CN115514723A - Exchange frame and cluster router - Google Patents

Abstract

The application provides a switching frame and a cluster router, which are used for reducing insertion loss, crosstalk and power consumption of the switching frame. The switching frame comprises a plurality of first switching network boards, wherein a first switching chip, a first optical module and a plurality of groups of first signal transmission assemblies are arranged on each first switching network board, each first switching chip comprises a plurality of links, and the plurality of links of each first switching chip can be evenly distributed to the plurality of first optical modules; the first optical module comprises a plurality of links, and the plurality of links of the first optical module can be evenly distributed to a plurality of first switching chips; the first signal transmission assembly comprises a first connector, a second connector and a first cable, the first connector is arranged close to the first exchange chip, and the first end of the first connector is connected with part of links of the first exchange chip; the second connector is arranged close to the first optical module, and the first end of the second connector is connected with part of the link of the first optical module; two ends of the first cable are respectively connected with the second end of the first connector and the second end of the second connector.

Description

Exchange frame and cluster router

Technical Field

The present application relates to the field of electronic devices, and in particular, to a switching frame and a cluster router.

Background

The new service of 5G and cloud era brings 25-30% of flow increase to a backbone network every year, and the physical cluster router provides a new way for solving the problems that the single-machine capacity reaches the limit, the network structure is more and more complex and the like in the core network node evolution by virtue of the characteristics of high reliability, non-blocking forwarding and high-capacity smooth expansion. The most core of the cluster technology is the switching system, the physical multi-frame cluster technology connects a plurality of service frames through independent switching frames, and the switching frames are used for realizing data exchange among the service frames. In the switching frame, the switching chip of the switching network board is connected with the optical module in a cross-sharing manner, which results in an excessively long connection routing length between the switching chip and the optical module which are diagonally arranged, and with the continuous improvement of transmission rate, the insertion loss and power consumption of the switching network board are also significantly increased, which now becomes a key reason for hindering the capacity upgrade of the cluster router.

Disclosure of Invention

The application provides a switching frame and a cluster router, which are used for reducing insertion loss, crosstalk and power consumption of the switching frame.

In a first aspect, the present application provides a switch frame, which may include a plurality of first switch network boards, where each first switch network board may be provided with a first switch chip, a first optical module, and a plurality of groups of first signal transmission assemblies. The first switch chip may include a plurality of links, and the plurality of links of the first switch chip may be equally distributed to the plurality of first optical modules; the first optical module may also include a plurality of links, which may also be evenly distributed to the plurality of first switch chips. The first signal transmission assembly may be configured to connect the link of the first switch chip with the link of the first optical module, and may include a first connector, a second connector, and a first cable, the first connector may be disposed near the first switch chip, and a first end of the first connector may be connected with a portion of the link of the first switch chip; a second connector may be disposed adjacent to the first optical module, a first end of the second connector may be connected with a portion of the link of the first optical module; two ends of the first cable are respectively connected with the second end of the first connector and the second end of the second connector, so that the link of the first exchange chip can be connected with the link of the first optical module, and signal transmission between the first exchange chip and the first optical module is realized.

In the above scheme, the link of the first switch chip and the link of the first optical module may be interconnected through the first signal transmission component, and under the condition that the distance between the link of the first switch chip and the link of the first optical module is relatively long, the problems of insertion loss and power consumption caused by signal routing interconnection may be solved, and in addition, the problems of signal delay, large power consumption, difficult heat dissipation and the like caused by the scheme of using the clock data recovery chip may also be avoided.

In a specific configuration, the link of the first switch chip may include a transmission link and a reception link, and the link of the first optical module may also include a transmission link and a reception link. In the same group of first signal transmission assemblies, the terminals at the first end of the first connector may all be used for connecting the transmit link of the first switch chip, and the terminals at the first end of the second connector may all be used for connecting the receive link of the first optical module, and at this time, the first signal transmission assemblies are only used for transmitting signals in the transmit direction. Alternatively, the terminals of the first end of the first connector may all be used for connecting the receiving link of the first switching chip, and the terminals of the first end of the second connector may all be used for connecting the transmitting link of the first optical module, in this case, the first signal transmission assembly is only used for transmitting signals in the receiving direction. That is to say, the first signal transmission assembly is only used for transmitting signals in the same direction, so that physical transmission medium separation of high-speed signals in the sending direction and the receiving direction can be achieved, and crosstalk between the signals in the sending direction and the receiving direction can be reduced.

In some possible embodiments, the number of the first switch chips and the number of the first optical modules may be multiple, the multiple first switch chips may be disposed in a column at a position close to a first side of the first switch network board, the multiple first optical modules may be disposed in a column at a position close to a second side of the first switch network board, and the first side and the second side of the first switch network board are disposed opposite to each other. The first exchanging chip is approximately in a rectangular structure and comprises a first side edge, a second side edge, a third side edge and a fourth side edge which are sequentially connected, wherein the first side edge is the side edge of the first exchanging chip close to the first side of the first exchanging screen plate, and the third side edge is the side edge of the first exchanging chip close to the second side of the first exchanging screen plate. As can be understood, the first side is the side farthest from each of the first optical modules. The links of the first switching chip are distributed on the four sides of the first switching chip, and the first end of the first connector can be connected with part of the links on the first side of the first switching chip. That is, part of the link at the first side may be connected to the first optical module through the first signal transmission assembly, so that the scheme of using a clock data recovery chip may be avoided, which is beneficial to improving the signal transmission quality of the first switching network board and reducing the production cost thereof.

In some possible embodiments, a signal transmission direction, that is, a transmission direction, sent by the first switch chip and received by the first optical module, is high in demand for a low-loss transmission medium, so that the first end of the first connector may be specifically connected to a transmission link on the first side of the first switch chip, and the second connector may be connected to a reception link of the first optical module, so that signal transmission is performed in the transmission direction by using the first signal transmission assembly, which is favorable for reducing the insertion loss of the first switch board.

