CN115577475A - Method and system for obtaining initial value of thermal simulation parameter of radiator - Google Patents
Method and system for obtaining initial value of thermal simulation parameter of radiator Download PDFInfo
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Abstract
The invention relates to the technical field of heat simulation of radiators, in particular to a method and a system for acquiring an initial value of a heat simulation parameter of a radiator, wherein the method calculates the configuration similarity between a first heat source vector sequence of a mainboard to be simulated and a second heat source vector sequence of each candidate historical simulation mainboard; screening a plurality of similar historical simulation main boards according to the configuration similarity; the method comprises the steps of obtaining coordinates of all heat sources in a mainboard to be simulated to obtain a first coordinate sequence, calculating heat source distribution similarity between the first coordinate sequence and similar heat sources in a second coordinate sequence of each similar historical simulation mainboard, calculating comprehensive similarity according to the heat source distribution similarity and the configuration similarity, and taking simulation parameters of a radiator corresponding to the historical simulation mainboard with the maximum comprehensive similarity as initial values of corresponding simulation parameters of the radiator to be simulated, so that the final optimal parameters are closer to when thermal simulation is carried out according to the initial values, the adjustment range and the adjustment range of thermal simulation parameters are reduced, and the thermal simulation times are reduced.
Description
Technical Field
The invention relates to the technical field of heat simulation of radiators, in particular to a method and a system for acquiring initial values of heat simulation parameters of a radiator.
Background
The heat dissipation of the circuit board generally adopts a cold plate type heat dissipation, a cold plate type heat radiator generally adopts a base plate and heat dissipation teeth, configuration parameters of the heat radiator need to use thermal simulation software to perform thermal simulation FLOTHERM in advance, when a thermal simulation model is established, initial values of the configuration parameters of the heat dissipation teeth in the heat radiator are set according to experience, the configuration parameters of the heat dissipation teeth are continuously adjusted in the simulation process, and the optimal configuration parameters of the heat dissipation teeth which can enable the heat dissipation performance to be better are determined through thermal simulation comparison and evaluation, wherein the configuration parameters of the heat dissipation teeth comprise the tooth height, the tooth space and the tooth thickness of the heat radiator in the heat radiator. The initial value set by experience is not only dependent on the subjective experience of the user, but also causes the user to invest a lot of time and effort to repeatedly adjust the configuration parameters according to the initial value in a wide range because the user does not know the deviation between the initial value and the optimal configuration parameters.
Disclosure of Invention
Aiming at the technical problems, the technical scheme adopted by the invention is as follows:
a method for obtaining an initial value of a thermal simulation parameter of a radiator is provided, wherein the radiator is attached to a mainboard for radiating, and the mainboard comprises a plurality of heat sources; the method comprises the following steps:
s100, obtaining a first heat source vector formed by the thermal resistance, the power consumption, the quantity and the ambient temperature of each type of heat source in the mainboard to be simulated corresponding to the radiator to be simulated, wherein the first heat source vectors of all the heat sources in the mainboard to be simulated form a first heat source vector sequence.
S200, respectively obtaining second heat source vector sequences of N candidate historical simulation main boards, wherein N is the number of the candidate historical simulation main boards; the candidate historical simulation mainboard is a mainboard corresponding to a radiator which is subjected to thermal simulation in the database.
S300, according to the first heat source vector sequence and each second heat source vector sequence, calculating configuration similarity between the mainboard to be simulated and each candidate historical simulation mainboard, wherein M candidate historical simulation mainboards corresponding to the configuration similarity larger than a configuration similarity threshold are similar historical simulation mainboards, M is the number of the similar historical simulation mainboards, and N is larger than or equal to M.
S400, acquiring a first coordinate of each heat source in the mainboard to be simulated to obtain a first coordinate sequence; acquiring a second coordinate of each heat source in each similar historical simulation mainboard to obtain a second coordinate sequence; calculating the average Euclidean distance between a first coordinate and a second coordinate corresponding to the same kind of heat sources in the first coordinate sequence and the second coordinate sequence to obtain the average Euclidean distance sequence of all kinds of heat sources in the mainboard to be simulated and each similar historical simulation mainboard; and calculating the heat source distribution similarity between the mainboard to be simulated and the corresponding similar historical simulation mainboard according to the average Euclidean distance sequence.
