CN115599027B - Low-dimensional aircraft chip microsystem, preparation and control method - Google Patents
Low-dimensional aircraft chip microsystem, preparation and control method Download PDFInfo
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- CN115599027B CN115599027B CN202211615513.4A CN202211615513A CN115599027B CN 115599027 B CN115599027 B CN 115599027B CN 202211615513 A CN202211615513 A CN 202211615513A CN 115599027 B CN115599027 B CN 115599027B
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- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
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- G—PHYSICS
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- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
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Abstract
The invention relates to a low-dimensional aircraft chip microsystem, a preparation method and a control method, which relate to the fields of unmanned aerial vehicle navigation flight control and micro electro mechanical systems, and the low-dimensional aircraft chip microsystem comprises: the flight control system comprises an aircraft substrate, a flight control microprocessor, a flight state monitoring module, a control module, a data storage module and a communication module; the flight control microprocessor is integrated on the aircraft substrate; the flight state monitoring module, the control module, the data storage module and the communication module are all connected with the flight control microprocessor. The invention can reduce the volume and weight of the hardware of the miniature flight control system, and is suitable for the development of the low-dimensional miniature fixed-wing aircraft in the direction of high density, miniaturization and high reliability.
Description
Technical Field
The invention relates to the field of unmanned aerial vehicle navigation flight control and micro electro mechanical systems, in particular to a low-dimensional aircraft chip micro system, a preparation method and a control method.
Background
Due to the small size of the micro aircraft, the micro aircraft can perform tasks in areas where people cannot reach the areas with harsh environments or narrow spaces. The method can be used for chemical sampling, environmental monitoring, pipeline inspection, communication relay and even extraterrestrial surface detection and the like. For a low-dimensional miniature fixed wing aircraft integrating the functions of a rudder, an elevator and ailerons into a plane, the flight and aileron can simultaneously control course, pitch and roll motions. Therefore, under the action of unsteady atmospheric disturbance, the attitude stability control and navigation of the micro aircraft are different from the conventional problems. However, weight and flight control limit further performance improvements, so core flight control should be a high integration of payload and minimal integration between various functional modules, while increasing stability augmentation control microsystems for increased stability handling characteristics.
In the prior art, a design mode of a PCB with independent functions is adopted, the integration level of elements and circuit layout is improved, and the miniature design of a flight control system is realized, but the system is formed by assembling and splicing functional modules, the overall weight is heavier, and because a miniature aircraft is small in size, the body capacity and the bearing weight of the miniature aircraft are greatly limited, and the traditional design framework and the traditional manufacturing mode can not meet the development requirements of the miniature unmanned aerial vehicle.
In addition, in the prior art, the microsystem technology is generally designed and manufactured, the navigation flight control microsystem takes the LTCC as a structural body, high-density and multilayer wiring is simultaneously carried out in the LTCC, and various navigation source sensors, a navigation calculation CPU, a flight control CPU, a navigation circuit, a flight control circuit and the like are three-dimensionally integrated on the LTCC in a high-precision manner.
The wing body fusion body has the smallest low-dimensional layout size under the condition of completing the same flight task and bearing the same size of load, and simultaneously brings greater difficulty and challenge to flight control hardware and software systems. The traditional flight control micro system further increases the total weight of the aircraft, so that the micro aircraft has poor load carrying capacity and poor flight performance.
Disclosure of Invention
The invention aims to provide a low-dimensional aircraft chip micro-system, a preparation method and a control method, which are used for reducing the volume and the weight of micro flight control system hardware and are suitable for the development of low-dimensional micro fixed wing aircraft in the direction of high density, miniaturization and high reliability.
In order to achieve the purpose, the invention provides the following scheme:
a low dimensional aircraft chip microsystem comprising: the flight control system comprises an aircraft substrate, a flight control microprocessor, a flight state monitoring module, a control module, a data storage module and a communication module;
the flight control microprocessor is integrated on the aircraft substrate; the flight state monitoring module, the control module, the data storage module and the communication module are all connected with the flight control microprocessor.