In addition, apart from the first side edge, the distance between the end of the second side edge close to the first side edge and the first optical module is relatively far, so that the first end of the first connector is also used for being connected with the link of the end of the second side edge close to the first side edge, and the link of the end of the second side edge close to the first side edge can be connected with the first optical module through the first signal transmission assembly, so that the scheme of adopting a clock data recovery chip can be avoided, the signal transmission quality of the first exchange network board is improved, and the production cost of the first exchange network board is reduced. Similarly, the link at the end of the fourth side close to the first side may also be connected to the first optical module through the first signal transmission assembly.

In some possible embodiments, the first end of the first connector may be specifically connected to a transmission link at an end of the second side of the first switch chip close to the first side, and the second connector may be connected to a reception link of the first optical module, so that the first signal transmission assembly is utilized to perform signal transmission in the transmission direction, which is favorable for reducing the insertion loss of the first switch board. Similarly, the transmitting link at the end of the fourth side close to the first side may also be connected to the first optical module through the first signal transmission assembly.

In some possible embodiments, the first end of the first connector may be further connected to a receiving link on the first side of the first switch chip, and the first end of the second connector may be used to connect to a transmitting link of the first optical module. That is, the receiving link at the first side of the first switch chip may also be connected to the transmitting link of the first optical module through the first signal transmission component. Similarly, the receiving link at the end of the second side close to the first side may also be connected to the transmitting link of the first optical module through the first signal transmission assembly, and the receiving link at the end of the fourth side close to the first side may also be connected to the transmitting link of the first optical module through the first signal transmission assembly.

In other possible embodiments, a plurality of signal traces may be disposed on the first switch board. The receiving link at the first side of the first switch chip may also be connected to the transmitting link of the first optical module through a signal trace. That is to say, in the receiving direction with relatively small loss, the first switch chip and the first optical module may be connected by signal traces. The design can separate the physical transmission media of the high-speed channel in the sending direction and the receiving direction, and can reduce the number of the first signal transmission assemblies on the premise of keeping the overall low loss of the first exchange network board, thereby being beneficial to reducing the product cost of the first exchange network board.

Similarly, the receiving link at the end of the second side close to the first side may also be connected to the transmitting link of the first optical module through a signal trace; and a receiving link at one end of the fourth side edge close to the first side edge can also be connected with a sending link of the first optical module through signal wiring, so that the product cost of the first switching network board is further reduced.

In some possible embodiments, the transmitting link at the third side of the first switch chip may be connected to the receiving link of the first optical module through a signal trace, and the receiving link at the third side of the first switch chip may also be connected to the transmitting link of the first optical module through a signal trace. In this case, the length of the signal trace connecting the first switch chip and the first optical module is relatively short, and therefore, the generated insertion loss is also relatively small.

In some possible embodiments, a transmission link at one end of the second side of the first switch chip, which is close to the third side, may be connected to a receiving link of the first optical module through a signal trace, and a receiving link at one end of the second side of the first switch chip, which is close to the third side, may also be connected to the transmission link of the first optical module through a signal trace. The lengths of the signal traces are also relatively short, and therefore, the insertion loss generated is also small.

In some possible real-time solutions, the first switching network board is provided with a plurality of first tracks. The first end of the first connector and the link of the first exchange chip can be connected through the first routing, and when the first connector and the link of the first exchange chip are specifically arranged, the length of the first routing is not more than 10cm, so that the loss caused by the first routing is relatively small, and the influence on the whole loss of the first exchange network board is also small.

Similarly, the first exchange network board is provided with a plurality of second wires. The first end of the second connector can be connected with the link of the first optical module through a second routing wire, and when the first connector is specifically set, the length of the second routing wire is not more than 10cm, so that the loss caused by the second routing wire is relatively small, and the influence on the whole loss of the first exchange network board is also small.

In some possible real-time schemes, the first connector and the second connector can be tightly attached to the surface of the first exchange screen, and the height of the first connector and the height of the second connector do not exceed 4mm, so that the influence on an air inlet channel and an air outlet channel of the air-cooling heat dissipation module on the first exchange screen is small, and the first exchange screen can keep good heat dissipation performance.

In a second aspect, the present application further provides a cluster router, where the cluster router may include a plurality of service boxes, an optical fiber, and a switch box in any of the foregoing possible embodiments. The service frame may include a plurality of second switch network boards, each of which is provided with a plurality of second switch chips and a plurality of second optical modules, wherein each of the second switch chips and the second optical modules includes a plurality of links, the links of the second switch chips are connected to the links of the corresponding second optical modules, the second optical modules are connected to the first optical modules through optical fibers, and data transmission between the service frame and the switch frame can be implemented by using photoelectric signal conversion of the first optical modules and the second optical modules. The loss and power consumption of the cluster router are relatively small because the loss and power consumption of the switch frame are reduced.

In some possible real-time schemes, a plurality of sets of second signal transmission components may be further disposed on the second switch network board, and the second signal transmission components may include a third connector, a fourth connector, and a second cable, where the third connector is disposed near the second switch chip, and a first end of the third connector may be connected to a part of the link of the second switch chip; the fourth connector is arranged close to the second optical module, and a first end of the fourth connector can be connected with part of links of the second optical module; two ends of the second cable are respectively connected with the second end of the third connector and the second end of the fourth connector, so that the link of the second switching chip can be connected with the link of the second optical module, and signal transmission between the second switching chip and the second optical module is realized. In the scheme, the link of the second switch chip and the link of the second optical module can be interconnected through the second signal transmission assembly, and under the condition that the distance between the link of the second switch chip and the link of the second optical module is relatively long, the problems of insertion loss and overlarge power consumption generated when signal wiring interconnection is adopted can be solved, and in addition, the problems of signal delay, large power consumption, difficult heat dissipation and the like caused by the adoption of the clock data recovery chip scheme can be avoided.