And S500, calculating comprehensive similarity according to the heat source distribution similarity and the configuration similarity between the mainboard to be simulated and each similar historical simulation mainboard.
S600, taking the simulation parameters of the radiators corresponding to the historical simulation main boards with the maximum comprehensive similarity as initial values of the simulation parameters corresponding to the radiators to be simulated.
In addition, the invention also provides a system for acquiring the initial values of the thermal simulation parameters of the heat radiator, which comprises a processor and a non-transitory computer readable storage medium, wherein at least one instruction or at least one program is stored in the non-transitory computer readable storage medium, and the at least one instruction or the at least one program is loaded by the processor and executes the method for acquiring the initial values of the thermal simulation parameters of the heat radiator.
Compared with the prior art, the method and the system for acquiring the initial value of the thermal simulation parameter of the radiator have obvious beneficial effects, can achieve considerable technical progress and practicability, have industrial wide utilization value and at least have the following beneficial effects:
the invention provides a method and a system for acquiring an initial value of a thermal simulation parameter of a radiator, which are used for matching a historical simulation mainboard which is subjected to thermal simulation in a database according to the heat source configuration and the distribution characteristics of the mainboard to be simulated, screening the historical simulation mainboard similar to the mainboard to be simulated, and taking the optimal simulation parameter of the radiator corresponding to the historical simulation mainboard as the initial value of the mainboard to be simulated, so that the optimal parameter is closer to the final optimal parameter when thermal simulation is carried out according to the initial value, the adjustment range and the adjustment range of the thermal simulation parameter are reduced, the thermal simulation times are reduced, and the problems that the initial value depends on the subjective experience of a user and the configuration parameter of the user needs to be repeatedly adjusted according to the initial value in a large range are solved.
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In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a flowchart of a method for obtaining an initial value of a thermal simulation parameter of a heat sink according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 illustrates a method for obtaining an initial value of a thermal simulation parameter of a heat sink, where the heat sink is attached to a motherboard for heat dissipation, and the motherboard includes a plurality of heat sources; the method comprises the following steps:
s100, obtaining a first heat source vector formed by the thermal resistance, the power consumption, the quantity and the ambient temperature of each type of heat source in the mainboard to be simulated corresponding to the radiator to be simulated, wherein the first heat source vectors of all the heat sources in the mainboard to be simulated form a first heat source vector sequence.
Specifically, the heat source is a chip. Optionally, the heat source is a CPU, GPU, network chip or bridge processor.
Specifically, each type of heat source is the same type of heat source having the same configuration, and more specifically, each type of heat source has the same model. It will be appreciated that the power consumption is the same for each type of heat source. For example, two vector model GPUs, the two GPUs are the same type of heat source.
Specifically, the thermal resistance of the heat source is the thermal resistance from the inside of the chip to the chip case, which is an inherent property of the packaged chip.
Specifically, the ambient temperature is the temperature of the environment to be simulated, and is generally a temperature value specified by a user.
Wherein, a first heat source vector RY of the ith type heat source in the mainboard to be simulated 0,i =(θ 0,i ,W 0,i ,U 0,i ,T 0,i ) Wherein theta 0,i Is the thermal resistance of the i-th heat source in the mainboard to be simulated, W 0,i For the power consumption of the i-th heat source in the mainboard to be simulated, U 0,i The number and T of the ith heat source in the mainboard to be simulated 0,i Is the corresponding ambient temperature of the radiator to be simulated.
Preferably, the first heat source vector further includes: the thermal conductivity of the thermal conductive rubber pad of each type of heat source and the thermal conductivity of the heat sink itself. I.e. the first heat source vector RY 0,i =(θ 0,i ,W 0,i ,U 0,i ,T 0,i ,β 0,i ,γ 0 ) Wherein beta is 0,i Is the heat conductivity coefficient of the heat-conducting rubber pad of the i-th heat source in the mainboard to be simulated, gamma 0 The thermal conductivity of the radiator in the mainboard to be simulated. It should be noted that the thermal conductivity is related to the property of the thermal conductive material itself.
