CN115618789B

CN115618789B - Method and system for automatically eliminating isolated island and micropore of integrated circuit layout

Info

Publication number: CN115618789B
Application number: CN202211633416.8A
Authority: CN
Inventors: 唐章宏
Original assignee: Beijing Wisechip Simulation Technology Co Ltd
Current assignee: Beijing Wisechip Simulation Technology Co Ltd
Priority date: 2022-12-19
Filing date: 2022-12-19
Publication date: 2023-03-17
Anticipated expiration: 2042-12-19
Also published as: CN115618789A

Abstract

A system for a method of automatic elimination of integrated circuit layout islands and microvias, comprising: converting a part defined as a hole and a part coated with copper in the integrated circuit layout into layout polygons and performing Boolean operation to form uniform layout polygons; identifying boundaries of islands and/or micropores in the unified layout polygon based on the grids, and generating a covering polygon for covering the islands and/or micropores based on the boundaries and the grids; re-reading the integrated circuit layout, and generating a new integrated circuit layout together with the generated covering polygon so as to eliminate isolated islands and/or micropores contained in the initial integrated circuit layout; through carrying out automatic elimination processing to micropore and/or isolated island in the integrated circuit territory, avoid micropore and isolated island to appear influencing the reliability of territory in the integrated circuit territory and detect the discovery defect to the isolated island and the micropore that produce in technology production, reduce integrated circuit preparation cost, promoted production efficiency.

Description

Method and system for automatically eliminating isolated island and micropore of integrated circuit layout

Technical Field

The application relates to the technical field of integrated circuits, in particular to a method and a system for automatically eliminating an isolated island and a micropore of an integrated circuit layout.

Background

The integrated circuit layout is an intermediate link between the integrated circuit schematic diagram and the integrated circuit process realization and is an essential important link. With the development of communication technology, research and development of very large scale integrated circuits have been gradually developed. In order to improve the performance of electronic equipment, reduce the size and cost, transistors, other components and circuits are integrated on a small semiconductor substrate. In order to realize more functions, the ultra-large scale integrated circuit has a structure from several layers to hundreds of layers, each layer of structure is extremely complex, tens of millions of transistors are integrated, and the ultra-large scale integrated circuit has a multi-scale structure from a centimeter level to the latest nanometer level at present. Integrated circuit layouts may hide many microvias and islands that may appear in the integrated circuit through process implementations. These micro-holes and islands present in the produced integrated circuits affect the safety and accuracy of the circuit usage, as shown by the islands and micro-holes in fig. 2 and 3. How to eliminate micropore and island in integrated circuit layout design, avoid micropore and island to cause the design defect to avoid detecting out micropore and island after tape-out or system board and lead to the re-preparation, increase integrated circuit preparation cycle and cost, the technical problem that the skilled person in the art needs a lot of solution.

Disclosure of Invention

Object of the application

In view of the above, the present application aims to provide a method and a system for automatically eliminating an island and a micropore in an integrated circuit layout, so as to solve the technical problem of how to eliminate the micropore and the island in the integrated circuit layout design.

(II) technical scheme

The application discloses a method for automatically eliminating an isolated island and a micropore of an integrated circuit layout, which comprises the following steps:

s1, converting a part defined as a hole and a part coated with copper in an integrated circuit layout into layout polygons and performing Boolean operation to form uniform layout polygons;

s2, identifying boundaries of the islands and/or the micropores in the unified layout polygon, and generating covering polygons for covering the islands and/or the micropores on the basis of the boundaries;

s3, defining a part covering the island and covering the polygon as a hole and/or defining a part covering the micropore and covering the polygon as copper cladding;

and S4, reading in the integrated circuit layout again, and generating a new integrated circuit layout together with the generated covering polygon to eliminate the isolated island and/or the micropore.

In one possible embodiment, the converting the portion defined as the hole and the portion covered with copper in the integrated circuit layout into layout polygons and performing boolean operations to form uniform layout polygons includes:

s11, converting a part defined as a hole in the integrated circuit layout into a hollowed polygon; the method comprises the steps that a spacer caused by a via hole in a hole part is converted into a first hollowed polygon, when the shape of the spacer caused by the via hole is defined as a circle in a layout of an integrated circuit, the first hollowed polygon is a regular polygon, when the shape of the spacer caused by the via hole is defined as an ellipse in the layout of the integrated circuit, discrete points are taken according to the ellipse under polar coordinates with equal radian, the first hollowed polygon is a polygon formed by sequentially connecting the discrete points, and when the shape of the spacer caused by the via hole is defined as a polygon in the layout of the integrated circuit, the first hollowed polygon is a polygon defined in the layout; converting a hollowed circle, a hollowed ellipse and a hollowed polygon in a part, defined as a copper-clad part, of an integrated circuit layout in a hole into a second hollowed polygon, wherein the second hollowed polygon is a regular polygon when the hollowed circle, the hollowed ellipse and the hollowed polygon are hollowed in the part, defined as the hollowed circle, defined as the copper-clad part, discrete points are taken according to the ellipse at equal radian under polar coordinates when the hollowed polygon is defined as the hollowed ellipse, the second hollowed polygon is a polygon formed by sequentially connecting the discrete points, and the second hollowed polygon is a polygon defined in the layout when the hollowed polygon is defined as the copper-clad part;

s12, converting a part defined as copper-clad in the integrated circuit layout into a polygon coated with copper; wherein, the routing in the copper-clad part is converted into a first copper-clad polygon according to a starting point, an end point and a width, the first copper-clad polygon is a rectangle, a pad caused by a via hole in the copper-clad part is converted into a second copper-clad polygon, the second copper-clad polygon is in a hollowed-out polygon converted by the isolation gasket, when the shape of the pad is defined as a circle in a layout of the integrated circuit, the second copper-clad polygon is a regular polygon, when the shape of the pad is defined as an ellipse in the layout of the integrated circuit, discrete points are taken according to an equal radian of the ellipse under a polar coordinate, and the second copper-clad polygon is a polygon formed by sequentially connecting the discrete points, when the shape of the bonding pad is defined as a polygon in a layout of the integrated circuit, the polygon of the second copper clad is a polygon defined in the layout, other parts of the copper clad are converted into a polygon of a third copper clad, when other parts of the copper clad are defined as circles, the polygon of the third copper clad is a regular polygon, when other parts of the copper clad are defined as ellipses, discrete points are taken according to equal radians of the ellipses under polar coordinates, the polygon of the third copper clad is a polygon formed by sequentially connecting the discrete points, and when other parts of the copper clad are defined as polygons, the polygon of the third copper clad is a polygon defined in the layout;

s13, performing Boolean operation on the first copper-clad polygon and the third copper-clad polygon to form a third new copper-clad polygon;

s14, performing Boolean difference operation on the third new copper-clad polygon, the first hollowed polygon and the second hollowed polygon respectively to form a first new copper-clad polygon;

and S15, performing Boolean operation on the first new copper-clad polygon and the second copper-clad polygon to form a uniform layout polygon.

