CN115576390A

CN115576390A - Server system

Info

Publication number: CN115576390A
Application number: CN202110760034.0A
Authority: CN
Inventors: 王建文; 简汉钟; 林圣展; 徐浩翔; 林炯玮; 陈安信
Original assignee: Chenbro Micom Co Ltd
Current assignee: Chenbro Micom Co Ltd
Priority date: 2021-07-06
Filing date: 2021-07-06
Publication date: 2023-01-06

Abstract

A server system. A housing comprising a base plate; the upper cover is arranged on the bottom plate; a pair of side walls, a pair of side doors, and a front panel disposed between the bottom panel and the top cover, wherein the pair of side doors are disposed perpendicular to the front panel, each of the pair of side doors is disposed in alignment with one of the pair of side walls, and the housing has a rear portion defined by a region between the pair of side walls and a front portion defined by a region between the pair of side doors; a pair of module housings disposed at the front, wherein each module housing has a front end facing one of the side doors and a rear end facing the other side door; and a pair of circuit boards covering the rear ends of the component housings, respectively, wherein each circuit board is perforated to form a plurality of holes, the central corridor being defined by a distance between the pair of circuit boards, the plurality of holes being configured to allow air exhausted from the front ends of the component housings to flow toward the central corridor, the plurality of holes for exposing the rear ends of the storage parts received by the component housings.

Description

Server system

Technical Field

The present disclosure relates generally to server systems and modules and components therein. More particularly, the present disclosure relates to a novel cooling arrangement for a server system that allows side-entry storage drives to better cool the server system.

Background

In conventional arrangements, the server systems are typically mounted like drawers from the front of the server system rack, so it is intuitive to place most of the storage drives of the server systems in locations near the user for pick and place. In other words, the storage drives (e.g., hard disk drives) are typically disposed at the front of the server system, and thus are typically plugged in and out of the front or top surface of the server system. However, due to the industry-specified width and height, the number of storage drives that are inserted from the front of the server system is naturally limited by the size of the front area; a storage drive that is inserted from the top of the server system requires the user to insert or remove the drive from above the server system, which is inconvenient. On the other hand, inserting from the side of the server system (e.g., the flank of the server system body) increases the number of storage drives while allowing easy access to each storage drive. However, more storage drives means more heat is generated within the server system. In addition, at the industry-specified widths and heights, having more storage drives also means less cooling space available. Thus, side-entry storage drives typically have heat dissipation problems, which is highly undesirable for server systems.

The present disclosure provides a new arrangement of a side-entry server system incorporating enhanced thermal management capabilities.

Disclosure of Invention

In view of the above, there is a need for a housing with enhanced thermal management capabilities.

According to the present disclosure, a housing is provided. The housing includes a floor; the upper cover is arranged on the bottom plate; a pair of side walls, a pair of side doors, and a front panel disposed between the bottom panel and the top cover, wherein the pair of side doors are disposed perpendicular to the front panel, each of the pair of side doors being disposed generally aligned with one of the pair of side walls, the outer housing having a rear defined by a region between the pair of side walls and a front defined by a region between the pair of side doors; a pair of module housings disposed in said front portion, wherein each of said module housings has a front end facing one of said side doors and a rear end facing the other of said side doors; and a pair of circuit boards covering the rear ends of the component housings, respectively, wherein each of the circuit boards is perforated to form a plurality of holes, a central gallery defined by a distance between the pair of circuit boards, the plurality of holes configured to allow air exhausted from the front ends of the component housings to flow toward the central gallery, the plurality of holes for exposing rear ends of storage components received by the component housings.

In one embodiment, the housing further comprises a stress dispersing member across the entire width of the bottom plate, the stress dispersing member being arranged perpendicular to the pair of side walls and the pair of side doors.

According to the present disclosure, a housing is provided. The housing includes a floor; the upper cover is arranged on the bottom plate; a pair of side doors and a front panel disposed between the bottom panel and the upper cover, wherein a front portion is defined between the pair of side doors; a stress dispersion member traversing an entire width of the chassis, a pair of component housings disposed between the stress dispersion member and the front panel; wherein each of the component housings has a front end and a rear end opposite to the front end, an end portion of the stress dispersion member extends beyond the front end of the component housing, and portions of the component housings, at which the front end, the side door, the upper cover, the bottom plate, and the stress dispersion member extend, form a bend.

In one embodiment, the housing further comprises a pair of circuit boards disposed between the pair of component housings and each of the pair of circuit boards is at an angle to the bottom plate, wherein each of the circuit boards is perforated to form a plurality of holes, a central gallery is defined by a distance between the pair of circuit boards, the front end of the component housing is perforated to allow air from outside the component housing to flow through the holes to the central gallery, the holes being disposed along the rear end of the component housing.

According to the present disclosure, a housing is provided. The housing includes a floor; the upper cover is arranged on the bottom plate; a front panel disposed between the base plate and the upper cover, a stress dispersion member traversing an entire width of the base plate and secured to the base plate and the upper cover, wherein the front panel and the stress dispersion member define a front therebetween; a pair of component housings disposed at the front portion, each of the component housings having a front end facing out of the housing and a rear end facing into the housing, wherein ends of the stress dispersing member extend beyond the front end of the component housing; and a pair of circuit boards covering the rear ends of the component housings, respectively, wherein each of the circuit boards is perforated to form a plurality of holes, a central gallery defined by a distance between the pair of circuit boards, the plurality of holes configured to allow air exhausted from the front ends of the component housings to flow toward the central gallery, the plurality of holes for exposing rear ends of storage components received by the component housings.

According to the present disclosure, a housing is provided. The housing includes a floor; a stress dispersion member traversing the entire width of the base plate, wherein the stress dispersion member forms a barrier between the front and rear portions of the base plate; a pair of assembly housings disposed at the front and abutting the stress distributing member, wherein each of the assembly housings has a front end and a rear end opposite the front end, each of the assembly housings being configured to arrange received electronic devices in a stacked array, wherein ends of the stress distributing member extend beyond the front end of the assembly housing; and a pair of circuit boards disposed between the pair of component housings, each of the circuit boards disposed at an angle to the base plate, wherein each of the circuit boards is perforated to form a plurality of holes, a central gallery defined by a distance between the pair of circuit boards, the front end of the component housing is perforated to allow air from outside the component housing to flow through the holes to the central gallery, the holes being disposed along the rear end of the component housing.

In one embodiment, the housing further comprises a pair of side walls securing the ends of the stress dispersing member.

In one embodiment, the housing further comprises an upper cover disposed on the base plate; wherein the base plate and the upper cover fasten the stress dispersion member.

In one embodiment, the housing further comprises a pair of side doors mechanically connected to the top cover and configured to angle away from the housing, wherein a peripheral gallery is defined by a space between the front end of the assembly housing, one of the side doors, and a portion of the stress dispersing member, wherein the stress dispersing member forms a sealed end of the peripheral gallery.

In one embodiment, a pair of door stops protrude from an area of the stress distributing member and are disposed between the side door and the assembly housing, the door stops being configured to seal a gap between the side door and the side wall.

In one embodiment, wherein each of the side doors includes a door panel that is angled away from the housing; and the sealing wing part forms an angle when being configured to be far away from the upper cover.

