CN115579184A - Superconducting conductor - Google Patents
Superconducting conductor Download PDFInfo
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- CN115579184A CN115579184A CN202211417469.6A CN202211417469A CN115579184A CN 115579184 A CN115579184 A CN 115579184A CN 202211417469 A CN202211417469 A CN 202211417469A CN 115579184 A CN115579184 A CN 115579184A
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- metal sleeve
- temperature superconducting
- framework
- superconducting
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- 239000004020 conductor Substances 0.000 title claims abstract description 141
- 239000002184 metal Substances 0.000 claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 claims abstract description 56
- 238000001816 cooling Methods 0.000 claims abstract description 31
- 238000009434 installation Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000003466 welding Methods 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims description 37
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 239000010935 stainless steel Substances 0.000 claims description 9
- 229910001220 stainless steel Inorganic materials 0.000 claims description 9
- 238000005253 cladding Methods 0.000 claims description 8
- 238000001192 hot extrusion Methods 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims 1
- 238000001125 extrusion Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000004927 fusion Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
- H01B12/06—Films or wires on bases or cores
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/16—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by cooling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/10—Nuclear fusion reactors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
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- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
An embodiment of the present invention provides a superconducting conductor, including: the metal sleeve and the conductor framework are of a hollow cylindrical structure; the conductor framework is arranged in the metal sleeve; the conductor skeleton is equipped with: the cooling channel transversely penetrates through the conductor framework, and the central axis of the cooling channel is superposed with the central axis of the conductor framework; each installation groove transversely penetrates through the conductor framework, all the installation grooves are arranged around the cooling channel and are parallel to the cooling channel, and each installation groove and the metal sleeve form an installation space for placing a high-temperature superconducting wire; and the high-temperature superconducting wire is placed in the installation space, and a gap between the high-temperature superconducting wire and the metal sleeve in each installation space is filled with the first low-melting-point welding material. The embodiment of the invention improves the mechanical strength and the current carrying capacity of the superconducting conductor.
Description
Technical Field
The present invention relates to a superconducting conductor.
Background
The large-scale high-intensity magnetic field magnet has extremely high scientific research and application values, for example, the fusion reactor magnet is one of key components for realizing magnetic confinement nuclear fusion, and the particle accelerator magnet is a core component for realizing collision and detection of high-energy particles. The critical magnetic field of the low-temperature superconducting material is low, and the practical value is generally considered to be lost after the critical magnetic field exceeds 15T. The second generation high temperature superconducting material has extremely high critical magnetic field and critical current density, and provides a better choice for building large-scale high-intensity magnetic field magnets.
Higher magnetic field and current density mean higher electromagnetic force, while the second-generation high-temperature superconducting tape has a multilayer composite structure, has stronger tensile and compressive capacities, and is difficult to bear shearing and tearing stress. When the high-temperature superconducting strip is subjected to improper shearing and tearing stress to cause the fragmentation or peeling of the superconducting layer, the high-temperature superconducting conductor loses superconductivity.
In addition, the critical current of the second generation high temperature superconducting tape has remarkable anisotropy, and the anisotropy increases with the decrease of temperature and the increase of magnetic field. Although various techniques for enhancing the flux pinning have been developed, the anisotropy of the critical current is reduced to a limited extent, for example, the critical current of a typical parallel field and a perpendicular field is still different by more than 3 times under 20T and 20K conditions. Therefore, if the high current carrying capacity of the high-temperature superconducting tape under the parallel field can be fully utilized, the economic performance of the high-temperature superconducting magnet can be greatly improved, and the application of the high-temperature superconducting material is promoted.
Disclosure of Invention
The embodiment of the invention provides a superconducting conductor, which aims to improve the mechanical strength and the current carrying capacity of the superconducting conductor, and improve the current carrying capacity of the superconducting conductor while enhancing the mechanical strength of the superconducting conductor.
