CN115595535B - Method for improving heat cycle reliability of aluminum nitride coated ceramic substrate - Google Patents
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- 239000000758 substrate Substances 0.000 title claims abstract description 137
- 239000000919 ceramic Substances 0.000 title claims abstract description 116
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 title claims abstract description 98
- 238000000034 method Methods 0.000 title claims abstract description 47
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 65
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 65
- 238000005728 strengthening Methods 0.000 claims abstract description 33
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000010936 titanium Substances 0.000 claims abstract description 32
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 32
- 238000004544 sputter deposition Methods 0.000 claims abstract description 25
- 238000004381 surface treatment Methods 0.000 claims abstract description 23
- 238000004140 cleaning Methods 0.000 claims abstract description 19
- 238000007747 plating Methods 0.000 claims abstract description 14
- 238000005406 washing Methods 0.000 claims description 34
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 30
- 239000007864 aqueous solution Substances 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 10
- 239000003513 alkali Substances 0.000 claims description 10
- 229910017604 nitric acid Inorganic materials 0.000 claims description 10
- 238000005554 pickling Methods 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 7
- 238000007711 solidification Methods 0.000 claims description 7
- 230000008023 solidification Effects 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 5
- 238000007670 refining Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 28
- 239000013078 crystal Substances 0.000 description 11
- 238000012360 testing method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
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- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
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- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
- C23C14/5813—Thermal treatment using lasers
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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Abstract
The invention discloses a method for improving the heat cycle reliability of an aluminum nitride aluminum-coated ceramic substrate, which relates to the field of semiconductor processing and aims at solving the problem that the heat resistance of the aluminum nitride aluminum-coated ceramic substrate is insufficient, and the technical scheme is as follows: a method for improving the heat cycle reliability of an aluminum nitride coated ceramic substrate comprises the following steps: 1) Surface sputtering titanium plating: taking an aluminum nitride coated aluminum ceramic substrate for surface cleaning, and then plating titanium to obtain the aluminum nitride coated aluminum ceramic substrate with a nano-scale titanium layer, wherein the thickness of the titanium layer is 50-100nm; 2) Laser strengthening: taking the aluminum nitride coated ceramic substrate with the nano-level titanium layer in the step 1 for laser strengthening treatment; 3) Surface treatment: and (3) carrying out surface treatment on the aluminum nitride aluminum-coated ceramic substrate treated in the step (2). The method for improving the heat-resistant cycle reliability of the aluminum nitride coated ceramic substrate can effectively improve the heat-resistant cycle performance of the substrate.
Description
Technical Field
The invention relates to the field of semiconductor preparation, in particular to a method for improving the heat cycle reliability of an aluminum nitride coated ceramic substrate.
Background
With the rapid development of IGBT power electronics, power electronics technology is evolving towards high voltage, high current, high power density, high speed aspects; aluminum nitride coated ceramic substrate (DBA) is used as the packaging substrate of IGBT, has excellent heat-resistant cycle performance, excellent interface bonding reliability, high heat conductivity and high insulating strength, and is favored by third-generation SiC semiconductor devices.
In the heat-resistant cycle performance test process of the device, aluminum has lower yield strength, and crystal grains can absorb partial damage protection ceramics through shaping, so that a bonding interface of aluminum and aluminum nitride ceramics has higher heat-resistant cycle reliability compared with a bonding interface of copper and aluminum nitride ceramics, but as the cycle number increases, the aluminum nitride aluminum-coated substrate prepared by adopting a liquid phase bonding method has large uneven size difference of the aluminum crystal grains on the surface, the crystal grains are easy to deform and slip, hillock shapes are generated on the surface of the substrate in a macroscopic manner, and the roughness is increased rapidly, so that the heat-resistant cycle reliability of the aluminum nitride aluminum-coated ceramic substrate is reduced. Under the practical application environment, hillocks and roughness on the surface of the DBA substrate are increased rapidly, the reliability of a welding layer between a chip and the substrate is affected, and a device is disabled in extreme cases, so that development of a method for improving the heat-resistant cycle reliability of the aluminum nitride aluminum-coated ceramic substrate and reducing the risk of the device is needed.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention aims to provide a method for improving the heat cycle reliability of an aluminum nitride aluminum-coated ceramic substrate, and the heat cycle resistance of the aluminum nitride aluminum-coated ceramic substrate is improved by titanium plating and then laser strengthening.
