CN115521424A - Phenolic resin and preparation method and application thereof - Google Patents
Phenolic resin and preparation method and application thereof Download PDFInfo
- Publication number
- CN115521424A CN115521424A CN202211302375.4A CN202211302375A CN115521424A CN 115521424 A CN115521424 A CN 115521424A CN 202211302375 A CN202211302375 A CN 202211302375A CN 115521424 A CN115521424 A CN 115521424A
- Authority
- CN
- China
- Prior art keywords
- parts
- phenolic resin
- stage
- solution
- phenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 229920001568 phenolic resin Polymers 0.000 title claims abstract description 40
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 40
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 24
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 24
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims abstract description 24
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229920005610 lignin Polymers 0.000 claims abstract description 18
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 12
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims abstract description 12
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims abstract description 12
- 230000002378 acidificating effect Effects 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 150000001875 compounds Chemical class 0.000 claims abstract description 12
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 12
- 239000003054 catalyst Substances 0.000 claims abstract description 9
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 239000010425 asbestos Substances 0.000 claims abstract description 5
- 238000000227 grinding Methods 0.000 claims abstract description 5
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 239000000843 powder Substances 0.000 claims abstract description 5
- 229910052895 riebeckite Inorganic materials 0.000 claims abstract description 5
- 238000003756 stirring Methods 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000010992 reflux Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000007935 neutral effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 7
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/24—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with mixtures of two or more phenols which are not covered by only one of the groups C08G8/10 - C08G8/20
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/20—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with polyhydric phenols
- C08G8/22—Resorcinol
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C09J161/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2361/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08J2361/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
The invention discloses a phenolic resin and a preparation method and application thereof, wherein the phenolic resin comprises the following raw materials: 30-50 parts of phenol; 50-60 parts of formaldehyde; 5-10 parts of acetone; 5-10 parts of ethanol; 5-10 parts of polyvinyl acetal; 3-6 parts of resorcinol; 10-15 parts of dioxane; 6-12 parts of acidic lignin; 10-15 parts of polyhydroxy compound; 1-3 parts of a catalyst; 1-3 parts of a curing agent; 1-3 parts of a silane coupling agent. The invention adopts phenol, formaldehyde, acetone, ethanol, polyvinyl acetal, resorcinol, dioxane, acidic lignin, polyhydroxy compound, catalyst, curing agent and silane coupling agent to rapidly prepare the phenolic resin with strong structural stability, and can be applied to the preparation of molding powder, grinding wheels, friction plates, bulb bonding, asbestos products, insulating plates or decorative plates.
Description
Technical Field
The invention relates to the technical field of phenolic resin, in particular to phenolic resin and a preparation method and application thereof.
Background
Phenolic resin is a synthetic plastic, colorless or yellow brown transparent solid, also commonly called bakelite because of the use of many electrical equipment. The cutting fluid has the advantages of excellent heat resistance, flame resistance, water resistance and insulativity, better acid resistance, poor alkali resistance, good mechanical and electrical properties and easy cutting, and is divided into two types of thermosetting plastics and thermoplastic plastics.
Through retrieval, in a phenolic resin material with the publication number of CN112979896A and a preparation method and application thereof, the application discloses a phenolic resin material, the phenolic resin material has a hollow structure, and the particle size of the phenolic resin material is 100-1000 nm; the aperture size of the hollow structure of the phenolic resin material is 10-800 nm; the thickness of the shell layer of the phenolic resin material is 5-800 nm. The phenolic resin material has the advantages of shape diversity, high monodispersity and uniform granularity, and can simply and quickly synthesize hollow phenolic resin with various structures.
The general phenolic resin has poor structural stability, and is easy to cause deformation of products prepared from the phenolic resin, so that the phenolic resin with higher practicability, and a preparation method and application thereof are provided.
Disclosure of Invention
The invention aims to provide phenolic resin and a preparation method and application thereof, and solves the existing problems.
