CN115627379B - Copper alloy bar and preparation method thereof - Google Patents
Copper alloy bar and preparation method thereof Download PDFInfo
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- CN115627379B CN115627379B CN202211348951.9A CN202211348951A CN115627379B CN 115627379 B CN115627379 B CN 115627379B CN 202211348951 A CN202211348951 A CN 202211348951A CN 115627379 B CN115627379 B CN 115627379B
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title description 7
- 239000010949 copper Substances 0.000 claims abstract description 12
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 229910005883 NiSi Inorganic materials 0.000 claims description 33
- 238000001125 extrusion Methods 0.000 claims description 27
- 230000032683 aging Effects 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 23
- 238000005266 casting Methods 0.000 claims description 18
- 229910017028 MnSi Inorganic materials 0.000 claims description 17
- 239000006104 solid solution Substances 0.000 claims description 14
- 238000009826 distribution Methods 0.000 claims description 11
- 239000011159 matrix material Substances 0.000 claims description 11
- 238000000137 annealing Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000003723 Smelting Methods 0.000 claims description 4
- 238000004321 preservation Methods 0.000 claims description 4
- 239000000498 cooling water Substances 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 21
- ZUPBPXNOBDEWQT-UHFFFAOYSA-N [Si].[Ni].[Cu] Chemical compound [Si].[Ni].[Cu] ZUPBPXNOBDEWQT-UHFFFAOYSA-N 0.000 abstract description 20
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 abstract description 15
- 239000000956 alloy Substances 0.000 description 16
- 229910045601 alloy Inorganic materials 0.000 description 15
- 238000012545 processing Methods 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000013078 crystal Substances 0.000 description 6
- 238000001556 precipitation Methods 0.000 description 6
- 238000005728 strengthening Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 206010057040 Temperature intolerance Diseases 0.000 description 1
- 238000007545 Vickers hardness test Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000008543 heat sensitivity Effects 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- BSPSZRDIBCCYNN-UHFFFAOYSA-N phosphanylidynetin Chemical compound [Sn]#P BSPSZRDIBCCYNN-UHFFFAOYSA-N 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/001—Continuous casting of metals, i.e. casting in indefinite lengths of specific alloys
- B22D11/004—Copper alloys
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/0075—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for rods of limited length
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Abstract
The invention discloses a copper alloy bar, which is characterized in that: the copper alloy comprises the following components in percentage by mass: 4.0 to 6.8 weight percent, si:0.86 to 1.5 weight percent, mn:0.12 to 0.60 percent, B:0.001 to 0.06wt% of Cu and unavoidable impurities in balance. According to the invention, ni, si, mn, B is added into the copper alloy and the respective contents are controlled, so that the tensile strength Rm is more than or equal to 1100MPa, the yield ratio Rp0.2/Rm is more than or equal to 0.95, and the impact toughness ak is more than or equal to 0.9kj/cm 2 The copper-nickel-silicon alloy bar realizes that the material is difficult to deform and lose efficacy under the action of external force while improving the strength.
Description
Technical Field
The invention belongs to the technical field of copper alloy, and particularly relates to a copper alloy bar and a preparation method thereof.
Background
Copper nickel silicon is an aging strengthening copper alloy, has high strength, high hardness and excellent electric conduction and heat conduction properties, and is widely applied to the fields of electronic appliances, communication engineering, aerospace, mechanical manufacturing and large-scale integrated circuits.
The existing copper-nickel-silicon alloy is usually processed into strips and applied to the manufacturing fields of integrated circuit lead frames and high-speed back plate connectors, so that the tensile strength, bending performance and stress relaxation resistance of the materials are more concerned.
Copper alloy materials mainly used in the fields of high-speed railway contact wire hanging string clamps, connector terminals, spiral springs and the like at present are tin phosphor bronze and low-nickel low-silicon alloy, and with the development of the fields, the comprehensive performance requirements on the materials are higher and higher, and besides high strength, the materials are required to be subjected to external force, so that the materials are not easy to deform and fail.
The yield ratio refers to the ratio of the yield strength to the tensile strength of a material, and the size of the yield ratio reflects the utilization rate of the strength of the material and the deformation resistance under the action of external force, and the higher the yield ratio is, the less easily the material is deformed under the action of the external force. The copper alloy bar has high yield ratio, which indicates that the bar processed parts are not easy to deform and fail due to external force.