The technical aim of the invention is realized by the following technical scheme: a method for improving the heat cycle reliability of an aluminum nitride coated ceramic substrate comprises the following steps:
1) Surface sputtering titanium plating: taking an aluminum nitride coated aluminum ceramic substrate for surface cleaning, and then plating titanium to obtain the aluminum nitride coated aluminum ceramic substrate with a nano-scale titanium layer, wherein the thickness of the titanium layer is 50-100nm;
2) Laser strengthening: taking the aluminum nitride coated ceramic substrate with the nano-level titanium layer in the step 1 for laser strengthening treatment;
3) Surface treatment: and (3) carrying out surface treatment on the aluminum nitride aluminum-coated ceramic substrate treated in the step (2).
The invention is further provided with: in the step 1, the thickness of the aluminum layer on the surface of the aluminum nitride aluminum-coated ceramic substrate is 0.4-0.6 mm.
The invention is further provided with: in step 1, the surface cleaning step is as follows:
A. preparing 10-20% sodium hydroxide aqueous solution, immersing the aluminum nitride aluminum-coated ceramic substrate into alkaline washing for 3-5 min, taking out and washing with pure water;
B. preparing 10-20% nitric acid aqueous solution, immersing the aluminum nitride coated ceramic substrate in the step A for pickling for 90-100 s, taking out, cleaning with pure water, and drying at 80-120 ℃ for later use.
The invention is further provided with: in the step (1), the titanizing process is a surface sputtering titanizing process, and the working parameters are as follows: the power is 5KW, the Ar flow is 30Sccm, the temperature of a sputtering substrate is 200-300 ℃, the frequency pulse current is sputtered, the current output mode is sine wave output, the sputtering pressure is 0.3Pa, and the sputtering time is 10min.
The invention is further provided with: step 2, the laser strengthening treatment process parameters are as follows: the laser power is 8-12KW, the scanning speed is 20-25 mm/s, and the spot diameter is 0.25-0.5 mm.
The invention is further provided with: in the step 3, the surface treatment process comprises the following steps: the aluminum nitride coated ceramic substrate is subjected to surface grinding, and then to alkali washing treatment and acid washing treatment.
The invention is further provided with: the surface treatment steps are as follows:
s1, mechanically grinding the substrate after the treatment in the step 2 to remove surface impurities;
s2, preparing a 20% sodium hydroxide aqueous solution, taking the aluminum nitride aluminum-coated ceramic substrate in the step S1, immersing the ceramic substrate in alkali washing for 10-15S, taking out the ceramic substrate and washing the ceramic substrate with pure water;
s3, preparing 40-50% nitric acid aqueous solution, immersing the aluminum nitride coated ceramic substrate in the step S2 into the aqueous solution, pickling for 90-100S, taking out the ceramic substrate, and cleaning the ceramic substrate with pure water to obtain the aluminum nitride coated ceramic substrate.
The invention is further provided with: the amount of the mechanical grinding chip is 5-10 mu m.
The invention is further provided with: in the step 2, remelting and solidifying the aluminum on the surface of the aluminum nitride aluminum-coated ceramic substrate after laser strengthening, wherein the remelting and solidifying depth is 80 mu m; and (3) refining surface grains after remelting and solidification, wherein the average grain size is 32 mu m.
