CN115602637A - Metal ceramic shell for replacing SOP-08 pure ceramic package and preparation method thereof - Google Patents

Metal ceramic shell for replacing SOP-08 pure ceramic package and preparation method thereof Download PDF

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Publication number
CN115602637A
CN115602637A CN202211362842.2A CN202211362842A CN115602637A CN 115602637 A CN115602637 A CN 115602637A CN 202211362842 A CN202211362842 A CN 202211362842A CN 115602637 A CN115602637 A CN 115602637A
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ceramic
shell
welding
sop
ceramic insulator
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CN202211362842.2A
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CN115602637B (en
Inventor
许杨生
王维敏
陈云
张跃
钱语尧
郑少勋
金方涛
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Zhejiang Dongci Technology Co ltd
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Zhejiang Dongci Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4817—Conductive parts for containers, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

The invention relates to a metal ceramic shell for replacing SOP-08 pure ceramic package and a preparation method thereof, wherein the shell comprises a shell body, a bottom plate, a cover plate, a molybdenum sheet press welding area, a ceramic insulator, a Kovar copper core lead and a ceramic supporting sheet, wherein the bottom plate and the cover plate are respectively packaged at the bottom and the top of the shell body, the ceramic supporting sheet is welded on the bottom plate, the ceramic insulator is embedded on the shell body through assembling equipment and sealed through welding, the ceramic insulator is an integral body and is provided with a plurality of lead holes, and the Kovar copper core lead penetrates through the lead holes to be connected with the inside and the outside of the shell body and sealed through welding.

Description

Metal ceramic shell for replacing SOP-08 pure ceramic package and preparation method thereof
Technical Field
The invention belongs to the technical field of ceramic packaging, and particularly relates to a metal ceramic shell for replacing SOP-08 pure ceramic packaging and a preparation method thereof.
Background
At present, a large amount of SOP-08 series standard-size device products are required in the fields of optical communication such as military use, civil use and the like, and the SOP-08 series standard-size device products are required to have the characteristics of low resistance, low thermal resistance, good impact resistance, high reliability and the like, wherein the metal ceramic shell adopts a metal material as a main body, porous high-temperature co-fired alumina ceramic as an insulator, a metal lead is used as a circuit for conduction, and the shell formed by metal and alumina ceramic has the strength, the conductivity and the heat dissipation performance obviously higher than those of a pure ceramic structure, so that the reliability of the metal ceramic shell is higher;
a Chinese patent with an authorization publication number of CN103247542B discloses a method for manufacturing a leading-out end of an integrated circuit ceramic package shell and a special lead frame, wherein the frame comprises an outer frame and a lead outer end connecting outer frame, the inner end of the lead is in one-to-one correspondence with a bonding pad on the ceramic shell, and the inner end of the lead is left on the bonding pad to form a bulge to form the leading-out end, so that the positioning is convenient and accurate when the lead is welded with the bonding pad, the outer frame is utilized to realize direct rack plating, the manufacturing process complexity of a detail distance shell is reduced, the efficiency is improved, and the product quality is improved;
a chinese patent with an authorization publication number CN 105977216B discloses a miniaturized airtight leadless ceramic packaging structure, which comprises a ceramic shell, a die bonding adhesive, a silicon wafer, a bonding wire and a cover plate; the silicon chip is arranged in a bonding core area at the bottom of the cavity structure through bonding glue, the sealing ring, the upper ceramic layer, the lower ceramic layer and the pad layer are sequentially arranged from top to bottom, the cover plate is arranged at the top of the sealing ring, and the bonding wire is connected with the silicon chip and the metallization layer, so that the airtight leadless package is smaller in appearance;
however, the strength, the electric conduction and the heat dissipation performance of the shell of the packaging structure are not good enough, the use reliability is not high, the assembly of the shell is mostly completed manually, the assembly efficiency is low, and the assembly quality is unstable.
Disclosure of Invention
One of the purposes of the invention is to provide a metal ceramic shell for replacing SOP-08 pure ceramic package, aiming at the defects of the prior art and the problems that the existing alumina ceramic has poor strength, high resistance and thermal resistance and is not suitable for large current due to signal transmission through an internal printed circuit.
