TWM642376U - Server device - Google Patents

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Publication number
TWM642376U
TWM642376U TW112200124U TW112200124U TWM642376U TW M642376 U TWM642376 U TW M642376U TW 112200124 U TW112200124 U TW 112200124U TW 112200124 U TW112200124 U TW 112200124U TW M642376 U TWM642376 U TW M642376U
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Taiwan
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fan
server device
module
drawing storage
storage array
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TW112200124U
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Chinese (zh)
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健南 許
張鵬程
王建文
蔡惠卿
蘇俊鴻
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勤誠興業股份有限公司
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Priority to TW112200124U priority Critical patent/TWM642376U/en
Publication of TWM642376U publication Critical patent/TWM642376U/en

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Abstract

A server device includes a chassis, a first fan assembly, a front-drawing storage array, two side-drawing storage arrays, a power supply module and a motherboard module. The chassis includes a case body having an accommodating space, and a partition board separating the accommodating space into an upper layer area and a lower layer area stacked with each other. The side-drawing storage arrays are oppositely arranged in the lower area and connected to a front end of the case body. The first fan assembly is located in the lower area and connected to a rear end of the case body. The front-drawing storage array is located in the upper area and connected to the front end of the case body. The power module is located in the upper area and connected to the rear end of the case body. The motherboard module is located in the upper area, connected to the rear end of the case body, and electrically connected to the side-drawing storage array, the first fan assembly, the front-drawing storage array and the power supply module.

Description

伺服器裝置server device

本創作係有關於一種伺服器裝置,尤指一種同時具有前抽式及側抽式儲存陣列的伺服器裝置。The invention relates to a server device, especially a server device with both front-drawing and side-drawing storage arrays.

隨著雲端服務的需求日益提升,為了提供更好的網路服務,伺服器設備不免需要搭配更多的儲存性能,以有效提高伺服器設備的服務品質。With the increasing demand for cloud services, in order to provide better network services, server equipment inevitably needs to be equipped with more storage performance, so as to effectively improve the service quality of server equipment.

然而,在業界指定的伺服器公規下,時常產生主機板模組與儲存驅動器的配置空間有限,無法使二者有效兼具配置之問題,同時,如何有效對儲存驅動器提供散熱手段也面臨許多挑戰。However, under the server specifications specified by the industry, the configuration space of the motherboard module and the storage drive is often limited, and it is impossible to effectively configure the two. At the same time, how to effectively provide heat dissipation for the storage drive is also faced challenge.

由此可見,上述技術顯然仍存在不便與缺陷,而有待加以進一步改良。因此,如何能有效地解決上述不便與缺陷,實屬當前重要研發課題之一,亦成爲當前相關領域亟需改進的目標。This shows that the above-mentioned technology obviously still has inconvenience and defective, and needs to be further improved. Therefore, how to effectively solve the above-mentioned inconveniences and defects is one of the current important research and development issues, and has become an urgent need for improvement in related fields.

本創作提出一種伺服器裝置,用以解決先前技術的問題。This creation proposes a server device to solve the problems of the prior art.

依據本創作之一實施方式,一種伺服器裝置包含一機箱、一第一風扇組、一前抽式儲存陣列、二側抽式儲存陣列、一電源模組與一主機板模組。機箱具有一箱體與一分隔板。箱體具有一容置空間,分隔板將容置空間區隔出彼此層疊之上層區及下層區。側抽式儲存陣列彼此相對地配置於下層區內,且連接箱體之一端。第一風扇組位於下層區內,且連接箱體之另端。前抽式儲存陣列位於上層區內,且連接箱體之所述端。電源模組位於上層區內,且連接箱體之另端。主機板模組位於上層區內,連接箱體之另端,且電連接這些側抽式儲存陣列、第一風扇組、前抽式儲存陣列及電源模組。According to an embodiment of the present invention, a server device includes a chassis, a first fan group, a front-drawing storage array, two side-drawing storage arrays, a power supply module and a motherboard module. The chassis has a box body and a partition board. The box body has an accommodating space, and the partition plate separates the accommodating space into an upper layer area and a lower layer area which are stacked with each other. The side-drawing storage arrays are arranged in the lower area opposite to each other and connected to one end of the box body. The first fan group is located in the lower area and connected to the other end of the cabinet. The front access storage array is located in the upper area and is connected to the end of the cabinet. The power module is located in the upper area and connected to the other end of the cabinet. The motherboard module is located in the upper area, connected to the other end of the box body, and electrically connected to these side-drawing storage arrays, the first fan group, the front-drawing storage array and the power supply module.

依據本創作一或複數個實施例,在上述之伺服器裝置中,箱體更包含一底板、一蓋板、二長側板與二開口。此二長側板位於底板之二相對側緣,且朝一相同方向延伸。蓋板相對底板,且連接長側板,使得蓋板、長側板與底板共同定義出所述容置空間。此些開口分別形成於長側板上,連接底板之二相對側 ,且接通容置空間。此些開口分別曝露出此些側抽式儲存陣列。According to one or more embodiments of the present invention, in the above server device, the box body further includes a bottom plate, a cover plate, two long side plates and two openings. The two long side plates are located on two opposite side edges of the bottom plate and extend toward a same direction. The cover plate is opposite to the bottom plate, and is connected with the long side plate, so that the cover plate, the long side plate and the bottom plate jointly define the accommodating space. These openings are respectively formed on the long side plates, connecting two opposite sides of the bottom plate, and connecting with the accommodating space. The openings respectively expose the side-drawing storage arrays.

依據本創作一或複數個實施例,在上述之伺服器裝置中,箱體更包含二側門及二扣件。此二側門分別樞接至底板之相對側緣,用以樞轉以覆蓋這些開口。此二扣件分別位於這些側門上。當其中一側門覆蓋對應之開口時,其中一扣件將對應之側門固定於箱體上。According to one or more embodiments of the present invention, in the above server device, the cabinet further includes two side doors and two fasteners. The two side doors are respectively pivotally connected to opposite side edges of the bottom plate for pivoting to cover the openings. These two fasteners are located on these side doors respectively. When one of the side doors covers the corresponding opening, one of the fasteners fixes the corresponding side door on the box body.

依據本創作一或複數個實施例,在上述之伺服器裝置中,每個側抽式儲存陣列包含一第一框架、多個第一硬碟驅動器及一第一電路背板。第一框架包含多個第一磁碟槽,這些第一磁碟槽依據一陣列方式排列。這些第一硬碟驅動器分別可抽取地位於這些第一磁碟槽內。第一電路背板電連接這些第一硬碟驅動器。According to one or more embodiments of the present invention, in the above server device, each side-loading storage array includes a first frame, a plurality of first hard disk drives and a first circuit backplane. The first frame includes a plurality of first disk slots, and the first disk slots are arranged in an array. The first hard disk drives are respectively detachably located in the first disk slots. The first circuit backplane is electrically connected to the first hard disk drives.

