CN104974346A - Preparation method of liquid-crystal allyl-compound-modified bismaleimide resin - Google Patents
Preparation method of liquid-crystal allyl-compound-modified bismaleimide resin Download PDFInfo
- Publication number
- CN104974346A CN104974346A CN201510418690.7A CN201510418690A CN104974346A CN 104974346 A CN104974346 A CN 104974346A CN 201510418690 A CN201510418690 A CN 201510418690A CN 104974346 A CN104974346 A CN 104974346A
- Authority
- CN
- China
- Prior art keywords
- allyloxy
- phenyl ester
- phenylformic acid
- nitrae
- isosorbide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention relates to a liquid-crystal allyl-compound-modified bismaleimide resin and a preparation method thereof. The liquid-crystal allyl-compound-modified bismaleimide resin comprises a phenyl 1,4-di(4-allyloxybenzoate) liquid-crystal allyl compound, 2,2'-diallyl bisphenol A, a bismaleimide monomer and the like. The preparation method comprises the following steps: melting the phenyl 1,4-di(4-allyloxybenzoate) liquid-crystal allyl compound by heating; adding the 2,2'-diallyl bisphenol A, and uniformly mixing; controlling the temperature at 130-160 DEG C, adding the bismaleimide monomer while stirring to perform prepolymerization until the system becomes a uniform transparent red brown liquid; and cooling to room temperature to obtain the red brown transparent solid resin. The modified bismaleimide resin is soluble in acetone, chloroform and other conventional low-boiling solvents, and has favorable curability. The cured product has excellent heat resistance and toughness. Thus, the modified bismaleimide resin is a matrix resin of advanced polymer-base composite materials required by the fields of aerospace, electronics and electricity.
Description
Technical field
The invention belongs to organic high performance polymer material field, be specifically related to the preparation method of the bimaleimide resin of a kind of liquid crystal type allylic cpd modification.
Background technology
Bimaleimide resin is a kind of new type resin developed mid-term in 20th century, it has the thermotolerance of polyimide resin and the excellent processability of epoxy resin simultaneously, it is a kind of high-strength, high mold materials, can be used as advanced polymer matrix composite, but the cross-linking density of bismaleimide resin is large, toughness of products is poor, and its shock resistance and anti-stress cracking performance are also had a greatly reduced quality.For improving its shortcoming, domestic and international many investigators are devoted to the toughness reinforcing work of bimaleimide resin.
At present, conventional bimaleimide resin method of modifying has allylic cpd modification, aromatic diamine modification, thermoplastic resin modified and liquid crystalline cpd modification etc., but major part be all sacrifice bimaleimide resin other excellent properties to reach the toughness reinforcing object of bismaleimide resin.Therefore, on maintenance bimaleimide resin excellent properties basis, the toughness of raising bimaleimide resin and manufacturability have become the important content of performance resins research and development.In order to meet the high speed development of modern science and technology and industry, the research and development having a bimaleimide resin of outstanding toughness and superior heat resistance performance are extremely urgent and arise at the historic moment.
Document (Nie Wangyan, Li Yang, the .4 such as Xu Hongyao, the fabrication & properties [J] of 4' bis-(4-allyloxy phenylformic acid) phenyl ester bifunctional group liquid crystal. functional materials, 2009,40 (2): 342-344.) openly 1 is reported, the synthetic method of 4 '-two (4-allyloxy phenylformic acid) phenyl ester, but the document is just for a kind of bifunctional group liquid crystal monomer of synthesis, not follow-up report, also by Isosorbide-5-Nitrae, '-two (4-allyloxy phenylformic acid) phenyl ester is not used in the middle of the study on the modification of bimaleimide resin.
Summary of the invention
The present invention is in order to avoid to sacrifice other excellent properties of bimaleimide resin to realize toughness reinforcing deficiency, provide a kind of preparation method of liquid crystal type allylic cpd modified bismaleimide resin, to reach the object that toughness significantly improves while keeping bimaleimide resin excellent heat resistance energy.