S200, respectively obtaining second heat source vector sequences of N candidate historical simulation main boards, wherein N is the number of the candidate historical simulation main boards; the candidate historical simulation mainboard is a mainboard corresponding to a radiator which is subjected to thermal simulation in the database.
It should be noted that the second heat source vector in the second heat source vector sequence is obtained in the same manner as the first heat source vector and has the same parameters of the vector, that is, the second heat source vector and the first heat source vector have the same vector dimensions. The heat radiator which completes thermal simulation in the database is the same as the heat radiator to be simulated, and the same means that the whole board is adopted for heat radiation of the main board and the types of the heat radiators are the same. Optionally, the heat sink is an air-cooled heat sink, wherein the air-cooled heat sink includes a base plate and heat dissipating fins. For the radiator which has completed thermal simulation, a set of optimal parameters is corresponded, and optionally, for the air-cooled radiator, the radiator which has completed simulation comprises the optimal parameters of the thickness of the substrate, the height, the thickness and the number of the radiating fins.
Specifically, the second heat source vector RY of the ith type of heat source in the kth candidate historical simulation mainboard k,i =(θ k,i ,W k,i ,U k,i ,T k,i ) Wherein theta k,i Is the thermal resistance, W, of the ith class heat source in the kth candidate historical simulation mainboard k,i For the power consumption, U, of the ith heat source in the kth candidate historical simulation mainboard k,i The number of the ith type heat sources and T in the kth candidate historical simulation mainboard k,i And simulating the corresponding ambient temperature of the radiator for the kth candidate history. Preferably, RY k,i =(θ k,i ,W k,i ,U k,i ,T k,i ,β k,i ,γ k ) Wherein, β k,i Is the heat conductivity coefficient gamma of the heat-conducting rubber pad of the ith heat source in the kth candidate historical simulation mainboard k And simulating the heat conductivity coefficient of the heat radiator in the mainboard for the kth candidate history.
Optionally, the N candidate historical simulation motherboards are historical simulation motherboards in the database, which have the same size as the to-be-simulated motherboard, the shell and the heat dissipation domain.
As a preferred embodiment, the step of obtaining N candidate historical simulation motherboards includes:
s210, obtaining the size of the mainboard to be simulated, the shell surrounding the mainboard to be simulated and the heat dissipation domain to obtain the volume proportion, and obtaining a first volume ratio vector of the mainboard to be simulated according to the volume proportion.
It should be noted that the casing surrounding the motherboard to be simulated is the largest space for the heat sink to directly dissipate heat from the heat sink, and is generally the host casing. The heat dissipation domain is a range of dissipating heat to an external space by taking the shell as a center, and is generally the size of the heat dissipation space designated by a user, and the size of the heat dissipation domain is generally 1.5-2 times of that of the shell.
Specifically, the main board to be simulated, the shell and the heat dissipation domain are all of three-dimensional structures and have length, width and height, and corresponding volumes are calculated according to the length, the width and the height to obtain the volume ratio among the volume of the main board to be simulated, the volume of the shell and the volume of the heat dissipation domain.
The step of obtaining a first volume ratio vector of the mainboard to be simulated according to the volume ratio comprises the following steps:
s211, multiplying the volume ratio (VS: VG: VY) among the mainboard to be simulated, the shell and the heat dissipation domain by preset weight (S, g, y) respectively to obtain a first volume ratio vector (S multiplied by VS, g multiplied by VG, y multiplied by VY); VS is a volume ratio corresponding item of the mainboard to be simulated in the volume ratio, VG is a volume ratio corresponding item of the shell in the volume ratio, VY is a volume ratio corresponding item of the heat dissipation domain in the volume ratio, s is the weight of the volume ratio corresponding item of the mainboard to be simulated, g is the weight of the volume ratio corresponding item of the shell, and y is the weight of the volume ratio corresponding item of the heat dissipation domain, wherein s > g > y, and s + g + y =1. It should be noted that s, g and y are values specified by a user, and for thermal simulation of the motherboard to be simulated, the size of the motherboard is more important for thermal simulation than the housing and the heat dissipation area, so that the weight of the motherboard is the largest, and the housing is the second most.
