CN115528079A - Display module, manufacturing method thereof and display device - Google Patents
Display module, manufacturing method thereof and display device Download PDFInfo
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- CN115528079A CN115528079A CN202211197824.3A CN202211197824A CN115528079A CN 115528079 A CN115528079 A CN 115528079A CN 202211197824 A CN202211197824 A CN 202211197824A CN 115528079 A CN115528079 A CN 115528079A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 211
- 239000000463 material Substances 0.000 claims abstract description 133
- 239000003292 glue Substances 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims description 54
- 230000003139 buffering effect Effects 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- 230000001681 protective effect Effects 0.000 claims description 10
- 239000012945 sealing adhesive Substances 0.000 claims description 10
- 230000000903 blocking effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 26
- 239000000853 adhesive Substances 0.000 description 33
- 230000001070 adhesive effect Effects 0.000 description 33
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- 239000006260 foam Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
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Abstract
A display module, a manufacturing method thereof and a display device belong to the technical field of display. This display module assembly includes: display panel, heat dissipation layer and fingerprint module, this heat dissipation layer are located this display panel's non-light emitting area, and this heat dissipation layer includes the fingerprint trompil, and this fingerprint module is located this fingerprint trompil, and this fingerprint module glues the material through the shading and attaches on this display panel's non-light emitting area, and the width in the first clearance between material and this heat dissipation layer is glued in this shading is less than predetermineeing the width, and the width direction in this first clearance is parallel with this display panel's non-light emitting area. This application can improve this display module assembly's display effect.
Description
Technical Field
The present disclosure relates to display technologies, and in particular, to a display module, a manufacturing method thereof, and a display device.
Background
With the development of Organic Light-Emitting Diode (OLED) display technology, a fingerprint recognition function can be integrated in a display module. The integrated display module group that has the fingerprint identification function includes display panel and sets up the fingerprint module on display panel's non-light emitting area.
In the related art, an ultra clean film (SCF) is attached to a non-light emitting surface of a display panel, and the SCF includes fingerprint openings in which fingerprint modules are disposed and attached to the non-light emitting surface of the display panel by a Pressure Sensitive Adhesive (PSA). In the process of attaching the fingerprint module, a roller is used for applying an attaching pressure to the pressure sensitive adhesive. To avoid the roller pressing against the SCF, the fingerprint apertures need to be set large enough so that there is a large gap between the PSA and SCF. However, the gap easily affects the display effect of the display module.
Disclosure of Invention
The application provides a display module assembly and manufacturing method, display device thereof can improve the display effect of this display module assembly, and the technical scheme of this application as follows:
in a first aspect, a display module is provided, the display module includes: the display panel, the heat dissipation layer and the fingerprint module; the heat dissipation layer is located on display panel's the non-light emitting area, the heat dissipation layer includes the fingerprint trompil, fingerprint module is located in the fingerprint trompil, fingerprint module glues the material through the shading and attaches in on display panel's the non-light emitting area, the shading glue the material with the width in first clearance between the heat dissipation layer is less than predetermines the width, the width direction in first clearance with display panel's non-light emitting area is parallel. Optionally, the heat dissipation layer includes a first buffer sublayer and a heat dissipation sublayer, and the first buffer sublayer and the heat dissipation sublayer are sequentially distributed along a direction away from the display panel; the material of the heat dissipation sublayer is a shading material, the orthographic projection of the heat dissipation sublayer on the display panel covers the orthographic projection of the first buffering sublayer on the display panel, and the first gap is a gap between the shading rubber material and the first buffering sublayer.
Optionally, an orthographic projection of the heat dissipation sublayer on the display panel coincides with an orthographic projection of the first buffer sublayer on the display panel; or,
the area of the orthographic projection of the heat dissipation sublayer on the display panel is larger than that of the first buffering sublayer on the display panel, and the orthographic projection of the heat dissipation sublayer on the display panel covers the orthographic projection of the first gap on the display panel.
Optionally, the heat dissipation layer further includes a second buffer sublayer, the second buffer sublayer is located between the first buffer sublayer and the heat dissipation sublayer, and an orthographic projection of the second buffer sublayer on the display panel coincides with an orthographic projection of the heat dissipation sublayer on the display panel.
Optionally, the display module assembly further comprises an edge sealing rubber material, and the edge sealing rubber material is distributed around the fingerprint module.
In a second aspect, a method for manufacturing a display module is provided, the method including:
forming a display panel and a fingerprint module;
forming a heat dissipation layer on a non-light emitting surface of the display panel, the heat dissipation layer including fingerprint openings;
will fingerprint module sets up in the fingerprint trompil, make fingerprint module glues the material through the shading and attaches on the non-light emitting area, wherein, the shading glue the material with the width in first clearance between the heat dissipation layer is less than predetermineeing the width, the width direction in first clearance with display panel's non-light emitting area is parallel. Optionally, the heat dissipation layer includes a first buffer sublayer and a heat dissipation sublayer, and the first buffer sublayer and the heat dissipation sublayer are sequentially distributed along a direction away from the display panel; the material of the heat dissipation sublayer is a shading material, the orthographic projection of the heat dissipation sublayer on the display panel covers the orthographic projection of the first buffer sublayer on the display panel, and the first gap is a gap between the shading rubber material and the first buffer sublayer.
Optionally, an orthographic projection of the heat dissipation sublayer on the display panel coincides with an orthographic projection of the first buffer sublayer on the display panel; or,
the area of the orthographic projection of the heat dissipation sublayer on the display panel is larger than that of the orthographic projection of the first buffer sublayer on the display panel, and the orthographic projection of the heat dissipation sublayer on the display panel covers the orthographic projection of the first gap on the display panel.