依據本創作一或複數個實施例,在上述之伺服器裝置中,箱體更包含一中間擋牆。中間擋牆位於下層區內,介於該第一風扇組與該些側抽式儲存陣列之間。中間擋牆固定地連接這些側抽式儲存陣列之這些第一框架及這些長側板。箱體之所述端對應下層區之位置具有一前框部。前框部包含一封閉面與二進氣框。封閉面介於這些進氣框之間,每個側抽式儲存陣列位於其中一進氣框與中間擋牆之間。According to one or more embodiments of the present invention, in the above server device, the cabinet further includes a middle retaining wall. The intermediate retaining wall is located in the lower area, between the first fan group and the side-drawing storage arrays. The middle retaining wall is fixedly connected with the first frames and the long side panels of the side drawer storage arrays. The said end of the box body has a front frame portion corresponding to the position of the lower layer area. The front frame part includes a closed surface and two air intake frames. The sealing surface is between the intake frames, and each side-drawing storage array is located between one of the intake frames and the middle retaining wall.

依據本創作一或複數個實施例,在上述之伺服器裝置中,這些側抽式儲存陣列之這些第一電路背板之間相隔出一中央廊道。中央廊道之二相對端分別連對齊封閉面及中間擋牆之多透氣口,用以容納這些側抽式儲存陣列之線材。According to one or more embodiments of the present invention, in the above server device, a central corridor is separated between the first circuit backplanes of the side-drawing storage arrays. The two opposite ends of the central corridor are respectively connected with multiple ventilation openings aligned with the closed surface and the intermediate retaining wall to accommodate the wires of these side-drawn storage arrays.

依據本創作一或複數個實施例,在上述之伺服器裝置中,第一風扇組包含多個第一風扇裝置。每個第一風扇裝置包含一第一支架、一第一風扇模組及一拉柄。這些第一風扇裝置之這些第一支架並列於箱體之另端。第一風扇模組可插拔地位於第一支架內,且電連接主機板模組。拉柄樞接於第一風扇模組上。According to one or more embodiments of the present invention, in the above server device, the first fan group includes a plurality of first fan devices. Each first fan device includes a first bracket, a first fan module and a handle. The first brackets of the first fan devices are arranged at the other end of the box body. The first fan module is pluggably located in the first bracket and electrically connected to the motherboard module. The pull handle is pivotally connected to the first fan module.

依據本創作一或複數個實施例,在上述之伺服器裝置中,前抽式儲存陣列包含一第二框架、多個第二硬碟驅動器及一第二電路背板。第二框架包含多個第二磁碟槽,這些第二磁碟槽依據一陣列方式排列。這些第二硬碟驅動器分別可抽取地位於這些第二磁碟槽內。第二電路背板電連接這些第二硬碟驅動器。According to one or more embodiments of the present invention, in the above server device, the front access storage array includes a second frame, a plurality of second hard disk drives and a second circuit backplane. The second frame includes a plurality of second disk slots, and the second disk slots are arranged in an array. The second hard disk drives are respectively detachably located in the second disk slots. The second circuit backplane is electrically connected to the second hard disk drives.

依據本創作一或複數個實施例,在上述之伺服器裝置更包含一第二風扇組與一理線槽。第二風扇組位於上層區內,介於主機板模組與前抽式儲存陣列之間,且電連接主機板模組。理線槽形成於第二風扇組與前抽式儲存陣列之間,用以容納前抽式儲存陣列之線材。According to one or more embodiments of the present invention, the above server device further includes a second fan group and a cable management slot. The second fan group is located in the upper area, between the motherboard module and the front-drawing storage array, and is electrically connected to the motherboard module. The wire management groove is formed between the second fan group and the front-drawing storage array, and is used for accommodating wires of the front-drawing storage array.

依據本創作一或複數個實施例,在上述之伺服器裝置中,第二風扇組包含一第二支架與多個第二風扇模組。第二支架固定於分隔板上,位於主機板模組與前抽式儲存陣列之間,且第二支架包含多個線性排列之風扇槽。每個第二風扇模組可插拔地位於其中一風扇槽內,且透過第二支架電連接主機板模組。每個第二風扇模組包含一施力部,施力部以供對應之第二風扇模組被抽出對應之風扇槽。According to one or more embodiments of the present invention, in the above server device, the second fan group includes a second bracket and a plurality of second fan modules. The second bracket is fixed on the partition plate and is located between the mainboard module and the front-drawing storage array, and the second bracket includes a plurality of linearly arranged fan slots. Each second fan module is pluggably located in one of the fan slots, and is electrically connected to the motherboard module through the second bracket. Each second fan module includes a force applying portion for the corresponding second fan module to be pulled out of the corresponding fan slot.

透過以上所述架構,伺服器裝置不僅能夠在有限空間下同時兼具主機板模組與儲存驅動器的存在,更能在所述有限空間內配置出最多數量的儲存驅動器,又能有效地對儲存驅動器提供適當之散熱手段。Through the above-mentioned structure, the server device can not only have the existence of the motherboard module and the storage drive in the limited space, but also can configure the maximum number of storage drives in the limited space, and can effectively manage the storage. The driver provides proper cooling means.

以上所述僅係用以闡述本創作所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本創作之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above description is only used to explain the problem to be solved by this creation, the technical means to solve the problem, and its effects, etc. The specific details of this creation will be introduced in detail in the following implementation methods and related drawings.

以下將以圖式揭露本創作之複數實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,熟悉本領域之技術人員應當瞭解到,在本創作部分實施方式中,這些實務上的細節並非必要的,因此不應用以限制本創作。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。為了便於讀者觀看,圖式中各元件的尺寸並非依實際比例繪示。The following will disclose multiple implementations of this creation with diagrams. For the sake of clarity, many practical details will be described together in the following description. However, those skilled in the art should understand that in some implementations of the present invention, these practical details are not necessary, and thus should not be used to limit the present invention. In addition, for the sake of simplifying the drawings, some well-known structures and components will be shown in a simple and schematic manner in the drawings. For the convenience of readers, the dimensions of the components in the drawings are not drawn in actual scale.