The embodiment of the invention is realized by the following technical scheme:
a superconducting conductor comprising: the metal sleeve and the conductor framework are of a hollow cylindrical structure; the conductor framework is arranged in the metal sleeve;
the conductor skeleton is equipped with:
the cooling channel transversely penetrates through the conductor framework, and the central axis of the cooling channel is superposed with the central axis of the conductor framework;
each installation groove transversely penetrates through the conductor framework, all the installation grooves are arranged around the cooling channel and are parallel to the cooling channel, and each installation groove and the metal sleeve form an installation space for placing a high-temperature superconducting wire; and
the high-temperature superconducting wire is placed in the installation space, and a gap between the high-temperature superconducting wire and the metal sleeve in each installation space is filled with the first low-melting-point welding material.
Furthermore, the metal sleeve is made of stainless steel, and the conductor framework is made of high-purity copper.
Further, the mounting groove is a U-shaped groove; the opening of the U-shaped groove faces to the inner wall of the metal sleeve, and all the U-shaped grooves are parallel to the central axis of the conductor framework and are arranged along the surface of the conductor framework.
Further, the mounting groove is a U-shaped spiral mounting groove; the opening of U-shaped spiral mounting groove is towards metal casing's inner wall, and all U-shaped spiral mounting grooves use the axis of conductor skeleton to be the central line and are the heliciform and set up in conductor skeleton's surface.
Furthermore, the intercept of the U-shaped spiral mounting groove is 20R-50R, the bottom of the U-shaped spiral mounting groove is semicircular, the diameter is 1.0R-1.02R, the slotting depth is 2.0R-2.04R, and R is the radius of the conductor skeleton; r is the radius of the high temperature superconducting wire.
Further, the high-temperature superconducting wire includes:
a stacked tape including a plurality of high-temperature superconducting thin tapes stacked; and
and the copper cladding is used for packaging the stacked strips, and the gap between the copper cladding and the stacked strips is filled with second low-melting-point solder.
Further, the belt face direction of the stacked belt may be twisted with respect to the external magnetic field direction so that the belt face direction of the stacked belt is parallel to the external magnetic field direction.
Further, the first low melting point solder and the second low melting point solder are solders with melting points not higher than 250 ℃.
Furthermore, the conductor framework is formed by hot extrusion.
Furthermore, the metal sleeve is tightly attached to the conductor framework and the high-temperature superconducting wire through low-temperature hot extrusion.
Compared with the prior art, the embodiment of the invention has the following advantages and beneficial effects:
according to the superconducting conductor provided by the embodiment of the invention, through the metal sleeve, the conductor framework, the cooling channel, the mounting groove and the high-temperature superconducting wire, stress and deformation in the extrusion process can not be directly transmitted to the stacking belt when the metal sleeve is extruded at low temperature, so that the superconductivity of the high-temperature superconducting wire is effectively protected, and the metal sleeve, the conductor framework and the high-temperature superconducting wire are welded into a whole through the first low-melting-point solder in the mounting space after the metal sleeve is extruded and cooled, so that the mechanical property and the thermal stability of the whole superconducting conductor are enhanced, the transverse electromagnetic stress pointing to the metal sleeve is enhanced, and the mechanical strength and the current carrying capacity of the superconducting conductor are improved.
The belt surface direction of the superconducting stacked belt is randomly adjusted by twisting the high-temperature superconducting wire, so that the belt surface direction is parallel to the direction of an external magnetic field, and the current carrying capacity of the superconducting conductor is greatly improved; the high-temperature superconducting wire is spirally wound, and brazing filler metal with higher resistivity is selected as a filling material of the U-shaped groove, so that the coupling loss of the superconducting conductor under the alternating-current working condition is reduced, the hysteresis loss of the high-temperature superconducting strip is reduced under the combined action of the superconducting strip surface and the external magnetic field, and the total alternating-current loss of the superconducting conductor is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic cross-sectional view of a superconducting conductor.
Fig. 2 is a schematic view of a structure of a superconducting conductor.
Fig. 3 is a schematic view of the structure of the high-temperature superconducting wire.
Fig. 4 is a schematic view of another superconducting conductor.
Fig. 5 is a schematic view of a structure of a conductor skeleton in the superconducting conductor of fig. 4.
Reference numbers and corresponding part names in the figures:
1-metal sleeve, 2-conductor framework, 3-high-temperature superconducting wire, 4-cooling channel, 5-mounting groove, 6-first low-melting-point solder, 7-copper cladding, 8-stacking strip, 9-second low-melting-point solder and 10-strip surface direction.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one of ordinary skill in the art that: it is not necessary to employ these specific details to practice the present invention. In other instances, well-known structures, circuits, materials, or methods have not been described in detail so as not to obscure the present invention.
