CN115551193A - Display module and display device - Google Patents
Display module and display device Download PDFInfo
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- CN115551193A CN115551193A CN202211311361.9A CN202211311361A CN115551193A CN 115551193 A CN115551193 A CN 115551193A CN 202211311361 A CN202211311361 A CN 202211311361A CN 115551193 A CN115551193 A CN 115551193A
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- 239000010408 film Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
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- 238000000034 method Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 5
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- 230000000694 effects Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
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- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application provides a display module and a display device, wherein the display module comprises a display panel, a circuit board and a circuit board; the display panel is provided with a plurality of first bonding terminals which are arranged along a first direction; the circuit board is provided with a plurality of second bonding terminals, at least two second bonding terminals are arranged along a first direction, at least two second bonding terminals are arranged along a second direction, and the first direction is intersected with the second direction; the circuit board includes many connecting wires, and first nation decides terminal and second nation decides the terminal in the connecting wire electricity connection. The embodiment of the application provides a display module assembly and display device, the size of circuit board along the first direction can be less than or equal to display panel along the size of first direction, reserves sufficient space for the nation of circuit board decides to connect, is favorable to reducing the size of display module assembly along the first direction.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module and a display device.
Background
The Organic Light-Emitting Diode (OLED) display panel has the advantages of simple structure, fast response speed, active Light emission, low power consumption, and the like, and has been widely applied to the display field of electronic devices such as mobile phones, tablet computers, televisions, and the like.
The display panel is usually electrically connected to a circuit board through a circuit board, and the circuit board transmits a control signal to the display panel through the circuit board, or receives an electrical signal of the display panel through the circuit board. Among the correlation technique, the circuit board size is greater than the display panel size, carries out the in-process of nation's connection to circuit board and display panel, has the not enough problem in nation's of circuit board space, so, is unfavorable for reducing display module assembly's size.
Disclosure of Invention
The application provides a display module assembly and display device to solve the not enough problem in bonding space of circuit board, be favorable to reducing display module assembly's size.
In a first aspect, a display module provided in an embodiment of the present application includes a display panel, a circuit board, and a circuit board; the display panel is provided with a plurality of first bonding terminals which are arranged along a first direction; the circuit board is provided with a plurality of second bonding terminals, at least two second bonding terminals are arranged along a first direction, at least two second bonding terminals are arranged along a second direction, and the first direction is intersected with the second direction; the circuit board includes many connecting wires, and first nation decides terminal and second nation decides the terminal in the connecting wire electricity connection.
In some embodiments, the plurality of second bonding terminals are arranged in a plurality of rows along the first direction, and two adjacent rows of second bonding terminals are arranged at intervals along the second direction.
In some embodiments, a first gap exists between two adjacent second bonding terminals of the same row, wherein at least a portion of an orthographic projection of at least a portion of one row of second bonding terminals in the second direction falls within the first gap between the adjacent other row of second bonding terminals.
In some embodiments, the connecting lines include first connecting lines and second connecting lines, the first connecting lines and the second connecting lines are respectively electrically connected to two rows of second bonding terminals adjacent to each other in the second direction, and orthographic projections of the first connecting lines and the second connecting lines in the second direction are alternately arranged in the first direction.
In some embodiments, the circuit board includes a first routing layer and a second routing layer stacked together, the first connection line is disposed on the first routing layer, and the second connection line is disposed on the second routing layer.
In some embodiments, the first routing layer is located on one side of the second routing layer close to the circuit board, the first routing layer is provided with a first via hole, and the second connecting line penetrates through the first via hole.
In some embodiments, multiple second bonding terminals are disposed in the same layer.
In some embodiments, the circuit board includes a first sub-layer and a second sub-layer stacked in a second direction, the circuit board is disposed on a side of the second sub-layer facing away from the first sub-layer, the second sub-layer is provided with a second via hole, one of two adjacent rows of the second bonding terminals is disposed on the first sub-layer and exposed by the second via hole, and the other row is disposed on the second sub-layer.
In some embodiments, the wiring board includes a first connection terminal and a second connection terminal connected to the plurality of connection lines, the first connection terminal being connected to the second bonding terminal located in the first sub-layer, the second connection terminal being connected to the second bonding terminal located in the second sub-layer; an absolute value of a difference between a pitch of the first connection terminal and the second bonding terminal of the first sublayer and a pitch of the second connection terminal and the second bonding terminal of the second sublayer is less than or equal to 50 μm in the second direction.