In order to achieve the purpose, the invention provides the following technical scheme: the phenolic resin comprises the following raw materials in parts by weight:
30-50 parts of phenol;
50-60 parts of formaldehyde;
5-10 parts of acetone;
5-10 parts of ethanol;
5-10 parts of polyvinyl acetal;
3-6 parts of resorcinol;
10-15 parts of dioxane;
6-12 parts of acidic lignin;
10-15 parts of polyhydroxy compound;
1-3 parts of a catalyst;
1-3 parts of a curing agent;
1-3 parts of a silane coupling agent.
The phenolic resin comprises the following raw materials in parts by weight:
45 parts of phenol;
50 parts of formaldehyde;
5 parts of acetone;
5 parts of ethanol;
5 parts of polyvinyl acetal;
4 parts of resorcinol;
10 parts of dioxane;
8 parts of acidic lignin;
10 parts of polyhydroxy compound;
2 parts of a catalyst;
1 part of a curing agent;
1 part of silane coupling agent.
Preferably, dioxane, acidic lignin and polyhydroxy compound are put into molten phenol, heated to reflux, cooled, and adjusted to neutral pH value to obtain lignin solution.
A preparation method of phenolic resin comprises the following steps:
s1, adding phenol, acetone, ethanol, polyvinyl acetal and resorcinol into a reaction kettle, dissolving in water, and sequentially mixing in three stages, namely, a stage A, a stage B and a stage C at the temperature of 30-120 ℃;
and (2) stage A: stirring at 30-60 deg.C for 15-30min at rotation speed of 800-1000r/min to obtain solution A;
and (B) stage: stirring at 60-70 deg.C for 10-15min at 1500-2000r/min, adding curing agent and silane coupling agent into solution A, and stirring for 5-15min to obtain solution B;
and C, stage: adding lignin solution into the solution B at 70-120 deg.C, stirring for 30-60min at 2000-3000r/min; preparation of phenolic resin solution
S2, cooling for 12-24h to prepare the phenolic resin.
The phenolic resin is applied to the preparation of molding powder, grinding wheels, friction plates, bulb bonding, asbestos products, insulating plates or decorative plates.
Compared with the prior art, the invention has the following beneficial effects:
the invention adopts phenol, formaldehyde, acetone, ethanol, polyvinyl acetal, resorcinol, dioxane, acidic lignin, polyhydroxy compound, catalyst, curing agent and silane coupling agent to rapidly prepare the phenolic resin with strong structural stability, and can be applied to the preparation of molding powder, grinding wheels, friction plates, bulb bonding, asbestos products, insulating plates or decorative plates.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
The phenolic resin comprises the following raw materials in parts by weight:
30-50 parts of phenol;
50-60 parts of formaldehyde;
5-10 parts of acetone;
5-10 parts of ethanol;
5-10 parts of polyvinyl acetal;
3-6 parts of resorcinol;
10-15 parts of dioxane;
6-12 parts of acidic lignin;
10-15 parts of polyhydroxy compound;
1-3 parts of a catalyst;
1-3 parts of a curing agent;
1-3 parts of a silane coupling agent.
The phenolic resin comprises the following raw materials in parts by weight:
45 parts of phenol;
50 parts of formaldehyde;
5 parts of acetone;
5 parts of ethanol;
5 parts of polyvinyl acetal;
4 parts of resorcinol;
10 parts of dioxane;
8 parts of acidic lignin;
10 parts of polyhydroxy compound;
2 parts of a catalyst;
1 part of a curing agent;
1 part of silane coupling agent.
Further, adding dioxane, acidic lignin and polyhydroxy compound into molten phenol, heating to reflux, cooling, and adjusting pH value to neutrality to obtain lignin solution.
A preparation method of phenolic resin comprises the following steps:
s1, adding phenol, acetone, ethanol, polyvinyl acetal and resorcinol into a reaction kettle, dissolving in water, and sequentially mixing in three stages, namely, a stage A, a stage B and a stage C at the temperature of 30-120 ℃;
and (2) stage A: stirring at 30-60 deg.C for 15-30min at rotation speed of 800-1000r/min to obtain solution A;
and (B) stage: stirring at 60-70 deg.C for 10-15min at 1500-2000r/min, adding curing agent and silane coupling agent into solution A, and stirring for 5-15min to obtain solution B;
and C, stage: adding lignin solution into the solution B at 70-120 deg.C, stirring for 30-60min at 2000-3000r/min; preparation of phenolic resin solution
S2, cooling for 12-24h to prepare the phenolic resin.