第1圖係本創作一實施方式之伺服器裝置10的立體圖。第2圖係第1圖之伺服器裝置10朝另一視角觀察的立體圖。第3圖為第1圖之伺服器裝置10的分解圖。如第1圖至第3圖所示,伺服器裝置10包含一機箱100、一第一風扇組300、一前抽式儲存陣列500、二側抽式儲存陣列600、一主機板模組700與一電源模組750(Power Supply Unit,PSU)。機箱100具有一箱體200與一分隔板210。箱體200具有一容置空間800、一前端201與一後端202。前端201與後端202彼此相對,且容置空間800位於箱體200內,介於前端201與後端202之間。分隔板210平放於箱體200內,且將容置空間800區隔出彼此層疊之上層區810及下層區820。側抽式儲存陣列600彼此相對地配置於下層區820內,且連接箱體200之前端201。第一風扇組300位於下層區820內,且連接箱體200之後端202。前抽式儲存陣列500位於上層區810內,且連接箱體200之前端201。電源模組750位於上層區810內,且連接箱體200之後端202。主機板模組700位於上層區810內,連接箱體200之後端202,且電連接這些側抽式儲存陣列600、第一風扇組300、前抽式儲存陣列500及電源模組750。Fig. 1 is a perspective view of a server device 10 according to an embodiment of the invention. FIG. 2 is a perspective view of the server device 10 in FIG. 1 viewed from another perspective. FIG. 3 is an exploded view of the server device 10 in FIG. 1 . As shown in FIGS. 1 to 3, the server device 10 includes a chassis 100, a first fan group 300, a front-drawing storage array 500, two side-drawing storage arrays 600, a motherboard module 700 and A power module 750 (Power Supply Unit, PSU). The chassis 100 has a box body 200 and a partition plate 210 . The box body 200 has an accommodating space 800 , a front end 201 and a rear end 202 . The front end 201 and the rear end 202 are opposite to each other, and the accommodating space 800 is located in the box body 200 between the front end 201 and the rear end 202 . The partition plate 210 is laid flat in the box body 200 , and partitions the accommodating space 800 into an upper layer area 810 and a lower layer area 820 stacked on each other. The side-drawing storage arrays 600 are disposed opposite to each other in the lower area 820 and connected to the front end 201 of the box body 200 . The first fan group 300 is located in the lower area 820 and connected to the rear end 202 of the cabinet 200 . The front-drawing storage array 500 is located in the upper area 810 and connected to the front end 201 of the box body 200 . The power module 750 is located in the upper area 810 and connected to the rear end 202 of the box body 200 . The motherboard module 700 is located in the upper area 810 , connected to the rear end 202 of the case 200 , and electrically connected to the side-drawing storage array 600 , the first fan group 300 , the front-drawing storage array 500 and the power supply module 750 .

如此,當一使用者面向伺服器裝置10之箱體200之前端201時,使用者能夠於箱體200之前端201操作對應之前抽式儲存陣列500,或者,將伺服器裝置10從一機櫃(圖中未示)拉出,便能夠從機箱100之兩側操作對應之側抽式儲存陣列600。故,透過以上架構,伺服器裝置10不僅能夠在有限空間下同時兼具主機板模組700與儲存驅動器的存在,更能在所述有限空間內配置出最多數量的儲存驅動器,又能有效地對儲存驅動器提供適當之散熱手段。In this way, when a user faces the front end 201 of the cabinet 200 of the server device 10, the user can operate the corresponding front-loading storage array 500 at the front end 201 of the cabinet 200, or the server device 10 can be removed from a cabinet ( (not shown in the figure) is pulled out, and the corresponding side-drawing storage array 600 can be operated from both sides of the chassis 100. Therefore, through the above structure, the server device 10 can not only have the existence of the motherboard module 700 and the storage drive in the limited space, but also can configure the maximum number of storage drives in the limited space, and can effectively Provide proper heat dissipation for storage drives.

再者,箱體200之前端201對應下層區820之位置具有一前框部240。箱體200之後端202對應下層區820之位置具有一第一開槽251,且第一風扇組300透過第一開槽251外露於機箱100之外。箱體200之前端201對應上層區810之位置具有一第二開槽243,且前抽式儲存陣列500透過第二開槽243外露於機箱100之外。箱體200之後端202對應上層區810之位置具有一後框部250。Furthermore, the front end 201 of the box body 200 has a front frame portion 240 at a position corresponding to the lower area 820 . The rear end 202 of the case body 200 has a first slot 251 at a position corresponding to the lower area 820 , and the first fan group 300 is exposed outside the case 100 through the first slot 251 . The front end 201 of the box body 200 has a second slot 243 at a position corresponding to the upper area 810 , and the front-loading storage array 500 is exposed outside the chassis 100 through the second slot 243 . The rear end 202 of the box body 200 has a rear frame portion 250 at a position corresponding to the upper zone 810 .

更具體地,如第3圖所示,箱體200更包含一蓋體220、一底板230及二長側板260。此二長側板260分別鄰接於底板230之二相對側緣231,此二長側板260皆朝一相同方向(如Z軸)延伸,蓋體220相對底板230配置,且覆蓋至此些長側板260相對底板230之一側,使得蓋體220、底板230及長側板260共同定義出容置空間800。分隔板210之二相對側分別固接至箱體200之此二長側板260。每個長側板260上更具有一開口261。開口261連接底板230之其中一側緣,且接通容置空間800。每個開口261足以曝露出其中一側抽式儲存陣列600。More specifically, as shown in FIG. 3 , the box body 200 further includes a cover body 220 , a bottom plate 230 and two long side plates 260 . The two long side plates 260 are respectively adjacent to the two opposite side edges 231 of the bottom plate 230, and the two long side plates 260 all extend towards a same direction (such as the Z axis). 230 , so that the cover body 220 , the bottom plate 230 and the long side plate 260 jointly define the accommodating space 800 . Two opposite sides of the partition plate 210 are respectively fixed to the two long side plates 260 of the box body 200 . Each long side plate 260 further has an opening 261 . The opening 261 is connected to one side edge of the bottom plate 230 and connected to the accommodating space 800 . Each opening 261 is sufficient to expose one of the side-loading storage arrays 600 .

箱體200更包含二側門280及二扣件281。每個側門280樞接至機箱100上,以便轉動而覆蓋或外露出對應之開口261。在本實施例中,每個側門280樞接至底板230之側緣231,使得側門280朝下翻轉以外露出對應之側抽式儲存陣列600(第1圖),或者,側門280朝上翻轉以覆蓋開口261(第2圖)。每個扣件281位於其中一側門280上。當側門280覆蓋對應之開口261時,扣件281將對應之側門280扣合於箱體200的一非活動式結構(例如長側板260或底板230)上(第2圖),使其暫時無法朝下翻轉並露出側抽式儲存陣列600。在本實施例中,扣件281例如為一可回彈之柱塞(plunger),然而,本創作不限於此。The box body 200 further includes two side doors 280 and two fasteners 281 . Each side door 280 is pivotally connected to the chassis 100 so as to be rotated to cover or expose the corresponding opening 261 . In this embodiment, each side door 280 is pivotally connected to the side edge 231 of the base plate 230, so that the side door 280 is turned downward to expose the corresponding side-drawn storage array 600 (FIG. 1 ), or the side door 280 is turned upward to expose Cover opening 261 (FIG. 2). Each fastener 281 is located on one side of the door 280 . When the side door 280 covers the corresponding opening 261, the fastener 281 will fasten the corresponding side door 280 on a non-movable structure (such as the long side plate 260 or the bottom plate 230) of the box body 200 (Fig. Flip down and expose the side access storage array 600 . In this embodiment, the fastener 281 is, for example, a resilient plunger, however, the present invention is not limited thereto.