Aiming at the technical problems, the technical scheme adopted by the invention is as follows:
the utility model provides a replace cermet shell of SOP-08 pure ceramic encapsulation, includes casing, bottom plate, apron, molybdenum sheet press-welding district, ceramic insulator, kovar package copper core lead wire and ceramic bearing piece, bottom plate and apron encapsulate respectively in the bottom and the top of casing, the ceramic bearing piece welds on the bottom plate, ceramic insulator inlays on the casing through equipment and realizes sealedly through the welding, ceramic insulator is a whole and opens and has a plurality of pin holes, kovar package copper core lead wire passes inside and outside the pin hole connection casing and realizes sealedly through the welding.
Preferably, the molybdenum sheet bonding area is located inside the shell and extends transversely along the shell.
Preferably, the ceramic insulator is an alumina high-temperature co-fired ceramic.
Preferably, the parts of the ceramic insulator and the ceramic supporting sheet, which need to be welded and sealed, are provided with surface metallization layers, each surface metallization layer comprises a tungsten slurry layer and a nickel plating layer, the tungsten slurry layers are printed in the preparation process of the ceramic insulator, the nickel plating layers are formed after the ceramic insulator is prepared and formed, and the thickness of each nickel plating layer is more than or equal to 3 mu m.
Preferably, the shell and the cover plate are made of kovar alloy, the base plate is made of tungsten copper, the shell, the base plate, the cover plate, the molybdenum sheet press welding area and the part of the kovar package copper core lead needing to be welded are plated with nickel, and the thickness of the nickel plating layer is more than or equal to 3 microns.
Preferably, the metal surface of the shell is plated with a layer of gold, and the thickness of the gold plating layer is more than or equal to 0.5 mu m.
The invention also provides a preparation method of the metal ceramic shell for replacing the SOP-08 pure ceramic package, which sequentially comprises the following steps:
s1, heating a nitrogen-hydrogen atmosphere protection chain type sintering furnace to the welding temperature of silver-copper welding flux, introducing nitrogen-hydrogen mixed gas protection gas, and preheating for a period of time;
s2, respectively welding a base plate and a shell, a ceramic bearing sheet and a molybdenum sheet press welding area, and a ceramic insulator and a Kovar copper clad core lead together, arranging a surface metallization layer on the ceramic insulator and the ceramic bearing sheet at a position needing to be welded and sealed, wherein the surface metallization layer comprises a tungsten slurry layer and a nickel plating layer, the tungsten slurry layer is printed in the ceramic insulator preparation process, and the nickel plating layer is carried out after the ceramic insulator is prepared and formed;
s3, embedding the ceramic insulator on the shell through assembling equipment and realizing sealing through welding;
s4, carrying out final assembly welding and assembling on all parts welded in the step S2 to form a metal ceramic shell;
the further preferred technical scheme is as follows: and in S3, the structure of the assembly equipment comprises a transmission belt, rotary units arranged on two sides of the transmission belt, bearing units arranged on the rotary units, clamping units arranged on the bearing units, guide units arranged above the transmission belt, and limiting units arranged on the clamping units.
The further preferred technical scheme is as follows: the rotary unit comprises a rotary chain a and a rotary chain b, the bearing unit comprises a bearing seat arranged on the rotary chain a and the rotary chain b, a frame arranged on the rotary chain b and bearing the bearing seat is provided, a cross rod a arranged on the frame in a sliding mode is arranged on the frame in a sliding mode, a vertical rod a arranged on the cross rod a in a sliding mode, a sliding sleeve fixedly connected to one side of the cross rod a, a cross rod b fixedly connected to the other side of the sliding sleeve and a vertical rod b arranged on the cross rod b in a sliding mode.
The further preferred technical scheme is as follows: the clamping unit comprises a gear a and a gear b which are rotatably arranged on a sliding sleeve, a rack a and a rack b which are meshed with the gear b, clamping plates arranged on a vertical rod a and a vertical rod b, a cylinder body connected on the vertical rod b and the vertical rod a, a cavity arranged on the clamping plates, a plurality of clamping blocks arranged on the cavity in a sliding mode, and air pipes connected to the cavity and the cylinder body, wherein the guiding unit comprises a guide plate arranged above a transmission belt, a guide post connected to the upper end of a horizontal rod a, a first rack and a second rack connected to the guide plate, a lower pressing rod arranged on the sliding sleeve in a sliding mode, and a piston connected to the lower end of the lower pressing rod, the first rack and the second rack are meshed with the gear a, the piston is arranged in the cylinder body in a sliding mode, and the limiting unit comprises a square taper rod connected to the lower pressing rod, a limiting plate connected to the sliding sleeve, and limiting rods arranged on four sides of the limiting plate in a sliding mode.