Optionally, the heat dissipation layer further includes a second buffer sublayer, the second buffer sublayer is located between the first buffer sublayer and the heat dissipation sublayer, and an orthographic projection of the second buffer sublayer on the display panel coincides with an orthographic projection of the heat dissipation sublayer on the display panel.
Optionally, will fingerprint module sets up in the fingerprint trompil, make fingerprint module passes through the shading and glues the material attached on the non-light emitting area, include:
forming the shading rubber material in a target area of the non-light-emitting surface, wherein the target area is a corresponding area of the fingerprint opening hole on the non-light-emitting surface;
attaching the fingerprint module on the shading rubber material.
Optionally, the forming the light-shielding rubber material in the target area of the non-light-emitting surface includes:
forming a rubber material structure in the target area, wherein the rubber material structure comprises the shading rubber material and a rubber material protective film, the shading rubber material is attached to the target area, and one surface of the rubber material protective film, which is far away from the display panel, is flush with one surface of the heat dissipation layer, which is far away from the display panel;
forming a heavy release film on one side of the heat dissipation layer far away from the display panel;
and stripping the rubber material protective film through the heavy release film.
Optionally, before forming the heat dissipation layer on the non-light emitting surface of the display panel, the method further includes: forming the shading rubber material in a target area of the non-luminous surface;
forming a heat dissipation layer on a non-light emitting surface of the display panel, including: forming the heat dissipation layer on the non-luminous surface to enable the shading rubber material to be located in the fingerprint opening;
said disposing said fingerprint module in said fingerprint opening, comprising: attaching the fingerprint module on the shading rubber material.
Optionally, the forming the heat dissipation layer on the non-light emitting surface includes:
forming the heat dissipation layer and a compensation layer on a first substrate, wherein the adhesion force between the compensation layer and the first substrate is larger than that between the heat dissipation layer and the first substrate;
the first substrate and the display panel are oppositely arranged, so that the heat dissipation layer is bonded with the non-light-emitting surface of the display panel, the bonding force between the heat dissipation layer and the non-light-emitting surface is larger than that between the heat dissipation layer and the first substrate, the shading rubber material on the non-light-emitting surface is positioned in the fingerprint opening, and the shading rubber material is in contact with the compensation layer;
and stripping the first substrate and the compensation layer.
Optionally, the forming the heat dissipation layer and the compensation layer on the first substrate includes:
forming a compensation layer on the first substrate;
forming the heat dissipation layer on a second substrate;
arranging the second substrate opposite to the first substrate, so that the compensation layer is positioned in the fingerprint opening and is not in contact with the second substrate;
and peeling off the second substrate to enable the compensation layer and the heat dissipation layer to remain on the first substrate.
In a third aspect, a display device is provided, where the display device includes the display module according to the first aspect or any one of the optional implementation manners of the first aspect.
The beneficial effect that technical scheme that this application provided brought is:
the application provides a display module assembly and manufacturing method, display device thereof, display module assembly includes display panel, heat dissipation layer and fingerprint module, this heat dissipation layer is located this display panel's non-light emitting area, this heat dissipation layer includes the fingerprint trompil, this fingerprint module is located this fingerprint trompil, this fingerprint module glues the material through the shading and attaches on this display panel's non-light emitting area, the width in the first clearance between material and this heat dissipation layer is glued to this shading is less than and predetermines the width, the width direction in this first clearance with display panel's non-light emitting area is parallel. Because the width in the first clearance between this shading glue material and this heat dissipation layer is less, so this first clearance is less to the influence of this display module assembly's display effect to this application can improve this display module assembly's display effect.
For example, when a gap exists between the light-shielding adhesive material and the heat dissipation layer, ambient light may be irradiated onto the display panel through the gap, when a full black picture is displayed on the display panel, under the influence of the ambient light, the luminance of a corresponding area of the gap on the display panel is greater than the luminance of other display areas of the display panel, and a color difference exists between the corresponding area of the gap on the display panel and the display pictures of the other display areas of the display panel, resulting in poor quality of the full black picture. The larger the width of the gap is, the larger the gap has an influence on the display effect of the display panel. In this application, the width in the first clearance between material and the heat dissipation layer is less to the shading, and consequently this first clearance is less in the region that corresponds on display panel, and this first clearance is less to display panel's display effect's influence, can improve this display panel's display effect to improve display module assembly's display effect, for example, make this display panel's the quality of total black picture better.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a cross-sectional view of a display module according to an embodiment of the present disclosure;
FIG. 2 is a cross-sectional view of another display module according to an embodiment of the present disclosure;
fig. 3 is a flowchart of a method for manufacturing a display module according to an embodiment of the present disclosure;
fig. 4 is a rear view of a display panel with a heat dissipation layer formed thereon according to an embodiment of the present disclosure;
FIG. 5 is a cross-sectional view taken at the location M-M of FIG. 4;
fig. 6 is a cross-sectional view of a display panel provided in an embodiment of the present disclosure after a heat dissipation layer and a light shielding adhesive are formed on a non-display surface of the display panel;
fig. 7 is a cross-sectional view of a display panel provided in an embodiment of the present application after a light-shielding adhesive is formed on a non-display surface of the display panel;
FIG. 8 is a cross-sectional view of a compensation layer formed on a first substrate according to an embodiment of the present disclosure;
FIG. 9 is a cross-sectional view of a second substrate with a heat spreader layer formed thereon according to an embodiment of the present disclosure;
FIG. 10 is a cross-sectional view of a first substrate and a second substrate positioned relative to each other according to an embodiment of the present disclosure;
FIG. 11 is a cross-sectional view of the second substrate of FIG. 10 after being peeled away according to an embodiment of the present application;
fig. 12 is a cross-sectional view of a display panel provided with a light-shielding adhesive and a heat dissipation layer, wherein the first substrate provided with a compensation layer is disposed opposite to the display panel;
fig. 13 is a cross-sectional view of a display panel provided in an embodiment of the present application after a light-shielding adhesive is formed on a non-light-emitting surface of the display panel;
fig. 14 is a cross-sectional view of a light-shielding adhesive material with a fingerprint module attached thereon according to an embodiment of the present disclosure;
fig. 15 is a cross-sectional view of a display panel provided in an embodiment of the present application after forming a glue structure on a non-light-emitting surface of the display panel;
fig. 16 is a cross-sectional view of a heat dissipation layer after a heavy release film is formed thereon according to an embodiment of the present disclosure;
fig. 17 is a cross-sectional view of another fingerprint module attached to a light-shielding adhesive material according to an embodiment of the present application.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and, together with the description, serve to explain the principles of the application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
Along with the development of display technology, can integrate the fingerprint identification function in the display module assembly. The display module integrated with the fingerprint identification function comprises a display panel and a fingerprint module arranged on a non-light-emitting surface of the display panel. The display panel may be an OLED display panel, which is widely used in various industries due to its characteristics of being light and thin, low in power consumption, high in light emitting efficiency, and the like. The fingerprint module can be ultrasonic fingerprint module, and ultrasonic fingerprint module is the fingerprint module based on ultrasonic fingerprint identification technology development, and ultrasonic fingerprint identification technology has extremely strong adaptive capacity as the third generation fingerprint identification technology, receives advantages such as dirty, the influence that water stain is less, good discernment rate of finger.
