CN115514193A - Power device and manufacturing method thereof - Google Patents

Power device and manufacturing method thereof Download PDF

Info

Publication number
CN115514193A
CN115514193A CN202211438853.4A CN202211438853A CN115514193A CN 115514193 A CN115514193 A CN 115514193A CN 202211438853 A CN202211438853 A CN 202211438853A CN 115514193 A CN115514193 A CN 115514193A
Authority
CN
China
Prior art keywords
air
igbt
air guide
adjusting assembly
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202211438853.4A
Other languages
Chinese (zh)
Other versions
CN115514193B (en
Inventor
石顺风
季虎
马义飞
马威
高镇军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Situoruiji Technology Co ltd
Original Assignee
Hangzhou Situoruiji Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Situoruiji Technology Co ltd filed Critical Hangzhou Situoruiji Technology Co ltd
Priority to CN202211438853.4A priority Critical patent/CN115514193B/en
Publication of CN115514193A publication Critical patent/CN115514193A/en
Application granted granted Critical
Publication of CN115514193B publication Critical patent/CN115514193B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20945—Thermal management, e.g. inverter temperature control

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention provides a power device, comprising: the air conditioner comprises an IGBT module, an absorption capacitor corresponding to the IGBT module, a radiator, an air guide assembly, a direct current support capacitor and an air volume adjusting assembly; the direct current support capacitor is positioned on the upper part of the air guide assembly; the radiator is positioned at the back of the IGBT module; the radiator is clamped between the air quantity adjusting assembly and the air guide assembly; the first end of the air guide assembly is of a closed structure, and the second end of the air guide assembly is an air duct outlet; the air quantity adjusting assembly, the radiator and the air guide assembly form an inverted L-shaped air direction circulation air duct; the air volume adjusting component comprises a plurality of areas with different hole densities and a partition structure for partitioning the radiator into a plurality of areas; the hole density of the area on the same side of the first end of the air quantity adjusting assembly and the air guide assembly is higher than that of the area on the same side of the second end of the air quantity adjusting assembly and the air guide assembly. The invention solves the heat dissipation problem of the power module, and simultaneously realizes the good current sharing characteristic, good heat dissipation uniformity and compact structure of the power module, conforms to the design of the conventional power module and has lower cost.