In summary, the invention has the following beneficial effects: the invention provides a method for improving the heat-resistant cycle reliability of an aluminum nitride aluminum-coated ceramic substrate, which comprises the steps of sputtering titanium on the surface of the aluminum nitride aluminum-coated ceramic substrate, strengthening by laser, introducing trace titanium elements into the surface layer of aluminum to form a uniform titanium aluminum solid solution hardening layer, and then carrying out surface treatment on the aluminum solid solution hardening layer.
Drawings
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a sample surface grain structure diagram of the first embodiment;
FIG. 3 is a diagram showing the grain structure of the surface of the sample of comparative example one.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and examples.
A method for improving the heat cycle reliability of an aluminum nitride coated ceramic substrate, as shown in the flow chart of figure 1, specifically comprises the following steps:
1) Surface sputtering titanium plating: taking an aluminum nitride coated aluminum ceramic substrate for surface cleaning, and then plating titanium to obtain the aluminum nitride coated aluminum ceramic substrate with a nano-scale titanium layer, wherein the thickness of the titanium layer is 50-100nm;
2) Laser strengthening: taking the aluminum nitride coated ceramic substrate with the nano-level titanium layer in the step 1 for laser strengthening treatment;
3) Surface treatment: and (3) carrying out surface treatment on the aluminum nitride aluminum-coated ceramic substrate treated in the step (2).
Wherein, in the step 1, the thickness of the aluminum layer on the surface of the aluminum nitride aluminum-coated ceramic substrate is 0.4-0.6 mm.
The titanizing process is a surface sputtering titanizing process, and the working parameters are as follows: the power is 5KW, the Ar flow is 30Sccm, the temperature of a sputtering substrate is 200-300 ℃, the frequency pulse current is sputtered, the current output mode is sine wave output, and the sputtering pressure is 0.3Pa for 10min;
in step 1, the surface cleaning step is as follows:
A. preparing 10-20% sodium hydroxide aqueous solution, immersing the aluminum nitride aluminum-coated ceramic substrate into alkaline washing for 3-5 min, taking out and washing with pure water;
B. preparing 10-20% nitric acid aqueous solution, immersing the aluminum nitride coated ceramic substrate in the step A into the aqueous solution for pickling for 90-100 s, taking out the ceramic substrate, cleaning the ceramic substrate with pure water, and drying the ceramic substrate at 80-120 ℃ for later use;
in the step 2, the laser strengthening treatment process parameters are as follows: the laser power is 8-12KW, the scanning speed is 20-25 mm/s, and the spot diameter is 0.25-0.5 mm;
in the step 2, the aluminum on the surface of the aluminum nitride aluminum-coated ceramic substrate after laser strengthening is remelted and solidified to the depth of the influencing layer of 50-100 mu m; and (3) refining surface grains after remelting and solidification, wherein the average grain size is 20-50 mu m.
In the step 3, the surface treatment process comprises the following steps: grinding the surface of the aluminum nitride coated ceramic substrate, and then performing alkali washing treatment and acid washing treatment;
the specific processing steps are as follows:
s1, mechanically grinding the substrate after the treatment in the step 2 to remove surface impurities, wherein the amount of mechanically ground chips is 5-10 mu m;
s2, preparing a 20% sodium hydroxide aqueous solution, taking the aluminum nitride aluminum-coated ceramic substrate in the step S1, immersing the ceramic substrate in alkali washing for 10-15S, taking out the ceramic substrate and washing the ceramic substrate with pure water;
s3, preparing 40-50% nitric acid aqueous solution, immersing the aluminum nitride coated ceramic substrate in the step S2 into the aqueous solution, pickling for 90-100S, taking out the ceramic substrate, and cleaning the ceramic substrate with pure water to obtain the aluminum nitride coated ceramic substrate.
