KR100201223B1 - Far-infrared radiating thermosetting resin compositions - Google Patents

Abstract

The present invention relates to a thermosetting resin composition, and more particularly, to a far-infrared radiation thermosetting molding composition having improved mechanical strength and heat resistance properties containing a far-infrared radiation ceramic.

An object of the present invention is to provide a far-infrared radiation thermosetting granular resin composition having good heat resistance characteristics such as high heat deformation temperature and high strength even at high temperature.

The present invention is far-infrared radiation thermosetting characterized in that the heat distortion temperature of the final cured product consisting of 65 to 85 parts by weight of the inorganic filler containing at least 2% by weight of far-infrared radiation ceramic powder and 15 to 35 parts by weight of the thermosetting resin. It is providing a granular resin composition.

The resin composition according to the present invention has far-infrared emissivity higher than that of conventional products, mechanical strength at room temperature (25 ° C.) is higher than existing products, and strength retention at high temperature (100 ° C.) is also high. The difference with the product is remarkable.

Description

Far Infrared Radiation Thermosetting Granular Resin Composition

The present invention relates to a far-infrared radiation thermosetting resin composition, in particular, far-infrared radiation thermosetting dry granules (powder shape, flake shape, pellet shape, tablet shape, etc.) having high strength and high heat resistance properties containing far infrared radiation ceramics. It is about composition.

In general, far-infrared radiation refers to a ceramic that radiates a large amount of light that belongs to a wavelength range of 5.6 µm to 1,000 µm, and a far-infrared radiation ceramic refers to a ceramic that radiates a large amount of far-infrared radiation within a wavelength range of about 5.6 µm to 35 µm. It is known to have effects such as antibacterial action, odor removal, promotion of blood circulation, maintenance of food freshness, promotion of plant growth, uniform heating of the heated object and shortening of heating time.

Therefore, in order to utilize the beneficial properties of such far-infrared radiation ceramics, many products formed by mixing the far-infrared radiation ceramic with a thermoplastic resin or a thermosetting resin have been manufactured.

However, products made of conventional far-infrared radiation resin compositions have the following disadvantages and improvement is desired.

First, when the thermoplastic resin is based, there is a limit in increasing the content of the inorganic filler and the reinforcing agent, including the far-infrared radiation ceramic.

Therefore, the mechanical properties are generally poor, in particular, the mechanical strength at high temperatures is significantly lowered and the heat deformation temperature is low. In addition, there is a limit to increase the content of the far-infrared radiation ceramics, there is no limit to the far-infrared emissivity.

second. When based on a thermosetting resin, the properties of the resin composition are typically a bulk molding compound (BMC), a sheet molding compound (SMC), a liquid, or a semisolid wet composition. This is because the mixing efficiency of the kneader impeller, etc. used at this time is low and low, because the compounding materials of these substrates should be a liquid having a low molecular weight and most of the hardeners are aliphatic liquid compounds with low heat resistance. to be.

Therefore, it is difficult to make the content of the inorganic filler including the far-infrared radiation ceramic up to about 70% by weight or more, and for this reason, the conventional far-infrared radiation thermosetting resin composition has a low inorganic content, so that the thermal deformation temperature is low and the mechanical strength at high temperature is low. It is not suitable for long time use at a temperature of 60 ℃ or higher because of poor heat resistance such as sudden drop.

In general, the higher the content of the inorganic filler including the far-infrared radiation ceramic in the resin composition, the higher the content of the molded article produced therefrom, the higher the flexural and compressive strength, the better the dimensional stability and wear resistance, the higher the heat deformation temperature, etc. Will have.

An object of the present invention is to provide a far-infrared radiation thermosetting resin composition having a high far-infrared emissivity by increasing the content of the far-infrared radiation ceramics.

Another object of the present invention is to provide a far-infrared radiation thermosetting granular resin composition capable of producing a molded article having high heat resistance and mechanical strength by increasing the content of an inorganic filler including a far-infrared radiation ceramic.

