151 and a second end 152 connected to each other, the first end 151 is electrically connected to the rf chip 140, and the second end 152 is located in the gap 121a formed by the plurality of first connecting lines 1211 and the plurality of second connecting lines 1212. The second feeding line 160 includes a third terminal 161 and a fourth terminal 162 connected to each other, the third terminal 161 is electrically connected to the rf chip 140, the fourth terminal 162 is located in the gap 121a formed by the first connecting lines 1211 and the second connecting lines 1212, and the fourth terminal 162 is orthogonal to the second terminal 152.

In this embodiment, the fourth end 162 is orthogonal to the second end 152, so that the first antenna 121 is a dual-polarized antenna radiator. In other words, the first antenna 121 can transmit and receive electromagnetic wave signals having polarization directions of a vertical polarization direction and a horizontal polarization direction. When the first antenna 121 is a dual-polarized antenna, the communication effect of the antenna module 10 can be improved, and compared with the related art in which two antennas are used to realize different polarizations, the number of antennas in the antenna module 10 can be reduced in the antenna module 10 provided in this embodiment.

The first feeding line 150 may take the form of a Coplanar waveguide (CPW), a strip line, or the like, or a combination of a CPW form and a strip line. The second feed line 160 may take the form of a CPW, a strip line, etc., or a combination of a CPW form and a strip line. Accordingly, the third feed line 170 may take the form of a CPW, a strip line, or the like, or a combination of a CPW form and a strip line.

Referring to fig. 5, 10 and 11, the carrier substrate 110 further includes a plurality of fifth conductive layers 117. The plurality of fifth conductive layers 117 are sequentially stacked and spaced in the first extending direction D1, and are located between the first conductive layer 111 and the second conductive layer 112, and the fifth conductive layer 117 is electrically connected to the first conductive layer 111 and the second conductive layer 112 located on the same layer, wherein one of the fifth conductive layers 117 has a receiving portion 1171 therein, and the first power feed line 150 is disposed in the receiving portion 1171 (see fig. 11) and is insulated from the fifth conductive layer 117.

The fifth conductive layer 117 on the same layer is electrically connected to the first conductive layer 111 and the second conductive layer 112, which includes but is not limited to the following cases: in one embodiment, the fifth conductive layer 117 and the first conductive layer 111 on the same layer are electrically connected through an electrical connector, and the fifth conductive layer 117 and the first conductive layer 111 on the same layer are electrically connected through an electrical connector; in another embodiment, the fifth conductive layer 117, the first conductive layer 111, and the second conductive layer 112 in the same layer are connected to form a whole, that is, the fifth conductive layer 117, the first conductive layer 111, and the second conductive layer 112 in the same layer are integrated. In the schematic diagram of this embodiment, the fifth conductive layer 117, the first conductive layer 111, and the second conductive layer 112 which are located in the same layer are connected to form an example.

An insulating layer is arranged between the adjacent two fifth conductive layers 117, and the insulating layer is used for separating the adjacent two fifth conductive layers 117.

Referring to fig. 5, 10 and 11, the first antenna 121 further includes a plurality of third connecting lines 1213. The plurality of third connection lines 1213 electrically connect the plurality of fifth conductive layers 117, the first conductive layer 111, and the second conductive layer 112, and the plurality of third connection lines 1213 are disposed around at least a portion of the first power feed line 150.

An insulating layer is arranged between the adjacent two fifth conductive layers 117, and the insulating layer is used for separating the adjacent two fifth conductive layers 117. The insulating layer is further provided with a through hole, and the third connecting line 1213 is disposed in the through hole to electrically connect the fifth conductive layer 117, the first conductive layer 111, and the second conductive layer 112. The plurality of third connection lines 1213 are disposed around at least a portion of the first power feed line 150, so that the fifth conductive layer 117, the first conductive layer 111, and the second conductive layer 112 can be electrically connected.

Referring to fig. 1 and fig. 15, in the present embodiment, the second antenna array 130 further includes a plurality of second antennas 131. Specifically, the plurality of second antennas 131 are arranged at intervals and regularly to form the second antenna array 130. The plurality of second antennas 131 are embedded in the carrier plate 110.