Impact resistance refers to the ability of a metallic material to resist deformation and fracture under impact load, the magnitude of which is representative of the ability of a test specimen to inhibit the occurrence of primary cracks, and is a combined manifestation of material strength and plasticity, generally expressed by impact toughness (ak), in J/cm 2 The magnitude of the ak value indicates the toughness of the material, and a material with a low ak value is generally referred to as a brittle material, and a material with a high ak value is generally referred to as a tough material. The impact toughness of the copper-nickel-silicon bar is improved, and the deformation resistance of the parts under the action of external force can be enhanced.
The copper alloy bar is mainly prepared by a stretching method, wherein the stretching refers to a pressure processing method that a blank is subjected to plastic deformation through a die hole under the action of a certain tensile force, so that the section is reduced and the length is increased, the structure compactness is poor compared with that of a rolling process, and the strength improved by the stretching method is lower than that of the rolling method under the same processing rate, so that the copper-nickel-silicon alloy bar with excellent comprehensive properties of strength, yield ratio and impact resistance is prepared by the stretching method.
Disclosure of Invention
The first technical problem to be solved by the invention is to provide a copper alloy bar which is not easy to deform under the action of external force while improving the strength.
The second technical problem to be solved by the invention is to provide a preparation method of a copper alloy bar.
The invention solves the first technical problem by adopting the technical scheme that: a copper alloy bar, characterized in that: the copper alloy comprises the following components in percentage by mass: 4.0 to 6.8 weight percent, si:0.86 to 1.5 weight percent, mn:0.12 to 0.60 percent, B:0.001 to 0.06wt% of Cu and unavoidable impurities in balance.
Ni: ni plays two main roles in the copper-nickel-silicon alloy of the present invention: firstly, ni and Si phases are mainly NiSi phases, when the NiSi phases are separated out from solid solution, the strength of the alloy can be greatly improved, the conductivity of the alloy is improved, and the necessary condition for fully forming the NiSi phases is that the mass ratio of Ni to Si is more than 4; and secondly, the excessive Ni always keeps the toughness of copper at a higher level, because the lattice constant of Ni is similar to that of Cu and can form a continuous solid solution with Cu, the excessive Ni is beneficial to the mechanical property of the alloy and can also play a role in improving the impact toughness of the Si-containing copper alloy.
Si: si is added into Cu, and the main function is to separate out Ni forming compound from copper alloy matrix, so that the yield strength and yield ratio of Cu can be obviously improved, the strength of copper-nickel-silicon alloy is related to the quantity and distribution of precipitated phases of NiSi and MnSi, and when the Si content is lower than 0.86%, the tensile strength of the alloy is difficult to be higher than 1100 Mpa. Accordingly, the minimum Si content in the high yield ratio impact-resistant copper-nickel-silicon alloy is not lower than 0.86%, and when the Si content exceeds 1.5%, firstly, the plasticity and impact toughness of the copper-nickel-silicon alloy are obviously reduced; secondly, si obviously reduces the conductivity of Cu; thirdly, because the bonding capability of Si and oxygen is strong, silicate with low melting point is easy to generate during welding, and the welding quality is affected.
Mn: mn is mainly used for forming a strengthening phase MnSi with Si in the copper-nickel-silicon alloy, so that the strength and impact toughness of the copper-nickel-silicon alloy are improved, and the damage of trace Mn to the conductivity of the copper-nickel-silicon alloy is small, so that the addition of Mn in the copper-nickel-silicon alloy is comprehensively considered to be controlled to be 0.12-0.60%.
B: the B can delay the growth of crystal grains in the solid solution process of the copper-nickel-silicon, can reduce the heat sensitivity of the strengthening phase in the aging heat treatment process of the alloy, improve the uniformity, the precipitation speed and the precipitation amount of the NiSi phase, inhibit the growth of the precipitation phase and improve the dispersity of the distribution of the precipitation phase, thereby improving the strength and the yield ratio of the copper-nickel-silicon and improving the impact toughness of the copper-nickel-silicon alloy with high Si content. The amount of B added in the present invention is 0.001 to 0.06wt%.
Preferably, the copper alloy includes a matrix phase and a second phase including a NiSi phase and a MnSi phase, and the area ratio of the second phase is 0.03 to 0.07%.
The copper-nickel-silicon alloy is an aging strengthening copper alloy, the matrix phase is an alpha phase containing Ni, and Ni, si and Mn elements are dissolved in Cu in a solid solution manner, so that Cu lattice is distorted, distortion energy is generated, and the alloy is strengthened in a solid solution manner. After aging, si in the alloy is respectively combined with Ni and Mn to be precipitated in the form of NiSi and MnSi second phase particles, and the NiSi and MnSi compounds which are dispersed and distributed can prevent dislocation movement, so that the strength of the alloy is greatly improved.