Description

Power device and manufacturing method thereof
Technical Field
The invention relates to the field of power electronics, in particular to a power device and a manufacturing method thereof.
Background
IGBTs are important core elements of power electronic power devices. In order to meet the power requirement, the commonly used IGBT parallel connection schemes include direct parallel connection, inverter bridge parallel connection, inverter parallel connection and the like, wherein the direct parallel connection technical scheme becomes a commonly used parallel connection mode at the present stage due to the low cost. In the parallel use process of the IGBT, the consistency of the current equalizing characteristic and the heat dissipation characteristic is better, and the use performance of the power device is better.
Fig. 1-4 are diagrams of three power device wind paths obtained for a direct parallel IGBT in the prior art. The symmetrical layout of the IGBTs of the power device shown in the figure 1 ensures that the current equalizing characteristic is good, but because the air duct is arranged along one end of the IGBT, the temperature of the IGBT close to the air inlet is the lowest, the temperature of the IGBT close to the air outlet is the highest, the actual working temperature is gradually increased along with the air inlet to the air outlet of the air duct, the operating life of the IGBT is further influenced by the difference of the working temperature, and the operating life of the whole power unit is further influenced. The power device shown in fig. 2 considers the current sharing characteristic and the heat dissipation working condition, the symmetrical layout of the IGBTs ensures that the current sharing characteristic is better, the IGBTs are arranged in parallel along the air duct to ensure that the actual working temperatures of the parallel-connected IGBTs are close, but the width of the power module is the sum of the height of the capacitor and the height of the heat radiator due to the staggered installation of the capacitor and the air duct of the heat radiator, the occupied width is too large, and the structure compactness is poor. If the scheme shown in fig. 2 is changed to the scheme shown in fig. 3 in order to improve the compactness of the structure, that is, the IGBT and the capacitor are arranged on the same side to overcome the defect of too wide width, hot air at the air outlet of the radiator is directly blown to the capacitor, which affects the service life of the capacitor. The power device shown in fig. 4 considers current flow equalizing characteristic, heat dissipation working condition and compactness, the symmetrical layout of the IGBTs ensures that the current flow equalizing characteristic is good, the IGBTs are arranged in parallel along the air duct to ensure that the actual working temperatures of the multiple parallel IGBTs are close, the structure is compact, the wire inlet and wire outlet positions of the conventional power device are reversed, the design scheme of the whole structure is not met, and the increased position adjustment of the wire inlet and the wire outlet increases the cost of the power module.
Therefore, the power module scheme of the parallel IGBT in the prior art cannot meet the low-cost requirement of the conventional power module design, such as good current sharing characteristic, good heat dissipation uniformity and compact structure.
Disclosure of Invention
In order to solve the problem that a power module of a parallel IGBT in the prior art cannot simultaneously meet the low-cost requirements of good current sharing characteristic, good heat dissipation uniformity and compact structure which meet the design of a conventional power module, the invention provides a power device, which comprises:
the air conditioner comprises at least two IGBT modules arranged in parallel, absorption capacitors corresponding to the at least two IGBT modules, a radiator, an air guide assembly, a direct current support capacitor and an air volume adjusting assembly;
the direct current supporting capacitor is positioned on the upper part of the air guide assembly; the radiator is positioned at the back of at least two IGBT modules; the radiator is clamped between the air quantity adjusting assembly and the air guide assembly; the first end of the air guide assembly is of a closed structure, and the second end of the air guide assembly is an air duct outlet; the air quantity adjusting assembly, the radiator and the air guide assembly form an inverted L-shaped air direction circulation air duct;
the air volume adjusting assembly comprises a plurality of areas with different hole densities and a dividing structure for dividing the radiator into a plurality of areas; the hole density of the area on the same side of the air quantity adjusting assembly and the first end of the air guide assembly is higher than the hole density of the area on the same side of the air quantity adjusting assembly and the second end of the air guide assembly.
Preferably, the plurality of regions with different hole densities of the air volume adjusting assembly and the plurality of regions divided by the dividing structure of the air volume adjusting assembly form a plurality of air channels with similar air speeds for radiating the at least two IGBT modules.