Throughout the specification, reference to "one embodiment," "an embodiment," "one example," or "an example" means: the particular features, structures, or characteristics described in connection with the embodiment or example are included in at least one embodiment of the invention. Thus, the appearances of the phrase "one embodiment," "an embodiment," "one example" or "an example" in various places throughout this specification are not necessarily all referring to the same embodiment or example. Furthermore, the particular features, structures, or characteristics may be combined in any suitable combination and/or sub-combination in one or more embodiments or examples. Further, those of ordinary skill in the art will appreciate that the illustrations provided herein are for illustrative purposes and are not necessarily drawn to scale. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the description of the present invention, the terms "front", "rear", "left", "right", "upper", "lower", "vertical", "horizontal", "upper", "lower", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, merely for convenience of description and simplification of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore, should not be construed as limiting the scope of the invention.
In order to improve the mechanical strength and current carrying capability of a superconducting conductor, and to enhance the mechanical strength and current carrying capability of the superconducting conductor, an embodiment of the present invention provides a superconducting conductor, as shown in fig. 1 to 5, including:
a metal sleeve 1 and a conductor framework 2 with a hollow cylindrical structure; the conductor framework is arranged in the metal sleeve; the conductor skeleton is equipped with: the cooling channel transversely penetrates through the conductor framework, and the central axis of the cooling channel 4 is superposed with the central axis of the conductor framework;
at least one mounting groove 5, wherein each mounting groove transversely penetrates through the conductor framework, all the mounting grooves are arranged around the cooling channel and are parallel to the cooling channel, and each mounting groove and the metal sleeve form a mounting space for placing a high-temperature superconducting wire; and
and the high-temperature superconducting wires 3 are placed in the installation spaces, and gaps between the high-temperature superconducting wires and the metal sleeves in each installation space are filled with the first low-melting-point solder 6.
The low-melting-point solder in the embodiment of the invention refers to a solder with a melting point lower than 250 ℃.
Referring to fig. 1, the high-strength large-current-carrying high-temperature superconducting conductor based on round strands is suitable for large magnets requiring strong magnetic field and high mechanical strength, such as fusion reactor magnets, accelerator magnets and the like, and comprises: a metal sleeve 1 and a conductor skeleton 2; the conductor framework is arranged in the metal sleeve; the center of the conductor framework transversely penetrates through the conductor framework and is provided with a cooling channel, one or more mounting grooves are arranged on the periphery of the surface of the conductor framework of the cooling channel and in parallel with the central axis of the cooling channel, each mounting groove and the inner wall of the metal sleeve form a mounting space for placing a high-temperature superconducting wire, and a gap between the high-temperature superconducting wire and the inner wall of the metal sleeve in each mounting space is filled with a first low-melting-point welding material.
Specifically, referring to fig. 1, the outermost layer of the superconducting conductor is a metal sleeve 1, and the inside of the metal sleeve 1 is a conductor skeleton 2 and a high-temperature superconducting wire 3; the center of the conductor framework is provided with a cooling channel 4, the outer side of the conductor framework is symmetrically provided with mounting grooves 5, and high-temperature superconducting wires are embedded in the mounting grooves 5; gaps between the conductor skeleton 2 and the high-temperature superconducting wire 3 and between the stainless steel metal sleeve 1 are filled with first low-melting-point solder 6.
Therefore, according to the embodiment of the invention, through the metal sleeve, the conductor framework, the cooling channel, the mounting groove and the high-temperature superconducting wire which are arranged in the conductor framework, the stress and the deformation in the extrusion process can not be directly transferred to the stacking belt when the metal sleeve is extruded at low temperature, so that the superconductivity of the high-temperature superconducting wire is effectively protected, and the metal sleeve, the conductor framework and the high-temperature superconducting wire are welded into a whole through the first low-melting-point solder in the mounting space after extrusion and cooling, so that the mechanical performance and the thermal stability of the whole superconducting conductor are enhanced, the transverse electromagnetic stress pointing to the metal sleeve is enhanced, and the mechanical strength and the current carrying capacity of the superconducting conductor are improved.