For achieving the above object, the technical solution used in the present invention is employing 1,4-bis-(4-allyloxy phenylformic acid) phenyl ester class liquid crystal type allylic cpd associating 2,2 '-diallyl bisphenol, as properties-correcting agent, carries out toughening modifying to bimaleimide resin.Its concrete steps are as follows:
First by Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester class liquid crystal type allylic cpd heating and melting; But adding a certain amount of 2,2 '-diallyl bisphenol stirs; Finally add a certain amount of bismaleimide monomer in batches and stir pre-polymerization 30 ~ 90min in 130 DEG C ~ 160 DEG C, until system becomes homogeneous phase reddish-brown transparent liquid, obtain the bimaleimide resin of liquid crystal type allylic cpd modification.The prepolymer deaeration process obtained, after overcuring, obtains the bimaleimide resin cured article of liquid crystal type allylic cpd modification.
Described bismaleimide monomer is N, N '-4.4 '-diphenyl methane dimaleimide, N, N '-penylene bismaleimides and both mixtures
Described bismaleimide monomer amount of substance and 2, the ratio of 2 '-diallyl bisphenol and the total amount of substance of Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester class liquid crystal type allylic cpd is 1:0.8 ~ 1.
Described 2,2 '-diallyl bisphenol and Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester class liquid crystal type allylic cpd mol ratio are 1:0.1 ~ 0.6.
The present invention proposes a kind of preparation method of liquid crystal type allylic cpd modified bismaleimide resin, by modified bismaleimide resin prepared by present method, shock strength is maximum reaches 15.6MPa, than adding 2 merely, adds 90.2% during 2 '-diallyl bisphenol; Modulus in flexure and flexural strength is maximum can reach 4.24Gpa and 156.2Mpa respectively, and adds 2 merely, and 2 '-diallyl bisphenol modified bismaleimide resin is compared, and adds 11.58% and 19.24% respectively; T
5%heat decomposition temperature can reach 438 DEG C.The bimaleimide resin shock strength of obtained liquid crystal type allylic cpd modification, flexural strength and modulus in flexure and thermotolerance all increase.
Accompanying drawing explanation
Fig. 1 is the liquid crystal figure after Isosorbide-5-Nitrae '-two (4-allyloxy phenylformic acid) phenyl ester melting under polarizing microscope.
Fig. 2 is the thermogravimetric curve (N of the New Modified Bismaleimide Resin that embodiment one prepares
2, temperature rise rate 20 DEG C/min).
Fig. 3 is the SEM figure of the New Modified Bismaleimide Resin section that embodiment 1 prepares.
Embodiment
Now the present invention is described further in conjunction with the embodiments.
Embodiment 1
By 2.06g 1,4 '-two (4-allyloxy phenylformic acid) phenyl ester is in 165 DEG C of heating and meltings, add 13.26g 2, after the melting of 2 '-diallyl bisphenol, add 19.68g N again, N '-4.4 '-diphenyl methane dimaleimide monomer carries out melting copolymerization in 140 DEG C, until system becomes homogeneous phase reddish-brown transparent liquid, then insulation reaction, obtains modified bismaleimide resin.The resin obtained being put into temperature is that the vacuum drying oven of 140 DEG C carries out deaeration process 50min, then pours into be preheated to 140 DEG C and to be coated with to wipe in the mould of releasing agent to be cured, curing process is 180 DEG C/and 1h+210 DEG C/2h+250 DEG C/6h.Namely the bismaleimides cured resin of described liquid crystal type allylic cpd modification is obtained after solidification terminates.