Optionally, the flight state monitoring module includes a 3-axis gyroscope, a 3-axis accelerometer, an air pressure sensor, a GPS module, a 3-axis digital compass, and a battery voltage detection module;
the air pressure sensor, the 3-axis gyroscope and the 3-axis accelerometer are all connected with the flight control microprocessor through SPI interfaces; the GPS module is connected with the flight control microprocessor through a first serial port;
the 3-axis digital compass is connected with the flight control microprocessor through an IIC interface; and the battery voltage detection module is connected with the flight control microprocessor through an ADC (analog to digital converter) interface.
Optionally, the control module comprises a rudder control module and a motor control module;
the rudder control module is connected with the flight control microprocessor through a PWM output interface; and the motor control module is connected with the flight control microprocessor through a motor driving interface.
Optionally, the communication module comprises a 915 data transmission wireless communication module and a remote sensing signal decoding module;
the 915 data transmission wireless communication module is connected with the flight control microprocessor through a third serial port; and the remote sensing signal decoding module is connected with the flight control microprocessor through a second serial port.
Optionally, the low-dimensional aircraft chip micro-system further comprises a power module connected with the flight control microprocessor; the power module is used for providing electric energy for the flight control microprocessor.
The invention also provides a preparation method of the low-dimensional aircraft chip microsystem, which is used for preparing any one of the low-dimensional aircraft chip microsystems, and the preparation method of the low-dimensional aircraft chip microsystem comprises the following steps:
sticking the single chip to an aircraft substrate and grinding the single chip; the single chip comprises a flight control microprocessor, a flight state monitoring module, a control module, a data storage module and a communication module;
pasting the aircraft substrate pasted with the single chip and the multilayer thin film flexible plate to obtain a chip flexible plate electrode;
etching a lead pattern on the disk belt and forming a lead frame according to the lead pattern;
manufacturing salient points on the chip flexible plate electrodes, and welding the chip flexible plate electrodes and the lead frame according to the salient points to obtain a disk-shaped lead frame;
punching and separating the single chip to obtain a beam lead device;
and bonding the beam lead device with the aircraft substrate to obtain the low-dimensional aircraft chip micro-system.
Optionally, the disk tape comprises a polyester film and a copper foil disposed on the polyester film.
The invention also provides a control method of the low-dimensional aircraft chip microsystem, which is applied to any one of the low-dimensional aircraft chip microsystems, and comprises the following steps:
acquiring sensor data; the sensor data comprises 3-axis gyroscope data, 3-axis accelerometer data, barometer data, GPS module data, 3-axis digital compass data and battery voltage data;
estimating the position and the attitude according to the sensor data to obtain the state information of the aircraft;
and carrying out PID control according to the state information to obtain a controller output instruction.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
the invention provides a low-dimensional aircraft chip microsystem, comprising: the system comprises an aircraft substrate, a flight control microprocessor, a flight state monitoring module, a control module, a data storage module and a communication module; the flight control microprocessor is integrated on the aircraft substrate; the flight state monitoring module, the control module, the data storage module and the communication module are all connected with the flight control microprocessor. The volume and the weight of the hardware of the miniature flight control system are reduced through integration, and the miniature fixed wing aircraft is suitable for the development of the low-dimensional miniature fixed wing aircraft in the directions of high density, miniaturization and high reliability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
FIG. 1 is a schematic structural diagram of a low dimensional aircraft chip microsystem provided in the present invention;
FIG. 2 is a general diagram of a low dimensional aircraft chip microsystem provided by the present invention;
FIG. 3 is a schematic diagram of a flight control microprocessor according to the present invention;
FIG. 4 is a schematic diagram of a MEMS sensor;
FIG. 5 is a schematic diagram of an SD card;
FIG. 6 is a schematic diagram of a 915D wireless communication module;
FIG. 7 is a schematic diagram of a power module;
FIG. 8 is a flight control stack block diagram;
fig. 9 is a posture control strategy diagram.