更具體地,第4A圖為第1圖之伺服器裝置10之機箱100之下層區820的俯視圖。如第3圖與第4A圖所示,每個側抽式儲存陣列600包含一第一框架610、一第一電路背板630與多個第一硬碟驅動器640。第一框架610鎖固於箱體200上,且第一框架610包含多個第一磁碟槽620,且這些第一磁碟槽620依據一陣列方式排列。這些第一硬碟驅動器640分別可抽取地位於這些第一磁碟槽620內。第一電路背板630固定於第一框架610背對開口261之一側,且第一電路背板630電連接主機板模組700。舉例來說,第一電路背板630上分布多個連接埠631,每個第一硬碟驅動器640之連接端子641用以插接至第一電路背板630之其中一連接埠631,並透過第一電路背板630電連接主機板模組700。More specifically, FIG. 4A is a top view of the lower layer area 820 of the chassis 100 of the server device 10 in FIG. 1 . As shown in FIG. 3 and FIG. 4A , each side-loading storage array 600 includes a first frame 610 , a first circuit backplane 630 and a plurality of first hard disk drives 640 . The first frame 610 is locked on the case body 200, and the first frame 610 includes a plurality of first disk slots 620, and the first disk slots 620 are arranged in an array. The first hard disk drives 640 are respectively detachably located in the first disk slots 620 . The first circuit backplane 630 is fixed on a side of the first frame 610 facing away from the opening 261 , and the first circuit backplane 630 is electrically connected to the motherboard module 700 . For example, a plurality of connection ports 631 are distributed on the first circuit backplane 630, and the connection terminal 641 of each first hard disk drive 640 is used to plug into one of the connection ports 631 of the first circuit backplane 630, and through The first circuit backplane 630 is electrically connected to the motherboard module 700 .

如此,如第1圖與第3圖所示,側抽式儲存陣列600之任一第一硬碟驅動器640可以從對應之開口261被朝外抽出對應之第一磁碟槽620。如此,使用者能夠開啟其中一側門280,並從其開口261更換或維修此第一硬碟驅動器640。舉例來說,第一硬碟驅動器640包含2.5或3.5寸之硬碟,然而,本創作不限於此。In this way, as shown in FIG. 1 and FIG. 3 , any first hard disk drive 640 of the side-loading storage array 600 can be pulled out of the corresponding first disk slot 620 from the corresponding opening 261 . In this way, the user can open one side door 280 and replace or repair the first hard disk drive 640 through the opening 261 . For example, the first hard disk drive 640 includes a 2.5-inch or 3.5-inch hard disk, however, the present invention is not limited thereto.

如第3圖與第4A圖所示,箱體200更包含一中間擋牆270。中間擋牆270位於下層區820內,且中間擋牆270介於第一風扇組300與這些第一框架610之間。中間擋牆270之二相對端分別固定地連接箱體200之長側板260,且中間擋牆270之一面固定地連接此些第一框架610。如此,側抽式儲存陣列600能夠更穩定地位於箱體200內。As shown in FIG. 3 and FIG. 4A , the box body 200 further includes a middle retaining wall 270 . The intermediate retaining wall 270 is located in the lower area 820 , and the intermediate retaining wall 270 is interposed between the first fan group 300 and the first frames 610 . Two opposite ends of the middle retaining wall 270 are respectively fixedly connected to the long side panels 260 of the box body 200 , and one side of the middle retaining wall 270 is fixedly connected to the first frames 610 . In this way, the side-drawing storage array 600 can be more stably located in the box body 200 .

此外,這些側抽式儲存陣列600之這些第一電路背板630之間相隔出一中央廊道830。更具體地,中央廊道830介於中間擋牆270及前框部240之間,且被底板230、分隔板210及這些第一電路背板630所共同定義而成。中央廊道830用以容納這些側抽式儲存陣列600連接至主機板模組700之線材(圖中未示)。在本實施例中,中央廊道830之長軸方向(如X軸)與中間擋牆270之長軸方向(如Y軸)彼此正交,然而,本創作不限於此。In addition, a central corridor 830 is separated between the first circuit backplanes 630 of the side-drawing storage arrays 600 . More specifically, the central corridor 830 is located between the intermediate retaining wall 270 and the front frame portion 240 , and is jointly defined by the bottom plate 230 , the partition plate 210 and the first circuit backplanes 630 . The central corridor 830 is used for accommodating the cables (not shown) connecting the side-loading storage arrays 600 to the motherboard module 700 . In this embodiment, the long-axis direction (such as the X-axis) of the central corridor 830 and the long-axis direction (such as the Y-axis) of the intermediate retaining wall 270 are orthogonal to each other, however, the present invention is not limited thereto.

如第3圖與第4A圖所示,前框部240包含一封閉面241與二進氣框242。封閉面241介於這些進氣框242之間,每個側抽式儲存陣列600連接其中一進氣框242與中間擋牆270,且中央廊道830連接封閉面241及中間擋牆270。As shown in FIG. 3 and FIG. 4A , the front frame portion 240 includes a closed surface 241 and two air intake frames 242 . The closed surface 241 is located between the air intake frames 242 , each side pumping storage array 600 connects one of the air intake frames 242 and the intermediate retaining wall 270 , and the central corridor 830 connects the enclosed surface 241 and the intermediate retaining wall 270 .