Control group
Component is N, N '-1.4 '-diphenyl methane dimaleimide and 2,2 '-diallyl bisphenol;
By 14.98g 2,2 '-diallyl bisphenol is after 70 DEG C of heating and meltings, add 20.01g N, N '-4.4 '-diphenyl methane dimaleimide monomer carries out melting copolymerization in 140 DEG C, until system becomes homogeneous phase reddish-brown transparent liquid, then insulation reaction, obtains modified bismaleimide resin.The resin obtained being put into temperature is that the vacuum drying oven of 140 DEG C carries out deaeration process 50min, then pours into be preheated to 140 DEG C and to be coated with to wipe in the mould of releasing agent to be cured, curing process is 180 DEG C/and 1h+210 DEG C/2h+250 DEG C/6h.Namely described new modified bismaleimides cured resin is obtained after solidification terminates.
Embodiment 2
By 4.05g 1,4 '-two (4-allyloxy phenylformic acid) phenyl ester is in 165 DEG C of heating and meltings, add 11.59g 2, after the melting of 2 '-diallyl bisphenol, add 19.36g N again, N '-4.4 '-diphenyl methane dimaleimide monomer carries out melting copolymerization in 140 DEG C, until system becomes homogeneous phase reddish-brown transparent liquid, then insulation reaction, obtains modified bismaleimide resin.The prepolymer obtained being put into temperature is that the vacuum drying oven of 140 DEG C carries out deaeration process 50min, then pours into be preheated to 140 DEG C and to be coated with to wipe in the mould of releasing agent to be cured, curing process is 180 DEG C/and 1h+210 DEG C/2h+250 DEG C/6h.Namely the bismaleimides cured resin of described liquid crystal type allylic cpd modification is obtained after solidification terminates.
Embodiment 3
By 5.97g 1,4 '-two (4-allyloxy phenylformic acid) phenyl ester is in 165 DEG C of heating and meltings, add 9.98g 2, after the melting of 2 '-diallyl bisphenol, add 19.05g N again, N '-4.4 '-diphenyl methane dimaleimide monomer carries out melting copolymerization in 150 DEG C, until system becomes homogeneous phase reddish-brown transparent liquid, then insulation reaction obtains modified bismaleimide resin.The prepolymer obtained being put into temperature is that the vacuum drying oven of 150 DEG C carries out deaeration process 50min, then pours into be preheated to 150 DEG C and to be coated with to wipe in the mould of releasing agent to be cured, curing process is 180 DEG C/and 1h+210 DEG C/2h+250 DEG C/6h.Namely the bismaleimides cured resin of described liquid crystal type allylic cpd modification is obtained after solidification terminates.
Embodiment 4
By 7.84g 1,4 '-two (4-allyloxy phenylformic acid) phenyl ester is in 170 DEG C of heating and meltings, add 8.42g 2, after the melting of 2 '-diallyl bisphenol, add 18.75g N again, N '-4.4 '-diphenyl methane dimaleimide monomer carries out melting copolymerization in 150 DEG C, until system becomes homogeneous phase reddish-brown transparent liquid, then insulation reaction, obtains modified bismaleimide resin.The prepolymer obtained being put into temperature is that the vacuum drying oven of 150 DEG C carries out deaeration process 50min, then pours into be preheated to 150 DEG C and to be coated with to wipe in the mould of releasing agent to be cured, curing process is 180 DEG C/and 1h+210 DEG C/2h+250 DEG C/6h.Namely the bismaleimides cured resin of described liquid crystal type allylic cpd modification is obtained after solidification terminates.
Embodiment 5
By 9.64g 1,4 '-two (4-allyloxy phenylformic acid) phenyl ester is in 170 DEG C of heating and meltings, add 6.91g 2, after the melting of 2 '-diallyl bisphenol, add 18.45g N again, N '-4.4 '-diphenyl methane dimaleimide monomer carries out melting copolymerization in 150 DEG C, until system becomes homogeneous phase reddish-brown transparent liquid, then insulation reaction, obtains modified bismaleimide resin.The prepolymer obtained being put into temperature is that the vacuum drying oven of 150 DEG C carries out deaeration process 50min, then pours into be preheated to 150 DEG C and to be coated with to wipe in the mould of releasing agent to be cured, curing process is 180 DEG C/and 1h+210 DEG C/2h+250 DEG C/6h.Namely the bismaleimides cured resin of described liquid crystal type allylic cpd modification is obtained after solidification terminates.