Preferably, the power device further includes: a laminated busbar; one end of the laminated busbar is connected with the direct current support capacitor, and the other end of the laminated busbar is connected with at least two IGBT modules; one end of the absorption capacitor is connected with the input end of the IGBT module, and the other end of the absorption capacitor is connected with the wiring end of the laminated busbar.
Preferably, the power device further includes: and the alternating current input copper bar is connected with the alternating current input ends of the at least two IGBT modules and outputs the at least two IGBT modules after being connected in parallel.
Preferably, the power device further includes: and the metal frame is directly connected with the direct current supporting capacitor, the radiator, the air guide mechanism and the air volume adjusting assembly.
Preferably, the power device further includes: and the IGBT driving adapter plate is connected with the IGBT close to the second end of the air guide assembly.
Preferably, the power device further includes: the IGBT drive board is connected with the IGBT drive adapter board, and the IGBT drive board is positioned on the two IGBT face parts close to the second end of the air guide assembly.
According to the power consumption of the IGBT module, simulating the temperature of the IGBT module under the condition of no air volume adjusting component to obtain temperature difference data of the IGBT module under the condition of no air volume adjusting component;
determining the hole density and the hole distribution of a plurality of areas of the air volume adjusting assembly based on the temperature difference data;
simulating and calculating wind pressure data of hole density and hole distribution of a plurality of areas of the wind volume adjusting assembly, and if the wind pressure data exceeds a threshold value, adjusting the hole density and the hole distribution of the plurality of areas;
processing an air volume adjusting assembly based on the hole density and the hole distribution;
connecting the air volume adjusting assembly to an air inlet of the radiator, and connecting the air guide mechanism to an air outlet of the radiator; the air volume adjusting assembly, the radiator and the air guide mechanism form a plurality of air channels with similar flow velocity;
mounting the direct current support capacitor, the radiator, the air guide mechanism and the air volume adjusting assembly on the metal frame;
and arranging and mounting at least two IGBT modules to the radiator uniformly.
Preferably, the method for determining the hole density and the hole distribution of the plurality of areas of the air volume adjusting assembly based on the temperature difference data comprises the following steps: and determining the difference value between the lowest hole density and the highest hole density of the air quantity adjusting assembly according to the air difference, wherein the hole density change difference close to the second end of the air guide assembly is larger than the hole density change difference close to the first end of the air guide assembly.
Preferably, the IGBT driving adaptive board is connected to the IGBT close to the second end of the air guide assembly, and the IGBT driving adaptive board is connected with the IGBT driving board through a lead; the direct current input end of the IGBT module is connected with the direct current support capacitor, and the alternating current output end of the IGBT module is connected with the alternating current output copper bar and then is output after being connected in parallel.
The invention changes the trend of the air duct through the air quantity adjusting component, the radiator and the air guide component to form the inverted L-shaped air direction circulation air duct, and simultaneously satisfies the requirements of good current flow equalizing characteristic, good radiating uniformity and compact structure of the power module, conforms to the design of the conventional power module and has lower cost. According to the invention, the air duct design of the quarter turn is realized through the air guide assembly with one closed end and one open end, the hot air direct blowing capacitor is avoided, and the problem of inconsistent air volume of a plurality of power units connected in parallel caused by the air duct of the quarter turn is solved through the air volume adjusting assemblies with different hole densities.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a structure and a wind diagram of a power module of the first prior art;
FIG. 2 is a schematic diagram of a power module according to a second prior art;
FIG. 3 is a schematic diagram of a power module according to the second prior art;
FIG. 4 is a structure and a wind diagram of a power module of the third prior art;
fig. 5 is a diagram of a power module according to an embodiment of the present invention;
fig. 6 is a power module structure and a wind direction diagram according to a first embodiment of the present invention;
fig. 7 is a bottom view of an air volume adjusting assembly of a power module according to an embodiment of the present invention;
fig. 8 is a side view of an airflow adjusting assembly of a power module according to an embodiment of the present invention;
fig. 9 is a pressure simulation diagram of the no-wind-volume adjustment assembly of the power module manufacturing method according to the second embodiment of the invention;