In a specific configuration, the link of the second switch chip may include a transmission link and a reception link, and the link of the second optical module may also include a transmission link and a reception link. In the same group of second signal transmission assemblies, the terminals at the first end of the third connector may all be used for connecting the transmit link of the second switch chip, and the terminals at the first end of the fourth connector may all be used for connecting the receive link of the second optical module, and at this time, the second signal transmission assemblies are only used for transmitting signals in the transmit direction. Alternatively, the terminals of the first end of the third connector may all be used for connecting the receiving link of the second switch chip, and the terminals of the first end of the fourth connector may all be used for connecting the transmitting link of the second optical module, in this case, the second signal transmission assembly is only used for transmitting signals in the receiving direction. That is to say, the second signal transmission assembly is only used for transmitting signals in the same direction, so that physical transmission medium separation of high-speed signals in the sending direction and the receiving direction can be achieved, and crosstalk between the signals in the sending direction and the receiving direction can be reduced.

In some possible real-time solutions, the second switching network board is provided with a plurality of third traces. The first end of the third connector and the link of the second exchange chip can be connected through the third wire, and when the third connector and the second exchange chip are specifically arranged, the length of the second wire does not exceed 10cm, so that the loss caused by the second wire is relatively small, and the influence on the overall loss of the second exchange network board is also small.

Similarly, the second switch board is provided with a plurality of fourth wires. The first end of the fourth connector is connected with a link of the second optical module through a fourth wire, and when the fourth wire is specifically set, the length of the fourth wire is not more than 10cm, so that the loss caused by the fourth wire is relatively small, and the influence on the overall loss of the second switching network board is also small.

Drawings

Fig. 1 is a schematic structural diagram of a cluster router provided in an embodiment of the present application;

FIG. 2 is a schematic diagram of the structure of the first switching net panel shown in FIG. 1;

FIG. 3 is a schematic diagram of a first switching network board according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of a second exchange network board provided in an embodiment of the present application.

Reference numerals:

100-service box; 200-exchange frame; 300-an optical fiber; 110-line cards; 120-a second switching network board; 121-a second switching chip;

122-a second light module; 210-a first switching network board; 211-a first switching chip; 212 — a first light module;

2101-first side of first switching network board; 2102-a second side of the first switch screen; 10-a first signal transmission component;

11-a first connector; 12-a second connector; 13-a first cable; 2111 — high speed link of first switch chip;

21101-first side; 21102-second side; 21103-third side; 21104-fourth side;

20-a second signal transmission component; 21-a third connector; 22-a fourth connector; 23-a second cable; 1201-a first daughter board;

1202-second daughter board.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.

The new service of 5G and cloud era brings 25-30% of flow increase to a backbone network every year, and the physical cluster router provides a new way for solving the problems that the single-machine capacity reaches the limit, the network structure is more and more complex and the like in the core network node evolution by virtue of the characteristics of high reliability, non-blocking forwarding and high-capacity smooth expansion. The trunking technology is an effective technology for solving the problem of expansibility, and can meet the requirements of high-speed service increase and network performance and capacity improvement by using a relatively low-cost head end on the premise of convenient maintenance and no increase of network complexity, thereby reducing the construction cost and the maintenance cost of a network.

The cluster router connects two or more common core routers in a certain way, so that the core routers can work cooperatively and process in parallel, the smooth expansion of system capacity is realized, and the cluster router only represents one logic router to the outside. The scheme is also called as a router matrix or multi-chassis (multi-chassis) interconnection technology, and a plurality of independent switching networks are cascaded to form a multi-stage and multi-plane switching matrix system by adopting a Parallel Packet Switching (PPS) technology, so that the limit of a single case in the aspects of switching capacity, power consumption, heat dissipation and the like is broken through, and a router switching system with larger capacity is realized.

At present, when communication devices such as routers realize capacity expansion in a manner of cascading between machine frames, a scheme of setting a switch frame is generally adopted, and the switch frame is used to realize data exchange between each service frame. Referring to fig. 1, fig. 1 is a schematic structural diagram of a cluster router provided in the embodiment of the present application. The cluster router may include a service box 100 and a switch box 200, and the service box 100 and the switch box 200 may be connected by an optical fiber 300. The number of the service frames 100 may be m, and the number of the switching frames 200 may be n, at this time, the cluster router is an n-drive system, that is, the m service frames 100 are interconnected through the n switching frames 200. In this embodiment, m may take values of 2, 4, 8, 16, etc., and n may take values of 1, 2, 4, etc. The number of the service boxes 100 and the switching boxes 200 shown in fig. 1 is only an exemplary illustration, and does not limit the specific structure of the cluster router according to the embodiment of the present application.

The service frame 100 may include a plurality of line cards 110 and a plurality of switch network boards 120, and the line cards 110 are respectively connected to the switch network boards 120. In a specific implementation, the service frame 100 may further include a backplane (not shown), and the line card 110 and the switch board 120 may be connected to the backplane through board-to-board (board) connectors, respectively, and further the connection between the line card 110 and the switch board 120 is implemented by using the backplane. The switch network board 120 may be provided with a plurality of switch chips 121 and an optical module 122, where the optical module 122 has an optical interface capable of sending and receiving optical signals, and the optical module 122 may be configured to receive an electrical signal sent by the switch chip 121, convert the electrical signal into an optical signal, and output the optical signal through the optical interface, receive an optical signal input through the optical interface, convert the optical signal into an electrical signal, and send the electrical signal to the switch chip 121.

The switch frame 200 may include a plurality of switch boards 210, and a plurality of switch chips 211 and optical modules 212 are also disposed on the switch boards 210. For the sake of description differentiation, hereinafter, the switching network board 210 in the switching frame 200 is referred to as a first switching network board 210, the switching network board 120 in the service frame 100 is referred to as a second switching network board 120, the switching chip 211 and the optical module 212 on the first switching network board 210 are referred to as a first switching chip 211 and a first optical module 212, respectively, and the switching chip 121 and the optical module 122 on the second switching network board 120 are referred to as a second switching chip 121 and a second optical module 122, respectively.