In one embodiment, the housing further comprises a sealing strip disposed between the side door and the upper cover, the sealing strip configured to prevent air from entering through a space between the side door and the upper cover.

In one embodiment, the thickness of the sealing strip is not less than the distance between the upper cover and the sealing wing portion when the side door is at rest.

In one embodiment, the housing further comprises a front panel disposed between the bottom panel and the periphery of the top cover.

In one embodiment, wherein the front panel comprises an outer frame; and the inner frame is opposite to the outer frame; wherein a collection space is formed between the outer frame and the inner frame, wherein the assembly housing abuts the inner frame, the perforated area of the outer frame being greater than the perforated area of the inner frame, wherein the inner frame is perforated in an area extending beyond the front end of the assembly housing.

In one embodiment, the housing further comprises a spine disposed between the stress distributing member and the base plate, mechanically attached to the base plate, arranged perpendicular to the stress distributing member, and extending in opposite directions of the stress distributing member.

In one embodiment, each of the module housings has a top surface and a bottom surface secured to the top cover and the bottom plate, respectively.

In one embodiment, each of the component housings is configured to receive electronic devices in a stacked array.

In one embodiment, the region of the stress dispersing member in alignment with the central gallery is perforated.

In one embodiment, wherein the stress distributing means and the set of component housings are arranged to abut each other.

In one embodiment, wherein the stress dispersing member is configured as a cantilever for the housing when a portion of the housing is suspended.

In one embodiment, wherein the center of gravity of the housing is located at the front.

In one embodiment, wherein the pair of circuit boards are substantially perpendicular to the backplane.

In one embodiment, wherein the circuit board abuts the rear end of the component housing.

The enclosure cools the storage drive therein better than prior art.

Drawings

Fig. 1 is a perspective view of a rack-mounted server system according to one embodiment of the present disclosure.

FIG. 2 is an exploded view of a server system without a rack according to one embodiment of the present disclosure.

Fig. 3 is a perspective view of a server system according to one embodiment of the present disclosure.

Figure 4 is a top view of the door of figure 3 assembled.

Fig. 5 is a simplified schematic diagram of the partial (PL dashed area) layout of fig. 4.

Fig. 6 is an exploded view of a front panel according to one embodiment of the present disclosure.

Fig. 7 is another perspective view of a server system according to one embodiment of the present disclosure.

Fig. 8 is another exploded view of a server system according to one embodiment of the present disclosure.

FIG. 9 is a side view of a server system according to one embodiment of the present disclosure.

Fig. 10 is a front view of a memory module according to one embodiment of the present disclosure.

Fig. 10-1 isbase:Sub>A sectional viewbase:Sub>A-base:Sub>A of fig. 10.

Fig. 11 is a front schematic view of a storage case according to one embodiment of the present disclosure.

Fig. 12 is a front view of a storage case and circuit board according to one embodiment of the present disclosure.

Fig. 13 is an enlarged view of a part (a dotted PE line region) of fig. 8.

Fig. 14 is a front view of a front panel according to one embodiment of the present disclosure.

Fig. 15 is a simplified schematic of section B-B as shown in fig. 14.

Fig. 16 is another perspective view of a server system according to one embodiment of the present disclosure.

Fig. 17 is a partial (PE dotted line region) enlarged view of fig. 16.

Fig. 18 is another perspective view of a server system according to one embodiment of the present disclosure.

Fig. 19 is an enlarged view of a part (a dashed PE line region) of fig. 18.

Fig. 20 is a front view of a fan module according to one embodiment of the present disclosure.

Fig. 21 is a bottom view of a fan module according to one embodiment of the present disclosure.

Fig. 22 is a simplified schematic of section C-C of fig. 4.

Fig. 23 is an enlarged view (PE dotted line region) of fig. 9.

FIG. 24 is a cooling test result of a server system according to one embodiment of the present disclosure.

Fig. 25 is another perspective view of a server system according to one embodiment of the present disclosure.

Fig. 26A-26E are perspective views of a bone structure according to one embodiment of the present disclosure.

27A-27B are perspective views of side door structures according to one embodiment of the present disclosure.

Fig. 28 is a perspective view of a storage module according to one embodiment of the present disclosure.

FIG. 29 is a cross-sectional view of a side door structure according to one embodiment of the present disclosure.

Figures 30A-30J are perspective views of a rack-mounted server system according to one embodiment of the present disclosure.

Description of the main elements

The following detailed description will further illustrate the disclosure in conjunction with the above-described figures.

Detailed Description

For simplicity and clarity of illustration, it should be understood that where the disclosure is considered appropriate, reference numerals have been repeated among the figures to indicate corresponding or analogous elements. In addition, this disclosure sets forth numerous specific details to provide a thorough understanding of the described embodiments of the disclosure. However, it will be understood by those of ordinary skill in the art that the embodiments described in the present disclosure may be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the relevant features that are being described. Furthermore, the following description should not be considered as limiting the scope of the embodiments described in this disclosure. The figures are not necessarily to scale and certain portions may be exaggerated in scale to better illustrate the details and features of the present disclosure.

Fig. 1 illustrates a server system 100 mounted to a server rack 500, according to one embodiment of the present disclosure; FIG. 2 shows an exploded view of the server system 100 without the server rack 500; fig. 3 shows an arrangement in the server system 100. Referring to fig. 2 and 3, the server system 100 includes a base plate 11, an upper cover 12, a front panel 13, a rear panel 14 parallel to the front panel 13, a pair of side walls 15 parallel to each other, two side doors 16 parallel to each other, two component housings 17 (e.g., storage modules), two circuit boards 18, a fan module 19, a pair of fan brackets 20, a motherboard insulator 21, a motherboard (not shown), and a power module 22. The pair of side walls 15 are arranged perpendicular to the back plate 14 and the stress dispersion member 24. Further, the pair of side walls 15 are arranged perpendicularly to the front panel 13. In some embodiments, the housing also includes two side doors 16 that are parallel to each other. The pair of side doors 16 is arranged perpendicular to the front panel 13 and the stress dispersion member 24. Further, the pair of side doors 16 is arranged perpendicular to the rear panel 14. Each side door of the pair of side doors 16 is disposed in alignment with a corresponding side wall 15. In one embodiment, the bottom plate 11 is a rectangular plate having two long sides and two short sides. The front panel 13 and the rear panel 14 are respectively disposed at one of short sides of the bottom plate 11. A pair of side walls 15 and two side doors 16 are arranged at the long sides of the bottom panel 11, and each long side of the bottom panel 11 has one side wall 15 near the rear panel 14 and one side door 16 near the front panel 13. In some embodiments, the side door 16 is mechanically attached to the housing. In some embodiments, the housing portion forming the mechanical attachment acts as a door frame jamb for side door 16. In an exemplary embodiment, the side doors are hinged to the top cover 12 and are configured to angle away from the housing. Each side wall 15 and the side door 16 located on the same side of the floor 11 are aligned with each other. The side walls 15 and the side doors 16 are provided between the upper cover 12 and the bottom plate 11. The component housing 17, the circuit board 18, the fan module 19, the motherboard insulator 21, the motherboard, and the power module 22 are disposed on the bottom plate 11. The assembly housing 17 contains a housing frame structure 171 (storage case) and a plurality of device mounts 172 (drive trays). The device chassis 172 is configured to carry a plurality of electronic devices D (e.g., storage drives, storage components), and the electronic devices D may be inserted horizontally into the receiving frame structure 171 from the front of the component enclosure 17 together with the device chassis 172. In an embodiment, the device chassis 172 may be integrated into the receiving frame structure 171, so that the receiving frame structure 171 may directly receive the electronic device D. Thus, the device mounts 172 may also be arranged in a stacked array. In some embodiments, the component housing 17 has top and bottom surfaces that are secured to the top cover 12 and the bottom plate 11, respectively. In some other embodiments, the assembly housing 17 has a front end and a rear end opposite the front end. In some other embodiments, the assembly housing 17 has a front end and a rear end opposite the front end. In some embodiments, the component housing 17 comprises a main body, wherein an opening between a front end and a rear end of the main body allows passage between the front end and the rear end of the component housing 17. The module housings 17 are arranged in a back-to-back manner between two side doors 16, and each module housing 17 faces one of the side doors 16. In other words, the component housing 17 faces the long side of the bottom plate 11. The component housing 17 is at a distance from the periphery of the long side of the corresponding base plate 11. Since the assembly housing 17 faces the door 16, the device chassis 172 and the electronic device D cannot be removed from the housing frame structure 171 when the side door 16 is closed. In some embodiments, the front end of the assembly housing 17 is spaced a distance from the side door 16.

