CN115548173A - Equipment for removing defective wafer from semiconductor wafer - Google Patents

Equipment for removing defective wafer from semiconductor wafer Download PDF

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Publication number
CN115548173A
CN115548173A CN202211153942.4A CN202211153942A CN115548173A CN 115548173 A CN115548173 A CN 115548173A CN 202211153942 A CN202211153942 A CN 202211153942A CN 115548173 A CN115548173 A CN 115548173A
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CN
China
Prior art keywords
plate
sliding
wafer
moving platform
fixing plate
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Granted
Application number
CN202211153942.4A
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Chinese (zh)
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CN115548173B (en
Inventor
王庆富
乔占伟
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Dongguan Heyi Automation Technology Co ltd
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Dongguan Heyi Automation Technology Co ltd
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Priority to CN202211153942.4A priority Critical patent/CN115548173B/en
Publication of CN115548173A publication Critical patent/CN115548173A/en
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Publication of CN115548173B publication Critical patent/CN115548173B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning In General (AREA)

Abstract

The invention provides a device for removing a defective wafer from a semiconductor wafer, which comprises: grinding component, laser heater, mounting panel, sliding assembly, be provided with on the mounting panel sliding assembly, sliding assembly with laser heater connects, sliding assembly still with grinding component connects, through laser heater heats the welding pad simultaneously when heating the LED wafer, makes when reprocessing grinding component also changes when the wafer pad of grinding and clears up tin layer on the pad to make the pad surface level and smooth more, reduce no tin residual between the pad, improved the quality of reprocessing.

