CN115622640A - Gain calibration method for transceiver in communication module and communication module - Google Patents
Gain calibration method for transceiver in communication module and communication module Download PDFInfo
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- 238000012360 testing method Methods 0.000 claims description 10
- 239000003990 capacitor Substances 0.000 claims description 9
- 238000002955 isolation Methods 0.000 claims description 5
- 238000003860 storage Methods 0.000 claims description 5
- 238000004590 computer program Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000010295 mobile communication Methods 0.000 abstract description 3
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B17/00—Monitoring; Testing
- H04B17/10—Monitoring; Testing of transmitters
- H04B17/11—Monitoring; Testing of transmitters for calibration
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B17/00—Monitoring; Testing
- H04B17/10—Monitoring; Testing of transmitters
- H04B17/11—Monitoring; Testing of transmitters for calibration
- H04B17/13—Monitoring; Testing of transmitters for calibration of power amplifiers, e.g. gain or non-linearity
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B17/00—Monitoring; Testing
- H04B17/20—Monitoring; Testing of receivers
- H04B17/21—Monitoring; Testing of receivers for calibration; for correcting measurements
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Abstract
The embodiment of the invention relates to the field of mobile communication, and discloses a gain calibration method for a transceiver in a communication module and the communication module. The method comprises the steps that before calibration is carried out on a transceiver in a communication module, a first material placement position in series is reserved at a transmitting output port of the transceiver and/or an output port of a filter connected with the transmitting output port; attaching a fixed impedance element on the first material attaching position, wherein the fixed impedance element enables impedance on a transmitting output port passage after the transceiver is powered on to be located in a sensitive area; and then, the calibration operation is carried out on the transceiver, so that the calibration passing rate of the transceiver can be obviously improved. According to the scheme, when the communication module is used for production, the purposes of reducing material loss, reducing cost and improving the first pass yield can be achieved.
Description
Technical Field
The present invention relates to the field of mobile communications, and in particular, to a gain calibration method for a transceiver in a communication module and a communication module.
Background
For the 9x07 platform communication module, calibration failure at low power level of Band1 (2100 MHZ) always occurs during the factory mass production process, and the failure rate is about two thousandth. At present, it is common practice in factories to solve this problem by replacing Transceivers (TRCs) with failed calibration so that the replaced TRCs can pass power calibration. However, replacement of the TRC causes material loss and increases production costs.
Disclosure of Invention
An object of embodiments of the present invention is to provide a gain calibration method for a transceiver in a communication module and a communication module, which can improve the success rate of transceiver calibration without replacing the transceiver.
In order to solve the above technical problem, an embodiment of the present invention provides a gain calibration method for a transceiver in a communication module, including:
reserving a first material placement position in series at a transmitting output port of a transceiver and/or an output port of a filter connected with the transmitting output port in a communication module;
attaching a fixed impedance element to the first material attaching position, wherein the fixed impedance element enables impedance on the transmission output port passage after the transceiver is powered on to be located in a sensitive area;
performing a calibration operation on the transceiver.
An embodiment of the present invention further provides a communication module, including: the transceiver and the filter are positioned at a transmitting output port of the transceiver and/or an output port of the filter connected with the transmitting output port, a first material paste position connected in series is reserved on the output port of the filter, a fixed impedance element is pasted on the first material paste position, and the fixed impedance element enables impedance on a transmitting output port channel after the transceiver is powered on to be positioned in a sensitive area.
An embodiment of the present invention also provides an electronic device, including:
at least one processor; and (c) a second step of,
a memory communicatively coupled to the at least one processor; wherein,
the memory stores instructions executable by the at least one processor to enable the at least one processor to perform a gain calibration method for a transceiver in a communication module as described above.
Embodiments of the present invention also provide a computer-readable storage medium storing a computer program, which when executed by a processor implements the gain calibration method for a transceiver in a communication module as described above.