In a possible embodiment, the identifying boundaries of islands and/or micro-holes in the unified layout polygon, and the generating a covering polygon for covering the islands and/or micro-holes based on the boundaries includes:

s21, mesh division is carried out on the vertexes of the unified layout polygons according to a Delaunay division rule to form mesh division; s22, constructing a constraint triangular mesh which takes the edges of the uniform layout polygons as constraints based on an edge exchange method;

s23, identifying each copper-clad area and/or each hollowed area in the unified layout polygon based on the constraint triangular meshes;

s24, identifying an island based on the area size of each copper-clad region and/or identifying a micropore based on the area size of each hollowed region;

s25, for each island and/or micropore, setting the corresponding side of the triangle of the adjacent triangle without the same number as the boundary of the island and/or micropore;

s26, connecting the corresponding edges of the constrained triangles of the neighboring triangles without the same number in each island and/or micropore end to form a polygon E;

s27, establishing an outer auxiliary polygon E for covering the island and/or the micropore based on the polygon E and the triangular mesh ₁ (ii) a The outer auxiliary polygon E ₁ The covering polygons are used for covering the islands and/or the micropores.

In a possible embodiment, the identifying each copper-clad region and/or each hollowed-out region in the unified layout polygon based on the constrained triangular mesh comprises:

s230, initially setting the numbers of all triangles as unnumbered numbers; the triangle filling number of the current copper-clad area is set asfp=0; set the triangle filling number of the current hollowed area asfn=0; setting a current peripheral copper-clad grid cell setFront _p Is empty; setting a current set of peripheral excavated grid cellsFront _n Is empty; set the current process toq=1 polygon;

s231, if q>The number of polygons is entered into step S238, otherwise, if the current processing is the second oneqIf the polygon is a copper-clad polygon, go to step S232, if the current processing is the second oneqEach polygon is a hollowed polygon, and the step S235 is executed; s232, settingfp=fp+1, to the secondqA plurality of copper-clad polygons formed from any sides of the polygonseStarting from, find the left triangle with this edge associationt1If said left triangle ist1Is unnumbered, and is provided with a trianglet1Is numbered asfpAdd it to the collectionFront _p In, any side of the polygoneIs a left triangle including the sideeAnd the triangle sideeDirection and polygonal side ofeTriangles with the same direction;

s233, covering copper grid unit assembly from peripheryFront _p Take out a triangletAnd from the collectionFront _p If the triangle is removedtIs unnumbered and the common edge is not an edge of any polygon, the triangle is numberedtThe one or more neighboring triangles are added to the peripheral copper-clad grid cell setFront _p And adding the newly added peripheral copper-clad grid unit setFront _p The triangle of (a) is numbered asfpWherein the common edge refers to the triangletAdjacent triangles and said triangletA common edge of (a);

s234, judging the peripheral copper-clad grid unit setFront _p If not, go to step S233, if yes, setq=q+1, go to step S231;

s235, settingfn=fn-1, toqA plurality of hollowed-out polygons formed from any side of the polygoneFrom this, the right triangle associated with this edge is foundt1If said right triangle ist1Is unnumbered, set up a trianglet1Is numbered asfnAdd it to the collectionFront _n In, any side of the polygoneIs a right triangle including the sideeAnd the triangle sideeDirection and polygonal side ofeTriangles of opposite direction;

s236, hollowing out the grid cell set from the peripheryFront _n Take out a triangletAnd from the collectionFront _n If the triangle is removedtIs unnumbered, and the triangle is numbered with any one or more of the three neighboring trianglestIf the number of the neighbor triangle is that the edge corresponding to the unnumbered neighbor is not the edge of the polygon, the triangle is divided into three partstThe one or more neighbor triangles of (a) join the setFront _n And adding a new one to the peripheral excavated grid cell setFront _n The triangle of (a) is numbered asfn；

S237, judging the peripheral hollowed grid cell setFront _n If not, go to step S236, if so, setq=q+1, go to step S231;

and S238, accumulating the areas of the triangles with the same number based on the number filling results of the triangular meshes, judging the island and/or the micropores according to the size of the area of the triangular meshes corresponding to the number, and if the area sum is smaller than a given area threshold, determining the area corresponding to the number as the island and/or the micropore, wherein the area number of the island is positive and/or the area number of the micropore is negative.

In a possible embodiment, the outer auxiliary polygon for covering the island and/or the micropore is established based on the polygon E and the triangular meshE1 comprises: in a polygonEOut of shape to form a polygonEOuter auxiliary polygon E of ₁ And controlling the outer auxiliary polygon and the polygon through a set distance threshold valueEOf the distance of (c).

As a second aspect of the present application, there is also disclosed a system for automatically eliminating islands and microvias in an integrated circuit layout, comprising a layout conversion module, a covered polygon generation module, a covered polygon definition module, and an integrated circuit layout regeneration module; the layout conversion module is used for converting a part defined as a hole and a part coated with copper in the integrated circuit layout into layout polygons and performing Boolean operation to form uniform layout polygons; the coverage polygon generation module is used for identifying the boundaries of the islands and/or micropores in the unified layout polygon and generating a coverage polygon for covering the islands and/or micropores on the basis of the boundaries; the covering polygon definition module is used for defining a part of a covering polygon covering the island as a hole and/or defining a part of a covering polygon covering the micropore as copper cladding; the integrated circuit layout regenerating module is used for reading in the integrated circuit layout again, generating a new integrated circuit layout together with the generated covering polygon and eliminating the isolated island and/or the micropore.

In one possible implementation, the layout conversion module comprises a hole conversion unit, a copper-clad conversion unit, a third new copper-clad polygonal boolean operation unit, a first new copper-clad polygonal boolean operation unit and a unified layout polygonal boolean operation unit;

the hole conversion unit is used for converting a part defined as a hole in the integrated circuit layout into a hollowed polygon; the method comprises the steps that a spacer caused by a via hole in a hole part is converted into a first hollowed polygon, when the shape of the spacer caused by the via hole is defined as a circle in a layout of an integrated circuit, the first hollowed polygon is a regular polygon, when the shape of the spacer caused by the via hole is defined as an ellipse in the layout of the integrated circuit, discrete points are taken according to the ellipse under polar coordinates with equal radian, the first hollowed polygon is a polygon formed by sequentially connecting the discrete points, and when the shape of the spacer caused by the via hole is defined as a polygon in the layout of the integrated circuit, the first hollowed polygon is a polygon defined in the layout; converting a hollowed circle, a hollowed ellipse and a hollowed polygon in a part, defined as a copper-clad part, of an integrated circuit layout in a hole into a second hollowed polygon, wherein the second hollowed polygon is a regular polygon when the hollowed circle, the hollowed ellipse and the hollowed polygon are hollowed in the part, defined as the hollowed circle, defined as the copper-clad part, discrete points are taken according to the ellipse at equal radian under polar coordinates when the hollowed polygon is defined as the hollowed ellipse, the second hollowed polygon is a polygon formed by sequentially connecting the discrete points, and the second hollowed polygon is a polygon defined in the layout when the hollowed polygon is defined as the copper-clad part;

