CN115513072B - Microelectronic device packaging method based on fluid dispensing - Google Patents
Microelectronic device packaging method based on fluid dispensing Download PDFInfo
- Publication number
- CN115513072B CN115513072B CN202211391279.1A CN202211391279A CN115513072B CN 115513072 B CN115513072 B CN 115513072B CN 202211391279 A CN202211391279 A CN 202211391279A CN 115513072 B CN115513072 B CN 115513072B
- Authority
- CN
- China
- Prior art keywords
- plane
- insulating
- chip
- glue
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Abstract
The embodiment of the invention discloses a microelectronic device packaging method based on fluid dispensing, relates to the technical field of electronic component packaging processes, and can solve the problems that dispensing thickness and shape are difficult to control and insulating glue is easy to generate holes when dispensing on a plastic package carrier. The method comprises the following steps: etching the surface to be bonded of the plastic package carrier to obtain a first plane and a second plane which are connected with each other, wherein the first plane is higher than the second plane; etching a plurality of point grooves on the first plane, wherein the lowest surface of each point groove is higher than the lowest surface of the plastic package carrier, pressing insulating particles into each point groove, and placing part of the insulating particles outside the point grooves; dispensing insulating glue to the first plane for multiple times to enable the insulating glue to be fully distributed on the surfaces of the insulating particles and the first plane among the insulating particles; and when the insulating glue on the first plane is in a semi-solidification state, placing the chip on the glue surface in the semi-solidification state, and bonding the chip on the first plane.
Description
Technical Field
The invention relates to the technical field of electronic component packaging processes, in particular to a microelectronic device packaging method based on fluid dispensing.
Background
With the development of microelectronic devices such as power devices (including Light Emitting Diodes (LEDs), laser Diodes (LDs), insulated Gate Bipolar Transistors (IGBTs), etc.), the packaging process is an important process that affects the performance and reliability of the devices.
In the packaging process, die bonding is a very critical process, and is a process of bonding a chip (wafer) to a specified area of a plastic package carrier through a colloid (for example, for an LED, a conductive adhesive or an insulating adhesive is common), forming a thermal path or an electrical path, and providing conditions for subsequent wire bonding and connection.
As shown in fig. 1, a schematic diagram of a device package structure is shown. In the schematic diagram, the chip substrate potential is ground, the plastic package carrier is connected with the input terminal potential, the bottom of the chip is isolated from the plastic package carrier through the insulating glue, and under the condition that the insulating glue is effective, the insulating glue can effectively isolate the potential, namely, no current exists between the input terminal and the ground, but if the insulating glue fails, the input terminal and the ground can leak electricity, and the performance of the device is affected.
In the prior art, a chip and a plastic package carrier are generally adhered together through insulating glue in two ways, namely glue dispensing at the bottom of the chip and glue dispensing on the plastic package carrier. Because the dispensing at the bottom of the chip is prone to chip flying and poor in glue spreading effect, the dispensing at the bottom of the chip is not preferred, and the dispensing on the plastic carrier is more commonly used.
Disclosure of Invention
The embodiment of the invention provides a microelectronic device packaging method based on fluid dispensing, and aims to solve the problems that dispensing thickness and shape are difficult to control and insulating glue is easy to generate holes when dispensing is carried out on a plastic package carrier.
In order to solve the above problems, the embodiment of the present invention discloses a microelectronic device packaging method based on fluid dispensing, which includes:
etching the surface to be bonded of the plastic package carrier to obtain a first plane and a second plane which are connected with each other, wherein the first plane is higher than the second plane;
etching a plurality of point grooves on the first plane, wherein the lowest surface of each point groove is higher than the lowest surface of the plastic package carrier, pressing insulating particles into each point groove, and placing the insulating particles outside the point grooves;
dispensing insulating glue to the first plane for multiple times to enable the insulating glue to be fully distributed on the surfaces of the insulating particles and the first plane among the insulating particles;
and when the insulating glue on the first plane is in a semi-solidification state, placing the chip on the glue surface in the semi-solidification state, and bonding the chip on the first plane.