Unlike conventional blending methods, the inventors of the present invention increase the inorganic content including far-infrared radiation ceramics in the composition by dry blending rather than liquid or semi-solid blending to increase far-infrared emissivity as well as improve the mechanical and heat resistance properties. It became possible to provide a radiation thermosetting granular resin composition.

Such a high inorganic content resin composition may be obtained by melt blending or B-stage blending.

Far-infrared radiation thermosetting granular resin composition of the present invention, including 5 to 50% by weight of far-infrared radiation ceramic powder (a) based on the weight of the total composition, 65 to 85% by weight of inorganic filler (A) and thermosetting resin (B) 15 to 35 The heat distortion temperature of the final hardened | cured material is a composition obtained by dry blending the weight%, 200 degreeC or more.

Hereinafter, the present invention will be described in detail.

Far-infrared radiation ceramic (a) is a generic term for ceramics that radiates far infrared rays of approximately 5.6 µm to 35 µm with high efficiency, which is included in a wide range of inorganic fillers (A) at the same time.

As the inorganic filler (A), natural or artificial inorganic powders such as silica, alumina, calcium carbonate, fluorite, diatomaceous earth, talc, mica, hydrated alumina, sericite, glass beads, and glass powder can be used.

The thermosetting resin (B) is in a solid state at a room temperature of 55 ° C. or higher at a melting point capable of dry blending, melt blending, and B-stage (semicuring) the far-infrared radiation ceramic (a) and the inorganic filler (A), and the like. Epoxy resin, silicone resin, polyimide resin, diaryl phthalate resin, etc. which are 95 weight% or more are preferable.

Moreover, a phenol resin, melamine resin, urea resin, etc. are preferable.

The thermosetting resin serving as the substrate may be a liquid or semisolid resin within a range in which part of the thermosetting resin does not interfere with the mixing. For example, the liquid or semi-solid resin may be a silane coupling agent and tetraglycidyl diamino diphenylmethane epoxy resin in Example 1, an amino silane coupling agent in Example 2, and a silane coupling agent with the diaryl phthalate monomer of Example 3. The case of a ring agent corresponds to this.

In addition, the composition of the present invention may further contain inorganic or organic fibers such as glass fiber, carbon fiber, aramid fiber, asbestos, byron fiber, cellulose fiber, etc. as a reinforcing agent, the reinforcing agent is 1 to 35% by weight of the total weight of the composition It is preferable to set it as.

In addition, if necessary, the above-mentioned composition has an effective amount of plasticizer, flow improver, coupling agent, polymerization inhibitor, mold release agent, low shrinkage agent, antibacterial agent, antistatic agent, ultraviolet absorber, flame retardant, metal powder, magnetic powder, pigment, etc. Additives may also be added.

The far-infrared radiation thermosetting resin composition according to the present invention can be molded by compression molding, reaction injection molding, transfer molding, or the like. In addition, a natural pattern may be made by mixing molding two or more different resin compositions having different colors as necessary.

The invention will become more apparent from the following examples.

Example 1

end. Mixing of raw materials (resin 20% by weight + inorganic 80% by weight)

Diglycidyl ether bisphenol A epoxy resin (melting point 65 degreeC): 5 weight%

Cresol novolac type epoxy resin (melting point 80 ℃): 5 wt%

Tetraglycidyl Diamino Diphenylmethane Epoxy Resin: 2% by weight

CTBN (1300X13): 4 wt%

Diamino diphenyl sulfone: 3% by weight

Boron trifluoride monomethylamine: 0.5% by weight

Silane coupling agent: 0.5% by weight

Far Infrared Radiation Ceramic Powder: 15% by weight

Silica Powder: 50% by weight

Glass fiber: 15 wt%

I. Manufacturing method

The compounds were quenched by heat mixing for 5 minutes on an 8 inch roller and ground to produce a granular material. Next, compression molding was performed at 180 ° C. to make a plate having a thickness of 3 mm to measure far-infrared emissivity, heat deflection temperature (HDT) and strength. The far-infrared emissivity was 95% compared to the black body, and the heat distortion temperature measured by ASTM D648-56 was found to be 260 ° C. The strength is summarized in Table 1 together with other examples and comparative examples.