In some embodiments, the first connection terminal is spaced apart from the second bonding terminal of the first sub-layer by an interval equal to that between the second connection terminal and the second bonding terminal of the second sub-layer.
In some embodiments, the display panel includes a substrate layer and a functional layer stacked in a third direction, the first bonding terminal is formed on the functional layer, and the first direction, the second direction, and the third direction intersect with each other.
In some embodiments, the functional layer includes a touch electrode electrically connected to the first bonding terminal.
In some embodiments, the functional layer includes a display unit electrically connected with the first bonding terminal.
In a second aspect, an embodiment of the present application provides a display device, including the display module provided in any one of the above embodiments.
The embodiment of the application provides a display module assembly and display device, set up the second nation and decide the terminal and both included the part of arranging along the first direction, include the part of arranging along the second direction again, can save the space that the second nation decides the terminal and occupy along the first direction, make the circuit board along the size of first direction can be less than or equal to display panel along the size of first direction, reserve sufficient space for the nation of circuit board is connected, be favorable to reducing the size of display module assembly along the first direction.
Drawings
Features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings. In the drawings, like parts are provided with like reference numerals. The figures are not drawn to scale.
Fig. 1 is a schematic top view of a display module according to an embodiment of the present disclosure;
FIG. 2 isbase:Sub>A schematic cross-sectional view taken along A-A of FIG. 1;
fig. 3 is a schematic top view of another display module according to an embodiment of the present disclosure;
FIG. 4 is a schematic sectional view of the rear edge B-B of FIG. 3 with a part of the structure omitted;
FIG. 5 is a schematic cross-sectional view taken along line B-B of FIG. 3;
FIG. 6 is a schematic cross-sectional view taken along C-C of FIG. 1.
In the drawings, the drawings are not necessarily drawn to scale.
Description of the reference numerals:
100. a display module;
110. a display panel; 111. a first bonding terminal; 112. a substrate layer; 113. a functional layer;
120. a circuit board; 121. a second bonding terminal; 121a, a first gap; 122. a first sublayer; 123. a second sublayer; 123a, a second via hole;
130. a circuit board; 131. a connecting wire; 1311. a first connecting line; 1312. a second connecting line; 132. a first routing layer; 132a, a first via; 133. a second routing layer; 134. a first connection terminal; 135. a second connection terminal;
140. an anisotropic conductive adhesive;
x, a first direction; y, a second direction; z, third direction.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order to avoid unnecessarily obscuring the present application; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Further, the size and thickness of each configuration shown in the drawings are arbitrarily illustrated for understanding and ease of description, but the present inventive concept is not limited thereto. In the figures, the thickness of layers, films, panels, regions, etc. are exaggerated for clarity. In the drawings, the thickness of some of the layers and regions are exaggerated for better understanding and ease of description.
It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. Further, throughout the specification, the word "on" a target element means being positioned above or below the target element, and does not necessarily mean being positioned "at the upper side" based on the direction of gravity.
Furthermore, unless explicitly described to the contrary, the word "comprising" will be understood to imply the inclusion of stated elements but not the exclusion of any other elements.
In electronic devices such as mobile phones and tablet computers, structures such as light emitting elements on a display panel are generally required to be connected to a circuit board to control normal operation of the light emitting elements, or electrical signals of the structures such as the light emitting elements are transmitted to a circuit board to enable the circuit board to control operation of related components. The circuit board may be a driving circuit board, and as related functions such as touch control and display integrated on the display panel increase, the number of circuits required to be connected to the circuit board on the display panel increases, and the number of bonding terminals on the circuit board and the display panel also increases.
Among the correlation technique, the quantity of the second nation decides the terminal that has on the first nation decides terminal that has on the display panel and the circuit board is the same, but receive the restriction of the preparation technology of nation decides the terminal, the interval of the second nation decides the terminal on the circuit board is greater than the interval of the first nation decides terminal on the display panel, and the first nation decides terminal on the second nation decides terminal on the circuit board and the display panel is arranged along same direction usually, so, easily cause the circuit board to be greater than the display panel size along the size of second nation decides the terminal direction of arranging, at the in-process that circuit board and display panel nation decide the connection, the circuit board has the not enough problem in nation's definite space, be unfavorable for reducing display module's size.