The invention has the beneficial effects that:
1. the Kovar copper clad core lead wire embedding machine is provided with a rotary unit and a bearing unit, a shell is placed on a transmission belt, a ceramic insulator and a Kovar copper clad core lead wire are placed on a rotary chain a and a rotary chain b and run synchronously, and when the ceramic insulator and the Kovar copper clad core lead wire are welded together into a whole by manpower, the ceramic insulator and the Kovar copper clad core lead wire are placed on a bearing seat to play a role in bearing and positioning the ceramic insulator, so that the Kovar copper clad core lead wire can be accurately embedded with the ceramic insulator.
2. The clamping device is provided with a clamping unit, a guide unit and a limiting unit, when a shell and a ceramic insulator are synchronously transmitted, a rack a and a rack b respectively rotate clockwise and anticlockwise, the vertical rod a and the vertical rod b are pushed to extend towards openings formed in two sides of the shell until a clamping plate is driven to be close to the other end of a Kovar package copper core lead, a piston inputs gas in a cylinder body into a cavity in the descending process to clamp the Kovar package copper core lead, and meanwhile, a square conical rod is driven to descend when a lower pressing rod descends to push a limiting rod to slide towards the direction of the shell to limit the shell;
continue the transmission pulling Kovar package copper core lead wire and pass the opening on the casing and inlay on the casing, the grip block loosens Kovar package copper core lead wire, at this moment, the guide post drives horizontal pole a when the deflector back half, horizontal pole b and sliding sleeve rise to the casing along the frame direction and reset outward, can reach Kovar package copper core lead wire through this equipment and inlay on the casing automatically, accelerate work efficiency, in addition, the splint that are located the lower extreme pass through torsional spring coupling, prevent that splint from blocking when rising and breaking away from Kovar package copper core lead wire, the centre gripping of mechanical type pulls equipment precision high stability good, guarantee that the quality of batch product is reliable.
In conclusion, the invention has the functions of good product strength and electric conduction, good heat dissipation performance, high use reliability, high efficiency in the product assembling process, stable assembling quality and the like, and is suitable for the technical field of ceramic packaging.
Drawings
FIG. 1 is a schematic structural view of an assembly apparatus;
FIG. 2 is a schematic perspective view of a cermet housing without a cover plate;
FIG. 3 is a schematic cross-sectional view of the cermet housing with a cover plate;
FIG. 4 is a schematic structural diagram of a carrying unit;
FIG. 5 is a schematic view of a structure of a position-limiting unit;
FIG. 6 is a schematic view of the guide post driving the clamp plate to descend to the opening of the housing;
fig. 7 is a schematic view of a state in which the gear a is engaged with the first rack in transmission;
fig. 8 is a schematic view showing a state where a gear b is engaged with a rack a and a rack b;
FIG. 9 is a schematic view of the clamping block clamping and the limiting rod limiting the housing;
FIG. 10 is an enlarged view at A in FIG. 9;
in the drawings, the reference numerals designate the following components: the device comprises a shell 1, a bottom plate 2, a cover plate 3, a molybdenum sheet press welding area 4, a ceramic insulator 5, a Kovar package copper core lead 6, a ceramic supporting sheet 7, an assembling device 8, a conveying belt 801, a rotary unit 9, a bearing unit 10, a clamping unit 11, a guide unit 12, a limiting unit 13, a rotary chain a901, a rotary chain b902, a bearing seat 101, a frame 102, a cross rod a103, a vertical rod a104, a sliding sleeve 105, a cross rod b106, a vertical rod b107, a gear a111, a gear b112, a rack a113, a rack b114, a clamping plate 115, a cylinder 116, a chamber 117, a clamping block 118, an air pipe 119, a guide plate 121, a guide column 122, a first rack 12/3, a second rack 124, a lower pressing rod 125, a piston 126, a square taper rod 131, a limiting plate 132 and a limiting rod 133.