Description of the symbols:
the system comprises a flight control microprocessor 1, a data storage module 2, a flight state monitoring module 3, a 4-3-axis gyroscope, a 5-3-axis accelerometer, a 6-air pressure sensor, a 7-GPS module, an 8-3-axis digital compass, a 9-battery voltage detection module, a 10-915 data transmission wireless communication module, a 11-remote sensing signal decoding module, a 12-rudder machine control module, a 13-power supply module, a 14-SD card and a 15-EEPROM.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The invention aims to provide a low-dimensional aircraft chip micro-system, a preparation method and a control method, which are used for reducing the volume and the weight of micro flight control system hardware and are suitable for the development of low-dimensional micro fixed wing aircraft in the direction of high density, miniaturization and high reliability.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
As shown in fig. 1 to 7, the present invention provides a low dimensional aircraft chip microsystem comprising: the aircraft comprises an aircraft substrate, a flight control microprocessor 1 shown in figure 3, a flight state monitoring module 3, a control module, a data storage module 2 and a communication module.
The flight control microprocessor 1 is integrated on the aircraft substrate; the flight state monitoring module 3, the control module, the data storage module 2 and the communication module are all connected with the flight control microprocessor 1.
In practical application, the flight state monitoring module 3 comprises a 3-axis gyroscope 4, a 3-axis accelerometer 5, an air pressure sensor 6, a GPS module 7, a 3-axis digital compass 8 and a battery voltage detection module 9; the air pressure sensor 6, the 3-axis gyroscope 4 and the 3-axis accelerometer 5 are all connected with the flight control microprocessor 1 through SPI interfaces; the GPS module 7 is connected with the flight control microprocessor 1 through a first serial port USART 1; the 3-axis digital compass 8 is connected with the flight control microprocessor 1 through an IIC interface; the battery voltage detection module 9 is connected with the flight control microprocessor 1 through an ADC interface.
The control module comprises a rudder machine control module 12 and a motor control module; the rudder control module 12 is connected with the flight control microprocessor 1 through a PWM output interface; and the motor control module is connected with the flight control microprocessor 1 through a motor driving interface.
The communication module comprises a 915 data transmission wireless communication module 10 and a remote sensing signal decoding module 11 shown in FIG. 6; the 915 data transmission wireless communication module 10 is connected with the flight control microprocessor 1 through a third serial port USART 3; the remote sensing signal decoding module 11 is connected with the flight control microprocessor 1 through a second serial port USART 2.
The low-dimensional aircraft chip microsystem further comprises a power supply module 13 shown in fig. 7 connected with the flight control microprocessor 1; the power module 13 is used for providing electric energy for the flight control microprocessor 1.
The data storage module 2 includes an SD card 14 and an EEPROM15 as shown in fig. 5.
Bare chip planar interconnects on a substrate are made according to the low dimensional aircraft chip microsystem as shown in fig. 1: the flight control microprocessor 1 is communicated with 6-axis sensors (a 3-axis gyroscope 4 and a 3-axis accelerometer 5) and an air pressure sensor 6 with high stability and extremely low pressure signal lag through an SPI (serial peripheral interface), attitude and speed information is obtained according to the gyroscope and the accelerometer, the altimeter obtains altitude information, and the altimeter is communicated with a 3-axis digital compass 8 through an IIC (inter integrated circuit) interface to obtain course information. Through first serial ports USART1 and GPS communication, second serial ports USART2 is as telemetering measurement data transmission chip interface, and ground station data transmission pairs with aerial end data transmission, can adjust the parameter in the flight, real-time supervision unmanned aerial vehicle state, change flight task etc.. The information of the sensor calibration parameters, the system configuration, the software configuration and the like of the system is saved through the EEPROM15 mounted on the IIC2 bus. And the 4-wire mode of SDMMC is used for communicating with the SD card 14 to store the flight log. In addition, the voltage of 5V is stabilized to obtain 3.3V voltage, and the power is supplied to the SD card 14, the main control chip, the sensor and the like. The chip has a 3.3V voltage stabilizing function, meets the power consumption requirement of the system, does not need to carry out additional design on a power supply circuit, and simultaneously comprises a crystal oscillator circuit and a reset circuit which ensure the normal work of the microprocessor, leads out all I/O resources and is suitable for being accessed into a user system; the JTAG download interface facilitates user debugging of the control algorithm. Among them, the 3-axis gyroscope 4, the 3-axis accelerometer 5, the barometric pressure sensor 6, and the 3-axis digital compass 8 are MEMS sensors as shown in fig. 4.