In some embodiments, the pair of circuit boards 18 is disposed between the pair of component housings 17. The pair of circuit boards 18 are at a distance from each other. Each circuit board 18 is arranged vertically with respect to the backplane 11 on the rear side of one of the component housings 17, so that the circuit board 18 stands behind the respective two component housings 17.

In some embodiments, the circuit board covers the back end of the assembly housing by having a surface of the circuit board 18 (e.g., the surface of the circuit board having the largest surface area) projectedly disposed within the back end periphery of the assembly housing 17. In some embodiments, the circuit board 18 may be arranged to extend from the rear end periphery of the component housing 17. In an exemplary embodiment, the planar surface of the circuit board 18 may be disposed at an opening at the rear end of the main body of the component housing 17. In some embodiments, each circuit board 18 may be disposed at an angle to the backplane 11. In the exemplary embodiment, the circuit board 18 is arranged substantially perpendicular to the bottom plate 11. Further, the circuit board 18 may abut the rear end of the component housing 17. In some embodiments, the circuit board 18 is mechanically secured to the rear end of the component housing 17. Thus, the circuit board 18 can be electrically connected to the electronic device D in the component case 17 without providing a cable therebetween. Thus, in some embodiments, the storage drives D and the circuit board are coupled to each other using board-to-board connectors. In one embodiment, the circuit board 18 is a printed circuit board configured to couple the electronic device D to a motherboard.

The fan module 19 is disposed between the side walls 15 and configured to cool the component housing 17 and the circuit board 18. Pairs of fan brackets 20 are arranged near different side walls 15, respectively, and fan modules 19 may be mounted to server system 100 by coupling with fan brackets 20. Thus, fan modules 19 are positioned across backplane 11 from side to side in server system 100. The motherboard is disposed on the motherboard insulation 21 between the fan module 19 and the rear panel 14, and the motherboard is electrically coupled to the circuit board 18, the fan module 19, and the power module 22. The power module 22 is disposed between the side walls 15 and closer to the rear panel 14 than the fan module 19. The back of the power module 22 is aligned with the rear panel 14 so that the rear panel 14 does not itself cover the back of the power module 22. Therefore, the power module 22 may be independently removed from the server system 100. The upper cover 12 is disposed above the component housing 17, the circuit board 18, the fan module 19, the main board, and the power module 22 on the base plate 11. Thus, the bottom plate 11, the top cover 12, the front panel 13, the rear panel 14, the side walls 15, the side doors 16, and the power modules 22 together form a space in which the module case 17, the circuit board 18, the fan module 19, the fan bracket 20, the motherboard insulator 21, and the motherboard can be accommodated.

In one embodiment of the present disclosure, the top cover 12 includes a storage area top cover 121 covering over the component housing 17 and the circuit board 18, a fan area top cover 122 covering over the fan module 19, and a motherboard area top cover 123 covering over the motherboard. Accordingly, the component housing 17, the fan module 19, and the main board together with the circuit board 18 can be individually accessed from the top of the server system 100 for maintenance by removing the corresponding portions of the upper cover 12.

Fig. 4 is a top view of fig. 3, and fig. 5 is a simplified schematic diagram of a partial (PL dashed area) layout of fig. 4, according to one embodiment of the present disclosure. Referring to fig. 4 and 5, a cooling arrangement (e.g., for the component enclosure 17 and its circuit board 18) for the server system 100 according to an embodiment of the present disclosure will be described below.

To cool the server system 100, the fan modules 19 are configured to draw air into the server system 100 at the front panel 13 and blow air out of the server system 100 at the rear panel 14. In the server system 100, air driven by the fan modules 19 flows through and cools the component housings 17 and the circuit boards 18. More specifically, as shown in fig. 5, the air flows into the collection space CS in the front panel 13. The air passes through the plurality of air inlets 133 of the front panel 13, and then the air exits the front panel 13 through the plurality of air outlets 134 at the side of the collection space CS. Then, the air flows into two peripheral galleries FC (first galleries) communicating between the front panel 13 and the component housing 17. In some embodiments, the peripheral gallery FC is defined by the lateral spacing between the front end of the assembly housing 17, one of the side doors 16, and a portion of the stress dispersing member 24. The peripheral gallery is further defined by the vertical separation between the floor 11 and the roof 12. In other words, the flow path is defined by an enclosed space formed using the front end of the assembly housing 17, the side door 16, a part of the stress dispersion member 24, the bottom plate 11, and the upper cover 12. As shown in fig. 5, the part of the stress dispersing member 24 disposed between the side door 16 and the assembly housing 17 forms a seal of the outside gallery FC. Further, the stress dispersion member 24 forms a barrier between the front and rear portions of the chassis base 11. The front is further defined by the space between a pair of side doors 16. The rear portion is further defined by the space between a pair of side walls 15. A pair of peripheral galleries FC refer to spaces located inside the side doors 16 and in front of the storage modules 17. As shown in fig. 5, each peripheral gallery FC is defined between one of the side doors 16 and the assembly housing 17 facing that side door 16. The server system 100 also includes a stress dispersion member 24 (e.g., a first support) disposed at an end of the peripheral gallery FC on a side of the component housing 17 closer to the back panel 14, the stress dispersion member 24 serving as an air block configured to block air in the peripheral gallery FC from flowing toward the fan module 19 without passing through the component housing 17 and the circuit board 18. In some embodiments, air flowing through the peripheral gallery FC is exhausted by the fan module 19, enters the component housing 17 through the front end, and exits the component housing 17 through the plurality of holes 181 of the circuit board 18. The stress dispersing member 24 traverses the entire width of the base plate 11. In some embodiments, stress dispersing members 24 are secured to base plate 11 and upper cover 12. The stress dispersing member 24 and the module case 17 are arranged to abut each other. In one embodiment, the server system 100 may include other types of air barriers disposed at the ends of the two peripheral galleries FC, such as airtight sealants, airtight foams, airtight plasters, etc., instead of or in addition to the stress dispersion members 24. As a result, air flows into the component housing 17 from the two peripheral galleries FC through the plurality of retainer air holes 1721 thereof, and then exits the component housing 17 from the plurality of holes 181 on the circuit board 18. In this way, the air enters the center gallery SC (second gallery), which is a space defined between the two circuit boards 18. As the fan module 19 continues to draw air, air from the central gallery is driven through the openings 243 of the stress dispersing members 24 between the central gallery and the fan module 19. The opening 243 may be a perforation formed on the stress dispersing member 24 aligned with the center corridor SC. Finally, the air passes through the fan module 19 and exits the server system 100 from the back panel 14. The two peripheral galleries FC are parallel to the central gallery and the collecting space CS is perpendicular to the central gallery. It should be noted that the collecting space CS in the front panel 13 should not communicate directly with the central gallery between the component housings 17.

