CN115552876A - Photosensitive assembly with anti-shake function and corresponding camera module - Google Patents

Abstract

The invention relates to a photosensitive assembly with an anti-shake function, which comprises: a photosensitive chip; the middle seat is formed by a semiconductor process, the back surface of the photosensitive chip is supported and fixed on the upper surface of the middle seat, and the middle seat is provided with a middle seat contact positioned on the outer side of the photosensitive assembly; the base comprises a bottom plate and a side wall formed by upwards extending the periphery of the bottom plate, the side wall surrounds the middle base and has a gap with the side surface of the middle base, the top surface of the side wall is provided with a base contact, and the middle base contact is electrically connected with the base contact based on a routing process; an elastic support member elastically connecting the side wall and the middle seat; and the driving element is arranged between the middle seat and the base and used for driving the middle seat to move relative to the base in a direction parallel to the photosensitive surface. The invention also provides a corresponding camera module. The invention can realize the anti-shake function of the photosensitive component with smaller space cost.

Description

Photosensitive assembly with anti-shake function and corresponding camera module

RELATED APPLICATIONS

The present application claims "photosensitive device with anti-shake function and corresponding camera module", which is filed on 26.4.26.4.2020, having priority of 202010338312.9, and the entire contents of the above applications are incorporated herein by reference.

Technical Field

The invention relates to the technical field of camera modules, in particular to a photosensitive assembly with an anti-shake function and a corresponding camera module.

Background

With the popularization of mobile electronic devices, technologies related to camera modules applied to mobile electronic devices for helping users to obtain images (e.g., videos or images) have been rapidly developed and advanced, and in recent years, camera modules have been widely applied to various fields such as medical treatment, security, industrial production, and the like. Currently, in the field of consumer electronics (e.g., the field of mobile phones), the optical anti-shake function has become one of the common functions of the camera module. When an electronic device (such as a smart phone) takes pictures, the shaking is inevitable for various reasons. For example, when a handheld smartphone is used for shooting, a photographer often has difficulty in holding the smartphone stably for a long time, the button action during shooting also easily causes instability of the smartphone, and the situations can cause image shake in a view finder frame and affect the imaging quality of a camera module. Currently, optical anti-shake is typically achieved by optical image stabilizers. Optical Image Stabilizer, abbreviated as OIS. In the prior art, an optical image stabilizer is usually disposed on an optical lens of a camera module having an optical anti-shake function. Particularly, in order to promote the imaging quality of the camera module, the present most adopted solution is to equip the lens with a voice coil motor, drives the motion of the lens through the voice coil motor, corrects the shake of the lens and effectively promotes the imaging quality. However, the anti-shake effect of the voice coil motor disposed in the optical lens is limited. On one hand, the camera module needs to rely on the photosensitive chip to image, and in many actual shooting scenes, the camera module shakes not only the optical lens, but also the photosensitive chip may shake. For example, when a photographer shakes the mobile phone unstably, not only the position of the optical lens but also the position of the photo sensor chip may be shifted, and merely adjusting the position of the optical lens may not be enough to correct the frame shift. On the other hand, the driving capability of the voice coil motor itself disposed in the optical lens is also limited, for example, the stroke of the voice coil motor is limited, and it is difficult to correct the shake when the shake amplitude is large.

In order to effectively promote the imaging quality of the camera module, the anti-shake technology aiming at the photosensitive chip appears in the prior art. For example, it is proposed to provide a pan/tilt head at the bottom of the photosensitive assembly, and the photosensitive assembly is mounted on the pan/tilt head to prevent shaking. However, the volume occupied by the cradle head structure is large, the thickness of the mobile phone can be increased, and the current trend of thinning the smart phone is not met. Moreover, because the holder is large in size, for a smart phone with an extremely precious internal space, the adoption of the holder-based anti-shake scheme may significantly increase the design difficulty of the smart phone and occupy the space of other modules (such as a battery).

Therefore, there is a need for an anti-shake solution for photosensitive components that can be miniaturized.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide an anti-shake solution for a photosensitive assembly, which can realize miniaturization.

In order to solve the above technical problem, the present invention provides a photosensitive assembly with an anti-shake function, comprising: a photosensitive chip having a photosensitive surface; the middle seat is formed by a semiconductor process, the back surface of the photosensitive chip is supported and fixed on the upper surface of the middle seat, and the middle seat is provided with a middle seat contact positioned on the outer side of the photosensitive assembly; the base comprises a bottom plate and a side wall formed by upwards extending the periphery of the bottom plate, the side wall surrounds the middle seat and has a gap with the side surface of the middle seat, the top surface of the side wall is provided with a base contact, and the middle seat contact is electrically connected with the base contact based on a routing process; an elastic support member elastically connecting the side wall and the middle seat; and the driving element is arranged between the middle seat and the base and is used for driving the middle seat to move relative to the base in a direction parallel to the light sensing surface.

The lower surface of the base is supported and fixed on the upper surface of the circuit board; wherein the wiring board is made of a plurality of alternately arranged wiring layers and insulating layers by a lamination process.

The middle seat contact and the base contact are connected through a routing process, and the metal wire is pulled to a position 50-100 mu m higher than the middle seat and then bent downwards in the routing process.

The middle seat contact and the base contact are electrically connected through a flexible semiconductor wire, the middle seat and the base are integrally formed through a semiconductor process, the middle seat and the base are separated in a sacrificial layer removing mode, and required gaps are formed between the bottom surface of the middle seat and the base and between the side surface of the middle seat and the base.

Wherein the thickness of the middle seat is 3-30 μm, the height of the base seat is 250-350 μm, and the thickness of the bottom plate is 100-280 μm; the line width of the circuit manufactured on the base is larger than that of the circuit manufactured on the middle base.

The photosensitive chip is provided with a chip contact positioned on the back surface of the photosensitive chip, the photosensitive chip is fixed on the upper surface of the middle seat through a flip-chip process, and the chip contact is electrically connected with the middle seat contact based on a reflow soldering process.

The photosensitive chip is provided with a chip contact which is positioned in the edge area of the front surface of the photosensitive chip, and the chip contact is electrically connected with the middle seat contact based on a routing process.

The middle base contact comprises a first middle base contact and a second middle base contact, the base contact comprises a first base contact and a second base contact, the first middle base contact is electrically connected with the chip contact, and the second middle base contact is connected with the first base contact; the first mid-mount contact is located inside the second mid-mount contact.

The photosensitive assembly further comprises a circuit board, the lower surface of the base is supported and fixed on the upper surface of the circuit board, and the circuit board is provided with circuit board contacts; the first base contact is located on the inner side of the second base contact, and the second base contact is electrically connected with the circuit board contact based on a routing process.

The photosensitive assembly further comprises a circuit board, the lower surface of the base is supported and fixed on the upper surface of the circuit board, and the circuit board is provided with circuit board contacts; the second base contact is located on the lower surface of the base, and the second base contact is electrically connected with the circuit board contact based on a reflow soldering process.