the copper-clad conversion unit is used for converting a part defined as copper-clad in the integrated circuit layout into a polygon coated with copper; wherein, the routing in the copper-clad part is converted into a first copper-clad polygon according to a starting point, an end point and a width, the first copper-clad polygon is a rectangle, a pad caused by a via hole in the copper-clad part is converted into a second copper-clad polygon, the second copper-clad polygon is in a hollowed-out polygon converted by the isolation gasket, when the shape of the pad is defined as a circle in a layout of the integrated circuit, the second copper-clad polygon is a regular polygon, when the shape of the pad is defined as an ellipse in the layout of the integrated circuit, discrete points are taken according to an equal radian of the ellipse under a polar coordinate, and the second copper-clad polygon is a polygon formed by sequentially connecting the discrete points, when the shape of the bonding pad is defined as a polygon in a layout of the integrated circuit, the polygon of the second copper clad is a polygon defined in the layout, other parts of the copper clad are converted into a polygon of a third copper clad, when other parts of the copper clad are defined as circles, the polygon of the third copper clad is a regular polygon, when other parts of the copper clad are defined as ellipses, discrete points are taken according to equal radians of the ellipses under polar coordinates, the polygon of the third copper clad is a polygon formed by sequentially connecting the discrete points, and when other parts of the copper clad are defined as polygons, the polygon of the third copper clad is a polygon defined in the layout;

the third new copper-clad polygon Boolean operation unit is used for performing Boolean operation on the first copper-clad polygon and the third copper-clad polygon to form a third new copper-clad polygon;

the first new copper-clad polygon Boolean operation unit is used for performing Boolean difference operation on the third new copper-clad polygon and the first hollowed-out polygon and the second hollowed-out polygon respectively to form a first new copper-clad polygon;

the uniform layout polygon Boolean operation unit is used for performing Boolean operation on the first new copper-clad polygon and the second copper-clad polygon to form a uniform layout polygon.

In a possible implementation, the overlay polygon generation module comprises a first unit, a second unit, a third unit, a fourth unit, a fifth unit, a sixth unit, and a seventh unit; the first unit is used for mesh division of the vertexes of the unified layout polygons according to a Delaunay division rule to form mesh division; the second unit is used for constructing a constraint triangular mesh which takes the edges of the uniform layout polygons as constraints based on an edge exchange method; the third unit is used for identifying each copper-clad area and/or each hollowed area in the unified layout polygon based on the constraint triangular meshes; the fourth unit is used for identifying an island based on the area size of each copper-clad region and/or identifying a micropore based on the area size of each hollowed-out region; the fifth unit is used for setting the corresponding side of the triangle of the adjacent triangle without the same number as the boundary of each island and/or micropore; the sixth unit is used for connecting the edges corresponding to the constraint triangles of the neighbor triangles without the same number in each island and/or micropore end to form a polygon E; the seventh unit is configured to create an outer auxiliary polygon E for covering the island and/or the micro-hole based on the polygon E and the triangular mesh ₁ (ii) a The outer auxiliary polygon E ₁ The covering polygons are used for covering the islands and/or the micropores.

In a possible implementation, the third unit performs steps including:

s230, initially setting the serial numbers of all triangles as unnumbered numbers; the triangle filling number of the current copper-clad area is set asfp=0; set the triangle filling number of the current hollowed area asfn=0; setting a current peripheral copper-clad grid cell setFront _p Is empty; setting a current set of peripheral excavated grid cellsFront _n Is empty; set the current process toq=1 polygon;

s234, judging the peripheral copper-clad grid unitCollectionFront _p If not, go to step S233, if yes, setq=q+1, go to step S231;

s235, settingfn=fn-1, toqA plurality of hollowed-out polygons formed from any side of the polygoneFrom this point on, find the right triangle with this edge associationt1If said right triangle ist1Is unnumbered, and is provided with a trianglet1Is numbered asfnAdd it to the collectionFront _n In, any side of the polygoneIs a right triangle including the sideeAnd the triangle sideeDirection and polygonal side ofeTriangles of opposite direction;

s236, hollowing out the grid cell set from the peripheryFront _n Take out a triangletAnd from the collectionFront _n If the triangle is removedtIs unnumbered, and the triangle is numbered with any one or more of the three neighboring trianglestIf the number of the neighbor triangle is that the edge corresponding to the unnumbered neighbor is not the edge of the polygon, the triangle is divided into three partstThe one or more neighbor triangles of (2) join the setFront _n And adding a new one to the peripheral excavated grid cell setFront _n The triangle of (a) is numbered asfn；

In a possible embodiment, the creating of the outer auxiliary poly for covering the islands and/or micro-holes based on the polygon E and the triangular meshThe polygon E1 includes: in a polygonEOut of shape to form a polygonEOuter auxiliary polygon E of ₁ And controlling the outer auxiliary polygon and the polygon through a set distance threshold valueEThe distance of (c).

(III) advantageous effects

This application has avoided artificial processing through carrying out the automatic elimination processing to micropore and/or isolated island in the integrated circuit territory, has saved manpower and materials, avoids micropore and isolated island to realize appearing in integrated circuit through the technology simultaneously to avoid detecting discovery defect to the isolated island and the micropore that produce in technology production, reduce integrated circuit preparation cost, promoted production efficiency.

Additional advantages, objects, and features of the application will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the application. The objectives and other advantages of the present application may be realized and attained by the means of the instrumentalities and combinations particularly pointed out hereinafter.

Drawings

The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining and illustrating the present application and should not be construed as limiting the scope of the present application.

FIG. 1 is a flow chart of a method of the present application;

FIG. 2 is a schematic illustration of a microwell of the present application;

FIG. 3 is a schematic island diagram of the present application;

FIG. 4 is a schematic diagram of the process of generating a triangle mesh constrained by the edge-exchange method according to the present application;

FIG. 5 is a schematic view of polygon E shown in the present application;

FIG. 6 is a schematic diagram of a triangle mesh with at most one edge of each triangle in the triangle mesh coinciding with an edge of the polygon E, with an auxiliary node inserted therein;

FIG. 7 is a polygon E with a point-taking structure on an angular bisector according to the present application ₁ Vertex B of ₁ A schematic diagram;

FIG. 8 is a system block diagram of the present application;

wherein, 1, a layout conversion module; 2. a covering polygon generation module; 3. an overlay polygon definition module; 4. and the integrated circuit layout regenerating module.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the above description of the present application, it should be noted that the terms "one side", "the other side", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when using, are only used for convenience of description and simplification of description, and do not indicate or imply that the devices or elements that are referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

As shown in fig. 1, the present embodiment provides a method for rapidly detecting an island in an integrated circuit layout, including the following steps:

s1, converting a part defined as a hole and a part coated with copper in an integrated circuit layout into layout polygons and performing Boolean operation to form uniform layout polygons. The uniform layout polygon formed here can be used for Delaunay to perform triangular mesh subdivision.