Fig. 26A-26E are perspective views of a bone structure according to one embodiment of the present disclosure. In some embodiments, the housing is divided into a front portion and a rear portion. The bone structure of the housing is configured to provide structural support to the housing when subjected to a loading force. In some embodiments, the bone structure includes a stress dispersing member 24, a sidewall 15 secured to an end of the stress dispersing member 24, and a spine 25 disposed between the base plate 11 and the stress dispersing member 24. The spine 25 may be disposed substantially equidistant from the pair of side walls 15. In some embodiments, stress dispersing member 24 further includes a fixed bracket 246, and fixed bracket 246 is configured to compress against spine 25 when subjected to a loading force. The fixing bracket 246 is formed in an arch shape at the bottom of the stress dispersion member 24.

In addition to the stress distributing members 24 being arranged to define the rear and front of the enclosure, the stress distributing members 24 may act as structural beams capable of withstanding loads. In some embodiments, the server rack is configured to receive a plurality of enclosures. When a user needs to access the enclosure, the user may pull a portion of the enclosure away from the server rack. Thus, a portion of the housing is unsupported by the frame. In use, the housing may be partially suspended outside the server rack and the front may not be supported. The stress dispersing member is configured to form a cantilever of the enclosure when a portion (e.g., the front) of the enclosure is suspended. In some embodiments, the assembly housing 17 is arranged in the front of the housing. In some embodiments, the assembly housing 17 is disposed at the front of the housing. Thus, the center of gravity of the housing is located at the front. In some embodiments, the stress dispersing member 24 extends beyond the assembly housing 17. In some embodiments, the end of the stress dispersing member 24 that extends beyond the forward end of the assembly housing acts as an air barrier in the peripheral gallery FC.

In some embodiments, the spine 25 may form a channel having a web 251 and wings 252 protruding from the sides of the web 251. In some embodiments, the web 251 traverses the entire length of the front portion and extends partially into the rear portion. Furthermore, the web 251 is fastened to the bottom plate 11. In some other embodiments, depending on the material of the spine, the web 251 may extend partially to the anterior and posterior portions. In some embodiments, the wing 252 extends in a direction toward the upper cover 12. In some embodiments, wings 252 are mechanically fastened to stress dispersing member 24. Further, the ends of the wings form an L-shaped bend 253. In some embodiments, the L-shaped bend may be a pair of planar structures arranged in an L-shaped cross-sectional configuration. In some embodiments, the angles between the planar structures may be perpendicular to each other. In some other embodiments, the angle between the planar structures may be less than 180 degrees. In the exemplary embodiment, wings 252 are mechanically fastened to a forward facing side of stress distributing member 24. In particular, a portion of an L-shaped channel 253 disposed parallel to a surface of the stress dispersing member 24 is fastened to the stress dispersing member 24 using fasteners 254. Furthermore, in some embodiments, wing 251 is mechanically fastened to front panel 13. In the exemplary embodiment, the wing portions are mechanically fastened to an inner frame 132 of front panel 13. In particular, a portion of the L-shaped channel 253 disposed parallel to the inner frame 132 is fastened to the stress dispersing member 24 using fasteners 254.

With reference to spanning the width of the stress distributing member 24, when the weight load of the storage device is applied to the front of the housing, the spine 25 may apply a loading force to the stress distributing member 24 and the sidewalls 15 may each apply a supporting reaction force to the ends of the stress distributing member 24. With reference to the length of the overall housing, the stress dispersing member 24 and the spine 25 may form a cantilever structure when the weight load of the storage device D is applied to the front of the housing. In an exemplary embodiment, the storage device D may exert a substantially constant load over the length of the spine disposed across the front when the storage device D is equally divided between a pair of component housings 17.

Further, a side wall 15 is arranged at the rear of the housing. The side walls 15 of the housing abut the ends of the stress dispersing member. In some embodiments, the side walls 15, the base plate 11, and the upper cover 12 are fastened to the stress dispersion member 24. In this manner, the structural integrity of the housing is supported by the stress dispersing member 24 and further by the spine 25. When a force is applied to any one of the side walls 15, the bottom plate 11, and the upper cover 12, the stress dispersion member 24 can absorb at least a part of the stress generated on the housing by the applied force.

27A-27B are perspective views of side door structures according to one embodiment of the present disclosure. In a further embodiment, a seal 30 is disposed between the side door 16 and the side pillar of the side door 16 on the outer casing. The seal 30 is configured to prevent air from entering from the side door 16. In some embodiments, the seal strip 30 may serve as a barrier to the door frame of the side door 16 and the space between the side door 16. In an exemplary embodiment, the side pillars of the side door 16 are part of the top cover 12. A sealing strip 30 is provided between the base plate 11 and the top cover 12. A sealing strip 30 is provided between the side door 16 and the upper cover 12, wherein the sealing strip 30 is attached to the inner surface of the upper cover 12. The sealing strip 30 is configured to prevent air from entering through a space between the side door and the top cover.

FIG. 29 is a cross-sectional view of a side door structure according to one embodiment of the present disclosure. In some embodiments, side door 16 includes a door panel 165 and a sealing wing 164 formed at an angle to door panel 165. In some embodiments, the sealing wing 164 is perpendicular to the door panel 65. In some other embodiments, the angle between the sealing wing portion 164 and the door panel 165 may be greater or less than 90 degrees. When the angle between the sealing wing portion 164 and the door panel 165 is greater than 90 degrees, the sealing wing portion 164 may form a barrier to the gap between the door panel 165 and the upper cover 12.

The door panels 165 are configured to angle as they move away from the corresponding side wall 15. In other words, the angle between the side wall 15 and the side door 16 increases as the side door 16 is opened and/or removed from the enclosure. Sealing wings 164 are configured to angle when moved away from the corresponding upper cover 12. In other words, the angle between the sealing wing 164 and the inner surface of the upper cover 12 increases as the side door 16 opens or moves away from the housing. Further, when the side door 16 is opened, the front end of the module case 17 may be exposed, and a user may access electronic components provided in the module case 17.

In some embodiments, the sealing wing 164 forms a barrier between the external environment and the peripheral gallery when the side door 16 is closed. Although the sealing wings 164 may not directly contact the top cap 12 or the sealing strip 30, airflow from the external environment is prevented from entering the peripheral gallery, and airflow within the peripheral gallery is prevented from escaping the enclosure. In addition, when the side door 16 is closed, the side door may be stationary depending on the mechanism used. In other words, when no force (e.g., a pulling force) is applied to the side door 16, the side door 16 may cover the front end of the assembly housing 17.