Wherein the elastic support comprises a fixed part and a flexible part.

The driving element comprises an in-chip driving element, the in-chip driving element is used for driving the middle seat to move in a chip plane, the movement in the chip plane comprises at least one of x-axis translation, y-axis translation and Rz rotation, the x-axis and the y-axis are two mutually vertical coordinate axes parallel to a photosensitive surface of the photosensitive chip, the z-axis is a coordinate axis consistent with the normal direction of the photosensitive surface, and the Rz rotation is rotation around the z-axis.

The driving element comprises an off-chip driving element, the off-chip driving element is used for driving the middle seat to move out of the plane of the chip, the movement out of the plane of the chip comprises z-axis translation and/or inclination adjustment of the chip, the inclination adjustment comprises Rx rotation and Ry rotation, wherein the x axis and the y axis are two mutually perpendicular coordinate axes parallel to the photosensitive surface of the photosensitive chip, the z axis is a coordinate axis consistent with the normal direction of the photosensitive surface, the Rx rotation is rotation around the x axis, and the Ry rotation is rotation around the y axis.

Wherein the driving elements comprise an on-chip driving element and an off-chip driving element, the on-chip driving element is used for driving the middle seat to move in a chip plane, and the movement in the chip plane comprises at least one of x-axis translation, y-axis translation and Rz rotation; the off-chip driving element is used for driving the middle seat to move out of the plane of the chip, the movement out of the plane of the chip comprises z-axis translation and/or inclination adjustment of the chip, the inclination adjustment comprises Rx rotation and Ry rotation, wherein the x axis and the y axis are two mutually perpendicular coordinate axes parallel to the photosensitive surface of the photosensitive chip, the z axis is a coordinate axis consistent with the normal direction of the photosensitive surface, the Rx rotation is rotation around the x axis, the Ry rotation is rotation around the y axis, and the Rz rotation is rotation around the z axis.

The sheet-in driving element is arranged between the bottom surface of the middle seat and the base, and the sheet-out driving element is arranged between the side surface of the middle seat and the side wall of the base.

Wherein the on-chip driving element is a MEMS actuator, the MEMS actuator comprises a rotary actuating unit, and the rotary actuating unit comprises at least one fan-shaped comb tooth structure, and the rotary actuating unit is suitable for driving the middle seat to realize Rz rotation through electrostatic force.

Wherein the MEMS actuator further comprises a translational actuation unit, and the rotational actuation unit comprises at least one rectangular comb-tooth structure, which is adapted to drive the middle seat by electrostatic force to realize the x-axis translation and/or the y-axis translation.

Wherein the at least one rectangular comb tooth structure is arranged at the periphery of the at least one fan-shaped comb tooth structure.

The off-chip driving element comprises an electric driving wire, two ends of the electric driving wire are respectively connected with the side wall of the base and the middle seat, and the electric driving wire comprises a thermal temperature difference wire, a shape memory alloy wire and a piezoelectric wire.

Wherein the off-chip drive element is an electrostatic plate actuator.

Wherein the on-chip drive element comprises a first permanent magnet, a second permanent magnet and a coil; first permanent magnet set up in the bottom surface of middle seat, the second permanent magnet set up in the upper surface of base, first permanent magnet with the N of second permanent magnet, S utmost point correspond each other so that form magnetic field, the coil sets up first permanent magnet with the centre of second permanent magnet, and receive the effect of the impetus in magnetic field, through setting up the coil first permanent magnet with the direction of second permanent magnet makes the middle seat is in realize under the control of the electric current of coil the x axle translation and/or the y axle translation.

Wherein the in-sheet drive element further comprises a detection element for detecting displacement of the intermediate mount relative to the base.

According to another aspect of the present invention, there is also provided a camera module, which is a periscopic module, including: a light turning element; an optical lens; and a photosensitive assembly, the photosensitive assembly being any of the photosensitive assemblies described above, wherein the middle base contact is disposed in a single-side edge region of the middle base; or arranged at two side edge areas opposite to the position of the middle seat.

Wherein the metal wire is arranged in a single-side edge region of the middle seat; or arranged at two side edge areas opposite to the position of the middle seat.

Compared with the prior art, the application has at least one of the following technical effects:

1. the anti-shake function of photosensitive assembly can be realized with less space cost.

2. The utility model provides a photosensitive assembly is particularly suitable for being used for long burnt module of making a video recording, replaces the OIS anti-shake function of camera lens through the removal of sensitization chip in xy plane to reduce the size of long burnt module of making a video recording, and improve long burnt module and shoot the shake phenomenon.

3. In the photosensitive assembly of this application, set up the middle seat and the base of semiconductor technology preparation between circuit board and photosensitive chip, drive element only need drive the less middle seat of weight and photosensitive chip removal, helps reducing drive element's occupation volume to reduce whole photosensitive assembly's size.

4. In the photosensitive assembly of some embodiments of the present application, through the special design of the gold wire (or other wires) connecting the middle seat and the base, the risk of line faults caused by the anti-shaking movement of the chip is reduced or eliminated.

5. The light sensing assembly of some embodiments of the present application is particularly suitable for being used in a periscopic long-focus camera module, and the gold thread design of the light sensing assembly is arranged on one side or two sides of the opposite position, so that the height of the periscopic long-focus camera module can be effectively reduced, and the thickness of an electronic device (such as a mobile phone) carrying the periscopic long-focus camera module can be reduced.

6. Among the photosensitive assembly of some embodiments of this application, clearance between middle seat bottom surface and base sets up piece inner drive element, set up piece outer drive element between the lateral wall of middle seat side and base, two types of drive element can mutually support, provide more removal degrees of freedom for photosensitive chip, thereby strengthen the anti-shake function, the space utilization in clearance between middle seat and the base has also been promoted simultaneously ingeniously, help controlling photosensitive assembly's overall dimension.

7. In some embodiments of the present application, the size of the middle stage and the base, and the size of the driving element can be effectively reduced by integrally forming the middle stage and the base through a semiconductor process and then separating the middle stage and the base through a process of removing a sacrificial layer.