Detailed Description
The technical scheme in the embodiment of the invention is clearly and completely explained by combining the attached drawings.
Example one
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
As shown in fig. 1 to 8, a metal ceramic shell for replacing SOP-08 pure ceramic package comprises a shell 1, a bottom plate 2, a cover plate 3, a molybdenum sheet press welding area 4, a ceramic insulator 5, a kovar copper clad core lead 6 and a ceramic supporting sheet 7, wherein the bottom plate 2 and the cover plate 3 are respectively packaged at the bottom and the top of the shell 1, the ceramic supporting sheet 7 is welded on the bottom plate 2, the ceramic insulator 5 is embedded on the shell 1 through an assembling device 8 and sealed through welding, the ceramic insulator 5 is an integral body and is provided with a plurality of lead holes, the kovar copper clad core lead 6 penetrates through the lead holes to be connected with the inside and the outside of the shell 1 and sealed through welding, the bottom plate 2 and the cover plate 3 are packaged at the bottom and the top of the shell 1 through welding, and the kovar copper clad core lead 6 is welded on the ceramic insulator 5 after being bent through a die.
As shown in fig. 1, the molybdenum sheet bonding areas 4 are located inside the shell 1 and the molybdenum sheet bonding areas 4 extend in the transverse direction of the shell 1.
As shown in fig. 1, the ceramic insulator 5 is an alumina high-temperature co-fired ceramic; the ceramic insulator 5 is made of alumina high-temperature co-fired ceramic, the bending strength can reach 400MPa, and the bulk resistance is more than or equal to 1 multiplied by 10 12 Omega (500 VDC test) meets the requirements of high-reliability devices on the mechanical strength and the insulating property of the shell.
As shown in figure 1, the positions of the ceramic insulator 5 and the ceramic supporting sheet 7 which need to be welded and sealed are provided with surface metallization layers, the surface metallization layers comprise a tungsten slurry layer and a nickel plating layer, the tungsten slurry layer is printed in the preparation process of the ceramic insulator, the nickel plating layer is formed after the ceramic insulator 5 is prepared and formed, and the thickness of the nickel plating layer is more than or equal to 3 mu m.
As shown in figure 1, the shell 1 and the cover plate 3 are made of kovar alloy, the base plate 2 is made of tungsten copper, and the shell 1, the base plate 2, the cover plate 3, the molybdenum sheet press welding area 4 and the part of the kovar clad copper core lead 6 which needs to be welded are all plated with nickel, wherein the thickness of the nickel plating layer is more than or equal to 3 microns.
As shown in FIG. 1, the metal surface of the case is plated with a layer of gold, and the thickness of the gold plating layer is more than or equal to 0.5 μm.
Compared with the traditional SOP-08 pure ceramic packaging shell: the invention takes the metal material as the main body, so the integral strength is higher, and the heat dissipation performance is better; the main connecting areas are all finished in a welding mode, so that the sealing performance is better; the main conductive circuit is a metal lead, so that the resistance value is lower; by combining the advantages of 01 and 03, the high-current chip can better meet the use requirement of a high-current chip, and has better reliability; integral type ceramic insulator cooperation metal lead alternates welded structure, can effective control lead wire pitch and depth of parallelism, simultaneously, reduces the assembly and welds the degree of difficulty, promotes production efficiency.
In order to ensure the long-term reliability of the product, after the product is formed, a plurality of tests related to matching are carried out, including 2000h power aging test, 100 times thermal shock (liquid-liquid) test (-55 ℃ -125 ℃), 500 times temperature (-65 ℃ -175 ℃) shock test, 10000 times intermittent life test and other tests, so that the product is qualified in examination, and the high reliability of the product is proved to meet the requirements of the national military standard.
Example 2
As shown in fig. 1 to 8, a method for preparing a cermet casing instead of an SOP-08 pure ceramic package includes the steps of:
s1, heating a nitrogen-hydrogen atmosphere protection chain type sintering furnace to the welding temperature of the silver-copper solder, introducing nitrogen-hydrogen mixed gas protection gas, and preheating for a period of time.