fig. 10 is a temperature simulation diagram of the no-air-volume adjusting component of the power module manufacturing method according to the second embodiment of the invention;
fig. 11 is a pressure simulation diagram of the wind amount adjustment component of the power module manufacturing method according to the second embodiment of the present invention;
fig. 12 is a temperature simulation diagram of the wind amount adjustment component of the power module manufacturing method according to the second embodiment of the present invention.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced otherwise than as specifically described herein, and thus the scope of the present invention is not limited by the specific embodiments disclosed below.
Example one
The present embodiment provides a power device, as shown in fig. 5 to 7, including:
the air conditioner comprises an IGBT module 14, an IGBT module 11, an IGBT module 9 and an IGBT module 7 which are connected in parallel from left to right, four absorption capacitors 15 corresponding to the IGBT module 14, the IGBT module 11, the IGBT module 9 and the IGBT module 7, a radiator 6, an air guide assembly 4, a direct current support capacitor 2, an air volume adjusting assembly 8, a laminated busbar 1, an alternating current input copper bar 12, a metal frame 3, an IGBT driving adapter plate 5 and an IGBT driving plate 13.
The direct current support capacitor 2 is positioned at the upper part of the air guide component 4; the radiator 6 is located on the back of the IGBT module 14, the IGBT module 11, the IGBT module 9 and the IGBT module 7, is clamped between the air quantity adjusting assembly and the air guide assembly, and takes away heat of the IGBT module 14, the IGBT module 11, the IGBT module 9 and the IGBT module 7 through air flow of an air direction circulation channel constructed by the air quantity adjusting assembly and the air guide assembly. The air guide assembly is characterized in that the first end of the air guide assembly is of a closed structure, and the second end of the air guide assembly is an air duct outlet, so that air blown into the radiator from the air quantity adjusting assembly and then blown into the air guide assembly is sealed by the first end of the air guide assembly and can only be blown out from the air duct outlet of the second end, and an inverted L-shaped air direction circulation air duct is formed.
The upside of air guide mechanism be metal sheet structure and with direct current supports electric capacity 2 contacts, and the wind channel trend is changed through amount of wind adjustment subassembly, radiator, air guide component to this embodiment for blow in the radiator and then blow in the wind of air guide component directly not blow to direct current and support electric capacity 2 from the amount of wind adjustment subassembly, avoid influencing direct current and support electric capacity 2's life.
As shown in fig. 7 to 8, the airflow rate adjusting unit 4 includes a region S1, a region S2, a region S3, and a region S4 having different hole densities, and a dividing structure A1, a dividing structure A2, and a dividing structure A3 that divide the heat sink into three regions. The area S1 is a first end close to the air guide assembly closed structure, and the area S4 is a second end close to the air guide assembly air duct outlet structure. The cell density gradually decreases from the region S1 to the region S4. When evenly blowing in wind to the plane of air volume adjustment subassembly, be close to the type of falling L wind direction circulation wind channel corner, promptly, wind guide assembly enclosed construction's first end, the corresponding atmospheric pressure in the radiator position is bigger, is close to L type wind direction circulation wind channel exit, promptly, the second end of wind guide assembly wind channel exit, the corresponding atmospheric pressure at the radiator is littleer. The air pressure difference that the hole density difference constitutes for the wind that is close to the first end of wind guide component enclosed construction is difficult for piling up in wind guide component, can not form too big difference with the wind speed that is close to the second end of wind guide component wind channel open-ended, and then realize parallelly connected IGBT module 14, IGBT module 11, IGBT module 9, IGBT module 7 no matter its setting is at the first end that is close to the wind guide component enclosed construction or the second end of wind guide component wind channel export, all can obtain close heat dissipation amount of wind, guarantee evenly parallel IGBT module 14 who sets up, IGBT module 11, IGBT module 9, IGBT module 7 heat dissipation characteristic is close, the uniformity is better.
The power device further includes: a laminated busbar 1; one end of the laminated busbar 1 is connected with the direct current support capacitor 2, and the other end of the laminated busbar is connected with the IGBT module 14, the IGBT module 11, the IGBT module 9 and the IGBT module 7 which are connected in parallel; one end of the absorption capacitor 15 is connected with the input ends of the IGBT module 14, the IGBT module 11, the IGBT module 9 and the IGBT module 7, and the other end of the absorption capacitor is connected with the wiring end of the laminated busbar 1.