Drawings

FIG. 1 is a schematic side view of a photosensitive assembly with an anti-shake function according to an embodiment of the present disclosure;

FIG. 2 illustrates a schematic top view of a photosensitive assembly in one embodiment of the present application;

FIG. 3a illustrates a schematic top view of a photosensitive assembly having a resilient support in one embodiment of the present application;

FIG. 3b shows an enlarged partial schematic view of the resilient support of FIG. 3a near position A;

FIG. 4 illustrates the placement of on-chip and off-chip driving elements in one embodiment of the present application;

FIG. 5 illustrates a schematic top view of an on-chip drive element of a MEMS-based actuator in one embodiment of the present application;

FIG. 6 illustrates a top view schematic diagram of an on-die drive element of a MEMS-based actuator in another embodiment of the present application;

FIG. 7 illustrates a side view schematic of an off-chip drive component based on thermal differential lines in one embodiment of the present application;

FIG. 8 illustrates a schematic top view of an off-chip drive element based on an electrostatic plate actuator in an embodiment of the present application;

FIG. 9 is a schematic diagram illustrating the movement of the off-chip driving element of FIG. 8 under the influence of an electrostatic plate;

FIG. 10 shows a side view schematic of an SMA-based off-chip drive element in one embodiment of the application;

FIG. 11a illustrates a side view schematic of an on-chip drive element based on an electromagnetic actuator in an embodiment of the present application;

FIG. 11b shows a schematic top view of an electromagnetic actuator based on an in-chip drive element in an embodiment of the present application;

FIG. 12 illustrates a schematic top view of a magnetic flux profile of a single magnet of an on-chip drive element based on an electromagnetic actuator in one embodiment of the present application;

FIG. 13 illustrates a perspective view of a periscopic module according to an embodiment of the present application;

FIG. 14 is a schematic perspective view of a photosensitive assembly showing the location of gold wires in one embodiment of the present application;

FIG. 15 is a cross-sectional view of an embodiment of the present application showing the electrical connection between the interposer 10 and the base 20 based on semiconductor wires;

FIG. 16 illustrates a perspective view of a photosensitive assembly in one embodiment of the present application.

Detailed Description

For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that the expressions first, second, etc. in this specification are used only to distinguish one feature from another feature, and do not indicate any limitation on the features. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.

In the drawings, the thickness, size, and shape of an object have been slightly exaggerated for convenience of explanation. The figures are purely diagrammatic and not drawn to scale.

It will be further understood that the terms "comprises," "comprising," "includes," "including," "has," "including," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Moreover, when a statement such as "at least one of" appears after the list of listed features, that the entirety of the listed features is modified rather than modifying individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to examples or illustrations.

As used herein, the terms "substantially," "about," and the like are used as words of table approximation, not as words of table degree, and are intended to account for inherent deviations in measured or calculated values that would be recognized by one of ordinary skill in the art.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The invention is further described below with reference to the figures and the specific embodiments.

Fig. 1 is a schematic side view of a photosensitive assembly with an anti-shake function according to an embodiment of the present disclosure. Referring to fig. 1, in the present embodiment, the photosensitive assembly includes a photosensitive chip 50, an intermediate base 10, a base 20, a circuit board 60, and a driving element 30. Wherein, the photosensitive chip 50 is supported and fixed on the middle seat 10. The intermediate stage 10 may be shaped by a semiconductor process so as to have a more planar surface so that the back surface of the chip better conforms to the upper surface of the intermediate stage 10. The edge region of the photosensitive chip 50 has a plurality of contacts (sometimes also referred to as PADs, PADs or PAD points, which will not be described in detail below), and the contacts can serve as data input/output interfaces of the photosensitive chip 50. FIG. 2 illustrates a schematic top view of a photosensitive assembly in one embodiment of the present application, showing contact locations of various components of the photosensitive assembly. Referring to fig. 1 and 2, in the present embodiment, the contacts of the photo sensor chip 50 are electrically connected to the middle base 10 through a Wire bonding (Wire bonding) process. The edge area of the intermediate holder 10 may have two rows of contacts, one on the outside and the other on the inside. The inner contacts are electrically connected to the photosensitive chip 50, and the outer contacts are electrically connected to the base 20. In this embodiment, the base 20 includes a bottom plate and a sidewall formed by extending upward from the periphery of the bottom plate. The floor and the side walls may be integrally formed. The side walls surround the center seat 10 with a certain distance from the side of the center seat 10 so that the center seat 10 moves laterally. Here, the lateral direction refers to a direction parallel to the photosensitive surface of the photosensitive chip 50. The direction of the normal line of the photosensitive surface is the longitudinal direction. The longitudinal direction is the thickness direction of the photosensitive chip 50, i.e., the intermediate stage 10. In this embodiment, the middle base 10 and the base 20 are electrically connected through a wire bonding process. The contacts of the base 20 may be disposed on the top surface of the side wall. The contacts of the base 20 may be arranged in two rows, one on the inside for electrical connection with said intermediate socket 10 and one on the outside for electrical connection with the circuit board 60. The bottom surface of the base 20 may be attached to the wiring board 60. The wiring board 60 may be a PCB board, which may be formed by alternately arranging and laminating conductive layers and insulating layers. The edge region of the circuit board 60 has contacts for electrical connection with the base 20. In this embodiment, the side walls of the base 20 are elastically connected to the middle base 10 by elastic supports 40 (e.g., elastic flexures). The resilient support 40 may be rigid in one direction and resilient in another direction, thereby suspending the midblock 10 within the base 20 and allowing the midblock 10 to move in some directions relative to the base 20. Further, the driving element 30 is disposed in a gap between the base 20 and the middle seat 10. In this embodiment, the photosensitive chip 50 is supported and fixed on the middle base 10, and the two are integrated into a whole, and for convenience of description, the assembly formed by the two is referred to as a suspension photosensitive member. The suspended photosensitive member is suspended at the center of the base 20 by an elastic support member 40, and can be moved in at least one direction, such as x-axis movement or y-axis movement, by the driving of the driving element 30. In the present invention, the x-axis and the y-axis may be two mutually perpendicular coordinate axes parallel to the photosensitive surface, and the z-axis is a coordinate axis coincident with the normal direction of the photosensitive surface. In this embodiment, the driving element 30 may be disposed between the bottom surface of the middle seat 10 and the top surface of the bottom plate of the base 20, and in a top view, the driving element 30 is located within the coverage of the middle seat 10, so that it may also be referred to as an on-chip driving element 31 (refer to fig. 4, and the on-chip driving element is shown by a dashed square in fig. 4). In another embodiment, the driving element 30 may be disposed between the side wall of the base 20 and the side surface of the middle seat 10, and the driving element 30 is located outside the coverage of the middle seat 10 in a top view, so it may be referred to as an off-chip driving element 32 (refer to fig. 4). Further, in this embodiment, the wire bonding process may be performed by using gold wires. In the electrical connection between the middle stage 10 and the base 20, the gold wire may be bent (i.e., bent downward) after being pulled to a height of 50 to 100 μm above the middle stage. This is done in order to give the gold wire a degree of flexibility to accommodate the movement of the intermediate mount 10.