In the integrated display module assembly that has the fingerprint identification function, display panel's non-light emitting face is attached to have the SCF, and this SCF includes the fingerprint trompil, and fingerprint module sets up in this fingerprint trompil, and through PSA attached on display panel's non-light emitting face. As an example, when attaching the fingerprint module on the non-light emitting surface of the display panel, first, the PSA is attached on the area located in the fingerprint opening on the non-light emitting surface of the display panel, and then the fingerprint module is attached on the PSA. In the process of attaching the PSA to the non-light-emitting surface of the display panel, rollers are required to apply an attaching force to the PSA, and in order to avoid pressing the rollers onto the SCF to cause SCF indentation and stamping, the fingerprint opening needs to be set large enough to ensure a large gap between the PSA and the SCF. However, the gap between the PSA and the SCF is large, which affects not only the overall strength of the display module, but also the display effect of the display module. For example, when the display panel displays a full black picture, the display panel may be illuminated with ambient light through the gap, and when the display panel displays the full black picture, the gap has a luminance in a corresponding area on the display panel that is greater than luminance in other display areas of the display panel, and the gap has a color difference between the corresponding area on the display panel and the other display areas of the display panel, resulting in poor quality of the full black picture.
In order to avoid the influence of the gap between the PSA and the SCF on the display effect of the display module, in the related art, a light-shielding tape may be attached to a side of the SCF away from the display panel, and the orthographic projection of the light-shielding tape on the display panel may cover the orthographic projection of the fingerprint opening on the display panel on the SCF. However, the increase of the light-shielding tape increases the manufacturing process of the display module, and the light-shielding tape also needs to consider the avoidance requirement of the whole device.
The embodiment of the application provides a display module, a manufacturing method of the display module and a display device. This display module assembly includes display panel, heat dissipation layer and fingerprint module, and this heat dissipation layer is located this display panel's non-light emitting area, and this heat dissipation layer includes the fingerprint trompil, and this fingerprint module is located this fingerprint trompil, and this fingerprint module glues the material through the shading and attaches on this display panel's non-light emitting area, and the width in the first clearance between material and this heat dissipation layer is glued in this shading is less than predetermineeing the width, the width direction in this first clearance with display panel's non-light emitting area is parallel. Because the width in the first clearance between this shading glue material and this heat dissipation layer is less, so this first clearance is less to the influence of this display module assembly's display effect to this application can improve this display module assembly's display effect.
For example, when a gap exists between the light-shielding adhesive material and the heat dissipation layer, ambient light may be irradiated onto the display panel through the gap, when the display panel displays a full black picture, the luminance of the gap in a corresponding area on the display panel is higher than the luminance of other display areas of the display panel under the influence of the ambient light, and the display picture of the gap in the corresponding area on the display panel and the other display areas of the display panel has a color difference, resulting in poor quality of the full black picture. The larger the width of the gap is, the larger the gap has an influence on the display effect of the display panel. In this application, the width in the first clearance between material and the heat dissipation layer is less to the shading, and consequently this first clearance is less in the region that corresponds on display panel, and this first clearance is less to display panel's display effect's influence, can improve this display panel's display effect to improve display module assembly's display effect, for example, make this display panel's the quality of total black picture better.
The following describes a technical solution of the present application, and first describes an embodiment of a display module of the present application.
Please refer to fig. 1, which illustrates a cross-sectional view of a display module according to an embodiment of the present disclosure. This display module assembly includes display panel 01, heat dissipation layer 02 and fingerprint module 03. The heat dissipation layer 02 is located on the non-light emitting surface of the display panel 01, and the heat dissipation layer 02 comprises fingerprint openings A. The fingerprint module 03 is located in the fingerprint opening a, and the fingerprint module 03 is attached to the non-light-emitting surface of the display panel 01 through the shading adhesive material 041. The width of the first gap B between the light shielding rubber 041 and the heat dissipation layer 02 is smaller than a preset width, and the width direction of the first gap B is parallel to the non-light-emitting surface of the display panel 01, that is, the width of the first gap B is the size of the first gap B in the direction parallel to the non-light-emitting surface of the display panel 01. The preset width may be set according to actual conditions, and is 0.5mm, for example.
