CN115542969A - Automatic temperature control circuit - Google Patents
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Abstract
The invention provides an automatic temperature control circuit, and belongs to the technical field of electronics. The invention adopts a negative feedback regulation mode to automatically regulate and control the temperature, the automatic temperature control circuit converts the analog temperature into a corresponding analog voltage signal by utilizing a temperature sensor in the semiconductor refrigerator, the analog voltage signal after being filtered is converted into a digital temperature signal by an analog-to-digital conversion circuit, a micro control unit compares the temperature value of the digital temperature signal with a set temperature value to generate a new digital feedback signal, the digital feedback signal is converted into an analog feedback signal by a digital-to-analog conversion circuit, and the analog feedback signal is input into a semiconductor refrigerator controller circuit after being filtered and is used for controlling the semiconductor refrigerator to automatically regulate the temperature, thereby realizing the automatic feedback regulation of the temperature. The circuit can monitor the temperature of the target circuit in real time and make rapid and accurate adjustment so as to ensure that the target circuit works at constant temperature and prolong the service life of the target circuit.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a circuit capable of monitoring the temperature of a working target in real time and accurately and automatically regulating and controlling.
Background
With the rapid development of society and the accelerated progress of science and technology, temperature measuring instruments are applied more and more widely in various fields, and automation and intellectualization become the mainstream development direction of modern temperature control systems. When the electronic equipment works for a long time, the heating condition caused by the long-time operation has great influence on the working life and the working stability of the electronic equipment, and the working temperature of the electronic equipment needs to be adjusted timely and accurately.
Therefore, it is necessary to design an automatic temperature control circuit to solve the above problems.
Disclosure of Invention
The present invention is directed to solving the above problems. Therefore, the invention provides an automatic temperature control circuit which can enable a target to work at a relatively stable temperature through automatic adjustment, so that the circuit can work more stably and has a longer service life.
In order to achieve the purpose, the invention provides the following technical scheme:
an automatic temperature control circuit comprising: the system comprises a micro control unit, a semiconductor refrigerator controller circuit, a digital-to-analog conversion circuit and an analog-to-digital conversion circuit;
the temperature automatic control circuit converts analog temperature into corresponding analog voltage signals by using a temperature sensor in the semiconductor refrigerator, converts the filtered analog voltage signals into digital temperature signals by using an analog-to-digital conversion circuit, the micro control unit compares the temperature value of the digital temperature signals with a set temperature value to generate new digital feedback signals, the digital feedback signals are converted into analog feedback signals by using the digital-to-analog conversion circuit, and the analog feedback signals are input into a semiconductor refrigerator controller circuit after being filtered for controlling the semiconductor refrigerator to automatically adjust the temperature, so that the automatic feedback adjustment of the temperature is realized, and the target can work under a constant temperature condition.
Further, the automatic temperature control circuit is powered by 5V and 3.3V power supplies.
Furthermore, the automatic temperature control circuit selects a high-performance and low-loss embedded microcontroller as a core processor for temperature regulation, so that the automatic temperature control circuit can quickly regulate and control the temperature change of target work with high precision.
The analog-to-digital conversion circuit takes a synchronous sampling analog-to-digital converter as a core, converts the temperature change analog signal subjected to low-pass filtering into a digital signal and inputs the digital signal into the micro control unit.
The digital-to-analog conversion circuit takes a voltage output digital-to-analog converter as a core, converts a digital signal generated by the micro control unit into an analog signal, and outputs the analog signal as a bias input signal and a control signal of the semiconductor refrigerator after low-pass filtering.
The micro control unit uses the thermoelectric cooler controller as a drive of the semiconductor refrigerator, and the voltage output with the precision of 1 percent enables the micro control unit to accurately regulate and control the semiconductor refrigerator so as to ensure the accurate regulation of the temperature of a target working environment. The refrigerator is integrated with a temperature acquisition device, and the working temperature of a target circuit can be monitored in real time so as to quickly respond to the change of the environmental temperature.
The invention has the beneficial effects that:
the automatic temperature control circuit can ensure that the target works in a stable temperature environment, the long service life and the stable working state are ensured, and the temperature regulation has the characteristics of automation, accuracy and quickness.
Drawings
FIG. 1 is a block diagram of the overall structure of an automatic temperature control circuit;
FIG. 2 is a circuit diagram of a micro control unit;
FIG. 3 is a circuit diagram of an analog-to-digital conversion circuit;
FIG. 4 is a circuit diagram of a digital-to-analog conversion circuit;
fig. 5 is a circuit diagram of a semiconductor refrigerator driving module.