In the above embodiment, the middle base 10 may be formed by a semiconductor process, and the thickness thereof may be small enough to bear against the photosensitive chip 50 and enhance the structural strength of the photosensitive chip 50, and the area thereof may be only slightly larger than the area of the photosensitive chip 50, enough to leave a space for disposing the contact in the edge area thereof. In this way, the intermediate base 10 can have a smaller weight, so that the weight of the suspended moving member (i.e., the suspended photosensitive member) is lighter, thereby reducing the driving force requirement for driving the suspended moving member, which in turn helps to reduce the size of the driving element 30. In this embodiment, the lens holder (e.g., color filter lens holder) can be formed or mounted on the circuit board 60, which can avoid the weight increase caused by suspending the moving member to carry the lens holder. On the other hand, the middle base 10 manufactured by the semiconductor process has extremely high flatness (the smoothness of the middle base can reach within 5 μm), and compared with the circuit board 60, the photosensitive chip 50 is supported and fixed on the middle base 10, which is more favorable for ensuring the flatness of the chip, thereby ensuring the imaging quality. In the above embodiment, the photosensitive assembly and the optical lens assembly are assembled together to form a camera module, and the camera module can achieve optical anti-shake by driving the intermediate base 10 to move in a direction parallel to the photosensitive surface (relative to the base 20), so that an OIS motor for driving the optical lens can be eliminated, which is favorable for reducing the volume of the optical lens assembly. Further, in the above embodiment, since the middle base 10 and the base 20 need to move when the anti-shake function is turned on, if the wire is directly wired from the photo sensor chip 50 to the base 20, the gold wire may be damaged when the displacement of the photo sensor chip 50 is large. The photosensitive chip 50 and the middle base 10 are electrically connected together by gold wires, and then the middle base 10 and the base 20 are connected by elastic wires, so that the displacement of the middle base 10 can be better adapted (the photosensitive chip 50 is fixed on the middle base 10, so that the displacement of the middle base 10 is the displacement of the photosensitive chip 50).

Further, in one embodiment of the present application, the middle stage 10 has a functional circuit connected to the photosensitive chip 50, the functional circuit is fabricated on the surface or inside of the middle stage 10 by a semiconductor process, and a line width of a conductive line constituting the functional circuit is not less than 50 μm. The base 20 has a driving circuit connected to the driving element 30, which can supply current to the driving element 30. The driving circuit is fabricated on the surface or inside of the middle stage 10 by a semiconductor process, and the line width of a wire constituting the driving circuit is not less than 80 μm. The above values can be adjusted according to practical situations, and in other embodiments of the present application, the circuit between the base 20 and the middle seat 10 can be designed as follows: the line width of the wiring of the base 20 may be greater than the line width of the wiring of the middle stage 10 in order to provide a greater current to the driving element 30, thereby providing a greater thrust to the driving element 30.

Further, in an embodiment of the present application, the elastic support 40 comprises a flexure 41 and a fixing element 42, the flexure 41 allowing, on the one hand, the movement of the intermediate base 10 in a certain direction or directions and, on the other hand, the flexure 41 stabilizing the intermediate base 10 after the movement of the intermediate base 10 is completed. The fixing member 42 is rigid in some directions so that the center base 10 can move in a predetermined direction to prevent the movement from losing its directionality. Therefore, the flexure 41 and the fixing member 42 cooperate with each other to displace the middle base 10 in one or more predetermined directions under the driving of the driving element 30, so as to achieve the anti-shake function of the chip.

Further, fig. 3a shows a schematic top view of the photosensitive assembly with the elastic supporting member in one embodiment of the present application. The attachment position of the resilient support 40 is shown in this figure. Referring to fig. 3a, in the present embodiment, four elastic supporting members 40 may be disposed between the middle base 10 and the bottom base 20, and two ends of each elastic supporting member 40 may be connected to one corner of the middle base 10 and one corner of the bottom base 20, respectively. For example, one resilient support 40 may connect position a of base 20 with position B of intermediate seat 10. Position a is located in the lower left corner of the base 20 and position B is located in the upper left corner of the base 20. That is, the positions a and B are not in the same orientation, but are offset from each other so that the resilient support 40 may extend (may meander) from a starting fixing point in one orientation along the side of the intermediate seat 10 or base 20 to an ending fixing point in another orientation. In this way, the elastic support 40 may provide a more stable elastic support for the center seat 10. Further, fig. 3b shows a close-up schematic view of the elastic support near position a in fig. 3 a. Referring to fig. 3b, in this embodiment, the elastic supporting member 40 may include a rigid fixing member 42 and a flexible member 41 having elasticity in one or more directions. The anchors 42 may be mounted at position a and position B (not shown in fig. 3B), with the flexure 41 connected between the anchors 42 at either end. At the fixing point of the middle stage 10, the fixing member 42 may be installed on the lower surface of the middle stage 10, thereby avoiding occupying the contact disposing area and helping to reduce the area (referring to the area in the top view) of the middle stage 10. The flexure 41 is deformable in at least one direction. For example, the flexure 41 may be configured to allow deformation in the x-axis direction, but not in the y-axis direction. At this time, the flexure 41 may be deformed in response to a tensile force or tension in the x-axis direction, and may not be changed in the y-axis direction. The mount 42 is rigid in both the x-axis and y-axis directions and does not deform. Therefore, the elastic support 40 composed of the flexible component 41 and the fixed component 42 cannot move in the y-axis direction, or the elastic support 40 can absorb the motion energy in the y-axis direction and transmit the motion energy in the x-axis direction. That is, the elastic support 40 is movable in the x-axis direction and immovable in the y-axis direction. Based on the above principle, the middle seat 10 can be made rigid and immovable in one or several directions and movable in one or several directions by configuring different types and shapes of elastic supporting members according to different situations and design objectives.

Further, in one embodiment of the present application, the middle seat 10 is manufactured (for example, during etching), and the surface or the inside of the middle seat 10 is reserved with a circuit to form a contact in a manner of copper plating. The contacts of the intermediate mount 10 may be electrically connected to the contacts of the base mount 20 by semiconductor wires 19. Fig. 15 shows a cross-sectional schematic view of an embodiment of the present application in which the interposer and the base are electrically connected based on semiconductor wires. Referring to fig. 15, in the present embodiment, the contacts of the base 20 may be disposed on the top surface of the sidewall of the base 20. The middle seat 10 and the base 20 are integrally formed through a semiconductor process, and then the middle seat 10 and the base 20 are separated by removing a sacrificial layer, and a desired gap is formed between the bottom surface of the middle seat 10 and the base 20 and between the side surface of the middle seat 10 and the base 20. The contacts of the intermediate stage 10 may be electrically connected to the contacts of the base stage 20 by semiconductor wires. The semiconductor wire may be flexible so that the intermediate base 10 can move within a certain range. Specifically, when the middle stage 10 moves relative to the base 20, the semiconductor wires can better adapt to the displacement of the middle stage 10, so as to avoid the line fault caused by the movement. In this embodiment, the semiconductor wires may be fabricated based on a semiconductor process. When fabricating a semiconductor wire, the wire may not have to be pulled over the interposer. The thickness of the middle stage 10 may be 3 to 30 μm, the thickness of the base 20 may be 250 to 350 μm, and the thickness of the base may be 100 to 280 μm.