Embodiment 6
By 11.39g 1,4 '-two (4-allyloxy phenylformic acid) phenyl ester is in 170 DEG C of heating and meltings, add 5.44g 2, after the melting of 2 '-diallyl bisphenol, add 18.17g N again, N '-4.4 '-diphenyl methane dimaleimide monomer carries out melting copolymerization in 150 DEG C, until system becomes homogeneous phase reddish-brown transparent liquid, then insulation reaction, obtains modified bismaleimide resin.The prepolymer obtained being put into temperature is that the vacuum drying oven of 150 DEG C carries out deaeration process 50min, then pours into be preheated to 150 DEG C and to be coated with to wipe in the mould of releasing agent to be cured, curing process is 180 DEG C/and 1h+210 DEG C/2h+250 DEG C/6h.Namely the bismaleimides cured resin of described liquid crystal type allylic cpd modification is obtained after solidification terminates.
The mechanical property of various embodiments of the present invention and resistance toheat and control group are contrasted, comparing result is respectively as shown in Table I and Table II:
The mechanical property parameters of Table I modification span system cured article
According to above-mentioned Table I data presentation, in contrast to and carry out modification with 2,2-diallyl bisphenol to bimaleimide resin merely, toughness and the intensity of the bimaleimide resin of liquid crystal type allylic cpd modification prepared by the present invention are significantly improved.
Table II modified quartz sand system cured article Thermal Decomposition Parameters
According to upper Table II data presentation, in contrast to and carry out modification with 2,2-diallyl bisphenol to bimaleimide resin merely, the bimaleimide resin base of liquid crystal type allylic cpd modification prepared by the present invention originally maintains original superior heat resistance performance.
Claims (8)
1. the preparation method of the bimaleimide resin of liquid crystal type allylic cpd modification, it is characterized in that, this bimaleimide resin comprises 1,4-bis-(4-allyloxy phenylformic acid) phenyl ester class liquid crystal type allylic cpd, 2,2 '--diallyl bisphenol and bismaleimides; Concrete preparation method is: first by Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester class liquid crystal type allylic cpd heating and melting; But adding 2,2 '-diallyl bisphenol stirs; The last bismaleimide monomer that in batches adds stirs pre-polymerization 30 ~ 90min, until system becomes homogeneous phase reddish-brown transparent liquid in 130 DEG C ~ 160 DEG C; Be cooled to room temperature, obtain the bimaleimide resin of liquid crystal type allylic cpd modification.
2. preparation method according to claim 1, is characterized in that, described Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester class liquid crystal type allylic cpd is Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester, 2-methyl isophthalic acid, 4-bis-(4-allyloxy phenylformic acid) phenyl ester, 2-ethyl-Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester, the 2-tertiary butyl-Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester, 2-nitro-Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester, 2-chloro-Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester, 2-bromo-Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester, 2,5-dimethyl-Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester, 2,6-dimethyl-Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester, 2,6-di-t-butyl-Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester, 2,3,5,6-tetra-chloro-Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester, 2,3,5,6-tetra-bromo-Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester, 2,3,5,6-tetra-fluoro-Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester, 2,3,5,6-tetra-fluoro-Isosorbide-5-Nitrae-two (3-methyl-4-allyloxy phenylformic acid) phenyl ester, one in 2,3,5,6-tetra-bromo-Isosorbide-5-Nitrae-two (2,3,4-allyloxy phenylformic acid) phenyl ester or mixture.