To sum up, among the display module assembly that this application embodiment provided, the width in the first clearance between material and the heat dissipation layer is glued in the shading is less than predetermineeing the width, therefore the width in this first clearance is less, and this first clearance is less to the influence of display module assembly's display effect to this application can improve this display module assembly's display effect.
In an optional embodiment, the heat dissipation layer 02 includes a first buffer sublayer 021 and a heat dissipation sublayer 023, the first buffer sublayer 021 and the heat dissipation sublayer 023 are sequentially distributed along a direction away from the display panel 01, the heat dissipation sublayer 023 is made of a light-shielding material, an orthogonal projection of the heat dissipation sublayer 023 on the display panel 01 covers an orthogonal projection of the first buffer sublayer 021 on the display panel 01, and the first gap B is a gap between the light-shielding adhesive 041 and the first buffer sublayer 021. In one example, the orthographic projection of the heat dissipation sublayer 023 on the display panel 01 coincides with the orthographic projection of the first buffer sublayer 021 on the display panel 01. For example, fig. 1 shows a case where the orthographic projection of the heat dissipation sublayer 023 on the display panel 01 coincides with the orthographic projection of the first buffer sublayer 021 on the display panel 01. In another example, the area of the orthographic projection of the heat dissipation sublayer 023 on the display panel 01 is larger than the area of the orthographic projection of the first buffer sublayer 021 on the display panel 01, and the orthographic projection of the heat dissipation sublayer 023 on the display panel 01 covers the orthographic projection of the first gap B on the display panel 01. For example, fig. 2 shows a case where the area of the orthographic projection of the heat dissipation sublayer 023 on the display panel 01 is larger than the area of the orthographic projection of the first buffer sublayer 021 on the display panel 01, and the orthographic projection of the heat dissipation sublayer 023 on the display panel 01 covers the orthographic projection of the first gap B on the display panel 01. Because the material of heat dissipation sublayer 023 is the shading material, and the orthographic projection of heat dissipation sublayer 023 on display panel 01 covers the orthographic projection of first clearance B on display panel 01, therefore heat dissipation sublayer 023 can shelter from ambient light, avoids ambient light to shine on display panel 01 through first clearance B to can improve display panel 01's display effect.
Optionally, referring to fig. 1 and fig. 2, the heat dissipation layer 02 further includes a second buffer sublayer 022, the second buffer sublayer 022 is located between the first buffer sublayer 021 and the heat dissipation sublayer 023, and an orthogonal projection of the second buffer sublayer 022 on the display panel 01 coincides with an orthogonal projection of the heat dissipation sublayer 023 on the display panel 01.
Optionally, referring to fig. 1 and fig. 2, the display module further includes an edge sealing adhesive material 05, and the edge sealing adhesive material 05 is distributed around the fingerprint module 03. For example, the edge sealing adhesive material 05 is attached to the light shielding adhesive material 041 and distributed along the periphery of the fingerprint module 03, and the edge sealing adhesive material 05 is a slope-shaped structure and surrounds the periphery of the fingerprint module 03. Banding plastic material 05 is used for the separation steam, avoids steam to corrode fingerprint module 03.
In the embodiment of the present application, the display panel may be an OLED display panel. Such as an OLED touch display panel. The first buffer sublayer 021 may be made of EMBO (patterned silica gel), the second buffer sublayer 023 may be made of FOAM, the heat dissipation sublayer 022 may be made of a metal material (e.g., copper), the light-shielding adhesive material 041 may be made of a pressure-sensitive adhesive, and the edge-sealing adhesive material 05 may be a light-shielding adhesive material or a light-transmitting adhesive material. The heat dissipation layer 02 can dissipate heat generated by the display module during operation, and the heat dissipation sublayer 022 can isolate interference signals and eliminate static electricity.
To sum up, the display module assembly that this application embodiment provided, this display module assembly includes display panel, heat dissipation layer and fingerprint module, and this heat dissipation layer is located this display panel's non-light emitting area, and this heat dissipation layer includes the fingerprint trompil, and this fingerprint module is located this fingerprint trompil, and this fingerprint module glues the material through the shading and attaches on this display panel's non-light emitting area, and the width in the first clearance between material and this heat dissipation layer is glued in this shading is less than predetermineeing the width, the width direction in this first clearance with display panel's non-light emitting area is parallel. Because the width in the first clearance between this shading glue material and this heat dissipation layer is less, so this first clearance is less to the influence of this display module assembly's display effect to this application can improve this display module assembly's display effect.
The above is the introduction to the display module of the present application. The following describes a method for manufacturing a display module according to the present application.
Please refer to fig. 3, which illustrates a flowchart of a method for manufacturing a display module according to an embodiment of the present disclosure. As shown in fig. 3, the method includes the following steps S301 to S304.
S301, forming a display panel and a fingerprint module.
The display panel may be an OLED display panel. The display panel may be a rectangular display panel or a display panel of another shape. The display panel includes a light emitting face including a display area and a non-display area, for example, a peripheral area surrounding the display area. In addition, the display panel may be a touch display panel integrated with a touch function, for example, the display panel is an OLED touch display panel integrated with a touch function. The fingerprint module can be ultrasonic fingerprint identification module, and ultrasonic fingerprint identification module spreads the ultrasonic wave and discerns the fingerprint. The shape of the fingerprint module may be circular, oval, square, rectangular, etc., which is not limited in this application.