The phenolic resin is applied to the preparation of molding powder, grinding wheels, friction plates, bulb bonding, asbestos products, insulating plates or decorative plates.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The phenolic resin comprises the following raw materials in parts by weight:
30-50 parts of phenol;
50-60 parts of formaldehyde;
5-10 parts of acetone;
5-10 parts of ethanol;
5-10 parts of polyvinyl acetal;
3-6 parts of resorcinol;
10-15 parts of dioxane;
6-12 parts of acidic lignin;
10-15 parts of polyhydroxy compound;
1-3 parts of a catalyst;
1-3 parts of a curing agent;
1-3 parts of a silane coupling agent.
2. The phenolic resin according to claim 1, which specifically comprises the following raw materials in parts by weight:
45 parts of phenol;
50 parts of formaldehyde;
5 parts of acetone;
5 parts of ethanol;
5 parts of polyvinyl acetal;
4 parts of resorcinol;
10 parts of dioxane;
8 parts of acidic lignin;
10 parts of polyhydroxy compound;
2 parts of a catalyst;
1 part of a curing agent;
1 part of silane coupling agent.
3. The phenolic resin according to claim 1, wherein the solution of lignin is obtained by adding dioxane, acidic lignin and polyhydroxy compound into molten phenol, heating to reflux, cooling, and adjusting pH to neutral.
4. A process for the preparation of a phenolic resin as claimed in any of claims 1 to 3, comprising the steps of:
s1, adding phenol, acetone, ethanol, polyvinyl acetal and resorcinol into a reaction kettle, dissolving in water, and sequentially mixing in three stages, namely an A stage, a B stage and a C stage at the temperature of 30-120 ℃;
stage A: stirring at 30-60 deg.C for 15-30min at rotation speed of 800-1000r/min to obtain solution A;
and (B) stage: stirring at 60-70 deg.C for 10-15min at 1500-2000r/min, adding curing agent and silane coupling agent into solution A, and stirring for 5-15min to obtain solution B;
and C stage: adding the lignin solution into the solution B at 70-120 deg.C, stirring for 30-60min at 2000-3000r/min; preparation of phenolic resin solution
S2, cooling for 12-24h to prepare the phenolic resin.
5. Use of a phenolic resin as claimed in any one of claims 1 to 3 in the manufacture of moulding powders, grinding wheels, friction discs, bulb bonding, asbestos products, insulating panels or decorative panels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211302375.4A CN115521424A (en) | 2022-10-24 | 2022-10-24 | Phenolic resin and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211302375.4A CN115521424A (en) | 2022-10-24 | 2022-10-24 | Phenolic resin and preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115521424A true CN115521424A (en) | 2022-12-27 |
Family
ID=84702986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211302375.4A Pending CN115521424A (en) | 2022-10-24 | 2022-10-24 | Phenolic resin and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115521424A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107629181A (en) * | 2017-10-30 | 2018-01-26 | 湖南金泰检测检验有限公司 | Phenol-formaldehyde resin modified, modified phenolic resin grease article and its preparation method and application |
| CN112442155A (en) * | 2019-08-30 | 2021-03-05 | 山东圣泉新材料股份有限公司 | Phenolic resin and preparation method and application thereof |
-
2022
- 2022-10-24 CN CN202211302375.4A patent/CN115521424A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107629181A (en) * | 2017-10-30 | 2018-01-26 | 湖南金泰检测检验有限公司 | Phenol-formaldehyde resin modified, modified phenolic resin grease article and its preparation method and application |
| CN112442155A (en) * | 2019-08-30 | 2021-03-05 | 山东圣泉新材料股份有限公司 | Phenolic resin and preparation method and application thereof |
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