CN115621374B - Repair method of micro LED array substrate and display panel - Google Patents

Repair method of micro LED array substrate and display panel Download PDF

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Publication number
CN115621374B
CN115621374B CN202211194202.5A CN202211194202A CN115621374B CN 115621374 B CN115621374 B CN 115621374B CN 202211194202 A CN202211194202 A CN 202211194202A CN 115621374 B CN115621374 B CN 115621374B
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photoresist
led chip
abnormal
bonding metal
led chips
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CN115621374A (en
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蒲洋
康报虹
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HKC Co Ltd
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HKC Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Led Devices (AREA)

Abstract

The application discloses a repair method of a micro LED array substrate and a display panel, wherein the repair method comprises the following steps: determining abnormal LED chips existing on the driving substrate, wherein the abnormal LED chips are the LED chips with the abnormality in a plurality of LED chips; coating photoresist on one surface of the driving substrate, on which the LED chips are arranged, so that the photoresist covers all the LED chips; removing a portion of the photoresist at the abnormal LED chip to expose an epitaxial layer of the abnormal LED chip and a portion of the electrode; removing the exposed part of the abnormal LED chip; removing all the photoresist at the abnormal LED chip to expose two bonding metal layers corresponding to the abnormal LED chip; bonding two electrodes of the new LED chip with the bonding areas of the exposed bonding metal layer respectively; and removing all the photoresist on the driving substrate. Based on the mode, damage to the micro LED array substrate caused by repair can be reduced or eliminated.

Description

Repair method of micro LED array substrate and display panel
Technical Field
The application relates to the technical field of display, in particular to a repair method of a micro LED array substrate and a display panel.
Background
In the prior art, laser is generally used to remove an abnormal LED chip on a driving substrate in a micro LED array substrate, and then a new LED chip is mounted on the mounting position of the abnormal LED chip to complete repair.
The disadvantage of the prior art is that, in order to achieve the purpose of breaking the abnormal LED chip, the laser needs to be a high-energy laser, and when the abnormal LED chip is broken by using the high-energy laser, the driving substrate is easily damaged by the high-energy laser, for example, the bonding metal on the driving substrate is damaged, so that the micro LED array substrate is greatly damaged based on the existing repairing method.
Disclosure of Invention
The application mainly solves the technical problem of how to reduce or eliminate the damage to the micro LED array substrate caused by repair.
In order to solve the technical problems, the first technical scheme adopted by the application is as follows: the repair method of the micro LED array substrate comprises a driving substrate, wherein a plurality of bonding metal layers and a plurality of LED chips are arranged on the driving substrate, and the bonding metal layers are bonded with electrodes of the corresponding LED chips; after the bonding metal layer is bonded with the corresponding electrode, the bonding metal layer is provided with a bondable region capable of bonding with other electrodes; the repairing method comprises the following steps: determining abnormal LED chips existing on the driving substrate, wherein the abnormal LED chips are the LED chips with the abnormality in the plurality of LED chips; coating photoresist on one surface of the driving substrate, on which the LED chips are arranged, so that the photoresist covers all the LED chips; removing part of the photoresist at the abnormal LED chip to expose part of the epitaxial layer and the electrode of the abnormal LED chip; removing the exposed part of the abnormal LED chip; removing all photoresist at the abnormal LED chip to expose two bonding metal layers corresponding to the abnormal LED chip; bonding two electrodes of the new LED chip with the bonding areas of the exposed one-bond metal layer respectively; and removing all the photoresist on the driving substrate.
Wherein the width of the bonding metal layer is at least twice the width of an electrode in the horizontal direction, and the horizontal direction is parallel to the surface of the driving substrate on which the bonding metal layer is arranged.
The LED chips are arranged on the driving substrate based on a mass transfer method.
Wherein, remove partial photoresist in unusual LED chip department, include: and exposing and developing the photoresist at the abnormal LED chip to remove part of the photoresist at the abnormal LED chip.
Wherein, remove the whole photoresist at unusual LED chip department, include: and exposing and developing the photoresist at the abnormal LED chip to remove all the photoresist at the abnormal LED chip.