Description

Equipment for removing defective wafer from semiconductor wafer
Technical Field
The invention belongs to the technical field of wafer processing, and particularly relates to equipment for removing a defective wafer from a semiconductor wafer.
Background
When the semiconductor MiniLED wafer directly displays the screen and the backlight screen, and the wafer is not bright, dark, bright, and the like, the damaged wafer and the tin on the bonding pad need to be removed. When present manual work is reprocessed, be through the high power magnifying glass to this type of mode that appears the wafer bright or dark bright, pick up with very slight needle, then mend the tin and again the manual work pastes a wafer of the same model. Due to the fine structure, the manual maintenance is very troublesome, the operation difficulty is high, the repair time is long, and the efficiency is low; meanwhile, tin on the bonding pad cannot be well cleaned, so that the plane of the bonding pad is relatively flat.
Disclosure of Invention
Therefore, the present invention is directed to solve the above-mentioned drawbacks of the prior art and to provide an apparatus for removing a defective wafer from a semiconductor wafer.
Therefore, the technical scheme adopted is that the equipment for removing the defective wafer from the semiconductor wafer comprises the following components: grinding component, laser heater, mounting panel, sliding assembly, be provided with on the mounting panel sliding assembly, sliding assembly with laser heater connects, sliding assembly still with grinding component connects.
Preferably, the sliding assembly includes: the laser grinding device comprises a first electric push rod and a sliding block, wherein one side of the first electric push rod is connected with the mounting plate, the output end of the first electric push rod is connected with the top of the sliding block, one side of the sliding block is connected with the mounting plate in a sliding manner, and the sliding block is connected with the laser heater and the grinding component.
Preferably, a height measuring device is further arranged on the mounting plate.
Preferably, the mounting plate is disposed on a horizontal moving platform, and the horizontal moving platform includes: x is to moving platform, y to moving platform, the mounting panel with x is connected to moving platform, x is in to moving platform setting y is to moving platform is last, y is provided with transportation guide rail platform to the moving platform below, transportation guide rail platform bottom with y all sets up on the base to moving platform bottom.
Preferably, the grinding assembly is further provided with a suction nozzle, and the suction nozzle is connected with the cleaning device.
Preferably, the cleaning device includes: the dust collection device comprises a dust collection pipe, a dust collection box, a partition plate, a filter screen, an air outlet, a first motor and fan blades, wherein one end of the dust collection pipe is communicated with the suction nozzle, the other end of the dust collection pipe is communicated with one side of the dust collection box, the air outlet is formed in the other side of the dust collection box, the partition plate is arranged in the middle of the dust collection box, the filter screen is arranged on the partition plate, the first motor is arranged below the air outlet, and the fan blades are arranged on an output shaft of the first motor.
Preferably, the output end of the first motor is connected with one side of a cam, the cam is connected with a slide rail in a sliding manner, a first fixed plate is arranged on one side of the slide rail, the first fixed plate is rotatably connected with the top end of a first connecting rod, the bottom end of the first connecting rod is connected with a first sliding plate, the bottom surface of the first sliding plate is connected with a second fixed plate in a sliding manner, one side of the second fixed plate is connected with the side wall of the dust collection box, the other side of the second fixed plate is connected with the partition plate, a convex column is arranged on the other side of the cam, the convex column is connected with a first sliding chute on a third fixed plate in a sliding manner, and the bottom of the third fixed plate is vertically connected with the first sliding plate.
Preferably, a sweeper is arranged on the third fixing plate and can be in contact with the filter screen.
Preferably, one end, far away from the first fixed plate, of the slide rail is perpendicularly connected with the top end of the second connecting rod, a second sliding groove is formed in the first sliding plate, a third sliding groove is formed in the second fixed plate, a fourth sliding groove is further formed in the partition plate, the fourth sliding groove is slidably connected with the second sliding plate, a clamping groove is formed in the second sliding plate, the bottom end of the second connecting rod can be clamped with the clamping groove, the bottom of the second sliding plate is further connected with the top of a push plate, the push plate is arranged on the right side of the partition plate, an inclined plate is arranged above the push plate, and the inclined plate is arranged below the filter screen.
Preferably, a spring is arranged between the push plate and the front wall in the dust collection box.
The technical scheme of the invention has the following advantages: through laser heater heats the welding pad simultaneously when heating the LED wafer for during the reprocess grinding assembly also changeed when the wafer pad that grinds clears up tin layer on the pad, thereby makes the pad surface level and more smooth, reduces not have tin residue between the pad, has improved the reprocess quality.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic of the present invention;
FIG. 2 is a schematic view of the mounting plate of the present invention;
FIG. 3 is a schematic front view of the cleaning apparatus of the present invention;
FIG. 4 is a schematic right side view of the cleaning apparatus of the present invention;
wherein, 1, grinding component; 2. a laser heater; 3. mounting a plate; 4. a first electric push rod; 5. a slider; 6. a height measurer; 7. an x-direction moving platform; 8. a y-direction moving platform; 9. transporting the rail platform; 10. a base; 11. a suction nozzle; 12. a dust collection pipe; 13. a dust collection box; 14. a partition plate; 15. filtering with a screen; 16. an air outlet; 17. a first motor; 18. a fan blade; 19. a cam; 20. a slide rail; 21. a first fixing plate; 22. a first connecting rod; 23. a first sliding plate; 24. a second fixing plate; 25. a convex column; 26. a third fixing plate; 27. brushing; 28. a second connecting rod; 29. a second chute; 30. a third chute; 31. a fourth chute; 32. a second sliding plate; 33. a card slot; 34. pushing a plate; 35. a sloping plate; 36. a spring; 37. a first chute; .
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly connected to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The invention provides a device for removing a defective wafer from a semiconductor wafer, as shown in fig. 1, comprising: grinding component 1, laser heater 2, mounting panel 3, sliding assembly, be provided with on the mounting panel 3 sliding assembly, sliding assembly with laser heater 2 is connected, sliding assembly still with grinding component 1 is connected.