In some embodiments, when the sealing strip 30 is affixed to the inner surface of the top cover 12 and disposed adjacent to the side door 16, the thickness of the sealing strip 30 is no less than the distance between the top cover 12 and the sealing wing 164 when the side door 16 is closed. In other embodiments, the sealing wing 164 and the sealing strip 30 may substantially abut each other when the door is closed.

In some other embodiments, the periphery of the upper cover 12 disposed above the side door 16 may be folded. Therefore, the thickness of the sealing tape 30 can be further increased by the thickness of the upper cover 12, and the thickness is not smaller than the distance between the upper cover 12 and the sealing wing portion 164 when the side door 16 is closed.

In some other embodiments, the thickness of the sealing strip 30 is less than the distance between the inner surface of the top cover 12 and the top row of equipment seats 172. Thus, when the top row of equipment pedestals 172 is removed from the enclosure, the seal 30 does not interfere with the path of the equipment pedestals 172. In some other embodiments, the thickness of the sealing strip 30 is less than the distance between the inner surface of the cover 12 and the top row of storage drivers D. In this way, the seal strip 30 will not obstruct the path of the storage drives D when the top row of storage drives D is removed from the enclosure.

In some embodiments, the stress dispersing member 24 may include a pair of door stops 245, the pair of door stops 245 protruding from a region of the stress dispersing member 24 disposed between the side door 16 and the assembly housing 17. The door stopper 245 is configured to seal a gap between the side door 16 and the side wall 15.

Fig. 6 shows the front panel 13 disassembled according to one embodiment of the present disclosure. The front panel 13 includes an outer frame 131 and an inner frame 132 opposite to the outer frame 131. A plurality of air inlets 133 are formed on the outer frame 131 through the perforation. A plurality of air outlets 134 are formed through the inner frame 132. The front panel 13 may be mounted to the server system 100 by coupling the inner frame 132 between the side of the assembly housing 17 and the bottom plate 11. In other words, the assembly housing abuts the inner frame. In some other embodiments, the assembly housing is also arranged to be fastened to the front panel 13. And the outer frame 131 is coupled to the inner frame 132 to form the collecting space CS. In some embodiments, the collecting space CS is formed between the outer frame 131 and the inner frame 132. In some embodiments, the collection space CS is arranged to collect particles from the external environment. However, the use of the collection space CS is not limited thereto. A plurality of air inlets 133 are disposed on the outer frame 131. Further, the plurality of air inlets 133 include a primary air inlet 133a disposed at the front of the front panel 13 and a secondary air inlet 133b disposed at the top and/or the lower portion. That is, the primary air intake 133a and the secondary air intake 133b are arranged on different faces of the front panel 13. A plurality of air outlets 134 are arranged on the side of the inner frame 132 of the front panel 13 and thus correspond in position to the two peripheral galleries FC. In some embodiments, the perforations (i.e., the plurality of air outlets 134) on the inner frame 132 are formed in an area of the inner frame 132 that projects toward the extended portion of the stress dispersing member 24. Specifically, a plurality of air outlets 134 are formed in an area of the inner frame 132, i.e., an area disposed between the front end of the pack case and the side door. In some embodiments, the perforated area of the outer frame is greater than the perforated area of the inner frame. In contrast, the total area of the plurality of air inlets 133 is greater than the total area of the plurality of air outlets 134 because this compresses the air and increases the flow rate around the plurality of air outlets 134.

In one embodiment of the present disclosure, fig. 7 shows that if the sub-air inlet 133b is disposed at the top of the front panel 13, the storage area upper cover 121 includes an upper cover through-hole 1211, and the upper cover through-hole 1211 corresponds in position to the sub-air inlet 133b. Accordingly, air can be drawn into the collection space CS of the front panel 13 through the cover through-holes 1211 of the storage area cover 121. In another embodiment of the present disclosure, fig. 8 shows that if the secondary air inlets 133b are disposed at the bottom of the front panel 13, the bottom plate 11 includes the bottom plate through-holes 111, and the bottom plate through-holes 111 correspond in position to the secondary air inlets 133b. Accordingly, air may be drawn into the collection space CS of the front panel 13 through the bottom plate through holes 111 of the bottom plate 11. Returning to fig. 7, in one embodiment of the present disclosure, each side door 16 includes a ladder structure 163 that divides the door 16 into an upper door portion 16U and a lower door portion 16L, and the lower door portion 16L is recessed relative to the upper door portion 16U into the server system 100. Thus, as shown in fig. 1, when the server system 100 is fully located in the server rack 500, the side doors 16 are configured to receive the rack slide rails 600 below the ladder structure 163 such that the total weight of the server system 100 may be evenly distributed between the front and

rear panels

13, 14 without securing the rack slide rails 600 to the doors 16.

Fig. 9 is a side view of a server system 100 with a side door 16 opened according to one embodiment of the present disclosure. The server system 100 shown in fig. 9 is a 2U rack-mounted server unit, and each containment frame structure 171 of the two component enclosures 17 is configured to carry twelve device chassis 172, and thus twelve electronic devices D as shown. Thus, the server system 100 with two component housings 17 is configured to load twelve electronic devices D on each side, so that a total of twenty-four electronic devices D each weigh about 630 grams. In some embodiments, the housing is capable of supporting approximately 15 kilograms of the weight of the electronic device inserted into the housing. In particular, the skeleton of the enclosure allows the enclosure to support a 15 kilogram load while suspended from the server rack. Further, in some other embodiments, the backbone of the enclosure allows the enclosure to support loads in excess of 15 kilograms at the front when the enclosure is suspended from the server rack. Other load sources besides storage devices may be included. In some other embodiments, the enclosure may support a suspended load greater than 15kg (i.e., a front portion having a load weight of about 21 kg). However, the embodiments are not limited thereto. In some embodiments, the load limit of the enclosure may vary depending on the size and material of the enclosure. A plurality of tray air holes 1721 are disposed in the assembly housing 17 at the front of the device base 172. Since both the air outlet 134 and the tray air holes 1721 are in communication with the peripheral gallery FC, air drawn in by the fan module 19 is allowed to flow from the collection space CS into the equipment base 172. The length Ld of the door 16 is equal to or greater than the length Ls of the assembly housing 17, which not only protects the assembly housing 17 from dust, but also ensures that when the side door 16 is closed, the peripheral gallery FC defined in the side door 16 communicates with all of the tray air holes 1721 so that all of the air from the plurality of air outlets 134 can flow into the assembly housing 17. Since the side door 16 should be longer than the module case 17, the side wall 15 does not overlap the module case 17. Although in the present embodiment, the length Ls of the module case 17 is equal to the length of the receiving frame structure 171. In another embodiment where the receiving frame structure 171 is not provided, the length Ls may represent the total length of the plurality of electronic devices D mounted on one side of the server system 100.