Wherein, remove unusual LED chip exposed part, include: etching the exposed part of the abnormal LED chip.
Wherein, etch the part that unusual LED chip exposes, include: etching the exposed part of the abnormal LED chip by adopting acid liquor.
Wherein, remove the whole photoresist on the drive base plate, include: and removing all photoresist on the driving substrate by using a photoresist stripping solution.
Wherein bonding the two electrodes of the new LED chip with the bondable regions of the exposed one-bond metal layer, respectively, comprises: and heating and melting the exposed bonding metal layer, respectively inserting two electrodes of the new LED chip into the heating and melting bonding metal layer, and waiting for cooling and solidifying the bonding metal layer.
In order to solve the technical problems, a second technical scheme adopted by the application is as follows: a display panel comprises a driving chip and a micro LED array substrate repaired based on the repairing method.
The application has the beneficial effects that: in the technical scheme of the application, one side of the driving substrate provided with a plurality of LED chips is coated with photoresist, the photoresist covers all the LED chips, part of photoresist at the abnormal LED chips is removed to expose the epitaxial layer of the abnormal LED chips and part of electrodes thereof, the exposed part of the abnormal LED chips is removed, all of photoresist at the abnormal LED chips is removed to expose two bonding metal layers corresponding to the abnormal LED chips, each electrode of the new LED chips is respectively connected with an exposed bonding metal layer, and all of photoresist on the driving substrate is removed. Based on the mode, the photoresist can be arranged, the damage to other non-abnormal LED chips caused by the photoresist removing operation at the abnormal LED chips can be avoided, and under the condition that the epitaxial layer of the abnormal LED chips and part of the epitaxial layer are exposed and other devices on the driving substrate are covered by the photoresist, any type of LED chip removing mode without removing the photoresist can be adopted to remove the exposed part of the abnormal LED chips, the abnormal LED chips are prevented from being removed by adopting a mode of laser breaking the LED chips, and further the damage to the micro LED array substrate caused by laser is avoided, and the damage to the micro LED array substrate caused by repair is reduced or eliminated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a micro LED array substrate according to an embodiment of the present application;
FIG. 2 is a flow chart of a method for repairing a micro LED array substrate according to an embodiment of the present application;
FIG. 3 is a schematic diagram of step S11 in the repairing method of the micro LED array substrate of the present application;
FIG. 4 is a schematic diagram of step S12 in the repairing method of the micro LED array substrate of the present application;
FIG. 5 is a schematic diagram of step S13 in the repairing method of the micro LED array substrate of the present application;
FIG. 6 is a schematic diagram of step S14 in the repairing method of the micro LED array substrate of the present application;
FIG. 7 is a schematic diagram of step S15 in the repairing method of the micro LED array substrate of the present application;
FIG. 8 is a schematic diagram of step S16 in the repairing method of the micro LED array substrate of the present application;
FIG. 9 is a schematic diagram of step S17 in the repairing method of the micro LED array substrate of the present application;
FIG. 10 is a schematic diagram of a repair device according to an embodiment of the present application;
fig. 11 is a schematic structural diagram of a display panel according to an embodiment of the application.
Reference numerals: the driving substrate 10, the bonding metal layer 11, the led chip 12, the electrode 121, the epitaxial layer 122, the photoresist 13, the repairing device 20, the processing module 21, the coating module 22, the first removing module 23, the second removing module 24, the third removing module 25, the bonding module 26, the fourth removing module 27, the display panel 30, the driving chip 31, and the array substrate 32.
Detailed Description
The application is described in further detail below with reference to the drawings and examples. It is specifically noted that the following examples are only for illustrating the present application, but do not limit the scope of the present application. Likewise, the following examples are only some, but not all, of the examples of the present application, and all other examples, which a person of ordinary skill in the art would obtain without making any inventive effort, are within the scope of the present application.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
In the description of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; the connection can be mechanical connection or electric connection; may be directly connected or may be connected via an intermediate medium. It will be apparent to those skilled in the art that the foregoing is in the specific sense of the present application.