Further, still referring to fig. 2, in one embodiment of the present application, the photosensitive assembly includes a photosensitive chip 50, an intermediate base 10, a base 20, and a circuit board 60, and a driving element 30 disposed between the intermediate base 10 and the base 20. The middle seat 10 is provided with a middle seat contact 11, the base 20 is provided with a base contact 21, the circuit board 60 is provided with a circuit board contact 61, and the photosensitive chip 50 is provided with a chip contact 51. The chip contacts 51 are electrically connected to the interposer contacts 11, and the interposer contacts 11 are electrically connected to the circuit board contacts 61, so that the chip, the base 20, the interposer 10, and the circuit board 60 are electrically connected. In the present embodiment, the contact conduction manner may be embodied as wire connection, and in the present embodiment, the middle socket contacts 11 are preferably arranged in at least two rows, wherein one row is used for electrically connecting with the chip contacts 51, the other row is used for electrically connecting with the base 20 or the driving element 30, and similarly, the base contacts 21 are also preferably arranged in two rows, one row is used for electrically connecting with the middle socket contacts 11, and the other row is used for electrically connecting with the circuit board contacts 61 or the driving element 30.

Further, in another embodiment of the present application, the middle socket contacts 11 may be arranged in only one row, and each middle socket contact 11 may be electrically connected to both the base contact 21 and the chip contact 51. Similarly, the base contacts 21 may be arranged in only one row, and each base contact 21 may be electrically connected to both the interposer contact 11 and the circuit board contact 61.

Further, in one embodiment of the present application, the circuit board 60 may be a PCB board, and the PCB board may be formed by alternately laminating a plurality of circuit layers and insulating layers. That is, a plurality of wiring layers and insulating layers may be alternately arranged and combined into one body through a lamination process to form the PCB panel.

Further, in one embodiment of the present application, the photosensitive chip 50 and the middle base 10 may be mechanically and electrically connected through reflow (reflow) and flip chip (flip chip). At this time, the contacts of the photosensitive chip 50 may be located on the back surface thereof, and the contacts of the middle stage 10 may be located on the top surface (or upper surface) thereof. In this embodiment, since the edge region of the middle base 10 located at the periphery of the photosensitive chip 50 for setting the inner side contact can be omitted, the area of the middle base 10 can be the same as the photosensitive chip 50 or only slightly larger than the photosensitive chip 50, so as to help reduce the weight of the suspended moving member (i.e., the suspended photosensitive member), reduce the requirement for driving force for driving the suspended moving member, and further help reduce the size of the driving element 30. In addition, the lateral dimension of the photosensitive assembly can be reduced. It should be noted that in the present embodiment, the middle base 10 and the bottom base 20 are still electrically connected by gold wires based on a wire bonding process, so as to reserve a moving space for suspending the moving member.

Further, in one embodiment of the present application, the base and the circuit board may be mechanically and electrically connected by reflow (reflow) and flip chip processes (flip chip). This design can eliminate the need for external contacts disposed on the top surface of the side walls of the base 20, thereby helping to reduce the lateral dimensions of the photosensitive assembly.

Further, fig. 4 shows the placement areas of the on-chip driving elements and the off-chip driving elements in one embodiment of the present application. Referring to fig. 4, in this embodiment, the driving element may include an on-chip driving element and an off-chip driving element, where the on-chip driving element is used for driving the movement in the chip plane. Movement in the plane of the chip is here understood to mean lateral movement, i.e. x-axis translation, y-axis translation and Rz rotation, which means rotation about the z-axis. These directions of movement are parallel to the light-sensing surface of the chip and can therefore be understood as movements in the plane of the chip. The chip external driving part is used for realizing the movement outside the driving chip plane. The out-of-plane movement of the chip may include z-axis translation, tilt (tilt) adjustment of the chip including Rx rotation and Ry rotation, where Rx rotation refers to rotation about the x-axis and Ry rotation refers to rotation about the y-axis. These moving directions change the position or posture of the plane where the light-sensing surface of the chip is located, and therefore can be understood as movement out of the plane of the chip. The on-chip and off-chip drivers are illustrated in phantom in fig. 4. In the present embodiment, the on-chip driving member is disposed in the region of the middle base 10 and the off-chip driving member is disposed in the region between the middle base 10 and the base 20 in a top view. The on-chip drivers may also be referred to as on-chip drive elements 31 and the off-chip drivers may also be referred to as off-chip drive elements 32.

Further, fig. 5 shows a schematic top view of an on-chip drive element of a MEMS-based actuator in an embodiment of the present application. MEMS are all referred to as Micro Electro Mechanical systems, micro Electro Mechanical systems. In the present embodiment, the driving elements comprise on-chip drives, which are implemented as MEMS actuators, wherein the MEMS actuators comprise translational actuation units 33 at the four corners and rotational actuation units 34 in the center. Wherein the rotary actuating unit 34 comprises four fan-shaped comb structures, each of which can rotate the moving part of the actuator by an angle, the magnitude of which matches the voltage difference of the fan-shaped comb structures, through electrostatic force. The translational actuating unit 33 comprises four comb structures with rectangular shapes. Wherein the two rectangular comb structures can provide the electrostatic force for x-axis actuation and the two rectangular comb structures can provide the electrostatic force for y-axis actuation. In this embodiment, the in-chip driving element 31 may include a fixed element and a movable element, wherein the fixed element is fixed on the base 20 (refer to fig. 1 in combination), and the movable element is fixed with the middle base 10, so as to drive the middle base 10 (or the suspended photosensitive element) to move in the chip plane. The movement in the plane of the chip may include x-axis translation, y-axis translation, and Rz rotation, which refers to rotation about the z-axis.

Further, fig. 6 shows a schematic top view of an on-chip drive element of a MEMS-based actuator in another embodiment of the present application. Compared to the embodiment of fig. 5, the MEMS actuator in this embodiment can omit the translational actuating units at the four corners, and leave the rotational actuating unit 34 at the center. This embodiment may be in-chip-plane movement, which may include Rz rotation, which refers to rotation about the z-axis.

Further, fig. 7 illustrates a side view schematic of an off-chip drive element based on thermal differential lines in one embodiment of the present application. Referring to fig. 7, in the present embodiment, the driving element includes an off-chip driving member, which may be a thermal differential line 35, and the thermal differential line 35 may be extended and contracted with a change in temperature. In this embodiment, two ends of the thermal differential line are respectively connected to the sidewall of the base 20 and the middle base 10. By adjusting the temperature of the thermal differential lines, out-of-plane movement of the chip can be achieved. The out-of-plane movement of the chip may include z-axis translation, tilt (tilt) adjustment of the chip including Rx rotation and Ry rotation, where Rx rotation refers to rotation about the x-axis and Ry rotation refers to rotation about the y-axis. In this embodiment, the thermal differential wires may be replaced by various types of electric actuation wires such as SMA wires and piezoelectric wires. Among them, SMA is collectively called Shape Memory Alloys, i.e., shape Memory Alloys. In this embodiment, the SMA wire is conducted with currents of different magnitudes to provide different temperatures, so that the SMA wire is correspondingly stretched and contracted, thereby realizing the movement outside the plane of the chip. The piezoelectric element can be provided with a periodic electric signal, so that the piezoelectric element generates corresponding vibration, and the piezoelectric element drives the middle seat to move.