The display panel and the fingerprint module are only examples of the present application, the display panel may also be another electroluminescence display panel, a photoluminescence display panel, a liquid crystal display panel, or the like, and the fingerprint module may also be an optical fingerprint identification module, an electrical fingerprint identification module, or the like, which is not limited in this embodiment of the present application.
S302, forming a heat dissipation layer on a non-luminous surface of the display panel, wherein the heat dissipation layer comprises fingerprint openings.
Optionally, the heat dissipation layer includes a first buffer sub-layer and a heat dissipation sub-layer, the heat dissipation sub-layer is made of a light-shielding material, and the first buffer sub-layer is made of a buffer material. For example, the heat dissipation sub-layer is made of a metal material (e.g., copper), and the first buffer sub-layer is made of EMBO (patterned silicon). The heat dissipation layer can be formed on the non-luminous surface of the display panel, so that the first buffer sublayer and the heat dissipation sublayer are sequentially distributed along the direction far away from the display panel, and the orthographic projection of the heat dissipation sublayer on the display panel covers the orthographic projection of the first buffer sublayer on the display panel. For example, an orthographic projection of the heat dissipation sublayer on the display panel coincides with an orthographic projection of the first buffer sublayer on the display panel, or an area of the orthographic projection of the heat dissipation sublayer on the display panel is larger than an area of the orthographic projection of the first buffer sublayer on the display panel.
Optionally, the heat dissipation layer further includes a second buffer sublayer, and the second buffer sublayer is located between the first buffer sublayer and the heat dissipation sublayer. The material of the second buffer sub-layer is a buffer material, for example, the material of the second buffer sub-layer is FOAM (FOAM). The heat dissipation layer may be formed on the non-light emitting surface of the display panel such that an orthographic projection of the second buffer sub-layer on the display panel coincides with an orthographic projection of the heat dissipator on the display panel.
In the embodiment of the present application, an orthographic projection of the heat dissipation sublayer on the display panel coincides with an orthographic projection of the first buffer sublayer on the display panel, or an area of the orthographic projection of the heat dissipation sublayer on the display panel is larger than an area of the orthographic projection of the first buffer sublayer on the display panel. S302 includes the following two implementations.
The first implementation mode comprises the following steps: the orthographic projection of the heat dissipation sublayer on the display panel is overlapped with the orthographic projection of the first buffering sublayer on the display panel. Referring to fig. 4 and 5, fig. 4 is a rear view illustrating a heat dissipation layer 02 formed on a non-light-emitting surface of a display panel 01 according to an embodiment of the present disclosure, and fig. 5 is a cross-sectional view illustrating a portion M-M of fig. 4. The heat dissipation layer 02 is located on the non-light emitting surface of the display panel 01, the heat dissipation layer 02 includes a fingerprint opening a, and the heat dissipation layer 02 includes a first buffer sublayer 021, a second buffer sublayer 022 and a heat dissipation sublayer 023 which are sequentially distributed along the direction far away from the display panel 01, and the orthographic projections of the first buffer sublayer 021, the second buffer sublayer 022 and the heat dissipation sublayer 023 on the display panel 01 coincide with each other.
In one example, first, a first buffer sublayer 021, a second buffer sublayer 022 and a heat dissipation sublayer 023 are sequentially formed on a non-light emitting surface of the display panel 01, so as to obtain a heat dissipation layer body; then, fingerprint openings a are formed on the heat dissipation layer body, and the heat dissipation layer 02 is obtained. In another example, first, a first buffer sublayer 021, a second buffer sublayer 022 and a heat dissipation sublayer 023 are sequentially formed on a substrate to obtain a heat dissipation layer body; then forming a fingerprint opening A on the heat dissipation layer body to obtain a heat dissipation layer 02; then, the heat dissipation layer 02 is peeled off from the base substrate; finally, the heat dissipation layer 02 is attached on the non-light emitting surface of the display panel 01.
The second implementation mode comprises the following steps: the area of the orthographic projection of the heat dissipation sublayer on the display panel is larger than that of the orthographic projection of the first buffer sublayer on the display panel. Please refer to fig. 6, which illustrates a cross-sectional view of another embodiment of the present disclosure after forming a heat dissipation layer 02 on a non-light-emitting surface of a display panel 01. Heat dissipation layer 02 is located display panel 01's non-light emitting face, heat dissipation layer 02 includes fingerprint trompil A (fingerprint trompil A includes fingerprint trompil A1 and fingerprint trompil A2 that link up, the opening size of fingerprint trompil A1 is greater than the opening size of fingerprint trompil A2), and heat dissipation layer 02 includes the first buffering sublayer 021 that distributes in proper order along the direction of keeping away from display panel 01, second buffering sublayer 022 and heat dissipation sublayer 023, second buffering sublayer 022 orthographic projection and the orthographic projection coincidence of heat dissipation sublayer 023 on display panel 01, heat dissipation sublayer 023 orthographic projection on display panel 01 covers the orthographic projection of first buffering sublayer 021 on display panel 01, fingerprint trompil A1 link up first buffering sublayer 021, second buffering sublayer 022 and heat dissipation sublayer 023, fingerprint trompil A2 link up second buffering sublayer 022 and heat dissipation sublayer 023. As shown in fig. 6, a light shielding rubber 041 is further formed on the non-light emitting surface of the display panel 01, and the light shielding rubber 041 is located in the fingerprint opening a.
For example, in the second implementation manner, the light shielding adhesive 041 is first formed on the non-light emitting surface of the display panel 01, and then the heat dissipation layer 02 is formed on the non-light emitting surface of the display panel 01, so that the light shielding adhesive 041 is located in the fingerprint opening a of the heat dissipation layer 02. The light-shielding rubber 041 is formed on the non-light-emitting surface of the display panel 01, and includes: fig. 7 shows a cross-sectional view of the light shielding material 041 formed in a target region on the non-light-emitting surface of the display panel 01 and the light shielding material 041 formed on the non-light-emitting surface of the display panel 01. Here, the step of forming the heat dissipation layer 02 on the non-light emitting surface of the display panel 01 includes steps S3021 to S3023.