In view of the above, embodiments of a display module and a display device are provided, and the following description will be given with reference to the accompanying drawings.
The embodiment of the application provides a display module, which can be an Organic Light Emitting Diode (OLED) display module.
As shown in fig. 1, a display module 100 according to an embodiment of the present disclosure includes a display panel 110, a circuit board 120, and a circuit board 130. Display panel 110 has a plurality of first bonding terminals 111, and the plurality of first bonding terminals 111 are arranged along first direction X. Circuit board 120 has a plurality of second bonding terminals 121, and at least two second bonding terminals 121 are arranged along first direction X, and at least two second bonding terminals 121 are arranged along second direction Y, and first direction X intersects with second direction Y. The wiring board 130 includes a plurality of connection lines 131, and the connection lines 131 electrically connect the first bonding terminal 111 and the second bonding terminal 121.
The display panel 110 may have light emitting elements and a driving circuit such as a thin film transistor or the like for driving the light emitting elements. The first bonding terminal 111 may be connected to a driving circuit of the light emitting elements of the display panel 110, and thus, the driving circuit of the light emitting elements may be provided with a driving signal through the circuit board 120 to drive the corresponding light emitting elements to emit light. The display panel 110 may further have a touch layer including a plurality of touch electrodes to implement a touch function of the display panel 110. First bonding terminal 111 can connect the touch electrode to send the signal of telecommunication to the touch electrode, perhaps receive the signal of telecommunication that the touch electrode sent, be convenient for realize normal touch-control function.
A plurality of first bonding terminals 111 are arranged along first direction X, and then a plurality of first bonding terminals 111 may be disposed at intervals along first direction X, or a plurality of first bonding terminals 111 may be adjacent to each other and disposed in an insulating manner along first direction X. The first direction X may be a longitudinal direction of the display panel 110, and of course, the first direction X may also be a width direction of the display panel 110. First bonding terminals 111 may be arranged only along first direction X, or first bonding terminals 111 may be arranged both along first direction X and along second direction Y.
At least two second nation decides terminal 121 and arranges along first direction X, and at least two second nation decides terminal 121 and arranges along second direction Y, then can set up at least part among a plurality of second nation decides terminal 121 and arrange along first direction X and second direction Y simultaneously and be the matrix form, or, can set up some second nation decides terminal 121 among a plurality of second nation decides terminal 121 and arrange along first direction X and second direction and be the matrix form, remaining part can only arrange along first direction X, or only arrange along second direction Y, of course, also can set up remaining part and be not regular arranging.
The second direction Y intersects the first direction X, and the included angle between the second direction Y and the first direction X may be a right angle or an acute angle, and the second direction Y may be, for example, perpendicular to the first direction X.
The first direction X may be a direction parallel to the display surface of the display panel 110, and the second direction Y may be a direction parallel to the display surface, or the second direction Y may be a direction intersecting the display surface, and the second direction Y may be, for example, perpendicular to the display surface. Of course, the second direction Y may be a direction including both a direction parallel to the display surface and a direction intersecting the display surface.
In an embodiment where the second direction Y is parallel to the display surface, the first direction X and the second direction Y may be located on the same plane, and correspondingly, the plurality of second bonding terminals 121 are disposed on the same layer on the circuit board 120. In the embodiment where the second direction Y intersects the display surface, the second direction Y and the first direction X are not located on the same plane, and correspondingly, the second bonding terminals 121 are located on different layers of the circuit board 120 along the second direction Y. In an embodiment where the second direction Y includes both a direction parallel to the display surface and a direction intersecting the display surface, the plurality of second bonding terminals 121 may be located on different layers on the circuit board 120 in a direction perpendicular to the display surface, and arranged in a direction parallel to the display surface, both in the first direction X and in a direction intersecting the first direction X.
A plurality of first nation decides terminal 111 and can equidistant setting along first direction X, also can set up a plurality of first nation decides terminal 111 according to actual need and arrange along first direction X inequally. Similarly, the second bonding terminals 121 may be arranged at equal intervals along the first direction X and the second direction Y, or may be arranged at unequal intervals along the second direction Y and the first direction X, respectively. For example, in an embodiment where the second direction Y is perpendicular to the first direction X and parallel to the display surface, the plurality of second bonding terminals 121 may be arranged in an array along the first direction X and the second direction Y, or may be arranged irregularly along the first direction X and the second direction Y, which may be specifically selected according to actual needs.