第4B圖為第4A圖之箱體200之下層區820的操作示意圖。如第4A圖與第4B圖所示,當啟動第一風扇組300朝外抽氣時,由於封閉面241正對中央廊道830,被第一風扇組300帶動的氣流A從每個進氣框242進入對應之側抽式儲存陣列600內,使得上述氣流A之一部分A1經由所有第一硬碟驅動器640而到達第一風扇組300,上述氣流A之另部分A2從每個第一磁碟槽620進入中央廊道830內,並於中央廊道830內集中匯集後,而從中間擋牆270之透氣口271直線到達第一風扇組300。由於側門280覆蓋至對應之開口261,故,氣流A從進氣框242抵達第一風扇組300之過程中,不致從機箱100兩側之開口261(第1圖)溢出。如此,對這些側抽式儲存陣列600之第一硬碟驅動器640提供了更有效的散熱手段。FIG. 4B is a schematic diagram of the operation of the lower layer area 820 of the box body 200 in FIG. 4A. As shown in Fig. 4A and Fig. 4B, when the first fan group 300 is activated to draw air outward, since the closed surface 241 is facing the central corridor 830, the airflow A driven by the first fan group 300 enters from each Frame 242 enters into the corresponding side-drawing storage array 600, so that part A1 of the above-mentioned airflow A reaches the first fan group 300 through all the first hard disk drives 640, and the other part A2 of the above-mentioned airflow A is from each first disk The slots 620 enter the central corridor 830 and gather together in the central corridor 830 , and then reach the first fan group 300 from the air vent 271 of the intermediate retaining wall 270 in a straight line. Since the side door 280 covers the corresponding opening 261, the airflow A will not overflow from the openings 261 (FIG. 1 ) on both sides of the chassis 100 when it reaches the first fan group 300 from the intake frame 242 . In this way, a more effective heat dissipation method is provided for the first hard disk drives 640 of the side-loading storage arrays 600 .

更具體地,如第3圖與第4A圖所示,第一風扇組300包含多個第一風扇裝置310。每個第一風扇裝置310包含一第一支架311、一第一風扇模組312及一拉柄313。這些第一風扇裝置310之這些第一支架311並列於箱體200之第一開槽251內,且透過第一開槽251外露於機箱100之外。第一風扇模組312線性地依序排列,且第一風扇模組312之排列方向(如Y軸)平行第一硬碟驅動器640之抽取方向(如Y軸)。第一風扇模組312可插拔地位於第一支架311內,且電連接主機板模組700。更具體地,第一風扇模組312可熱插拔地連接主機板模組700。拉柄313樞接於第一風扇模組312上,方便使用者將第一風扇模組312手動安裝於對應之第一支架311中,或從第一支架311中被手動拆卸。舉例來說,第一風扇模組312為雙轉子風扇,以加強風流疏導,提升整體運行散熱效果。More specifically, as shown in FIG. 3 and FIG. 4A , the first fan set 300 includes a plurality of first fan devices 310 . Each first fan device 310 includes a first bracket 311 , a first fan module 312 and a handle 313 . The first brackets 311 of the first fan devices 310 are arranged in the first slot 251 of the casing 200 , and are exposed outside the casing 100 through the first slot 251 . The first fan modules 312 are linearly arranged sequentially, and the arrangement direction (such as the Y axis) of the first fan modules 312 is parallel to the extraction direction (such as the Y axis) of the first hard disk drive 640 . The first fan module 312 is pluggably located in the first bracket 311 and electrically connected to the motherboard module 700 . More specifically, the first fan module 312 is hot-swappably connected to the motherboard module 700 . The handle 313 is pivotally connected to the first fan module 312 , which is convenient for the user to manually install the first fan module 312 in the corresponding first bracket 311 or manually disassemble it from the first bracket 311 . For example, the first fan module 312 is a dual-rotor fan to enhance air flow guidance and improve overall cooling effect during operation.

如此,當使用者欲維修或更換任一第一風扇模組312時,使用者只需要繞到伺服器裝置10之箱體200之後端202(第2圖),便可快速地透過拉柄313移除對應之第一風扇模組312,不須拉出伺服器裝置10之全部,從而降低危害使用者之風險。In this way, when the user wants to repair or replace any one of the first fan modules 312, the user only needs to go around to the rear end 202 of the cabinet 200 of the server device 10 (see FIG. 2 ), and then quickly pass through the handle 313 To remove the corresponding first fan module 312, it is not necessary to pull out the entire server device 10, thereby reducing the risk of harming the user.

第5圖為第1圖之伺服器裝置10之機箱100之上層區810的俯視圖。更具體地,如第3圖與第5圖所示,前抽式儲存陣列500包含一第二框架510、一第二電路背板520及多個第二硬碟驅動器530。第二框架510鎖固於箱體200之第二開槽243(第3圖)。第二框架510包含多個第二磁碟槽511,且這些第二磁碟槽511依據一陣列方式排列。這些第二硬碟驅動器530分別可抽取地位於這些第二磁碟槽511內。第二電路背板520位於上層區810內,且固定於第二框架510背對箱體200之前端201之一側。第二電路背板520電連接主機板模組700。舉例來說,第二電路背板520上分布多個連接埠521,每個第二硬碟驅動器530之連接端子531用以插接至第二電路背板520之其中一連接埠521,並透過第二電路背板520電連接主機板模組700。舉例來說,第二硬碟驅動器530包含2.5或3.5寸之硬碟,然而,本創作不限於此。FIG. 5 is a top view of the upper layer area 810 of the chassis 100 of the server device 10 in FIG. 1 . More specifically, as shown in FIG. 3 and FIG. 5 , the front access storage array 500 includes a second frame 510 , a second circuit backplane 520 and a plurality of second hard disk drives 530 . The second frame 510 is locked in the second slot 243 of the box body 200 (FIG. 3). The second frame 510 includes a plurality of second disk slots 511 , and the second disk slots 511 are arranged in an array. The second hard disk drives 530 are respectively detachably located in the second disk slots 511 . The second circuit backboard 520 is located in the upper area 810 and fixed on a side of the second frame 510 facing away from the front end 201 of the box body 200 . The second circuit backplane 520 is electrically connected to the motherboard module 700 . For example, a plurality of connection ports 521 are distributed on the second circuit backplane 520, and the connection terminal 531 of each second hard disk drive 530 is used to plug into one of the connection ports 521 of the second circuit backplane 520, and through The second circuit backplane 520 is electrically connected to the motherboard module 700 . For example, the second hard disk drive 530 includes a 2.5-inch or 3.5-inch hard disk, however, the present invention is not limited thereto.

如此,使用者能夠於機箱100之前方,將前抽式儲存陣列500之任一第二硬碟驅動器530抽出對應之第二磁碟槽511,從而更換或維修此第二硬碟驅動器530。前抽式儲存陣列500之第二硬碟驅動器530之抽取方向(如X軸) 與每個側抽式儲存陣列600之第一硬碟驅動器640之抽取方向(如Y軸)彼此正交。In this way, the user can pull any second hard disk drive 530 of the front-loading storage array 500 out of the corresponding second disk slot 511 at the front of the chassis 100 to replace or repair the second hard disk drive 530 . The extraction direction (such as the X-axis) of the second hard disk drive 530 of the front-access storage array 500 and the extraction direction (such as the Y-axis) of the first hard disk drive 640 of each side-access storage array 600 are orthogonal to each other.