Detailed Description
The invention is described in further detail below with reference to the figures and examples,
referring to fig. 1, the present invention relates to an automatic temperature control circuit, which comprises a micro control unit, a semiconductor refrigerator controller, and a digital-to-analog/analog-to-digital conversion circuit, and is used for automatically adjusting a target operating environment temperature to ensure that the target operating environment temperature operates at a relatively constant temperature.
The temperature automatic control circuit obtains the temperature of a working circuit in real time by utilizing a temperature sensor arranged in a semiconductor refrigerator, converts the analog temperature into a corresponding analog voltage signal, converts the analog voltage signal subjected to low-pass filtering into a digital temperature signal through an analog-to-digital conversion circuit, compares the real-time temperature with the set temperature by a micro control unit to generate a new digital signal, converts the signal into an analog signal through a digital-to-analog conversion circuit, inputs the analog signal into a semiconductor refrigerator controller after low-pass filtering, and the semiconductor refrigerator controller is used for controlling the semiconductor refrigerator to automatically adjust the temperature, so that the automatic feedback adjustment of the temperature control circuit is realized, and the target can work under the constant temperature condition.
In one embodiment of the invention, referring to fig. 2, an embedded microcontroller STM32F373 with high performance and low loss is selected as a core processor for temperature regulation, so that the circuit can quickly perform high-precision regulation on temperature conversion of target work. The micro-control unit circuit comprises a microcontroller STM32F373 chip U1200, a transceiver MAX22500E chip U1201, resistors R1200, R1201, R1202, R1204, R1205, R1206, R1207, R1208, R1209, R1210, R1211, R1212, capacitors C1201, C1202, C1203, C1204, C1205, C1206, C1207, C1208, C1209, C1210, C1211, C1212, C1217, C1218 and a crystal oscillator Y1200. In the embodiment, the resistances of the resistors R1200, R1201, R1202, R1204, R1205, R1206, R1207, R1208, R1209, R1210, R1211, and R1212 are respectively 0 Ω, 4.7K Ω, 22 Ω, 8.2 Ω, 22 Ω, 120 Ω, 8.2 Ω, 4.7K Ω, the capacitances of the capacitors C1201, C1202, C1205, C1206, C1209, C1210, C1217, and C1218 are all 0.1uF/10V, the capacitances of the capacitors C1203 and C1204 are all 1uF/10v, the capacitances of C1207 and C1208 are all 0.01uF/10V, and the capacitances of the capacitors C1211 and C1212 are all 20pF.
Referring to fig. 3, the analog-to-digital conversion circuit converts the analog signal of temperature variation after low-pass filtering into a digital signal, and inputs the digital signal to the micro control unit, and includes a synchronous sampling analog-to-digital converter ADS8353 chip U1001, capacitors C1000, C1001, C1002, C1003, C1004, C1005, C1006, C1007, C1008, C1009, resistors R1000, R1001, R1002, R1003, R1004, R1005, R1006, R1007, R1008, R1009, R1010, an inductor L1000, and an OPA320 operational amplifier chip U1000, U1002. The resistances of the resistors R1000, R1001, R1004 and R1005 are all 121 Ω, the resistances of the resistors R1002 and R1003 are all 0.1 Ω, the resistances of the resistors R1006, R1007, R1008 and R1010 are 22 Ω, the resistance of the resistor R1009 is 49.9 Ω, and the inductance L1000 is 220uH.