In the step 3, after the surface treatment is finished, an aluminum nitride aluminum-coated ceramic substrate with a surface fine crystal strengthening layer is obtained;
compared with the prior art, the method for improving the heat-resistant cycle reliability of the aluminum nitride coated ceramic substrate comprises the steps of firstly, carrying out surface sputtering titanium plating treatment and laser strengthening treatment on the surface of the aluminum nitride coated ceramic substrate, introducing a fine crystal strengthening layer on the surface layer of the aluminum nitride coated ceramic substrate, controlling the laser strengthening power and the depth of a strengthening fine crystal area, finally enabling the surface layer of the aluminum nitride coated ceramic substrate to be a fine crystal strengthening area, enabling the inner layer to be a coarse crystal area, inhibiting the sliding and deformation of surface aluminum grains in the fine crystal area, macroscopically representing surface strengthening, eliminating hillock-shaped protrusions under a cold and hot cycle working environment, inhibiting the roughness from increasing sharply, and obviously improving the welding reliability between a chip and the aluminum nitride coated ceramic substrate.
Embodiment one:
(1) Surface sputtering titanium plating: taking an aluminum nitride aluminum-coated ceramic substrate for surface cleaning, and then plating titanium to obtain the aluminum nitride aluminum-coated ceramic substrate with a nano-scale titanium layer, wherein the thickness of the titanium-plated layer is 100nm;
(2) Laser strengthening: taking the aluminum nitride coated ceramic substrate with the nano-level titanium layer in the step (1) for laser strengthening treatment;
(3) Surface treatment: and (3) carrying out surface treatment on the aluminum nitride aluminum-coated ceramic substrate treated in the step (2).
Wherein, the thickness of the aluminum layer on the surface of the aluminum nitride aluminum-coated ceramic substrate is 0.4mm.
The titanizing process is a surface sputtering titanizing process, and the working parameters are as follows: the power is 5KW, the Ar flow is 30Sccm, the temperature of a sputtering substrate is 200-300 ℃, the frequency pulse current is sputtered, the current output mode is sine wave output, and the sputtering pressure is 0.3Pa for 10min;
the surface cleaning steps are as follows:
A. preparing 10-20% sodium hydroxide aqueous solution, immersing the aluminum nitride aluminum-coated ceramic substrate into alkaline washing for 3min, taking out and washing with pure water;
B. preparing a 20% nitric acid aqueous solution, immersing the aluminum nitride coated ceramic substrate in the step A into the solution for pickling for 90s, taking out the substrate, cleaning the substrate with pure water, and drying the substrate with hot air at 80 ℃ for later use;
in the step (2), the laser strengthening treatment process parameters are as follows: laser power 8KW, scanning speed 25mm/s, and spot diameter 0.25mm;
remelting and solidifying the aluminum on the surface of the aluminum nitride aluminum-coated ceramic substrate after laser strengthening to ensure that the depth of the influence layer is 80 mu m; and (3) refining surface grains after remelting and solidification, wherein the average grain size is 32 mu m.
The surface treatment process comprises the following steps: grinding the surface of the aluminum nitride coated ceramic substrate, and then performing alkali washing treatment and acid washing treatment;
the specific processing steps are as follows:
A. mechanically grinding the substrate after the treatment in the step (2) to remove surface impurities, wherein the amount of mechanically ground chips is 5 mu m;
B. preparing a 20% sodium hydroxide aqueous solution, immersing the aluminum nitride coated ceramic substrate in the step A into alkali washing for 10s, taking out and washing with pure water.
C. Preparing 40% nitric acid aqueous solution, immersing the aluminum nitride coated ceramic substrate in the step B into acid washing for 90s, taking out and washing with pure water to obtain the aluminum nitride coated ceramic substrate.
And after the surface treatment is finished, obtaining the aluminum nitride aluminum-coated ceramic substrate with the surface fine crystal strengthening layer.