The first optical module 212 of the first switch network board 210 may be connected to the second optical modules 122 of the plurality of service frames 100, and in a specific implementation, the first optical module 212 also has an optical interface capable of sending and receiving optical signals, and the optical interface of the first optical module 212 may be connected to the optical interface of the second optical module 122 through an optical fiber. In the service frame 100, the electrical signal sent by the line card 110 may be transmitted to the second switch chip 121 of the second switch network board 120 through the backplane, the second switch chip 121 may convert the received electrical signal into an optical signal through the second optical module 122, and then transmit the optical signal to the first optical module 212 through the optical fiber, the optical signal is converted into an electrical signal by the first optical module 212 and is sent to the corresponding first switch network board 210, and after data exchange is performed in the first switch network board 210, the optical signal is sent to other service frames 100 through the first optical module 212, thereby implementing data exchange between different service frames 100.

Fig. 2 is a schematic diagram of the structure of the first exchange net board shown in fig. 1. Referring to fig. 1 and fig. 2 together, in this embodiment, the number of the first switch chips 211 and the number of the first optical modules 212 may be multiple, and exemplarily, the number of the first switch chips 211 may be a, the number of the first optical modules 212 may be B, and both a and B are integers greater than or equal to 2. Similarly, the number of the first switch chips 211 and the first optical modules 212 shown in fig. 1 is only an exemplary illustration, and does not limit the specific structure of the first switch network board 210 according to the embodiment of the present application.

When the first switching chips 211 and the first optical modules 212 are specifically designed to be arranged in a row, the first switching chips 211 and the first optical modules 212 may be respectively located at two opposite sides of the first switching network board 210, for example, the row of the first switching chips 211 may be located near the first side 2101 of the first switching network board 210, and the row of the first optical modules 212 may be located near the second side 2012 of the first switching network board 210.

The first switch chip 211 may include C transmit chains and C receive chains, where C may be an integer greater than or equal to 100. In a specific setting, the C transmit links and the C receive links may be distributed around the first switch chip 211. The first optical module 212 may include D transmit chains and D receive chains, where D may be an integer greater than or equal to 10. The first switch chip 211 and the first optical module 212 are cross-equally connected, specifically, a transmission link and a reception link of each first switch chip 211 can be equally allocated to each first optical module 212, a transmission link and a reception link of each first optical module 212 can also be equally allocated to each first switch chip 211, and an equal-equally constraint relationship of D/a = C/B is satisfied between the first switch chip 211 and the first optical module 212.

For example, the number a of the first switch chips 211 may be 2, and the number C of the transmission links and the reception links of each first switch chip 211 may be 192; the number B of the first optical modules 212 may be 32, and the number D of the transmission and reception links of each first optical module 212 may be 12. 192 transmission links and reception links of the first switch chip 211 are equally distributed to 32 first optical modules 212, and each first optical module 212 bears 6 transmission links and 6 reception links of each first switch chip 211; the 12 transmit and receive links of the first optical module 212 are equally distributed to 2 first switch chips 211, and each first switch chip 211 bears 6 transmit and receive links of each first optical module 212.

With reference to fig. 1, for the first switch chip 211 and the first optical module 212 that are relatively far away from each other, for example, when the first switch chip 211 and the first optical module 212 are diagonally arranged and equally connected, the diagonal routing length between the link distributed on the left side of the first switch chip 211 and the first optical module 212 may often exceed 15 inches (inch), and when the transmission rate is upgraded to 56Gpbs, the insertion loss and the power consumption of the first switch board 210 may significantly increase, which has become a key reason for hindering the capacity upgrade of the cluster router. It should be noted that the terms of the orientations such as "left" and "right" used by the first switch board 210 in the embodiment of the present application are mainly explained according to the orientation of the first switch board 210 shown in fig. 1, and do not form a limitation on the orientation of the first switch board 210 in an actual application scenario.

In the prior art, the traditional solution to solve the insertion loss is to use a Printed Circuit Board (PCB) with lower loss and configure a larger number of Clock Data Recovery (CDR) chips. The CDR chip can be used as a transfer node of the long link, and the link which is directly driven on the exchange chip and cannot reach the optical module can be relayed through the CDR chip, and the CDR chip receives the reconstruction signal and then forwards the reconstruction signal to the first optical module. This scheme causes a certain signal delay, and the higher the transmission rate of the signal is, the more CDR chips are required, which results in a significant increase in product cost. In addition, the excessive number of CDR chips occupies more layout area on the PCB, which further reduces the size of the heat dissipation device on the PCB, and further makes the implementation of the heat dissipation scheme of the entire switching network board extremely difficult, even requiring the replacement of the air cooling heat dissipation scheme with the liquid cooling heat dissipation scheme. The liquid cooling heat dissipation scheme not only can further increase the product cost, but also can cause the upgrading difficulty of the served cluster router in the existing machine room environment, and destroy the characteristic of large-capacity smooth expansion of the cluster router, thereby causing the upgrading and the generation-breaking of the cluster router platform.

Another more common solution to address insertion loss is to use an optical module with a cable. One end of the cable is connected with the tail part of the optical module, and a plurality of high-speed channels in the receiving direction and the sending direction of each optical module are positioned in the same cable; the other end of the cable is connected with the board-to-board connector, is connected with the PCB where the exchange chip is located through the board-to-board connector, and is further connected with the sending link and the receiving link on the exchange chip through the wiring on the PCB. In practical application, the difference between the insertion loss driving capability in the receiving direction and the transmitting direction of high-speed signal transmission between the switch chip and the optical module is large, and research shows that the difference between the insertion loss driving capability in the "transmitting direction of the switch chip and the optical module" (referred to as transmitting direction for short) and the insertion loss driving capability in the "receiving direction of the optical module and the switch chip" (referred to as receiving direction for short) can reach 10dB, and the requirement of the transmitting direction on a low-loss transmission medium is far higher than that in the receiving direction.

