CN115576390A - Server system - Google Patents

Abstract

A server system. A casing includes a bottom plate; an upper cover arranged on the bottom plate; a pair of side walls, a pair of side doors and a front panel arranged between the bottom plate and the upper cover, wherein the opposite side doors are set perpendicular to the front panel, and the opposite side doors Each of the side doors is disposed in alignment with one of the pair of side walls, the housing having a rear portion defined by the area between the pair of side walls and a front portion defined by the area between the pair of side doors; a pair of component housings disposed at the front , wherein each component housing has a front end facing one of the side doors and a rear end facing the other side door; and a pair of circuit boards respectively covering the rear ends of the component housing, wherein each circuit board is perforated to form a plurality of holes, the central gallery Defined by the distance between the pair of circuit boards, the plurality of apertures are configured to allow air exhausted from the front of the component housing to flow toward the central gallery, the plurality of apertures for exposing the rear end of the storage component received by the component housing.

Description

server system

technical field

The present disclosure generally relates to server systems and modules and components therein. More specifically, the present disclosure relates to novel cooling arrangements for server systems that allow side-entry storage drives to better cool the server system.

Background technique

In a conventional arrangement, the server system is usually mounted like a drawer from the front of the server system rack, so it is intuitive to arrange most of the storage drives of the server system in a location close to the user for easy access. In other words, the storage drives (eg, hard drives) are typically placed at the front of the server system, so the storage drives are typically plugged in and unplugged from the front or top surface of the server system. However, due to the industry-specified width and height, the number of storage drives that can be inserted from the front of the server system is naturally limited by the size of the front area; storage drives that are inserted from the top of the server system require the user to insert or unplug from above the server system , is not convenient. On the other hand, inserting from the side of the server system (eg, the flank of the server system body) increases the number of storage drives while allowing easy access to each storage drive. However, more storage drives mean more heat generated within the server system. Additionally, having more storage drives means less cooling space available at the industry-specified width and height. Therefore, side-entry storage drives generally have heat dissipation issues, which is not ideal for server systems.

The present disclosure provides a new arrangement of side-entry server systems incorporating enhanced thermal management capabilities.

Contents of the invention

In view of the above, there is a need to provide an enclosure with enhanced thermal management capabilities.

According to the present disclosure, a housing is provided. The shell includes a base plate; the upper cover is arranged on the base plate; a pair of side walls, a pair of side doors and a front panel are arranged between the base plate and the upper cover, wherein the pair of side doors are arranged perpendicular to the said front panel, each side door of said pair of side doors is disposed substantially in alignment with one of said pair of side walls, said housing having a rear portion defined by an area between said pair of side walls and defined by said pair of side walls a front portion defined by the area between the side doors; a pair of assembly housings disposed at the front portion, wherein each of the assembly housings has a front end facing one of the side doors and a rear end facing the other of the side doors; and a A pair of circuit boards respectively cover the rear end of the component housing, wherein each of the circuit boards is perforated to form a plurality of holes, the central corridor is defined by the distance between the pair of circuit boards, and the plurality of holes are configured The plurality of apertures are configured to allow air exhausted from the front end of the component housing to flow toward the central corridor, and the plurality of apertures are configured to expose a rear end of the storage component received by the component housing.

In one embodiment, the housing further comprises a stress dispersing member across the entire width of the floor, the stress dispersing member being arranged perpendicular to the pair of side walls and the pair of side doors.

According to the present disclosure, a housing is provided. The housing includes a bottom plate; an upper cover is arranged on the bottom plate; a pair of side doors and a front panel are arranged between the bottom plate and the upper cover, wherein a front portion is defined between the pair of side doors; the stress dispersing member transversely A pair of component housings are arranged across the entire width of the base plate between the stress dispersing member and the front panel; wherein each of the component housings has a front end and a rear end opposite the front end, the stress dispersing The end of the component extends beyond the front end of the associated component housing, and the front end of the component housing, the side door, the upper cover, the bottom plate and the extended part of the stress dispersing member form a bend.

In one embodiment, the housing further includes a pair of circuit boards disposed between the pair of component housings, and each of the pair of circuit boards is at an angle to the base plate, wherein each of the circuit boards Perforated to form a plurality of holes, a central corridor defined by the distance between the pair of circuit boards, the front end of the component housing perforated to allow air from outside the component housing to flow through the associated holes to the central a corridor, the holes are disposed along the rear end of the component housing.

According to the present disclosure, a housing is provided. The housing includes a base plate; an upper cover is disposed on the base plate; a front panel is disposed between the base plate and the upper cover, and a stress dispersing member traverses the entire width of the base plate and is fastened to the base plate and the upper cover. The upper cover, wherein a front portion is defined between the front panel and the stress dispersing member; a pair of assembly housings are arranged at the front portion, each of the assembly housings has a front end facing outside of the housing and a front end facing inwardly of the housing. wherein the end of the stress dispersing member extends beyond the front end of the component housing; and a pair of circuit boards respectively covering the rear end of the component housing, wherein each of the circuit boards is perforated forming a plurality of apertures, a central corridor defined by the distance between the pair of circuit boards, the plurality of apertures configured to allow air exhausted from the front end of the component housing to flow toward the central corridor, the A plurality of apertures are used to expose the rear end of the storage component received by the assembly housing.

According to the present disclosure, a housing is provided. The housing includes a base plate; a stress dispersing member traversing the entire width of the base plate, wherein the stress dispersing member forms a barrier between the front and rear of the base plate; a pair of component housings disposed on the front and adjacent to the The stress dispersing member, wherein each of the component housings has a front end and a rear end relative to the front end, each of the component housings is configured to arrange received electronic devices in a stacked array, wherein the stress dispersing an end portion of a member extends beyond said front end of said component housing; and a pair of circuit boards is disposed between said pair of component housings, each said circuit board being disposed at an angle to said base plate, wherein each said The circuit boards are perforated to form a plurality of holes, a central corridor is defined by the distance between the pair of circuit boards, and the front end of the component housing is perforated to allow air from outside the component housing to flow through the associated holes to the a central corridor, the holes are disposed along the rear end of the component housing.

In one embodiment, the housing further includes a pair of side walls securing the ends of the stress distributing member.

In one embodiment, the housing further includes an upper cover disposed on the bottom plate; wherein the bottom plate and the upper cover fasten the stress dispersing member.

In one embodiment, the enclosure further includes a pair of side doors mechanically connected to the upper cover and configured to form an angle away from the enclosure, wherein a peripheral corridor is defined by the front end of the component enclosure, one of the side doors, and Spacing is defined between portions of the stress dispersing members, wherein the stress dispersing members form sealed ends of associated peripheral corridors.

In one embodiment, wherein a pair of door stops protrudes from the region of the stress dispersing member and is disposed between the side door and the assembly housing, the door stops being configured to seal between the side door and the side wall the gap between.

In one embodiment, each of the side doors includes a door panel configured to form an angle away from the housing; and a sealing wing configured to form an angle away from the upper cover.

In one embodiment, the housing further includes a sealing strip disposed between the side door and the upper cover, and the sealing strip is configured to prevent air from entering through a space between the side door and the upper cover.

In one embodiment, the thickness of the sealing strip is not less than the distance between the upper cover and the sealing wing when the side door is stationary.

In one embodiment, the housing further includes a front panel disposed between the bottom plate and the periphery of the upper cover.