S2, respectively welding the base plate 2 and the shell 1, the ceramic bearing sheet 7 and the molybdenum sheet press welding area 4, and the ceramic insulator 5 and the Kovar copper clad core lead 6 together, arranging surface metallization layers on the ceramic insulator 5 and the ceramic bearing sheet 7 which need to be welded and sealed, wherein the surface metallization layers comprise a tungsten slurry layer and a nickel plating layer, the tungsten slurry layer is printed in the preparation process of the ceramic insulator 5, and the nickel plating layer is formed after the ceramic insulator 5 is prepared and formed.
And S3, embedding the ceramic insulator 5 on the shell 1 through an assembling device 8 and realizing sealing through welding.
And S4, carrying out final assembly welding and assembly on all parts formed by welding in the S2 to form the metal ceramic shell.
As shown in fig. 1, in S3, the assembly apparatus 8 includes a conveying belt 801, turning units 9 disposed on both sides of the conveying belt 801, a carrying unit 10 disposed on the turning unit 9 and a holding unit 11 disposed on the carrying unit 10, and a guide unit 12 disposed above the conveying belt 801.
As shown in fig. 1, the revolving unit 9 includes a revolving chain a901 and a revolving chain b902, the bearing unit 10 includes a bearing seat 101 disposed on the revolving chain a901 and the revolving chain b902, a frame 102 disposed on the revolving chain b902 for bearing the bearing seat 101, a cross bar a103 slidably disposed on the frame 102, a vertical bar a104 slidably disposed on the cross bar a103, a sliding sleeve 105 fixedly connected to one side of the cross bar a103, a cross bar b106 fixedly connected to the other side of the sliding sleeve 105, and a vertical bar b107 slidably disposed on the cross bar b106, when the ceramic insulator 5 and the kovar copper-clad core lead 6 are integrated by manual welding, the ceramic insulator is placed on the bearing seat 101 for bearing and positioning.
As shown in fig. 1, the clamping unit 11 includes a gear a111 and a gear b112 rotatably disposed on the sliding sleeve 105, a rack a113 and a rack b114 engaged with the gear b112, a clamping plate 115 disposed on the vertical rod a104 and the vertical rod b107, a cylinder 116 connected to the vertical rod b107 and the vertical rod a104, a chamber 117 opened on the clamping plate 115, and a plurality of clamping blocks 118 slidably disposed on the chamber 117, an air pipe 119 connected to the chamber 117 and the cylinder 116, the guiding unit 12 includes a guiding plate 121 disposed above the conveying belt 801, a guiding column 122 connected to an upper end of the horizontal rod a103, a first rack 123 and a second rack 124 connected to the guiding plate 121, a lower pressing rod 125 slidably disposed on the sliding sleeve 105, and a piston 126 connected to a lower end of the lower pressing rod 125, the first rack 123 and the second rack 124 are engaged with the gear a111, the piston 126 is slidably disposed in the cylinder 116, the limiting unit 13 includes a square rod 131 connected to the lower pressing rod 125, a limiting plate 132 connected to the sliding sleeve 105, and a limiting plate 133 slidably disposed on four sides of the limiting plate 132;
when the shell 1 and the ceramic insulator 5 are conveyed synchronously, the guide column 122 passes through the front half section of the guide plate 121 from top to bottom, and drives the cross rod a103, the cross rod b106 and the sliding sleeve 105 to descend into the shell 1 along the direction of the frame 102;
then in the process of continuing transmission, the gear a111 rotates clockwise through the first rack 122 to drive the gear b112 to rotate clockwise, the rack a113 and the rack b114 rotate clockwise and counterclockwise respectively, the vertical rod a104 and the vertical rod b107 are pushed to extend towards the openings formed in the two sides of the shell 1 until the clamping plate 115 is driven to be close to the other end of the kovar copper clad core lead 6, at this time, the lower pressing rod 125 drives the piston 126 to descend under the action of the guide plate 121, gas in the cylinder 116 is input into the chamber 117 through the air pipe 119, so that the clamping block 118 is pushed out of the clamping plate 115 to clamp the kovar copper clad core lead 6, and meanwhile, the lower pressing rod 125 drives the square conical rod 131 to descend to push the limiting rod 133 to slide towards the shell 1 to limit the shell 1, the kovar copper clad core lead 6 is clamped in a mode of generating air pressure through gas, so that the clamping force can be controlled, and the kovar copper clad core lead 6 can be prevented from being damaged;