S3021: a heat dissipation layer 02 and a compensation layer Y are formed on the first substrate X1, and the adhesion between the compensation layer Y and the first substrate X1 is greater than the adhesion between the heat dissipation layer 02 and the first substrate X1.
Illustratively, first, as shown in fig. 8, a compensation layer Y is formed on a first substrate X1. Then, as shown in fig. 9, a heat dissipation layer 02 is formed on the second substrate X2, the heat dissipation layer 02 including fingerprint openings a. Then, as shown in fig. 10, the second substrate X2 is disposed opposite to the first substrate X1, so that the compensation layer Y is located in the fingerprint opening a of the heat dissipation layer 02, and the compensation layer Y is not in contact with the second substrate X2. Finally, the second substrate X2 is peeled off, leaving the compensation layer Y and the heat dissipation layer 02 on the first substrate X1, resulting in the structure shown in fig. 11.
Wherein, the heat dissipation layer 02 includes first buffering sublayer 021, second buffering sublayer 022 and heat dissipation sublayer 023, and first buffering sublayer 021 includes first trompil A1, and heat dissipation sublayer 023 and second buffering sublayer 022 include second trompil A2, and the orthographic projection of first trompil A1 on first base X1 covers the orthographic projection of second trompil A2 on first base X1, and fingerprint trompil A includes first trompil A1 and second trompil A2. In one example, the process of forming the heat dissipation layer 02 on the second substrate X2 includes: firstly, forming a first buffer sublayer 021 on a second substrate X2, and carrying out fingerprint opening on the first buffer sublayer 021 to form a first opening A1; then, sequentially forming a second buffer sublayer 022 and a heat dissipation sublayer 023 on another substrate (not shown in the figure), and performing fingerprint hole opening on the second buffer sublayer 022 and the heat dissipation sublayer 023 to form second holes A2; thereafter, the second buffer sublayer 022 and the heat dissipation sublayer 023 are peeled off from the other substrate; finally, the second buffer sublayer 022 and the heat dissipation sublayer 023 are integrally attached to the first buffer sublayer 041, so that the second buffer sublayer 022 is bonded to the first buffer sublayer 041 to form the structure shown in fig. 9.
S3022: as shown in fig. 12, the first substrate X1 and the display panel 01 are disposed opposite to each other, so that the heat dissipation layer 02 is bonded to the non-light-emitting surface of the display panel 01, the bonding force between the heat dissipation layer 02 and the non-light-emitting surface of the display panel 01 is greater than the bonding force between the heat dissipation layer 02 and the first substrate, the light shielding rubber 041 on the non-light-emitting surface of the display panel 01 is located in the fingerprint opening a, and the light shielding rubber 041 is in contact with the compensation layer Y.
For example, first, the first substrate X1 is disposed opposite to the display panel 01, such that the heat dissipation layer 02 is in contact with the non-light emitting surface of the display panel 01, the light shielding rubber 041 is located in the fingerprint opening a, and the light shielding rubber 041 is in contact with the compensation layer Y, and then, a roller is used to apply an attaching pressure to the first substrate X1, such that the light shielding rubber 041 is attached to the non-light emitting surface of the display panel 01 by applying the pressure. The thickness of the light-shielding plastic material is smaller than the thickness of the first buffer sublayer, for example, the thickness of the light-shielding plastic material is smaller than 20 micrometers and the thickness of the first buffer sublayer is 30 micrometers to 40 micrometers, so that in the process of arranging the first substrate and the non-light-emitting surface of the display panel opposite to each other, the light-shielding plastic material is not affected by the thickness difference between the light-shielding plastic material and the first buffer sublayer, a first gap B exists between the first buffer sublayer 021 and the light-shielding plastic material 041, and the orthographic projection of the second buffer sublayer and the heat dissipation sublayer on the non-light-emitting surface covers the first gap B.
S3023: the first substrate X1 and the compensation layer Y are peeled off, resulting in the structure shown in fig. 6.
Because the adhesion between the compensation layer Y and the first substrate X1 is greater than the adhesion between the heat dissipation layer 02 and the first substrate X1, and the adhesion between the compensation layer Y and the first substrate X1 is greater than the adhesion between the light-shielding rubber 041 and the compensation layer Y, when the first substrate X1 is peeled off, the first substrate X1 can drive to peel off the compensation layer Y, and the process of peeling off the first substrate X1 and the compensation layer Y does not affect the heat dissipation layer 02.
S303, the fingerprint module is arranged in the fingerprint opening hole, so that the fingerprint module is attached to the non-light-emitting surface through the shading rubber material, wherein the width of a first gap between the shading rubber material and the heat dissipation layer is smaller than a preset width, and the width direction of the first gap is parallel to the non-light-emitting surface of the display panel.
The heat dissipation layer comprises a first buffer sublayer and a heat dissipation sublayer, the first buffer sublayer and the heat dissipation sublayer are sequentially distributed along the direction far away from the display panel, and the first gap is a gap between the shading rubber material and the first buffer sublayer. Wherein, the orthographic projection of the heat dissipation sublayer on the display panel is superposed with the orthographic projection of the first buffer sublayer on the display panel; or the orthographic projection area of the heat dissipation sublayer on the display panel is larger than the orthographic projection area of the first buffer sublayer on the display panel, and the orthographic projection of the heat dissipation sublayer on the display panel covers the orthographic projection of the first gap on the display panel. Optionally, the heat dissipation layer further includes a second buffer sublayer, the second buffer sublayer is located between the first buffer sublayer and the heat dissipation sublayer, and an orthographic projection of the second buffer sublayer on the display panel coincides with an orthographic projection of the heat dissipation sublayer on the display panel.