And S220, acquiring second volume ratio vectors corresponding to all historical simulation main boards in the database.
And S230, calculating the volume ratio similarity between the first volume ratio vector and the second volume ratio vector respectively, and acquiring N candidate historical simulation mainboards according to the volume ratio similarity. Wherein the volume ratio similarity is a vector similarity, and the optional vector similarity is a cosine similarity.
As a preferred embodiment, the step of obtaining N candidate historical simulation motherboards according to the volume ratio similarity in S230 is: and the historical simulation mainboard corresponding to the volume ratio similarity larger than the volume ratio similarity threshold is a candidate historical simulation mainboard.
As a preferred embodiment, the step of obtaining N candidate historical simulation motherboards according to the volume ratio similarity in S230 is: and the N historical simulation main boards with the largest volume ratio similarity are candidate historical simulation main boards.
Through the method of obtaining the candidate historical simulation mainboard in steps S210-S230, the same or similar simulation environment can be obtained, the volume ratio can be obtained to the heat dissipation system with the equal ratio scaling in the database, the simulation parameters of the heat dissipation system with the equal ratio scaling also have reference values, and the equal ratio scaling with the same ratio can be performed when other matching is performed.
S300, according to the first heat source vector sequence and each second heat source vector sequence, calculating configuration similarity between the mainboard to be simulated and each candidate historical simulation mainboard, wherein M candidate historical simulation mainboards corresponding to the configuration similarity larger than a configuration similarity threshold are similar historical simulation mainboards, M is the number of the similar historical simulation mainboards, and N is larger than or equal to M.
Optionally, the step of obtaining the configuration similarity includes: and calculating cosine similarity between vectors corresponding to heat sources of the same category in the first heat source vector sequence and the kth second heat source vector sequence, and adding the cosine similarity between the vectors corresponding to all the categories of heat sources to obtain configuration similarity.
Optionally, the configured similarity threshold is a similarity threshold pre-specified by the user. Optionally, the configuration similarity threshold may also be obtained according to all configuration similarities between the first heat source vector and the second heat source vector, and the obtaining step includes:
s310, calculating a configuration similarity mean value mean (SP) of configuration similarities SP = { SP1, SP2, …, SPj, …, SPN } corresponding to all the N candidate historical simulation main boards, wherein the jth configuration similarity SPj is a similarity between a first heat source vector sequence and a second heat source vector sequence corresponding to the jth candidate historical simulation main board, and the value range of j is 1 to N. Specifically, mean (SP) = 1/nx Σ N j=1 SPj。
Mean (SP) is a function for averaging SP.
S320, selecting a configuration similarity greater than mean (SP) to obtain a candidate configuration similarity sequence SP ' = { SP1, SP2 ', …, SPh ', …, SPh ' ″, wherein SPh ' is the H-th candidate configuration similarity, the value range of H is from 1 to H, and H is the number of candidate configuration similarities;
s330, obtaining a difference value between the SPh' and mean (SP) to obtain a heat source vector individual deviation Ch; differences between the H candidate configuration similarities in SP' and mean (SP) respectively constitute a heat source vector individual bias sequence C = { C1, C2, …, ch, …, ch };
s340, obtaining the mean value of the heat source vector to obtain a mean (C) of individual deviation of the heat source vector, and obtaining a configuration similarity threshold value SP according to the mean (C) and the mean (SP) 0 Wherein, SP 0 Satisfies the following conditions: SP 0 = mean (SP) + mean (C). Wherein mean (C) =1/H × Sigma H h=1 Ch。
The configuration similarity threshold value is acquired through the steps S310-S340, so that a proper threshold value can be acquired in a self-adaptive manner according to different environments without depending on subjective setting of a user.