The power device further includes: the alternating current input copper bar 12 is connected with alternating current input ends of the IGBT modules 14, 11, 9 and 7 which are connected in parallel, and the IGBT modules 14, 11, 9 and 7 which are connected in parallel and then output.
The power device further includes: the metal frame 3 is preferably a sheet metal frame. The metal frame 3 is directly connected to the dc support capacitor 2, the radiator 6, the air guide mechanism 4, and the air volume adjusting unit 8.
The power device further includes: IGBT drive adapter plate, and IGBT drive plate. And the IGBT driving adapter plate is connected with the IGBT module 7. The IGBT drive board is connected with the IGBT drive adapting board, and the IGBT drive board covers the IGBT module 14 and the IGBT module 11.
The air duct trend is changed through air volume adjusting assembly, radiator, wind-guiding assembly to this embodiment, constitutes the circulation wind duct of type of falling L wind direction, satisfies power module current flow equalizing characteristic simultaneously and well, the heat dissipation homogeneity is good, compact structure, accord with conventional power module design and the cost is lower. According to the invention, the air duct design of the quarter turn is realized through the air guide assembly with one closed end and one open end, the hot air direct blowing capacitor is avoided, and the problem of inconsistent air volume of a plurality of power units connected in parallel caused by the air duct of the quarter turn is solved through the air volume adjusting assemblies with different hole densities.
Example two
The present embodiment provides a method for manufacturing a power device, as shown in fig. 9 to 12, for manufacturing the power device according to the first embodiment, including:
according to the IBGT module power consumption, the temperature simulation of the IGBT module is carried out under the condition that no air volume adjusting assembly is adopted, and the temperature difference data of the IGBT module is obtained under the condition that no air volume adjusting assembly is adopted.
And determining the hole density and the hole distribution of a plurality of areas of the air volume adjusting assembly based on the temperature difference data.
Fig. 9 shows a simulated air pressure state when the air inlet is not provided with the air volume adjusting assembly, that is, the air inlet is uniformly and parallelly provided with the IGBT module 14, the IGBT module 11, the IGBT module 9 and the IGBT module 7, and fig. 10 shows a simulated temperature state when the air inlet is not provided with the air volume adjusting assembly, that is, the air inlet is uniformly and parallelly provided with the IGBT module 14, the IGBT module 11, the IGBT module 9 and the IGBT module 7. As can be seen from fig. 10, in the case of no air volume adjusting unit, the air pressure and the temperature of the IGBT modules 11 and 9 in the middle are high due to the rotation angle, and the maximum and minimum temperature difference is 4.75K and the maximum temperature rise is 49.57K, which is about 9.58% deviation.
Fig. 11 shows a simulated air pressure state when the air volume adjusting assembly with variable density is installed, that is, the air at the air inlet penetrates through the holes with different densities and then blows toward the IGBT modules 14, 11, 9, and 7 installed in parallel, and fig. 12 shows an air volume adjusting mechanism with variable density, that is, the air at the air inlet penetrates through the holes with different densities and then blows toward the IGBT modules 14, 11, 9, and 7 installed in parallel. As can be seen from fig. 12, in the case of no air volume adjusting unit, the air pressure and the temperature of the IGBT modules 11 and 9 in the middle are high due to the rotation angle, and the maximum and minimum temperature difference is 2.31K and the maximum temperature rise is 48K, which is about 4.81%.
The deviation between the parallel devices is one of the measuring marks for the parallel use of the electrical devices, and generally, the deviation exceeding 10% is considered to be used in a capacity reduction manner, while the deviation lower than 5% is considered to be better in consistency, and the deviation can be used in a less capacity reduction manner or in a capacity reduction manner. The air volume-free adjusting assembly is difficult to directly use under the condition of no capacity reduction, and the air volume adjusting assembly with variable density is arranged to support the parallel IGBT to operate without capacity reduction due to higher consistency.
And determining the difference value between the lowest hole density and the highest hole density of the air volume adjusting assembly according to the temperature difference. For example, the difference between the highest temperature and the lowest temperature of the IGBT module is greater than 15k, giving initial pore density differences of 30%,20%,10% between 15k and 10k, and between 10k and 5k, respectively. When the temperature extreme value is higher, the proportion of the air guide area occupying the area can be 100%, namely, the position with the maximum hole density is set to be full-pass. In this case, the initial adjustment value of the lowest hole density region at the temperature difference of 15k may be set to 70% of the air guide area, the initial adjustment value of the lowest hole density region at the temperature difference of 10 degrees may be set to 80% of the air guide area, and the initial adjustment value of the lowest hole density region at the temperature difference of 5 degrees may be set to 90% of the air guide area. And on the basis of adjusting the initial value, performing temperature difference modeling on the air volume adjusting assembly, and if the temperature difference is higher than a design threshold, adjusting the proportion of the air guide area in the lowest hole density area to the area until the requirement of the design threshold is met.