In some embodiments, the converting the portion defined as the hole and the portion coated with copper in the integrated circuit layout into layout polygons and performing boolean operations, and forming uniform layout polygons includes:

s11, converting a part defined as a hole in the integrated circuit layout into a hollowed polygon; the method comprises the steps that a spacer caused by a via hole in a hole part is converted into a first hollowed polygon, when the shape of the spacer caused by the via hole is defined as a circle in a layout of an integrated circuit, the first hollowed polygon is a regular polygon, when the shape of the spacer caused by the via hole is defined as an ellipse in the layout of the integrated circuit, discrete points are taken according to the ellipse under polar coordinates with equal radian, the first hollowed polygon is a polygon formed by sequentially connecting the discrete points, and when the shape of the spacer caused by the via hole is defined as a polygon in the layout of the integrated circuit, the first hollowed polygon is a polygon defined in the layout; converting a hollowed circle, a hollowed ellipse and a hollowed polygon in a part, defined as a copper-clad part in an integrated circuit layout, in a hole part into a second hollowed polygon, wherein when the hollowed circle, the hollowed ellipse and the hollowed polygon are in the copper-clad part, the second hollowed polygon is a regular polygon, when the hollowed ellipse, the second hollowed polygon is a polygon formed by connecting discrete points in sequence, and when the hollowed polygon is in the copper-clad part, the second hollowed polygon is a polygon defined in the layout;

S2, identifying boundaries of the islands and/or micropores in the unified layout polygon, and generating a covering polygon for covering the islands and/or micropores based on the boundaries.

In some embodiments, the method comprises the steps of:

and S21, mesh division is carried out on the vertexes of the unified layout polygons according to a Delaunay division rule to form mesh division. S22, constructing a constraint triangular mesh which takes the edges of the uniform layout polygons as constraints based on an edge exchange method; the method comprises the steps that triangle mesh subdivision is carried out on a uniform layout polygon through a Delaunay method to form Delaunay mesh subdivision, a constraint triangular mesh with the sides of the uniform layout polygon as constraints is generated through a side exchange method on the basis of the Delaunay mesh subdivision, namely the sides of any layout polygon are all the sides of the constraint triangle, different copper-clad and hollowed regions defined by the layout polygon can be identified based on a triangle neighbor and a triangular mesh traversal method, wherein the copper-clad region is a region of a copper-clad part in the uniform layout polygon, the region of the copper-clad part comprises the copper-clad part defined in an integrated circuit board diagram and also comprises a newly-formed copper-clad part after Boolean operation, the hollowed region is a non-copper-clad region, namely a hollowed region, the hollowed region comprises a hole part defined in the integrated circuit board diagram and further comprises a newly-formed hole and a micropore after Boolean operation;

s221, collecting all sides of polygons which are not common sides of the two triangles in the mesh generation, and sorting according to the side lengths to form a set Lost; s222, taking out the side with the longest side length from the set Lost and removing the side from the set Lost, so that the calculation amount required for restoring the side is the minimum, such as the side in FIG. 4;

s223, starting from one vertex of the side with the longest side length, searching a triangle which comprises the vertex and is provided with other two vertexes at two sides of the side, wherein the side with the longest side length is the side taken out and removed in the step S222; from said edge, as in fig. 2

Is sent, searches for the edge containing vertex A and vertex C, D is located on the edge

Exchanging the common sides of the triangle Delta ACD and the triangle Delta DCE at the two sides to obtain a triangle Delta ACE and a triangle Delta EDA, wherein the neighbor triangle has a common side with the triangleThe triangle exchanges the common edge of the triangle and the adjacent triangle to obtain two new triangles, wherein the adjacent triangle is the triangle with the common edge with the triangle;

s224, repeating the step S223 until the side with the longest side length is a common side of the two adjacent triangles;

s225, judging whether the set Lost is an empty set, if not, turning to the step S222, and if so, generating a constrained triangular grid with the hole boundary in the unified layout polygon as constraint; the step of transferring to is to continue to execute according to the rule and the sequence of the step after the step of transferring to; the polygon edges are collected without different treatment, and whether the closed hole (polygon) is formed by the copper-clad polygon edges or the edges of the hole-digging polygon is determined by input, so that an end-to-end closed line segment set is formed.

S23, identifying each copper-clad area and/or each hollowed area in the unified layout polygon based on the constraint triangular meshes; in some embodiments, the method comprises the steps of:

s230, initially setting the numbers of all triangles as unnumbered numbers; the triangle filling number of the current copper-clad area is set asfp=0; set the triangle filling number of the current hollowed area asfn=0; setting a current peripheral copper-clad grid cell setFront _p Is empty; setting a current set of peripheral excavated grid cellsFront _n Is empty; set the current processing toq=1 polygon;

s231, if q>Number of polygons, go to step S238, otherwise, if the current process is the second oneqIf each polygon is a copper-clad polygon, go to step S232, if the current polygon is the second polygonqEach polygon is a hollowed polygon, and the step S235 is executed; s232, settingfp=fp+1, to the secondqA plurality of copper-clad polygons formed from any side of the polygoneStarting from, find the left triangle with this edge associationt1If said left triangle ist1Is unnumbered, and is provided with a trianglet1Is numbered asfpAdd it to the collectionFront _p In, any side of the polygoneIs a left triangle including the sideeAnd the triangle sideeDirection and polygonal side ofeTriangles with the same direction;

s235, settingfn=fn-1, to the firstqA plurality of hollowed-out polygons formed from any side of the polygoneFrom this, the right triangle associated with this edge is foundt1If said right triangle ist1Is unnumbered, and is provided with a trianglet1Is numbered asfnAdd it to the collectionFront _n In, any side of the polygoneIs a right triangle including the sideeAnd the triangle sideeDirection and polygonal side ofeTriangles of opposite direction;

s236, hollowing out the grid cell set from the peripheryFront _n Take out a triangletAnd from the collectionFront _n If the triangle is removedtIs unnumbered, and the triangle is numbered with any one or more of the three neighboring trianglestIf the number of the neighbor triangle is that the edge corresponding to the unnumbered neighbor is not the edge of the polygon, the triangle is divided into three partstThe one or more neighbor triangles of (1)The collectionFront _n And adding a new one to the peripheral excavated grid cell setFront _n The triangle of (a) is numbered asfn；

S24, identifying an island based on the area size of each copper-clad region and/or identifying a micropore based on the area size of each hollowed region; and accumulating the areas of the triangular meshes in the copper-clad area and/or the excavated area, and judging that the area sum is smaller than a threshold value to be an island and/or a micropore.