主機板模組700包含一主機板710與多個電子元件720。主機板710位於上層區810內,放置於分隔板210上,且連接後框部250。電子元件720排列於主機板710上,且彼此透過主機板710相應地電連接。電子元件720例如為中央處理單元、圖形處理單元、記憶體裝置與網路介面卡等等。主機板模組700更包含輸入輸出模組730,輸入輸出模組730電連接主機板710,且從後框部250所外露。The motherboard module 700 includes a motherboard 710 and a plurality of electronic components 720 . The motherboard 710 is located in the upper area 810 , placed on the partition board 210 , and connected to the rear frame portion 250 . The electronic components 720 are arranged on the main board 710 and are electrically connected to each other through the main board 710 . The electronic component 720 is, for example, a central processing unit, a graphics processing unit, a memory device, a network interface card, and the like. The motherboard module 700 further includes an input-output module 730 , the input-output module 730 is electrically connected to the motherboard 710 and is exposed from the rear frame portion 250 .

在本實施例中,伺服器裝置10更包含後硬碟裝置740,後硬碟裝置740位於上層區810內,配置於分隔板210上,且介於主機板模組700與電源模組750之間,且後硬碟裝置740電連接主機板模組700。然而,本創作不限於主機板模組700、後硬碟裝置740與電源模組750之配置位置,其他實施例中,主機板模組700、後硬碟裝置740與電源模組750能夠依據尺寸及數量之不同進行相應地排列。In this embodiment, the server device 10 further includes a rear hard disk device 740. The rear hard disk device 740 is located in the upper zone 810, disposed on the partition plate 210, and interposed between the motherboard module 700 and the power module 750. between, and the rear hard disk device 740 is electrically connected to the motherboard module 700 . However, the present invention is not limited to the configuration positions of the motherboard module 700, the rear hard disk device 740 and the power module 750. And the difference in quantity is arranged accordingly.

在本實施例中,伺服器裝置10更包含一第二風扇組400。第二風扇組400位於上層區810內,介於主機板模組700與前抽式儲存陣列500之間,且電連接主機板模組700。第二風扇組400與前抽式儲存陣列500之間相隔出一理線槽840,理線槽840用以容納前抽式儲存陣列500之線材(圖中未示)。In this embodiment, the server device 10 further includes a second fan group 400 . The second fan group 400 is located in the upper area 810 , between the motherboard module 700 and the front-loading storage array 500 , and is electrically connected to the motherboard module 700 . A cable management slot 840 is separated between the second fan group 400 and the front-drawing storage array 500 , and the cable management slot 840 is used for accommodating wires (not shown in the figure) of the front-drawing storage array 500 .

故,當啟動第二風扇組400而朝向箱體200之後框部250吹氣時,被第二風扇組400帶動的氣流進入前抽式儲存陣列500,並將第二硬碟驅動器530之熱能經由理線槽840送入第二風扇組400,第二風扇組400再將主機板模組700之熱能從後框部250送出機箱100之外。如此,第二風扇組400能夠同時對前抽式儲存陣列500及主機板模組700之這些第二硬碟驅動器530提供了更有效的散熱手段。Therefore, when the second fan group 400 is activated to blow air toward the rear frame 250 of the case body 200, the airflow driven by the second fan group 400 enters the front-drawing storage array 500, and passes the heat energy of the second hard disk drive 530 through The cable management groove 840 sends into the second fan group 400 , and the second fan group 400 sends the heat energy of the motherboard module 700 out of the chassis 100 from the rear frame part 250 . In this way, the second fan group 400 can simultaneously provide a more effective cooling method for the second hard disk drives 530 of the front-drawing storage array 500 and the motherboard module 700 .

更進一步地,第二風扇組400包含一第二支架410與多個第二風扇模組430。第二支架410固定於分隔板210上,位於主機板模組700與前抽式儲存陣列500之間,且第二支架410包含多個線性排列之風扇槽420。風扇槽420沿著第一硬碟驅動器640之抽取方向(如Y軸)排列。每個第二風扇模組430可插拔地位於其中一風扇槽420內,且透過第二支架410電連接主機板模組700。更具體地,第二風扇模組430可熱插拔地連接主機板模組700。每個第二風扇模組430包含一施力部431,施力部431位於第二風扇模組430面向蓋板之一側,以供使用者抓取施力部431,從而將第二風扇模組430朝上抽出風扇槽420。在本實施例中,伺服器裝置10更包含免工具拆裝的導風罩(ARIDUCT,圖中未示)設計,使得第二風扇組400之氣流能夠更集中地通過主機板模組700。 Furthermore, the second fan group 400 includes a second bracket 410 and a plurality of second fan modules 430 . The second bracket 410 is fixed on the partition plate 210 and is located between the motherboard module 700 and the front-loading storage array 500 , and the second bracket 410 includes a plurality of fan slots 420 arranged linearly. The fan slots 420 are arranged along the extraction direction (such as the Y axis) of the first hard disk drive 640 . Each second fan module 430 is pluggably located in one of the fan slots 420 , and is electrically connected to the motherboard module 700 through the second bracket 410 . More specifically, the second fan module 430 is hot-swappably connected to the motherboard module 700 . Each second fan module 430 includes a force application portion 431, and the force application portion 431 is located on the side of the second fan module 430 facing the cover, so that the user can grasp the force application portion 431, so that the second fan module Group 430 is drawn out of fan slot 420 upwards. In this embodiment, the server device 10 further includes a tool-free detachable air duct (ARIDUCT, not shown in the figure) design, so that the airflow of the second fan set 400 can pass through the motherboard module 700 more concentratedly.

此外,如第3圖、第4B圖與第5圖所示,上層區810與下層區820的散熱機制為各別獨立進氣、出氣,經分隔板210分開,彼此散熱氣流互不干涉。更具體地,上層區810之氣流以直通的方式流動,依序經由第二開槽243、前抽式儲存陣列500、第二風扇組400、主機板模組700,最後從後框部250排出;反觀,下層區820之氣流則依序經由進氣框242、側抽式儲存陣列600,在中央廊道830匯流之後,再透過第一風扇組300之引導,從而於第一開槽251排出箱體200之外。 In addition, as shown in FIG. 3 , FIG. 4B and FIG. 5 , the heat dissipation mechanisms of the upper zone 810 and the lower zone 820 are independent air intake and outlet, separated by the partition plate 210 , and the heat dissipation airflow does not interfere with each other. More specifically, the airflow in the upper zone 810 flows in a straight-through manner, passing through the second slot 243 , the front-drawing storage array 500 , the second fan group 400 , the mainboard module 700 , and finally exhausted from the rear frame 250 On the other hand, the airflow in the lower area 820 passes through the air intake frame 242 and the side-drawn storage array 600 in sequence, and after converging in the central corridor 830, it is guided by the first fan group 300 to be discharged in the first slot 251 Outside the box 200.