S400, acquiring a first coordinate of each heat source in the mainboard to be simulated to obtain a first coordinate sequence; acquiring a second coordinate of each heat source in each similar historical simulation mainboard to obtain a second coordinate sequence; calculating the average Euclidean distance between a first coordinate and a second coordinate corresponding to the same kind of heat sources in the first coordinate sequence and the second coordinate sequence to obtain the average Euclidean distance sequence of all kinds of heat sources in the mainboard to be simulated and each similar historical simulation mainboard; calculating the heat source distribution similarity between the mainboard to be simulated and the corresponding similar historical simulation mainboard according to the average Euclidean distance sequence;
specifically, when the size of the main board to be simulated is the same as that of the historical simulated main board, a coordinate system is established by using the central point of the surface of the main board attached to the radiator or selecting one point in the surface as the origin of coordinates, and the transverse axis and the longitudinal axis of the coordinate system are respectively parallel to two edges of the main board which are perpendicular to each other. And taking the central point of each heat source as the coordinate of the heat source, and acquiring the coordinate of each heat source in a coordinate system. The to-be-simulated main board comprises a plurality of heat sources, first coordinates of all the heat sources in the to-be-simulated main board are obtained, then first coordinate sequences of all the heat sources in the to-be-simulated main board are obtained, and similarly, second coordinate sequences of all the heat sources in each similar historical simulation main board are obtained.
Specifically, the ith type of heat source in the first coordinate sequence comprises first coordinates { XY 1) of F heat sources i,1 ,XY1 i,2 ,…,XY1 i,f ,…,XY1 i,F }，XY i,f The first coordinate of the ith heat source in the ith heat source is set, the value range of F is 1-F, and F is the number of heat sources in the ith heat source in the mainboard to be simulated. Each heat source in the ith type of heat source corresponds to a first coordinate. Similarly, the ith heat source in the second coordinate sequence in the qth similar history simulation mainboard comprises second coordinates { XY2 ] of R heat sources q i,1 ,XY2 q i,2 ,…,XY2 q i,r ,…,XY2 q i,R In which XY2 q i,r And the value range of R is 1 to R for the second coordinate of the ith heat source in the qth similar historical simulation mainboard, and R is the number of heat sources in the ith heat source in the qth similar historical simulation mainboard. The average Euclidean distance d between the first coordinate and the second coordinate corresponding to the ith type heat source in the first coordinate sequence and the second coordinate sequence q,i Satisfies the following conditions:
d q,i =1/(F×R)×∑ F f=1 ∑ R r=1 ED i (XY1 i,f ,XY2 q i,r ) Wherein ED i (XY1 i,f ,XY2 q i,r ) Is XY1 i,f And XY2 q i,r The euclidean distance between them. Wherein d is q,i And the average Euclidean distance between the mainboard to be simulated and the ith heat source in the qth similar historical simulation mainboard.
As a preferred embodiment, the step of obtaining the similarity of the heat source distribution includes: calculating an average Euclidean distance sequence d of the qth similar historical simulation mainboard q ={d q,1 ,d q,2 ,…,d q,i ,…,d q,I Obtaining the heat source distribution difference degree DC between the mainboard to be simulated and the qth similar historical simulation mainboard through the variance of q Wherein I is the number of categories of heat sources; obtaining the heat source distribution similarity SD according to the heat source distribution difference q The heat source distribution similarity SD q Degree of difference DC from heat source distribution q A negative correlation.
Optionally, heat source distribution similarity SD q For heat source distribution difference degree DC q The reciprocal of (c). Preferably, to prevent the denominator from being zero, SD q Satisfies the following conditions: SD q =1/(DC q +1)。
Preferably, for the method for screening N candidate historical simulation motherboards according to the volume ratio, before obtaining the heat source coordinates in the candidate historical simulation motherboards, the size of the candidate historical simulation motherboard is scaled in an equal proportion, and the obtaining of the scaling ratio includes: calculating the area according to the length and the width of the mainboard to be simulated, and calculating the area according to the length and the width of the candidate historical mainboard, wherein the scaling ratio W of the candidate historical mainboard = the area of the simulated mainboard/the area of the candidate historical mainboard.
And S500, calculating comprehensive similarity according to the heat source distribution similarity and the configuration similarity between the mainboard to be simulated and each similar historical simulation mainboard.