The low-dimensional miniature fixed wing aircraft has the characteristics of few control surfaces and high efficiency, and the low-dimensional aircraft chip microsystem provided by the invention has the advantages that the aircraft body and the low-dimensional aircraft chip microsystem form a wing body fusion body, the design can eliminate the additional resistance generated by an aircraft body part and the interference between wing bodies, so that a higher lift-drag ratio can be obtained at a possibly lower speed, the purpose of improving the whole-aircraft performance is achieved, the problem of the pneumatic efficiency reduction of the whole-aircraft lift-drag ratio reduction caused by the course stability augmentation of the traditional resistance type three-dimensional control surfaces is well solved, the low-dimensional miniature fixed wing aircraft is suitable for the miniature aircraft with the low-dimensional layout of the wing body fusion plane, and the application value is realized.
The invention also provides a preparation method of the low-dimensional aircraft chip microsystem, which is used for preparing any one of the low-dimensional aircraft chip microsystems, the low-dimensional aircraft chip microsystem is a whole full-integrated design aircraft flexible plate, and the preparation method of the low-dimensional aircraft chip microsystem comprises the following steps:
sticking the single chip to an aircraft substrate and grinding the single chip; the single chip comprises a flight control microprocessor, a flight state monitoring module, a control module, a data storage module and a communication module.
The aircraft substrate of the invention is a PI flexible substrate. With flight control microprocessor, 3-axis gyroscope, 3-axis accelerometer, baroceptor, the GPS module, 3-axis digital compass, battery voltage detects, the SD card, 915 digital transmission wireless communication module, 5V power module, single-chip module attenuate such as 3.3V power module, adopt 60cp photoresist single-chip to adhere to 1 mm's PI gentle base plate on, 90 degrees preheat 2 minutes, adopt the amesdial to test the gross thickness of gentle board and chip, then adopt 100 mesh fine sand to grind the chip, adopt the amesdial to test in the grinding process, until grinding suitable thickness.
And (3) pasting the aircraft substrate pasted with the single chip with the multilayer thin film flexible board to obtain a chip flexible board electrode.
Adopt the insulating cement to bond the gentle base plate of PI and the multilayer film flexible plate of chip, bonding material adopts the insulating cement, and the volume is glued in the control, avoids overflowing too much, guarantees to glue thickness about 30 microns, and the solidification process is controlled simultaneously, reduces the injury that stress brought the attenuate chip. Three-stage time curing is adopted: temperature rising, main curing and temperature reduction are carried out, and the main curing section is realized by reducing the temperature and prolonging the time.
And etching a lead pattern on the disk belt and forming a lead frame according to the lead pattern. Wherein the disk tape comprises a polyester film and a copper foil arranged on the polyester film.
And manufacturing salient points on the chip flexible plate electrodes, and welding the chip flexible plate electrodes and the lead frame according to the salient points to obtain the disk-shaped lead frame.
And punching and separating the single chip to obtain the beam type lead device.
And bonding the beam lead device with the aircraft substrate to obtain the low-dimensional aircraft chip micro-system.