應當說明的是,在本實施例中,機箱100為至少4U的機架,意即,機箱100空間的高度為4個單位高度,然而,本創作不不對伺服器的尺寸進行限定,例如2U、3U等高度均可採用本創作上述所提供的技術方案。 It should be noted that, in this embodiment, the chassis 100 is a rack of at least 4U, that is, the height of the space of the chassis 100 is 4 unit heights, however, this invention does not limit the size of the server, such as 2U, 3U and other heights can adopt the technical solutions provided above in this creation.

最後,上述所揭露之各實施例中,並非用以限定本創作,任何熟習此技藝者,在不脫離本創作之精神和範圍內,當可作各種之更動與潤飾,皆可被保護於本創作中。因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。Finally, the embodiments disclosed above are not intended to limit this creation. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of this creation, and all of them can be protected in this creation. creation. Therefore, the scope of protection of this creation should be defined by the scope of the attached patent application.

10:伺服器裝置 100:機箱 200:箱體 201:前端 202:後端 210:分隔板 220:蓋體 230:底板 231:側緣 240:前框部 241:封閉面 242:進氣框 243:第二開槽 250:後框部 251:第一開槽 260:長側板 261:開口 270:中間擋牆 271:透氣口 280:側門 281:扣件 300:第一風扇組 310:第一風扇裝置 311:第一支架 312:第一風扇模組 313:拉柄 400:第二風扇組 410:第二支架 420:風扇槽 430:第二風扇模組 431:施力部 500:前抽式儲存陣列 510:第二框架 511:第二磁碟槽 520:第二電路背板 521:連接埠 530:第二硬碟驅動器 531:連接端子 600:側抽式儲存陣列 610:第一框架 620:第一磁碟槽 630:第一電路背板 631:連接埠 640:第一硬碟驅動器 641:連接端子 700:主機板模組 710:主機板 720:電子元件 730:輸入輸出模組 740:後硬碟裝置 750:電源模組 800:容置空間 810:上層區 820:下層區 830:中央廊道 840:理線槽 A:氣流 A1:氣流之一部分 A2:氣流之另部分 X、Y、Z:軸 10: Server device 100: Chassis 200: cabinet 201: front end 202: Backend 210: Partition board 220: cover body 230: Bottom plate 231: side edge 240: front frame 241: closed surface 242: Air intake frame 243: Second slot 250: Rear frame 251: The first slot 260: long side panel 261: opening 270: middle retaining wall 271: ventilation port 280: side door 281: Fasteners 300: The first fan group 310: The first fan device 311: The first bracket 312: The first fan module 313: pull handle 400: Second fan group 410: second bracket 420: fan slot 430: Second fan module 431: force department 500: front access storage array 510: second frame 511: Second disk slot 520: second circuit backplane 521: port 530: Second hard drive 531: Connecting terminal 600:Side-drawn storage array 610: First frame 620: The first disk slot 630: The first circuit backplane 631: port 640: First hard drive 641: Connecting terminal 700: Motherboard module 710: Motherboard 720: Electronic components 730: Input and output module 740: rear hard disk device 750: Power module 800:Accommodating space 810: upper area 820: lower area 830: Central Corridor 840: cable management slot A: Airflow A1: part of the airflow A2: Another part of the airflow X, Y, Z: axes

為讓本創作之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖係本創作一實施方式之伺服器裝置的立體圖。 第2圖係第1圖之伺服器裝置朝另一視角觀察的立體圖。 第3圖為第1圖之伺服器裝置的分解圖。 第4A圖為第1圖之伺服器裝置之機箱之下層區的俯視圖。 第4B圖為第4A圖之機箱之下層區的操作示意圖。 第5圖為第1圖之伺服器裝置之機箱之上層區的俯視圖。 In order to make the above-mentioned and other purposes, features, advantages and embodiments of this creation more obvious and easy to understand, the description of the accompanying drawings is as follows: Fig. 1 is a perspective view of a server device according to an embodiment of the invention. Fig. 2 is a perspective view of the server device in Fig. 1 viewed from another angle. Fig. 3 is an exploded view of the server device in Fig. 1. FIG. 4A is a top view of the lower layer of the chassis of the server device in FIG. 1 . FIG. 4B is a schematic diagram of the operation of the lower layer of the cabinet in FIG. 4A. Fig. 5 is a top view of the upper layer area of the chassis of the server device in Fig. 1.

10:伺服器裝置 10: Server device

100:機箱 100: Chassis

200:箱體 200: cabinet

201:前端 201: front end

202:後端 202: Backend

220:蓋體 220: cover body

230:底板 230: Bottom plate

240:前框部 240: front frame

260:長側板 260: long side panel

261:開口 261: opening

280:側門 280: side door

281:扣件 281: Fasteners

300:第一風扇組 300: The first fan group

500:前抽式儲存陣列 500: front access storage array

511:第二磁碟槽 511: Second disk slot

530:第二硬碟驅動器 530: Second hard drive

531:連接端子 531: Connecting terminal

620:第一磁碟槽 620: The first disk slot

640:第一硬碟驅動器 640: First hard drive

641:連接端子 641: Connecting terminal

800:容置空間 800:Accommodating space

810:上層區 810: upper area

820:下層區 820: lower area

X、Y、Z:軸 X, Y, Z: axes

Claims (10)