Fig. 10 shows one of the component housings 17 with a circuit board 18 behind it, according to one embodiment of the present disclosure; FIG. 10-1 isbase:Sub>A sectional view A-A of FIG. 10; fig. 11 shows one of the receiving frame structures 171. As shown in fig. 10, the twelve electronic devices D in the housing frame structure 171 are horizontally arranged in three (columns) by four (rows). Note that in this disclosure, rows are straight and columns are transverse. Referring to fig. 11, the receiving frame structure 171 includes three straight partitions 1711 and a plurality of transverse rails 1712, and each straight partition 1711 has a double-layered structure on which the plurality of transverse rails 1712 are integrated. Returning to fig. 10-1, as air drawn from the peripheral gallery FC enters the assembly housing 17 through the tray air holes 1721 in the device base 172, the air passes through the passageway P around the electronic device D. In one embodiment, the passageway P is defined by the space above the electronic device D. As the air flows through the passageway P, the air comes into direct contact with the electronic device D, thereby removing most of the heat from the top of the electronic device D. After flowing through the passage P, the air leaves the component housing 17 and enters the central gallery via holes 181 on the circuit board 18 located behind the component housing 17.

Fig. 28 is a perspective view of a storage module according to one embodiment of the present disclosure. The memory module may be formed by a component housing 17 and a circuit board 18. In some embodiments, the circuit board 18 is perforated to form a plurality of holes 181. A plurality of holes 181A may be formed on the planar profile of the circuit board 18. In some embodiments, the plurality of holes 181A are in an array. A plurality of holes 181 may be arranged to expose the rear end of the storage component when the circuit board 18 covers the rear end of the assembly housing 17. In some embodiments, a plurality of holes 181B are further formed by the circuit board 18 in conjunction with the assembly housing 17. In an exemplary embodiment, a portion of the hole 181B is formed by a notch 185 on the periphery of the circuit board 18 and a corresponding peripheral side 175 on the rear end of the assembly housing 17. In an exemplary embodiment, the number of the plurality of holes 181 of the circuit board 18 is the same as the number of memory components that the assembly housing 17 can carry. Further, the bottom region of the circuit board and the component housing may also form a plurality of holes. However, the number of the plurality of holes is not limited thereto. In some embodiments, the number of the plurality of holes may be greater or less than the number of storage components that the component housing can carry, depending on the arrangement of the holes in the circuit board.

In some other embodiments, the assembly housing 17 further includes wings 176 extending from the sides of the assembly housing 17. In some embodiments, the wings 176 may overlap the front panel 13 and the stress dispersing member 24, respectively. Further, the wing portions 176 may correspond to the top surface of the fastening front panel 13 and the top surface of the stress dispersion member 24.

Fig. 12 shows fig. 10 of an undisplayed device chassis 172 and an electronic device D, according to an embodiment of the disclosure. As shown in fig. 12, when all of the device chassis 172 and the electronic device D are removed from the housing frame structure 171 of the component housing 17, the circuit board 18 disposed behind is visible from the front of the component housing 17. In other words, the receiving frame structure 171 has a box shape with a front surface being empty and a back surface being the circuit board 18. In one embodiment, a circuit board 18 includes a plurality of rows of holes 181, the number of rows of holes 181 corresponding to the number of rows of electronic device D. In other words, each row of device chassis 172 with electronic device D may have a row of holes 181 behind it. Thus, air passing through the passage P of the assembly housing 17 can efficiently flow into the central gallery without pooling horizontally. In one embodiment of the present disclosure, the holes 181 include at least a primary hole 1811 and a secondary hole 1812. As shown in fig. 12, the main hole 1811 is disposed at a non-edge portion of the circuit board 18, and the sub hole 1812 is disposed at an edge portion of the circuit board 18. In other words, the primary hole 1811 is a hole in the circuit board 18, and the secondary hole 1811 is a notch at the edge of the circuit board 18. In an embodiment of the present disclosure, the circuit board 18 includes at least one secondary hole 1812 at its top edge. In another embodiment, the circuit board 18 includes secondary holes 1812 at both its top and bottom edges. In yet another embodiment, the circuit board 18 further includes a plurality of driver connectors 182 configured to couple to the electronic device D. Since the driver connectors 182 are one of the main components that accumulate heat, each driver connector 182 is disposed in the vicinity of any one of the holes 181 to effectively cool it. Although the holes 181 are shown as being both long and narrow, it should be understood that the shape of the holes 181 is not limited in nature, so long as they allow air from the passage P to pass therethrough. For example, each hole 181 may be replaced by a plurality of equivalent circular holes.

Fig. 13 is an enlarged view of a portion (PE dashed area) of fig. 8 according to one embodiment of the present disclosure. The stress dispersion member 24 is disposed between the sidewalls 15 in a side-to-side direction of the server system 100 across the base 11 and is configured to increase the structural strength of the floor 11 of the server system 100. The stress dispersion member 24 includes a skeleton 241 and a plurality of spacers 242. The stress dispersion member 24 is perforated to form a plurality of openings 243. A plurality of openings 243 are defined between the plurality of dividers 242 within the frame 241. In some embodiments, the plurality of openings 243 are aligned with the lateral spacing between the circuit boards. In other words, the region of the stress distributing member aligned with the central gallery is perforated. The plurality of openings 243 not only allow air drawn in from the central gallery by the fan module 19 to pass through the stress dispersion member 24, but also allow cables (not shown) coupled to the circuit board 18 to pass therethrough so that the cables can be coupled to the motherboard. The server system 100 further includes a second support 25 disposed between the assembly housings 17 and perpendicular to the stress dispersion member 24 and the front panel 13. Further, the second support 25 includes a web 251 and a plurality of wings 252. The web 251 disposed between the front panel 13 and the stress dispersing member 24 has two ends; one end of the web 251 extends toward the front panel 13, and the other end of the web 251 extends toward the stress dispersing member 24. The plurality of wings 252 extend vertically at both ends of the web 251 and are configured to couple the second support 25 to the stress dispersion member 24 and the inner frame 132, such that the server system 100 increases the structural strength between the stress dispersion member 24 and the front panel 13 through the second support 25. It should be noted that the second support 25 does not have to be in direct contact with the base plate 11. However, the second support 25 may be directly connected to the backplane 11 and/or the component enclosure 17 to further enhance the structure of the server system 100. In one embodiment of the present disclosure, the second support 25 includes two wings 252 at each end. Near one end of the stress distributing member 24, two wings 252 are each coupled to one of the partitions 242 of the stress distributing member 24, allowing air and cables (not shown) from the circuit board 18 to pass therebetween. At one end near the front panel 13, cables (not shown) from the UI module 23 pass between the wings 252. In any case, the cables from the circuit board 18 and the UI module 23 can be neatly arranged between the wings 252 of the second support 25.

Fig. 14 shows a front view of the front panel 13, according to one embodiment of the present disclosure; fig. 15 is a simplified schematic of section B-B of fig. 14. The server system 100 further comprises a UI module 23, the UI module 23 being mounted in the middle between the outer frame 131 and the inner frame 132 of the front panel 13, thereby at least partly dividing the collecting space CS into two equal parts. Furthermore, the UI module 23 is configured to separate the collection space CS from the central corridor.

Fig. 16 shows the server system 100, and fig. 17 shows an enlarged view of a part (PE dotted line region) of fig. 16. In one embodiment of the present disclosure, in the peripheral gallery FC, the floor 11 further includes a surface projection 112 between the assembly housing 17 and the side door 16 corresponding to the assembly housing 17. That is, the surface projection 112 is projected from the plane of the bottom plate 11, and is disposed between the front end of the module case 17 and the periphery of the bottom plate 11. When the device base 172 of the lowermost column of the component housing 17 and the electronic device D are inserted into or pulled out of the accommodation frame structure 171, the surface projections 112 are configured to support the device base 172 of the lowermost column and the electronic device D, thereby preventing the drive carrier 172 of the lowermost column from rubbing against the base 11 due to the weight of the electronic device D.