S25, for each island and/or micropore, setting the corresponding side of the triangle of the adjacent triangle without the same number as the boundary of the island and/or micropore.

S26, connecting the edges corresponding to the constraint triangles of the neighbor triangles without the same number in each island and/or micropore end to form a polygon E.

S27, establishing an outer auxiliary polygon E for covering the island and/or the micropore based on the polygon E and the triangular mesh ₁ (ii) a The outer auxiliary polygon E ₁ The covering polygon is used for covering the island and/or the micropore. In some embodiments, the building of the outer auxiliary polygon E1 for covering the island and/or the micro-hole based on the polygon E and the triangular mesh comprises: forming an outer auxiliary polygon E of the polygon E outside the polygon E ₁ And controlling the distance between the outer auxiliary polygon and the polygon E through a set distance threshold value. As shown in FIG. 5, the vertex ABCDEFGHIJKLM in the figure forms a polygon E, and the polygon E is generatedA triangular mesh T of vertices; inserting an auxiliary node into the triangular mesh, so that each triangle in the triangular mesh T has at most one edge coinciding with one edge of the polygon E, as shown in fig. 6, where two edges coinciding means that two edges have two same vertices and directions of the two edges are the same or different; calculating the outer auxiliary polygon E one by one according to the information of each edge and vertex of the polygon E ₁ The respective vertex information of (2): let two adjacent edges of a vertex B of the polygon E be

And

at the adjacent side

And

taking point B on the angular bisector ₁ The point is outside the polygon E and satisfies

Whereinl _min Is the side length of the smallest side of the triangle containing vertex B, as shown in fig. 7. WhereinfactorIs a distance threshold coefficient for the distance between the two,factor>1, for example, is preferablefactor=2, outer auxiliary polygon E corresponding to other vertex ₁ The vertices of (c) can be given in the same way.

In this embodiment, the hollowed-out region and the copper-clad region are different from the hole portion and the copper-clad portion defined by the integrated circuit layout, the hollowed-out region is a region in which holes are present in the unified layout polygon, and includes the hole portion and the newly-generated hole portion defined in the integrated circuit layout, such as a hole formed between wirings, while the copper-clad region is a region in which copper is present in the unified layout polygon, and includes the copper-clad portion defined in the integrated circuit layout and the newly-generated copper-clad portion, such as an isolated island between vias.

And S3, defining a part covering the island, which covers the polygon as a hole, and/or defining a part covering the micropore, which covers the polygon as copper.

In some embodiments, for the outer auxiliary polygon E ₁ Is defined when the outer auxiliary polygon E ₁ When the corresponding boundary is the boundary of the micropore, the outer auxiliary polygon E ₁ A portion defined as the copper clad; when the outer auxiliary polygon E ₁ When the corresponding boundary is the boundary of an island, the outer auxiliary polygon E ₁ A portion defined as the aperture; the outer auxiliary polygon E ₁ The covered polygons cover the islands and/or micropores.

S4, reading the integrated circuit layout and the defined file covering the polygon, and generating a new integrated circuit layout to eliminate the isolated island and/or the micropore. In the process of detecting the micropore and the island, all the routing, the bonding pad and the isolation gasket in the original layout design file are converted into polygons and subjected to Boolean operation, so that the polygon is different from the original layout design file, and after the micropore and the island are eliminated, the routing, the bonding pad and the isolation gasket in the original layout design file are not modified, so that the number of the polygons is less than that of the polygons, and the newly added outer auxiliary polygon E is added ₁ To form a final layout design file.

Through carrying out automatic elimination processing to micropore and/or island in the integrated circuit territory, avoided the manual handling, saved manpower and materials, avoided micropore and island to pass through the technology realization simultaneously and can appear in integrated circuit to avoid detecting discovery defect to the island and the micropore that produce in technology production, reduce integrated circuit preparation cost, promoted production efficiency.

As shown in fig. 8, as a second aspect of this embodiment, there is provided a system for automatically eliminating islands and microvias in an integrated circuit layout, including a layout conversion module 1, an overlay polygon generation module 2, an overlay polygon definition module 3, and an integrated circuit layout regeneration module 4; the layout conversion module 1 is used for converting a part which is defined as a hole and a part coated with copper in an integrated circuit layout into a layout polygon and performing Boolean operation to form a uniform layout polygon; the covering polygon generation module 2 is used for identifying the boundaries of the islands and/or the micropores in the unified layout polygon, and generating covering polygons for covering the islands and/or the micropores based on the boundaries; the covering polygon definition module 3 is used for defining a part of a covering polygon covering the island as a hole and/or defining a part of a covering polygon covering the micropore as copper cladding; the integrated circuit layout regeneration module 4 is configured to read in the integrated circuit layout and the defined file covering the polygon, and generate a new integrated circuit layout to eliminate the isolated island and/or the micro-hole.

The layout conversion module 1 comprises a hole conversion unit, a copper-clad conversion unit, a third new copper-clad polygonal Boolean operation unit, a first new copper-clad polygonal Boolean operation unit and a uniform layout polygonal Boolean operation unit; the hole conversion unit is used for converting a part defined as a hole in the integrated circuit layout into a hollowed polygon; the method comprises the steps that a spacer caused by a via hole in a hole part is converted into a first hollowed polygon, when the shape of the spacer caused by the via hole is defined as a circle in a layout of an integrated circuit, the first hollowed polygon is a regular polygon, when the shape of the spacer caused by the via hole is defined as an ellipse in the layout of the integrated circuit, discrete points are taken according to the ellipse under polar coordinates with equal radian, the first hollowed polygon is a polygon formed by sequentially connecting the discrete points, and when the shape of the spacer caused by the via hole is defined as a polygon in the layout of the integrated circuit, the first hollowed polygon is a polygon defined in the layout; converting a hollowed circle, a hollowed ellipse and a hollowed polygon in a part, defined as a copper-clad part, of an integrated circuit layout in a hole into a second hollowed polygon, wherein the second hollowed polygon is a regular polygon when the hollowed circle, the hollowed ellipse and the hollowed polygon are hollowed in the part, defined as the hollowed circle, defined as the copper-clad part, discrete points are taken according to the ellipse at equal radian under polar coordinates when the hollowed polygon is defined as the hollowed ellipse, the second hollowed polygon is a polygon formed by sequentially connecting the discrete points, and the second hollowed polygon is a polygon defined in the layout when the hollowed polygon is defined as the copper-clad part; the copper-clad conversion unit is used for converting a part defined as copper-clad in the integrated circuit layout into a polygon coated with copper; wherein, the routing in the copper-clad part is converted into a first copper-clad polygon according to a starting point, an end point and a width, the first copper-clad polygon is a rectangle, a pad caused by a via hole in the copper-clad part is converted into a second copper-clad polygon, the second copper-clad polygon is in a hollowed-out polygon converted by the isolation gasket, when the shape of the pad is defined as a circle in a layout of the integrated circuit, the second copper-clad polygon is a regular polygon, when the shape of the pad is defined as an ellipse in the layout of the integrated circuit, discrete points are taken according to an equal radian of the ellipse under a polar coordinate, and the second copper-clad polygon is a polygon formed by sequentially connecting the discrete points, when the shape of the bonding pad is defined as a polygon in a layout of the integrated circuit, the polygon of the second copper clad is a polygon defined in the layout, other parts of the copper clad are converted into a polygon of a third copper clad, when other parts of the copper clad are defined as circles, the polygon of the third copper clad is a regular polygon, when other parts of the copper clad are defined as ellipses, discrete points are taken according to equal radians of the ellipses under polar coordinates, the polygon of the third copper clad is a polygon formed by sequentially connecting the discrete points, and when other parts of the copper clad are defined as polygons, the polygon of the third copper clad is a polygon defined in the layout;