Taking a chip U1001 as a core, wherein a pin 1 of the chip U1001 is connected with one end of a resistor R1002, the other end of the resistor R1002 is connected with one end of a capacitor C1003, and the other end of the capacitor C1003 is connected with a pin 2 of the chip U1001 and is grounded; a pin 4 of the chip U1001 is connected with one end of a resistor R1003, the other end of the resistor R1003 is connected with one end of a capacitor C1001, and the other end of the capacitor C1004 is connected with a pin 3 of the chip U1001 and is grounded; a pin 5 of the chip U1001 is respectively connected with one end of a resistor R1005 and one end of a capacitor C1005, and the other end of the resistor R1005 is grounded; a pin 6 of the chip U1001 is respectively connected with one end of the resistor R1004 and the other end of the inductor C1005; the other end of the resistor R1004 is respectively connected with pins 1 and 4 of the chip U1002; the 2 pin of the chip U1002 is grounded; a pin 3 of the chip U1002 serves as a signal input end and receives the collected temperature change analog signal, a pin 5 of the chip U1002 is connected with a +5V power supply and one end of a capacitor C1002 respectively, and the other end of the capacitor C1002 is grounded; a pin 7 of the chip U1001 is respectively connected with a 3.3V power supply and one end of a capacitor C1007, and the other end of the capacitor C1007 is grounded; the pin 8 of the chip U1001 is a digital input end and is connected with one end of a resistor R1008, and the other end of the resistor R1008 is connected with a pin 13 of a microcontroller chip U1200; a pin 9 of the chip U1001 is used for inputting chip selection digital signals and is connected with one end of a resistor R1006, and the other end of the resistor R1006 is connected with a pin 14 of the chip U1200; a pin 10 of the chip U1001 is used for inputting a clock signal and is connected with one end of a resistor R1007, and the other end of the resistor R1007 is connected with a pin 11 of the chip U1200; the pin 11 of the chip U1001 is connected with one end of a resistor R1010, and the other end of the resistor R1010 is connected with the pin 12 of the chip U1200 and used for outputting a digital signal; a pin 12 of the chip U1001 is connected with one end of a resistor R1009, and the other end of the resistor R1009 is grounded; a pin 14 of the chip U1001 is respectively connected with a +5V power supply, one end of a capacitor C1006, one end of a capacitor C1008 and one end of an inductor L1000, the other end of the inductor L1000 is respectively connected with the +5V power supply and one end of a capacitor C1009, the other end of the capacitor C1009 and the other end of the capacitor C1008 are grounded, and the other end of the capacitor C1006 is respectively connected with a pin 13 and a pin 17 of the chip U1001 and then grounded; a pin 16 of the chip U1001 is respectively connected with one end of a resistor R1001 and one end of a capacitor C1001, and the other end of the resistor R1001 is grounded; a pin 15 of the chip U1001 is respectively connected with one end of the resistor R1000 and the other end of the capacitor C1001; the other end of the resistor R1000 is respectively connected with pins 1 and 4 of the chip U1000; 2 pins of the chip U1000 are grounded; an external analog quantity signal is input into a pin 3 of the chip U1000 and used for setting the expected temperature of the circuit; the 5 pins of the chip U1000 are respectively connected with a +5V power supply and one end of a capacitor C1000, and the other end of the capacitor C1000 is grounded.
The digital-to-analog conversion circuit converts a digital signal generated by the micro control unit into an analog signal, and the analog signal is output as a control signal of the semiconductor refrigerator after being subjected to low-pass filtering. Referring to fig. 4, the digital-to-analog conversion circuit includes a voltage output digital-to-analog converter DACx0504 chip U1101, resistors R1100, R1103, R1104, R1105, R1106, R1107, R1108, R1109, R1112, R1113, R1114, R1115, R1116, R1117, R1118, R1119, R1120, R1123, capacitors C1102, C1104, C1105, C1107, C1111, C1115, C1119, C1120, C1121, and an inductor L1100. In this embodiment, the resistances of the resistors R1100, R1109, R1120, and R1123 are all 1.8K Ω, the resistances of the resistors R1103, R1104, R1105, R1117, R1118, and R1119 are all 10K Ω, the resistances of the resistors R1106, R1107, R1108, R1112, and R1113 are all 33 Ω, no electronic device is attached to the resistors R1114, R1115, and R1116, and the inductor L1100 is 220uH.