The working principle and the beneficial effects of the technical scheme are as follows: through laser heater 2 heats the welding pad simultaneously when heating the LED wafer for during the reprocess grinding subassembly 1 also more changes when the wafer pad of grinding and clears up tin layer on the pad, thereby makes the pad surface level and smooth more, reduces not have tin residue between the pad, has improved the quality of reprocess.
In one embodiment, as shown in fig. 2, the sliding assembly includes: first electric putter 4, sliding block 5, one side of first electric putter 4 with the mounting panel 3 is connected, first electric putter 4's output with the top of sliding block 5 is connected, one side of sliding block 5 with mounting panel 3 sliding connection, sliding block 5 with laser heater 2 the grinding component 1 is connected.
In one embodiment, a height measurer 6 is further disposed on the mounting plate 3.
In one embodiment, the mounting plate 3 is disposed on a horizontal moving platform comprising: x is to moving platform 7, y to moving platform 8, mounting panel 3 with x is connected to moving platform 7, x is in to moving platform 7 setting y is to moving platform 8 is last, y is provided with transportation guide rail platform 9 to moving platform 8 below, transportation guide rail platform 9 bottom with y all sets up on base 10 to moving platform 8 bottom.
The working principle and the beneficial effects of the technical scheme are as follows: through first electric putter 4 drives sliding block 5 makes grinding component 1 with laser heater 2 can realize the up-and-down motion, through x to moving platform 7, y to moving platform 8 can adjust grinding component 1 with laser heater 2's horizontal position for grinding component 1 can the adjusting position contact the wafer position of waiting to repair on the PCB board and grind, and pass through height measurement ware 6 measures the vertical distance between the confirmed and this wafer, transportation guide rail platform 9 is responsible for the transportation to the PCB board, transports the PCB board of waiting to repair to the below of grinding component 1.
In one embodiment, as shown in fig. 2-4, the grinding assembly 1 is further provided with a suction nozzle 11, and the suction nozzle 11 is connected with a cleaning device.
In one embodiment, the cleaning device comprises: dust absorption pipe 12, dust collection box 13, baffle 14, filter screen 15, air outlet 16, first motor 17, flabellum 18, the one end of dust absorption pipe 12 with suction nozzle 11 intercommunication, the other end of dust absorption pipe 12 with one side intercommunication of dust collection box 13, the opposite side of dust collection box 13 is provided with air outlet 16, dust collection box 13 middle part is provided with baffle 14, be provided with on the baffle 14 filter screen 15, air outlet 16 below is provided with first motor 17, be provided with on first motor 17's the output shaft flabellum 18.
The working principle and the beneficial effects of the technical scheme are as follows: the fan blades 18 are driven to rotate by the first-page motor, air is exhausted from the air outlet 16, so that the wafer and the soldering tin which are ground by the grinding assembly 1 are sucked away by the suction nozzle 11 and collected in the dust collection box 13, and the filter screen 15 prevents impurities from passing through, so that the impurities are prevented from being dissipated to the outside of the dust collection box 13 to pollute the working environment.
In one embodiment, the output end of the first motor 17 is connected to one side of a cam 19, the cam 19 is slidably connected to a slide rail 20, a first fixing plate 21 is disposed on one side of the slide rail 20, the first fixing plate 21 is rotatably connected to the top end of a first connecting rod 22, the bottom end of the first connecting rod 22 is connected to a first sliding plate 23, the bottom surface of the first sliding plate 23 is slidably connected to a second fixing plate 24, one side of the second fixing plate 24 is connected to the side wall of the dust collecting box 13, the other side of the second fixing plate 24 is connected to the partition plate 14, a boss 25 is disposed on the other side of the cam 19, the boss 25 is slidably connected to a first sliding slot 37 of a third fixing plate 26, and the bottom of the third fixing plate 26 is vertically connected to the first sliding plate 23.
In one embodiment, the third fixing plate 26 is provided with a wiper 27, and the wiper 27 can contact with the filter screen 15.
The working principle and the beneficial effects of the technical scheme are as follows: the first motor 17 drives the cam 19 to rotate, so that the sliding rail 20 swings up and down, meanwhile, the convex column 25 is connected with the first sliding groove 37 in a sliding manner, the third fixing plate 26 and the first sliding plate 23 are driven to slide back and forth, the filter screen 15 is cleaned by the sweeper 27, and dust is prevented from blocking the filter screen 15.
In one embodiment, one end of the slide rail 20 away from the first fixed plate 21 is vertically connected to a top end of a second connecting rod 28, the first sliding plate 23 is provided with a second sliding slot 29, the second fixed plate 24 is provided with a third sliding slot 30, the partition plate 14 is further provided with a fourth sliding slot 31, the fourth sliding slot 31 is slidably connected to a second sliding plate 32, the second sliding plate 32 is provided with a clamping slot 33, a bottom end of the second connecting rod 28 can be clamped to the clamping slot 33, a bottom of the second sliding plate 32 is further connected to a top of a push plate 34, the push plate 34 is disposed at a right side of the partition plate 14, an inclined plate 35 is disposed above the push plate 34, and the inclined plate 35 is disposed below the filter screen 15.
In one embodiment, a spring 36 is provided between the push plate 34 and the inner front wall of the dust box 13.
The working principle and the beneficial effects of the technical scheme are as follows: because the cam 19 enables the end of the slide rail 20 far away from the first fixed plate 21 to swing up and down, and the second sliding plate 32 reciprocates back and forth, the end of the slide rail 20 far away from the first fixed plate 21 moves backwards and upwards, moves forwards and downwards, and then moves backwards and backwards again in a reciprocating manner, so that the second connecting rod 28 can be clamped with the clamping groove 33 when the slide rail 20 swings downwards to drive the push plate 34 to move backwards, then the slide rail 20 swings upwards, the second connecting rod 28 is separated from the clamping groove 33, and the push plate 34 resets under the action of the spring 36, so that the dust falling on the inclined plate 35 can continuously slide downwards towards the inclined plate 35, the dust falling off from the inclined plate 35 can be pushed into the lower part of the inclined plate 35 through the push plate 34, the influence of the air flow on the dust and welding slag can be reduced, and part of the dust and welding slag can be prevented from being curled up again by the air flow and attached to the filter screen 15, and the filtering and dust collection effects can be influenced.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (10)