Etching a multi-unit Cu conductor precise strip lead pattern on a disk belt consisting of a polyester (such as polyimide) film and a Cu foil and forming a gold-plated Cu lead frame; manufacturing salient points on the PI flexible plate electrodes of the chip; correspondingly welding the chip module electrodes and the lead welding areas together through the salient points one by one to complete inner lead bonding to form a disk-shaped lead frame containing the Ie chip; punching and separating a single chip and a lead frame to form a beam type lead device; and bonding the beam-lead devices to corresponding positions of the multi-chip assembly flexible substrate.
And welding the belt lead and the flexible substrate through outer lead bonding, and finally obtaining the integrally designed and manufactured low-dimensional aircraft chip micro-system suitable for the low-dimensional micro-aircraft.
And burning a Bootloader file into a flight control chip to serve as a micro-system starting program, compiling flight control codes to generate firmware, and carrying out sensor data calibration through a USB pin burning starting script, a flight control algorithm and the like.
The invention also provides a control method of the low-dimensional aircraft chip microsystem, which is applied to any one of the low-dimensional aircraft chip microsystems, and comprises the following steps:
acquiring sensor data; the sensor data includes 3-axis gyroscope data, 3-axis accelerometer data, barometric sensor data, GPS module data, 3-axis digital compass data, and battery voltage data.
And estimating the position and the attitude according to the sensor data to obtain the state information of the aircraft.
And performing PID control according to the state information to obtain a controller output instruction.
And a plurality of bare chips and passive devices are interconnected by utilizing micro-electromechanical and planar interconnection technologies to form a high-performance low-dimensional aircraft micro-system. The combined sensor measuring module integrates bare chips of devices such as a three-axis acceleration sensor, a three-axis gyroscope, a micro airspeed meter, a micro altimeter, a micro GPS receiver and the like on a special chip, thereby realizing information exchange and sharing of the aircraft, and finishing management, measurement, control and task scheduling of the operation of the low-dimensional aircraft in real time to realize the functions of the whole system. The flight control algorithm of the low-dimensional aircraft chip micro-system mainly comprises attitude calculation, attitude control and position and stability augmentation control algorithms, the bare chip-level special plane integrated chip can greatly reduce the volume and weight of micro-flight control system hardware, and the low-dimensional aircraft chip micro-system is suitable for the development of the low-dimensional micro fixed wing aircraft in the high-density, small-size and high-reliability direction.
As shown in fig. 8, the flight control stack is a collection of autonomous aircraft navigation, guidance, and control algorithms the low dimensional aircraft chip microsystem flight control stack integrates navigation, guidance, and control algorithms for the low dimensional autonomous aircraft. The method specifically comprises position, attitude, speed control and position and attitude estimation. Inputting sensor data such as GPS, gyroscope, accelerometer, barometer and the like into a position and attitude predictor, and obtaining angle data according to the specific position and attitude estimator and the good gyroscope integration with high-frequency characteristics, wherein the angle data comprises a pitch angle
Roll angle
Course angle
The accelerometer and the digital compass obtain angle data with good low-frequency characteristics so as to complement each other, and the drift error of the integral is corrected to obtain an optimal angle; the predictor performs data fusion to calculate the state of the aircraft, and then transmits state information to the navigation module and the position, attitude and speed controller, wherein the state information is angular speed deviation corresponding to the pitch angle
Angular velocity offset corresponding to roll angle
Angular velocity deviation corresponding to course angle
(ii) a The goal of the position, attitude, velocity controller is to adjust the actual value of the process variable to be consistent with the desired set point, and the resulting output quantity achieves a correction of the state variable to ultimately reach the desired set point. Taking an attitude controller as an example, the controller includes a pitch angle with desired attitude angle data
Roll angle
Angle of course
The isoparametric is used as input, the process variable is an estimated value of the current attitude, and the controller finally outputs an attitude and throttle instruction for guiding the aircraft to the expected position. In particular to a left and right aileron steering engineThe longitudinal flight is controlled by the up-and-down movement, the horizontal course control is completed by the differential motion of the left and right auxiliary wing surfaces, and the two groups of control are respectively completed by symmetrical and asymmetrical signals generated by a pair of mutually independent steering engines. The following formula takes the attitude controller as an example, but the parameters used are general parameters of the entire flight control.