Preferably, the NiSi phase occupies 90 to 97% of the area content of the second phase. The second phase is mainly NiSi phase, and because the microhardness of the MnSi phase reaches more than 470HV, the second phase has over high proportion, the material is easy to damage a cutter during cutting processing, has over low proportion, and has weak synergistic strengthening effect with the NiSi phase.
Preferably, the NiSi phase and matrix phase orientation relationship satisfies: (100) m //(001) p 、[011] m //[010] p 。
(100) m : brackets indicate the crystal plane index, letter m indicates that the lattice type is simple monoclinic, [011 ]]: brackets indicate the crystal orientation of the crystal, and the letter p indicates that the lattice type is orthorhombic. The NiSi phase and the matrix phase are in a non-coherent relation, and the dislocation movement does not cut the NiSi phase but bypasses the NiSi phase when the copper nickel silicon is deformed by the positional relation, so that the blocking effect of the NiSi on the dislocation movement is stronger, and the impact deformation resistance effect of the blocking material is more remarkable.
Preferably, the average size of the NiSi phase is less than or equal to 200nm, and the average size of the MnSi phase is less than or equal to 1500nm; the NiSi phase number distribution satisfies: 2.6 to 3.2 ten thousand pieces/mm 2 The method comprises the steps of carrying out a first treatment on the surface of the The MnSi phase number distribution satisfies: 0.07 to 0.15 ten thousand pieces/mm 2 。
Preferably, the dislocation density of the copper alloy satisfies 5.3 to 7.2x10 13 cm -2 At this time, solute atomsNi and second phases NiSi and MnSi cause moderate distortion of crystal lattice, have strong blocking effect on dislocation movement, not only can improve strength, but also can resist impact deformation, but also need to avoid strong distortion of crystal lattice caused by overhigh dislocation density, almost completely prevent dislocation movement, and the material cannot show certain toughness and is directly brittle-broken when impacted.
The invention solves the second technical problem by adopting the technical proposal that: the preparation method of the copper alloy bar is characterized in that the copper alloy process flow comprises the following steps: smelting, casting, extruding, coiling, combined drawing and aging annealing; the aging annealing process adopts reducing atmosphere protection, and the aging temperature is as follows: 330-420 ℃, and the heat preservation time is as follows: cooling to below 60 ℃ for 3-12 h, and discharging.
The effect of aging annealing causes NiSi and MnSi which are in solid solution to be separated out from a tissue, second phase particles which are in dispersion distribution obstruct dislocation movement, the strength of the alloy is improved, the total area ratio, particle size and distribution quantity of the NiSi and MnSi phases in the precipitated phases and the orientation and matching relation of the NiSi and MnSi phases and the matrix have important influence on the yield ratio after the aging annealing of the alloy, the finer the second phase particles are, the more dispersed the distribution is, the higher the yield strength of the alloy is, the larger the yield ratio is, and the orientation relation of the NiSi precipitated phases and the matrix phases is related to the processing ratio before aging and the aging temperature and the heat preservation time. When the aging temperature is lower than 330 ℃ and the precipitation quantity of NiSi and MnSi phases is small and the distribution proportion is low under the condition that the processing rate is unchanged, the NiSi phase and the matrix phase are generally present (010) m //(100) p 、[001] m //[100] p The alloy has low strength, if the aging temperature is higher than 420 ℃, the sizes of NiSi and MnSi phases grow up, overaging occurs, the longer the aging time is, the larger the size is, and the grown NiSi phase and matrix alpha phase are in the form of 011 m //(101) p 、[010] m //[100] p The yield strength and impact toughness are reduced.
Preferably, the casting temperature: 1180-1250 ℃, cooling by cooling water, and drawing casting speed: 30-60 mm/min, and the temperature of the ingot casting crystallizer is controlled at 670-780 ℃. The copper-nickel-silicon alloy has high Si content and large casting internal stress, so that the problem of cracking of the core part of an ingot casting caused by the action of casting stress is solved, and a red ingot pulling process is adopted. The temperature of the cast ingot out of the crystallizer is lower than 670 ℃, which indicates that the primary cooling strength is overlarge, the liquid-solid line moves upwards into the crystallizer, the contact area between the cast ingot solidified shell and the inner surface of the crystallizer is increased, the friction resistance is also increased, and the surface quality of the cast ingot is poor; after the temperature is higher than 780 ℃, the liquid-solid line moves downwards, the solidified shell becomes thin, the copper water in the core part of the cast ingot is easy to melt and thin the solidified shell, copper leakage is generated, and the drawing casting fails.