The application firstly discloses a repairing method of a micro LED array substrate, referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of an embodiment of the micro LED array substrate of the application, and fig. 2 is a schematic flow chart of an embodiment of the repairing method of the micro LED array substrate of the application.
As shown in fig. 1, the micro LED array substrate includes a driving substrate 10, on which a plurality of bonding metal layers 11 and a plurality of LED chips 12 are disposed, the bonding metal layers 11 are bonded to one electrode 121 of the corresponding LED chip 12, and each bonding metal layer 11 has a bondable region a capable of bonding with other electrodes 121 after bonding to the corresponding electrode 121.
As shown in fig. 2, the repair method of the micro led array substrate includes:
step S11: the abnormal LED chip X present on the driving substrate 10 is determined.
The abnormal LED chip X is an LED chip 12 having an abnormality among the plurality of LED chips 12.
Referring to fig. 3, fig. 3 is a schematic diagram of step S11 in the repair method of the micro LED array substrate according to the present application, as shown in fig. 3, after a lot of LED chips 12 are basically transferred from growth onto the driving substrate 10 by mass transfer, or after the LED chips 12 on the driving substrate 10 are used for a long time, or in the case where a plurality of LED chips 12 are present on other driving substrates 10, each LED chip 12 on the driving substrate 10 may be subjected to lighting detection to determine the LED chip 12, which emits light abnormally or does not emit light, of the plurality of LED chips 12 as an abnormal LED chip X.
The abnormal LED chip X is likely to cause defects on the screen of the micro LED array substrate, and therefore, the abnormal LED chip X needs to be processed to replace the new normal LED chip 12 with the abnormal LED chip X, thereby completing repair of the micro LED array substrate.
Step S12: the side of the driving substrate 10 on which the LED chips 12 are disposed is coated with a photoresist 13 such that the photoresist 13 covers all of the LED chips 12.
Referring to fig. 4, fig. 4 is a schematic diagram of step S12 in the repair method of the micro LED array substrate according to the present application, as shown in fig. 4, after determining that the abnormal LED chips X exist in the plurality of LED chips 12 disposed on the driving substrate 10, a photoresist 13 may be coated on a side of the driving substrate 10 on which the plurality of LED chips 12 are disposed, so that the coated photoresist 13 forms a glue layer covering all the LED chips 12 (including the abnormal LED chips X).
Step S13: a portion of the photoresist 13 at the abnormal LED chip X is removed to expose a portion of the electrode 121 and the epitaxial layer 122 of the abnormal LED chip X.
Referring to fig. 5, fig. 5 is a schematic diagram of step S13 in the repair method of the micro LED array substrate according to the present application, as shown in fig. 5, any type of removal method corresponding to the applied photoresist may be used to remove the photoresist at the position corresponding to the abnormal LED chip X in the glue layer formed by the photoresist 13, so that only the epitaxial layer 122 of the abnormal LED chip X and a part of the electrode 121 thereof are exposed out of the photoresist 13, and the other part of the electrode 121 of the abnormal LED chip X is still located in the photoresist 13.
Step S14: and removing the exposed part of the abnormal LED chip X.
Referring to fig. 6, fig. 6 is a schematic diagram of step S14 in the repair method of the micro LED array substrate according to the present application, as shown in fig. 6, any type of method that cannot cause loss to the photoresist 13, or that can only cause little loss to the photoresist 13 but cannot cause loss to the object covered by the photoresist 13, may be used to remove the exposed portion of the abnormal LED chip X, that is, remove the exposed epitaxial layer 122 and the exposed electrode 121 of the abnormal LED chip X.
The protection by the photoresist 13 prevents the other normal LED chips 12, the bonding metal layer 11 and the driving substrate 10 from being damaged in the process of removing the exposed portion of the abnormal LED chip X.
Step S15: all the photoresist 13 at the abnormal LED chip X is removed so that the two bonding metal layers 11 corresponding to the abnormal LED chip X are exposed.