According to the scheme, the multiple high-speed channels in the receiving direction and the sending direction are located in the same cable, physical transmission media in the sending direction and the receiving direction are not separated, and due to the fact that the low loss requirements of the transmission media and the receiving direction are different, even if the high-speed PCB with the lowest loss is used, the loss requirement in the sending direction cannot be met, the loss allowance in the receiving direction is too large, and therefore board waste and product cost improvement are caused.

In view of this, an embodiment of the present application provides a first switching network board, where the first switching chip and the first optical module are interconnected by using a connector, so that on the premise of reducing insertion loss, not only can the problems of signal delay, large power consumption, and difficulty in heat dissipation caused by using a CDR chip scheme be solved, but also physical transmission medium separation of high-speed channels in the sending direction and the receiving direction can be achieved, thereby reducing crosstalk between signals in the sending direction and the receiving direction, and reducing overall cost of a product.

Referring first to fig. 3, fig. 3 is a schematic structural diagram of a first switching network board according to an embodiment of the present application. The first switch board 210 in this embodiment may be a multi-layer circuit board, and in practical implementation, the number of layers of the first switch board 210 may be designed according to actual requirements, for example, the first switch board 210 may include 8, 16, 24 or more sub-boards, which is not limited in this application. In addition to the first switch chip 211 and the first optical module 212, the first switch board 210 in this embodiment may further include a first signal transmission assembly 10, and the first signal transmission assembly 10 may include a first connector 11, a second connector 12, and a first cable 13. The first connector 11 and the second connector 12 are respectively disposed on the first switch board 210, and both may be disposed on the same daughter board, or may be disposed on different daughter boards, and may be specifically designed according to the disposed positions of the first switch chip 211 and the first optical module 212.

Illustratively, the first connector 11 may be disposed near the first switching chip 211, the second connector 12 may be disposed near the first optical module 212, and the first connector 11 may be connected with the high-speed link 2111 of the first switching chip 211, and the second connector 12 may be connected with the high-speed link of the first optical module 212. Both ends of the first cable 13 may be connected to the first connector 11 and the second connector 12, respectively, so as to connect the high-speed link of the first switch chip 211 with the high-speed link of the first optical module 212, thereby implementing signal transmission between the first switch chip 211 and the first optical module 212.

In this embodiment, the first switch chip 211 may include a first side 21101, a second side 21102, a third side 21103 and a fourth side 21104, which are sequentially connected, where the first side 21101 may be a side of the first switch chip 211 close to the first side 2101 of the first switch board 210, that is, a side of the first switch chip 211 far away from the first optical module 212, and the third side 21103 may be a side of the first switch chip 211 close to the second side 2102 of the first switch board 210, that is, a side of the first switch chip 211 close to the first optical module 212. It can be understood that the high-speed link 2111 on the first switch chip 211, which is distributed on one side of the first side 21101, is farthest from the first optical module 212, the high-speed link 2111 is distributed on the second side 21102 near one end of the first side 21101, and similarly, the high-speed link is distributed on the fourth side 21104 near one end of the first side 21101. During specific design, the high-speed links 2111 and the first optical module 212 can be connected through the first signal transmission assembly 10, so that the problems of signal delay, high power consumption, difficulty in heat dissipation and the like caused by using a CDR chip are solved.

Illustratively, each first switch chip 211 may be connected to each first optical module 212 through multiple sets of first signal transmission assemblies 10, that is, multiple first connectors 11 may be disposed at each first switch chip 211, for example, the embodiment shown in fig. 3 is illustrated by taking four first connectors 11 disposed at each first switch chip 211 as an example. The first connectors 11 of the respective groups of first signal transmission assemblies 10 may be respectively connected with N high-speed links of the first switch chip 211, and the N high-speed links connected by each first connector 11 are all transmission links or all reception links. Illustratively, the value of N may be 8, 16, 24, etc.

Accordingly, the second connectors 12 of each group of the first signal transmission assemblies 10 can be respectively connected with N high-speed links of the corresponding one or more first optical modules 212, and the N high-speed links connected by the second connectors 12 are all receiving links or all transmitting links. It is understood that each first cable 13 also includes N transmission links, and each first cable 13 can carry N high-speed signals between the first switch chip 211 and the first optical module 212, where the N high-speed signals are all signals sent by the first switch chip 211 to the first optical module 212 or all signals sent by the first optical module 212 to the first switch chip 211. That is to say, the first cables 13 in each set of the first signal transmission assemblies 10 are only used for transmitting signals in the same direction, and there is no situation of simultaneously sending or receiving signal transmission in two directions, so that physical transmission medium separation of high-speed signals in the sending direction and the receiving direction can be achieved, and further crosstalk between signals in the sending direction and the receiving direction can be reduced.

In some embodiments, for the first switch chip 211, the transmitting link on the first side 21101 and the receiving link of the first optical module 212 may be connected through the first signal transmission assembly 10, and the receiving link on the first side 21101 and the transmitting link of the first optical module 212 may also be connected through the first signal transmission assembly 10; similarly, the transmission links on the left sides of the second side 21102 and the fourth side 21104 and the reception link of the first optical module 211 may be connected through the first signal transmission module 10, and the reception links on the left sides of the second side 21102 and the fourth side 21104 and the transmission link of the first optical module 212 may also be connected through the first signal transmission module 10. That is, in these high-speed links, the signal transmission medium in both the transmission direction and the reception direction may be the first signal transmission assembly 10.

In some other embodiments, considering that the difference between the insertion/loss driving capability of the transmission direction and the receiving direction of the signal between the first switch chip 211 and the first optical module 212 is large, the transmission link on the first side 21101 and the receiving link of the first optical module 212 may be connected through the first signal transmission assembly 10, and the receiving link on the first side 21101 and the transmission link of the first optical module 212 may be connected through the signal trace on the first switch network board 210. The same is true. The transmission links on the left sides of the second side 21102 and the fourth side 21104 and the reception link of the first optical module 212 may be connected through the first signal transmission assembly 10, and the reception links on the left sides of the second side 21102 and the fourth side 21104 and the transmission link of the first optical module 212 may be connected through signal routing on the first switch board 210. That is, in the transmitting direction with relatively large loss, the first switch chip 211 and the first optical module 212 are connected through the first signal transmission assembly 10, and in the receiving direction with relatively small loss, the first switch chip 211 and the first optical module 212 are connected through signal routing. The design can not only separate the physical transmission media of the high-speed channel in the sending direction and the receiving direction, but also reduce the number of the first signal transmission components 10 on the premise of keeping the overall low loss of the first switching network board 210, thereby being beneficial to reducing the product cost of the first switching network board 210.