Furthermore, the metal sleeve is made of stainless steel. Furthermore, the metal sleeve is tightly attached to the conductor framework and the high-temperature superconducting wire through low-temperature hot extrusion.
The metal sleeve 1 is made of stainless steel, provides the main strength of the high-temperature superconducting conductor, and is used for resisting electromagnetic force under a strong magnetic field and a large current. The metal sleeve 1 is closely attached to the conductor framework 2 and the high-temperature superconducting wire 3 through low-temperature hot extrusion.
Furthermore, the conductor framework is made of high-purity copper materials. Furthermore, the conductor framework is formed by hot extrusion.
The conductor framework 2 is made of high-purity copper and is formed by hot extrusion, mounting grooves 5 are symmetrically formed in the outer side of the conductor framework 2 and used for supporting the high-temperature superconducting wire to enable the high-temperature superconducting wire to be stressed uniformly, and deformation of a copper cladding under transverse stress is reduced, so that superconductivity loss of the high-temperature superconducting strip under stress is reduced; the high-purity copper has extremely low resistivity and extremely high thermal conductivity at low temperature, and the high-temperature superconducting wire can rapidly lead out current and heat when losing time, so that the thermal stability of the high-temperature superconducting conductor is improved; the center of the conductor framework 2 is provided with a cooling channel 4, and liquid nitrogen, cold helium gas or liquid helium is introduced to cool the high-temperature superconducting conductor.
In some embodiments, the structure of the mounting slot is shown with reference to fig. 2, the mounting slot being a U-shaped slot; the opening of the U-shaped groove faces to the inner wall of the metal sleeve, and all the U-shaped grooves are parallel to the central axis of the conductor framework and are arranged along the surface of the conductor framework.
Referring to fig. 2, the conductor skeleton is a cylindrical structure; the axis of conductor skeleton coincides with cooling channel's axis, and the outer surface of conductor skeleton around cooling channel is excavated along the axis parallel with conductor skeleton's axis has a plurality of U-shaped grooves parallel with cooling channel, and the opening of mounting groove is towards metal sleeve's inner wall, optionally, the U-shaped groove is 6, and every U-shaped groove evenly distributed is in conductor skeleton's circumference.
In other embodiments, the structure of the mounting groove is shown with reference to fig. 4 and 5, the mounting groove is a U-shaped spiral mounting groove; the opening of U-shaped spiral mounting groove is towards metal sleeve's inner wall, and all U-shaped spiral mounting grooves use conductor skeleton's axis to be the heliciform as the central line and set up in conductor skeleton's surface. Optionally, the number of the U-shaped spiral mounting grooves is 6, and each U-shaped spiral mounting groove is uniformly distributed in the circumferential direction of the conductor framework.
Referring to fig. 4, the conductor skeleton is a cylindrical structure; the axis of the conductor framework coincides with the axis of the cooling channel, the axis of the conductor framework serves as a central line, a plurality of U-shaped spiral mounting grooves are spirally arranged on the outer surface of the conductor framework on the periphery of the cooling channel, and the openings of the mounting grooves face to the inner wall of the metal sleeve.
Optionally, the intercept of the U-shaped spiral mounting groove is 20R to 50r, the bottom of the U-shaped spiral mounting groove is semicircular, the diameter is 1.0R to 1.02R, and the slotting depth is 2.0R to 2.04R, wherein R is the radius of the conductor skeleton; r is the radius of the high temperature superconducting wire.
Further, the high-temperature superconducting wire includes:
a stacked tape 8 including a plurality of high-temperature superconducting thin tapes stacked; and
and a copper clad 7 for encapsulating the stacked tape, and a gap between the copper clad and the stacked tape is filled with a second low melting point solder 9.
The copper cladding 7 and the second low-melting-point welding material 9 can effectively protect the internal high-temperature superconducting conductor when the high-temperature superconducting wire 3 is stranded on the conductor framework, so that the high-temperature superconducting conductor is stressed uniformly and the superconductivity loss of the high-temperature superconducting conductor caused by stress concentration is avoided. The copper cladding 7 and the second low-melting-point solder 9 have excellent thermal conductivity and electric conductivity at low temperature, and can ensure that the high-temperature superconducting wire 3 has better thermal stability.