For two implementations of S302, S303 also includes the following two implementations.
First implementation (corresponding to the first implementation in S302): first, as shown in fig. 13, a light-shielding adhesive 041 is formed in a target region of the non-light-emitting surface of the display panel 01, where the fingerprint opening a on the heat dissipation layer 02 corresponds to the non-light-emitting surface of the display panel 01, and then, as shown in fig. 14, the fingerprint module 03 is attached to the light-shielding adhesive 041. The forming of the light shielding rubber 041 in the target region of the non-light emitting surface of the display panel 01 includes the following steps S3031 to S3033.
S3031: as shown in fig. 15, a glue material structure 04 is formed in a target area of a non-light emitting surface of the display panel 01, the glue material structure 04 includes a light shielding glue material 041 and a glue material protection film 042, the light shielding glue material 041 is attached in the target area, and a surface of the glue material protection film 042 away from the display panel 01 is flush with a surface of the heat dissipation layer 02 away from the display panel 01. The light-shielding rubber 041 and the rubber protective film 042 may be the same rubber, for example, both the light-shielding rubber 041 and the rubber protective film 042 may be pressure-sensitive adhesive.
S3032: as shown in fig. 16, a heavy release film Z is formed on a side of the heat dissipation layer 02 far from the display panel 01, an adhesive force between the heavy release film Z and the adhesive material protection film 042 is greater than an adhesive force between the adhesive material protection film 042 and the light-shielding adhesive material 041, and an adhesive force between the heavy release film Z and the adhesive material protection film 042 is greater than an adhesive force between the heavy release film Z and the heat dissipation layer 02.
For example, in the structure formed in step S3032, a heavy release film Z is formed to cover the heat dissipation layer 02 and the adhesive protection film 042, and then a roller is used to apply pressure to the heavy release film Z, so that the light-shielding adhesive 041 is more tightly attached to the non-light-emitting surface of the display panel 01 by applying pressure.
S3033: the adhesive material protective film 041 is peeled off by the heavy release film Z to obtain the structure shown in fig. 13.
For example, the heavy release film Z is peeled, and the adhesive material protective film 041 is peeled by the heavy release film Z. Since the adhesion force between the heavy release film Z and the rubber material protection film 042 is greater than the adhesion force between the rubber material protection film 042 and the light-shielding rubber material 041, and the adhesion force between the heavy release film Z and the rubber material protection film 042 is greater than the adhesion force between the heavy release film Z and the heat dissipation layer 02, in the process of peeling the heavy release film Z, when the rubber material protection film 042 is separated from the light-shielding rubber material 041, the heavy release film Z is not yet separated from the rubber material protection film 042, and when the heavy release film Z is separated from the heat dissipation layer 02, the heavy release film Z is not yet separated from the rubber material protection film 042, so that the rubber material protection film 041 can be peeled by the heavy release film Z, and the structure shown in fig. 13 is finally formed.
Second implementation (corresponding to the second implementation in S302): as shown in fig. 17, the fingerprint module 03 is attached to the light-shielding rubber 041.
In one example, in the structure formed by the second implementation manner in step S302, the fingerprint module 03 is attached to the light shielding adhesive 041, so as to obtain the structure shown in fig. 17.
S304, forming edge sealing glue materials around the fingerprint module.
The schematic diagram after the edge sealing adhesive material 05 is formed around the fingerprint module 03 can refer to fig. 1 or fig. 2. The edge sealing rubber material 05 can be attached to the shading rubber material 041 and distributed along the periphery of the fingerprint module 03, and the edge sealing rubber material 05 forms a slope-shaped structure around the fingerprint module 03. In one example, one side of the edge sealing adhesive material 05 is adhered to the side of the light shielding adhesive material 041, and the other side is adhered to the side of the fingerprint module 03. Optionally, the edge sealing adhesive material 05 is made of a light-shielding material. In one example, a light shielding tape is attached to the light shielding adhesive 041 as the edge sealing adhesive 05. In another example, a light-shielding glue is attached to the light-shielding glue 041, and the light-shielding glue is cured to obtain the edge-shielding glue 05.
To sum up, the manufacturing method of the display module assembly that this application embodiment provided, when making this display module assembly, at first form display panel and fingerprint module, then form the heat dissipation layer including the fingerprint trompil on the non-light emitting area of this display panel, later with this fingerprint module setting in this fingerprint trompil, make this fingerprint module glue the material through the shading and attach on this non-light emitting area, the width of the first clearance between material and this heat dissipation layer is less than predetermineeing the width. Because the width in the first clearance between this shading glues material and this heat dissipation layer is less than predetermineeing the width, consequently the width in the first clearance between this shading glues material and this heat dissipation layer is less, and this first clearance is less to display module's display effect's influence to this application can improve this display module's display effect.
The embodiment of the application also provides a display device which comprises the display module shown in fig. 1 or fig. 2. Because the display effect of this display module assembly is better, consequently, the display device who adopts this display module assembly's display effect is better. By way of example, the display device may be: products or components with fingerprint identification function and display function such as smart watches, electronic readers, mobile phones and tablet computers.