The wiring board 130 includes a plurality of connection lines 131, and each connection line 131 has one end electrically connected to the first bonding terminal 111 and the other end electrically connected to the second bonding terminal 121. The wiring board 130 may further include a connection terminal connected to the connection line 131, and the connection terminal may be electrically connected to the first bonding terminal 111 or the second bonding terminal 121 by a Conductive paste such as Anisotropic Conductive Film (ACF).
The embodiment of the application provides a display module assembly 100, set up a plurality of second nation and decide terminal 121 and both included the part of arranging along first direction X, include the part of arranging along second direction Y again, can save the space that second nation decides terminal 121 and occupy along first direction X, make circuit board 120 along first direction X's size can be less than or equal to display panel 110 along first direction X's size, reserve sufficient space for circuit board 120's nation decides to connect, be favorable to reducing display module assembly 100 along first direction X's size.
In some embodiments, the plurality of second bonding terminals 121 are arranged in a plurality of rows along the first direction X, and two adjacent rows of second bonding terminals 121 are spaced apart along the second direction Y.
Each row of second bonding terminals 121 is disposed at intervals along first direction X, and two adjacent rows of second bonding terminals 121 are disposed at intervals along second direction Y. A plurality of second bonding terminals 121 may be arranged in two rows, or in three or more rows, and may be set according to actual needs.
Two adjacent rows of second bonding terminals 121 along second direction Y may be disposed relatively, or two adjacent second bonding terminals 121 along second direction Y may be disposed along a staggered arrangement of second direction Y, that is, the second bonding terminal 121 of one row is disposed along a gap between second direction Y and the second bonding terminal 121 of another adjacent row.
One wiring board 130 may connect one row of second bonding terminals 121, or one wiring board 130 may connect multiple rows of bonding terminals simultaneously.
Set up second bonding terminal 121 and arrange along first direction X and be the multirow, be favorable to arranging of second bonding terminal 121 more regular to be connected with circuit board 130.
In some embodiments, a first gap 121a exists between two adjacent second bonding terminals 121 of the same row, where at least a portion of the orthographic projection of at least a portion of one row of second bonding terminals 121 in second direction X falls within first gap 121a between second bonding terminals 121 of another adjacent row.
The size of first gap 121a may be greater than, less than, or equal to the size of second bonding terminal 121 along first direction X. The orthographic projection of one row of second bonding terminals 121 in second direction X all falls within first gap 121a between the adjacent other row of second bonding terminals 121, or a portion of the orthographic projection of one row of second bonding terminals 121 in second direction Y falls within first gap 121a between the adjacent other row of second bonding terminals 121. At least a portion of the orthographic projection of a portion of one row of second bonding terminals 121 in the second direction Y may be disposed to fall into the first gap 121 between another adjacent row of second bonding terminals 121, or at least a portion of the orthographic projection of all second bonding terminals 121 in the second direction Y may all fall into the first gap 121 between another adjacent row of second bonding terminals 121, so that at least a portion of the orthographic projection of at least one row of second bonding terminals 121 in the second direction Y is disposed to fall into the first gap 121a between another adjacent row of second bonding terminals 121, that is, two adjacent rows of second bonding terminals 121 are disposed in a staggered arrangement along the first direction X.
So set up, when arranging, many connecting wires 131 that are connected with two adjacent lines of second nation terminal 121 respectively on circuit board 130 can arrange in turn along first direction X to reduce the risk that adjacent connecting wire 131 appears the short circuit in the in-process of preparation.
In some embodiments, the connection lines 131 include first connection lines 1311 and second connection lines 1312, the first connection lines 1311 and the second connection lines 1312 electrically connect two rows of the second bonding terminals 121 adjacent in the second direction Y, respectively, and orthographic projections of the first connection lines 1311 and the second connection lines 1312 in the second direction Y are alternately arranged in the first direction X.
The first connection lines 1311 and the second connection lines 1312 are respectively connected to two rows of second bonding terminals 121 adjacent to each other in the second direction Y, orthogonal projections of the first connection lines 1311 and the second connection lines 1312 in the second direction Y are alternately arranged in the first direction X, one second connection line 1312 exists between orthogonal projections of two first connection lines 1311 adjacent to each other in the first direction X in the second direction Y, and one first connection line 1311 exists between orthogonal projections of two second connection lines 1312 adjacent to each other in the first direction X in the second direction Y.