Compared with the prior art, the method and the device have the advantages that before the transceiver in the communication module is calibrated, the first material placement positions connected in series are reserved at the transmitting output port of the transceiver and/or the output port of the filter connected with the transmitting output port; attaching a fixed impedance element on the first material attaching position, wherein the fixed impedance element can enable the impedance on a transmitting output port passage after the transceiver is powered on to be positioned in a sensitive area; and then, the calibration operation is carried out on the transceiver, so that the calibration passing rate of the transceiver can be obviously improved. According to the scheme, when the communication module is used for production, the purposes of reducing material loss, reducing cost and improving the first pass yield can be achieved.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings which correspond to and are not to be construed as limiting the embodiments, in which elements having the same reference numeral designations represent like elements throughout, and in which the drawings are not to be construed as limiting in scale unless otherwise specified.
FIG. 1 is a detailed flow chart of a gain calibration method for a transceiver in a communication module according to an embodiment of the present invention;
FIG. 2 is a detailed flow chart of a method of determining a capacitance value of a first capacitor according to an embodiment of the invention;
FIG. 3 is a graph one of calibration results at Band1 Low Power levels according to an embodiment of the present invention;
FIG. 4 is a second graph of calibration results at a low power level of Band1 in accordance with an embodiment of the present invention;
FIG. 5 is a schematic diagram of a communication module according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
One embodiment of the present invention relates to a gain calibration method for a transceiver in a communication module, wherein the communication module can be a communication module in various existing mobile communication platforms, such as a communication module in a high-pass 9x07 platform. As shown in fig. 1, the gain calibration method for a transceiver in a communication module according to this embodiment includes the following steps.
Step 101: and reserving a first material placement position in series at a transmitting output port of a transceiver and/or an output port of a filter connected with the transmitting output port in the communication module.
Currently, for example, a communication module of a high-pass 9x07 platform is used, when the communication module is produced in a large scale in a factory, a situation that the Band1 calibration fails always occurs, and the failure rate is about two thousandth. The factory can only change Transceiver (TRC) and can calibrate and pass, but changes TRC and can cause material loss, increase cost, through rate reduction scheduling problem, in order to avoid this problem, carries out the analysis to the calibration failure in this embodiment, has optimized on design communication module and calibration match.
Specifically, in the process of designing the communication module, a first material placement position connected in series is reserved at a transmitting output port of a transceiver in the communication module and/or an output port of a filter connected with the transmitting output port. The first material attaching position is a position where an attaching material (here, an electronic device such as a resistor, a capacitor, an inductor and the like) is attached to a circuit (here, a communication module) and is reserved in the circuit in advance; the first material placement in series means that after the materials are placed, the materials are connected in series with the adjacent devices at the placement positions, for example, the materials placed on the first material placement are connected in series with the transceiver and the filter.
The number of the first material placement positions can be one or more, and the first material placement positions can be located at a transmitting output port of the transceiver and/or an output port of a filter connected with the transmitting output port. When designing and producing the communication module, a first material sticking position is reserved.
Step 102: and a fixed impedance element is attached to the first material attaching position, and the fixed impedance element can enable the impedance on a transmission output port passage after the transceiver is powered on to be positioned in a sensitive area.
Specifically, before calibrating the transceiver in the communication module (for example, calibration at low power level of Band1 (2100 MHZ)), a fixed impedance element, which may be a capacitor, an inductor, a resistor, or any combination of the three, may be attached to the reserved first material attachment site, and functions to make the impedance on the transmission output port path of the transceiver located in the inductive region after the transceiver is powered on.
Before the step is executed, the impedance of the fixed impedance element is debugged for a plurality of times in advance, so that when the fixed impedance element is debugged to enable the impedance on a transmission output port path of the transceiver to be located in an inductive area after the transceiver is powered on, the calibration passing rate of the transceiver is obviously improved. Therefore, in order to improve the overall calibration throughput of the transceiver, in this embodiment, before the transceiver to be tested is calibrated, the fixed impedance element is attached to the first material attachment site, and the impedance of the fixed impedance element is preset in a reasonable range, so that the impedance on the transmission output port path of the transceiver can be pulled into the inductive region after the transceiver is powered on.