the third new copper-clad polygon Boolean operation unit is used for carrying out Boolean operation on the first copper-clad polygon and the third copper-clad polygon to form a third new copper-clad polygon; the first new copper-clad polygon Boolean operation unit is used for respectively carrying out Boolean operation on the third new copper-clad polygon, the first hollowed polygon and the second hollowed polygon to form a first new copper-clad polygon; the uniform layout polygon Boolean operation unit is used for performing Boolean operation on the first new copper-clad polygon and the second copper-clad polygon to form a uniform layout polygon.

The overlay polygon generation module 2 comprises a first unit, a second unit, a third unit, a fourth unit, a fifth unit, a sixth unit and a seventh unit; the first unit is used for mesh division of the vertexes of the unified layout polygons according to a Delaunay division rule to form mesh division; the second unit is used for constructing a constraint triangular mesh which takes the edges of the uniform layout polygons as constraints based on an edge exchange method; the third unit is used for identifying each copper-clad area and/or each hollowed area in the unified layout polygon based on the constraint triangular meshes; the fourth unit is used for identifying an island based on the area size of each copper-clad region and/or identifying a micropore based on the area size of each hollowed-out region; the fifth unit is used for setting the corresponding side of the triangle of the adjacent triangle without the same number as the boundary of each island and/or micropore; the sixth unit is used for connecting the edges corresponding to the constrained triangles of the neighboring triangles without the same number in each island and/or micropore end to form a polygon E; the seventh unit is used for establishing an outer auxiliary polygon E for covering the island and/or the micropore based on the polygon E and the triangular mesh ₁ (ii) a The outer auxiliary polygon E ₁ The covering polygons are used for covering the islands and/or the micropores.

The third unit performs steps including:

s231, if q>The number of polygons is entered into step S238, otherwise, if the current processing is the second oneqIf the polygon is a copper-clad polygon, go to step S232, if the current processing is the second oneqEach polygon being hollowed outPolygon, go to step S235; s232, settingfp=fp+1, to the secondqA plurality of copper-clad polygons formed from any sides of the polygonseStarting from, find the left triangle with this edge associationt1If the left trianglet1Is unnumbered, and is provided with a trianglet1Is numbered asfpAdd it to the collectionFront _p In, any side of the polygoneIs a left triangle including the sideeAnd the triangle sideeDirection and polygonal side ofeTriangles with the same direction;

s233, covering copper grid unit assembly from peripheryFront _p Take out a triangletAnd removing it from the collectionFront _p If the triangle is removedtIs unnumbered and the common edge is not an edge of any polygon, the triangle is numberedtThe one or more neighboring triangles are added to the peripheral copper-clad grid cell setFront _p And adding the new peripheral copper-clad grid unit setFront _p The triangle of (a) is numbered asfpWherein the common edge refers to the triangletAdjacent triangles and said triangletA common edge of (a);

s236, hollowing out the grid cell set from the peripheryFront _n Take out oneTriangle shapetAnd from the collectionFront _n If the triangle is removedtIs unnumbered, and the triangle is numbered with any one or more of the three neighboring trianglestIf the number of the neighbor triangle is that the edge corresponding to the unnumbered neighbor is not the edge of the polygon, the triangle is divided into three partstThe one or more neighbor triangles of (a) join the setFront _n And adding the new part into the peripheral hollowed grid cell setFront _n The triangle of (a) is numbered asfn；

The seventh unit performs steps including: in a polygonEOut of shape to form a polygonEOuter auxiliary polygon E of ₁ And controlling the outer auxiliary polygon and the polygon through a set distance threshold valueEThe distance of (c). As shown in fig. 5, the vertices ABCDEFGHIJKLM in the figure form a polygon E, and a triangle mesh T of the vertices of the polygon E is generated; inserting an auxiliary node into the triangular mesh, so that each triangle in the triangular mesh T has at most one edge coinciding with one edge of the polygon E, as shown in fig. 6, where two edges coinciding means that two edges have two same vertices and directions of the two edges are the same or different; calculating the outer auxiliary polygon E one by one according to the information of each edge and vertex of the polygon E ₁ The respective vertex information of (2): let two adjacent edges of a vertex B of the polygon E be

And

at the adjacent side

And

In whichl _min Is the side length of the smallest side of the triangle containing vertex B, as shown in fig. 7. WhereinfactorIs a distance threshold coefficient for the distance between the two,factor>1, for example, is preferablefactor=2, outer auxiliary polygon E corresponding to other vertices ₁ The vertices of (2) can be given in the same way.

Finally, although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can make modifications and equivalent covers on the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application, and all of them should be covered by the claims of the present application.

Claims

1. A method for automatically eliminating isolated islands and micropores in an integrated circuit layout is characterized by comprising the following steps: s1, converting a part defined as a hole and a part coated with copper in an integrated circuit layout into layout polygons and performing Boolean operation to form uniform layout polygons;

s2, identifying boundaries of the islands and/or micropores in the unified layout polygon, and generating a covering polygon for covering the islands and/or micropores on the basis of the boundaries; s3, defining a part covering the island and covering the polygon as a hole and/or defining a part covering the micropore and covering the polygon as copper cladding; s4, reading in the integrated circuit layout again, and generating a new integrated circuit layout together with the generated covering polygon to eliminate the isolated island and/or the micropore;

converting a part defined as a hole and a part coated with copper in the integrated circuit layout into a layout polygon and performing Boolean operation to form a uniform layout polygon, wherein the step of forming the uniform layout polygon comprises the following steps:

