CN115521729A - Colloid flat pasting process - Google Patents
Colloid flat pasting process Download PDFInfo
- Publication number
- CN115521729A CN115521729A CN202211227088.1A CN202211227088A CN115521729A CN 115521729 A CN115521729 A CN 115521729A CN 202211227088 A CN202211227088 A CN 202211227088A CN 115521729 A CN115521729 A CN 115521729A
- Authority
- CN
- China
- Prior art keywords
- glue
- colloid
- grooves
- pasting process
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000084 colloidal system Substances 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000003292 glue Substances 0.000 claims abstract description 29
- 239000012528 membrane Substances 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 239000002131 composite material Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a glue flat pasting process, which enables the surface of a glue to be flat after flat pasting and ensures the subsequent stable and reliable use of a product. Set up the net air discharge duct in the colloid with from the adhesion face region that forms between the type membrane, the net air discharge duct is located thickness direction, extends to whole adhesion region, and the thickness of net air discharge duct is not more than the glue film thickness of colloid or from the thickness of type membrane.
Description
Technical Field
The invention relates to the technical field of glue flat pasting, in particular to a glue flat pasting process.
Background
In the die cutting industry, PET single-sided adhesive is compounded on the surface of a product, the PET single-sided adhesive needs to be flatly attached to an external release film, and when the PET single-sided adhesive is actually attached, the PET single-sided adhesive needs to be attached to the release film through an attaching roller under certain pressure, so that only part of air is remained on the surface of the PET single-sided adhesive and the release film, and the part of air cannot be emptied, so that the surface of the product is uneven, and subsequent use is influenced; therefore, a process suitable for flat pasting of the colloid is urgently needed.
Disclosure of Invention
In order to solve the problems, the invention provides a glue flat-pasting process, which enables the surface of a glue to be flat-pasted and ensures the subsequent stable and reliable use of a product.
A colloid flat pasting process is characterized in that: set up the net air discharge duct in the colloid with from the adhesion face region that forms between the type membrane, the net air discharge duct is located thickness direction, extends to whole adhesion region, and the thickness of net air discharge duct is not more than the glue film thickness of colloid or from the thickness of type membrane.
It is further characterized in that:
after the colloid and the release film are pressed and leveled, the whole composite structure is kept stand for 18 to 24 hours, so that redundant air is discharged out of the grid exhaust groove, and the colloid and the release film are flatly and reliably pasted.
It is further characterized in that:
covering a release film with grid exhaust grooves on the adhesive surface of the colloid;
and processing the adhesive surface of the colloid to form a grid exhaust groove, so that the inner surface of the release film is flatly attached to the whole outer plane area of the grid exhaust groove.
It is still further characterized in that:
the ratio of the total area of the grid exhaust grooves to the total area of the adhering surface area is 0.5-1.5%, and the integral flatness after adhering is ensured;
the concave depth of the grid exhaust groove is not more than 20% of the thickness of the release film, so that the overall stability of the release film is ensured;
the concave depth of the grid exhaust groove is not more than 15% of the thickness of the glue layer of the glue body, so that the overall viscosity of the glue body is ensured;
the grid exhaust grooves comprise warp grooves and weft grooves, and the warp grooves and the weft grooves are spliced and combined with each other to form all grid exhaust grooves with the same size;
the widths of the warp slots and the weft slots are the same and are both 0.05 mm-0.1 mm, so that the stable and reliable air exhaust is ensured;
the bottom of the radial groove and the bottom of the weft groove are all semicircular surfaces, so that excessive force cannot be generated when gas circulates, and the grid exhaust groove is stable and reliable in exhaust.
After the adhesive tape is adopted, the grid exhaust grooves are arranged in the adhesive area between the adhesive body and the release film, the grid exhaust grooves are positioned in the thickness direction and extend to the whole adhesive area, the thickness of the grid exhaust grooves is not more than the adhesive layer thickness of the adhesive body or the thickness of the release film, and redundant gas is exhausted along the grid exhaust grooves after the adhesive body is flatly pasted, so that the surface of the adhesive body after being flatly pasted is flat, and the subsequent stable and reliable use of a product is ensured.
Drawings
FIG. 1 is a schematic cross-sectional view of a first embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a second embodiment of the present invention;
FIG. 3 is a schematic top view of a grid vent of the present invention;
the names corresponding to the sequence numbers in the figure are as follows:
colloid 10, glue layer 11, release film 20, grid exhaust groove 30, warp groove 31 and weft groove 32.
Detailed Description
A colloid flat pasting process, which is shown in figures 1-3: set up net air discharge duct 30 in the adhesive surface region that forms between glue film 11 of colloid 10 and from type membrane 20, net air discharge duct 30 is located the thickness direction, extends to whole adhesion region, and the thickness of net air discharge duct 30 is not more than glue film 11 thickness of colloid 10 or from the thickness of type membrane 20.
After the colloid 10 and the release film 20 are flatly pressed, the whole composite structure is kept stand for 18-24 hours, so that redundant air is discharged out of the grid exhaust groove 30, and the colloid 10 and the release film 20 are flatly and reliably pasted.
In the first embodiment, a release film 20 with grid air discharge grooves 30 is covered on the adhesive surface of a colloid 10; the ratio of the total area of the grid exhaust grooves 30 to the total area of the adhering surface area is 0.5-1.5%, and the integral flatness after adhering is ensured; the concave depth of the grid vent groove is not more than 20% of the thickness of the release film, and the integral stability of the release film is ensured.