In one embodiment, wherein said front panel comprises an outer frame; and an inner frame opposite to said outer frame; wherein a collection space is formed between said outer frame and said inner frame, wherein said component housing adjoins said An inner frame having a perforated area greater than that of the inner frame, wherein the inner frame is perforated in a region extending beyond the front end of the component housing.

In one embodiment, said housing further comprises a spine disposed between said stress distributing member and said base plate, mechanically attached to said base plate, arranged perpendicular to said stress distributing member, and at said stress The two opposite directions of the dispersion member extend.

In one embodiment, each of said component housings has a top surface and a bottom surface fastened to said upper cover and said bottom plate, respectively.

In one embodiment, each of said component housings is configured to receive electronic devices in a stacked array.

In one embodiment, the area of the stress distributing member where it is aligned with the central gallery is perforated.

In one embodiment, wherein the stress distributing member and the housing of the assembled components are arranged adjacent to each other.

In one embodiment, wherein the stress dispersing member is configured as a cantilever for the housing when a portion of the housing is suspended.

In one embodiment, wherein the center of gravity of the housing is located at the front.

In one embodiment, the pair of circuit boards are substantially perpendicular to the base plate.

In one embodiment, wherein said circuit board abuts said rear end of said component housing.

Compared with the prior art, the above-mentioned casing can better cool the storage drive inside it.

Description of drawings

FIG. 1 is a perspective view of a rack-mounted server system according to an embodiment of the present disclosure.

FIG. 2 is an exploded view of a server system without racks according to one embodiment of the present disclosure.

FIG. 3 is a perspective view of a server system according to one embodiment of the present disclosure.

Fig. 4 is a top view of Fig. 3 after the door is assembled.

FIG. 5 is a simplified schematic diagram of a partial (PL dotted area) layout of FIG. 4 .

Figure 6 is an exploded view of a front panel according to one embodiment of the present disclosure.

FIG. 7 is another perspective view of a server system according to an embodiment of the present disclosure.

FIG. 8 is another exploded view of a server system according to one embodiment of the present disclosure.

FIG. 9 is a side view of a server system according to one embodiment of the present disclosure.

FIG. 10 is a front view of a memory module according to one embodiment of the present disclosure.

Fig. 10-1 is a sectional view of A-A of Fig. 10 .

11 is a schematic front view of a storage case according to one embodiment of the present disclosure.

12 is a front view of a memory case and circuit board according to one embodiment of the present disclosure.

FIG. 13 is an enlarged view of a part (PE dotted line area) of FIG. 8 .

Figure 14 is a front view of a front panel according to one embodiment of the present disclosure.

FIG. 15 is a simplified schematic diagram of the B-B section as shown in FIG. 14 .

FIG. 16 is another perspective view of a server system according to one embodiment of the present disclosure.

FIG. 17 is an enlarged view of a part (PE dotted line area) of FIG. 16 .

FIG. 18 is another perspective view of a server system according to one embodiment of the present disclosure.

FIG. 19 is an enlarged view of a part of FIG. 18 (area of the dotted line PE).

Figure 20 is a front view of a fan module according to one embodiment of the present disclosure.

Figure 21 is a bottom view of a fan module according to one embodiment of the present disclosure.

FIG. 22 is a simplified schematic diagram of the C-C section of FIG. 4 .

FIG. 23 is an enlarged view of FIG. 9 (PE dotted line area).

FIG. 24 is a cooling test result of a server system according to one embodiment of the present disclosure.

FIG. 25 is another perspective view of a server system according to one embodiment of the present disclosure.

26A-26E are perspective views of a bone structure according to one embodiment of the present disclosure.

27A-27B are perspective views of side door structures according to one embodiment of the present disclosure.

Figure 28 is a perspective view of a storage module according to one embodiment of the present disclosure.

FIG. 29 is a cross-sectional view of a side door structure according to one embodiment of the present disclosure.

30A-30J are perspective views of a rack-mounted server system according to one embodiment of the present disclosure.

Description of main component symbols

The following specific embodiments will further illustrate the present disclosure in conjunction with the above-mentioned drawings.

detailed description

For simplicity and clarity of illustration, it should be understood that reference numerals are repeated where appropriate in the present disclosure or among different drawings to indicate corresponding or analogous elements. Additionally, this disclosure sets forth numerous specific details in order to provide a thorough understanding of the described embodiments of the present disclosure. However, it will be understood by those of ordinary skill in the art that the embodiments described in this disclosure may be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the pertinent feature being described. Also, the following description should not be considered as limiting the scope of the described embodiments of the present disclosure. The drawings are not necessarily to scale and the proportions of certain parts may have been exaggerated to better show details and features of the present disclosure.

According to one embodiment of the present disclosure, FIG. 1 shows a server system 100 installed to a server rack 500; FIG. 2 shows an exploded view of the server system 100 without the server rack 500; FIG. in the layout. 2 and 3, the server system 100 includes a base plate 11, an upper cover 12, a front panel 13, a rear panel 14 parallel to the front panel 13, a pair of side walls 15 parallel to each other, two side doors 16 parallel to each other, two components Housing 17 (eg, storage module), two circuit boards 18 , fan module 19 , pair of fan brackets 20 , motherboard insulator 21 , motherboard (not shown) and power module 22 . The pair of side walls 15 are arranged perpendicular to the back plate 14 and the stress dispersion member 24 . Furthermore, the pair of side walls 15 are arranged perpendicular to the front panel 13 . In some embodiments, the housing also includes two side doors 16 parallel to each other. The pair of side doors 16 are arranged perpendicular to the front panel 13 and the stress dispersing member 24 . Furthermore, the pair of side doors 16 are arranged perpendicular to the rear panel 14 . Each of the pair of side doors 16 is arranged in alignment with a corresponding side wall 15 . In one embodiment, the base plate 11 is a rectangular plate having two long sides and two short sides. The front panel 13 and the rear panel 14 are respectively arranged on one of the short sides of the base plate 11 . A pair of side walls 15 and two side doors 16 are arranged at long sides of the bottom panel 11 , and each long side of the bottom panel 11 has one side wall 15 near the rear panel 14 and one side door 16 near the front panel 13 . In some embodiments, side door 16 is mechanically attached to the housing. In some embodiments, the portion of the housing forming the mechanical attachment serves as the jamb of the side door 16 . In the exemplary embodiment, the side doors are hinged to the upper cover 12 and are configured to be angled away from the housing. Each side wall 15 and a side door 16 on the same side of the floor 11 are aligned with each other. The side wall 15 and the side door 16 are disposed between the upper cover 12 and the bottom plate 11 . The component shell 17 , the circuit board 18 , the fan module 19 , the main board insulation 21 , the main board and the power supply module 22 are arranged on the base plate 11 . The component housing 17 contains a housing frame structure 171 (storage box) and a plurality of device mounts 172 (drive trays). The device base 172 is configured to carry a plurality of electronic devices D (eg, storage drives, storage components), and the electronic devices D together with the device base 172 can be horizontally inserted into the receiving frame structure 171 from the front of the component housing 17 . In an embodiment, the device base 172 can be integrated into the receiving frame structure 171 , so the receiving frame structure 171 can directly accommodate the electronic device D. As shown in FIG. Accordingly, the device bases 172 may also be arranged in a stacked array. In some embodiments, the component housing 17 has a top surface and a bottom surface fixed to the upper cover 12 and the bottom plate 11 respectively. In some other embodiments, component housing 17 has a front end and a rear end opposite the front end. In some other embodiments, component housing 17 has a front end and a rear end opposite the front end. In some embodiments, component housing 17 includes a main body, wherein an opening between the front and rear ends of the main body allows passage between the front and rear ends of component housing 17 . The component housings 17 are arranged between the two side doors 16 in a back-to-back manner, and each component housing 17 faces one of the side doors 16 . In other words, the component case 17 faces the long side of the bottom plate 11 . The component housing 17 is at a distance from the periphery of the long side of the corresponding bottom plate 11 . Since the component housing 17 faces the door 16, the device base 172 and the electronic device D cannot be removed from the receiving frame structure 171 when the side door 16 is closed. In some embodiments, the front end of the component housing 17 is spaced from the side door 16 by a certain distance.