As shown in fig. 8, in one embodiment of the present disclosure, the fan module 19 includes a fan frame 191 and a plurality of fan units 192 arranged therein. FIG. 18 shows the server system 100 with the fan bracket 20, and FIG. 19 shows an enlarged view of a portion (PE dashed area) of FIG. 18; fig. 20 is a front view of the fan module 19, and fig. 21 is a bottom view of the fan module 19; fig. 22 is a simplified schematic of section C-C of fig. 4. In one embodiment of the present disclosure, a pair of fan brackets 20 are fixed to the side walls 15 without being directly connected to the bottom plate 11. In other words, the pair of fan brackets 20 are suspended with respect to the base plate 11. Each fan bracket 20 includes a guide structure 201, the guide structure 201 configured to be coupled to the fan module 19. As shown in fig. 20, the fan frame 191 of the fan module 19 includes two concave portions 1911 respectively disposed at both sides of the fan frame 191, and each concave portion 1911 at each lower corner looks like a notch. In fig. 21, the fan frame 191 further comprises two receiving structures 1912 integrated into the inner recess 1911, the receiving structures 1912 being configured to receive the guiding structure 201 of the fan mount 20. As shown in fig. 19, the guide structure 201 may be an upward protrusion standing vertically with respect to the base plate 11; as shown in fig. 21, the receiving structure 1912 may be a hole facing downward in the internal recess 1911. Accordingly, fan frame 191 of fan module 19 may be guided for installation to server system 100 by alignment between receiving structures 1912 and corresponding guide structures 201. It should be noted that the recessed portion 1911 of the fan frame 191 is not only configured to guide the mounting of the fan bracket 20 through the receiving structure 1912 formed thereon, but also to allow the cables 26 from the circuit board 18 and the UI module 23 to pass around the fan module 19 from the wall corners between the fan module 19, the side walls 15, and the bottom plate 11. As shown in fig. 22, the cable channel CC defined between the side wall 15, the bottom plate 11, and the inner recess 1911 of the fan frame 191 is configured to accommodate a cable 26 extending from the circuit board 18 and the UI module 23 to a motherboard disposed behind the fan module 19. Thus, cable bypass around fan module 19 is achieved through cable channels CC below internal recess 1911. In another embodiment, multiple fan units 192 may be mounted to the server system 100 without the fan frame 191, where the multiple fan units 192 are arranged in a door-to-door direction of the server system 100.

Fig. 23 is an enlarged view of a part (PE dotted line region) of fig. 9. In one embodiment of the present disclosure, side door 16 may include at least one seal 161. As shown in fig. 9, the side door 16 includes two seals 161 on its inner surface and also includes a hinge 162 coupled to the upper cover 12. In this way, the side door 16 can be opened by lifting the end near the base 11. However, in another embodiment, the door hinge 162 may be coupled to the base 11 so that it can be opened by lowering the end of the side door 16 adjacent the top cover 12. When the side door 16 is closed, one seal 161 is disposed on the proximal side of the door 16 with respect to the base 11, and the other seal 161 is disposed on the proximal side of the door 16 with respect to the upper cover 12. In other words, one seal 161 is installed near the hinge 162, and the other seal 161 is installed away from the hinge 162.

In one embodiment of the present disclosure, the plurality of electronic devices D are 3.5 inches in size. A 3.5 inch storage drive is typically superior to a 2.5 inch storage drive in terms of buffer size, RPM (revolutions per minute), maximum storage capacity, data transfer speed, and price. However, 3.5 inch storage drives have higher power consumption and therefore higher operating temperatures than 2.5 inch storage drives. The high operating temperature coupled with the close packing of the 3.5 inch electronics D component enclosure 17, cooling of the server system 100 becomes a significant problem. According to the cooling test results shown in fig. 24, the cooling arrangement in fig. 5 cooled the electronic devices D in operation, in which the maximum temperature difference between the electronic devices D was 2.9 degrees celsius and the maximum temperature was 45.7 degrees celsius. The lower maximum temperature difference indicates that cooling of the electronic device D is uniform and balanced, while the maximum temperature below 50 degrees celsius may be safe and stable to meet general industry standards. It should be noted that the air between the fan module 19 and the front panel 13 in the server system 100 is laminar flow, the air between the fan module 19 and the rear panel 14 is turbulent flow, and the same cooling arrangement can be applied to the electronic device D of 2.5 inches as long as the physical volume of the accommodating frame structure 171 occupied by the device base 172 and the electronic device D is greater than 70%.

Furthermore, the weight of a 3.5 inch storage drive is about four times the weight of a 2.5 inch storage drive. Thus, as shown in fig. 3, carrying twenty-four 3.5 inch electronic devices D on the front FP of the server system 100 places a significant amount of pressure on the backplane 11. Fig. 25 shows a server system 100 with a support 27, according to one embodiment of the present disclosure. To further enhance the structural strength of the floor 11, in addition to the stress dispersion member 24 and the second support 25, a support 27 may be included in the central gallery and coupled between the stress dispersion member 24 and the inner frame 132. According to an embodiment of the present disclosure, the server system 100 may include at least any one or any combination of the stress dispersion member 24, the second support 25, and the support 27.

It should be noted that although all of the exemplary illustrations are based on 2U rack servers, any of the embodiments of the present disclosure may be applied to other rack servers of any different size, such as 4U, 6U, and 8U rack servers.

Fig. 30A-30J are perspective views of a rack-mounted server system according to one embodiment of the present disclosure. In some embodiments, the rack slide 600 (shown in fig. 1) includes an outer slide 601, an inner slide 602 mechanically attached to the outer slide 601, and

support brackets

603a, 603b, 603c, and 603d mechanically attached to the inner slide 602. In some embodiments, the inner slide rail 602 is configured to mechanically move along the outer slide rail 601. In some embodiments, the support 603a (shown in fig. 30A) may be a plate holder with one end fixed to the inner rail 602 and the other end fixed to the housing 100. In an exemplary embodiment, the support bracket 603a is fastened to a sidewall of the housing 100. The plate holder may be an L-shaped plate holder. In some embodiments, the support bracket 603b (shown in fig. 30E) may be a triangular support bracket with one side fixed to the inner slide rail 602 and the other side fixed to the housing 100. Further, angular support plates are fixed to both side ends of the support frame 603 b. In an exemplary embodiment, the support bracket 603b is fastened to the back panel of the housing 100. In some embodiments, the support 603c (shown in fig. 30G) may be a triangular support, one side of which is fixed to the inner slide 602 and the other side of which is fixed to the housing 100. In an exemplary embodiment, the support bracket 603c is secured to the back panel of the housing 100. Further, the support bracket 603c has two gussets. The first gusset plate is fixed at the end of both sides. The second gusset is secured between the first gusset and the side of the inner slide rail 602. In some embodiments, the support bracket 603d (shown in fig. 30I) may be a triangular support bracket with one side fixed to the inner slide rail 602 and the other side fixed to the housing 100. Further, angular support plates are fixed to both side ends of the support bracket 603 d. Also, the support bracket 603d has a flange extending from one side fastened to the inner slide rail 602. One end of the flange is fixed to a side wall of the housing 100.