Thus, the first connection lines 1311 and the second connection lines 1312 are alternately arranged along the first direction X, which is beneficial to reducing the risk of adhesion and short circuit of two adjacent connection lines 131 in the preparation process of the connection lines 131.
The first connection line 1311 and the second connection line 1312 may be disposed on the same layer, or the first connection line 1311 and the second connection line 1312 may be disposed on different film layers of the wiring board 130.
As shown in fig. 1 and 2, in some embodiments, the circuit board 130 includes a first routing layer 132 and a second routing layer 133 stacked together, a first connection line 1311 is disposed on the first routing layer 132, and a second connection line 1312 is disposed on the second routing layer 133.
The first routing layer 132 and the second routing layer 133 may be stacked in a direction perpendicular to the display surface of the display panel 110, that is, in a stacking direction of the layers of the display panel 110.
It is understood that the first connecting lines 1311 and the second connecting lines 1312 are disposed on the first routing layer 132 and the second routing layer 133, respectively, i.e., the first connecting lines 1311 and the second connecting lines 1312 are disposed on different layers. Therefore, the distance between the first connecting line 1311 and the second connecting line 1312 can be further increased, and the risk of short circuit caused by adhesion of the adjacent connecting lines 131 in the preparation process of the circuit board 130 is further reduced.
With continued reference to fig. 1 and 2, in some embodiments, the first routing layer 132 is disposed on a side of the second routing layer 133 adjacent to the circuit board 120, the first routing layer 132 has a first via 132a, and the second connection line 1312 passes through the first via 132a.
It is understood that the connection line 131 on the wiring board 130 is connected to the second bonding terminal 121 through a connection terminal, and the connection terminal on the wiring board 130 is electrically connected to the second bonding terminal 121 through the anisotropic conductive adhesive 140. The more uniform the thickness of the anisotropic conductive adhesive connecting the different connection terminals and the second bonding terminal 121, the more reliable the connection of the circuit board 130 and the circuit board 120.
In an embodiment where two adjacent rows of second bonding terminals 121 in the second direction Y are disposed in the same layer, the connection terminals on the wiring board 130 are also disposed in the same layer to achieve uniformity in anisotropic conductive thickness between different connection terminals and the second bonding terminals 121. The connection terminal on the circuit board 130 can be disposed on a side of the circuit board 130 close to the circuit board 120, and since the first connection line 1311 and the second connection line 1312 are disposed on different layers and the first routing layer 133 is disposed on a side close to the circuit board 120, the second connection line 1312 can pass through the first via 132a on the first routing layer 132 to achieve electrical connection with the connection terminal.
Therefore, the first wiring layer 132 is provided with the via holes, and the second connecting lines 1312 are arranged to penetrate through the first via holes 132a, which is beneficial to realizing the same layer arrangement of the connecting terminals on the circuit board 130, facilitating the preparation of the connecting terminals on the circuit board 130, and improving the reliability of the electrical connection between the connecting terminals on the circuit board 130 and the second bonding terminals 121 on the circuit board 120.
As shown in fig. 1, in some embodiments, a plurality of second bonding terminals 121 are disposed in the same layer.
Thus, the second direction Y may be parallel to the display surface of the display panel 110, and the plurality of second bonding terminals 121 are disposed on the same layer, so that the second bonding terminals 121 are conveniently manufactured, and the manufacturing process of the circuit board 120 is simplified. In addition, since the second bonding terminals 121 are disposed on the same layer, the second bonding terminals 121 do not occupy more space in the direction perpendicular to the stacking direction, which is beneficial to reducing the size of the circuit board 120 in the layer direction.
As shown in fig. 3 and 4, in some embodiments, the circuit board 120 includes a first sub-layer 122 and a second sub-layer 123 stacked in the second direction Y, the circuit board 130 is disposed on a side of the second sub-layer 123 opposite to the first sub-layer 122, the second sub-layer 123 is provided with a second via hole 123a, one of two adjacent rows of the second bonding terminals 121 is disposed on the first sub-layer 122 and exposed by the second via hole 123a, and the other row is disposed on the second sub-layer 123.