Taking the signal transmission medium in the sending direction as the first signal transmission assembly 10 and the signal transmission medium in the receiving direction as the signal traces, in this embodiment of the present application, the first exchange network board 210 may be provided with a plurality of first traces and a plurality of second traces, one end of the first trace is connected to the sending link on the first side 21101 of the first exchange chip 211, and the other end of the first trace may be connected to the terminal on the first end of the first connector 11 through the pad structure; one end of the second wire is connected to the receiving link of the first optical module 212, and the other end of the second wire may be connected to the terminal at the first end of the second connector 12 through a pad structure; both ends of the first cable 13 are connected to the terminals at the second end of the first connector 11 and the terminals at the second end of the second connector 12, respectively. At this time, the signal transmission path between the first switch chip 211 and the first optical module 212 is specifically the first switch chip 211, the first trace, the first connector 11, the first cable 13, the second connector 12, the second trace, and the first optical module 212. It can be understood that the transmission links on the left side of the second side 21102 and the fourth side 21104 may also be connected to the first connector 11 through the first trace, and the description thereof is omitted.

In order to reduce the lengths of the first traces and the second traces, in the embodiment of the present application, the first connector 11 may be specifically disposed on the first switch board 210 near the first side 21101 of the first switch chip 211, or near the positions on the left side of the second side 21102 and the fourth side 21104 of the first switch chip 211. The second connector 12 may be disposed on a side of the first optical module 212 close to the first switch chip 211. After the first connector 11 and the second connector 12 of each first signal transmission assembly 10 are connected by the first cable 13, the plurality of first cables 13 on the first switch board 210 are distributed in a substantially diagonal cross manner, and the plurality of first cables 13 present an approximately "X" type structural layout.

Referring to fig. 3, the number on the first connector 11 may indicate the length of a first trace between the first connector 11 and the first switch chip 211, and the number on the second connector 12 indicates the length of a second trace between the second connector 12 and the first optical module 212. It can be seen that the lengths of the wires between each first connector 11 and the first switch chip 211 and between each second connector 12 and the first optical module 212 do not exceed 10cm, so that the loss generated by the first wire and the second wire is relatively small, and the influence on the overall loss of the first switch network board 210 is small.

In addition, in the embodiment of the present application, the first connector 11 and the second connector 12 can be tightly attached to the surface of the first exchange network board 210, the heights of the two connectors do not exceed 4mm, and the influence on the air inlet channel and the air outlet channel of the air-cooling heat dissipation module on the first exchange network board 210 is small, so that the first exchange network board 210 can maintain good heat dissipation performance, and the working reliability is high.

It should be noted that, for high-speed links at other positions on the first switch chip 211, that is, high-speed links distributed on one side of the third side 21103, and high-speed links at one end of the second side 21102 and one end of the fourth side 21104 close to the third side 21103, distances between the high-speed links and the first optical module 212 are relatively short, and therefore the high-speed links can be connected to the first optical module 212 through signal traces on the first switch network board 210. In this case, since the length of the signal trace connecting the first switch chip 211 and the first optical module 212 is relatively short, the generated insertion loss is also relatively small, and the influence on the overall loss of the first switch board 210 is small. In specific implementation, the transmitting link at one side of the third side 21103 may be connected to the receiving link of the first optical module 212 through signal routing, and the receiving link at one side of the third side 21103 may also be connected to the transmitting link of the first optical module 212 through signal routing; similarly, the transmit links on the right side of the second side 21102 and the fourth side 21104 and the receive link of the first optical module 212 may also be connected by signal traces. That is, in these high-speed links, the signal transmission medium in both the transmit direction and the receive direction can be signal traces.

In addition, in the prior art, for the second switching network board in the service frame, when the second switching chip is connected to the second optical module, the CDR chip is also used as a transit node, so that the second switching network board also has the problem of too large insertion loss. Based on the same principle, the second switch chip and the second optical module can also be connected in a similar manner to the foregoing embodiment, so as to reduce the power consumption and cost of the second switch network board.

Referring to fig. 4, fig. 4 is a schematic structural diagram of a second switching network board according to an embodiment of the present application. The second switch board 120 in the embodiment of the present application may also be a multi-layer circuit board, and in specific implementation, the number of the daughter boards of the second switch board 120 may be designed according to actual requirements, which is not limited in the present application. The second switch chip 121 and the second optical module 122 may be provided on the same daughter board, or may be provided on different daughter boards. In addition to the second switch chip 121 and the second optical module 122, the second switch board 120 may include a second signal transmission assembly 20, and the second signal transmission assembly 20 may include a third connector 21, a fourth connector 22, and a second cable 23. Wherein the third connector 21 and the fourth connector 22 are respectively disposed on the second switch board 120, exemplarily, the third connector 21 may be disposed near the second switch chip 121, the fourth connector 22 may be disposed near the second optical module 122, and the third connector 21 is connected with the high-speed link of the second switch chip 121, and the fourth connector 22 is connected with the high-speed link of the second optical module 122. Both ends of the second cable 23 may be connected to the third connector 21 and the fourth connector 22, respectively, so as to connect the high-speed link of the second switch chip 121 with the high-speed link of the second optical module 122, thereby implementing signal transmission between the second switch chip 121 and the second optical module 122.