In some embodiments, the pair of circuit boards 18 is disposed between the pair of component housings 17 . The pair of circuit boards 18 are at a distance from each other. Each circuit board 18 is vertically arranged on the back of one of the component housings 17 with respect to the bottom plate 11 , so that the circuit board 18 stands behind each of the two component housings 17 .

In some embodiments, the circuit board covers the rear end of the component housing 17 by having the surface of the circuit board 18 (eg, the surface of the circuit board having the largest surface area) projectively disposed within the rear end periphery of the component housing 17 . In some embodiments, the circuit board 18 may be arranged to extend from the rear periphery of the component housing 17 . In an exemplary embodiment, a flat surface of the circuit board 18 may be provided at an opening at the rear end of the main body of the component housing 17 . In some embodiments, each circuit board 18 may be arranged at an angle to the chassis 11 . In the exemplary embodiment, circuit board 18 is arranged substantially perpendicular to base plate 11 . Additionally, the circuit board 18 may adjoin the rear end of the component housing 17 . In some embodiments, circuit board 18 is mechanically secured to the rear end of component housing 17 . Therefore, the circuit board 18 can be electrically connected to the electronic device D in the component case 17 without providing a cable therebetween. Therefore, in some embodiments, the storage drive D and the circuit board are coupled to each other using a board-to-board connector. In one embodiment, the circuit board 18 is a printed circuit board configured to couple the electronic device D to a motherboard.

A fan module 19 is disposed between the side walls 15 and is configured to cool the component housing 17 and the circuit board 18 . Pairs of fan brackets 20 are respectively arranged near different side walls 15 , and the fan module 19 can be coupled to the fan brackets 20 to be installed on the server system 100 . In this way, the fan module 19 is horizontally placed on the bottom plate 11 from one side to the other in the server system 100 . The motherboard is disposed on the motherboard insulation 21 between the fan module 19 and the rear panel 14 , and is electrically coupled to the circuit board 18 , the fan module 19 and the power module 22 . The power module 22 is arranged between the side walls 15 and is closer to the rear panel 14 than the fan module 19 . The back of the power module 22 is aligned with the rear panel 14 , so the rear panel 14 itself does not cover the back of the power module 22 . Therefore, the power module 22 can be removed from the server system 100 independently. The upper cover 12 is disposed above the component shell 17 , the circuit board 18 , the fan module 19 , the main board and the power module 22 on the base plate 11 . Therefore, the base plate 11, the upper cover 12, the front panel 13, the rear panel 14, the side wall 15, the side door 16 and the power supply module 22 together form a housing 17, a circuit board 18, a fan module 19, a fan bracket 20, Motherboard insulator 21 and the space of the motherboard.

In one embodiment of the present disclosure, the upper cover 12 includes a storage area upper cover 121 covering the component housing 17 and the circuit board 18, a fan area upper cover 122 covering the fan module 19, and a cover covering the main board. The motherboard area upper cover 123. Therefore, by removing the corresponding part of the upper cover 12 , the component housing 17 together with the circuit board 18 , the fan module 19 and the main board can be individually accessed from the top of the server system 100 for maintenance.

According to an embodiment of the present disclosure, FIG. 4 is a top view of FIG. 3 , and FIG. 5 is a simplified schematic diagram of a partial (PL dotted line area) layout of FIG. 4 . Referring to FIGS. 4 and 5 , the cooling arrangement (for example, for the component housing 17 and its circuit board 18 ) of the server system 100 according to an embodiment of the present disclosure will be described below.

To cool server system 100 , fan module 19 is configured to draw air into server system 100 at front panel 13 and blow air out of server system 100 at rear panel 14 . In server system 100 , air driven by fan module 19 flows through and cools component housing 17 and circuit board 18 . More specifically, as shown in FIG. 5 , the air flows into the collection space CS in the front panel 13 . The air passes through the plurality of air inlets 133 of the front panel 13, and then the air exits the front panel 13 through the plurality of air outlets 134 at the side of the collection space CS. Then, the air flows into the two peripheral corridors FC (first corridor) communicating between the front panel 13 and the module case 17 . In some embodiments, peripheral corridor FC is defined by the lateral spacing between the front end of component housing 17 , one of side doors 16 , and a portion of stress dispersing member 24 . The peripheral corridor is further defined by the vertical separation between the floor 11 and the upper cover 12 . In other words, the flow path is defined by a closed space formed using the front end of the component case 17 , the side door 16 , a part of the stress dispersing member 24 , the bottom plate 11 and the upper cover 12 . As shown in FIG. 5 , a portion of the stress dispersing member 24 disposed between the side door 16 and the assembly housing 17 forms a seal for the outer corridor FC. Furthermore, the stress dispersing member 24 forms a barrier between the front and rear of the bottom plate 11 . The front is further defined by the space between a pair of side doors 16 . The rear is further defined by the space between a pair of side walls 15 . The pair of peripheral corridors FC refer to the space located inside the side door 16 and in front of the storage module 17 . As shown in FIG. 5 , each peripheral corridor FC is therefore defined between one of the side doors 16 and the component housing 17 facing that side door 16 . The server system 100 also includes a stress dispersing member 24 (such as a first support) arranged at the end of the peripheral corridor FC on the side of the component housing 17 closer to the rear panel 14, the stress dispersing member 24 serving as an air barrier is configured to prevent The air in the peripheral corridor FC flows to the fan module 19 without passing through the component housing 17 and the circuit board 18 . In some embodiments, the air flowing through the peripheral corridor FC is exhausted by the fan module 19 , enters the component housing 17 through the front end, and exits the component housing 17 through the plurality of holes 181 in the circuit board 18 . The stress distributing member 24 spans the entire width of the bottom plate 11 . In some embodiments, the stress dispersing member 24 is fixed on the bottom plate 11 and the upper cover 12 . The stress dispersing member 24 and the component case 17 are arranged to adjoin each other. In one embodiment, the server system 100 may include other types of air barriers disposed at the ends of the two peripheral corridors FC instead of or in addition to the stress dispersing members 24, e.g., airtight sealants , airtight foam, airtight tape, etc. As a result, air flows in from the two peripheral corridors FC through the plurality of tray air holes 1721 of the component housing 17 , and then the air exits the component housing 17 through the plurality of holes 181 on the circuit board 18 . In this way, the air enters the central gallery SC (second gallery), which is the space defined between the two circuit boards 18 . As fan module 19 continues to draw air, air from the central gallery is driven through opening 243 of stress dispersing member 24 between the central gallery and fan module 19 . The opening 243 may be a perforation formed on the stress spreading member 24 aligned with the central corridor SC. Finally, the air passes through the fan module 19 and exits the server system 100 through the rear panel 14 . The two peripheral corridors FC are parallel to the central corridor, while the collection space CS is perpendicular to the central corridor. It should be noted that the collection space CS in the front panel 13 should not communicate directly with the central corridor between the module housings 17 .