In one example, as shown in fig. 2, determining the impedance of the fixed impedance element to be attached on the first material attaching position may include the following steps:
step 201: and removing a power amplifier connected with the output port of the filter in the communication module, and welding the power amplifier by using a conductor.
Generally, a transceiver, a filter capacitor and a power amplifier are connected to a transmission path (Tx) in a communication module in sequence, and a transmission signal can be amplified by the power amplifier and then transmitted through an antenna. In this embodiment, in order to test the S22 parameter of the transceiver, the power amplifier may be removed first, and in order to implement normal transmission, a conductor, such as a copper pipe, may be welded at the power amplifier, so as to maintain a normal transmission path.
Step 202: and testing S22 parameters of the transceiver in the communication module, and balancing various radio frequency indexes of the transceiver in the communication module by debugging the impedance of the adjustable impedance element attached to the first material attaching position.
Specifically, for convenience of debugging, an adjustable impedance element (adjustable impedance) may be mounted on the first material attaching position, and then the S22 parameter (return loss) of the test transceiver may be forcibly transmitted to the transmission path, so as to obtain a test result corresponding to the S22 parameter, that is, the impedance on the transmission output port path. The impedance of the adjustable impedance element attached to the first material attachment position is continuously adjusted and changed to search for the impedance value of the state of balance of various radio frequency indexes of the transceiver in the communication module. The rf metrics include, but are not limited to, saturation power, adjacent Channel Leakage Ratio (ACLR). The balance of the radio frequency indexes corresponds to the best overall performance of the transceiver, and the calibrated passing rate is the highest.
In one example, to quickly obtain the state of balance of the radio frequency indexes, step 202 can be implemented as follows.
The method comprises the following steps: for a transceiver sample in the communication module for which a calibration failure has occurred, the S22 parameters of the transceiver sample in the communication module are tested.
In particular, the impedance of the adjustable impedance element may be debugged for transceiver samples in the communication module for which calibration has failed. And after the impedance of the variable impedance element is adjusted each time, the S22 parameter of the transceiver sample in the communication module under the corresponding impedance is tracked and tested to obtain a corresponding test result.
For example, fig. 3 shows the calibration results at a low power level of Band 1. Among these, there is a large mutation in the S22 parameter of TRC when RGI31 and RGI 32 are used.
Step two: the impedance of the adjustable impedance element attached to the first material attaching position is debugged, so that the radio frequency index of the transceiver sample in the communication module, which fails in calibration, passes the calibration.
Specifically, after many experiments, when the impedance at the transmission output port path of the TRC is in the inductive region and the transmission (Tx) Automatic Gain Control (AGC) 32 is reduced to AGC31, the impedance change is much smaller, and during calibration, the impedance change is much better at AGC 31.
As shown in fig. 4, when the variable impedance element is debugged for a plurality of times in the place where the calibration failed in fig. 3, it is found that the radio frequency indices of the TRC are most balanced when the effective impedance of the variable impedance element connected in series with the TRC output port is 3.3nH (equivalent to capacitance).
Step 203: and according to the S22 parameter, determining the impedance of the corresponding adjustable impedance element after the radio frequency index which causes the calibration failure of the transceiver sample in the communication module passes the calibration as the impedance of the fixed impedance element to be attached on the first material attaching position.
Specifically, the impedance on the path of the transmission output port can be known according to the test result corresponding to the S22 parameter, and when it is determined that the radio frequency indexes are balanced, it can be found that the impedance on the path of the transmission output port is pulled to the inductive region. And the effective impedance of the adjustable impedance element attached to the first material attachment position can be determined as the impedance of the fixed impedance element to be attached to the first material attachment position when the transceiver is calibrated subsequently.