In the second embodiment, the grid air vent groove 30 is formed on the adhesive surface of the colloid 10, so that the inner surface of the release film 20 is flatly attached to the whole outer plane area of the grid air vent groove 30. The ratio of the total area of the grid exhaust grooves 30 to the total area of the adhering surface area is 0.5-1.5%, and the integral flatness after adhering is ensured;
the concave depth of the grid exhaust grooves 30 is not more than 15% of the thickness of the glue layer 11 of the glue body 10, and the overall viscosity of the glue body 10 is ensured.
In the first and second embodiments, the grid exhaust grooves 30 include the warp grooves 31 and the weft grooves 32, and the warp grooves 31 and the weft grooves 32 are spliced and combined with each other to form all grid exhaust grooves 30 with the same grid size;
the width of the warp groove 31 and the width of the weft groove 32 are the same and are both 0.05 mm-0.1 mm, so that stable and reliable air exhaust is ensured;
the radial grooves 31 and the weft grooves 32 have the same depth, and the contact part of the bottom and the substrate is a semicircular surface, so that excessive force cannot be generated when gas circulates, and the stable and reliable air exhaust of the grid exhaust grooves is ensured.
The working principle is as follows: because set up the net air discharge duct in the colloid and from the adhesion area between the type membrane, the net air discharge duct is located the thickness direction, extends to whole adhesion area, and the thickness of net air discharge duct is not more than the glue film thickness of colloid or from the thickness of type membrane, and unnecessary gas is discharged along the net air discharge duct after the colloid is flatly pasted, and it makes the surfacing after the colloid is flatly pasted, ensures the follow-up reliable and stable use of product.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. A colloid flat pasting process is characterized in that: set up the net air discharge duct in the colloid with from the adhesion face region that forms between the type membrane, the net air discharge duct is located thickness direction, extends to whole adhesion region, and the thickness of net air discharge duct is not more than the glue film thickness of colloid or from the thickness of type membrane.
2. The glue flat pasting process of claim 1, characterized in that: after the colloid and the release film are pressed and leveled, the whole composite structure is kept stand for 18 to 24 hours, so that redundant air is discharged out of the grid exhaust groove, and the colloid and the release film are flatly and reliably pasted.
3. The glue flat pasting process of claim 2, characterized in that: and covering a release film with grid exhaust grooves on the adhesive surface of the colloid.
4. The glue flat pasting process of claim 2, characterized in that: and processing the adhesive surface of the colloid to form a grid exhaust groove, so that the inner surface of the release film is flatly attached to the whole outer plane area of the grid exhaust groove.
5. The process of claim 3 or 4, wherein: the ratio of the total area of the grid exhaust grooves to the total area of the adhesive surface area is 0.5-1.5%.
6. The glue flat pasting process of claim 3, wherein: the concave depth of the grid exhaust groove is not more than 20% of the thickness of the release film.
7. The glue flat pasting process of claim 4, wherein: the concave depth of the grid exhaust groove is not more than 15% of the thickness of the glue layer of the glue body.
8. The glue flat pasting process of claim 1, characterized in that: the grid exhaust grooves comprise warp grooves and weft grooves, and the warp grooves and the weft grooves are spliced and combined with each other to form all grid exhaust grooves with the same size.
9. The glue pasting process of claim 8, wherein: the width of the warp groove and the width of the weft groove are the same and are both 0.05 mm-0.1 mm.
10. The glue pasting process of claim 8, wherein: the contact part of the bottom of the radial groove and the weft groove and the substrate is a semicircular surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211227088.1A CN115521729A (en) | 2022-10-09 | 2022-10-09 | Colloid flat pasting process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211227088.1A CN115521729A (en) | 2022-10-09 | 2022-10-09 | Colloid flat pasting process |
Publications (1)
Publication Number | Publication Date |
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CN115521729A true CN115521729A (en) | 2022-12-27 |
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Family Applications (1)
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CN202211227088.1A Pending CN115521729A (en) | 2022-10-09 | 2022-10-09 | Colloid flat pasting process |
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CN (1) | CN115521729A (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN207525179U (en) * | 2017-06-21 | 2018-06-22 | 东莞市古川胶带有限公司 | Discharge type grid double-face adhesive tape |
CN211106090U (en) * | 2019-09-25 | 2020-07-28 | 无锡市亚达特种光源材料有限公司 | Noctilucent film with exhaust reticulate pattern |
JP2020131461A (en) * | 2019-02-14 | 2020-08-31 | 住友ベークライト株式会社 | Release film |
CN216832652U (en) * | 2021-12-06 | 2022-06-28 | 江门市领昱电子材料有限公司 | High-temperature-resistant texture release film |
CN216946859U (en) * | 2021-12-21 | 2022-07-12 | 浙江耀阳新材料科技有限公司 | Grid release film |
CN217159767U (en) * | 2022-01-13 | 2022-08-09 | 荣耀终端有限公司 | Electronic device |
-
2022
- 2022-10-09 CN CN202211227088.1A patent/CN115521729A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN207525179U (en) * | 2017-06-21 | 2018-06-22 | 东莞市古川胶带有限公司 | Discharge type grid double-face adhesive tape |
JP2020131461A (en) * | 2019-02-14 | 2020-08-31 | 住友ベークライト株式会社 | Release film |
CN211106090U (en) * | 2019-09-25 | 2020-07-28 | 无锡市亚达特种光源材料有限公司 | Noctilucent film with exhaust reticulate pattern |
CN216832652U (en) * | 2021-12-06 | 2022-06-28 | 江门市领昱电子材料有限公司 | High-temperature-resistant texture release film |
CN216946859U (en) * | 2021-12-21 | 2022-07-12 | 浙江耀阳新材料科技有限公司 | Grid release film |
CN217159767U (en) * | 2022-01-13 | 2022-08-09 | 荣耀终端有限公司 | Electronic device |
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Application publication date: 20221227 |