Further, in another embodiment of the present application, the drive element may include an on-chip drive element based on a MEMS actuator and an off-chip drive element based on a thermal differential line. Wherein, the on-chip driving element based on the MEMS actuator can only adopt a translation actuating unit, and a rotation actuating unit is omitted. An off-chip drive element based on thermal differential temperature lines may be used to achieve the rotary actuation function. It should be noted that in other embodiments of the present application, the thermal differential wires may be replaced by various types of electric actuation wires, such as SMA wires, piezoelectric wires, etc.

Further, fig. 8 illustrates a schematic top view of an off-chip drive element based on an electrostatic plate actuator in one embodiment of the present application. Referring to fig. 8, in the present embodiment, an electrostatic plate actuator is employed as an off-chip driving element, which may be disposed in a region between a side wall of the base and the middle base. The electrostatic plate actuator is driven by electrostatic force between the conductive plates. Electrostatic plate actuators can be fabricated with micro-machining techniques that can process microstructures up to the micrometer or even nanometer scale. The electrostatic plate actuator in the present embodiment includes a rigid fixing member 36, a moving member 37, a fixed plate 38, a moving plate 39, and an elastic member 39a. Wherein the rigid fixed member 36 is connected with the base 20 and fixes the fixed plate 38, the moving member 37 can be supported by the elastic element 39a, the moving member 37 can be connected with the middle base, and one end of the moving member 37 can be connected with the moving plate 39. The elastic element 39a connects at least the moving part 37 and the rigid fixing part 36. Specifically, the elastic element 39a may be connected to the rigid fixing member 36 at one end and the moving member 37 at the other end. Further, fig. 9 shows a schematic diagram of the movement of the off-chip driving element of fig. 8 under the action of the electrostatic plate. Referring to fig. 8 and 9, the elastic element 39a can provide a supporting force for the x-axis displacement of the moving member, so that the moving member 37 drives the middle base 10 to move in the x-axis direction. Since the middle base 10 is provided with the photosensitive chip 50, the moving member can drive the photosensitive chip 50 to move in the x-axis direction. In this embodiment, the movable plate 39 and the fixed plate 38 are disposed opposite to each other to form a capacitor structure. The movable plate may be configured to be driven at a plurality of different voltages, such as a first voltage, a second voltage, and a third voltage, and when the voltages configured to the movable plate are different, an electric field generated between the movable plate and the fixed plate may be changed. The movable plate and the fixed plate can be close to or far away from each other under the action of an electric field, and the elastic element can provide supporting force when being bent, so that the movable plate is prevented from moving away from the set x-axis direction. It should be noted that in this embodiment, the moving member and the fixed member may be bar-shaped in a top view and arranged in the coverage area of the intermediate base, so as to improve the reliability and stability of the mechanical connection of the moving member and the intermediate base 10.

Further, still referring to FIG. 8, in one embodiment of the present application, an electrostatic force is generated between the fixed and moving plates after being energized, thereby attracting or repelling each other. The force generated between the two is determined by the size of the capacitance between the two plates, the voltage and the gap between the two. Due to the need to maintain the voltage difference, the fixed and moving plates do not contact each other in this embodiment, and the areas of the fixed and moving plates are substantially matched so as to provide sufficient driving force while effectively utilizing space.

Further, fig. 10 shows a side view schematic of an SMA based off-chip drive element in an embodiment of the application. Referring to fig. 10, in this embodiment, the off-chip drive element may be an OIS device based on SMA wire. In this embodiment, SMA wire 35a connects base 20 and intermediate mount 10, and flexure 41 connects base 20 and intermediate mount 10 simultaneously, and as actuation is performed using an SMA material, the SMA material may be arranged to be heated to actuate movement of intermediate mount 10. In particular, SMA wires may change between the martensite and austenite phases when subjected to different temperatures. At low temperatures the SMA wire is in the martensite phase and at high temperatures the SMA wire transforms into the austenite phase. Transformation to the austenitic phase may cause the SMA wires to contract, thereby causing the movement of the intermediate seat 10. Further, the temperature of the SMA wire may be adjusted by adjusting the current passing through the SMA wire, thereby controlling the expansion and contraction of the SMA wire to drive the movement of the intermediate base 10 (or the suspension photosensitive member).

Further, still referring to fig. 10, in one embodiment of the present application, the SMA wire 35a has a property that the resistance varies with its length along a curve where the resistance decreases from the local maximum resistance to the local minimum resistance during contraction. Further, the SMA wire may be supported by two support structures, which may be constructed of copper or cupper. Two support structures may be fixed to the side walls of the base 20 and the intermediate seat 10, respectively. Base 20 and mid-mount 10 are also resiliently coupled by flexures to constrain mid-mount 10 to move in one or more directions while providing some resilient support for mid-mount 10 to keep it stable.

Further, in one embodiment of the present application, the driving element comprises an actuator using a piezoelectric-based material. The piezoelectric material may be, for example, lead zirconate titanate (PZT), zinc oxide, or other piezoelectric material. The piezoelectric element receives periodic electric signals and can generate corresponding movement, so that the piezoelectric element drives the middle seat to move. The direction of movement of the piezoelectric element can be different from the direction of rigidity of the support element, so that the chip can be driven to move in certain specific directions, and the shake in the specific directions can be compensated. FIG. 16 illustrates a perspective view of a photosensitive assembly in one embodiment of the present application. Reference is made to fig. 16, in which the support elements may be arranged between the sides of the intermediate seat and the side walls of the base seat. And four support elements 43 may be arranged in a spiral (as shown in fig. 16). These four support elements 43 make it possible to make the intermediate base rigid in the horizontal direction (i.e. in a direction parallel to the xy-plane) and elastic in the z-direction. In this embodiment, z-axis movement and tilt compensation (i.e., tilt compensation) of the photo-sensing chip can be achieved by controlling the stiffness of the actuator beam of the piezoelectric actuator and the amount of electrical flexure. Further, the helical arrangement of the four support elements 43 can be understood as: the two ends of each support element 43 are connected to one vertex of the support seat and to the adjacent vertex of the intermediate seat corresponding to this vertex. Wherein, for any vertex of a quadrilateral, the vertex has two adjacent vertices and a diagonal vertex. In the present embodiment, the base and the middle seat are substantially quadrilateral (rectangular).