26A-26E are perspective views of a bone structure according to one embodiment of the present disclosure. In some embodiments, the housing is divided into a front and a rear. The bone structure of the shell is configured to provide structural support to the shell when subjected to load forces. In some embodiments, the bony structure includes a stress distributing member 24 , a sidewall 15 secured to an end of the stress distributing member 24 , and a spine 25 disposed between the base plate 11 and the stress distributing member 24 . The spine 25 may be disposed substantially equidistant from the pair of side walls 15 . In some embodiments, the stress distributing member 24 also includes a fixation bracket 246 configured to compress the spine 25 when subjected to a load force. The fixing bracket 246 forms an arch at the bottom of the stress spreading member 24 .

In addition to being arranged to define the rear and front of the housing, the stress dispersing member 24 may act as a structural beam capable of bearing loads. In some embodiments, a server rack is configured to receive multiple enclosures. When the user needs to access the housing, the user can pull part of the housing away from the server rack. In this way, part of the enclosure is not supported by the rack. When in use, the enclosure may hang partially outside the server rack and the front may not be supported. When a portion of the enclosure (eg, the front) is suspended, the stress dispersing member is configured to form a cantilever of the enclosure. In some embodiments, the component housing 17 is arranged in the front of the housing. In some embodiments, the component housing 17 is arranged at the front of the housing. In this way, the center of gravity of the shell is at the front. In some embodiments, stress dispersing member 24 extends beyond component housing 17 . In some embodiments, the ends of the stress dispersing members 24 that extend beyond the front end of the component housing act as air barriers in the peripheral corridor FC.

In some embodiments, the spine 25 may form a channel having a web 251 and wings 252 protruding from the sides of the web 251 . In some embodiments, the web 251 traverses the entire length of the front portion and extends partially into the rear portion. Furthermore, the web 251 is fastened to the bottom plate 11 . In some other embodiments, the web 251 may extend partially to the front and back, depending on the material of the spine. In some embodiments, the wings 252 extend toward the upper cover 12 . In some embodiments, wings 252 are mechanically secured to stress distributing member 24 . Furthermore, the ends of the wings form an L-shaped bend 253 . In some embodiments, the L-shaped bend may be a structure in which a pair of planar structures are arranged in an L-shaped cross-section. In some embodiments, the angles between planar structures may be perpendicular to each other. In some other embodiments, the angle between planar structures may be less than 180 degrees. In the exemplary embodiment, wing 252 is mechanically secured to the forward-facing side of stress-dispersing member 24 . In particular, a portion of the L-shaped channel 253 disposed parallel to the surface of the stress distributing member 24 is fastened to the stress distributing member 24 using a fastener 254 . Additionally, in some embodiments, wings 251 are mechanically secured to front panel 13 . In the exemplary embodiment, the wings are mechanically fastened to the inner frame 132 of the front panel 13 . In particular, a portion of the L-shaped channel 253 disposed parallel to the inner frame 132 is fastened to the stress distributing member 24 using fasteners 254 .

With reference to the width across the stress dispersing member 24, when the weight load of the storage device is applied to the front of the enclosure, the spine 25 can exert a load force on the stress dispersing member 24, and the side walls 15 can each exert support on the end of the stress dispersing member 24 reaction force. Referring to the entire length of the housing, the stress dispersing member 24 and the spine 25 may form a cantilever structure when the weight load of the storage device D is applied to the front of the housing. In an exemplary embodiment, when the storage device D is bisected between the pair of assembly housings 17, the storage device D may exert a substantially constant load across the length of the spine disposed anteriorly.

Furthermore, a side wall 15 is arranged at the rear of the housing. The side wall 15 of the housing abuts the end of the stress dispersing member. In some embodiments, sidewall 15 , bottom plate 11 and upper cover 12 are fastened to stress dissipating member 24 . In this way, the structural integrity of the shell is supported by the stress dispersing members 24 and further by the spine 25 . When a force is applied to any one of the side wall 15, the bottom plate 11, and the upper cover 12, the stress dispersion member 24 may absorb at least a part of the stress generated on the housing by the applied force.

27A-27B are perspective views of side door structures according to one embodiment of the present disclosure. In a further embodiment, the weather strip 30 is disposed between the side door 16 and the jamb of the side door 16 on the housing. The weather strip 30 is configured to prevent the ingress of air from the side door 16 . In some embodiments, the weather strip 30 may act as a barrier to the space between the door frame of the side door 16 and the side door 16 . In the exemplary embodiment, the jambs of the side door 16 are part of the upper cover 12 . The sealing strip 30 is disposed between the bottom plate 11 and the top cover 12 . A weather strip 30 is disposed between the side door 16 and the upper cover 12 , wherein the weather strip 30 is attached to an inner surface of the upper cover 12 . The weather strip 30 is configured to prevent the ingress of air through the space between the side door and the roof.

FIG. 29 is a cross-sectional view of a side door structure according to one embodiment of the present disclosure. In some embodiments, the side door 16 includes a door panel 165 and a sealing wing 164 formed at an angle to the door panel 165 . In some embodiments, the sealing wings 164 are perpendicular to the door panel 65 . In some other embodiments, the angle between the sealing wing 164 and the door panel 165 may be greater or less than 90 degrees. When the angle between the sealing wing 164 and the door panel 165 is greater than 90 degrees, the sealing wing 164 can form a barrier for the gap between the door panel 165 and the upper cover 12 .

The door panel 165 is configured to form an angle when moved away from the corresponding side wall 15 . In other words, the angle between side wall 15 and side door 16 increases when side door 16 is opened and/or removed from the housing. The sealing wings 164 are configured to form an angle when moved away from the corresponding upper cover 12 . In other words, when the side door 16 is opened or moved away from the housing, the angle between the sealing wings 164 and the inner surface of the upper cover 12 increases. In addition, when the side door 16 is opened, the front end of the component housing 17 may be exposed, and a user may access electronic components disposed within the component housing 17 .

In some embodiments, sealing wings 164 form a barrier between the external environment and the peripheral corridor when side door 16 is closed. Although the sealing wings 164 may not directly contact the top cover 12 or the sealing strip 30, they still prevent airflow from the external environment from entering the peripheral corridor, and prevent airflow within the peripheral corridor from escaping the housing. Furthermore, when the side door 16 is closed, depending on the mechanism used, the side door may be stationary. In other words, the side door 16 may cover the front end of the component housing 17 when no force (eg, pulling force) is applied to the side door 16 .

In some embodiments, when the sealing strip 30 is attached to the inner surface of the upper cover 12 and disposed adjacent to the side door 16 , the thickness of the sealing strip 30 is not less than the distance between the upper cover 12 and the sealing wing 164 when the side door 16 is closed. In other embodiments, the sealing wings 164 and the weatherstrip 30 may substantially abut each other when the door is closed.