s12, converting a part defined as copper-clad in the integrated circuit layout into a polygon coated with copper; wherein, the routing in the copper-clad part is converted into a first copper-clad polygon according to a starting point, an end point and a width, the first copper-clad polygon is a rectangle, a pad caused by a via hole in the copper-clad part is converted into a second copper-clad polygon, the second copper-clad polygon is in a hollowed polygon converted by the isolation gasket, when the shape of the pad is defined as a circle in a layout of the integrated circuit, the second copper-clad polygon is a regular polygon, when the shape of the pad is defined as an ellipse in the layout of the integrated circuit, discrete points are taken according to the equal radian of the ellipse under a polar coordinate, and the second copper-clad polygon is a polygon formed by sequentially connecting the discrete points, when the shape of the bonding pad is defined as a polygon in a layout of the integrated circuit, the polygon of the second copper clad is a polygon defined in the layout, other parts of the copper clad are converted into a polygon of a third copper clad, when other parts of the copper clad are defined as circles, the polygon of the third copper clad is a regular polygon, when other parts of the copper clad are defined as ellipses, discrete points are taken according to equal radians of the ellipses under polar coordinates, the polygon of the third copper clad is a polygon formed by sequentially connecting the discrete points, and when other parts of the copper clad are defined as polygons, the polygon of the third copper clad is a polygon defined in the layout;

s14, performing Boolean difference operation on the third new copper-clad polygon, the first hollowed-out polygon and the second hollowed-out polygon respectively to form a first new copper-clad polygon;

2. The method of claim 1, wherein the identifying boundaries of islands and/or microvias in the unified layout polygon and the generating a covering polygon for covering the islands and/or microvias based on the boundaries comprises: s21, mesh division is carried out on the vertexes of the unified layout polygons according to a Delaunay division rule to form mesh division; s22, constructing a constraint triangular mesh which takes the edges of the uniform layout polygons as constraints based on an edge exchange method;

s23, based on the constraint triangular netIdentifying each copper-clad area and/or each hollowed area in the unified layout polygon; s24, identifying an island based on the area size of each copper-clad region and/or identifying a micropore based on the area size of each hollowed region; s25, for each island and/or micropore, setting the side corresponding to the constraint triangle of the neighbor triangle without the same number as the boundary of the island and/or micropore; s26, connecting the edges corresponding to the constraint triangles of the neighbor triangles without the same number in each island and/or micropore end to form a polygon E; s27, establishing an outer auxiliary polygon E for covering the island and/or the micropore based on the polygon E and the triangular mesh ₁ (ii) a The outer auxiliary polygon E ₁ The covering polygons are used for covering the islands and/or the micropores.

3. The method according to claim 2, wherein the identifying each copper-clad region and/or each hollowed-out region in the unified layout polygon based on the constrained triangular mesh comprises:

s231, if q>The number of polygons is entered into step S238, otherwise, if the current processing is the second oneqIf the polygon is a copper-clad polygon, go to step S232, if the current processing is the second oneqEach polygon is a hollowed polygon, and the step S235 is executed; s232, settingfp=fp+1, to the secondqA plurality of copper-clad polygons formed from any sides of the polygonseStarting from, find the left triangle with this edge associationt1If said left triangle ist1Is unnumbered, and is provided with a trianglet1Is numbered asfpAdd it to the collectionFront _p In, any side of the polygoneIs a left triangle including the sideeAnd the triangle sideeDirection and polygonal side ofeTriangles with the same direction; s233, covering copper grid unit assembly from peripheryFront _p Take out a triangletAnd from the collectionFront _p If the triangle is removedtIs unnumbered and the common edge is not an edge of any polygon, the triangle is numberedtThe one or more neighboring triangles are added to the peripheral copper-clad grid cell setFront _p And adding the newly added peripheral copper-clad grid unit setFront _p The triangle of (a) is numbered asfpWherein the common edge refers to the triangletAdjacent triangles and said triangletA common edge of (a); s234, judging the peripheral copper-clad grid unit setFront _p If not, go to step S233, if yes, setq=q+1, go to step S231; s235, settingfn=fn-1, toqA plurality of hollowed-out polygons formed from any side of the polygoneFrom this point on, find the right triangle with this edge associationt1If said right triangle ist1Is unnumbered, and is provided with a trianglet1Is numbered asfnAdd it to the collectionFront _n In, any side of the polygoneIs a right triangle including the sideeAnd the triangle sideeDirection and polygonal side ofeTriangles of opposite direction;

s236, hollowing out the grid cell set from the peripheryFront _n Take out a triangletAnd from the collectionFront _n If the triangle is removedtIs unnumbered, and the triangle is numbered with any one or more of the three neighboring trianglestIf the number of the neighbor triangle is that the edge corresponding to the unnumbered neighbor is not the edge of the polygon, the triangle is divided into three partstThe one or more neighbor triangles of (a) join the setFront _n To get newAdding the peripheral hollowed grid cell setFront _n The triangle of (a) is numbered asfn(ii) a S237, judging the peripheral hollowed grid cell setFront _n If not, go to step S236, if so, setq=q+1, go to step S231;

4. A method according to claim 3, wherein an outer auxiliary polygon E for covering the island and/or via is created based on the polygon E and triangle mesh ₁ The method comprises the following steps: in a polygonEOut of shape to form a polygonEOuter auxiliary polygon E of ₁ And controlling the outer auxiliary polygon and the polygon through a set distance threshold valueEThe distance of (c).

5. A system for automatically eliminating isolated islands and micropores of an integrated circuit layout is characterized by comprising a layout conversion module, a covering polygon generation module, a covering polygon definition module and an integrated circuit layout regeneration module; the layout conversion module is used for converting a part defined as a hole and a part coated with copper in an integrated circuit layout into a layout polygon and performing Boolean operation to form a uniform layout polygon; the coverage polygon generation module is used for identifying the boundary of an island and/or a micropore in the unified layout polygon and generating a coverage polygon for covering the island and/or the micropore based on the boundary; the covering polygon definition module is used for defining a part of a covering polygon covering the island as a hole and/or defining a part of a covering polygon covering the micropore as copper cladding; the integrated circuit layout regenerating module is used for reading the initial integrated circuit layout again, generating a new integrated circuit layout together with the generated covering polygon and eliminating the isolated island and/or the micropore;