In the formula:
is the angular velocity offset of the pitch angle,
is the angular velocity offset of the roll angle,
is the angular velocity offset of the heading angle,
is a pitch angle,
Roll angle and
is the angle of the course direction and is,
in order to be the roll angle velocity,
for the pitch angle rate to be,
is the course angular rate; corresponding relation
Time, thr is an accelerator command, and M is the steering engine output.
The throttle instruction is as follows: in fig. 9, the difference between the angle output by the angular velocity controller and the current attitude value fed back by the sensor is converted into a PWM signal. The Thr throttle command corresponds to an expected attitude, and the output of the M steering engine corresponds to an actual attitude.
The pitch angle, roll angle and heading angle of the expected angular speed are converted into a body coordinate system, and are described by a controller of a pitch channel, and the flight control is around an x axis
Around y is
Around z is
. From the formula
The anti-interference stability-increasing flight is realized through the parallel regulation of an inner ring and an outer ring of a cascade PID, and the cascade control adopts another measuring unit and adds another feedback loop to form a second closed loop to quickly sense and overcome the system disturbance. The additionally introduced measuring unit needs to be more sensitive than the original measuring unit and can sense the system disturbance more quickly. The method can quickly correct errors to keep a stable state before the controlled object has larger errors, wherein the feedback current angle and an angle ring PID controller form an outer ring, the feedback current angular velocity and an angular velocity ring PID controller form an inner ring, the current angle is derived from the optimal estimation value in the attitude calculation result, and the current angular velocity value is estimated by the state to obtain the optimal estimation value. The input of the outer ring angle ring PID controller is the error of the attitude angle, namely the attitude angle subtracts the current feedback angle value, and the output result of the angle ring PID controller is the expected angular velocity; the input of the inner ring angular velocity ring PID controller is angular velocity error, the expected angular velocity subtracts the feedback current angular velocity, the output result of the angular velocity PID controller is the control quantity of the steering engine and the sensor, and the control method is proportional-integral-derivative control.
When the aircraft slightly perturbs in the flight process and the attitude angle of the aircraft does not change, the angle controller has no way of predicting the angle error of the system, so that the aircraft cannot be quickly controlled, but the measuring unit of the angular velocity PID controller can quickly sense the change of the angular velocity and quickly feed the change of the angular velocity back to the angular velocity PID controller, and the auxiliary controller performs PID control on the error of the angular velocity to obtain output, and the output is sent to a steering engine and a sensor, so that the aircraft quickly eliminates the error and keeps a stable state. Another active control is: when the angular velocity loop PID controller obtains an expected attitude angle, the attitude expectation subtracts the current feedback angle to obtain an input error of the angular velocity loop PID controller, the main angular velocity loop PID controller obtains an expected angular velocity through P control, at the moment, the angular velocity expectation subtracts the current feedback angular velocity to obtain an angular velocity error, the error is input to the angular velocity loop PID controller, the angular velocity loop PID controller obtains output through PID control, the output is delivered to an actuator, and the actuator enables the aircraft to quickly eliminate the angular velocity error, so that the aircraft is kept stable in an expected attitude angle state. In practice, in order to realize quick response, the inner ring can be directly controlled, or the posture can be directly controlled. The control strategy is shown in fig. 9.