Continuing with the example in step 202, in this step, according to the S22 parameter, the impedance of the adjustable impedance element corresponding to the calibration pass of the radio frequency indicator that causes the calibration failure of the transceiver sample in the communication module is determined as the impedance of the fixed impedance element to be attached to the first material attachment position.
Specifically, the impedance of the adjustable impedance element in the corresponding communication module in fig. 4 can be determined as the impedance of the fixed impedance element to be mounted on the first material mounting position during the subsequent calibration TRC, so that mass production mounting is realized.
In addition, an appropriate matching form (first material placement) can be reserved at the input port of the power amplifier, and a specific matching value (impedance of the fixed impedance element) can exist different matching values according to different projects, but it is necessary to pull the impedance of the TRC to an inductive region when the Tx AGC (such as the AGC32 in fig. 4) where calibration failure may occur.
Step 103: a calibration operation is performed on the transceiver.
Specifically, after the fixed impedance element is mounted, a calibration operation may be performed on the transceiver, such as performing a calibration on the transceiver at a low power level of Band1 (2100 MHZ).
Compared with the related art, in the embodiment, before the transceiver in the communication module is calibrated, the first material placement positions connected in series are reserved at the transmitting output port of the transceiver and/or the output port of the filter connected with the transmitting output port; attaching a fixed impedance element on the first material attaching position, wherein the fixed impedance element enables impedance on a transmitting output port passage after the transceiver is powered on to be located in a sensitive area; and then, the calibration operation is carried out on the transceiver, so that the calibration passing rate of the transceiver can be obviously improved. According to the scheme, when the communication module is used for production, the purposes of reducing material loss, reducing cost and improving the first pass yield can be achieved.
Another embodiment of the present invention relates to a communication module that is a processing target in the above method embodiment. As shown in fig. 5, the communication module includes: the transceiver comprises a transceiver 1 and a filter 2, wherein a first material paste position connected in series is reserved at a transmitting output port of the transceiver 1 and/or an output port of the filter 2 connected with the transmitting output port, a fixed impedance element 3 is pasted on the first material paste position, and the fixed impedance element 3 enables impedance on a transmitting output port channel after the transceiver is powered on to be located in a sensitive area.
In one example, as shown in fig. 5, the communication module further includes: reserving a second material sticking position in series at a transmitting output port of the transceiver 1; and an isolation capacitor 4 is attached to the second material attaching position, and the isolation capacitor 4 is used for isolating the direct current component on the path of the emission output port.
Specifically, tests show that a communication module of a high-pass 9x07 platform has a direct current component of about 0.8mV at a TRC transmission output port, so that at least two serially-connected material placement positions are reserved during schematic diagram design, and one position is used for optimizing a calibration problem and pulling the impedance of the TRC to an inductive region; one for isolating the dc component.
Another embodiment of the invention relates to an electronic device, as shown in FIG. 6, comprising at least one processor 302; and a memory 301 communicatively coupled to the at least one processor 302; the memory 301 stores instructions executable by the at least one processor 302, and the instructions are executed by the at least one processor 302 to enable the at least one processor 302 to perform any of the method embodiments described above.
Where the memory 301 and processor 302 are coupled in a bus, the bus may comprise any number of interconnected buses and bridges that couple one or more of the various circuits of the processor 302 and memory 301 together. The bus may also connect various other circuits such as peripherals, voltage regulators, power management circuits, etc., which are well known in the art, and therefore, will not be described any further herein. A bus interface provides an interface between the bus and the transceiver. The transceiver may be one element or a plurality of elements, such as a plurality of receivers and transmitters, providing a means for communicating with various other apparatus over a transmission medium. The data processed by the processor 302 is transmitted over a wireless medium through an antenna, which further receives the data and transmits the data to the processor 302.