3. preparation method according to claim 1 and 2, is characterized in that, described bismaleimides is N, N '-4.4 '-diphenyl methane dimaleimide, N, N ' one in-penylene a bismaleimides or both mixtures.
4. preparation method according to claim 1 and 2, it is characterized in that, the mass ratio of described bismaleimide monomer amount of substance and diallyl bisphenol and the total material of Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester class liquid crystal type allylic cpd is 1:0.8 ~ 1.
5. preparation method according to claim 3, it is characterized in that, the mass ratio of described bismaleimide monomer amount of substance and diallyl bisphenol and the total material of Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester class liquid crystal type allylic cpd is 1:0.8 ~ 1.
6. preparation method according to claim 1 and 2, is characterized in that, 2 '-diallyl bisphenol and Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester class liquid crystal type allylic cpd mol ratio are 1:0.1 ~ 0.6.
7. preparation method according to claim 3, is characterized in that, 2 '-diallyl bisphenol and Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester class liquid crystal type allylic cpd mol ratio are 1:0.1 ~ 0.6.
8. preparation method according to claim 4, is characterized in that, 2 '-diallyl bisphenol and Isosorbide-5-Nitrae-two (4-allyloxy phenylformic acid) phenyl ester class liquid crystal type allylic cpd mol ratio are 1:0.1 ~ 0.6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510418690.7A CN104974346B (en) | 2015-07-16 | 2015-07-16 | A kind of preparation method for the bimaleimide resin that liquid crystal type allyl compound is modified |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510418690.7A CN104974346B (en) | 2015-07-16 | 2015-07-16 | A kind of preparation method for the bimaleimide resin that liquid crystal type allyl compound is modified |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104974346A true CN104974346A (en) | 2015-10-14 |
| CN104974346B CN104974346B (en) | 2017-07-11 |
Family
ID=54271341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510418690.7A Active CN104974346B (en) | 2015-07-16 | 2015-07-16 | A kind of preparation method for the bimaleimide resin that liquid crystal type allyl compound is modified |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104974346B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106977717A (en) * | 2017-04-26 | 2017-07-25 | 黑龙江省科学院石油化学研究院 | A kind of ester group compound containing alkenyl and preparation method thereof and the bimaleimide resin using its modification |
| CN109988305A (en) * | 2017-12-29 | 2019-07-09 | 深圳光启尖端技术有限责任公司 | Modified bismaleimide resin and preparation method thereof |
| CN110643321A (en) * | 2019-09-24 | 2020-01-03 | 苏州益可泰电子材料有限公司 | Electronic material glue solution and application thereof |
| CN110684353A (en) * | 2019-09-24 | 2020-01-14 | 江苏立一新材料科技有限公司 | High-performance friction material and application thereof |
| CN110734546A (en) * | 2019-09-24 | 2020-01-31 | 江苏立一新材料科技有限公司 | Self-repairing wear-resistant material and application thereof |
| CN110746776A (en) * | 2019-09-24 | 2020-02-04 | 江苏立一新材料科技有限公司 | Flame-retardant wear-resistant material and application thereof |
| CN112480669A (en) * | 2020-11-05 | 2021-03-12 | 航天特种材料及工艺技术研究所 | High-toughness and high-temperature-resistant bismaleimide resin and preparation method thereof |
| CN112662178A (en) * | 2020-12-22 | 2021-04-16 | 广东盈骅新材料科技有限公司 | Modified bismaleimide prepolymer and preparation and application thereof |