In this embodiment, two rows of second bonding terminals 121 adjacent to each other in the second direction Y are respectively located in the first sublayer 122 and the second sublayer 123 in the second direction Y. The circuit board 130 is disposed on a side of the second sub-layer 123 opposite to the first sub-layer 122, and then the circuit board 130 is connected to the circuit board 120 from the side of the second sub-layer 123 opposite to the first sub-layer 122, and the first sub-layer 122 is disposed on a side of the second sub-layer 123 opposite to the circuit board 130, so that in order to achieve electrical connection between the second bonding terminal 131 of the first sub-layer 122 and the connection terminal on the circuit board 130, at least a portion of a corresponding position between the second sub-layer 123 and the second bonding terminal 121 on the first sub-layer 122 is provided with a second via hole 123a, so as to achieve electrical connection between the second bonding terminal 121 of the first sub-layer 122 and the circuit board 130.
So, when reducing circuit board 120 along the size of first direction X, also can utilize the space of following second direction Y in the display module assembly 100, rationally set up arranging of second nation terminal 121, reduce the space that circuit board 130 took along third direction Z, third direction Z can be perpendicular to first direction X and second direction Y respectively.
In an embodiment where the second bonding terminals 121 in different rows along the second direction Y are located on different layers, connection terminals on the circuit board 130 connected to the second bonding terminals 121 on the first sub-layer 122 and the second sub-layer 123 respectively may be disposed on the same layer, and certainly, connection terminals on the circuit board 130 connected to the second bonding terminals 121 on the first sub-layer 122 and the second sub-layer 123 respectively may also be disposed on different layers, so that the distances between the second bonding terminals 121 of the first sub-layer 122 and the second bonding terminals 121 of the second sub-layer 123 are equal to the distances between the connection terminals on the circuit board 130.
As shown in fig. 3 and 5, in some embodiments, the wiring board 130 includes a first connection terminal 134 and a second connection terminal 135 connected to the plurality of connection lines 131, the first connection terminal 134 is connected to the second bonding terminal 121 located on the first sub-layer 122, and the second connection terminal 135 is connected to the second bonding terminal 121 located on the second sub-layer 123. The absolute value of the difference between the pitch of first connection terminal 134 and second bonding terminal 121 of first sub-layer 122 and the pitch of second connection terminal 135 and second bonding terminal 121 of second sub-layer 123 in second direction Y is less than or equal to 50 μm.
The first and second connection terminals 134 and 135 are electrically connected to the second bonding terminals 121 at the first and second sub-layers 122 and 123, respectively. Since the height difference exists between the second bonding terminals 121 located in the first sublayer 122 and the second sublayer 123 along the second direction Y, the first connection terminal 134 and the second connection terminal 135 are respectively connected to the second bonding terminal 121 through the anisotropic conductive adhesive 140, and the smaller the difference between the sizes of the anisotropic conductive adhesive 140 connected to the first connection terminal 134 and the second connection terminal 135 along the second direction Y, the more the reliability of the connection between the circuit board 130 and the circuit board 120 is improved. h1 is a distance between the second bonding terminal 121 located in the first sub-layer 122 and the first connection terminal 134 along the second direction Y, and h2 is a distance between the second bonding terminal 121 located in the second sub-layer 123 and the second connection terminal 135 along the second direction Y, that is, the smaller the absolute value of the difference between h1 and h2 in fig. 5 is, the more favorable the improvement of the consistency of the heights of the anisotropic conductive adhesives 140 respectively connected with the first connection terminal 134 and the second connection terminal 135 along the second direction Y, and the more favorable the improvement of the reliability of the connection between the circuit board 130 and the circuit board 120.
The absolute value of the difference between the distance between first connection terminal 134 and second bonding terminal 121 of first sub-layer 122 and the distance between second connection terminal 135 and second bonding terminal 121 of second sub-layer 123 in second direction Y is the absolute value of the difference between h1 and h2.
Alternatively, the absolute value of the difference between the pitch of the first connection terminal 134 and the second bonding terminal 121 of the first sub-layer 122 and the pitch of the second connection terminal 135 and the second bonding terminal 121 of the second sub-layer 123 in the second direction Y may be any value not greater than 50 μm, such as 0, 10 μm, 20 μm, 30 μm, 40 μm, or 50 μm.