Embodiment two:
(1) Surface sputtering titanium plating: taking an aluminum nitride aluminum-coated ceramic substrate for surface cleaning, and then plating titanium to obtain the aluminum nitride aluminum-coated ceramic substrate with a nano-scale titanium layer, wherein the thickness of the titanium-plated layer is 80nm;
(2) Laser strengthening: taking the aluminum nitride coated ceramic substrate with the nano-level titanium layer in the step (1) for laser strengthening treatment;
(3) Surface treatment: and (3) carrying out surface treatment on the aluminum nitride aluminum-coated ceramic substrate treated in the step (2).
In the step (1), the thickness of the aluminum layer on the surface of the aluminum nitride aluminum-coated ceramic substrate is 0.4mm.
The titanizing process is a surface sputtering titanizing process, and the working parameters are as follows: the power is 5KW, the Ar flow is 30Sccm, the temperature of a sputtering substrate is 200-300 ℃, the frequency pulse current is sputtered, the current output mode is sine wave output, and the sputtering pressure is 0.3Pa for 10min;
the surface cleaning steps are as follows:
A. preparing 10-20% sodium hydroxide aqueous solution, immersing the aluminum nitride aluminum-coated ceramic substrate into alkaline washing for 3min, taking out and washing with pure water;
B. preparing a 20% nitric acid aqueous solution, immersing the aluminum nitride coated ceramic substrate in the step A into the solution for pickling for 90s, taking out the substrate, cleaning the substrate with pure water, and drying the substrate with hot air at 80 ℃ for later use;
in the step (2), the laser strengthening treatment process parameters are as follows: laser power 8KW, scanning speed 25mm/s, and spot diameter 0.25mm;
remelting and solidifying the aluminum on the surface of the aluminum nitride aluminum-coated ceramic substrate after laser strengthening to ensure that the depth of the influence layer is 80 mu m; and (3) refining surface grains after remelting and solidification, wherein the average grain size is 40 mu m.
The surface treatment process comprises the following steps: grinding the surface of the aluminum nitride coated ceramic substrate, and then performing alkali washing treatment and acid washing treatment;
the method comprises the following specific steps:
A. mechanically grinding the substrate after the treatment in the step (2) to remove surface impurities, wherein the amount of mechanically ground chips is 5 mu m;
B. preparing a 20% sodium hydroxide aqueous solution, immersing the aluminum nitride coated ceramic substrate in the step A into alkali washing for 10s, taking out and washing with pure water;
C. preparing 40% nitric acid aqueous solution, immersing the aluminum nitride coated ceramic substrate in the step B into acid washing for 90s, taking out and washing with pure water to obtain the aluminum nitride coated ceramic substrate.
And after the surface treatment is finished, obtaining the aluminum nitride aluminum-coated ceramic substrate with the surface fine crystal strengthening layer.
Comparative example one:
the first comparative example is a non-fine grain reinforced aluminum nitride aluminum coated ceramic substrate, and the thickness of the aluminum layer is 0.4mm.
The substrates of the first embodiment, the second embodiment and the first comparative embodiment are respectively subjected to a grain size and a thermal cycle test at-55/150 ℃ for 200 times, and the surface roughness test is carried out on the substrates, wherein the thermal cycle test conditions are as follows: in a temperature cycle test box (brand: aispeck; model: TSE-122-A), placing a sample at-55deg.C for 30min, placing at 150deg.C for 30min for 1 cycle, and performing repeated thermal cycle test, wherein the intermediate temperature conversion time is less than 60S, and the temperature deviation range is + -2deg.C; the roughness test method comprises the following steps: placing the sample on a marble horizontal table, detecting the surface roughness value by using a contact pin type roughness tester (manufacturer: tokyo precision instrument factory; model specification: mahr M310), taking the Ra value, and detecting the result as follows;
and fig. 2 is a sample surface grain structure diagram of the first embodiment, and fig. 3 is a sample surface grain structure diagram of the first comparative embodiment, which can be obviously compared, the sample prepared by the method has the advantages of significantly reduced surface grains, small roughness change after thermal cycle test, and significantly improved surface reliability.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention. It should be noted that modifications and adaptations to the present invention may occur to one skilled in the art without departing from the principles of the present invention and are intended to be within the scope of the present invention.