| CN113831461A (en) * | 2021-09-28 | 2021-12-24 | 泉州师范学院 | Bismaleimide/acrylic acid liquid crystal photosensitive resin-based composition and application thereof in 405nm3D printing |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1156733A (en) * | 1996-12-23 | 1997-08-13 | 四川联合大学 | Dimaleic type liquid crystal polyimide and its preparing process |
| EP1016659A1 (en) * | 1998-12-29 | 2000-07-05 | Dainippon Ink And Chemicals, Inc. | Bismaleimides comprising mesogenic groups and oligomeric liquid crystalline bismaleimides |
| CN101768269A (en) * | 2008-12-29 | 2010-07-07 | 冯星起 | Bismaleimides resin pre-polymer preparation method |
| CN102167825A (en) * | 2011-03-11 | 2011-08-31 | 南京航空航天大学 | Bismaleimide resin for microdiameter pultrusion process and preparation method thereof |
-
2015
- 2015-07-16 CN CN201510418690.7A patent/CN104974346B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1156733A (en) * | 1996-12-23 | 1997-08-13 | 四川联合大学 | Dimaleic type liquid crystal polyimide and its preparing process |
| EP1016659A1 (en) * | 1998-12-29 | 2000-07-05 | Dainippon Ink And Chemicals, Inc. | Bismaleimides comprising mesogenic groups and oligomeric liquid crystalline bismaleimides |
| CN101768269A (en) * | 2008-12-29 | 2010-07-07 | 冯星起 | Bismaleimides resin pre-polymer preparation method |
| CN102167825A (en) * | 2011-03-11 | 2011-08-31 | 南京航空航天大学 | Bismaleimide resin for microdiameter pultrusion process and preparation method thereof |
Non-Patent Citations (3)
| Title |
|---|
| BERNARD FACHE ET AL: "New adhesives: Bismaleimide liquid crystals containing polymethylene flexible groups and aramide–arylate mesogen groups", 《INTERNATIONAL JOURNAL OF ADHESION & ADHESIVES》 * |
| YINGFENG YU ET AL: "Synthesis and Cure of Liquid Crystalline Diallyl Modifiers for Bismaleimide Resin", 《JOURNAL OF APPLIED POLYMER SCIENCE》 * |
| 聂王焰 等: "4 ,4" 二(4-烯丙氧基苯甲酸)苯酯双功能基团液晶体的制备与性能", 《功能材料》 * |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106977717A (en) * | 2017-04-26 | 2017-07-25 | 黑龙江省科学院石油化学研究院 | A kind of ester group compound containing alkenyl and preparation method thereof and the bimaleimide resin using its modification |
| CN106977717B (en) * | 2017-04-26 | 2019-03-26 | 黑龙江省科学院石油化学研究院 | A kind of ester group compound containing alkenyl and preparation method thereof and the bimaleimide resin being modified using it |
| CN109988305A (en) * | 2017-12-29 | 2019-07-09 | 深圳光启尖端技术有限责任公司 | Modified bismaleimide resin and preparation method thereof |
| CN110746776A (en) * | 2019-09-24 | 2020-02-04 | 江苏立一新材料科技有限公司 | Flame-retardant wear-resistant material and application thereof |
| CN110684353A (en) * | 2019-09-24 | 2020-01-14 | 江苏立一新材料科技有限公司 | High-performance friction material and application thereof |
| CN110734546A (en) * | 2019-09-24 | 2020-01-31 | 江苏立一新材料科技有限公司 | Self-repairing wear-resistant material and application thereof |
| CN110643321A (en) * | 2019-09-24 | 2020-01-03 | 苏州益可泰电子材料有限公司 | Electronic material glue solution and application thereof |
| CN110684353B (en) * | 2019-09-24 | 2021-12-03 | 江苏立一新材料科技有限公司 | High-performance friction material and application thereof |
| CN110746776B (en) * | 2019-09-24 | 2021-12-10 | 江苏立一新材料科技有限公司 | Flame-retardant wear-resistant material and application thereof |
| CN112480669A (en) * | 2020-11-05 | 2021-03-12 | 航天特种材料及工艺技术研究所 | High-toughness and high-temperature-resistant bismaleimide resin and preparation method thereof |
| CN112662178A (en) * | 2020-12-22 | 2021-04-16 | 广东盈骅新材料科技有限公司 | Modified bismaleimide prepolymer and preparation and application thereof |
| WO2022134589A1 (en) * | 2020-12-22 | 2022-06-30 | 广东盈骅新材料科技有限公司 | Modified bismaleimide prepolymer, preparation method therefor, and application thereof |
| CN113831461A (en) * | 2021-09-28 | 2021-12-24 | 泉州师范学院 | Bismaleimide/acrylic acid liquid crystal photosensitive resin-based composition and application thereof in 405nm3D printing |