Further, FIG. 11a shows a schematic side view of an electromagnetic actuator based on an on-chip drive element in an embodiment of the present application; FIG. 11b shows a schematic top view of an electromagnetic actuator based on an on-chip drive element in an embodiment of the present application. Referring to fig. 11a and 11b, in the present embodiment, the driving element is an electromagnetic actuator composed of a coil and a magnet. A first driver 22 and a second driver 23 are disposed at different positions of the base 20, the first driver is used for pushing the photosensitive chip to move in the x-axis direction, and the second driver is used for pushing the photosensitive chip to move in the y-axis direction. In this embodiment, the first driver is powered on to enable the first driver to push the photosensitive chip to move in the x-axis direction, and the second driver is powered on to enable the driver to push the photosensitive chip to move in the y-axis direction. The first driver and the second driver are electrified simultaneously, so that the photosensitive chip can be pushed to move in the directions of the x axis and the y axis simultaneously. Referring to fig. 11a, the first and second drivers may each include a first permanent magnet 24, a coil 25, and a second permanent magnet 26. Wherein the first permanent magnet is arranged on the bottom surface of the middle seat, and the coil is fixed on the bottom surface of the first permanent magnet. The second permanent magnet is fixed on the upper surface of the base (the upper surface of the bottom plate area). Further, in the present embodiment, the NS poles of the first permanent magnet and the second permanent magnet correspond to each other so as to form a magnetic field. The coil is arranged between the two permanent magnets, so that the coil can be influenced by the pushing force of the magnetic field. By arranging the directions of the coils and the permanent magnets, the coils of the first driver on the left side can only receive one force in the x-axis direction, and the coils of the second driver on the right side can only receive one force in the y-axis direction. Thus, the current through the coil is controlled so that the photosensitive chip can be controllably moved in the x-axis and y-axis directions.

Further, in an embodiment of the present application, the first driver and the second driver each have a detection element 27 (refer to fig. 11 a). The detecting element may include first and second detecting elements, wherein the first detecting element is configured to detect a relative position and an offset between the middle seat and the base, for example, an offset in the x-axis direction, and output an electrical signal to the first driver, so that the first driver generates a driving force and stabilizes the position of the middle seat. Similarly, the second detecting element can be used for detecting the offset of the middle seat relative to the base in the y-axis direction, and then outputting an electric signal to the second driver to enable the second driver to generate a driving force, so that the middle seat is kept stable. The detection element may be implemented as a hall element, a coil magnet assembly, or the like. In addition, the embodiment needs to perform detection calibration on multiple degrees of freedom, for example, the tilt in Rz, rx, ry directions can be detected by a gyroscope. Therefore, in the present embodiment, the detecting elements and the driving elements are in one-to-one correspondence, and each detecting element is used to detect a displacement in the moving direction of the driving element corresponding thereto. The design ensures that the positions of the detection element and the driving element can be as close as possible, so that the detection precision of the detection element can be ensured, and the movement accuracy of the driving element can also be ensured.

Fig. 12 illustrates a top view schematic diagram of a magnetic flux line distribution of a single magnet of an on-chip drive element based electromagnetic actuator in an embodiment of the present application. In the figure, the magnetic induction line direction is represented by dots and crosses, the dots represent the direction out of the vertical paper, and the crosses represent the direction in the vertical paper. The dashed box S in the figure represents the coil, and the arrow represents the force direction of the coil when energized. Wherein, the energizing direction of the coil can be clockwise. Referring to fig. 12, in this embodiment, the magnets and the coils are arranged appropriately, and the driving element can form driving forces in the x-axis direction and the y-axis direction on the intermediate base (to which the coils are fixed), so as to drive the intermediate base to move in the x-axis direction and the y-axis direction.

Fig. 13 is a perspective view of a periscopic module according to an embodiment of the present disclosure. Referring to fig. 13, the present embodiment provides a periscopic camera module (abbreviated as periscopic module) including a beam-bending element 100, an optical lens 200 and a photosensitive element 300. Wherein the photosensitive assembly 300 has an OIS chip anti-shake apparatus. Because the periscopic module is often far away from the focal length, the shaking of the shooting object (such as the shot person or object) caused by the shaking during shooting is more obvious, and the shooting object is easy to blur. In this embodiment, the photosensitive element 300 may be the photosensitive element with anti-shake function of any of the foregoing embodiments. The photosensitive chip is arranged on the middle base and jointly forms a suspended moving piece, and the suspended moving piece is suspended by the base and can move relative to the base in a controlled manner. The suspension moving piece (middle seat) and the base are electrically connected through a gold thread. FIG. 14 is a perspective view of a photosensitive assembly showing the position of gold wires in one embodiment of the present application. Referring to fig. 14, in the present embodiment, the gold wires may be intensively designed on both sides or one side of the photosensitive chip (and/or the middle mount) so as to ensure that the photosensitive assembly has a small size in the direction of one coordinate axis. For example, the gold wires of the middle seat may be arranged in two strip-shaped edge regions of the middle seat, and the two strip-shaped edge regions are approximately parallel. The gold wires occupy a certain volume, but in the present embodiment, the gold wires are concentratedly designed on two opposite sides or one side of the photo-sensing chip (where the two opposite sides refer to two sides that are not adjacent, for example, the first side 71 and the second side 72 in fig. 14, i.e., two opposite sides), so that the occupation of space in the other direction of the photo-sensing chip can be avoided. For example, when gold wires are collectively designed on both sides or one side of the photosensitive chip, the dimension of the photosensitive member in the x-axis direction may not be increased by merely increasing the dimension of the photosensitive member in the y-axis direction. Since the camera module of this embodiment is a periscopic module, the y-axis direction can be the thickness direction of the mobile phone (or other electronic devices). This design of the present embodiment will help reduce the thickness of the handset (or other electronic device). Further, in this embodiment, the contacts of the middle seat and the base are all arranged in the x-axis direction, so that the contact size and the gold wire size in the y-axis direction are reduced. Specifically, the gold wires on two sides (two sides opposite to each other, that is, two sides that are not adjacent to each other) or three sides are omitted, so that the size occupied by the contacts on two sides or three sides can be omitted, and the size required to be reserved in the two-side or three-side wire bonding process can also be omitted. For each side, the contact points are arranged to occupy the size of about 80-100 μm, and the gold wire process occupies the size of 120-180 μm, so that the embodiment can reduce the size of the photosensitive assembly in the y-axis direction (by more than 200 μm). Therefore, the height of the periscopic module can be reduced by the embodiment, so that the periscopic module is suitable for the trend of miniaturization of the camera module.