1. An apparatus for removing a defective wafer from a semiconductor wafer, comprising: grinding component (1), laser heater (2), mounting panel (3), sliding assembly, be provided with on mounting panel (3) sliding assembly, sliding assembly with laser heater (2) are connected, sliding assembly still with grinding component (1) is connected.
2. The apparatus as claimed in claim 1, wherein the slide assembly comprises: first electric putter (4), sliding block (5), one side of first electric putter (4) with mounting panel (3) are connected, the output of first electric putter (4) with the top of sliding block (5) is connected, one side of sliding block (5) with mounting panel (3) sliding connection, sliding block (5) with laser heater (2) grinding component (1) are connected.
3. The apparatus for removing the defective wafer from the semiconductor wafer as claimed in claim 1, wherein a height measuring device (6) is further provided on the mounting plate (3).
4. The apparatus for removing the defective wafer from the semiconductor wafer as claimed in claim 1, wherein the mounting plate (3) is disposed on a horizontal moving platform, the horizontal moving platform comprising: x is to moving platform (7), y to moving platform (8), mounting panel (3) with x is connected to moving platform (7), x sets up to moving platform (7) y is to moving platform (8) on, y is provided with transportation guide rail platform (9) to moving platform (8) below, transportation guide rail platform (9) bottom with y all sets up on base (10) to moving platform (8) bottom.
5. The apparatus for removing the defective wafer from the semiconductor wafer as claimed in claim 1, wherein the polishing assembly (1) is further provided with a suction nozzle (11), and the suction nozzle (11) is connected with a cleaning device.
6. The apparatus as claimed in claim 5, wherein the cleaning device comprises: dust absorption pipe (12), dust collection box (13), baffle (14), filter screen (15), air outlet (16), first motor (17), flabellum (18), the one end of dust absorption pipe (12) with suction nozzle (11) intercommunication, the other end of dust absorption pipe (12) with one side intercommunication of dust collection box (13), the opposite side of dust collection box (13) is provided with air outlet (16), dust collection box (13) middle part is provided with baffle (14), be provided with on baffle (14) filter screen (15), air outlet (16) below is provided with first motor (17), be provided with on the output shaft of first motor (17) flabellum (18).
7. The apparatus for removing the defective wafer from the semiconductor wafer as claimed in claim 6, wherein an output end of the first motor (17) is connected to one side of a cam (19), the cam (19) is slidably connected to a slide rail (20), one side of the slide rail (20) is provided with a first fixing plate (21), the first fixing plate (21) is rotatably connected to a top end of a first connecting rod (22), a bottom end of the first connecting rod (22) is connected to a first sliding plate (23), a bottom surface of the first sliding plate (23) is slidably connected to a second fixing plate (24), one side of the second fixing plate (24) is connected to a side wall of the dust box (13), another side of the second fixing plate (24) is connected to the partition plate (14), another side of the cam (19) is provided with a convex pillar (25), the convex pillar (25) is slidably connected to a first sliding groove (37) on a third fixing plate (26), and a bottom of the third fixing plate (26) is vertically connected to the first sliding plate (23).
8. The apparatus for removing the imperfect wafer on the semiconductor wafer according to claim 7, wherein said third fixing plate (26) is provided with a wiper (27), said wiper (27) can contact with said screen (15).
9. The apparatus for removing the defective wafer from the semiconductor wafer as claimed in claim 7, wherein one end of the slide rail (20) away from the first fixing plate (21) is vertically connected to a top end of a second connecting rod (28), the first sliding plate (23) is provided with a second sliding slot (29), the second fixing plate (24) is provided with a third sliding slot (30), the partition plate (14) is further provided with a fourth sliding slot (31), the fourth sliding slot (31) is slidably connected to the second sliding plate (32), the second sliding plate (32) is provided with a clamping slot (33), a bottom end of the second connecting rod (28) can be clamped to the clamping slot (33), a bottom of the second sliding plate (32) is further connected to a top of a pushing plate (34), the pushing plate (34) is disposed at a right side of the partition plate (14), an inclined plate (35) is disposed above the pushing plate (34), and the inclined plate (35) is disposed below the filter screen (15).
10. The apparatus for removing the defective wafer from the semiconductor wafer as claimed in claim 9, wherein a spring (36) is provided between the pushing plate (34) and the inner front wall of the dust box (13).
CN202211153942.4A 2022-09-21 2022-09-21 Equipment for removing bad wafer from semiconductor wafer Active CN115548173B (en)