The method comprises the steps of determining hole distribution on the basis of determining the proportion of the air guide area in a highest hole density area to the area and the proportion of the air guide area in a lowest hole density area to the area, wherein the hole distribution is determined in the mode that firstly, temperature difference modeling is carried out on the hole density which is uniformly distributed in a descending mode, under the condition that the temperature simulation condition of an IGBT module corresponding to an air volume adjusting assembly with the hole density which is uniformly distributed in the descending mode does not meet the expectation, the hole density distribution is adjusted, the hole density change difference close to the second end of the air guide assembly is gradually larger than the hole density change difference close to the first end of the air guide assembly, the temperature simulation is carried out on the IGBT module corresponding to the air volume adjusting assembly which is adjusted gradually, and the hole density and the hole distribution of a plurality of areas of the air volume adjusting assembly are determined until the temperature simulation result meets the design requirements.
And (3) performing simulation calculation on the basis of the wind pressure data of the hole density and the hole distribution of the plurality of areas of the wind volume adjusting assembly determined by the method, and if the wind pressure data exceeds a threshold value, adjusting the hole density and the hole distribution of the plurality of areas. And (4) circulating an optimization process of adjusting and determining hole distribution based on temperature simulation and evaluating whether the determined hole distribution meets a wind pressure standard or not based on wind pressure simulation so as to obtain the optimal hole distribution. The method aims at the determination method of the power device with the structure, effectively balances the design efficiency and the design optimization freedom degree, and can well complete the design of the hole density and the space distribution in the power device with the structure.
Air volume adjusting assembly is processed based on hole density and hole distribution.
Connecting the air volume adjusting assembly to an air inlet of the radiator, and connecting the air guide mechanism to an air outlet of the radiator; the air volume adjusting component, the radiator and the air guide mechanism form a plurality of air channels with similar flow rates.
And installing the direct current supporting capacitor, the radiator, the air guide mechanism and the air volume adjusting assembly on the metal frame.
And the IGBT modules 14, 11, 9 and 7 are uniformly arranged and mounted on the radiator.
And connecting the IGBT driving adaptation board to an IGBT module 7, wherein the IGBT driving adaptation board is connected with the IGBT driving board by adopting a lead.
The direct current input ends of the IGBT module 14, the IGBT module 11, the IGBT module 9 and the IGBT module 7 are connected with the direct current support capacitor, and the alternating current output ends of the IGBT module 14, the IGBT module 11, the IGBT module 9 and the IGBT module 7 are connected with the alternating current output copper bar and then output after being connected in parallel.
The foregoing description, for purposes of explanation, used specific nomenclature to provide a thorough understanding of the embodiments. It will be apparent, however, to one skilled in the art that the embodiments may be practiced without the specific details. Thus, the foregoing descriptions of specific embodiments described herein are presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the above teaching. Further, as used herein to refer to the position of a component, the terms above and below, or their synonyms, do not necessarily refer to an absolute position relative to an external reference, but rather to a relative position of the component with reference to a drawing.
Moreover, the foregoing drawings and description include many concepts and features that may be combined in various ways to achieve various benefits and advantages. Thus, features, components, elements and/or concepts from the various figures may be combined to produce embodiments or implementations not necessarily shown or described in this specification. Furthermore, not all features, components, elements and/or concepts shown in a particular figure or description may be required to be present in any particular embodiment and/or implementation. It is to be understood that such embodiments and/or implementations fall within the scope of the present description.