The above description is only a preferred embodiment of the present application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims (24)

1. A photosensitive assembly with an anti-shake function, comprising:

   a photosensitive chip having a photosensitive surface;

   the middle seat is formed by a semiconductor process, the back surface of the photosensitive chip is supported and fixed on the upper surface of the middle seat, and the middle seat is provided with a middle seat contact positioned on the outer side of the photosensitive assembly;

   the base comprises a bottom plate and a side wall formed by upwards extending the periphery of the bottom plate, the side wall surrounds the middle seat and has a gap with the side surface of the middle seat, the top surface of the side wall is provided with a base contact, and the middle seat contact is electrically connected with the base contact based on a routing process;

   an elastic support member elastically connecting the side wall and the middle seat; and

   and the driving element is arranged between the middle seat and the base and used for driving the middle seat to move relative to the base in a direction parallel to the photosensitive surface.
2. A photosensitive assembly according to claim 1, further comprising a circuit board, wherein the lower surface of the base bears against and is fixed to the upper surface of the circuit board; wherein the wiring board is made of a plurality of alternately arranged wiring layers and insulating layers by a lamination process.
3. The photosensitive assembly of claim 1, wherein the middle base contact and the base contact are connected by a wire bonding process in which a metal wire is pulled to a position 50-100 μm higher than the middle base and then bent downward.
4. A photosensitive assembly according to claim 1, wherein the middle base contact and the base contact are electrically connected by a flexible semiconductor wire, the middle base and the base are integrally formed by a semiconductor process, and the middle base and the base are separated by removing a sacrificial layer, and a desired gap is formed between the bottom surface of the middle base and the base and between the side surface of the middle base and the base.
5. A photosensitive assembly according to claim 1, wherein the thickness of the intermediate mount is 3-30 μm, the height of the base mount is 250-350 μm, and wherein the thickness of the base plate is 100-280 μm; the line width of the circuit manufactured on the base is larger than that of the circuit manufactured on the middle base.
6. A photosensitive assembly according to claim 1, wherein said photosensitive chip has chip contacts on a back surface thereof, said photosensitive chip is fixed to an upper surface of said intermediate base by a flip-chip process, and said chip contacts are electrically connected to said intermediate base contacts based on a reflow process.
7. A photosensitive assembly according to claim 1, wherein the photosensitive chip has chip contacts at a front edge region thereof, the chip contacts being electrically connected to the interposer contacts based on a wire bonding process.
8. A photosensitive assembly according to claim 6 or 7, wherein the mid-mount contacts comprise a first mid-mount contact and a second mid-mount contact, the mount contacts comprise a first mount contact and a second mount contact, the first mid-mount contact being electrically connected to the chip contact, the second mid-mount contact being connected to the first mount contact; the first mid-mount contact is located inside the second mid-mount contact.
9. A photosensitive assembly according to claim 8, further comprising a circuit board, wherein the lower surface of the base bears against and is fixed to the upper surface of the circuit board, and the circuit board has circuit board contacts; the first base contact is located on the inner side of the second base contact, and the second base contact is electrically connected with the circuit board contact based on a routing process.
10. A photosensitive assembly according to claim 8, further comprising a circuit board, wherein the lower surface of the base bears against and is fixed to the upper surface of the circuit board, and the circuit board has circuit board contacts; the second base contact is located on the lower surface of the base, and the second base contact is electrically connected with the circuit board contact based on a reflow soldering process.
11. A photosensitive assembly according to claim 1, wherein the resilient support comprises a fixed member and a flexure member.
12. A photosensitive assembly according to claim 1, wherein the drive element comprises an in-chip drive element for driving movement of the intermediate stage in a chip plane, the movement in the chip plane comprising at least one of an x-axis translation, a y-axis translation, and an Rz rotation, wherein the x-axis and the y-axis are two mutually perpendicular coordinate axes parallel to a photosensitive surface of the photosensitive chip, the z-axis is a coordinate axis that is aligned with a normal direction of the photosensitive surface, and the Rz rotation is a rotation about the z-axis.
13. A photosensitive assembly according to claim 1, wherein the driving element comprises an off-chip driving element for driving the movement of the intermediate mount out of the plane of the chip, the out-of-plane movement comprising a z-axis translation and/or a tilt adjustment of the chip, the tilt adjustment comprising an Rx rotation and an Ry rotation, wherein the x-axis and the y-axis are two mutually perpendicular coordinate axes parallel to the photosensitive surface of the photosensitive chip, the z-axis is a coordinate axis coinciding with a normal direction of the photosensitive surface, the Rx rotation is a rotation about the x-axis, and the Ry rotation is a rotation about the y-axis.
14. A photosensitive assembly according to claim 1, wherein the drive elements include on-chip drive elements for driving movement of the intermediate mount within a chip plane including at least one of x-axis translation, y-axis translation and Rz rotation and off-chip drive elements; the off-chip driving element is used for driving the middle seat to move out of the plane of the chip, the movement out of the plane of the chip comprises z-axis translation and/or inclination adjustment of the chip, the inclination adjustment comprises Rx rotation and Ry rotation, wherein the x axis and the y axis are two mutually perpendicular coordinate axes parallel to the photosensitive surface of the photosensitive chip, the z axis is a coordinate axis consistent with the normal direction of the photosensitive surface, the Rx rotation is rotation around the x axis, the Ry rotation is rotation around the y axis, and the Rz rotation is rotation around the z axis.
15. A photosensitive assembly according to claim 14, wherein the on-chip drive elements are disposed between a bottom surface of the intermediate mount and the base, and the off-chip drive elements are disposed between side surfaces of the intermediate mount and side walls of the base.
16. A photosensitive assembly according to claim 12, wherein the on-chip driving element is a MEMS actuator comprising a rotary actuating unit comprising at least one sector-shaped comb structure adapted to drive the mid-mount by electrostatic force to effect the Rz rotation.
17. A photosensitive assembly according to claim 16, wherein the MEMS actuator further comprises a translational actuation unit, and the rotational actuation unit comprises at least one rectangular comb-tooth structure adapted to drive the intermediate mount by electrostatic force to effect the x-axis translation and/or the y-axis translation.
18. A photosensitive assembly according to claim 17 wherein the at least one rectangular comb tooth structure is disposed at the periphery of the at least one fan-shaped comb tooth structure.
19. A photosensitive assembly according to claim 13, wherein said off-chip driving element comprises an electric wire having both ends connected to said side wall of said base and said middle seat, respectively, said electric wire comprising a thermal differential wire, a shape memory alloy wire and a piezoelectric wire.
20. A photosensitive assembly according to claim 13, wherein the off-chip drive element is an electrostatic plate actuator.
21. A photosensitive assembly according to claim 12 wherein the in-sheet drive element comprises a first permanent magnet, a second permanent magnet and a coil; first permanent magnet set up in the bottom surface of middle seat, the second permanent magnet set up in the upper surface of base, first permanent magnet with the N of second permanent magnet, S utmost point correspond each other so that form magnetic field, the coil sets up first permanent magnet with the centre of second permanent magnet, and receive the effect of the impetus in magnetic field, through setting up the coil first permanent magnet with the direction of second permanent magnet makes the middle seat is in realize under the control of the electric current of coil the x axle translation and/or the y axle translation.
22. A photosensitive assembly according to claim 21 wherein the in-sheet drive element further comprises a detection element for detecting displacement of the intermediate mount relative to the base.
23. The utility model provides a module of making a video recording, its characterized in that, the module of making a video recording is periscopic module, and it includes:

    a light turning element;

    an optical lens; and

    a photosensitive assembly, the photosensitive assembly being the photosensitive assembly of any one of claims 1-20, wherein the midblock contact is disposed at a single-sided edge region of the midblock; or arranged at two side edge areas opposite to the position of the middle seat.
24. The camera module of claim 23, wherein the metal wires are disposed in a single-sided edge region of the center pad; or arranged at two side edge areas opposite to the position of the middle seat.

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