The processor 302 is responsible for managing the bus and general processing and may also provide various functions including timing, peripheral interfaces, voltage regulation, power management, and other control functions. While memory 301 may be used to store data used by processor 302 in performing operations.
Another embodiment of the present invention relates to a computer-readable storage medium storing a computer program. The computer program realizes the above-described method embodiments when executed by a processor.
That is, as can be understood by those skilled in the art, all or part of the steps in the method for implementing the embodiments described above may be implemented by a program instructing related hardware, where the program is stored in a storage medium and includes several instructions to enable a device (which may be a single chip, a chip, or the like) or a processor (processor) to execute all or part of the steps of the method described in the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (9)
1. A method for gain calibration of a transceiver in a communication module, comprising:
reserving a first material placement position in series at a transmitting output port of a transceiver and/or an output port of a filter connected with the transmitting output port in a communication module;
attaching a fixed impedance element to the first material attaching position, wherein the fixed impedance element enables impedance on the transmission output port passage after the transceiver is powered on to be located in a sensitive area;
performing a calibration operation on the transceiver.
2. The method of claim 1, wherein determining the impedance of the fixed impedance element to be attached to the first material attachment site comprises:
removing a power amplifier connected with an output port of the filter in the communication module, and welding the power amplifier by using a conductor;
testing S22 parameters of a transceiver in the communication module, and balancing various radio frequency indexes of the transceiver in the communication module by debugging the impedance of the adjustable impedance element attached to the first material attaching position;
and determining the impedance of the adjustable impedance element corresponding to the balanced radio frequency indexes as the impedance of a fixed impedance element to be attached on the first material attaching position according to the S22 parameter.
3. The method of claim 1, wherein the testing the S22 parameters of the transceiver in the communication module to balance the radio frequency indicators of the transceiver in the communication module by adjusting the impedance of the adjustable impedance element mounted on the first material mount comprises:
testing S22 parameters of the transceiver samples in the communication module for the transceiver samples in the communication module, wherein the transceiver samples have failed to be calibrated;
and debugging the impedance of the adjustable impedance element attached to the first material attaching position to enable the radio frequency index of the transceiver sample in the communication module, which fails in calibration, to pass calibration.
4. The method according to claim 3, wherein determining, according to the S22 parameter, the impedance of the adjustable impedance element corresponding to the balanced radio frequency indexes as the impedance of a fixed impedance element to be attached to the first material attachment position includes:
and according to the S22 parameter, determining the impedance of the corresponding adjustable impedance element after the radio frequency index which causes the calibration failure of the transceiver sample in the communication module to reach the calibration pass as the impedance of the fixed impedance element to be attached on the first material attaching position.
5. The method according to any one of claims 1-4, further comprising:
reserving second material attaching positions connected in series at a transmitting output port of a transceiver in the communication module;
and attaching an isolation capacitor on the second material attaching position, wherein the isolation capacitor is used for isolating the direct current component on the transmitting output port passage.
6. A communication module, comprising: the transceiver and the filter are positioned at a transmitting output port of the transceiver and/or an output port of the filter connected with the transmitting output port, a first material paste position connected in series is reserved on the output port of the filter, a fixed impedance element is pasted on the first material paste position, and the fixed impedance element enables impedance on a transmitting output port channel after the transceiver is powered on to be positioned in a sensitive area.
7. The communication module according to claim 6, wherein a second material pad is reserved in series at a transmitting output port of the transceiver; and an isolation capacitor is attached to the second material attaching position and used for isolating the direct current component on the transmitting output port passage.
8. An electronic device, comprising:
at least one processor; and the number of the first and second groups,
a memory communicatively coupled to the at least one processor; wherein,
the memory stores instructions executable by the at least one processor to cause the at least one processor to perform the method of gain calibration for a transceiver in a communication module of any of claims 1 to 5.
9. A computer-readable storage medium storing a computer program which, when executed by a processor, implements the gain calibration method for a transceiver in a communication module of any of claims 1 to 5.
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