Referring to fig. 7, fig. 7 is a schematic diagram of step S15 in the repair method of the micro LED array substrate according to the present application, as shown in fig. 7, any type of removal method corresponding to the applied photoresist may be used to remove all the photoresist at the position corresponding to the abnormal LED chip X in the adhesive layer formed by the photoresist 13, so that only the electrode 121 and the bonding metal layer 11 corresponding to the other part of the residual abnormal LED chip X are exposed.
Step S16: the two electrodes 121 of the new LED chip 12 are bonded to the bondable region a of the exposed one-bond metal layer 11, respectively.
Referring to fig. 8, fig. 8 is a schematic diagram of step S16 in the repair method of the micro LED array substrate according to the present application, as shown in fig. 8, after step S15, two bonding metal layers 11 bonded by an abnormal LED chip X are exposed, each exposed bonding metal layer 11 is reserved with a corresponding bondable region a, and two electrodes of a new LED chip 12 are bonded with one of the bondable regions a, so that the new LED chip 12 is replaced with the abnormal LED chip X.
Based on the protection of the photoresist 13, in the process of bonding the two electrodes of the new LED chip 12 with one of the bondable areas A, the bonding metal layers 11 in the photoresist 13 are not damaged, and abnormal bonding of other normal LED chips 12 is avoided.
Step S17: all the photoresist 13 on the drive substrate 10 is removed.
Referring to fig. 9, fig. 9 is a schematic diagram of step S17 in the repair method of the micro LED array substrate according to the present application, as shown in fig. 9, after the replacement of the new LED chip 12 and the abnormal LED chip X is completed, the photoresist 13 remaining on the driving substrate 10 may be removed, and the micro LED array substrate after the repair is completed is obtained.
Based on the above manner, the abnormal LED chip X and the new LED chip 12 can be removed by coating and gradually removing the photoresist, and the damage to the normal LED chip 12 and related things caused by the repair operation in the process can be avoided as much as possible, the reliability of the repair method is improved, and the damage to the micro LED array substrate caused by the repair is reduced or eliminated.
In the technical scheme of the application, one side of the driving substrate provided with a plurality of LED chips is coated with photoresist, the photoresist covers all the LED chips, part of photoresist at the abnormal LED chips is removed to expose the epitaxial layer of the abnormal LED chips and part of electrodes thereof, the exposed part of the abnormal LED chips is removed, all of photoresist at the abnormal LED chips is removed to expose two bonding metal layers corresponding to the abnormal LED chips, each electrode of the new LED chips is respectively connected with an exposed bonding metal layer, and all of photoresist on the driving substrate is removed. Based on the mode, the photoresist can be arranged, the damage to other non-abnormal LED chips caused by the photoresist removing operation at the abnormal LED chips can be avoided, and under the condition that the epitaxial layer of the abnormal LED chips and part of the epitaxial layer are exposed and other devices on the driving substrate are covered by the photoresist, any type of LED chip removing mode without removing the photoresist can be adopted to remove the exposed part of the abnormal LED chips, the abnormal LED chips are prevented from being removed by adopting a mode of laser breaking the LED chips, and further the damage to the micro LED array substrate caused by laser is avoided, and the damage to the micro LED array substrate caused by repair is reduced or eliminated.
In one embodiment, as shown in fig. 1, the width of the bonding metal layer 11 is at least twice the width of the electrode 121 in the horizontal direction D1, and the horizontal direction D1 is parallel to the surface of the driving substrate 10 on which the bonding metal layer 11 is disposed.
Specifically, as shown in fig. 1, the horizontal direction D1 may be a direction parallel to the width direction of the bonding metal layer 11, in the horizontal direction D1, the width of the bonding metal layer 11 is at least twice the width of one electrode 121, and in each bonding metal layer 11, the area other than the area where the electrode 121 is bonded to the bonding metal layer 11 is the bondable area a.
In this way, the width of the bonding metal layer 11 in the horizontal direction D1 is at least twice that of the electrode 121, and the bonding positions of the electrode 121 on the bonding metal layer 11 are reasonably arranged, so that a certain area of the bondable region a is enough for bonding the electrode 121.
Alternatively, the area of the entire area on the bonding metal layer 11 available for bonding is at least twice the area required for bonding the electrode 121 on the bonding metal layer 11.