The above description is intended only to illustrate embodiments of the present application, and should not be construed as limiting the present application, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (11)
1. The utility model provides a display module assembly which characterized in that, display module assembly includes: the display panel, the heat dissipation layer and the fingerprint module; the utility model discloses a display panel's non-light emitting area, including display panel's non-light emitting area, heat dissipation layer, fingerprint module, shading glue material, width, the width direction in first clearance with display panel's non-light emitting area is parallel, the heat dissipation layer is located on display panel's the non-light emitting area, the fingerprint module is located in the fingerprint trompil, the fingerprint module glues the material through the shading and attaches in display panel's non-light emitting area, the shading glue the material with the width in first clearance between the heat dissipation layer is less than predetermines the width, the width direction in first clearance with display panel's non-light emitting area is parallel.
2. The display module according to claim 1, wherein the heat dissipation layer comprises a first buffer sublayer and a heat dissipation sublayer, and the first buffer sublayer and the heat dissipation sublayer are sequentially distributed along a direction away from the display panel; the material of the heat dissipation sublayer is a shading material, the orthographic projection of the heat dissipation sublayer on the display panel covers the orthographic projection of the first buffering sublayer on the display panel, and the first gap is a gap between the shading rubber material and the first buffering sublayer.
3. The display module of claim 2,
the orthographic projection of the heat dissipation sublayer on the display panel is superposed with the orthographic projection of the first buffering sublayer on the display panel; or,
the area of the orthographic projection of the heat dissipation sublayer on the display panel is larger than that of the first buffering sublayer on the display panel, and the orthographic projection of the heat dissipation sublayer on the display panel covers the orthographic projection of the first gap on the display panel.
4. The display module according to claim 2, wherein the heat dissipation layer further comprises a second buffer sublayer, the second buffer sublayer is located between the first buffer sublayer and the heat dissipation sublayer, and an orthographic projection of the second buffer sublayer on the display panel coincides with an orthographic projection of the heat dissipation sublayer on the display panel.
5. The display module according to any one of claims 1 to 4, further comprising an edge sealing adhesive material distributed along the periphery of the fingerprint module.
6. A manufacturing method of a display module is characterized by comprising the following steps:
forming a display panel and a fingerprint module;
forming a heat dissipation layer on a non-light emitting surface of the display panel, the heat dissipation layer including fingerprint openings;
will fingerprint module sets up in the fingerprint trompil, make fingerprint module glues the material through the shading and attaches on the non-light emitting area, wherein, the shading glue the material with the width in first clearance between the heat dissipation layer is less than predetermineeing the width, the width direction in first clearance with display panel's non-light emitting area is parallel.
7. The method of claim 6,
it is in to incite somebody to action fingerprint module sets up in the fingerprint trompil, make fingerprint module pass through the shading and glue the material attached on the non-light emitting area, include:
forming the shading rubber material in a target area of the non-light-emitting surface, wherein the target area is a corresponding area of the fingerprint opening hole on the non-light-emitting surface;
attaching the fingerprint module on the shading rubber material.
8. The method of claim 7, wherein the forming the light blocking glue in the target area of the non-light emitting face comprises:
forming a glue material structure in the target area, wherein the glue material structure comprises the shading glue material and a glue material protective film, the shading glue material is attached in the target area, and one surface of the glue material protective film, which is far away from the display panel, is flush with one surface of the heat dissipation layer, which is far away from the display panel;
forming a heavy release film on one side of the heat dissipation layer far away from the display panel;
and stripping the rubber material protective film through the heavy release film.
9. The method of claim 6,
before forming a heat dissipation layer on a non-light emitting face of the display panel, the method further comprises: forming the shading rubber material in a target area of the non-luminous surface;
forming a heat dissipation layer on a non-light emitting surface of the display panel, including: forming the heat dissipation layer on the non-luminous surface to enable the shading rubber material to be located in the fingerprint opening;
said disposing said fingerprint module in said fingerprint opening, comprising: attaching the fingerprint module on the shading rubber material.
10. The method of claim 9, wherein the forming the heat spreading layer on the non-light emitting face comprises:
forming the heat dissipation layer and a compensation layer on a first substrate, wherein the adhesion force between the compensation layer and the first substrate is larger than that between the heat dissipation layer and the first substrate;
the first substrate and the display panel are arranged oppositely, so that the heat dissipation layer is bonded with the non-light-emitting surface of the display panel, the bonding force between the heat dissipation layer and the non-light-emitting surface is larger than that between the heat dissipation layer and the first substrate, the shading rubber material on the non-light-emitting surface is located in the fingerprint opening, and the shading rubber material is in contact with the compensation layer;
and stripping the first substrate and the compensation layer.
11. A display device, comprising the display module according to any one of claims 1 to 5.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211197824.3A CN115528079A (en) | 2022-09-29 | 2022-09-29 | Display module, manufacturing method thereof and display device |
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| CN202211197824.3A CN115528079A (en) | 2022-09-29 | 2022-09-29 | Display module, manufacturing method thereof and display device |
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| CN112861761A (en) * | 2021-02-24 | 2021-05-28 | 京东方科技集团股份有限公司 | Display module and display device |
| CN214688313U (en) * | 2020-11-19 | 2021-11-12 | 京东方科技集团股份有限公司 | Heat dissipation film, display module and electronic equipment |
| US20220201905A1 (en) * | 2020-06-05 | 2022-06-23 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Heat dissipation module, display assembly and display device |
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| CN108388847A (en) * | 2018-02-06 | 2018-08-10 | 武汉华星光电半导体显示技术有限公司 | A kind of display device |
| US20220201905A1 (en) * | 2020-06-05 | 2022-06-23 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Heat dissipation module, display assembly and display device |
| CN214688313U (en) * | 2020-11-19 | 2021-11-12 | 京东方科技集团股份有限公司 | Heat dissipation film, display module and electronic equipment |
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