In an embodiment of the present invention, etching a surface to be bonded of a plastic package carrier to obtain a first plane and a second plane which are connected to each other includes:
determining an area corresponding to the surface to be bonded of the chip on the surface to be bonded of the plastic package carrier;
and etching a circle of line groove on the surface to be bonded of the plastic package carrier around the periphery of the area, wherein the area is internally provided with a first plane, and the bottom surface of the line groove is provided with a second plane.
In an embodiment of the present invention, when the insulating adhesive on the first plane is in a semi-solidified state, the step of placing the chip on the adhesive surface in the semi-solidified state to bond the chip on the first plane includes:
when the insulating glue on the first plane is in a semi-solidified state, a pressboard capable of being electrified is arranged above the chip, and the chip is pressed on the glue surface in the semi-solidified state under the condition that the pressboard is electrified;
and controlling the pressing temperature and/or the pressing force of the pressing plate, so that after the chip is bonded with the first plane, the pressing plate is not magnetized and leaves the chip after a preset time.
In an embodiment of the invention, an insulating film is arranged between the pressing plate and the chip, wherein the thickness of the insulating film does not influence the magnetic attraction force of the magnetic plate on the back gold layer of the chip after the magnetic flux is applied.
In an embodiment of the present invention, the step of pressing the insulating particles into each of the grooves further includes:
coating insulating glue in each groove;
and when the insulating glue in the point grooves is in a semi-solidified state, pressing insulating particles into each point groove.
In one embodiment of the present invention, the plurality of point grooves are uniformly distributed on the first plane.
In an embodiment of the present invention, the step of dot-coating the insulating paste in each of the grooves further includes:
and sequentially carrying out primary baking and primary heating softening on the plastic package carrier to enable the insulating glue in the point groove to be in a semi-solidified state.
In an embodiment of the present invention, the step of dispensing the insulating paste to the first plane for multiple times further includes:
and (4) after the insulating glue is repeatedly dispensed to the first plane and leveled, wherein the highest point of the leveled insulating glue is more than or equal to that of the insulating particles.
In an embodiment of the present invention, the step of dispensing the insulating paste to the first plane for multiple times so that the insulating paste is fully spread on the surfaces of the insulating particles and the first plane between the insulating particles further includes:
and sequentially carrying out secondary baking and secondary heating softening on the plastic packaging carrier to enable the insulating glue on the first plane to be in a semi-solidified state.
In an embodiment of the present invention, the method further includes:
before etching the surface to be bonded of the plastic package carrier, covering the area which is not required to be mounted on the plastic package carrier with a mask, and vacating the area which is required to etch the first plane and the second plane;
after the chip is firmly adhered to the first plane, the mask covering the plastic package carrier is removed.
The embodiment of the invention has the following advantages:
according to the embodiment of the invention, the surface to be bonded of the sealed carrier is etched to obtain the first plane and the second plane which are connected, wherein the first plane is higher than the second plane, so that the second plane can contain the insulating glue overflowing from the first plane when the chip is attached to the sealed carrier, and the insulating glue overflowing from the first plane cannot climb onto the chip, so that the insulating effect between the input end and the ground is poor;
according to the embodiment of the invention, a plurality of point grooves are etched on the first plane, the lowest surface of each point groove is higher than the lowest surface of the plastic package carrier, insulating particles are pressed into each point groove, and the insulating particles are partially arranged outside the point grooves, so that the uniformity of the thickness of the insulating adhesive can be effectively ensured;
according to the embodiment of the invention, the insulating glue is repeatedly dotted on the first plane, so that the insulating glue is fully distributed on the surfaces of all the insulating particles and the first plane among all the insulating particles, and then when the insulating glue on the first plane is in a semi-solidified state, the chip is placed on the glue surface in the semi-solidified state, so that the chip is adhered on the first plane; wherein, a plurality of insulating particles of doping in the insulating cement form the fine shrinkage stress of having shared insulating cement of protruding structure for the insulating cement is difficult for appearing the cavitation in the curing process, and when even making appearing the cavitation, the cavity of insulating cement is also difficult for expanding by the dragging of insulating particle.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention.