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CN202211153942.4A CN115548173B (en) 2022-09-21 2022-09-21 Equipment for removing bad wafer from semiconductor wafer

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CN115548173B CN115548173B (en) 2023-08-01

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181097A (en) * 1994-12-22 1996-07-12 Komatsu Electron Metals Co Ltd Removing method and device of foreign object attached to semiconductor wafer-attaching plate
CN113782650A (en) * 2021-09-07 2021-12-10 苏州奕格飞半导体技术有限公司 Wafer laser stripping device and method
WO2022036952A1 (en) * 2020-08-17 2022-02-24 惠州市源德智科技有限公司 Grinding device for flux solder paste
CN114178645A (en) * 2022-01-24 2022-03-15 东莞市合易自动化科技有限公司 Multi-time positioning welding machine for repairing and fixing MiniLED wafer
WO2022052210A1 (en) * 2020-09-10 2022-03-17 安徽龙芯微科技有限公司 Manufacturing method for packaging structure
CN114335190A (en) * 2021-12-21 2022-04-12 南通康芯半导体科技有限公司 Knife-scraping diode chip with simplified manufacturing process and manufacturing method thereof
JP2022121826A (en) * 2021-02-09 2022-08-22 東レエンジニアリング株式会社 Chip component removing method and chip component removing device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181097A (en) * 1994-12-22 1996-07-12 Komatsu Electron Metals Co Ltd Removing method and device of foreign object attached to semiconductor wafer-attaching plate
WO2022036952A1 (en) * 2020-08-17 2022-02-24 惠州市源德智科技有限公司 Grinding device for flux solder paste
WO2022052210A1 (en) * 2020-09-10 2022-03-17 安徽龙芯微科技有限公司 Manufacturing method for packaging structure
JP2022121826A (en) * 2021-02-09 2022-08-22 東レエンジニアリング株式会社 Chip component removing method and chip component removing device
CN113782650A (en) * 2021-09-07 2021-12-10 苏州奕格飞半导体技术有限公司 Wafer laser stripping device and method
CN114335190A (en) * 2021-12-21 2022-04-12 南通康芯半导体科技有限公司 Knife-scraping diode chip with simplified manufacturing process and manufacturing method thereof
CN114178645A (en) * 2022-01-24 2022-03-15 东莞市合易自动化科技有限公司 Multi-time positioning welding machine for repairing and fixing MiniLED wafer

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