In order to satisfy the above relationship, it may be arranged that the first connection terminal 134 and the second connection terminal 135 are disposed at different layers in the second direction Y, and a pitch of the first connection terminal 134 and the second connection terminal 135 in the second direction Y coincides with a pitch of the first sub-layer 122 and the second sub-layer 123 in the second direction Y as much as possible, or an absolute value of a difference between the pitch of the first connection terminal 134 and the second connection terminal 135 in the second direction Y and a pitch of the second bonding terminal 121 in the second direction Y at the first sub-layer 122 and the second sub-layer 123, respectively, is less than or equal to 50 μm.
Exemplarily, in an embodiment where the first connection line 1311 and the second connection line 1312 are respectively disposed on the first wiring layer 132 and the second wiring layer 133, the first connection line 1311 may be disposed on the first wiring layer 132, and the second connection line 1312 may be disposed on the second wiring layer 133, and the first connection line 1311 is disposed to connect the first connection terminal 134, and the second connection line 1312 is disposed to connect the second connection terminal 135.
The display module 100 provided in the embodiment of the present application, through setting up along the second direction Y, the absolute value of the difference between the distance between the first connection terminal 134 and the second bonding terminal 121 of the first sub-layer 122 and the distance between the second connection terminal 135 and the second bonding terminal 121 of the second sub-layer 123 is less than or equal to 50 μm, which is beneficial to reducing the difference between the sizes of the anisotropic conductive adhesive 140 connected with the first connection terminal 134 and the second connection terminal 135 along the second direction Y, and is further beneficial to improving the reliability of the connection between the circuit board 130 and the circuit board 120.
In some embodiments, the spacing between first connection terminal 134 and second bonding terminal 121 of first sub-layer 122 is equal to the spacing between second connection terminal 135 and second bonding terminal 121 of second sub-layer 123.
As shown in fig. 5, the interval between the first connection terminal 134 and the second bonding terminal 121 of the first sub-layer 122 is equal to the interval between the second connection terminal 135 and the second bonding terminal 121 of the second sub-layer 123, i.e., h1= h2. In this way, the anisotropic conductive paste 140 connected to the first connection terminal 134 and the second connection terminal 135 has the same size along the second direction Y, which is further advantageous for improving the reliability of the connection between the circuit board 130 and the circuit board 120.
It is understood that, in order to achieve h1= h2, the pitch of the first and second connection terminals 134 and 135 in the second direction Y may be set to be equal to the pitch of the second bonding terminals 121 respectively located at the first and second sub-layers 122 and 123.
As shown in fig. 1 and 6, in some embodiments, display panel 110 includes a substrate layer 112 and a functional layer 113 stacked in a third direction Z, and first bonding terminals 111 are formed on functional layer 113, and the first direction X, second direction Y, and third direction Z intersect each other two by two.
For example, the first direction X, the second direction Y, and the third direction Z may be set to be perpendicular two by two.
The functional layer 113 may be a film layer that implements a display function of the display panel 110, or the functional layer 113 may be a film layer that implements a touch function of the display panel 110. Of course, the functional layer 113 may include both a film layer for implementing a display function and a film layer for implementing a touch function.
The substrate layer 112 and the functional layer 113 are stacked along a third direction Z, and the third direction Z intersects with the first direction X and the second direction Y two by two, so that the first direction X, the second direction Y, and the third direction Z may be perpendicular to each other two by two. Because second nation decides terminal 121 and arranges along a direction and second direction Y, then can reduce the space that circuit board 120 took along third direction Z, be favorable to reducing circuit board 120 and display film group along third direction Z thickness.
In some embodiments, the functional layer 113 includes a touch electrode electrically connected to the first bonding terminal 111.
The touch electrodes may be self-capacitive, or alternatively, the touch electrodes may be mutually capacitive. The touch control electrodes comprise touch control driving electrodes and touch control induction electrodes, and the touch control driving electrodes and the touch control induction electrodes can be arranged on the same layer, or the touch control driving electrodes and the touch control induction electrodes are respectively positioned on different layers and are arranged in an insulating mode.
The functional layer 113 includes a touch electrode, and the touch electrode is electrically connected to the first bonding terminal 111 to electrically connect the touch electrode to the circuit board 120, so that the touch electrode can send an electrical signal to the circuit board 120, or the touch electrode receives the electrical signal from the circuit board 120 to realize a normal touch function of the display panel 110.
In some embodiments, functional layer 113 includes a display unit electrically connected to first bond terminal 111.