Specifically, the high-temperature superconducting wire is formed by packaging a copper-clad shell 7, a stacking belt 8 formed by orderly stacking a plurality of high-temperature superconducting thin belts is contained in the high-temperature superconducting wire, and a second low-melting-point solder 9 is filled in a gap between the stacking belt 8 and the copper-clad shell 7; furthermore, the superconducting conductor in the embodiment of the present invention may be a high-strength high-temperature superconducting conductor with controllable strip surface direction, where the controllable strip surface direction means that the strip surface direction 10 of each high-temperature superconducting stacked strip may form any specified included angle with the opening direction of the U-shaped groove as required.
Further, the band-face direction 10 of the stacked band may be twisted with respect to the external magnetic field direction so that the band-face direction of the stacked band is parallel to the external magnetic field direction. Further, the high-temperature superconducting wire has a cylindrical structure.
The tape plane direction refers to a direction parallel to the surface of the high-temperature superconducting thin tape.
The high-temperature superconducting wire 3 is of a cylindrical structure, so that when the high-temperature superconducting wire 3 is twisted in a U-shaped groove, the tape surface direction of the high-temperature superconducting wire 3 can be controlled at will, particularly, the arrangement of the tape surface direction 10 of the high-temperature superconducting wire is designed and realized according to the distribution of a magnetic field where a superconducting conductor is located, so that the tape surface direction 10 is parallel to the magnetic field as much as possible, and the large current carrying advantage of the high-temperature superconducting tape under a parallel field can be fully utilized (the critical current of the high-temperature superconducting tape under the parallel field under low temperature is 3-8 times that under a vertical field).
Further, the first low melting point solder and the second low melting point solder are solders with melting points not higher than 250 ℃.
Low temperature in the embodiments of the present invention refers to a temperature lower than 250 deg.c, and high temperature refers to a temperature higher than 250 deg.c.
The first low melting point solder 6 and the second low melting point solder 9 are low temperature solders having melting points not higher than 250 ℃, and are made of alloys containing lead, tin, bismuth, and the like. Optionally, the first low-melting-point solder 6 and the second low-melting-point solder 9 adopt lead-tin solder with lower resistivity, which is beneficial to improving the thermal stability of the superconducting conductor; the first low-melting-point solder 6 and the second low-melting-point solder 9 adopt bismuth-containing solder with higher resistivity, which is beneficial to reducing the coupling loss of the superconducting conductor under the alternating-current working condition. When the metal sleeve 1 is subjected to low-temperature hot extrusion, the first low-melting-point solder 6 and the second low-melting-point solder 9 are in a molten state, so that stress and deformation in the extrusion process cannot be directly transmitted to the high-temperature superconducting stacking belt 8, and the superconductivity of the superconducting conductor is effectively protected. After extrusion cooling, the solder 6 is filled in the gaps among the metal sleeve 1, the conductor framework 2 and the high-temperature superconducting wire 3 and is welded into a whole, so that the mechanical property and the thermal stability of the superconducting conductor are further enhanced, and particularly, the high-temperature superconducting wire is enhanced to resist the transverse electromagnetic stress pointing to the stainless steel metal sleeve 1.
The combination of the high-temperature superconducting wire and the conductor framework with the U-shaped groove enables the control of the band surface direction of the high-temperature superconducting strip in the large conductor to be a feasible measure, and the large current-carrying advantages of the high-temperature superconducting strip in a parallel field can be effectively utilized by reasonably controlling the band surface direction of the high-temperature superconducting strip in the conductor, so that the quantity of the high-temperature superconducting strips with the same current-carrying capacity can be obviously reduced, and the material cost is obviously reduced.
The combination of the high-temperature superconducting wire and the conductor framework with the U-shaped groove reduces stress concentration of an indirect contact of the stranded wire when the high-temperature superconducting wire is directly stranded, effectively improves the capability of the high-temperature superconducting conductor for resisting transverse extrusion, increases the framework, improves the copper-to-superconducting ratio of the high-temperature superconducting conductor, and is beneficial to improving the thermal stability of the high-temperature superconducting conductor.