Taking a chip U1101 as a core, wherein a pin 1 of the chip U1101 is respectively connected with a 3.3V reference power supply and one end of a capacitor C1107, and the other end of the capacitor C1107 is grounded; pins 2, 3, 4 and 5 of the chip U1101 are analog signal output pins, wherein the pin 5 of the chip U1101 is used for controlling temperature setting, is connected with one end of a resistor R1100, the other end of the resistor R1100 is used as a signal output end and is connected with one end of a capacitor C1102, and the other end of the capacitor C1102 is grounded; pins 2, 3 and 4 of the chip U1101 are used for outputting analog voltage, pin 2 of the chip U1101 is connected with one end of a resistor R1120, the other end of the resistor R1120 is used as a signal output end and is connected with one end of a capacitor C1115, and the other end of the capacitor C1115 is grounded; a pin 3 of the chip U1101 is connected with one end of a resistor R1123, the other end of the resistor R1123 serves as a signal output end and is connected with one end of a capacitor C1119, and the other end of the capacitor C1119 is grounded; a pin 4 of the chip U1101 is connected with one end of a resistor R1109, one end of the resistor R1109 serves as a signal output end and is connected with one end of a capacitor C1111, and the other end of the capacitor C1111 is grounded; pins 6 and 17 of the chip U1101 are connected and then grounded; a pin 7 of the chip U1101 is respectively connected with a +5V power supply, one end of a capacitor C1105, one end of a capacitor C1120 and one end of an inductor L1120, the other end of the capacitor C1105 and the other end of the capacitor C1120 are grounded, the other end of the inductor L1100 is respectively connected with a 5V power supply and one end of a capacitor C1121, and the other end of the capacitor C1121 is grounded; the 8 pins of the chip U1101 are connected with one end of a resistor R1116 and one end of a resistor R1117 respectively, the 9 pins of the chip U1101 are connected with one end of a resistor R1114 and one end of a resistor R1119 respectively, the 10 pins of the chip U1101 are connected with one end of a resistor R1115 and one end of a resistor R1118 respectively, the other ends of the resistor R1117, the R1118 and the R1119 are grounded, and the other ends of the resistor R1114, the R1115 and the R1116 are connected and then connected with a 3.3V power supply; the 11 pins of the chip U1101 are respectively connected with one end of a resistor R1113 and one end of a resistor R1105, and the other end of the resistor R1113 is connected with the 35 pins of the chip U1200; a pin 12 of the chip U1101 is respectively connected with one end of a resistor R1112 and one end of a resistor R1104, and the other end of the resistor R1112 is connected with a pin 32 of the chip U1200; a pin 15 of the chip U1101 is respectively connected with one end of a resistor R1108 and one end of a resistor R1103, and the other end of the R1108 is connected with a pin 30 of the chip U1200; the other end of the resistor R1103, the other end of the resistor R1104 and the other end of the resistor R1105 are connected and then connected with a 3.3V power supply; a pin 13 of the chip U1101 is connected with one end of a resistor R1106, and the other end of the resistor R1106 is connected with a pin 29 of the chip U1200; a pin 14 of the chip U1101 is connected with one end of a resistor R1107, and the other end of the resistor R1107 is connected with a pin 31 of the chip U1200; the 16 pins of the chip U1101 are respectively connected with a 3.3V power supply and one end of a capacitor C1104, and the other end of the capacitor C1104 is grounded.
In this embodiment, the thermoelectric cooler controller LTM4663 is used as a semiconductor cooler controller, and its voltage output with 1% precision makes it possible to accurately regulate and control a semiconductor cooler, so as to ensure accurate regulation of a target working environment temperature. Referring to fig. 5, the semiconductor refrigerator controller circuit comprises a thermoelectric cooler controller LTM4663 chip U900, resistors R900, R901, R902, R903, R904, R905, R906, R907, R908, RX900, RFB900, RCB900, capacitors C900, C901, C902, C903, C904, C905, and C906, wherein the resistors R900, R901, R902, R903, R904, R905, R906, R907, R908, RX900, RFB900, and RCB900 have resistances of 17.4K Ω, 0 Ω, 10K Ω, 0 Ω, 1.87M Ω, 165K Ω, 1.87M Ω, 0 Ω, 7.5K Ω, and 100K Ω, the capacitors C900, C901, C904, and C906 have capacitance values of 10uF/10v, 902, C903, R905 have capacitance values of 0.01uF/10V, 10nF/10V, and 10.5 uF/10V, respectively.
The A1 pin of the chip U900 is respectively connected with the ground and one end of a resistor R908, and the other end of the resistor R908 is grounded; a2 pin and a B2 pin of the chip U900 are connected and then connected with one end of a resistor R903, the other end of the resistor R903 is connected with one end of a capacitor C903, and the other end of the capacitor C903 is grounded; pins A3, B3, D2 and E2 of the chip U900 are connected and then respectively connected with a 5V power supply and one end of a capacitor C900, and the other end of the capacitor C900 is grounded; pins A4 and B4 of the chip U900 are voltage output pins, the pins A4 and B4 are connected and then respectively connected with a driving anode of the semiconductor refrigerator and one end of a capacitor C906, and the other end of the capacitor C906 is grounded; pins A5 and B5 of the chip U900 are grounded; the pins B1 and C1 of the chip U900 are connected and then respectively connected with a driving cathode of the semiconductor refrigerator and one end of a capacitor C901, and the other end of the capacitor C901 is grounded; a C4 pin of a chip U900 is respectively connected with one end of a resistor R900, one end of a resistor RX900 and one end of a resistor RFB900, the other end of the resistor R900 is connected with an E1 pin of the chip U900, the other end of the resistor RX900 is connected with a temperature acquisition positive electrode of a semiconductor refrigerator, a temperature acquisition negative electrode of the semiconductor refrigerator is grounded, the other end of the resistor RFB900 is respectively connected with a C5 pin of the chip U900, one end of a resistor R904, one end of a resistor R905 and one end of a capacitor C904, the other end of the resistor R904 outputs a digital signal for controlling temperature change, the other end of the capacitor C904 is connected with one end of a resistor R906, the other end of the resistor R906 is respectively connected with the other end of a resistor R905, one end of a capacitor C902, one end of a capacitor C905 and the D4 pin of the chip U900, the other end of the capacitor C905 is connected with one end of the resistor R907, the other end of the resistor R907 is connected with the other end of the capacitor C902 and then connected with a D3 pin of the chip U900; a pin E3 of the chip U900 is connected with one end of the resistor RCB900, and the other end of the resistor RCB900 is connected with a pin D1 of the chip U900 and then grounded; the E5 pin of the chip U900 is respectively connected with one end of a resistor R902 and one end of a resistor R901, the other end of the resistor R902 is grounded, and the other end of the resistor R901 is used for inputting digital signals and controlling temperature setting; the pins C2, C3, D5, E4 of the chip U900 are suspended.