The display unit includes a plurality of sub-pixels, which may be respectively used for red light, green light, and blue light. The driving circuit of each sub-pixel is electrically connected to the first bonding terminal 111, and is electrically connected to the circuit board 120 through the first bonding terminal 111, so that the circuit board 120 provides electric energy and electric signals for each sub-pixel, or each sub-pixel transmits the electric signals to the circuit board 120, so as to realize the normal display function of the display panel 110.
The display device provided by the embodiment of the present application includes the display module 100 provided by any one of the above embodiments.
The display device provided by the embodiment of the application has the same technical effect because the display device comprises the display module provided by any one of the embodiments, and the description is omitted here.
While the application has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the application. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. The present application is not intended to be limited to the particular embodiments disclosed herein but is to cover all embodiments that may fall within the scope of the appended claims.
Claims (10)
1. A display module, comprising:
the display panel is provided with a plurality of first bonding terminals, and the first bonding terminals are arranged along a first direction;
the circuit board is provided with a plurality of second bonding terminals, at least two second bonding terminals are arranged along the first direction, at least two second bonding terminals are arranged along the second direction, and the first direction is intersected with the second direction;
the circuit board comprises a plurality of connecting wires, and the connecting wires are electrically connected with the first bonding terminal and the second bonding terminal.
2. The display module assembly according to claim 1, wherein the plurality of second bonding terminals are arranged in a plurality of rows along the first direction, and two adjacent rows of the second bonding terminals are arranged at intervals along the second direction;
preferably, a first gap exists between two adjacent second bonding terminals of the same row, wherein at least a portion of an orthographic projection of at least a portion of one row of the second bonding terminals in the second direction falls within the first gap between the second bonding terminals of another adjacent row.
3. The display module according to claim 2, wherein the connection lines include first connection lines and second connection lines, the first connection lines and the second connection lines are respectively electrically connected to two rows of the second bonding terminals adjacent to each other in the second direction, and orthographic projections of the first connection lines and the second connection lines in the second direction are alternately arranged in the first direction.
4. The display module according to claim 3, wherein the circuit board comprises a first wiring layer and a second wiring layer stacked on each other, the first connecting line is disposed on the first wiring layer, and the second connecting line is disposed on the second wiring layer.
5. The display module assembly of claim 4, wherein the first routing layer is disposed on a side of the second routing layer close to the circuit board, the first routing layer has a first via hole, and the second connection line passes through the first via hole.
6. The display module of claim 2, wherein the second bonding terminals are disposed in the same layer.
7. The display module according to claim 2, wherein the circuit board includes a first sub-layer and a second sub-layer stacked in the second direction, the circuit board is disposed on a side of the second sub-layer opposite to the first sub-layer, the second sub-layer has a second via hole, one of the two adjacent rows of the second bonding terminals is disposed on the first sub-layer and exposed by the second via hole, and the other row is disposed on the second sub-layer.
8. The display film stack of claim 7, wherein the circuit board includes a first connection terminal and a second connection terminal connected to the plurality of connection lines, the first connection terminal being connected to the second bonding terminal at the first sub-layer, the second connection terminal being connected to the second bonding terminal at the second sub-layer;
an absolute value of a difference between a pitch of the first connection terminal and the second bonding terminal of the first sub-layer and a pitch of the second connection terminal and the second bonding terminal of the second sub-layer in the second direction is less than or equal to 50 μm;
preferably, the first connection terminal is spaced apart from the second bonding terminal of the first sub-layer by an interval equal to the interval between the second connection terminal and the second bonding terminal of the second sub-layer.
9. The display module according to claim 1, wherein the display panel comprises a substrate layer and a functional layer stacked in a third direction, the first bonding terminal is formed on the functional layer, and the first direction, the second direction and the third direction intersect with each other;
preferably, the functional layer includes a touch electrode, and the touch electrode is electrically connected to the first bonding terminal;
and/or the functional layer includes a display unit electrically connected to the first bonding terminal.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211311361.9A CN115551193A (en) | 2022-10-19 | 2022-10-19 | Display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211311361.9A CN115551193A (en) | 2022-10-19 | 2022-10-19 | Display module and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115551193A true CN115551193A (en) | 2022-12-30 |
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ID=84718948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211311361.9A Pending CN115551193A (en) | 2022-10-19 | 2022-10-19 | Display module and display device |
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| Country | Link |
|---|---|
| CN (1) | CN115551193A (en) |
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2022
- 2022-10-19 CN CN202211311361.9A patent/CN115551193A/en active Pending
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