Preferably, the comprehensive similarity between the mainboard to be simulated and the qth similar historical simulation mainboard meets the following requirements:
SU q =SP q +SD q 。
s600, taking the simulation parameter of the radiator corresponding to the historical simulation mainboard with the maximum comprehensive similarity as an initial value of the simulation parameter corresponding to the radiator to be simulated.
Specifically, the comprehensive similarity between the mainboard to be simulated and the M similar simulation mainboards is obtained, and a comprehensive similarity set SU = { SU is obtained 1 ,SU 2 ,…,SU q ,…,SU M And q has a value ranging from 1 to M. And acquiring the maximum value of the comprehensive similarity in the SU set, wherein the radiator of the similar simulation mainboard corresponding to the maximum value is a target radiator, and acquiring the optimal parameters of the thickness of the substrate, the height, the thickness and the number of the radiating fins corresponding to the target radiator as the thermal simulation initial values of the radiators to be simulated corresponding to the mainboard to be simulated.
The method for acquiring the initial value of the thermal simulation provided by the invention matches the historical simulation mainboard which is subjected to thermal simulation in the database according to the heat source configuration and the distribution characteristic of the mainboard to be simulated, screens the historical simulation mainboard similar to the mainboard to be simulated, and takes the optimal simulation parameter of the radiator corresponding to the historical simulation mainboard as the initial value of the mainboard to be simulated, so that the final optimal parameter can be closer when the thermal simulation is carried out according to the initial value.
Based on the same inventive concept as the method embodiment, an embodiment of the present invention further provides a system for acquiring initial values of thermal simulation parameters of a heat sink, where the system includes a processor and a non-transitory computer-readable storage medium, where at least one instruction or at least one program is stored in the non-transitory computer-readable storage medium, and the at least one instruction or the at least one program is loaded and executed by the processor to implement a method for acquiring initial values of thermal simulation parameters of a heat sink, where the method for acquiring initial values of thermal simulation parameters of a heat sink has been described in detail in the foregoing embodiments, and is not described again.
Although some specific embodiments of the present invention have been described in detail by way of illustration, it should be understood by those skilled in the art that the above illustration is only for the purpose of illustration and is not intended to limit the scope of the invention. It will also be appreciated by those skilled in the art that various modifications may be made to the embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A method for obtaining an initial value of a thermal simulation parameter of a radiator is provided, wherein the radiator is attached to a mainboard for radiating, and the mainboard comprises a plurality of heat sources; characterized in that the method comprises:
s100, obtaining a first heat source vector formed by the thermal resistance, the power consumption, the quantity and the ambient temperature of each type of heat source in the mainboard to be simulated corresponding to the radiator to be simulated, wherein the first heat source vectors of all the heat sources in the mainboard to be simulated form a first heat source vector sequence;
s200, respectively obtaining second heat source vector sequences of N candidate historical simulation main boards, wherein N is the number of the candidate historical simulation main boards; the candidate historical simulation mainboard is a mainboard corresponding to a radiator which is subjected to thermal simulation in a database;
s300, calculating configuration similarity between the mainboard to be simulated and each candidate historical simulation mainboard according to the first heat source vector sequence and each second heat source vector sequence, wherein M candidate historical simulation mainboards corresponding to the configuration similarity larger than a configuration similarity threshold are similar historical simulation mainboards, M is the number of the similar historical simulation mainboards, and N is larger than or equal to M;
s400, acquiring a first coordinate of each heat source in the mainboard to be simulated to obtain a first coordinate sequence; acquiring a second coordinate of each heat source in each similar historical simulation mainboard to obtain a second coordinate sequence; calculating the average Euclidean distance between the first coordinate and the second coordinate corresponding to the similar heat sources in the first coordinate sequence and the second coordinate sequence to obtain the average Euclidean distance sequence of all the similar heat sources in the mainboard to be simulated and each similar historical simulation mainboard; calculating the heat source distribution similarity between the mainboard to be simulated and the corresponding similar historical simulation mainboard according to the average Euclidean distance sequence;
s500, calculating comprehensive similarity according to the heat source distribution similarity and the configuration similarity between the mainboard to be simulated and each similar historical simulation mainboard;
s600, taking the simulation parameter of the radiator corresponding to the historical simulation mainboard with the maximum comprehensive similarity as an initial value of the simulation parameter corresponding to the radiator to be simulated.