In some other embodiments, the periphery of the upper cover 12 arranged above the side door 16 can be folded. Therefore, the thickness of the sealing strip 30 can further increase the thickness of the upper cover 12 , and the thickness is not less than the distance between the upper cover 12 and the sealing wing 164 when the side door 16 is closed.

In some other embodiments, the thickness of the sealing strip 30 is less than the distance between the inner surface of the top cover 12 and the top row of the device base 172 . In this way, when the top row of equipment bases 172 is removed from the housing, the weather strip 30 does not obstruct the path of the equipment bases 172 . In some other embodiments, the thickness of the sealing strip 30 is smaller than the distance between the inner surface of the upper cover 12 and the top row of storage drives D. In this way, the sealing strip 30 will not obstruct the path of the storage drives D when the top row of the storage drives D is removed from the housing.

In some embodiments, the stress dispersing member 24 may include a pair of door stops 245 that protrude from a region of the stress dispersing member 24 disposed between the side door 16 and the assembly housing 17 . The door stop 245 is configured to seal the gap between the side door 16 and the side wall 15 .

Figure 6 shows the front panel 13 disassembled according to one embodiment of the present disclosure. The front panel 13 includes an outer frame 131 and an inner frame 132 opposite to the outer frame 131 . A plurality of air inlets 133 are formed on the outer frame 131 through holes. A plurality of air outlets 134 are formed on the inner frame 132 through perforations. The front panel 13 may be mounted to the server system 100 by coupling the inner frame 132 between the side of the component case 17 and the bottom plate 11 . In other words, the component housing is tight against the inner frame. In some other embodiments the component housing is also arranged to be fastened to the front panel 13 . And the outer frame 131 is coupled to the inner frame 132 to form the collection space CS. In some embodiments, the collection space CS is formed between the outer frame 131 and the inner frame 132 . In some embodiments, the collection space CS is arranged to collect particles from the external environment. However, use of the collection space CS is not limited thereto. A plurality of air inlets 133 are arranged on the outer frame 131 . In addition, the plurality of air intakes 133 include a main air intake 133a disposed on the front surface of the front panel 13 and a secondary air intake 133b disposed at the top and/or lower portion. That is, the primary air intake 133 a and the secondary air intake 133 b are arranged on different faces of the front panel 13 . A plurality of air outlets 134 are arranged on the side of the inner frame 132 of the front panel 13, thus corresponding to the two peripheral corridors FC in position. In some embodiments, the perforations on the inner frame 132 (ie, the plurality of air outlets 134 ) are formed in a region of the inner frame 132 projected to face the extension of the stress spreading member 24 . Specifically, a plurality of air outlets 134 are formed in an area of the inner frame 132, that is, an area disposed between the front end of the component housing and the side door. In some embodiments, the perforated area of the outer frame is larger than the perforated area of the inner frame. In contrast, the total area of the plurality of air inlets 133 is larger than the total area of the plurality of air outlets 134 because this compresses the air and increases the flow around the plurality of air outlets 134 .

In one embodiment of the present disclosure, FIG. 7 shows that if the secondary air inlet 133b is arranged on the top of the front panel 13, the upper cover 121 of the storage area includes an upper cover through hole 1211, and the upper cover through hole 1211 is located in the position It corresponds to the secondary air inlet 133b. Accordingly, air may be drawn into the collection space CS of the front panel 13 through the upper cover through hole 1211 of the storage area upper cover 121 . In another embodiment of the present disclosure, FIG. 8 shows that if the secondary air inlet 133b is arranged at the bottom of the front panel 13, the bottom plate 11 contains a bottom plate through hole 111, and the bottom plate through hole 111 is in the same position as the secondary air intake. Port 133b corresponds. Accordingly, air may be sucked into the collection space CS of the front panel 13 through the chassis through-hole 111 of the chassis 11 . Returning to FIG. 7 , in one embodiment of the present disclosure, each side door 16 includes a ladder-like structure 163 that divides the door 16 into an upper door portion 16U and a lower door portion 16L, and the lower door portion 16L is recessed into the server system relative to the upper door portion 16U 100 in. Therefore, as shown in FIG. 1, when the server system 100 is completely located in the server rack 500, the side door 16 is configured to accommodate the rack slide rail 600 below the ladder structure 163, so that the total weight of the server system 100 can be adjusted without When the rack slide rails 600 are fixed to the door 16 , they are evenly distributed between the front panel 13 and the rear panel 14 .

FIG. 9 is a side view of the server system 100 with the side door 16 opened according to one embodiment of the present disclosure. The server system 100 shown in FIG. 9 is a 2U rack server unit, and each housing frame structure 171 of the two component enclosures 17 is configured to carry twelve equipment chassis 172, thus twelve electronic equipment D. Thus, a server system 100 with two component enclosures 17 is configured to load twelve electronic devices D on each side, for a total of twenty-four electronic devices D, each weighing approximately 630 grams. In some embodiments, the housing is capable of supporting a weight of approximately 15 kilograms of electronic equipment inserted into the housing. In particular, the skeleton of the enclosure allows the enclosure to support a load of 15 kg while being suspended from the server rack. Furthermore, in some other embodiments, the skeleton of the enclosure allows the enclosure to support loads in excess of 15 kg at the front when the enclosure is suspended from the server rack. Among them, other load sources besides storage devices may be included. In some other embodiments, the housing can support a suspended load greater than 15 kg (ie with a front portion of about 21 kg load weight). However, embodiments are not limited thereto. In some embodiments, the load limit of the enclosure may vary depending on the size and material of the enclosure. A plurality of tray air holes 1721 are arranged in the front of the device chassis 172 in the assembly housing 17 . Since both the air outlet 134 and the holder air hole 1721 are in communication with the peripheral corridor FC, the air sucked by the fan module 19 is allowed to flow into the equipment base 172 from the collection space CS. The length Ld of the door 16 is equal to or greater than the length Ls of the module casing 17, which not only protects the module casing 17 from dust, but also ensures that when the side door 16 is closed, the peripheral corridor FC defined in the side door 16 communicates with all trays. Air holes 1721 are provided so that all air from the plurality of air outlets 134 can flow into the component housing 17. Since the side door 16 should be longer than the module housing 17, the side wall 15 does not overlap the module housing 17. Although in this embodiment, the length Ls of the component housing 17 is equal to the length of the housing frame structure 171 . In another embodiment where the receiving frame structure 171 is not provided, the length Ls may represent the total length of the plurality of electronic devices D installed on one side of the server system 100 .

According to an embodiment of the present disclosure, FIG. 10 shows one of the component housings 17 with the circuit board 18 behind; FIG. 10-1 is a cross-sectional view of A-A of FIG. 10 ; and FIG. 11 shows one of the receiving frame structures 171 . As shown in FIG. 10 , twelve electronic devices D in the accommodation frame structure 171 are horizontally arranged in three (columns) by four (rows). It should be noted that in this disclosure, rows are vertical and columns are horizontal. Referring to FIG. 11 , the receiving frame structure 171 includes three vertical partitions 1711 and a plurality of lateral rails 1712 , and each vertical partition 1711 has a double-layer structure on which a plurality of lateral rails 1712 are integrated. Returning to FIG. 10-1 , when the air extracted from the peripheral corridor FC enters the component housing 17 through the bracket air hole 1721 on the device base 172 , the air passes through the channel P around the electronic device D. In an embodiment, the channel P is defined by the space above the electronic device D. As shown in FIG. When the air flows through the channel P, the air is in direct contact with the electronic device D, thus taking most of the heat from the top of the electronic device D. After flowing through the channel P, the air leaves the component housing 17 and enters the central gallery via holes 181 in the circuit board 18 located behind the component housing 17 .