In this embodiment, the second antenna 131 is embedded in the carrier board 110, so that the second antenna 131 is integrated in the carrier board 110, and the thickness of the carrier board 110 is not increased or is slightly increased, so that the antenna module 10 has a higher integration level and a smaller volume. When the antenna module 10 is applied to the communication device 1, the antenna module is convenient to assemble with other devices in the communication device 1, and the integration level of the communication device 1 is improved.

In this embodiment, the carrier board 110 includes a first conductive layer 111 on a first surface 110a, and the second antenna 131 and the first conductive layer 111 are disposed at the same layer and at an interval. The first conductive layer 111 is located on the first surface 110a, and when the second antenna 131 and the first conductive layer 111 are disposed at the same layer and at an interval, that is, the second antenna 131 is located on the first surface 110a, the electromagnetic wave signals received and transmitted by the second antenna 131 are less or even not blocked by the conductive layer and the insulating layer in the carrier plate 110, so that the quality of the antenna module 10 receiving and transmitting the electromagnetic wave signals by using the second antenna 131 can be improved. In other embodiments, the second antenna 131 may be disposed on any layer between the first conductive layer 111 and the second conductive layer 112.

In combination with any of the above embodiments, the loading plate 110 further includes a third surface 110c (see fig. 15). The third surface 110c is connected to and intersected with the first surface 110a, the third surface 110c is disposed opposite to the second surface 110b, and the rf chip 140 is disposed on the third surface 110c.

The carrier plate 110 is located on the third surface 110c, so that the distance between the rf chip 140 and the second antenna 131 is short, and the length of a feed line electrically connecting the rf chip 140 and the second antenna 131 is shortened, thereby avoiding the loss of rf signals caused by a long feed line.

A plurality of first output terminals 141 and a plurality of second output terminals 142 are disposed on a surface of the rf chip 140 facing the third surface 110c. The first output 141 is for electrical connection to the first and second

power feed lines

150 and 160. The plurality of second output terminals 142 are for electrically connecting to a third power feeding line 170, wherein the third power feeding line 170 is for electrically connecting the second antenna 131.

Compared to the first output terminals 141 and the second output terminals 142 disposed on other surfaces, the surface of the rf chip 140 facing the third surface 110c has the first output terminals 141 and the second output terminals 142, so that the lengths of the first feeder line 150, the second feeder line 160, and the third feeder line 170 are further made shorter, and further, the loss of the rf signals transmitted by the first feeder line 150, the second feeder line 160, and the third feeder line 170 is reduced, so that the first antenna array 120 and the second antenna array 130 have better radiation gain.

The first output terminal 141 and the second output terminal 142 may be connected to the carrier plate 110 through a soldering process, and the first output terminal 141 and the second output terminal 142 face the third surface 110c, so this process is called a Flip-Chip (Flip-Chip) process. The first feeding line 150 may be a feeding wire or a feeding probe; accordingly, the second feeding line 160 may be a feeding electrical wire or a feeding probe; accordingly, the third feeding line 170 may be a feeding guide or a feeding probe.

Referring to fig. 2 and other cross-sectional views, in the present embodiment, the carrier board 110 includes 11 wiring layers as an example for illustration, and it can be understood that in other embodiments, the carrier board 110 may have other numbers of layers. The carrier plate 110 includes a first wiring layer TM1, a second wiring layer TM2, a third wiring layer TM3, a fourth wiring layer TM4, a fifth wiring layer TM5, a sixth wiring layer TM6, a seventh wiring layer TM7, an eighth wiring layer TM8, a ninth wiring layer TM9, a tenth wiring layer TM10, and an eleventh wiring layer TM11. The first wiring layer TM1, the second wiring layer TM2, the third wiring layer TM3, the fourth wiring layer TM4, the fifth wiring layer TM5, the sixth wiring layer TM6, the seventh wiring layer TM7, the eighth wiring layer TM8, the ninth wiring layer TM9, the tenth wiring layer TM10, and the eleventh wiring layer TM11 are sequentially stacked and spaced, an insulating layer is arranged between any two adjacent wiring layers of the 11 wiring layers, and the surface of the first wiring layer TM1 departing from the second wiring layer TM2 is a first surface 120a of the bearing plate 110. The rf chip 140 is disposed adjacent to the eleventh wiring layer TM11.

In the schematic diagram of the embodiment, the second antenna 132 is disposed in the first wiring layer TM1 as an example.

The second antenna 132 is disposed on the first wiring layer TM1, and the third feeder line 170 penetrates through another wiring layer interposed between the first wiring layer TM1 and the rf chip 140. In the present embodiment, the third power feeding line 170 penetrates the first to eleventh wiring layers TM1 to TM11. It is to be understood that, when the second antenna 132 is disposed in the nth wiring layer TMN, the third feeding line 170 penetrates the wiring layer between the nth wiring layer TMN and the rf chip 140.

The first conductive layer 111, the second conductive layer 112, the multiple conductive layers 113, the multiple fourth conductive layers 114, and the fifth conductive layer 117 utilize original wiring layers in the carrier substrate 110, so that the first antenna array 120 and the second antenna array 130 in the antenna module 10 are easily carried in the carrier substrate 10.

The devices that can be disposed in each wiring layer may be devices that are required for operation in the antenna module 10, such as a received signal processing device, a transmitted signal processing device, and the like.

Furthermore, some wiring layers are also provided with power lines and control lines, and the power lines and the control lines are respectively electrically connected with the radio frequency chip 140. The power line is used for providing the radio frequency chip 140 with electric energy required by the radio frequency chip 140, and the control line is used for transmitting a control signal to the radio frequency chip 140 so as to control the radio frequency chip 140 to work.

The present application also provides a communication device 1. The communication device 1 may be, but is not limited to, a cellular phone, a cordless phone, a Session Initiation Protocol (SIP) phone, a Wireless Local Loop (WLL) station, a Personal Digital Assistant (PDA), a mobile phone, and so on. Referring to fig. 19 and 20 together, fig. 19 is a schematic diagram of a communication device according to an embodiment of the present application; fig. 20 isbase:Sub>A cross-sectional view taken along linebase:Sub>A-base:Sub>A of fig. 19. The communication device 1 comprises the antenna module 10 according to any of the previous embodiments. The antenna module 10 refers to the foregoing description, and is not described herein again.

In the present embodiment, the communication device 1 further includes a middle frame 50 and a rear cover 70. The middle frame 50 and the rear cover 70 are accommodated to form an accommodating space, the antenna module 10 is disposed in the accommodating space, a direction of transmitting and receiving electromagnetic wave signals of the first antenna 121 faces the middle frame 50, and the second antenna 131 faces the rear cover 70.

In the present embodiment, the middle frame 50 includes a carrier 510 and a frame 520 connected by bending, the frame 520 includes a main body 521 and a sub-wave-transmitting portion 522, the transmittance of the sub-wave-transmitting portion 522 is greater than that of the main body 521, and the direction in which the first antenna 121 transmits and receives the electromagnetic wave signal is directed toward the sub-wave-transmitting portion 522.

The transmissivity of the sub-wave-transmitting portion 522 is greater than the transmissivity of the main body portion 521, and the direction in which the first antenna 121 transmits and receives the electromagnetic wave signals is oriented toward the sub-wave-transmitting portion 522, so that the electromagnetic wave signals transmitted and received by the first antenna 121 can pass through the sub-wave-transmitting portion 522 in a large amount, and the antenna module 10 has a good communication performance.

In one embodiment, the body 521 is made of a conductive material, such as al-mg alloy, al alloy, cu alloy, or the like; the sub-wave-transmitting portion 522 is made of a non-electromagnetic wave shielding material, such as plastic or plastic. In another embodiment, the body 521 is made of a conductive material, such as al-mg alloy, al alloy, cu alloy, or the like; the sub wave-transmitting portion 522 is a hollow area in the frame portion 520. As long as the transmittance of the sub-wave-transmitting portion 522 is greater than the transmittance of the main body portion 521.

In this embodiment, the communication device 1 further includes a screen 30, and the screen 30 is carried on the middle frame 50. The screen 30 may be a screen 30 having touch and display functions; it may be a screen having only a display function; the screen having only a touch function is not limited herein. The screen 30 is disposed on a side of the middle frame 50 facing away from the rear cover 70. In other words, the screen 30 and the rear cover 70 are respectively disposed on two opposite sides of the middle frame 50.

Although embodiments of the present application have been shown and described, it is understood that the above embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the above embodiments without departing from the scope of the present application, and that such changes and modifications are also to be considered as within the scope of the present application.

Claims

1. An antenna module, characterized in that, the antenna module includes:

carrying a plate;

a first antenna array carried on the carrier;

the radio frequency chip is carried on the bearing plate or arranged on one side of the bearing plate and used for providing radio frequency signals to the first antenna array and the second antenna array.

2. The antenna module of claim 1, wherein the carrier plate comprises:

a first surface facing a first direction, wherein a main lobe direction of the first antenna array is the first direction; and

and a second surface connected to and intersecting the first surface and facing a second direction, wherein the main lobe direction of the second antenna array is the second direction.

3. The antenna module of claim 2, wherein the first direction is orthogonal to the second direction.

4. The antenna module of claim 1, wherein the carrier plate comprises:

a first conductive layer;

the second conducting layer is opposite to the first conducting layer and is arranged at intervals;

the multiple third conducting layers are sequentially stacked along a first extending direction and are arranged between the first conducting layer and the second conducting layer at intervals;

a plurality of first insulating layers, wherein the first insulating layers are arranged between the first conducting layer and a third conducting layer nearest to the first conducting layer, between the second conducting layer and a third conducting layer nearest to the second conducting layer, and between two adjacent third conducting layers;

the multilayer fourth conducting layers are sequentially stacked along a first extending direction and arranged between the first conducting layer and the second conducting layer at intervals, and the multilayer fourth conducting layers and the multilayer third conducting layers are arranged at intervals along a second extending direction; and

the second insulating layers are arranged between the first conducting layer and a fourth conducting layer closest to the first conducting layer, between the second conducting layer and a fourth conducting layer closest to the second conducting layer, and between two adjacent fourth conducting layers;

the first antenna array comprises a plurality of first antennas comprising the first conductive layer, the second conductive layer, the plurality of third conductive layers, the plurality of fourth conductive layers, and:

a plurality of first connecting lines for electrically connecting the first conductive layer, the plurality of third conductive layers, and the second conductive layer, the plurality of first connecting lines being arranged at intervals; and

the second connecting lines are opposite to the first connecting lines and are arranged at intervals to form gaps, the second connecting lines are used for electrically connecting the first conductive layer, the multiple fourth conductive layers and the second conductive layer, and the second connecting lines are arranged at intervals.

5. The antenna module of claim 4, wherein at least one first dielectric layer is connected to a second dielectric layer on the same layer.

6. The antenna module of claim 5, wherein each of the first dielectric layers is connected to each of the second dielectric layers.

7. The antenna module of claim 5, wherein a first one of the first insulating layers is connected to a first one of the second insulating layers in a stacking direction of the third conductive layers; and/or the last layer of the first insulating layer is connected with the last layer of the second insulating layer; the first insulating layer and the second insulating layer of the rest layers are oppositely arranged at intervals.

8. The antenna module of claim 1, wherein the carrier plate comprises:

a first conductive layer;

the second conducting layer is opposite to the first conducting layer and is arranged at intervals; and

a first insulating layer disposed between the first conductive layer and the second conductive layer;

the first antenna array comprises a plurality of first antennas comprising the first conductive layer, the second conductive layer, and:

a plurality of first connecting lines for electrically connecting the first conductive layer and the second conductive layer, the plurality of first connecting lines being arranged at intervals;

the second connecting lines are opposite to the first connecting lines and are arranged at intervals to form gaps, the second connecting lines are used for electrically connecting the first conductive layer and the second conductive layer, and the second connecting lines are arranged at intervals.

9. The antenna module of claim 4 or 8, wherein the first insulating layer comprises:

a first insulating portion; and

and a second insulating portion connected to the first insulating portion and through which the first connection line passes, wherein an electromagnetic characteristic of the second insulating portion is superior to that of the first insulating portion.

10. The antenna module of claim 9, wherein when the carrier plate comprises a second insulating layer, the second insulating layer comprises:

a third insulating section; and

and the fourth insulating part is connected with the third insulating part, and the second connecting wire penetrates through the fourth insulating part, wherein the electromagnetic property of the fourth insulating part is superior to that of the third insulating part.

11. The antenna module of claim 4 or 8, wherein the antenna module further comprises:

the first feed line comprises a first end and a second end which are connected, the first end is electrically connected to the radio frequency chip, and the second end is located in a gap formed by the first connecting lines and the second connecting lines.

12. The antenna module of claim 11, wherein the antenna module further comprises:

a second feed line including a third end and a fourth end connected, the third end being electrically connected to the RF chip, the fourth end being located in the gap formed by the plurality of first connecting lines and the plurality of second connecting lines, wherein the fourth end is orthogonal to the second end.

13. The antenna module of claim 11, wherein the carrier plate further comprises:

the first feed line is arranged in the accommodating part and is insulated from the fifth conducting layer.

14. The antenna module of claim 13, wherein the first antenna further comprises:

a plurality of third connection lines electrically connecting the plurality of fifth conductive layers, the first conductive layer, and the second conductive layer, and disposed around at least a portion of the first power feed line.

15. The antenna module of claim 1, wherein the carrier has an antenna layout area and a non-antenna layout area connected to each other, the first antenna array and the second antenna array are located in the antenna layout area, the carrier includes a plurality of carrier insulation layers stacked in sequence and spaced apart from each other, each carrier insulation layer includes:

a first load bearing insulation part located at the antenna arrangement region; and

a second carrier insulation portion located at the non-antenna arrangement region, wherein at least a portion of the first carrier insulation portion has electromagnetic properties superior to those of the second carrier insulation portion.

16. The antenna module as claimed in claim 1, wherein the carrier board includes a plurality of layers of carrier insulation layers stacked in sequence and spaced apart from each other, and the second antenna array includes a plurality of second antennas arranged in an array, wherein at least one of the second antennas includes a third feeding line electrically connected to the rf chip, and the third feeding line includes:

one end of the first feeding part is electrically connected with the radio frequency chip, and the first feeding part penetrates through at least one layer of the multiple layers of bearing insulation layers;

one end of the connecting part is connected with the first feed part in a bending mode, and the connecting part is clamped between two adjacent bearing insulating layers; and

and one end of the second feeding part is connected with the other end of the connecting part in a bending way, and the second feeding part penetrates through at least one layer of the plurality of bearing insulating layers, wherein the electromagnetic property of at least one layer of the two bearing insulating layers which clamp the connecting part is better than that of the bearing insulating layers of the rest layers of the plurality of bearing insulating layers.

17. The antenna module of claim 2, wherein the second antenna array further comprises a plurality of second antennas embedded in the carrier plate.

18. The antenna module of claim 17, wherein the carrier board includes a first conductive layer on a first surface, and the second antenna is disposed on a same layer as the first conductive layer and spaced therefrom.

19. A communication device, characterized in that it comprises an antenna module according to any one of claims 1-18.

20. The communication device according to claim 19, further comprising a middle frame and a back cover, wherein the middle frame and the back cover are accommodated to form an accommodating space, the antenna module is disposed in the accommodating space, the middle frame includes a carrying portion and a frame portion connected by bending, the frame portion has a main portion and a sub-wave-transmitting portion, a main lobe direction of the first antenna faces the sub-wave-transmitting portion, wherein a transmittance of the sub-wave-transmitting portion is greater than a transmittance of the main portion, and a main lobe direction of the second antenna faces the back cover.