Claims (10)

1. A power device, comprising:
the air conditioner comprises at least two IGBT modules arranged in parallel, absorption capacitors corresponding to the at least two IGBT modules, a radiator, an air guide assembly, a direct current support capacitor and an air volume adjusting assembly;
the direct current supporting capacitor is positioned on the upper part of the air guide assembly; the radiator is positioned at the back of at least two IGBT modules; the radiator is clamped between the air volume adjusting assembly and the air guide assembly; the first end of the air guide assembly is of a closed structure, and the second end of the air guide assembly is an air duct outlet; the air quantity adjusting assembly, the radiator and the air guide assembly form an inverted L-shaped air direction circulation air duct;
the air volume adjusting assembly comprises a plurality of areas with different hole densities and a dividing structure for dividing the radiator into a plurality of areas; the hole density of the area on the same side of the air quantity adjusting assembly and the first end of the air guide assembly is higher than the hole density of the area on the same side of the air quantity adjusting assembly and the second end of the air guide assembly.
2. The power device according to claim 1, wherein the plurality of regions of the air volume adjusting assembly having different hole densities and the plurality of regions into which the heat sink is divided by the dividing structure of the air volume adjusting assembly form a plurality of air ducts having similar wind speeds for dissipating heat of the at least two IGBT modules.
3. A power device according to claim 1, further comprising: a laminated busbar; one end of the laminated busbar is connected with the direct current support capacitor, and the other end of the laminated busbar is connected with at least two IGBT modules; one end of the absorption capacitor is connected with the input end of the IGBT module, and the other end of the absorption capacitor is connected with the wiring end of the laminated busbar.
4. A power device according to claim 1, further comprising: and the alternating current input copper bar is connected with the alternating current input ends of the at least two IGBT modules and outputs the at least two IGBT modules after being connected in parallel.
5. A power device according to claim 1, further comprising: and the metal frame is directly connected with the direct current supporting capacitor, the radiator, the air guide mechanism and the air volume adjusting assembly.
6. A power device according to claim 1, further comprising: and the IGBT driving adapter plate is connected with the IGBT close to the second end of the air guide assembly.
7. A power device according to claim 6, characterized in that the power device further comprises: the IGBT drive board is connected with the IGBT drive adapter board, and the IGBT drive board is positioned on the two IGBT face parts close to the second end of the air guide assembly.
8. A method for manufacturing a power device according to any one of claims 1 to 7, comprising:
according to the power consumption of the IGBT module, simulating the temperature of the IGBT module under the condition of no air volume adjusting assembly to obtain temperature difference data of the IGBT module under the condition of no air volume adjusting assembly;
determining hole density and hole distribution of a plurality of areas of the air volume adjusting assembly based on the temperature difference data;
simulating and calculating the hole density and hole distribution wind pressure data of a plurality of areas of the wind volume adjusting assembly, and if the wind pressure data exceeds a threshold value, adjusting the hole density and hole distribution of the plurality of areas;
processing an air volume adjusting assembly based on the hole density and the hole distribution;
connecting the air volume adjusting assembly to an air inlet of the radiator, and connecting the air guide mechanism to an air outlet of the radiator; the air volume adjusting assembly, the radiator and the air guide mechanism form a plurality of air channels with similar flow velocity;
mounting the direct current support capacitor, the radiator, the air guide mechanism and the air volume adjusting assembly on a metal frame;
and arranging and mounting at least two IGBT modules to the radiator uniformly.
9. The method for manufacturing a power device according to claim 8, wherein the method for determining the hole density and the hole distribution of the plurality of regions of the air volume adjusting assembly based on the temperature difference data comprises: and determining the difference value between the lowest hole density and the highest hole density of the air quantity adjusting assembly according to the temperature difference, wherein the hole density change difference close to the second end of the air guide assembly is larger than the hole density change difference close to the first end of the air guide assembly.
10. The method for manufacturing the power device according to claim 8, wherein the IGBT driving adapter plate is connected to the IGBT near the second end of the air guide assembly, and the IGBT driving adapter plate is connected to the IGBT driving plate by a wire; the direct current input end of the IGBT module is connected with the direct current support capacitor, and the alternating current output end of the IGBT module is connected with the alternating current output copper bar and then is output after being connected in parallel.
CN202211438853.4A 2022-11-17 2022-11-17 Power device and manufacturing method thereof Active CN115514193B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211438853.4A CN115514193B (en) 2022-11-17 2022-11-17 Power device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211438853.4A CN115514193B (en) 2022-11-17 2022-11-17 Power device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
CN115514193A true CN115514193A (en) 2022-12-23
CN115514193B CN115514193B (en) 2023-06-06