Figure 28 is a perspective view of a storage module according to one embodiment of the present disclosure. The memory module may be formed from a component housing 17 and a circuit board 18 . In some embodiments, the circuit board 18 is perforated to form a plurality of holes 181 . A plurality of holes 181A may be formed on the planar outline of the circuit board 18 . In some embodiments, the plurality of holes 181A is in an array. When the circuit board 18 covers the rear end of the component housing 17, a plurality of holes 181 may be arranged to expose the rear end of the storage component. In some embodiments, the plurality of holes 181B are further formed by the circuit board 18 in combination with the component housing 17 . In the exemplary embodiment, a portion of aperture 181B is formed by a notch 185 on the periphery of circuit board 18 and a corresponding peripheral side 175 on the rear end of component housing 17 . In the exemplary embodiment, the number of holes 181 of the circuit board 18 is the same as the number of storage components that the component housing 17 can carry. Further, the bottom area of the circuit board and the component casing may also form a plurality of holes. However, the number of holes is not limited thereto. In some embodiments, the number of holes may be greater or less than the number of storage components that the component housing can carry, depending on the arrangement of the holes in the circuit board.

In some other embodiments, the component housing 17 also includes wings 176 extending from the sides of the component housing 17 . In some embodiments, the wings 176 may overlap the front panel 13 and the stress distributing member 24 respectively. Further, the wing portion 176 can correspond to fasten the top surface of the front panel 13 and the top surface of the stress dispersing structure 24 .

FIG. 12 illustrates FIG. 10 without device mount 172 and electronic device D shown, according to one embodiment of the present disclosure. As shown in FIG. 12 , when all the device chassis 172 and the electronic device D are removed from the receiving frame structure 171 of the component case 17 , the circuit board 18 arranged behind can be seen from the front of the component case 17 . In other words, the accommodating frame structure 171 is in the shape of a box, its front side is empty, and its back side is the circuit board 18 . In one embodiment, a circuit board 18 includes multiple rows of holes 181 , and the number of rows of holes 181 corresponds to the number of rows of electronic devices D. As shown in FIG. In other words, each row of device mounts 172 with electronic devices D may have a row of holes 181 behind it. Therefore, the air passing through the passage P of the module housing 17 can efficiently flow into the central corridor without being horizontally pooled. In one embodiment of the present disclosure, the hole 181 at least includes a primary hole 1811 and a secondary hole 1812 . As shown in FIG. 12 , the primary hole 1811 is arranged on the non-edge portion of the circuit board 18 , and the secondary hole 1812 is arranged on the edge portion of the circuit board 18 . In other words, the primary hole 1811 is a hole on the circuit board 18 , and the secondary hole 1811 is a notch at the edge of the circuit board 18 . In one embodiment of the present disclosure, the circuit board 18 includes at least one secondary hole 1812 at its top edge. In another embodiment, the circuit board 18 includes secondary holes 1812 at both its top and bottom edges. In yet another embodiment, the circuit board 18 also includes a plurality of driver connectors 182 configured to couple to the electronic device D. As shown in FIG. Since the driver connectors 182 are one of the main components that accumulate heat, each driver connector 182 is arranged near any hole 181 to effectively cool it. Although the holes 181 are shown as being long and narrow, it should be understood that the shapes of the holes 181 are practically unlimited as long as they allow the air from the passage P to pass through. For example, each hole 181 could be replaced by a plurality of equivalent circular holes.

FIG. 13 is an enlarged view of a part of FIG. 8 (PE dotted line area) according to an embodiment of the present disclosure. The stress dispersing member 24 is arranged between the sidewalls 15 and transversely on the base 11 from one side to the other side of the server system 100 , and is configured to increase the structural strength of the bottom plate 11 of the server system 100 . The stress dispersing member 24 includes a frame 241 and a plurality of spacers 242 . The stress distributing member 24 is perforated to form a plurality of openings 243 . A plurality of openings 243 are defined between the plurality of dividers 242 within the skeleton 241 . In some embodiments, the plurality of openings 243 are aligned with the lateral spacing between the circuit boards. In other words, the area of the stress dispersing member aligned with the central corridor is perforated. The plurality of openings 243 not only allow the air drawn by the fan module 19 from the central corridor to pass through the stress dispersing member 24, but also allow the cables (not shown) coupled to the circuit board 18 to pass through so that the cables can be coupled to motherboard. The server system 100 also includes a second support 25 arranged between the component housings 17 and perpendicular to the stress dispersing member 24 and the front panel 13 . Furthermore, the second support 25 comprises a web 251 and a plurality of wings 252 . The web 251 arranged between the front panel 13 and the stress dispersing member 24 has two ends; one end of the web 251 extends toward the front panel 13 , and the other end of the web 251 extends toward the stress dispersing member 24 . A plurality of wings 252 extend vertically at both ends of the web 251 and are configured to couple the second support 25 to the stress dissipating member 24 and the inner frame 132 , so that the server system 100 is increased by the second support 25 The structural strength between the stress dispersing member 24 and the front panel 13 is improved. It should be noted that the second support 25 does not have to be in direct contact with the bottom plate 11 . However, the second support 25 may be directly connected to the base plate 11 and/or the component housing 17 to further enhance the structure of the server system 100 . In one embodiment of the present disclosure, the second support 25 includes two wings 252 at each end. At one end near the stress distributing member 24, two wings 252 are each coupled to one of the dividers 242 of the stress distributing member 24, allowing air and cables (not shown) from the circuit board 18 to pass therebetween. At the end near the front panel 13 , cables (not shown) from the UI module 23 pass between the wings 252 . In conclusion, the cables from the circuit board 18 and the UI module 23 can be arranged neatly between the wings 252 of the second support 25 .

According to an embodiment of the present disclosure, Fig. 14 shows a front view of the front panel 13; Fig. 15 is a simplified schematic diagram of the B-B section of Fig. 14 . The server system 100 also includes a UI module 23 installed in the middle between the outer frame 131 and the inner frame 132 of the front panel 13, thereby at least partially dividing the collection space CS into two equal parts. Furthermore, the UI module 23 is configured to separate the collection space CS from the central corridor.

FIG. 16 shows the server system 100 , and FIG. 17 shows an enlarged view of a part of FIG. 16 (PE dotted line area). In one embodiment of the present disclosure, in the peripheral corridor FC, the floor 11 further includes a surface protrusion 112 between the component housing 17 and the side door 16 corresponding to the component housing 17 . That is to say, the surface protrusion 112 protrudes from the plane of the base plate 11 and is disposed between the front end of the component case 17 and the periphery of the base plate 11 . When the device base 172 and the electronic device D in the bottom row of the component housing 17 are inserted into or pulled out of the housing frame structure 171, the surface protrusions 112 are configured to support the device base 172 and the electronic device D in the bottom row, thereby preventing the device base 172 and the electronic device D in the bottom row. The lower row of drive brackets 172 rubs against the base 11 due to the weight of the electronic device D .