2. The method of claim 1, wherein the obtaining of the N candidate historical emulated motherboards comprises:
s210, obtaining the size of the mainboard to be simulated, a shell surrounding the mainboard to be simulated and a heat dissipation domain to obtain the volume proportion, and obtaining a first volume ratio vector of the mainboard to be simulated according to the volume proportion;
s220, acquiring second volume ratio vectors corresponding to all historical simulation main boards in a database;
and S230, calculating the volume ratio similarity between the first volume ratio vector and the second volume ratio vector respectively, and acquiring N candidate historical simulation mainboards according to the volume ratio similarity.
3. The method according to claim 2, wherein the obtaining N candidate historical simulation motherboards according to the volume ratio similarity in S230 includes: and the historical simulation mainboard corresponding to the volume ratio similarity larger than the volume ratio similarity threshold is a candidate historical simulation mainboard.
4. The method of claim 2, wherein the obtaining N candidate historical simulation motherboards according to the volume ratio similarity in S230 comprises: and the N historical simulation main boards with the largest volume ratio similarity are candidate historical simulation main boards.
5. The method according to claim 1, wherein cosine similarities between vectors corresponding to heat sources of the same category in the first heat source vector sequence and the kth second heat source vector sequence are calculated, and the cosine similarities between vectors corresponding to heat sources of all categories are added to obtain configuration similarities, wherein k has a value ranging from 1 to N.
6. The method of claim 5, wherein the step of obtaining the configuration similarity threshold comprises:
s310, calculating a configuration similarity mean value mean (SP) of configuration similarities SP = { SP1, SP2, …, SPj, … and SPN } corresponding to the N candidate historical simulation main boards, wherein the jth configuration similarity SPj is the similarity between a first heat source vector sequence and a second heat source vector sequence corresponding to the jth candidate historical simulation main board, the value range of j is 1 to N, and N is the number of the candidate historical simulation main boards;
s320, selecting a configuration similarity greater than mean (SP) to obtain a candidate configuration similarity sequence SP ' = { SP1, SP2 ', …, SPh ', …, SPh ' ″, wherein SPh ' is the H-th candidate configuration similarity, the value range of H is from 1 to H, and H is the number of candidate configuration similarities;
s330, obtaining a difference value between the SPh' and mean (SP) to obtain a heat source vector individual deviation Ch; differences between the H candidate configuration similarities in SP' and mean (SP) respectively constitute a heat source vector individual bias sequence C = { C1, C2, …, ch, …, ch };
s340, obtaining the mean value of the heat source vector to obtain a mean (C) of individual deviation of the heat source vector, and obtaining a configuration similarity threshold value SP according to the mean (C) and the mean (SP) 0 Wherein, SP 0 Satisfies the following conditions: SP 0 =mean(SP)+mean(C)。
7. The method of claim 1, wherein the step of obtaining the similarity of the heat source distribution comprises: calculating an average Euclidean distance sequence d of the qth similar historical simulation mainboard q ={d q,1 ,d q,2 ,…,d q,i ,…,d q,I Obtaining the heat source distribution difference degree DC between the mainboard to be simulated and the qth similar historical simulation mainboard through the variance of q Wherein I is the number of categories of heat sources; according to DC q Obtaining the heat source distribution similarity SD q The SD of q And DC q Negative correlation, where q ranges from 1 to M.
8. The method of claim 7, wherein the SD q Is DC q The reciprocal of (c).
9. The method of claim 1, wherein the integrated similarity is a sum of a heat source distribution similarity and a configuration similarity.
10. A system for obtaining initial values of thermal simulation parameters of a heat sink, the system comprising a processor and a non-transitory computer readable storage medium having at least one instruction or at least one program stored therein, wherein the at least one instruction or the at least one program is loaded by the processor and executed to implement the method of any one of claims 1 to 9.
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