Example 2

end. Formulation of raw materials (resin 20 wt% + inorganic 80 wt%)

Silicone resin (Flake foam with melting point of 80 ° C): 19 wt%

Zinc fatty acid salt as a curing catalyst: 0.5% by weight

Amino silane coupling agent: 0.5% by weight

Far Infrared Radiation Ceramic Powder: 15% by weight

Silica Powder: 44.5 wt%

Glass fiber: 20 wt%

Other: 0.5 wt%

I. Manufacturing method

It prepared by the same method as in Example 1.

The far-infrared emissivity was 95% compared to the black body, and the heat distortion temperature measured by ASTM D648-56 was found to be 300 ° C. The strength is summarized in Table 1 together with other examples and comparative examples.

Example 3

end. Mixing of raw materials (35% by weight of resin + 65% of inorganic material)

Diaryl Phthalate Resin: 31% by weight

Diaryl Phthalate Monomer: 2 wt%

Silane Coupling Agent: 1% by weight

Thi-butylperbenzoate: 1 wt%

Polymerization inhibitor: 0.01 wt%

Silica powder: 30% by weight

Far Infrared Radiation Ceramic Powder: 15% by weight

Glass fiber: 20% by weight

I. Manufacture process

It prepared by the same method as in Example 1.

The far-infrared emissivity was 95% compared to the black body, and the heat distortion temperature measured by ASTM D648-56 was found to be 210 ° C. The strength is summarized in Table 1 together with other examples and comparative examples.

Example 4

end. Mixing of raw materials (resin 20 wt% + inorganic 80 wt%)

m, m'-DABP: 5% by weight

Silica Powder: 50% by weight

Far Infrared Radiation Ceramic Powder: 20% by weight

Glass fiber: 10% by weight

Other: 1 wt%

I. Manufacture process

It prepared by the same method as in Example 1.

The far infrared emissivity was 95% compared to the black body, and the heat distortion temperature measured by ASTM D648-56 was 300 ° C. The strength is summarized in Table 1 together with other examples and comparative examples.

Comparative Example 1

end. Blending raw materials (resin 60% by weight + inorganic 40% by weight)

Alumina Powder: 27.5 wt%

Silica Powder: 12.5 wt%

DGEBA epoxy resin (viscosity: 11,500 cps at 25 ° C): 50% by weight

Diethyl amino propyl amine: 10% by weight

I. Manufacture process

The compounds were mixed with a kneader to form a 3 mm thick molded article at 150 ° C. to measure far-infrared emissivity, heat deflection temperature (H.D.T) and strength.

Far-infrared emissivity was 85% compared to the black body, the heat distortion temperature measured by ASTM D648-56 appeared to be 75 ℃ and the strength is summarized in Table 1 together with the examples.

As shown in Table 1, the resin composition according to the present invention has a far-infrared emissivity higher than that of the existing product, and the mechanical strength at room temperature (25 ° C.) is higher than that of the existing product. The difference between the product and the existing product is noticeable.

According to the present invention, it is possible to increase the inorganic material including the far-infrared radiation ceramic and the reinforcing material in the thermosetting resin by 80%, thereby improving the far-infrared emissivity and mechanical strength, and providing a resin composition which is maintained at a high temperature at about the same temperature at room temperature. In addition, the heat deformation temperature is also increased to 200 ° C or higher.

Claims (3)

Obtained by dry blending or melt blending 65 to 85% by weight of the inorganic filler (A) and 15 to 35% by weight of the thermosetting resin (B), including 5 to 50% by weight of the far-infrared radiation ceramic powder (a) based on the total weight of the composition. Far-infrared radiation thermosetting granular resin composition whose heat distortion temperature of a final hardened | cured material is 200 degreeC or more. The far-infrared radiation thermosetting granular resin composition according to claim 1, wherein the thermosetting resin (B) is selected from an epoxy resin, a silicone resin, a polyimide resin, and a diaryl phthalate resin. The far-infrared radiation thermosetting granular resin composition according to claim 1, wherein the thermosetting resin (B) is selected from a phenol resin, a melamine resin, and a urea resin.