after the clamping block 118 completes the clamping action, the gear a111 rotates counterclockwise through the second rack 123 on the transmission path, thereby driving the gear b112 to rotate counterclockwise, the rack a113 and the rack b114 rotate counterclockwise and clockwise respectively, pull the vertical rod a104 and the vertical rod b107 to extend towards the inside of the housing 1 and enable the kovar copper clad core lead 6 to pass through the opening on the housing 1 to be embedded on the housing 1, at this time, the lower pressing rod 125 drives the piston 126 to rise in the rising process to suck the gas in the chamber 117 back into the cylinder body 116 when passing through the second half section from the bottom to the top of the guide plate 121, so that the clamping block 118 releases the kovar copper clad core lead 6, at this time, the guide post 122 drives the cross rod a103, the cross rod b106 and the sliding sleeve 105 to rise along the direction of the frame 102 to reset when passing through the second half section of the guide plate 121, through the device, the kovar copper clad core lead 6 can be automatically embedded on the housing 1, thereby increasing the working efficiency, in addition, the clamping plate 115 at the lower end is connected through the torsion spring, and the clamping plate 115 is prevented from being separated from the kovar copper clad core lead 6 when rising.
In the description of the present invention, it is to be understood that the terms "front-back", "left-right", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or component must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the invention.
Of course, in this disclosure, those skilled in the art will understand that the terms "a" and "an" should be interpreted as "at least one" or "one or more," i.e., in one embodiment, a number of an element may be one, and in another embodiment, a number of the element may be plural, and the terms "a" and "an" should not be interpreted as limiting the number.
The present invention is not limited to the above-described embodiments, and it should be noted that various changes and modifications can be made by those skilled in the art without departing from the structure of the present invention, and these changes and modifications should be construed as the scope of the present invention, which does not affect the effect and practicality of the present invention.

Claims (10)

1. A metal ceramic shell for replacing SOP-08 pure ceramic package is characterized in that: including casing (1), bottom plate (2), apron (3), molybdenum sheet pressure welding district (4), ceramic insulator (5), kovar package copper core lead wire (6) and ceramic bearing piece (7), bottom plate (2) and apron (3) encapsulate respectively in the bottom and the top of casing (1), ceramic bearing piece (7) welding is on bottom plate (2), ceramic insulator (5) are inlayed on casing (1) and are realized sealedly through the welding through equipment (8), ceramic insulator (5) are a whole and open and have a plurality of pin holes, kovar package copper core lead wire (6) pass inside and outside pin hole connection casing (1) and realize sealedly through the welding.
2. The metal ceramic shell for replacing an SOP-08 pure ceramic package according to claim 1, wherein: the molybdenum sheet press welding area (4) is located inside the shell (1) and the molybdenum sheet press welding area (4) extends transversely along the shell (1).
3. The metal ceramic shell for replacing an SOP-08 pure ceramic package according to claim 1, wherein: the ceramic insulator (5) is alumina high-temperature co-fired ceramic.
4. The cermet housing in place of the SOP-08 pure ceramic package of claim 1, wherein: the ceramic insulator (5) and the ceramic supporting sheet (7) are provided with surface metallization layers at positions needing welding and sealing, the surface metallization layers comprise tungsten slurry layers and nickel plating layers, the tungsten slurry layers are printed in the preparation process of the ceramic insulator (5), the nickel plating layers are formed after the ceramic insulator (5) is prepared, and the thickness of the nickel plating layers is more than or equal to 3 mu m.
5. The metal ceramic shell for replacing an SOP-08 pure ceramic package according to claim 1, wherein: the Kovar alloy shell comprises a shell body (1), a cover plate (3) and a base plate (2), wherein the base plate (2) is made of tungsten copper, nickel is plated on the shell body (1), the base plate (2), the cover plate (3), a molybdenum sheet press welding area (4) and a Kovar package copper core lead (6) which need to be welded, and the thickness of the nickel plating layer is larger than or equal to 3 mu m.