In conclusion, the temperature control device can accurately control the temperature of the target, thereby ensuring the stability of the working environment of the target and prolonging the service life of the target.
While the invention has been described in connection with specific embodiments thereof, it is not intended that such description be construed as limiting the scope of the invention, which is defined by the appended claims, as any modification thereto will fall within the scope of the invention.
Claims (6)
1. An automatic temperature control circuit, comprising: the system comprises a micro control unit, a semiconductor refrigerator controller circuit, a digital-to-analog conversion circuit and an analog-to-digital conversion circuit;
the temperature automatic control circuit converts analog temperature into corresponding analog voltage signals by using a temperature sensor in the semiconductor refrigerator, converts the filtered analog voltage signals into digital temperature signals by using an analog-to-digital conversion circuit, the micro control unit compares the temperature value of the digital temperature signals with a set temperature value to generate new digital feedback signals, the digital feedback signals are converted into analog feedback signals by using the digital-to-analog conversion circuit, and the analog feedback signals are input into a semiconductor refrigerator controller circuit after being filtered for controlling the semiconductor refrigerator to automatically adjust the temperature, so that the automatic feedback adjustment of the temperature is realized, and the target can work under a constant temperature condition.
2. The automatic temperature control circuit of claim 1, wherein the automatic temperature control circuit is powered by a 5V and 3.3V power supply.
3. The automatic temperature control circuit of claim 1, wherein the analog-to-digital conversion circuit converts the analog signal of temperature variation after low-pass filtering into a digital signal and inputs the digital signal to the micro control unit, and the analog-to-digital conversion circuit comprises a synchronous sampling analog-to-digital converter ADS8353 chip U1001, capacitors C1000, C1001, C1002, C1003, C1004, C1005, C1006, C1007, C1008, C1009, resistors R1000, R1001, R1002, R1003, R1004, R1005, R1006, R1007, R1008, R1009, R1010, inductor L1000, OPA320 operational amplifier chips U1000, U1002;
taking a chip U1001 as a core, wherein a pin 1 of the chip U1001 is connected with one end of a resistor R1002, the other end of the resistor R1002 is connected with one end of a capacitor C1003, and the other end of the capacitor C1003 is connected with a pin 2 of the chip U1001 and is grounded; the pin 4 of the chip U1001 is connected with one end of a resistor R1003, the other end of the resistor R1003 is connected with one end of a capacitor C1001, and the other end of the capacitor C1004 is connected with the pin 3 of the chip U1001 and is grounded; a pin 5 of the chip U1001 is respectively connected with one end of a resistor R1005 and one end of a capacitor C1005, and the other end of the resistor R1005 is grounded; a pin 6 of the chip U1001 is respectively connected with one end of the resistor R1004 and the other end of the inductor C1005; the other end of the resistor R1004 is connected with pins 1 and 4 of the chip U1002 respectively; the 2 pin of the chip U1002 is grounded; a pin 3 of the chip U1002 serves as a signal input end and receives the collected temperature change analog signal, a pin 5 of the chip U1002 is connected with a +5V power supply and one end of a capacitor C1002 respectively, and the other end of the capacitor C1002 is grounded; a pin 7 of the chip U1001 is respectively connected with a 3.3V power supply and one end of a capacitor C1007, and the other end of the capacitor C1007 is grounded; the pin 8 of the chip U1001 is a digital input end and is connected with one end of a resistor R1008, and the other end of the resistor R1008 is connected with a pin 13 of a microcontroller chip U1200; a pin 9 of the chip U1001 is used for inputting chip selection digital signals and is connected with one end of a resistor R1006, and the other end of the resistor R1006 is connected with a pin 14 of the chip U1200; a pin 10 of the chip U1001 is used for inputting a clock signal and is connected with one end of a resistor R1007, and the other end of the resistor R1007 is connected with a pin 11 of the chip