As shown in FIG. 8 , in one embodiment of the present disclosure, the fan module 19 includes a fan frame 191 and a plurality of fan units 192 disposed therein. Figure 18 shows a server system 100 with a fan bracket 20, and Figure 19 shows an enlarged view of a part of Figure 18 (PE dotted line area); Figure 20 is a front view of the fan module 19, and Figure 21 is a fan module 19 Figure 22 is a simplified schematic diagram of the C-C section of Figure 4. In one embodiment of the present disclosure, a pair of fan brackets 20 are fixed to the side wall 15 without being directly connected to the bottom plate 11 . In other words, the pair of fan brackets 20 are suspended relative to the bottom plate 11 . Each fan bracket 20 includes a guide structure 201 configured to be coupled to the fan module 19 . As shown in FIG. 20 , the fan frame 191 of the fan module 19 includes two inner recesses 1911 respectively arranged on two sides of the fan frame 191 , and each inner recess 1911 looks like a gap at each lower corner. In FIG. 21 , the fan frame 191 further includes two receiving structures 1912 integrated into the inner recess 1911 , and the receiving structures 1912 are configured to receive the guide structures 201 of the fan bracket 20 . As shown in FIG. 19 , the guiding structure 201 may be an upward protrusion standing vertically relative to the bottom plate 11 ; as shown in FIG. 21 , the receiving structure 1912 may be a hole located in the inner recess 1911 facing downward. Therefore, the fan frame 191 of the fan module 19 can be guided for installation to the server system 100 through the alignment between the receiving structure 1912 and the corresponding guiding structure 201 . It should be noted that the recessed portion 1911 of the fan frame 191 is not only configured to guide the installation of the fan bracket 20 through the receiving structure 1912 formed thereon, but also to allow the cables 26 from the circuit board 18 and the UI module 23 to be routed from the fan. The corner between the module 19 , the side wall 15 and the bottom plate 11 bypasses the fan module 19 . As shown in FIG. 22 , the cable channel CC defined between the side wall 15 , the bottom plate 11 and the recessed portion 1911 of the fan frame 191 is configured to accommodate cables extending from the circuit board 18 and the UI module 23 to the rear of the fan module 19 . cable 26 from the motherboard. Therefore, the cable bypasses the fan module 19 through the cable channel CC under the concave portion 1911 . In another embodiment, a plurality of fan units 192 can be installed to the server system 100 without the fan frame 191 , wherein the plurality of fan units 192 are arranged in a door-to-door direction of the server system 100 .

FIG. 23 is an enlarged view of a part of FIG. 9 (PE dotted line area). In one embodiment of the present disclosure, side door 16 may include at least one seal 161 . As shown in FIG. 9 , the side door 16 includes two seals 161 on its inner surface and also includes a hinge 162 coupled to the upper cover 12 . Thus, the side door 16 can be opened by lifting the end close to the base 11 . However, in another embodiment, the door hinge 162 can also be coupled to the base 11 , so that the side door 16 can be opened by lowering the end close to the upper cover 12 . When the side door 16 is closed, one seal 161 is disposed near the door 16 relative to the base 11 , and the other seal 161 is disposed near the door 16 relative to the upper cover 12 . In other words, one seal 161 is mounted near the hinge 162 and the other seal 161 is mounted away from the hinge 162 .

In one embodiment of the present disclosure, the size of the plurality of electronic devices D is 3.5 inches. 3.5-inch storage drives generally outperform 2.5-inch storage drives in terms of cache size, RPM (revolutions per minute), maximum storage capacity, data transfer speed, and price. However, a 3.5-inch storage drive has higher power consumption than a 2.5-inch storage drive and therefore has a higher operating temperature. Combined with the high operating temperature and the tightly packed component housing 17 of the 3.5 inch electronics D, the cooling of the server system 100 becomes a very serious problem. According to the cooling test results shown in Fig. 24, the cooling arrangement in Fig. 5 cooled the electronic device D in operation, wherein the maximum temperature difference between the electronic devices D was 2.9 degrees Celsius, and the highest temperature was 45.7 degrees Celsius. The lower maximum temperature difference indicates that the cooling of the electronic device D is uniform and balanced, while the maximum temperature below 50 degrees Celsius can meet the safety and stability of general industry standards. It should be noted that the air between the fan module 19 and the front panel 13 in the server system 100 is a laminar flow, and the air between the fan module 19 and the rear panel 14 is a turbulent flow, and the same cooling arrangement can also be applied For a 2.5-inch electronic device D, as long as the device base 172 and the electronic device D occupy more than 70% of the physical volume of the receiving frame structure 171 .

Additionally, a 3.5-inch storage drive weighs about four times as much as a 2.5-inch storage drive. Therefore, as shown in FIG. 3 , carrying twenty-four 3.5-inch electronic devices D on the front FP of the server system 100 exerts great pressure on the bottom plate 11 . FIG. 25 shows a server system 100 with a support 27, according to one embodiment of the present disclosure. To further enhance the structural strength of the bottom plate 11 , in addition to the stress dispersing member 24 and the second support 25 , a support 27 may be included in the central gallery and coupled between the stress dispersing member 24 and the inner frame 132 . According to an embodiment of the present disclosure, the server system 100 may include at least any one or any combination of the stress dispersing member 24 , the second support 25 and the support 27 .

It should be noted that although all exemplary illustrations are based on 2U rack servers, any embodiments of the present disclosure may be applied to other rack servers of different sizes, such as 4U, 6U, and 8U racks style server.

30A-30J are perspective views of a rack-mounted server system according to one embodiment of the present disclosure. In some embodiments, rack rail 600 (shown in FIG. 1 ) includes outer rail 601, inner rail 602 mechanically attached to outer rail 601, and support brackets 603a, 603b, 603c, and 603d mechanically attached to on the inner slide rail 602. In some embodiments, the inner slide rail 602 is configured to move mechanically along the outer slide rail 601 . In some embodiments, the supporting frame 603a (as shown in FIG. 30A ) can be a flat-panel bracket with one end fixed on the inner slide rail 602 and the other end fixed on the outer shell 100 . In an exemplary embodiment, the support frame 603a is fastened to the sidewall of the housing 100 . The board support may be an L-shaped board support. In some embodiments, the support frame 603b (as shown in FIG. 30E ) may be a triangular support frame with one side fixed on the inner slide rail 602 and the other side fixed on the outer shell 100 . Further, gusset plates are fixed to both ends of the support frame 603b. In an exemplary embodiment, the support frame 603b is fastened to the back panel of the housing 100 . In some embodiments, the support frame 603c (as shown in FIG. 30G ) may be a triangular support frame, one side of which is fixed on the inner slide rail 602 and the other side is fixed on the outer shell 100 . In an exemplary embodiment, the support frame 603c is fastened to the back panel of the housing 100 . In addition, the support frame 603c has two gussets. The first gussets are fixed at the ends on both sides. The second gusset is secured between the first gusset and the side of the inner slide rail 602 secured thereto. In some embodiments, the support frame 603d (as shown in FIG. 30I ) may be a triangular support frame with one side fixed on the inner slide rail 602 and the other side fixed on the outer shell 100 . Further, gusset plates are fixed to both ends of the support frame 603d. Also, the support frame 603d has a flange extending from one side fastened to the inner slide rail 602 . One end of the flange is fixed on the side wall of the housing 100 .