Preferably, in the extrusion process, the ingot heating temperature is as follows: 850-980 ℃, extrusion speed: 8-15 mm/s, double-flow extrusion, extrusion ratio: 50-200, extruding the extrusion blank from a die, and carrying out on-line solid solution, wherein the solid solution temperature is 780-850 ℃. The extrusion ratio is lower than 50, and the extrusion billet structure is easy to generate an ingot casting state structure due to low extrusion deformation degree, so that the material performance is poor, but the extrusion ratio is too high and exceeds 200, and the extrusion force exceeds the extrusion force limited by the extruder, so that the ingot is not extruded or equipment is damaged. When the extrusion speed is low, the whole ingot can be extruded within a longer time, the temperature of the ingot is reduced rapidly, the deformation resistance of the tail end of the ingot is increased, the extrusion of the whole ingot can not be completed smoothly, when the extrusion speed is too high, the extrusion force is increased rapidly and exceeds the limit pressure of the extruder, and the extrusion rod is broken. When the extrusion time is finished, the surface temperature of an extrusion blank flows out of a die hole is lower than 780 ℃, solid solution is insufficient, the quantity of precipitated NiSi phases is insufficient during aging, the strengthening effect cannot be achieved, the temperature is higher than 850 ℃, the heating temperature of an ingot casting is required to be higher, the grains of the blank after solid solution are coarse, and the yield ratio and the impact toughness of a final product are reduced.
Preferably, the processing rate of the coil drawing is controlled to be 80-85%, the processing rate of the combined drawing is controlled to be 9-23%, the direct high-processing rate drawing is performed without annealing in the two processes, dislocation density in the alloy is greatly increased, discontinuous precipitation is caused in the aging period, the strength at the peak value can be remarkably improved, and the time for reaching the peak value strength is shortened. If the coil drawing processing rate is lower than 80%, the processing rate of combined drawing is required to be increased in order to increase the dislocation density in the alloy, so that the combined drawing is easy to break, if the combined drawing processing rate is lower than 9%, the dislocation density in the alloy is lower, the aging treatment cannot reach the peak strength, if the coil drawing processing rate exceeds 85%, the plasticity of a wire blank is severely reduced, the rod drawn in the combined drawing process is straightened, and if the combined drawing processing rate of a finished product exceeds 23%, the impact toughness of the material is reduced, and the material is easy to break under the action of external force.
Compared with the prior art, the invention has the advantages that: according to the invention, ni, si, mn, B is added into the copper alloy and the respective contents are controlled, so that the tensile strength Rm is more than or equal to 1100MPa, the yield ratio Rp0.2/Rm is more than or equal to 0.95, and the impact toughness ak is more than or equal to 0.9kj/cm 2 The copper-nickel-silicon alloy bar realizes that the material is difficult to deform and lose efficacy under the action of external force while improving the strength.
Detailed Description
The present invention is described in further detail below with reference to examples.
The invention provides 10 examples and 4 comparative examples, the specific compositions are shown in Table 1.
The preparation procedure of the examples is as follows:
1) Smelting: the ingredients are mixed according to the required components, and the smelting temperature is 1090-1260 ℃.
2) Casting: casting temperature: 1180-1250 ℃, cooling by cooling water, and drawing casting speed: 30-60 mm/min, the temperature of the ingot casting crystallizer is controlled at 670-780 ℃, and the ingot sawing specification is that: phi 245mm is 600mm.
3) Extruding: ingot heating temperature: 850-980 ℃, extrusion speed: 8-15 mm/s, double-flow extrusion, extrusion ratio: 50-200, extruding the extrusion blank from a die, and carrying out on-line solid solution, wherein the solid solution temperature is 780-850 ℃.
4) And (3) disc pulling: the processing rate of the disc drawing is 80-85%;
5) And (3) joint drawing: the processing rate of the combined drawing is 9-23%.
6) Aging annealing: by reducing atmosphere H 2 Protection, ageing temperature: 330-420 ℃, and the heat preservation time is as follows: cooling to below 60 ℃ for 3-12 h, and discharging.
7) And (5) precisely straightening.
8) The finished product is checked, and key technological parameter control is shown in tables 2 and 3.
Comparative example 1 was prepared according to the preparation method of example 1.
Comparative example 2 is different from example 1 in that: the ageing temperature was 300 ℃.
Comparative example 3 is different from example 1 in that: the ageing temperature was 450 ℃.
Comparative example 4 differs from example 1 in that: the processing rate of the combined drawing was 27%.
The following test was performed on the microstructures of the examples and comparative examples, and the results are shown in table 4.
Observing the phase occupation ratio, the phase size and the phase distribution quantity by using a scanning electron microscope;
dislocation density: the images were observed by an X-ray diffractometer.