U1200; the pin 11 of the chip U1001 is connected with one end of a resistor R1010, and the other end of the resistor R1010 is connected with the pin 12 of the chip U1200 and used for outputting a digital signal; a pin 12 of the chip U1001 is connected with one end of a resistor R1009, and the other end of the resistor R1009 is grounded; a 14 pin of the chip U1001 is respectively connected with a +5V power supply, one end of a capacitor C1006, one end of a capacitor C1008 and one end of an inductor L1000, the other end of the inductor L1000 is respectively connected with the +5V power supply and one end of a capacitor C1009, the other end of the capacitor C1009 and the other end of the capacitor C1008 are grounded, and the other end of the capacitor C1006 is respectively connected with a 13 pin and a 17 pin of the chip U1001 and then grounded; a pin 16 of the chip U1001 is respectively connected with one end of a resistor R1001 and one end of a capacitor C1001, and the other end of the resistor R1001 is grounded; a pin 15 of the chip U1001 is connected with one end of the resistor R1000 and the other end of the capacitor C1001 respectively; the other end of the resistor R1000 is respectively connected with pins 1 and 4 of the chip U1000; the 2 pin of the chip U1000 is grounded; an external analog signal is input to a pin 3 of the chip U1000 and used for setting a target temperature of a circuit, a pin 5 of the chip U1000 is connected with a +5V power supply and one end of a capacitor C1000 respectively, and the other end of the capacitor C1000 is grounded.
4. The automatic temperature control circuit of claim 1, wherein the digital-to-analog converter circuit converts the digital signal generated by the micro-control unit into an analog signal, and the analog signal is low-pass filtered and then used as an input of the semiconductor refrigerator controller circuit; (ii) a The digital-to-analog conversion circuit comprises a voltage output digital-to-analog converter DACx0504 chip U1101, resistors R1100, R1103, R1104, R1105, R1106, R1107, R1108, R1109, R1112, R1113, R1114, R1115, R1116, R1117, R1118, R1119, R1120, R1123, capacitors C1102, C1104, C1105, C1107, C1111, C1115, C1119, C1120, C1121 and an inductor L1100;
taking a chip U1101 as a core, wherein a pin 1 of the chip U1101 is respectively connected with a 3.3V reference power supply and one end of a capacitor C1107, and the other end of the capacitor C1107 is grounded; a pin 5 of the chip U1101 is used for controlling temperature setting, is connected with one end of a resistor R1100, the other end of the resistor R1100 is used as a signal output end and is connected with one end of a capacitor C1102, and the other end of the capacitor C1102 is grounded; pins 2, 3 and 4 of the chip U1101 are used for outputting analog voltage, wherein pin 2 of the chip U1101 is connected with one end of a resistor R1120, the other end of the resistor R1120 is used as a signal output end and is connected with one end of a capacitor C1115, and the other end of the capacitor C1115 is grounded; a pin 3 of the chip U1101 is connected with one end of a resistor R1123, the other end of the resistor R1123 serves as a signal output end and is connected with one end of a capacitor C1119, and the other end of the capacitor C1119 is grounded; a pin 4 of the chip U1101 is connected with one end of a resistor R1109, one end of the resistor R1109 serves as a signal output end and is connected with one end of a capacitor C1111, and the other end of the capacitor C1111 is grounded; pins 6 and 17 of the chip U1101 are connected and then grounded; a pin 7 of the chip U1101 is connected to a +5V power supply, one end of a capacitor C1105, one end of a capacitor C1120, and one end of an inductor L1120 respectively, the other end of the capacitor C1105 and the other end of the capacitor C1120 are grounded, the other end of the inductor L1100 is connected to a 5V power supply and one end of a capacitor C1121 respectively, and the other end of the capacitor C1121 is grounded; the 8 pins of the chip U1101 are respectively connected with one end of a resistor R1116 and one end of a resistor R1117, the 9 pins of the chip U1101 are respectively connected with one end of a resistor R1114 and one end of a resistor R1119, the 10 pins of the chip U1101 are respectively connected with one end of a resistor R1115 and one end of a resistor R1118, the other ends of the resistor R1117, the R1118 and the R1119 are grounded, and the other