In one embodiment, the plurality of LED chips 12 are LED chips 12 disposed on the driving substrate 10 based on a mass transfer method.
Specifically, the mass transfer method may be any mass transfer method suitable for the corresponding LED chip 12, and may be specifically determined according to practical needs, which is not limited herein.
The LED chip 12 may be a micro LED, or may be any other type of light emitting device, which may be specifically determined according to practical requirements, and is not limited herein.
In an embodiment, step S13 may include:
the photoresist 13 at the abnormal LED chip X is exposed and developed to remove a portion of the photoresist 13 at the abnormal LED chip X.
Specifically, the exposure and development technology may be used to remove a portion of the photoresist 13 at the abnormal LED chip X, or other types of photoresist removal technologies may be used to remove the portion of the photoresist 13, which is not limited herein.
In an embodiment, step S15 may include:
and exposing and developing the photoresist at the position of the abnormal LED chip X to remove all the photoresist at the position of the abnormal LED chip X.
Specifically, the exposure and development technique may be used to remove all of the photoresist 13 remaining at the abnormal LED chip X, or other types of photoresist removal techniques may be used to remove the portion of the photoresist 13, which is not limited herein.
In an embodiment, step S14 may include:
the exposed portion of the abnormal LED chip X is etched.
Specifically, the etching operation may be performed using any liquid that cannot react with the photoresist 13 and can be etched with the epitaxial layer 122 of the abnormal LED chip X and the exposed electrode 121 thereof.
Based on the above mode, the exposed part of the abnormal LED chip X can be prevented from being removed by adopting the laser shredding mode, so that the damage of laser to the micro LED array substrate is prevented, the part of the abnormal LED chip X exposed outside the photoresist 13 is subjected to targeted etching based on etching liquid, the part of the micro LED array substrate except the abnormal LED chip X is placed to be damaged, and the damage to the micro LED array substrate caused by repairing is further reduced or eliminated.
Optionally, etching the exposed portion of the abnormal LED chip X may specifically include:
etching the exposed part of the abnormal LED chip X by adopting acid liquor.
Specifically, the epitaxial layer 122 and the partial electrode 121 exposed by the abnormal LED chip X can be etched by using an acid solution capable of etching the epitaxial layer 122 and the partial electrode 121 of the abnormal LED chip X, and since the acid solution does not etch the photoresist 13, other LED chips 12 in the photoresist 13 are not affected by the acid solution, and damage to the micro LED array substrate caused by repairing is reduced.
In one embodiment, step S17 may specifically include:
the photoresist stripping solution is used to remove all of the photoresist 13 on the drive substrate 10.
Specifically, after the replacement of the abnormal LED chip X and the new LED chip 12 is completed, the photoresist stripping solution may be used to remove all the photoresist 13 remaining on the driving substrate 10, thereby completing the repair process of the entire micro LED array substrate.
In one embodiment, the step S16 may specifically include:
the exposed bonding metal layer 11 is heated and melted, and two electrodes 121 of a new LED chip 12 are respectively inserted into one of the heated and melted bonding metal layers 11, and the bonding metal layer 11 is waited for cooling and solidifying.
Specifically, the bonding metal layer 11 may be a metal layer formed by vapor deposition of indium In or tin Sn, and when it is required to bond an electrode 121 to the bonding metal layer 11, the bonding between the electrode 121 and the corresponding bonding metal layer 11 may be completed by heating and melting the metal on the bonding metal layer 11, inserting the electrode 121 into the melted bonding metal layer 11, and cooling and solidifying the bonding metal layer 11 after the temperature of the bonding metal layer 11 is reduced.
The application also provides a repairing device for the micro LED array substrate, as shown in fig. 1, the micro LED array substrate comprises a driving substrate 10, a plurality of bonding metal layers 11 and a plurality of LED chips 12 are arranged on the driving substrate 10, the bonding metal layers 11 are bonded with one electrode 121 of the corresponding LED chip 12, and each bonding metal layer 11 has a bondable area a capable of being bonded with other electrodes 121 after being bonded with the corresponding electrode 121.