In some embodiments, the second switch chip 121 may be disposed on the first sub-board 1201 of the second switch net board 120, for example, may be disposed in a first area of the first sub-board 1201, and a plurality of the second switch chips 121 may be disposed in a row in the first area. The second optical modules 122 may be disposed on the second daughter board 1202 of the second switching network board 120, and the second optical modules 122 may also be disposed in a column on the second daughter board 1202. In a specific implementation, the second sub-board 1202 may partially overlap with the first sub-board 1201, and a projection of the second sub-board 1202 on the first sub-board 1201 is located outside the first area. In this case, the third connector 21 may be provided in the first region of the first daughter board 1201, the fourth connector 22 may be provided in the second daughter board 1202, and the second cable 23 may be connected between the third connector 21 and the fourth connector 22 across boards.

Illustratively, each second switch chip 121 may be connected with the second optical module 122 through a plurality of sets of second signal transmission assemblies 20, and thus a plurality of third connectors 21 may be disposed at each second switch chip 121. The third connectors 21 of the respective groups of second signal transmission assemblies 20 may be respectively connected with M high-speed links of the second switch chip 121, and the M high-speed links connected by each third connector 21 are all transmission links or all reception links. Illustratively, M may take on values of 8, 16, 24, and so on.

Accordingly, the fourth connectors 22 of the second transmission assemblies 20 of each group may be respectively connected to M high-speed links of the corresponding one or more second optical modules 122, and all of the M high-speed links connected by the fourth connectors 22 are receiving links or all of the M high-speed links are transmitting links. It is understood that each second cable 23 also includes M transmission links, and each second cable 23 can carry M high-speed signals between the second switch chip 121 and the second optical module 122, where the M high-speed signals are all signals sent by the second switch chip 121 to the second optical module 122, or all signals sent by the second optical module 122 to the second switch chip 121. That is to say, the second cables 23 in each set of second signal transmission assemblies 20 are only used for transmitting signals in the same direction, and there is no situation of simultaneously transmitting or receiving signal transmission in two directions, so that physical transmission medium separation of high-speed signals in the transmitting direction and the receiving direction can be realized, and further crosstalk between signals in the transmitting direction and the receiving direction can be reduced.

In the embodiment of the present application, the transmission link of the second switch chip 121 and the reception link of the second optical module 122 may be connected through the second signal transmission component 20, and the reception link of the second switch chip 121 and the transmission link of the second optical module 122 may also be connected through the second signal transmission component 20. That is, between the second switch chip 121 and the second optical module 122, the signal transmission medium in both the transmission direction and the reception direction may be the second signal transmission assembly 20. In the second signal transmission module 20 shown in fig. 4, the second cable 23 is schematically shown by a solid line to indicate that the second signal transmission module 20 is a transmission medium in the transmission direction, and the second cable 23 is schematically shown by a broken line to indicate that the second signal transmission module 20 is a transmission medium in the reception direction.

During specific setting, a plurality of third wires may be disposed on the first sub-board 1201, one end of the third wire is connected to the transmission link of the second switch chip 121, and the other end of the third wire may be connected to the terminal at the first end of the third connector 21 through the pad structure; a plurality of fourth wires may be disposed on the second daughter board 1202, one end of each fourth wire is connected to the receiving link of the second optical module 122, and the other end of each fourth wire may be connected to the terminal at the first end of the fourth connector 22 through a pad structure; both ends of the second cable 23 are connected to the terminals at the second ends of the third and fourth connectors 21 and 22, respectively. It can be seen that, in the sending direction, the signal transmission path between the second switch chip 121 and the second optical module 122 is specifically the second switch chip 121, the third trace, the third connector 21, the second cable 23, the fourth connector 22, the fourth trace, and the second optical module 122.

It can be understood that the third trace may also be used to connect the receiving link of the second switch chip 121 with the third connector 21, and similarly, the fourth trace may also be used to connect the transmitting link of the second optical module 122 with the fourth connector 22. At this time, in the receiving direction, the signal transmission path between the second switch chip 121 and the second optical module 122 is specifically the second optical module 122-the fourth trace-the fourth connector 22-the second cable 23-the third connector 21-the third trace-the second switch chip 121.

In order to reduce the lengths of the third wire and the fourth wire, in this embodiment, the third connector 21 may be specifically disposed on the first sub-board 1201 near the second switch chip 121, and the fourth connector 22 may be disposed on the second sub-board 1202 near the second optical module 122. In this embodiment, the lengths of the wires between each third connector 21 and the second switch chip 121 and between each fourth connector 22 and the second optical module 122 do not exceed 10cm, so that the loss generated by the third wire and the fourth wire is relatively small, and the influence on the overall loss of the second switch network board 120 is small. After the third connector 21 and the fourth connector 22 of each second signal transmission assembly 20 are connected by the second cable 23, the plurality of second cables 23 on the second switch board 120 may be arranged in a substantially horizontal parallel manner.

In addition, in this embodiment of the application, the third connector 21 and the fourth connector 22 can be tightly attached to the surface of the second exchange network board 120, the heights of both are not more than 4mm, and the influence on the air inlet channel and the air outlet channel of the air-cooled heat dissipation module on the second exchange network board 120 is small, so that the second exchange network board 120 can maintain good heat dissipation performance, and the working reliability is high.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (17)

1. A switching frame is characterized by comprising a plurality of first switching network boards, wherein a first switching chip, a first optical module and a plurality of groups of first signal transmission assemblies are arranged on each first switching network board, and the switching frame comprises:

the first switching chip comprises a plurality of links, and the plurality of links of the first switching chip can be evenly distributed to the plurality of first optical modules;

the first optical module comprises a plurality of links, and the plurality of links of the first optical module can be evenly distributed to a plurality of first switching chips;

the first signal transmission assembly comprises a first connector, a second connector and a first cable, the first connector is arranged close to the first switching chip, and a first end of the first connector is connected with a part of links of the first switching chip; the second connector is arranged close to the first optical module, and a first end of the second connector is connected with a part of links of the first optical module; and two ends of the first cable are respectively connected with the second end of the first connector and the second end of the second connector.