Claims (6)
1. A method for improving the heat cycle reliability of an aluminum nitride coated ceramic substrate, comprising the steps of:
1) Surface sputtering titanium plating: taking an aluminum nitride coated aluminum ceramic substrate for surface cleaning, and then plating titanium to obtain the aluminum nitride coated aluminum ceramic substrate with a nano-scale titanium layer, wherein the thickness of the titanium layer is 50-100nm;
2) Laser strengthening: carrying out laser strengthening treatment on the aluminum nitride coated ceramic substrate with the nano-level titanium layer in the step 1, and carrying out aluminum remelting solidification on the surface of the aluminum nitride coated ceramic substrate after laser strengthening, wherein the remelting solidification depth is 80 mu m; refining surface grains after remelting and solidification, wherein the average grain size is 32 mu m;
3) Surface treatment: carrying out surface treatment on the aluminum nitride aluminum-coated ceramic substrate treated in the step 2;
in the step 1), the titanizing process is a surface sputtering titanizing process, and the working parameters are as follows: the power is 5KW, the Ar flow is 30Sccm, the temperature of a sputtering substrate is 200-300 ℃, the frequency pulse current is sputtered, the current output mode is sine wave output, the sputtering pressure is 0.3Pa, and the sputtering time is 10min;
in the step 2), the laser strengthening treatment process parameters are as follows: the laser power is 8-12KW, the scanning speed is 20-25 mm/s, and the spot diameter is 0.25-0.5 mm.
2. The method for improving the heat cycle reliability of the aluminum nitride coated ceramic substrate according to claim 1, wherein the method comprises the following steps: in the step 1, the thickness of the aluminum layer on the surface of the aluminum nitride aluminum-coated ceramic substrate is 0.4-0.6 mm.
3. The method for improving the heat cycle reliability of the aluminum nitride coated ceramic substrate according to claim 1, wherein the method comprises the following steps: in step 1, the surface cleaning step is as follows:
A. preparing 10-20% sodium hydroxide aqueous solution, immersing the aluminum nitride aluminum-coated ceramic substrate into alkaline washing for 3-5 min, taking out and washing with pure water;
B. preparing 10-20% nitric acid aqueous solution, immersing the aluminum nitride coated ceramic substrate in the step A for pickling for 90-100 s, taking out, cleaning with pure water, and drying at 80-120 ℃ for later use.
4. The method for improving the heat cycle reliability of the aluminum nitride coated ceramic substrate according to claim 1, wherein the method comprises the following steps: in the step 3, the surface treatment process comprises the following steps: the aluminum nitride coated ceramic substrate is subjected to surface grinding, and then to alkali washing treatment and acid washing treatment.
5. The method for improving the heat cycle reliability of an aluminum nitride coated ceramic substrate according to claim 4, wherein the surface treatment step comprises:
s1, mechanically grinding the substrate after the treatment in the step 2 to remove surface impurities;
s2, preparing a 20% sodium hydroxide aqueous solution, taking the aluminum nitride aluminum-coated ceramic substrate in the step S1, immersing the ceramic substrate in alkali washing for 10-15S, taking out the ceramic substrate and washing the ceramic substrate with pure water;
s3, preparing 40-50% nitric acid aqueous solution, immersing the aluminum nitride coated ceramic substrate in the step S2 into the aqueous solution, pickling for 90-100S, taking out the ceramic substrate, and cleaning the ceramic substrate with pure water to obtain the aluminum nitride coated ceramic substrate.
6. The method for improving the heat cycle reliability of the aluminum nitride coated ceramic substrate according to claim 5, wherein the method comprises the following steps: the amount of the mechanical grinding chip is 5-10 mu m.
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