The embodiments shown and described above are only examples. Many details are often found in the art and are therefore not shown or described. Even though numerous characteristics, advantages and structural and functional details of the present technology have been set forth in the foregoing description, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size and arrangement of parts within the principles of the disclosure and the broad meaning of the terms in which the appended claims are expressed. It is therefore to be understood that the above described embodiments may be modified within the scope of the claims.

Claims

1. An enclosure, comprising:

a base plate;

the upper cover is arranged on the bottom plate;

a pair of side walls, a pair of side doors and a front panel arranged between the bottom plate and the upper cover,

wherein the pair of side doors are disposed perpendicular to the front panel,

each side door of the pair of side doors is disposed in substantial alignment with one of the pair of side walls,

a rear portion defined by an area between the pair of side walls and a front portion defined by an area between the pair of side doors;

a pair of module housings disposed at the front portion,

wherein each of said module housings has a front end facing one of said side doors and a rear end facing the other of said side doors; and

a pair of circuit boards respectively covering the rear ends of the module housings,

wherein each circuit board is perforated to form a plurality of holes,

the central corridor is defined by the distance between the pair of circuit boards,

the plurality of holes are configured to allow air exhausted from the front end of the component housing to flow toward the central gallery,

the plurality of holes are for exposing a rear end of a storage component received by the assembly housing.

2. The enclosure of claim 1, further comprising:

the stress distributing member traverses the entire width of the base plate,

the stress dispersion member is arranged perpendicular to the pair of side walls and the pair of side doors.

3. An enclosure, comprising:

a base plate;

the upper cover is arranged on the bottom plate;

a pair of side doors and a front panel disposed between the bottom panel and the upper cover,

wherein the pair of side doors define a front portion therebetween;

a stress dispersion member traversing an entire width of the base plate;

a pair of assembly housings disposed between the stress dispersion member and the front panel;

wherein each of the component housings has a front end and a rear end opposite the front end,

the ends of the stress dispersing members extend beyond the front end of the component housing,

the front end of the assembly housing, the side door, the upper cover, the bottom plate, and the portion of the stress dispersion member extending form a space.

4. The enclosure of claim 1, further comprising:

a pair of circuit boards disposed between the pair of component housings and each of the pair of circuit boards at an angle to the bottom plate,

wherein each of the circuit boards is perforated to form a plurality of holes,

the front end of the component housing is perforated to allow air from outside the component housing to flow through the holes to the central gallery,

the aperture is disposed along the rear end of the assembly housing.

5. An enclosure, comprising:

a base plate;

the upper cover is arranged on the bottom plate;

the front panel is arranged between the bottom plate and the upper cover;

a stress dispersion member traversing an entire width of the base plate and fastened to the base plate and the upper cover, wherein a front portion is defined between the front panel and the stress dispersion member;

a pair of module housings disposed at the front portion,

each of said component housings having a front end facing out of said housing and a rear end facing into the housing,

wherein an end of the stress dispersing member extends beyond the front end of the assembly housing; and

a pair of circuit boards respectively cover the rear ends of the component housings,

wherein each circuit board is perforated to form a plurality of holes,

the plurality of apertures are for exposing a rear end of a storage component received by the assembly housing.

6. An enclosure, comprising:

a base plate;

a stress dispersion member traversing an entire width of the base plate,

wherein the stress dispersing member forms a barrier between the front and rear portions of the base plate;

a pair of assembly housings disposed at the front and abutting the stress dispersion member,

each of the component housings is configured to arrange the received electronic devices in a stacked array,

a pair of circuit boards disposed between the pair of module housings, each of the circuit boards disposed at an angle to the base plate,

wherein each circuit board is perforated to form a plurality of holes,

the front end of the component housing is perforated to allow air from outside the component housing to flow through the hole to the central gallery,

the aperture is disposed along the rear end of the assembly housing.

7. The enclosure of claim 3, 5 or 6, further comprising:

a pair of side walls fastening the end portions of the stress dispersion member.

8. The enclosure of claim 6, further comprising:

the upper cover is arranged on the bottom plate;

wherein the base plate and the upper cover fasten the stress dispersion member.

9. The enclosure of claim 2, 3, 5 or 8, further comprising:

a pair of side doors are mechanically connected to the top cover and are configured to be angled away from the housing,

wherein a peripheral gallery is defined by a spacing between the front end of the assembly housing, one of the side doors, and a portion of the stress dispersing member,

wherein the stress dispersing member forms a sealing end of the peripheral gallery.

10. The housing of claim 9, wherein the stress dispersing member comprises

A pair of door stoppers protruding from regions of the stress dispersion member and disposed between the side doors and the module case,

the door stop is configured to seal a gap between the side door and the side wall.

11. The enclosure of claim 9, wherein each of said side doors comprises:

a door panel configured to form an angle away from the housing; and

the sealing wing portion is configured to form an angle when being away from the upper cover.

12. The enclosure of claim 11, further comprising:

and the sealing strip is arranged between the side door and the upper cover and is configured to prevent air from entering through the side door and the space between the upper covers.

13. The housing of claim 12, wherein the sealing strip has a thickness not less than a distance between the top cover and the sealing wing portion when the side door is at rest.

14. The enclosure of claim 8, further comprising:

and the front panel is arranged between the peripheries of the bottom plate and the upper cover.

15. The enclosure of claim 1, 3, 5 or 14, wherein the front panel comprises:

an outer frame; and

an inner frame opposite to the outer frame;

wherein a collecting space is formed between the outer frame and the inner frame,

wherein the assembly outer shell abuts the inner frame,

the perforated area of the outer frame is larger than that of the inner frame,

wherein the inner frame is perforated in an area extending beyond the front end of the assembly housing.

16. The enclosure of claim 2, 3, 5 or 6, further comprising:

a spine disposed between the stress dispersion member and the base plate, mechanically attached to the base plate, arranged perpendicular to the stress dispersion member, and extending in opposite directions of the stress dispersion member.

17. The housing of claim 16, wherein the stress dispersing member comprises:

a fixing bracket forming an arch at a bottom of the stress dispersion member, wherein the spine passes through a partition formed in the fixed bracket in the top of the deck.

18. A housing as claimed in claim 1, 3, 5 or 8, wherein each of said component housings has a top face and a bottom face secured to said upper cover and said base plate, respectively.

19. The housing of claims 1, 3, 5, or 8, wherein each of the component housings is configured to receive electronic devices in a stacked array.

20. The casing of claim 2, 4, 5 or 6, wherein a region of the stress dispersing member aligned with the central gallery is perforated.

21. A casing according to claim 2, 3, 5 or 6, wherein the stress distributing member and the set of component casings are arranged adjacent to each other.

22. A casing according to claim 2, 3, 5 or 6, wherein the stress dispersing member is configured as a cantilever for the casing when a portion of the casing is suspended.

23. A casing according to claim 2, 3, 5 or 6, wherein the centre of gravity of the casing is located at the front.

24. The enclosure of claim 1, 4, 5 or 6, wherein the pair of circuit boards are substantially perpendicular to the backplane.

25. A housing according to claim 1, 4, 5 or 6, wherein the circuit board abuts the rear end of the component housing.