Referring to fig. 10, fig. 10 is a schematic structural view of an embodiment of the repairing device of the present application, and as shown in fig. 10, the repairing device 20 includes a processing module 21, a coating module 22, a first removing module 23, a second removing module 24, a third removing module 25, a bonding module 26, and a fourth removing module 27.
The processing module 21 is configured to determine an abnormal LED chip existing on the driving substrate, where the abnormal LED chip is an LED chip having an abnormality among the plurality of LED chips.
The coating module 22 is used for coating photoresist on one surface of the driving substrate on which the LED chips are arranged, so that the photoresist covers all the LED chips.
The first removing module 23 is used to remove the photoresist at the abnormal LED chip so that the epitaxial layer of the abnormal LED chip and a portion of the electrode are exposed.
The second removing module 24 is used for removing the exposed portion of the abnormal LED chip.
The third removing module 25 is used for removing photoresist at the abnormal LED chip to expose two bonding metal layers corresponding to the abnormal LED chip.
The bonding die block 26 is used to bond the two electrodes of the new LED chip with the bondable regions of the exposed one-bond metal layer, respectively.
The fourth removal module 27 is used to remove all the photoresist on the drive substrate.
In the technical scheme of the application, one side of the driving substrate provided with a plurality of LED chips is coated with photoresist, the photoresist covers all the LED chips, part of photoresist at the abnormal LED chips is removed to expose the epitaxial layer of the abnormal LED chips and part of electrodes thereof, the exposed part of the abnormal LED chips is removed, all of photoresist at the abnormal LED chips is removed to expose two bonding metal layers corresponding to the abnormal LED chips, each electrode of the new LED chips is respectively connected with an exposed bonding metal layer, and all of photoresist on the driving substrate is removed. Based on the mode, the photoresist can be arranged, the damage to other non-abnormal LED chips caused by the photoresist removing operation at the abnormal LED chips can be avoided, and under the condition that the epitaxial layer of the abnormal LED chips and part of the epitaxial layer are exposed and other devices on the driving substrate are covered by the photoresist, any type of LED chip removing mode without removing the photoresist can be adopted to remove the exposed part of the abnormal LED chips, the abnormal LED chips are prevented from being removed by adopting a mode of laser breaking the LED chips, and further the damage to the micro LED array substrate caused by laser is avoided, and the damage to the micro LED array substrate caused by repair is reduced or eliminated.
The present application also proposes a display panel, referring to fig. 11, fig. 11 is a schematic structural diagram of an embodiment of the display panel of the present application, the display panel 30 includes a driving chip 31 and an array substrate 32, and the array substrate 32 is a micro led array substrate repaired by the repairing method according to any one of the foregoing embodiments.
As shown in fig. 9, in the micro LED array substrate repaired by the repair method according to any of the foregoing embodiments, part of the electrodes of the removed abnormal LED chip X remain on the bonding metal layer 11 of the LED chip, and the electrodes of the new LED chip 12 are disposed on the bonding metal layer 11 except for the area occupied by the part of the electrodes.
In the technical scheme of the application, one side of the driving substrate provided with a plurality of LED chips is coated with photoresist, the photoresist covers all the LED chips, part of photoresist at the abnormal LED chips is removed to expose the epitaxial layer of the abnormal LED chips and part of electrodes thereof, the exposed part of the abnormal LED chips is removed, all of photoresist at the abnormal LED chips is removed to expose two bonding metal layers corresponding to the abnormal LED chips, each electrode of the new LED chips is respectively connected with an exposed bonding metal layer, and all of photoresist on the driving substrate is removed. Based on the mode, the photoresist can be arranged, the damage to other non-abnormal LED chips caused by the photoresist removing operation at the abnormal LED chips can be avoided, and under the condition that the epitaxial layer of the abnormal LED chips and part of the epitaxial layer are exposed and other devices on the driving substrate are covered by the photoresist, any type of LED chip removing mode without removing the photoresist can be adopted to remove the exposed part of the abnormal LED chips, the abnormal LED chips are prevented from being removed by adopting a mode of laser breaking the LED chips, and further the damage to the micro LED array substrate caused by laser is avoided, and the damage to the micro LED array substrate caused by repair is reduced or eliminated.