一種伺服器裝置,包含:一機箱,具有一箱體與一分隔板,該箱體具有一容置空間,該分隔板將該容置空間區隔出彼此層疊之一上層區及一下層區;二側抽式儲存陣列,彼此相對地配置於該下層區內,且連接該箱體之一端;一第一風扇組,位於該下層區內,且連接該箱體之另端;一前抽式儲存陣列,位於該上層區內,且連接該箱體之該端;一電源模組,位於該上層區內,且連接該箱體之該另端;以及一主機板模組,位於該上層區內,連接該箱體之該另端,且電連接該些側抽式儲存陣列、該第一風扇組、該前抽式儲存陣列及該電源模組。 A server device, comprising: a chassis with a box body and a partition plate, the box body has an accommodating space, and the partition plate separates the accommodating space into an upper layer area and a lower layer layered on each other area; two side-drawing storage arrays are disposed opposite to each other in the lower area and connected to one end of the box; a first fan group is located in the lower area and connected to the other end of the box; a front A pumping storage array is located in the upper area and connected to the end of the box; a power supply module is located in the upper area and connected to the other end of the box; and a motherboard module is located in the In the upper area, connect the other end of the cabinet and electrically connect the side-drawing storage arrays, the first fan group, the front-drawing storage array and the power supply module. 如請求項1所述之伺服器裝置,其中該箱體包含:一底板;二長側板,位於該底板之二相對側緣,且朝一相同方向延伸;一蓋板,相對該底板,且連接該些長側板,使得該蓋板、該些長側板與該底板共同定義出該容置空間;以及二開口,分別形成於該些長側板上,連接該底板之該二 相對側,且接通該容置空間,其中該些開口分別曝露出該些側抽式儲存陣列。 The server device as described in claim 1, wherein the box body includes: a bottom plate; two long side plates, located at two opposite side edges of the bottom plate, and extending in the same direction; a cover plate, opposite to the bottom plate, and connected to the Some long side plates, so that the cover plate, the long side plates and the bottom plate jointly define the accommodating space; and two openings are respectively formed on the long side plates, connecting the two of the bottom plate The opposite side is connected to the accommodating space, wherein the openings respectively expose the side-drawing storage arrays. 如請求項2所述之伺服器裝置,其中該箱體更包含:二側門,分別樞接至該底板之該二相對側緣,用以樞轉以覆蓋該些開口;以及二扣件,分別位於該些側門上,其中當該些側門其中之一覆蓋該些開口其中之一時,該些扣件其中之一將對應之該側門固定於該箱體上。 The server device as described in claim 2, wherein the box body further comprises: two side doors, respectively pivotally connected to the two opposite side edges of the bottom plate, for pivoting to cover the openings; and two fasteners, respectively Located on the side doors, when one of the side doors covers one of the openings, one of the fasteners will fix the corresponding side door on the box body. 如請求項2所述之伺服器裝置,其中該些側抽式儲存陣列中每一者包含:一第一框架,包含複數個第一磁碟槽,該些第一磁碟槽依據一陣列方式排列;複數個第一硬碟驅動器,分別可抽取地位於該些第一磁碟槽內;以及一第一電路背板,電連接該些第一硬碟驅動器。 The server device as described in claim 2, wherein each of the side-loading storage arrays includes: a first frame, including a plurality of first disk slots, and the first disk slots are based on an array method Arrangement; a plurality of first hard disk drives respectively detachably located in the first disk slots; and a first circuit backplane electrically connected to the first hard disk drives. 如請求項4所述之伺服器裝置,其中該箱體更包含:一中間擋牆,位於該下層區內,介於該第一風扇組與該些側抽式儲存陣列之間,且該中間擋牆固定地連接該些側抽式儲存陣列之該些第一框架及該些長側板, 其中該箱體之該端對應該下層區之位置具有一前框部,該前框部包含一封閉面與二進氣框,該封閉面介於該些進氣框之間,該些側抽式儲存陣列中每一者位於該些進氣框其中之一與該中間擋牆之間。 The server device as described in claim 4, wherein the cabinet further includes: a middle retaining wall, located in the lower area, between the first fan group and the side-drawing storage arrays, and the middle The retaining wall is fixedly connected to the first frames and the long side panels of the side drawer storage arrays, Wherein the end of the box body has a front frame part corresponding to the position of the lower floor area, the front frame part includes a closed surface and two air intake frames, the closed surface is between the air intake frames, and the side drawers Each of the storage arrays is located between one of the air intake frames and the intermediate retaining wall. 如請求項5所述之伺服器裝置,其中該些側抽式儲存陣列之該些第一電路背板之間相隔出一中央廊道,該中央廊道之二相對端分別連對齊該封閉面及該中間擋牆之複數個透氣口,用以容納該些側抽式儲存陣列之線材。 The server device as described in claim 5, wherein a central corridor is separated between the first circuit backplanes of the side-drawing storage arrays, and the two opposite ends of the central corridor are respectively connected to the closed surface And a plurality of ventilation openings in the middle retaining wall are used to accommodate the wires of the side-drawing storage arrays. 如請求項1所述之伺服器裝置,其中該第一風扇組包含複數個第一風扇裝置,該些第一風扇裝置中每一者包含:一第一支架,其中該些第一風扇裝置之該些第一支架並列於該箱體之該另端;一第一風扇模組,可插拔地位於該第一支架內,且電連接該主機板模組;以及一拉柄,樞接於該第一風扇模組上。 The server device as described in claim 1, wherein the first fan group includes a plurality of first fan devices, and each of the first fan devices includes: a first bracket, wherein one of the first fan devices The first brackets are arranged side by side at the other end of the box body; a first fan module is pluggably located in the first bracket and electrically connected to the motherboard module; and a pull handle is pivotally connected to on the first fan module. 如請求項1或7所述之伺服器裝置,其中該前抽式儲存陣列包含:一第二框架,包含複數個第二磁碟槽,該些第二磁碟槽依據一陣列方式排列;複數個第二硬碟驅動器,分別可抽取地位於該些第二磁 碟槽內;以及一第二電路背板,電連接該些第二硬碟驅動器。 The server device as described in claim 1 or 7, wherein the front-loading storage array includes: a second frame, including a plurality of second disk slots, and the second disk slots are arranged in an array; a second hard drive, each removably located on the second and a second circuit backplane electrically connected to the second hard disk drives. 如請求項1或7所述之伺服器裝置,更包含:一第二風扇組,位於該上層區內,介於該主機板模組與該前抽式儲存陣列之間,且電連接該主機板模組;以及一理線槽,形成於該第二風扇組與該前抽式儲存陣列之間,用以容納該前抽式儲存陣列之線材。 The server device as described in claim 1 or 7, further comprising: a second fan group, located in the upper zone, between the motherboard module and the front-loading storage array, and electrically connected to the host a board module; and a cable management trough formed between the second fan group and the front-drawing storage array for accommodating the wires of the front-drawing storage array. 如請求項9所述之伺服器裝置,其中該第二風扇組包含:一第二支架,固定於該分隔板上,位於該主機板模組與該前抽式儲存陣列之間,且該第二支架包含複數個線性排列之風扇槽;以及複數個第二風扇模組,該些第二風扇模組中每一者可插拔地位於該些風扇槽其中之一內,且透過該第二支架電連接該主機板模組,其中該些第二風扇模組中每一者包含一施力部,該施力部以供對應之該第二風扇模組被抽出對應之該風扇槽。 The server device as described in claim 9, wherein the second fan group includes: a second bracket, fixed on the partition plate, between the motherboard module and the front-drawing storage array, and the The second bracket includes a plurality of linearly arranged fan slots; and a plurality of second fan modules, each of the second fan modules is pluggably located in one of the fan slots, and passes through the first fan modules The two brackets are electrically connected to the motherboard module, wherein each of the second fan modules includes a force application part, and the force application part is used for the corresponding second fan module to be drawn out of the corresponding fan slot.
TW112200124U 2023-01-05 2023-01-05 Server device TWM642376U (en)

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