A high-performance electronic system consisting of a plurality of bare chips and passive devices is integrated in the same package by utilizing a planar micro-assembly and interconnection technology, and all functional modules are organically connected, so that information exchange and sharing of the aircraft are realized, management, measurement, control and task scheduling of the operation of the low-dimensional aircraft are completed in real time, and the functions of the whole system are realized. The chip reduces the volume and weight of flight control system hardware, and simultaneously compensates the aerodynamic damping of the micro aircraft by using a cascade PID (proportion integration differentiation) inner-outer two-ring stability augmentation control technology, so that the low-dimensional micro fixed wing is relatively poor in static stability, and has higher applicability and flexibility.
In the present specification, the embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The principles and embodiments of the present invention have been described herein using specific examples, which are set forth only to help understand the apparatus and its core concepts of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (8)
1. A low-dimensional aircraft chip microsystem, comprising: the system comprises an aircraft substrate, a flight control microprocessor, a flight state monitoring module, a control module, a data storage module and a communication module;
the flight control microprocessor is integrated on the aircraft substrate; the flight state monitoring module, the control module, the data storage module and the communication module are all connected with the flight control microprocessor;
sticking the single chip to an aircraft substrate and grinding the single chip; the single chip comprises a flight control microprocessor, a flight state monitoring module, a control module, a data storage module and a communication module; the aircraft substrate pasted with the single chip is pasted with the multilayer thin film flexible plate to obtain a chip flexible plate electrode; etching a lead pattern on the disk belt and forming a lead frame according to the lead pattern; manufacturing salient points on the chip flexible plate electrodes, and welding the chip flexible plate electrodes and the lead frame according to the salient points to obtain a disk strip-shaped lead frame; punching and separating the single chip to obtain a beam lead device; and bonding the beam lead device with the aircraft substrate to obtain the low-dimensional aircraft chip microsystem.
2. The low-dimensional aircraft chip microsystem as claimed in claim 1, wherein said flight status monitoring module comprises a 3-axis gyroscope, a 3-axis accelerometer, a barometric pressure sensor, a GPS module, a 3-axis digital compass and a battery voltage detection module;
the air pressure sensor, the 3-axis gyroscope and the 3-axis accelerometer are all connected with the flight control microprocessor through SPI interfaces; the GPS module is connected with the flight control microprocessor through a first serial port;
the 3-axis digital compass is connected with the flight control microprocessor through an IIC interface; and the battery voltage detection module is connected with the flight control microprocessor through an ADC (analog to digital converter) interface.
3. The low dimensional aircraft chip microsystem as claimed in claim 1, characterized in that said control modules comprise a rudder control module and a motor control module;
the rudder control module is connected with the flight control microprocessor through a PWM output interface; and the motor control module is connected with the flight control microprocessor through a motor driving interface.
4. The low-dimensional aircraft chip microsystem as claimed in claim 1, wherein said communication module comprises a 915 data transmission wireless communication module and a remote sensing signal decoding module;
the 915 data transmission wireless communication module is connected with the flight control microprocessor through a third serial port; and the remote sensing signal decoding module is connected with the flight control microprocessor through a second serial port.
5. The low dimensional aircraft chip microsystem of claim 1, further comprising a power module connected to said flight control microprocessor; and the power supply module is used for providing electric energy for the flight control microprocessor.
6. A method for preparing a low dimensional aircraft chip microsystem, wherein the method for preparing a low dimensional aircraft chip microsystem is used for preparing the low dimensional aircraft chip microsystem of any one of claims 1 to 5, and the method for preparing a low dimensional aircraft chip microsystem comprises:
sticking the single chip to an aircraft substrate and grinding the single chip; the single chip comprises a flight control microprocessor, a flight state monitoring module, a control module, a data storage module and a communication module;
pasting the aircraft substrate pasted with the single chip and the multilayer thin film flexible plate to obtain a chip flexible plate electrode;
etching a lead pattern on the disk belt and forming a lead frame according to the lead pattern;
manufacturing salient points on the chip flexible plate electrodes, and welding the chip flexible plate electrodes and the lead frame according to the salient points to obtain a disk strip-shaped lead frame;
punching and separating the single chip to obtain a beam lead device;
and bonding the beam lead device with the aircraft substrate to obtain the low-dimensional aircraft chip micro-system.