Family

ID=84513607

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211438853.4A Active CN115514193B (en) 2022-11-17 2022-11-17 Power device and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN115514193B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102611327A (en) * 2011-01-25 2012-07-25 富士电机株式会社 Power conversion apparatus of stacked structure
US20130343110A1 (en) * 2011-10-18 2013-12-26 Huawei Technologies Co., Ltd. Inverter, Sealing Air Duct and Heat Dissipation System
CN204046403U (en) * 2014-09-19 2014-12-24 浙江日风电气有限公司 Based on the wind cooling power unit of IGBT
CN104868702A (en) * 2014-11-03 2015-08-26 浙江海得新能源有限公司 Converter power cabinet
CN205081667U (en) * 2015-07-07 2016-03-09 科诺伟业风能设备（北京）有限公司 IGBT power modular structure that connects in parallel
US20180166996A1 (en) * 2016-12-12 2018-06-14 Sungrow Power Supply Co., Ltd. Central-string inverter device
WO2021169164A1 (en) * 2020-02-28 2021-09-02 中车青岛四方车辆研究所有限公司 Traction converter and control method therefor

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102611327A (en) * 2011-01-25 2012-07-25 富士电机株式会社 Power conversion apparatus of stacked structure
US20120188807A1 (en) * 2011-01-25 2012-07-26 Fuji Electric Co., Ltd. Stacked structure of power conversion apparatus
US20130343110A1 (en) * 2011-10-18 2013-12-26 Huawei Technologies Co., Ltd. Inverter, Sealing Air Duct and Heat Dissipation System
CN204046403U (en) * 2014-09-19 2014-12-24 浙江日风电气有限公司 Based on the wind cooling power unit of IGBT
CN104868702A (en) * 2014-11-03 2015-08-26 浙江海得新能源有限公司 Converter power cabinet
CN205081667U (en) * 2015-07-07 2016-03-09 科诺伟业风能设备（北京）有限公司 IGBT power modular structure that connects in parallel
US20180166996A1 (en) * 2016-12-12 2018-06-14 Sungrow Power Supply Co., Ltd. Central-string inverter device
WO2021169164A1 (en) * 2020-02-28 2021-09-02 中车青岛四方车辆研究所有限公司 Traction converter and control method therefor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
黄继雄等: "单相电源箱逆变单元散热系统的研究", 《武汉理工大学学报(信息与管理工程版)》 *

Also Published As

Publication number Publication date
CN115514193B (en) 2023-06-06

Similar Documents

Publication Publication Date Title
US8081465B2 (en) Cooling apparatus for semiconductor chips
WO2011018882A1 (en) Semiconductor module and cooling unit
US11477920B2 (en) Power module
CN109244592B (en) Air cooling structure and battery box
CN110036355A (en) The cabinet and server of server
CN112152475B (en) Inverter device
CN101847940B (en) Assembly structure of inverter power unit and modular power unit using same
CN115514193B (en) Power device and manufacturing method thereof
CN112965585A (en) Server heat dissipation device and server heat dissipation method
JP6474751B2 (en) Cell inverter unit
CN115459612A (en) Inverter device
CN103702546A (en) Converter and radiating method
CN111356327B (en) Current transformer
CN112996327A (en) Power cabinet
CN220041065U (en) Heat radiating device and chassis
CN215345679U (en) Active heat dissipation module
CN216626446U (en) Inverter based on multiple heat dissipation air channels
JP7531618B2 (en) Power conversion device and elevator control panel
CN210016319U (en) Uninterrupted power source rack
CN219779570U (en) Heat dissipation control cabinet
CN117440669B (en) Heat radiation structure and heat radiation method of multichannel solid-state switch
CN217821500U (en) Active display card backplate heat abstractor
CN218447627U (en) Electric cabinet body and heat radiation structure of circuit breaker thereof
CN216210797U (en) Server with GPU module and CPU module capable of independently radiating heat separately
CN221447289U (en) Outdoor type modularized energy storage all-in-one machine

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant