CN115634801A

CN115634801A - Dispensing machine for diode control

Info

Publication number: CN115634801A
Application number: CN202211367757.5A
Authority: CN
Inventors: 许国珍
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-11-03
Filing date: 2022-11-03
Publication date: 2023-01-24

Abstract

The invention discloses a dispensing machine for diode preparation, which structurally comprises a supporting table, an upright post, a motor, a dispensing mechanism and a placement mechanism, wherein the outer side end of the supporting table is fixed with the bottom of the upright post, the motor is arranged at the top of the upright post, glue is heated by a heating wire and contacts with a lug after entering a glue outlet pipe, the downward flowing speed of electronic glue in the glue outlet pipe is accelerated, the glue outlet pipe is prevented from being bonded and blocked during glue outlet of the glue outlet pipe, the dispensing uniformity is improved, four clamping sheets elastically abut against four directions outside a light-emitting head on a diode placed in a placement groove, the diode is prevented from being inclined angle offset during dispensing, the diode is rotated in a sealing shell after dispensing to generate wind power to be conducted into a wind power dispersing ring pipe, cooling air is uniformly sprayed to the glue dispensing position where the light-emitting head of the diode is connected with pins through eight nozzles, and the solidification of the glue is accelerated, so that the bonding firmness of the light-emitting head and the pins is improved.

Description

Dispensing machine for diode control

Technical Field

The invention relates to the field of diodes, in particular to a dispenser for diode preparation.

Background

The in-process that LED was preparing, insert LED's two pins inside the light-emitting head and carry out the contact connection, thereby make two pins and light-emitting head switch on, and two pins need use the point gum machine to bond in the link outside of pin and light-emitting head after inserting the light-emitting head inside, improve the fastness between pin and the light-emitting head and can seal, but because the point gum machine is carrying out the adhesive deposite adhesive in-process outside the link of pin and light-emitting head, electronic glue is in the inside time of depositing of the play gum head of point gum machine for a long time, easily bond in the play gum head inside, lead to going out gluey in-process to take place the card pause easily, it is inhomogeneous to go out to glue, cause electronic glue to be difficult to even point at pin and light-emitting head junction, the in-process of point gum simultaneously, light-emitting head and pin need carry out the handstand and place, and the bottom of light-emitting head is spherical structure, place the in-process that the point was glued easily and take place the angle skew, cause electronic glue to be difficult to be accurate point at the junction of light-emitting head and pin, lead to light-emitting head and pin adhesive nature is not good.

Disclosure of Invention

The technical scheme adopted by the invention for realizing the technical purpose is as follows: this dispensing machine for diode control, its structure includes brace table, stand, motor, dispensing mechanism, placement machine construct, brace table outside end is fixed with the stand bottom to the stand top is equipped with the motor, dispensing mechanism outside end slidable mounting is inside the stand to dispensing mechanism is located the placement machine structure top, placement machine constructs and establishes at the brace table up end, dispensing mechanism includes lifting slide, direction horizontal pole, drive slider, motor, advances gluey mechanism, lifting slide slidable mounting is inside the stand to the direction horizontal pole is established at lifting slide outside end, drive slider slidable mounting is in the direction horizontal pole outside, drive slider upper end is equipped with the motor to motor top output rotates with advancing gluey mechanism upper end in step, advance gluey mechanism fixed mounting at the drive slider front end, it is located the placement machine structure top to advance gluey mechanism, the inside worm that still is equipped with of stand, the worm upper end rotates along with motor bottom output in step to the worm runs through inside and threaded connection in lifting slide.

As a further improvement of the invention, the glue feeding mechanism comprises a driving shaft, a stirring mechanism, a glue dissolving tube, a heating wire and two glue dispensing heads, wherein the driving shaft is fixedly arranged at the top of the glue dissolving tube, the stirring mechanism is arranged in the glue dissolving tube, the top of the stirring mechanism is fixed with the bottom of the driving shaft, the heating wire is arranged in the glue dissolving tube and is positioned outside the stirring mechanism, the glue dispensing heads are fixedly arranged at the bottom of the glue dissolving tube and are communicated with each other, the lower end of the stirring mechanism is positioned inside the upper end of the glue dispensing head, the glue dispensing heads are positioned above the placing mechanism, and the two heating wires are respectively arranged at the left end and the right end of the outside of the glue dissolving tube.

As a further improvement of the invention, the stirring mechanism comprises a spiral stirring rod, a spring rod and an extrusion hammer, the spiral stirring rod is arranged in the sol tube, the top of the spiral stirring rod is fixed with the bottom of the driving shaft, the spring rod is arranged in the lower end of the spiral stirring rod in a clearance fit manner, the extrusion hammer is welded at the lower end of the spring rod and is positioned in the upper end of the dispensing head, the upper end of the extrusion hammer is of an arc structure, and the lower end of the extrusion hammer is of a cone structure.

As a further improvement of the invention, the dispensing head comprises a guide hopper, a lower guide sheet, a glue outlet pipe and a bump, wherein the guide hopper is fixedly arranged at the bottom of the glue dissolving pipe and communicated with the glue dissolving pipe, the lower guide sheet is arranged on the inner wall of the guide hopper, the glue outlet pipe is fixedly arranged at the lower end of the guide hopper and communicated with the guide hopper, the bump is arranged on the inner wall of the glue outlet pipe, the extrusion hammer is positioned inside the upper end of the guide hopper, ten bumps are arranged in the guide hopper and are in a hemispherical structure, the five bumps are in a group and are respectively arranged on the left side and the right side of the inside of the glue outlet pipe, and the bumps on the two sides have a certain height difference.

As a further improvement of the present invention, the placing mechanism includes four support legs, a chassis, a placing groove, four engaging pieces, four extruding pipes and a cooling mechanism, wherein the bottoms of the support legs are fixedly mounted on the upper end surface of the support platform, the upper ends of the support legs are welded to the outer side of the chassis, the placing groove is embedded in the middle of the upper end of the chassis, the four engaging pieces are located inside the placing groove, the extruding pipes are arranged at the outer ends of the engaging pieces, the extruding pipes are fixedly mounted inside the chassis, the cooling mechanism is located outside the placing groove, the cooling mechanism penetrates through the inside of the chassis, and the four engaging pieces and the four extruding pipes are annularly distributed inside the placing groove of the circular cavity.

As a further improvement of the present invention, the cooling mechanism includes a small fan, a sealing shell, a conducting pipe, a dispersing ring pipe, a guide block, and nozzles, the small fan is installed inside the sealing shell, the upper end of the sealing shell is connected with the inner end of the conducting pipe, the outer end of the conducting pipe is fixed with and communicated with the bottom of the dispersing ring pipe, the dispersing ring pipe penetrates inside the chassis, the guide block is installed on the inner wall of the dispersing ring pipe, the nozzles are installed and communicated on the inner side of the dispersing ring pipe, the dispersing ring pipe is located outside the placing groove, the dispersing ring pipe is in a ring structure, and the eight nozzles are equidistantly installed on the inner end of the dispersing ring pipe.

The invention has the beneficial effects that:

1. the in-process of gluing carries out electron glue through outside pipe and carries out inside the electron glue and carry out heating work to glue through the heater wire, avoids glue to solidify the bonding inside the sol, and glue enters into out the inside back of glue pipe and takes place the contact with the lug for the inside speed that down flows of glue pipe is being gone out to electron glue, avoids glue to take place to bond when going out glue pipe inside and stops up, improves the homogeneity of gluing.

2. Exert the extrusion elasticity of down-ward inside for the block piece through the extrusion pipe, thereby make four block pieces carry out the elasticity conflict to placing four positions in the light-emitting head outside on the inside diode of standing groove, the in-process diode of avoiding the point to glue takes place the inclination skew, it is inside to rotate the production wind-force conduction through small-size fan inside the seal shell to glue the back and conduct the dispersion ring canal, through eight nozzles with even the light-emitting head that spouts the diode and the some glue departments that the pin is connected of cooling air, thereby it improves the bonding fastness of light-emitting head and pin to accelerate the solidification of glue.

Drawings

Fig. 1 is a schematic structural diagram of a dispenser for diode preparation according to the present invention.

Fig. 2 is a schematic perspective view of a dispensing mechanism according to the present invention.

Fig. 3 is a schematic view of an internal structure of a glue feeding mechanism according to the present invention.

Fig. 4 is a schematic structural diagram of a stirring mechanism according to the present invention.

Fig. 5 is a schematic view of an internal structure of a dispensing head according to the present invention.

Fig. 6 is a schematic top perspective view of a placement mechanism of the present invention.

Fig. 7 is a schematic top perspective view of a cooling mechanism according to the present invention.

In the figure: support table-C, upright post-G, motor-D, glue dispenser mechanism-5, placing mechanism-3, lifting slider-5 h, guide cross bar-59, drive slider-5 k, motor-5 m, glue inlet mechanism-52, drive shaft-52 z, stirring mechanism-52 j, sol tube-52C, heating wire-52 r, glue dispenser head-52 v, spiral stirring rod-j 3, spring rod-j 5, extrusion hammer-j 8, guide hopper-v 6, lower guide sheet-v 9, glue outlet tube-v 1, bump-v 4, support leg-36, chassis-36, placing groove-3 f, clamping sheet-3 k, extrusion tube-3 s, cooling mechanism-31, small fan-1 e, sealing shell-1 z, conduction tube-1C, dispersion ring tube-1 h, guide block-1 t and nozzle-1 p.

Detailed Description

The invention is further described below with reference to the accompanying drawings:

example 1:

as shown in figures 1 to 5:

the invention relates to a dispensing machine for diode preparation, which structurally comprises a support table C, an upright post G, a motor D, a dispensing mechanism 5 and a placement mechanism 3, wherein the outer side end of the support table C is fixed with the bottom of the upright post G, the motor D is arranged at the top of the upright post G, the outer side end of the dispensing mechanism 5 is slidably mounted inside the upright post G, the dispensing mechanism 5 is positioned above the placement mechanism 3, the placement mechanism 3 is arranged on the upper end surface of the support table C, the dispensing mechanism 5 comprises a lifting slide block 5h, a guide cross rod 59, a driving slide block 5k, a motor 5m and a glue feeding mechanism 52, the lifting slide block 5h is slidably mounted inside the upright post G, the guide cross rod 59 is arranged at the outer side end of the lifting slide block 5h, the driving slide block 5k is slidably mounted outside the guide cross rod 59, the upper end of the driving slide block 5k is provided with the motor 5m, the top output end of the motor 5m and the upper end of the glue feeding mechanism 52 synchronously rotate, the glue feeding mechanism 52 is fixedly mounted at the front end of the driving slide block 5k, the glue feeding mechanism 52 is positioned above the placement mechanism 3, a worm is arranged inside the placement mechanism, the upright post G, the worm screw is synchronously rotates along with the output end of the motor D, the worm screw thread of the worm screw, and the lifting slide block 5h, and the lifting slide block is connected inside the lifting slide block 5h, so as to drive the lifting mechanism to rotate the lifting mechanism to drive the lifting mechanism to lift mechanism to move the lifting mechanism.

The glue feeding mechanism 52 comprises a driving shaft 52z, a stirring mechanism 52j, a sol tube 52c, a heating wire 52r and a glue dispensing head 52v, wherein the driving shaft 52z is fixedly installed at the top of the sol tube 52c, the stirring mechanism 52j is arranged inside the sol tube 52c, the top of the stirring mechanism 52j is fixed with the bottom of the driving shaft 52z, the heating wire 52r is arranged inside the sol tube 52c, the heating wire 52r is positioned outside the stirring mechanism 52j, the glue dispensing head 52v is fixedly installed at the bottom of the sol tube 52c and communicated with the bottom of the sol tube 52c, the lower end of the stirring mechanism 52j is positioned inside the upper end of the glue dispensing head 52v, the glue dispensing head 52v is positioned above the placing mechanism 3, the two heating wires 52r are arranged at the left end and the right end of the inside of the sol tube 52c respectively, so as to heat the electronic glue inside the sol tube 52c, and prevent the electronic glue from being solidified inside the sol tube 52c and being adhered inside the sol tube 52 c.

Wherein, rabbling mechanism 52j includes spiral puddler j3, spring beam j5, extrusion hammer j8, spiral puddler j3 is established inside dissolving rubber pipe 52c to spiral puddler j3 top is fixed with drive shaft 52z bottom, spring beam j5 adopts clearance fit to install inside spiral puddler j3 lower extreme, and the welding of spring beam j5 lower extreme has extrusion hammer j8, extrusion hammer j8 is located dispensing head 52v upper end inside, extrusion hammer j8 upper end is the arc structure to the lower extreme is the cone structure, does benefit to through spring beam j5 and drives extrusion hammer j8 and carry out elastic movement from top to bottom at spiral puddler j3 bottom to carry out the hammering the glue of lower extreme and accelerate the inside exhaust speed of glue from dispensing head 52v when avoiding glue to take place to bond.

The dispensing head 52v comprises a guide hopper v6, a lower guide sheet v9, a dispensing tube v1 and a projection v4, the guide hopper v6 is fixedly installed at the bottom of the glue dissolving tube 52c and communicated with the glue dissolving tube, the lower guide sheet v9 is arranged on the inner wall of the guide hopper v6, a dispensing tube v1 is fixedly installed at the lower end of the guide hopper v6 and communicated with the glue dissolving tube, a projection v4 is arranged on the inner wall of the dispensing tube v1, the extrusion hammer j8 is located inside the upper end of the guide hopper v6, ten projections v4 are arranged on the inner wall of the guide hopper v4, the projections v4 are of a hemispherical structure, the five projections are in a group and are respectively arranged on the left side and the right side inside the dispensing tube v1, the projections v4 on the two sides have a certain height difference, the downward flowing speed of the electronic glue inside the dispensing tube v1 is accelerated, the occurrence of bonding blockage during the dispensing of the glue inside the dispensing tube v1 is avoided, and the uniformity of the dispensing is improved.

The specific use mode and function of the embodiment are as follows:

in the invention, a diode is placed on a placing mechanism 3 in an inverted manner, a motor D is started to rotate at the top of an upright column G, so that a worm in the upright column G rotates, a lifting slider 5h is driven to drive a guide cross rod 59 to perform lifting adjustment, a driving slider 5k performs left-right sliding adjustment on the guide cross rod 59, a glue inlet mechanism 52 is adjusted to a joint of a light emitting head and a pin of the diode to perform glue dispensing operation, electronic glue is conveyed into a sol tube 52c through an external guide tube in the glue dispensing process, a motor 5m is started to drive a driving shaft 52z to rotate, a spiral stirring rod j3 performs rotary stirring on the electronic glue in the sol tube 52c and performs spiral conveying downwards, glue is heated through a heating wire 52r to avoid glue from being solidified and bonded in the sol tube 52c, a rotary spring rod j3 applies up-and down movement elasticity to an extrusion hammer j8 through a spring rod j5 while stirring, the glue is hammered in a lower end guide hopper v6 to avoid glue from being bonded, a lower guide piece v9 in the guide hopper 6 to enter a glue outlet pipe to increase the uniformity of a glue outlet pipe v1, and the uniformity of a glue outlet pipe 1.

Example 2:

as shown in fig. 6 to 7:

wherein, the placing mechanism 3 includes stabilizer blade 36, chassis 36, standing groove 3f, grip block 3k, extrusion pipe 3s,

cooling mechanism

31, 36 bottom fixed mounting of stabilizer blade are at a supporting bench C up end, 36 upper ends of stabilizer blade and 36 outside welding in chassis, 36 upper ends of chassis middle part has inlayed standing groove 3f, grip block 3k is located standing groove 3f inboard, grip block 3k outside end is equipped with extrusion pipe 3s, extrusion pipe 3s fixed mounting is inside chassis 36, cooling mechanism 31 is located the standing groove 3f outside, cooling mechanism 31 runs through inside chassis 36, grip block 3k and extrusion pipe 3s all are equipped with four to it is inside the standing groove 3f of circular cavity to be the loop type distribution, does benefit to carrying out the elastic conflict to four azimuths in the luminescent head outside of placing on the inside diode of standing groove 3f, avoids four orientations in-process diodes that the point glued to take place inclination, improves the accuracy of point.

The cooling mechanism 31 includes a small fan 1e, a sealing case 1z, a conducting tube 1c, a dispersing ring tube 1h, a guide block 1t and nozzles 1p, the small fan 1e is installed inside the sealing case 1z, the upper end of the sealing case 1z is connected with the inner end of the conducting tube 1c, the outer end of the conducting tube 1c is fixed to and communicated with the bottom of the dispersing ring tube 1h, the dispersing ring tube 1h penetrates through the chassis 36, the guide block 1t is arranged on the inner wall of the dispersing ring tube 1h, the nozzles 1p are arranged on the inner side of the dispersing ring tube 1h and communicated with the dispersing ring tube 1h, the dispersing ring tube 1h is arranged on the outer side of the placing groove 3f, the dispersing ring tube 1h is in a ring structure, the eight nozzles 1p are arranged on the inner end of the dispersing ring tube 1h, wind power generated by the small fan 1e is uniformly dispersed into the eight nozzles 1p through the dispersing ring tube 1h, cooling wind is uniformly sprayed to the positions where the light emitting heads and the pins of the diodes are connected through the eight nozzles 1p, and solidification of the glue is accelerated, thereby improving the adhesion of the light emitting heads and the pins.

The specific use mode and function of the embodiment are as follows:

according to the invention, the diode is placed on the chassis 36 in an inverted manner, the light emitting head on the diode is clamped in the placing groove 3f, the clamping sheets 3k are abutted outwards through the outer sides of the light emitting head, inward extrusion elastic force is applied to the clamping sheets 3k through the extrusion pipes 3s, so that the four clamping sheets 3k elastically abut against the four directions of the outer sides of the light emitting head on the diode placed in the placing groove 3f, the diode is prevented from being inclined and deviated in the dispensing process, the dispensing accuracy is improved, wind power is generated by rotating the sealing shell 1z through the small fan 1e after dispensing, the wind power is conducted to the interior of the dispersing ring pipe 1h through the conducting pipe 1c, the wind power is dispersed in the dispersing ring pipe 1h, the cooling is accelerated to be extruded into the nozzle 1p through the wind power guide block 1t arranged on the inner wall of the dispersing ring pipe 1h, and is finally sprayed out of the nozzle 1p, the cooling wind power is uniformly sprayed to the dispensing position where the light emitting head and the pins of the diode are connected through the eight nozzles 1p, and the solidification of the glue is accelerated, and the firmness of the bonding of the light emitting head and the pins is improved.

The technical solutions of the present invention or similar technical solutions designed by those skilled in the art based on the teachings of the technical solutions of the present invention are all within the scope of the present invention.

Claims

1. The utility model provides a diode preparation point gum machine, its structure includes brace table (C), stand (G), motor (D), point gum machine constructs (5), places mechanism (3), brace table (C) outside end is fixed with stand (G) bottom to stand (G) top is equipped with motor (D), point gum machine constructs (5) outside end slidable mounting inside stand (G) to point gum machine constructs (5) and is located places mechanism (3) top, place mechanism (3) and establish at brace table (C) up end, its characterized in that:

glue dispensing mechanism (5) including lifting slide (5 h), direction horizontal pole (59), drive slider (5 k), motor (5 m), advance gluey mechanism (52), lifting slide (5 h) slidable mounting is inside stand (G) to direction horizontal pole (59) are established at lifting slide (5 h) outside end, drive slider (5 k) slidable mounting is in the direction horizontal pole (59) outside, drive slider (5 k) upper end is equipped with motor (5 m), and motor (5 m) top output end and advance gluey mechanism (52) upper end synchronous rotation, advance gluey mechanism (52) fixed mounting at drive slider (5 k) front end, it is located placement mechanism (3) top to advance gluey mechanism (52).