end of the resistor R1114, the other end of the resistor R1115 and the other end of the resistor R1116 are connected and then connected with a 3.3V power supply; the 11 pins of the chip U1101 are respectively connected with one end of a resistor R1113 and one end of a resistor R1105, and the other end of the resistor R1113 is connected with the 35 pins of the chip U1200; a pin 12 of the chip U1101 is respectively connected with one end of a resistor R1112 and one end of a resistor R1104, and the other end of the resistor R1112 is connected with a pin 32 of the chip U1200; a pin 15 of the chip U1101 is respectively connected with one end of a resistor R1108 and one end of a resistor R1103, and the other end of the resistor R1108 is connected with a pin 30 of the chip U1200; the other end of the resistor R1103, the other end of the resistor R1104 and the other end of the resistor R1105 are connected and then connected with a 3.3V power supply; a pin 13 of the chip U1101 is connected with one end of a resistor R1106, and the other end of the resistor R1106 is connected with a pin 29 of the chip U1200; a pin 14 of the chip U1101 is connected with one end of a resistor R1107, and the other end of the resistor R1107 is connected with a pin 31 of the chip U1200; the 16 pins of the chip U1101 are respectively connected with a 3.3V power supply and one end of a capacitor C1104, and the other end of the capacitor C1104 is grounded.
5. The automatic temperature control circuit of claim 1, wherein the semiconductor chiller controller circuit comprises a thermoelectric cooler controller LTM4663 chip U900, resistors R900, R901, R902, R903, R904, R905, R906, R907, R908, RX900, RFB900, RCB900, capacitors C900, C901, C902, C903, C904, C905, C906;
the A1 pin of the chip U900 is respectively connected with the ground and one end of a resistor R908, and the other end of the resistor R908 is grounded; pins A2 and B2 of the chip U900 are connected and then connected with one end of a resistor R903, the other end of the resistor R903 is connected with one end of a capacitor C903, and the other end of the capacitor C903 is grounded; pins A3, B3, D2 and E2 of the chip U900 are connected and then respectively connected with a 5V power supply and one end of a capacitor C900, and the other end of the capacitor C900 is grounded; pins A4 and B4 of the chip U900 are voltage output pins, the pins A4 and B4 are connected and then respectively connected with a driving anode of the semiconductor refrigerator and one end of a capacitor C906, and the other end of the capacitor C906 is grounded; pins A5 and B5 of the chip U900 are grounded; pins B1 and C1 of the chip U900 are connected and then respectively connected with a driving cathode of the semiconductor refrigerator and one end of a capacitor C901, and the other end of the capacitor C901 is grounded; the C4 pin of the chip U900 is respectively connected with one end of a resistor R900, one end of a resistor RX900 and one end of a resistor RFB900, the other end of the resistor R900 is connected with the E1 pin of the chip U900, the other end of the resistor RX900 is connected with the temperature acquisition anode of the semiconductor refrigerator, the temperature acquisition cathode of the semiconductor refrigerator is grounded, the other end of the resistor RFB900 is respectively connected with the C5 pin of the chip U900, one end of a resistor R904, one end of a resistor R905 and one end of a capacitor C904, the other end of the resistor R904 outputs a digital signal for controlling temperature change, the other end of the capacitor C904 is connected with one end of a resistor R906, the other end of the resistor R906 is respectively connected with the other end of the resistor R905, one end of a capacitor C902, one end of a capacitor C905 and one end of a capacitor R907, the other end of the resistor R907 is connected with the other end of the capacitor C and then connected with the D3 pin of the chip U902; a pin E3 of the chip U900 is connected with one end of the resistor RCB900, and the other end of the resistor RCB900 is connected with a pin D1 of the chip U900 and then grounded; the E5 pin of the chip U900 is respectively connected with one end of a resistor R902 and one end of a resistor R901, the other end of the resistor R902 is grounded, and the other end of the resistor R901 is used for inputting digital signals and controlling temperature setting; the pins C2, C3, D5 and E4 of the chip U900 are suspended.