The following performance tests were performed on 10 examples and 4 comparative examples, and the results are recorded in table 5.
Tensile strength Rm, yield strength rp0.2 and elongation a100: according to GB/T228.1-2021 section 1 Metal tensile test: room temperature test method.
Hardness HV5: according to GB/T4340.1-2009 Vickers hardness test of Metal materials part 1: test methods.
Impact toughness ak: the test is carried out according to GB/T229-2007 Charpy pendulum impact test method for metallic materials.
Conductivity of: measured according to GB/T351-2019 method for measuring resistivity of metallic materials.
TABLE 1 Components per wt% of inventive and comparative examples
| Numbering device | Ni | Si | Mn | B | Allowance of |
| Example 1 | 4.52 | 0.97 | 0.17 | 0.0035 | Allowance of |
| Example 2 | 5.16 | 1.08 | 0.55 | 0.024 | Allowance of |
| Example 3 | 6.09 | 1.25 | 0.36 | 0.0066 | Allowance of |
| Example 4 | 4.15 | 0.89 | 0.14 | 0.0025 | Allowance of |
| Example 5 | 6.21 | 1.28 | 0.15 | 0.046 | Allowance of |
| Example 6 | 5.74 | 1.04 | 0.40 | 0.0018 | Allowance of |
| Example 7 | 4.92 | 1.18 | 0.35 | 0.017 | Allowance of |
| Example 8 | 5.53 | 0.95 | 0.57 | 0.031 | Allowance of |
| Example 9 | 4.27 | 1.08 | 0.26 | 0.052 | Allowance of |
| Example 10 | 5.07 | 1.15 | 0.37 | 0.0048 | Allowance of |
| Comparative example 1 | 3.87 | 0.90 | 0.16 | ＜0.001 | Allowance of |
TABLE 2 Key process parameter control for embodiments of the invention
3 key Process parameter control of embodiments of the present invention
TABLE 4 microstructure of examples and comparative examples of the present invention
TABLE 5 Properties of examples and comparative examples of the invention
Claims (5)
1. A copper alloy bar, characterized in that: the copper alloy comprises the following components in percentage by mass: 4.0 to 6.8 weight percent, si:0.86 to 1.5 weight percent, mn:0.12 to 0.60 percent, B:0.001 to 0.06wt% of Cu and unavoidable impurities in balance;
the copper alloy comprises a matrix phase and a second phase, wherein the second phase comprises a NiSi phase and a MnSi phase, and the area ratio of the second phase is 0.03-0.07%;
the NiSi phase accounts for 90-97% of the area content of the second phase;
the phase direction relation of the NiSi phase and the matrix phase satisfies the following conditions: (100) m //(001) p 、[011] m //[010] p The method comprises the steps of carrying out a first treatment on the surface of the m represents that the lattice type is simple monoclinic, and p represents that the lattice type is body center orthorhombic;
the average size of the NiSi phase is less than or equal to 200nm, and the average size of the MnSi phase is less than or equal to 1500nm; the NiSi phase number distribution satisfies: 2.6 to 3.2 ten thousand pieces/mm 2 The method comprises the steps of carrying out a first treatment on the surface of the The MnSi phase number distribution satisfies: 0.07 to 0.15 ten thousand pieces/mm 2 ；
The dislocation density of the copper alloy satisfies 5.3 to 7.2 x 10 13 cm -2 。
2. A method for producing a copper alloy bar according to claim 1, wherein the copper alloy process flow comprises: smelting, casting, extruding, coiling, combined drawing and aging annealing; the aging annealing process adopts reducing atmosphere protection, and the aging temperature is as follows: 330-420 ℃, and the heat preservation time is as follows: cooling to below 60 ℃ for 3-12 h, and discharging.
3. The method of producing copper alloy bar according to claim 2, wherein the casting temperature: 1180-1250 ℃, cooling by cooling water, and drawing casting speed: 30-60 mm/min, and the temperature of the ingot casting crystallizer is controlled at 670-780 ℃.
4. The method for producing a copper alloy bar according to claim 2, wherein in the extrusion process, the ingot heating temperature is as follows: 850-980 ℃, extrusion speed: 8-15 mm/s, double-flow extrusion, extrusion ratio: 50-200, extruding the extrusion blank from a die, and carrying out on-line solid solution, wherein the solid solution temperature is 780-850 ℃.
5. The method for producing a copper alloy bar according to claim 2, wherein a working ratio of coil drawing is 80 to 85%, and a working ratio of combined drawing is 9 to 23%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211348951.9A CN115627379B (en) | 2022-10-31 | 2022-10-31 | Copper alloy bar and preparation method thereof |
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