2. The dispenser as claimed in claim 1, wherein: advance gluey mechanism (52) including drive shaft (52 z), rabbling mechanism (52 j), sol pipe (52 c), heater strip (52 r), dispensing head (52 v), drive shaft (52 z) fixed mounting is at sol pipe (52 c) top to sol pipe (52 c) inside is equipped with rabbling mechanism (52 j), rabbling mechanism (52 j) top is fixed with drive shaft (52 z) bottom, sol pipe (52 c) inside is equipped with heater strip (52 r), and heater strip (52 r) are located rabbling mechanism (52 j) outside, dispensing head (52 v) fixed mounting is in sol pipe (52 c) bottom and link up mutually, rabbling mechanism (52 j) lower extreme is located dispensing head (52 v) inside, dispensing head (52 v) are located and place the mechanism (3) top.

3. The dispenser as claimed in claim 2, wherein: the stirring mechanism (52 j) comprises a spiral stirring rod (j 3), a spring rod (j 5) and an extrusion hammer (j 8), the spiral stirring rod (j 3) is arranged inside the glue dissolving pipe (52 c), the top of the spiral stirring rod (j 3) is fixed with the bottom of the driving shaft (52 z), the spring rod (j 5) is arranged inside the lower end of the spiral stirring rod (j 3) in a clearance fit mode, the extrusion hammer (j 8) is welded at the lower end of the spring rod (j 5), and the extrusion hammer (j 8) is located inside the upper end of the glue dispensing head (52 v).

4. The dispenser for diode preparation according to claim 3, wherein: the dispensing head (52 v) comprises a guide hopper (v 6), a lower guide vane (v 9), a glue outlet pipe (v 1) and a convex block (v 4), the guide hopper (v 6) is fixedly installed at the bottom of the glue dissolving pipe (52 c) and communicated with the glue dissolving pipe, the lower guide vane (v 9) is arranged on the inner wall of the guide hopper (v 6), the glue outlet pipe (v 1) is fixedly installed at the lower end of the guide hopper (v 6) and communicated with the guide hopper, the convex block (v 4) is arranged on the inner wall of the glue outlet pipe (v 1), and the extrusion hammer (j 8) is located inside the upper end of the guide hopper (v 6).

5. The dispenser for diode preparation according to claim 1, wherein: placing mechanism (3) includes stabilizer blade (36), chassis (36), standing groove (3 f), block piece (3 k), extrusion pipe (3 s), cooling body (31), stabilizer blade (36) bottom fixed mounting is at brace table (C) up end, stabilizer blade (36) upper end welds mutually with chassis (36) outside, standing groove (3 f) have been inlayed in chassis (36) upper end middle part, block piece (3 k) are located standing groove (3 f) inboard, block piece (3 k) outside end is equipped with extrusion pipe (3 s), extrusion pipe (3 s) fixed mounting is inside chassis (36), cooling body (31) are located standing groove (3 f) outside, cooling body (31) run through inside chassis (36).

6. The dispenser as claimed in claim 5, wherein: the cooling mechanism (31) comprises a small fan (1 e), a sealing shell (1 z), a conducting pipe (1 c), a dispersing ring pipe (1 h), a guide block (1 t) and a nozzle (1 p), the small fan (1 e) is installed inside the sealing shell (1 z), the upper end of the sealing shell (1 z) is connected with the inner side end of the conducting pipe (1 c), the outer side end of the conducting pipe (1 c) is fixed with and communicated with the bottom of the dispersing ring pipe (1 h), the dispersing ring pipe (1 h) penetrates through the inside of a chassis (36), the guide block (1 t) is arranged on the inner wall of the dispersing ring pipe (1 h), the nozzle (1 p) is arranged on the inner side of the dispersing ring pipe (1 h) and communicated with the dispersing ring pipe, and the dispersing ring pipe (1 h) is located on the outer side of a placing groove (3 f).