| CN113831461B (en) * | 2021-09-28 | 2023-11-21 | 泉州师范学院 | Bismaleimide/acrylic acid liquid crystal photosensitive resin-based composition and application thereof in 405nm3D printing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104974346B (en) | 2017-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104974346A (en) | Preparation method of liquid-crystal allyl-compound-modified bismaleimide resin | |
| CN101654518B (en) | Thermosetting polyimide resin and preparation method and application thereof | |
| CN111333817B (en) | Bio-based furan epoxy resin polymer and preparation method and application thereof | |
| CN101831173B (en) | Bi-phthalonitrile resin glass fiber composite material toughened by poly(arylene ether nitrile) and preparation method thereof | |
| Wang et al. | Phthalonitrile terminated fluorene based copolymer with outstanding thermal and mechanical properties | |
| CN106633860A (en) | Liquid crystal polyester resin complex with low dielectric constant and preparation method of liquid crystal polyester resin complex | |
| CN102850545A (en) | High-toughness high-heat-resistant poly-benzoxazine/ bismaleimide blending resin and preparation method thereof | |
| WO2023221619A1 (en) | Epoxy resin batch for composite material pultrusion and preparation method therefor | |
| CN104177640A (en) | Method for preparing cyanate prepreg | |
| CN107011657A (en) | A kind of high-ductility bimaleimide resin and its preparation method and application | |
| CN103012790B (en) | Bisphthalonitrile-amino phenoxy phthalonitrile copolymer and condensate, and glass fiber composite material and preparation method thereof | |
| CN101456953A (en) | Organosilane modified bisphenol A cyanate ester resin and preparation method thereof | |
| CN1493600A (en) | Preparation method and application of modified double maleimide resin | |
| TWI796409B (en) | thermosetting resin composition | |
| CN103665326A (en) | Thermosetting cyanate/bismaleimide resin composition | |
| CN101570599A (en) | Cyanate/bisoxazoline co-cured resin and preparation method and application thereof | |
| CN1155646C (en) | Modified dimaleimide resin capable of being used to transfer molding and its prepn | |
| CN106751819A (en) | A kind of RTM techniques cyanate resin composition and preparation method | |
| CN106633706A (en) | Full-aromatic polyester resin compound, preparation method thereof and application | |
| CN105017530B (en) | Prepolymer, polymer and its methods for making and using same of a kind of fragrant cyano resins of RTM | |
| CN106675021A (en) | Modified wholly-aromatic liquid crystal polyester resin composite and preparation method thereof | |
| CN105348530A (en) | Method for preparing bismaleimides resin prepolymer system according to liquid forming technology | |
| He et al. | High performance toughened cyanate ester resin with low injection temperature for RTM process | |
| CN101735458B (en) | Low melt viscosity ethylene rhodanate/bimaleimide resin, preparation method and application thereof | |
| CN111574712B (en) | Low-melting-point bismaleimide resin monomer eutectic and preparation method thereof, bismaleimide resin composition and preparation method of bismaleimide resin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20151014 Assignee: Jiangsu Xinyang new material Limited by Share Ltd Assignor: Dalian University of Technology Contract record no.: 2019320010013 Denomination of invention: Preparation method of liquid-crystal allyl-compound-modified bismaleimide resin Granted publication date: 20170711 License type: Exclusive License Record date: 20190328 |
|
| EE01 | Entry into force of recordation of patent licensing contract |