In the description of the present application, a description of the terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and further implementations are included within the scope of the preferred embodiment of the present application in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present application.
Logic and/or steps represented in the flowcharts or otherwise described herein, e.g., may be considered as a ordered listing of executable instructions for implementing logical functions, can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device (which can be a personal computer, server, network device, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions). For the purposes of this description, a "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of the computer-readable medium would include the following: an electrical connection (electronic device) having one or more wires, a portable computer diskette (magnetic device), a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). In addition, the computer readable medium may even be paper or other suitable medium on which the program is printed, as the program may be electronically captured, via, for instance, optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner, if necessary, and then stored in a computer memory.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application or directly or indirectly applied to other related technical fields are included in the scope of the present application.

Claims (10)

1. The repair method of the micro LED array substrate is characterized in that the micro LED array substrate comprises a driving substrate, wherein a plurality of bonding metal layers and a plurality of LED chips are arranged on the driving substrate, and the bonding metal layers are bonded with electrodes of the corresponding LED chips; after the bonding metal layer is bonded with the corresponding electrode, the bonding metal layer is provided with a bondable region capable of bonding with other electrodes;
the repairing method comprises the following steps:
determining abnormal LED chips existing on the driving substrate, wherein the abnormal LED chips are the LED chips with the abnormality in a plurality of LED chips;
coating photoresist on one surface of the driving substrate, on which the LED chips are arranged, so that the photoresist covers all the LED chips;
removing a portion of the photoresist at the abnormal LED chip to expose an epitaxial layer of the abnormal LED chip and a portion of the electrode;
removing the exposed part of the abnormal LED chip;
removing all the photoresist at the abnormal LED chip to expose two bonding metal layers corresponding to the abnormal LED chip;
bonding two electrodes of the new LED chip with the bonding areas of the exposed bonding metal layer respectively;
and removing all the photoresist on the driving substrate.
2. The repairing method according to claim 1, wherein a width of one of the bonding metal layers is at least twice as large as a width of one of the electrodes in a horizontal direction, the horizontal direction being parallel to a surface of the driving substrate on which the bonding metal layer is disposed.
3. The repairing method according to claim 1 or 2, wherein the plurality of LED chips are LED chips provided on the driving substrate based on a mass transfer method.
4. The repair method of claim 1 or 2, wherein the removing the portion of the photoresist at the abnormal LED chip comprises:
and exposing and developing the photoresist at the abnormal LED chip to remove part of the photoresist at the abnormal LED chip.
5. The repair method of claim 1 or 2, wherein the removing all of the photoresist at the abnormal LED chip comprises:
and exposing and developing the photoresist at the abnormal LED chip to remove all the photoresist at the abnormal LED chip.
6. The repairing method according to claim 1 or 2, wherein the removing the exposed portion of the abnormal LED chip comprises:
etching the exposed part of the abnormal LED chip.
7. The method of repairing of claim 6, wherein etching the exposed portion of the abnormal LED chip comprises:
and etching the exposed part of the abnormal LED chip by adopting acid liquor.
8. The repair method according to claim 1 or 2, wherein said removing all of the photoresist on the drive substrate comprises:
and removing all the photoresist on the driving substrate by adopting photoresist stripping liquid.
9. The repair method according to claim 1 or 2, wherein bonding the two electrodes of the new LED chip to the bonding-available regions of the exposed one of the bonding metal layers, respectively, comprises:
and heating and melting the exposed bonding metal layer, respectively inserting two electrodes of a new LED chip into the heated and melted bonding metal layer, and waiting for cooling and solidifying the bonding metal layer.
10. A display panel, characterized in that the display panel comprises a driving chip and a micro led array substrate repaired based on the repair method of any one of claims 1 to 9.
CN202211194202.5A 2022-09-28 2022-09-28 Repair method of micro LED array substrate and display panel Active CN115621374B (en)

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