The use of the low-temperature solder makes the processing of the stainless steel metal sleeve easier and more reasonable, and the extrusion of the stainless steel metal sleeve in the melting process of the low-temperature solder prevents the superconducting conductor from losing superconductivity due to excessive stress and strain. The low-temperature solder can be more fully filled in the gaps among the stainless steel metal sleeve, the framework and the high-temperature superconducting wire by fully extruding, so that the thermal stability of the high-temperature superconducting conductor can be improved, and the fatigue resistance of the high-temperature superconducting conductor can also be improved.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A superconducting conductor, comprising: the metal sleeve and the conductor framework are of a hollow cylindrical structure; the conductor framework is arranged in the metal sleeve;
the conductor skeleton is equipped with:
the cooling channel transversely penetrates through the conductor framework, and the central axis of the cooling channel is superposed with the central axis of the conductor framework;
each installation groove transversely penetrates through the conductor framework, all the installation grooves are arranged around the cooling channel and are parallel to the cooling channel, and each installation groove and the metal sleeve form an installation space for placing a high-temperature superconducting wire; and
the high-temperature superconducting wire is placed in the installation space, and a gap between the high-temperature superconducting wire and the metal sleeve in each installation space is filled with the first low-melting-point welding material.
2. The superconducting conductor of claim 1, wherein the metal sleeve is made of stainless steel and the conductor skeleton is made of high-purity copper.
3. The superconducting conductor of claim 2, wherein the mounting groove is a U-shaped groove; the opening of the U-shaped groove faces to the inner wall of the metal sleeve, and all the U-shaped grooves are parallel to the central axis of the conductor framework and are arranged along the surface of the conductor framework.
4. The superconducting conductor as claimed in claim 1 or 2, wherein the mounting groove is a U-shaped spiral mounting groove; the opening of U-shaped spiral mounting groove is towards metal casing's inner wall, and all U-shaped spiral mounting grooves use the axis of conductor skeleton to be the central line and are the heliciform and set up in conductor skeleton's surface.
5. The superconducting conductor of claim 4, wherein the U-shaped spiral mounting groove has an intercept of 20R-50R, a bottom of the U-shaped spiral mounting groove is semicircular, has a diameter of 1.0R-1.02R, and has a groove depth of 2.0R-2.04R, wherein R is a radius of the conductor skeleton; r is the radius of the high temperature superconducting wire.
6. The superconducting conductor according to claim 3 or 5, wherein the high-temperature superconducting wire comprises:
a stacked tape including a plurality of high-temperature superconducting thin tapes stacked; and
and the copper cladding is used for packaging the stacked strips, and the gap between the copper cladding and the stacked strips is filled with second low-melting-point solder.
7. The superconducting conductor of claim 6, wherein the tape-plane direction of the stacked tape is twisted with respect to the direction of the external magnetic field so that the tape-plane direction of the stacked tape is parallel to the direction of the external magnetic field.
8. The superconducting conductor according to claim 7, wherein the first low melting point solder and the second low melting point solder are solders having melting points of not higher than 250 ℃.
9. The superconducting conductor of claim 8 wherein the conductor former is formed by hot extrusion.
10. The superconducting conductor of claim 8, wherein the metal sleeve is pressed against the conductor former and the high-temperature superconducting wire by low-temperature thermal pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211417469.6A CN115579184A (en) | 2022-11-14 | 2022-11-14 | Superconducting conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211417469.6A CN115579184A (en) | 2022-11-14 | 2022-11-14 | Superconducting conductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115579184A true CN115579184A (en) | 2023-01-06 |
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| CN202211417469.6A Pending CN115579184A (en) | 2022-11-14 | 2022-11-14 | Superconducting conductor |
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| CN115985575A (en) * | 2023-03-16 | 2023-04-18 | 江西联创光电超导应用有限公司 | Composite conductor packaging method and system |
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| CN113363010A (en) * | 2020-10-26 | 2021-09-07 | 核工业西南物理研究院 | Stepped high-temperature superconducting CICC conductor with high current carrying capacity |
| CN113436803A (en) * | 2021-07-08 | 2021-09-24 | 广东电网有限责任公司 | Superconducting cable twisting structure |
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| CN115985575A (en) * | 2023-03-16 | 2023-04-18 | 江西联创光电超导应用有限公司 | Composite conductor packaging method and system |
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