6. The automatic temperature control circuit of claim 1, wherein the micro-control unit comprises a microcontroller STM32F373 chip U1200, a transceiver MAX22500E chip U1201, resistors R1200, R1201, R1202, R1204, R1205, R1206, R1207, R1208, R1209, R1210, R1211, R1212, capacitors C1201, C1202, C1203, C1204, C1205, C1206, C1207, C1208, C1209, C1210, C1211, C1212, C1217, C1218, a crystal oscillator Y1200;
pins 1, 17 and 48 of the chip U1200 are connected and then respectively connected with one end of a capacitor C1201, one end of a capacitor C1205, one end of a capacitor C1209 and a 3.3V power supply, the other end of the capacitor C1201, the other end of the capacitor C1205 and a pin 47 of the chip U1200 are connected and grounded, and the other end of the capacitor C1209 is grounded; pins 3 and 4 of the chip U1200 are used for signal output and are respectively connected with pins 4 and 3 of the chip U1201; the 5 pins of the chip U1200 are respectively connected with one end of a capacitor C1211 and the 3 pins of the crystal oscillator Y1200, the 6 pins of the chip U1200 are respectively connected with one end of a capacitor C1212 and the 1 pin of the crystal oscillator Y1200, the other ends of the capacitor C1211 and the C1212 are grounded, the 1 pin and the 3 pins of the crystal oscillator Y1200 are used for providing clock signals for the chip, and the 2 pins and the 4 pins of the crystal oscillator Y1200 are grounded; a pin 7 of the chip U1200 is used as an asynchronous reset pin and is respectively connected with an asynchronous reset signal and one end of a capacitor C1210, and the other end of the capacitor C1210 is grounded; the 8 pins of the chip U1200 are respectively connected with one end of the capacitor C1202 and one end of the C1206 and then grounded, and the other end of the capacitor C1202, the other end of the C1206, the 3.3V power supply and the 9 pins of the chip U1200 are connected; pins 11, 12, 13 and 14 of the chip U1200 are used for signal transmission with the analog-to-digital conversion circuit; pins 18, 19, 21 and 22 of the chip U1200 are respectively connected to resistors R1207, R1206, R1205 and R1204, and are configured to receive the amplified temperature change analog signal and the preset temperature analog signal; the 23 pins of the chip U1200 are respectively connected with one end of a capacitor C1203, one end of a capacitor C1204, one end of a capacitor C1207 and one end of a capacitor C1208 and then grounded, the other end of the capacitor C1203, the other end of the capacitor C1207, a 3.3V power supply and the 24 pins of the chip U1200 are connected, and the other end of the capacitor C1204, the other end of the capacitor C1208, the 3.3V power supply and the 25 pins of the chip U1200 are connected; pins 26 and 27 of the chip U1200 are SPI2 communication serial ports; pins 29, 30, 31, 32 and 35 of the chip U1200 are used for signal transmission with the digital-to-analog conversion circuit; pins 34, 38, 39 and 40 of the chip U1200 are SPI1 communication serial ports; a pin 36 of the chip U1200 is connected with one end of a resistor R1202, and the other end of the resistor R1202 is used for outputting an enable signal; pins 37, 42 and 43 of the chip U1200 are I2C communication serial ports, wherein the pin 42 of the chip U1200 is connected to the pin 5 of the chip U1201, and the pin 43 of the chip U1200 is connected to the pin 2 of the chip U1201 through a resistor R1209; a 44 pin of the chip U1200 is respectively connected with one end of the resistor R1200, one end of the resistor R1201 and an external input signal, the other end of the resistor R1201 is grounded, and the other end of the resistor R1200 is connected with a 3.3V power supply; a 44 pin of the chip U1200 is connected with an external input signal and used for selecting a starting mode, when the input signal is in a low level, the on-chip program memory is selected as a starting space, and when the input signal is in a high level, the on-chip bootstrap program is selected as the starting space; pins 2, 10, 15, 16, 20, 28, 33, 41, 45 and 46 of the chip U1200 are suspended; a pin 1 of the chip U1201 is respectively connected with a 3.3V power supply and one end of a capacitor C1217, and the other end of the capacitor C1217 is grounded; a pin 6 of the chip U1201 is connected with one end of a resistor R1212, and the other end of the resistor R1212 is grounded; pins 7 and 11 of the chip U1201 are connected and then grounded; a pin 10 of the chip U1201 is respectively connected with a 5V power supply and one end of a capacitor C1218, and the other end of the capacitor C1218 is grounded; the pin 8 and the pin 9 of the chip U1201 are used for pre-phase selection control input, the pin 8 of the chip U1201 is respectively connected with one end of a resistor R1210 and one end of a resistor R1211, the pin 9 of the chip U1201 is respectively connected with one end of a resistor R1208 and the other end of the resistor R1210, and the other end of the resistor R1208 and the other end of the resistor R1211 are used for signal transmission.
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