6. The cermet housing in place of the SOP-08 pure ceramic package of claim 1, wherein: the metal surface of the shell is plated with a layer of gold, and the thickness of the gold plating layer is more than or equal to 0.5 mu m.
7. A preparation method of a metal ceramic shell for replacing SOP-08 pure ceramic package comprises the following steps:
s1, heating a nitrogen-hydrogen atmosphere protection chain type sintering furnace to the welding temperature of the silver-copper solder, introducing nitrogen-hydrogen mixed gas protection gas, and preheating for a period of time.
S2, respectively welding the base plate (2) and the shell (1), the ceramic bearing sheet (7) and the molybdenum sheet press welding area (4) and the ceramic insulator (5) and the Kovar package copper core lead (6), arranging a surface metallization layer on the ceramic insulator (5) and the ceramic bearing sheet (7) at positions needing welding and sealing, wherein the surface metallization layer comprises a tungsten slurry layer and a nickel plating layer, the tungsten slurry layer is printed in the preparation process of the ceramic insulator (5), and the nickel plating layer is carried out after the ceramic insulator (5) is prepared and formed.
And S3, embedding the ceramic insulator (5) on the shell (1) through an assembling device (8) and realizing sealing through welding.
And S4, carrying out final assembly welding and assembling on all parts welded in the step S2 to form the metal ceramic shell.
8. The method for preparing the metal ceramic shell for replacing the SOP-08 pure ceramic package according to claim 7, wherein the method comprises the following steps: s3, the structure of the assembling equipment (8) comprises a conveying belt (801), rotary units (9) arranged on two sides of the conveying belt (801), bearing units (10) arranged on the rotary units (9), clamping units (11) arranged on the bearing units (10), guide units (12) arranged above the conveying belt (801), and limiting units (13) arranged on the clamping units (11).
9. The method for preparing a cermet casing instead of SOP-08 pure ceramic package according to claim 8, wherein: the rotary unit (9) comprises a rotary chain a (901) and a rotary chain b (902), the bearing unit (10) comprises a bearing seat (101) arranged on the rotary chain a (901) and the rotary chain b (902), a frame (102) arranged on the rotary chain b (902) and bearing seat (101), a cross rod a (103) arranged on the frame (102) in a sliding manner, a vertical rod a (104) arranged on the cross rod a (103) in a sliding manner, a sliding sleeve (105) fixedly connected to one side of the cross rod a (103), a cross rod b (106) fixedly connected to the other side of the sliding sleeve (105), and a vertical rod b (107) arranged on the cross rod b (106) in a sliding manner.
10. The method for preparing a cermet casing instead of SOP-08 pure ceramic package according to claim 8, wherein: the clamping unit (11) comprises a gear a (111) and a gear b (112) which are rotatably arranged on a sliding sleeve (105), a rack a (113) and a rack b (114) which are meshed with the gear b (112), clamping plates (115) arranged on vertical rods a (104) and b (107), a cylinder body (116) connected to the vertical rods b (107) and a vertical rod a (104), a chamber (117) arranged on the clamping plates (115), a plurality of clamping blocks (118) arranged on the chamber (117) in a sliding manner, and an air pipe (119) connecting the chamber (117) and the cylinder body (116), the guiding unit (12) comprises a guide plate (121) arranged above a conveying belt (801), a guiding column (122) connected to the upper end of a cross rod a (103), a first rack (123) and a second rack (124) connected to the guide plate (121), a lower pressing rod (125) arranged on the sliding sleeve (105), and a piston (126) connected to the lower pressing rod (125) connected to the lower end of the lower pressing rod (125), the first rack (123), the second rack (124) and the gear (111) are meshed with the gear b (125), and the piston (116) is arranged in the sliding manner, and the lower pressing rod (13) connected to the piston (13) arranged in the cylinder body (13), a limiting plate (132) connected with the sliding sleeve (105), and limiting rods (133) arranged on four sides of the limiting plate (132) in a sliding way.
CN202211362842.2A 2022-11-02 2022-11-02 Metal ceramic shell for replacing SOP-08 pure ceramic package and preparation method thereof Active CN115602637B (en)

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