the layout conversion module comprises a hole conversion unit, a copper-clad conversion unit, a third new copper-clad polygonal Boolean operation unit, a first new copper-clad polygonal Boolean operation unit and a uniform layout polygonal Boolean operation unit; the hole conversion unit is used for converting a part defined as a hole in the integrated circuit layout into a hollowed polygon; the method comprises the steps that a spacer caused by a via hole in a hole part is converted into a first hollowed polygon, when the shape of the spacer caused by the via hole is defined as a circle in a layout of an integrated circuit, the first hollowed polygon is a regular polygon, when the shape of the spacer caused by the via hole is defined as an ellipse in the layout of the integrated circuit, discrete points are taken according to the ellipse under polar coordinates and with equal radian, the first hollowed polygon is a polygon formed by sequentially connecting the discrete points, and when the shape of the spacer caused by the via hole is defined as a polygon in the layout of the integrated circuit, the first hollowed polygon is a polygon defined in the layout; converting a hollowed circle, a hollowed ellipse and a hollowed polygon in a part, defined as a copper-clad part in an integrated circuit layout, in a hole part into a second hollowed polygon, wherein when the hollowed circle, the hollowed ellipse and the hollowed polygon are in the copper-clad part, the second hollowed polygon is a regular polygon, when the hollowed ellipse, the second hollowed polygon is a polygon formed by connecting discrete points in sequence, and when the hollowed polygon is in the copper-clad part, the second hollowed polygon is a polygon defined in the layout; the copper-clad conversion unit is used for converting a part defined as copper-clad in the integrated circuit layout into a polygon coated with copper; wherein, the routing in the copper-clad part is converted into a first copper-clad polygon according to a starting point, an end point and a width, the first copper-clad polygon is a rectangle, a pad caused by a via hole in the copper-clad part is converted into a second copper-clad polygon, the second copper-clad polygon is in a hollowed polygon converted by the isolation gasket, when the shape of the pad is defined as a circle in a layout of the integrated circuit, the second copper-clad polygon is a regular polygon, when the shape of the pad is defined as an ellipse in the layout of the integrated circuit, discrete points are taken according to the equal radian of the ellipse under a polar coordinate, and the second copper-clad polygon is a polygon formed by sequentially connecting the discrete points, when the shape of the bonding pad is defined as a polygon in a layout of the integrated circuit, the polygon of the second copper clad is a polygon defined in the layout, other parts of the copper clad are converted into a polygon of a third copper clad, when other parts of the copper clad are defined as circles, the polygon of the third copper clad is a regular polygon, when other parts of the copper clad are defined as ellipses, discrete points are taken according to equal radians of the ellipses under polar coordinates, the polygon of the third copper clad is a polygon formed by sequentially connecting the discrete points, and when other parts of the copper clad are defined as polygons, the polygon of the third copper clad is a polygon defined in the layout;

the third new copper-clad polygon Boolean operation unit is used for performing Boolean operation on the first copper-clad polygon and the third copper-clad polygon to form a third new copper-clad polygon; the first new copper-clad polygon Boolean operation unit is used for performing Boolean difference operation on the third new copper-clad polygon and the first hollowed-out polygon and the second hollowed-out polygon respectively to form a first new copper-clad polygon; the uniform layout polygon Boolean operation unit is used for performing Boolean operation on the first new copper-clad polygon and the second copper-clad polygon to form a uniform layout polygon.

6. The system according to claim 5, wherein the overlay polygon generation module comprises a first unit, a second unit, a third unit, a fourth unit, a fifth unit, a sixth unit, and a seventh unit; the first unit is used for mesh division of the vertexes of the unified layout polygons according to a Delaunay division rule to form mesh division; the second unit is used for edge intersection basedConstructing a constraint triangular mesh with the edges of the uniform layout polygon as constraints by a conversion method; the third unit is used for identifying each copper-clad area and/or each hollowed area in the unified layout polygon based on the constraint triangular meshes; the fourth unit is used for identifying an island based on the area size of each copper-clad region and/or identifying a micropore based on the area size of each hollowed-out region; the fifth unit is used for setting the corresponding side of the triangle of the adjacent triangle without the same number as the boundary of each island and/or micropore; the sixth unit is used for connecting the edges corresponding to the constrained triangles of the neighboring triangles without the same number in each island and/or micropore end to form a polygon E; the seventh unit is configured to create an outer auxiliary polygon E for covering the island and/or the micro-hole based on the polygon E and the triangular mesh ₁ (ii) a The outer auxiliary polygon E ₁ The covering polygons are used for covering the islands and/or the micropores.

7. A system for automatic elimination of integrated circuit layout islands and microvias as set forth in claim 6, wherein said third unit performs steps comprising: s230, initially setting the serial numbers of all triangles as unnumbered numbers; the triangle filling number of the current copper-clad area is set asfp=0; set the triangular filling number of the current hollowed area asfn=0; setting a current peripheral copper-clad grid cell setFront _p Is empty; setting a current set of peripheral excavated grid cellsFront _n Is empty; set the current process toq=1 polygon;

s231, if q>The number of polygons is entered into step S238, otherwise, if the current processing is the second oneqIf the polygon is a copper-clad polygon, go to step S232, if the current processing is the second oneqEach polygon is a hollowed polygon, and the step S235 is executed; s232, settingfp=fp+1, to the secondqA plurality of copper-clad polygons formed from any sides of the polygonseStarting from, find the left triangle with this edge associationt1If said left triangle ist1Is not numbered and is not numbered,set up a trianglet1Is numbered asfpAdd it to the collectionFront _p In (2), any side of the polygoneIs a left triangle including the sideeAnd the triangle sideeDirection and polygonal side ofeTriangles with the same direction; s233, covering copper grid unit assembly from peripheryFront _p Take out a triangletAnd from the collectionFront _p If the triangle is removedtIs unnumbered and the common edge is not an edge of any polygon, the triangle is numbered as unnumberedtThe one or more neighboring triangles are added to the peripheral copper-clad grid cell setFront _p And adding the newly added peripheral copper-clad grid unit setFront _p The triangle of (a) is numbered asfpWherein the common edge refers to the triangletAdjacent triangles and said triangletA common edge of (a);

s234, judging the peripheral copper-clad grid unit setFront _p If not, go to step S233, if yes, setq=q+1, go to step S231; s235, settingfn=fn-1, toqA plurality of hollowed-out polygons formed from any side of the polygoneFrom this, the right triangle associated with this edge is foundt1If said right triangle ist1Is unnumbered, set up a trianglet1Is numbered asfnAdd it to the collectionFront _n In, any side of the polygoneIs a right triangle including the sideeAnd the triangle sideeDirection and polygonal side ofeTriangles of opposite direction;

s236, hollowing out the grid cell set from the peripheryFront _n Take out a triangletAnd from the collectionFront _n If the triangle is removedtIs unnumbered, and the triangle is numbered with any one or more of the three neighboring trianglestIf the number of the neighbor triangle is that the side corresponding to the unnumbered neighbor is not the polygon side, the triangle is divided into two partsShape oftThe one or more neighbor triangles of (a) join the setFront _n And adding a new one to the peripheral excavated grid cell setFront _n The triangle of is numbered asfn(ii) a S237, judging the peripheral hollowed grid cell setFront _n If not, go to step S236, if so, setq=q+1, go to step S231;

8. A system for automatic elimination of integrated circuit layout islands and micro-holes according to claim 7, wherein said creating an outer auxiliary polygon E for covering said islands and/or micro-holes based on said polygon E and triangular meshes ₁ The method comprises the following steps: in a polygonEOut of shape to form a polygonEOuter auxiliary polygon E of ₁ And controlling the outer auxiliary polygon and the polygon through a set distance threshold valueEThe distance of (c).