2. The switch block of claim 1, wherein the link of the first switch chip comprises a transmit link and a receive link, the link of the first optical module comprises a transmit link and a receive link;

in the same group of the first signal transmission assemblies, the terminals at the first end of the first connector are all used for connecting the transmission link of the first switching chip, and the terminals at the first end of the second connector are all used for connecting the reception link of the first optical module; or,

the terminals at the first end of the first connector are all used for connecting the receiving link of the first switching chip, and the terminals at the first end of the second connector are all used for connecting the transmitting link of the first optical module.

3. The switch frame of claim 2, wherein the first switch board includes a first side and a second side opposite to each other, the first switch chip and the first optical module are respectively plural in number, the plural first switch chips are disposed in a column near the first side of the first switch board, and the plural first optical modules are disposed in a column near the second side of the first switch board;

the first exchange chip comprises a first side edge, a second side edge, a third side edge and a fourth side edge which are sequentially connected, the first side edge is arranged close to the first side of the first exchange screen plate, and the third side edge is arranged close to the second side of the first exchange screen plate;

the links of the first switching chip are distributed on each side edge, and the first end of the first connector is connected with part of the links on the first side edge of the first switching chip.

4. The switch frame of claim 3, wherein a first end of the first connector is connected to a transmit link on a first side of the first switch chip, and a first end of the second connector is connected to a receive link of the first optical module.

5. The switching frame according to claim 3 or 4, wherein the first end of the first connector is connected to a portion of the link of the second side of the first switching chip near the first side end; and the first end of the first connector is connected with a part of links of the fourth side edge of the first exchange chip close to one end of the first side edge.

6. The switch frame of claim 5, wherein the first end of the first connector is connected to the transmit link of the second side of the first switch chip near the end of the first side; the first end of the first connector is connected with a sending link of the fourth side of the first exchange chip, which is close to one end of the first side;

a first end of the second connector is connected with a receive link of the first optical module.

7. The switch frame of any of claims 3-6, wherein a first end of the first connector is connected to a receive link on a first side of the first switch chip; the first end of the first connector is connected with a receiving link of the second side of the first exchange chip, which is close to one end of the first side; the first end of the first connector is connected with a receiving link at one end of the fourth side edge of the first exchange chip close to the first side edge;

the first end of the second connector is connected with the transmission link of the first optical module.

8. The switching frame according to any one of claims 3 to 6, wherein the first switching network board is provided with a plurality of signal traces;

a receiving link at a first side of the first switching chip is connected with a transmitting link of the first optical module through the signal routing; a receiving link at one end of the second side edge of the first switching chip, which is close to the first side edge, is connected with a sending link of the first optical module through the signal routing; and a receiving link at one end of the fourth side of the first switching chip, which is close to the first side, is connected with the sending link of the first optical module through the signal routing.

9. The switching frame according to any one of claims 3 to 8, wherein the first switching network board is provided with a plurality of signal traces;

a transmitting link at the third side of the first switching chip is connected with a receiving link of the first optical module through the signal routing; and a receiving link at the third side of the first switching chip is connected with a transmitting link of the first optical module through the signal routing.

10. The switching frame according to any one of claims 3 to 9, wherein the first switching network board is provided with a plurality of signal traces;

a sending link at one end of the second side of the first switching chip close to the third side is connected with a receiving link of the first optical module through the signal routing; a receiving link at one end of the second side of the first switching chip close to the third side is connected with a sending link of the first optical module through the signal routing;

a transmitting link at one end of a fourth side of the first switching chip close to the third side is connected with a receiving link of the first optical module through the signal routing; and a receiving link at one end of the fourth side of the first switching chip close to the third side is connected with a sending link of the first optical module through the signal routing.

11. The switching frame according to any one of claims 1 to 10, wherein the first switching network board is provided with a plurality of first traces, the first end of the first connector is connected to the link of the first switching chip through the first traces, and the length of the first traces is less than 10cm.

12. The switching frame according to any one of claims 1 to 11, wherein the first switching network board is provided with a plurality of second wires, the first end of the second connector is connected to the link of the first optical module through the second wires, and the length of the second wires is less than 10cm.

13. A cluster router comprising a plurality of service frames, an optical fiber and a switching frame according to any one of claims 1 to 12, wherein the service frames comprise a plurality of second switching network boards, and a plurality of second switching chips and a plurality of second optical modules are disposed on the second switching network boards, wherein:

the second switch chip and the second optical module respectively comprise a plurality of links, the links of the second switch chip are connected with the corresponding links of the second optical module, and the second optical module is connected with the first optical module through the optical fiber.

14. The cluster router of claim 13, wherein a plurality of sets of second signal transmission components are further disposed on the second switch fabric;

the second signal transmission assembly comprises a third connector, a fourth connector and a second cable, the third connector is arranged close to the second switching chip, and a first end of the third connector is connected with a part of links of the second switching chip; the fourth connector is arranged close to the second optical module, and a first end of the fourth connector is connected with a part of links of the second optical module; and two ends of the second cable are respectively connected with the second end of the third connector and the second end of the fourth connector.

15. The cluster router of claim 14, wherein the links of the second switch chip comprise a transmit link and a receive link, and the links of the second optical module comprise a transmit link and a receive link;

in the same group of the second signal transmission assemblies, the terminals at the first end of the third connector are all used for connecting the transmission link of the second switch chip, and the terminals at the first end of the fourth connector are all used for connecting the reception link of the second optical module; or,

and the terminals at the first end of the third connector are all used for connecting the receiving link of the second switching chip, and the terminals at the first end of the fourth connector are all used for connecting the transmitting link of the second optical module.

16. The cluster router according to any one of claims 13 to 15, wherein the second switch board is provided with a plurality of third traces, the first end of the third connector is connected to the link of the second switch chip through the third traces, and the length of the third traces is less than 10cm.

17. The cluster router according to any one of claims 13 to 16, wherein the second switch board is provided with a plurality of fourth wires, a first end of the fourth connector is connected to the link of the second optical module through the fourth wires, and a length of the fourth wires is less than 10cm.

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