7. The method of claim 6, wherein the tape comprises a polyester film and a copper foil disposed on the polyester film.
8. A control method of a low-dimensional aircraft chip microsystem, which is applied to the low-dimensional aircraft chip microsystem of any one of claims 1 to 5, the control method comprising:
acquiring sensor data; the sensor data comprises 3-axis gyroscope data, 3-axis accelerometer data, barometer data, GPS module data, 3-axis digital compass data and battery voltage data;
estimating the position and the attitude according to the sensor data to obtain the state information of the aircraft;
carrying out PID control according to the state information to obtain a controller output instruction;
sticking the single chip to an aircraft substrate and grinding the single chip; the single chip comprises a flight control microprocessor, a flight state monitoring module, a control module, a data storage module and a communication module; pasting the aircraft substrate pasted with the single chip and the multilayer thin film flexible plate to obtain a chip flexible plate electrode; etching a lead pattern on the disk belt and forming a lead frame according to the lead pattern; manufacturing salient points on the chip flexible plate electrodes, and welding the chip flexible plate electrodes and the lead frame according to the salient points to obtain a disk-shaped lead frame; punching and separating the single chip to obtain a beam lead device; and bonding the beam lead device with the aircraft substrate to obtain the low-dimensional aircraft chip microsystem.
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| CN115599027B true CN115599027B (en) | 2023-03-14 |
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| KR0148080B1 (en) * | 1995-07-31 | 1998-08-01 | 김광호 | Lead frame manufacture method and the use semiconductor package manufactur mathod |
| JP3561209B2 (en) * | 2000-05-24 | 2004-09-02 | 株式会社三井ハイテック | Flip chip mounting binder and method of manufacturing semiconductor device using the same |
| CN101718667B (en) * | 2009-12-08 | 2011-11-16 | 西安交通大学 | Density sensor chip based on micro electro mechanical system technology and preparation method thereof |
| CN102169126B (en) * | 2011-01-17 | 2012-12-19 | 东南大学 | Hot air speed and air direction sensor based on thinning process and manufacturing method thereof |
| CN102593016A (en) * | 2012-03-20 | 2012-07-18 | 中国科学院微电子研究所 | Method for mounting thin chip on flexible baseplate |
| CN105161432A (en) * | 2015-09-17 | 2015-12-16 | 中芯长电半导体（江阴）有限公司 | Chip packaging method |
| CN111696873A (en) * | 2020-06-17 | 2020-09-22 | 佛山市蓝箭电子股份有限公司 | Semiconductor packaging method and packaged chip |
| CN112506098A (en) * | 2020-11-27 | 2021-03-16 | 中电科技集团重庆声光电有限公司 | LTCC-based monolithic unmanned aerial vehicle integrated navigation flight control micro system |
| CN112783067A (en) * | 2021-01-12 | 2021-05-11 | 西安盛安睿电子技术工程有限公司 | Flight control system of miniature individual combat folding fixed-wing unmanned aerial vehicle |
| CN113148103B (en) * | 2021-03-25 | 2022-10-25 | 西北工业大学 | Miniature unmanned vehicles skeleton that can dismantle equipment fast |
| CN216351868U (en) * | 2021-11-29 | 2022-04-19 | 中国电子科技集团公司第二十七研究所 | Flight control navigation micro system with load capacity |
| CN115066109B (en) * | 2022-08-05 | 2022-11-11 | 苏州东山精密制造股份有限公司 | Flexible circuit board with electroplated hard gold isolated pad and manufacturing method thereof |
| CN115202271A (en) * | 2022-08-23 | 2022-10-18 | 南京理工大学 | Embedded flight controller of micro unmanned aerial vehicle |
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