The embodiments shown and described above are examples only. Many details are routinely encountered in the art and therefore have not been shown or described. Even though numerous features, advantages, and structural and functional details of the technology have been set forth in the foregoing description, this disclosure is merely illustrative of the technology and changes may be made in the details, particularly in the principles of the disclosure and claims. Changes in shape, size and arrangement of parts are within the full scope of the broad meaning of the term used. It will therefore be understood that the above-described embodiments may be modified within the scope of the claims.

Claims (25)

1. A shell, characterized in that, comprising: floor; The upper cover is arranged on the bottom plate; A pair of side walls, a pair of side doors and a front panel are arranged between the bottom plate and the upper cover, wherein said pair of side doors are arranged perpendicular to said front panel, each of the pair of side doors is disposed generally in alignment with one of the pair of side walls, a rear portion is defined by an area between the pair of side walls and a front portion is defined by an area between the pair of side doors; a pair of component housings, arranged at the front, wherein each said component housing has a front end facing one of said side doors and a rear end facing the other said side door; and a pair of circuit boards respectively covering said rear end of said component housing, wherein each of the circuit boards is perforated to form a plurality of holes, a central corridor defined by the distance between the pair of circuit boards, the plurality of apertures are configured to allow air exhausted from the front end of the component housing to flow toward the central gallery, The plurality of holes are used to expose the rear end of the storage component received by the assembly housing. 2. The housing of claim 1, further comprising: a stress dispersing member traversing the entire width of the base plate, The stress dispersing member is arranged perpendicular to the pair of side walls and the pair of side doors. 3. A shell, characterized in that, comprising: floor; The upper cover is arranged on the bottom plate; A pair of side doors and a front panel are arranged between the bottom plate and the upper cover, Wherein, the front portion is defined between the pair of side doors; a stress dispersing member traversing the entire width of said floor; a pair of component housings disposed between the stress dispersing member and the front panel; wherein each of said component housings has a front end and a rear end relative to said front end, an end of said stress distributing member extends beyond said front end of the associated component housing, The front end of the module housing, the side door, the upper cover, the bottom plate, and the extended portion of the stress dispersing member form a gap. 4. The housing of claim 1, further comprising: a pair of circuit boards is disposed between the pair of assembly housings, and each of the pair of circuit boards is at an angle to the base plate, wherein each of said circuit boards is perforated to form a plurality of holes, a central corridor defined by the distance between the pair of circuit boards, said front end of said module housing is perforated to allow air from outside said module housing to flow through said holes to said central gallery, The aperture is disposed along the rear end of the component housing. 5. A shell, characterized in that, comprising: floor; The upper cover is arranged on the bottom plate; a front panel, arranged between the bottom plate and the upper cover; a stress dispersing member spanning the entire width of the base plate and fastened to the base plate and the upper cover, wherein a front portion is defined between the front panel and the stress dispersing member; a pair of component housings, arranged at the front, Each of the component housings has a front end facing outside of the housing and a rear end facing inwardly of the housing, wherein an end of the stress dispersing member extends beyond the front end of the component housing; and a pair of circuit boards respectively covering the rear end of the component housing, wherein each of the circuit boards is perforated to form a plurality of holes, a central corridor defined by the distance between the pair of circuit boards, the plurality of apertures are configured to allow air exhausted from the front end of the component housing to flow toward the central gallery, The plurality of holes are used to expose the rear end of the storage component received by the assembly housing. 6. A shell, characterized in that it comprises: floor; a stress dispersing member, traversing the entire width of the base plate, wherein the stress dispersing member forms a barrier between the front and rear of the floor; a pair of component housings disposed at the front and adjacent to the stress dispersing member, wherein each of said component housings has a front end and a rear end relative to said front end, each of said component housings is configured to arrange receiving electronic devices in a stacked array, wherein an end of the stress dispersing member extends beyond the front end of the component housing; and a pair of circuit boards disposed between the pair of assembly housings, each of the circuit boards being disposed at an angle to the base plate, wherein each of the circuit boards is perforated to form a plurality of holes, a central corridor defined by the distance between the pair of circuit boards, said front end of said module housing is perforated to allow air from outside said module housing to flow to said central gallery through associated holes, The aperture is disposed along the rear end of the component housing. 7. The casing according to claim 3, 5 or 6, further comprising: A pair of side walls secures the ends of the stress dispersing member. 8. The housing of claim 6, further comprising: The upper cover is arranged on the bottom plate; Wherein the bottom plate and the upper cover fasten the stress dispersion member. 9. The casing according to claim 2, 3, 5 or 8, further comprising: a pair of side doors mechanically connected to the upper cover and configured to form an angle away from the enclosure, wherein a peripheral corridor is defined by a space between said front end of said component housing, one of said side doors, and a portion of said stress dispersing member, Wherein, the stress dispersing member forms a sealed end of the associated peripheral corridor. 10. The housing of claim 9, wherein the stress dispersing member comprises a pair of door stops protruding from the region of the stress dispersing member and disposed between the side door and the assembly housing, The door stop is configured to seal a gap between the side door and the side wall. 11. The enclosure of claim 9, wherein each of said side doors comprises: the door panel is configured to form an angle away from the housing; and The sealing wings are configured to form an angle away from the upper cover. 12. The housing of claim 11, further comprising: A sealing strip is arranged between the side door and the upper cover, and the sealing strip is configured to prevent air from entering through the space between the side door and the upper cover. 13. The casing according to claim 12, wherein the thickness of the sealing strip is not less than the distance between the upper cover and the sealing wing when the side door is stationary. 14. The housing of claim 8, further comprising: The front panel is arranged between the bottom plate and the periphery of the upper cover. 15. The housing of claim 1 , 3, 5 or 14, wherein the front panel comprises: frame; and an inner frame opposite to the outer frame; Wherein a collecting space is formed between the outer frame and the inner frame, wherein the component housing adjoins the inner frame, The perforated area of the outer frame is larger than the perforated area of the inner frame, Wherein the inner frame is perforated in a region extending beyond the front end of the component housing. 16. The housing of claim 2, 3, 5 or 6, further comprising: A spine, disposed between the stress dispersing member and the base plate, is mechanically attached to the base plate, arranged perpendicular to the stress dispersing member, and extending in opposite directions of the stress dispersing member. 17. The housing of claim 16, wherein the stress dispersing member comprises: A fixing bracket forming an arch at the bottom of the stress dispersing member, the spine passing through a gap formed between the fixing bracket and the deck. 18. The housing of claim 1 , 3, 5 or 8, wherein each of said component housings has a top surface and a bottom surface fastened to said upper cover and said bottom plate, respectively. 19. The housing of claim 1, 3, 5 or 8, wherein each of said component housings is configured to receive electronic devices in a stacked array. 20. The housing of claim 2, 4, 5 or 6, wherein the area of the stress dispersing member aligned with the central gallery is perforated. 21. A housing as claimed in claim 2, 3, 5 or 6, wherein the stress dispersing member and the component housing are arranged adjacent to each other. 22. The enclosure of claim 2, 3, 5 or 6, wherein the stress distributing member is configured as a cantilever for the enclosure when a portion of the enclosure is suspended. 23. The housing of claim 2, 3, 5 or 6, wherein the center of gravity of the housing is located at the front. 24. The housing of claim 1, 4, 5 or 6, wherein said pair of circuit boards are substantially perpendicular to said base plate. 25. The housing of claim 1, 4, 5 or 6, wherein said circuit board abuts said rear end of said component housing.

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