FIG. 1 is a schematic diagram of a plastic package structure of a conventional device;
FIG. 2 is a flow chart illustrating steps in a method for packaging a microelectronic device based on fluid dispensing, in accordance with an embodiment of the present invention;
FIG. 3 is a process structural diagram obtained by step S21 shown in FIG. 2 according to an embodiment of the present invention;
FIG. 4 is a structural diagram of the process obtained in step S22 shown in FIG. 2 according to the embodiment of the present invention;
FIG. 5 is a process structural diagram obtained in step S23 shown in FIG. 2 according to an embodiment of the present invention;
fig. 6 is a process structural view obtained by the step S24 shown in fig. 2 according to the embodiment of the present invention.
Description of reference numerals:
1-plastic package carrier, 11-first plane, 12-second plane, 13-point groove, 2-chip, 3-insulating glue, 4-insulating particle, IN-input terminal potential and GND-chip substrate potential.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
At present, the following reasons are found through the insulation paste failure analysis of an insulation paste electric leakage device:
1. the dispensing thickness and shape are not easy to control;
2. the cavity of insulating cement is bigger in the inefficacy chip than normal chip, and the cavity in the insulating cement makes the effective thickness attenuation of insulating cement promptly, and under the humid environment, creepage phenomenon takes place easily in insulating cement cavity position, makes the dielectric strength of insulating cement further descend, finally leads to the insulating cement between input and the ground to produce the electric leakage.
In view of this, the embodiment of the present invention provides a microelectronic device packaging method based on fluid dispensing, aiming to effectively overcome the problem of insulating glue failure caused by the above two reasons.
Referring to fig. 2, a flow chart illustrating steps of a microelectronic device packaging method based on fluid dispensing according to an embodiment of the present invention is shown, which may specifically include the following steps:
step S21, etching a surface to be bonded of the plastic package carrier 1 to obtain a first plane 11 and a second plane 12 which are connected with each other, wherein the first plane 11 is higher than the second plane 12;
in the plastic carrier 1, the first plane 11 is a plane for bonding the chip 2, and therefore, the first plane 11 is coated with the insulating paste 3. In the embodiment of the present invention, as shown in fig. 3, a second plane 12 is designed, wherein the second plane 12 needs to be connected to the first plane 11, and is intended to receive the insulation paste 3 overflowing from the first plane 11 when the chip 2 is attached to the plastic package carrier 1, so that the insulation paste 3 overflowing from the first plane 11 does not climb back onto the chip 2, which results in poor insulation effect between the input terminal and the ground.
Optionally, the height difference between the first plane 11 and the second plane 12 is 1/2-1 of the thickness of the glue on the first plane 11. This numerical limitation ensures that the second plane 12 has sufficient depth to carry the adhesive 3 that overflows from the first plane 11, so that the adhesive 3 does not climb back onto the chip 2 during the baking process after being transformed into a solid state.
When etching the surface to be bonded of the plastic package carrier 1, the areas of the first plane 11 and the second plane 12 on the plastic package carrier 1 may be determined, and then the first plane 11 and the second plane 12 may be obtained by etching the areas with different depths. Of course, in order to increase the overall packaging efficiency and reduce the processing cost, only the area where the second plane 12 is located may be etched, so that a height difference exists between the etched area and the first plane 11, and the second plane 12 is obtained.
In an alternative embodiment of the present invention, as shown in fig. 3, an implementation of etching to obtain the first plane 11 and the second plane 12 is given:
firstly, determining an area corresponding to a surface to be bonded of a chip 2 on the surface to be bonded of the plastic package carrier 1; and then, etching a circle of line groove on the surface to be bonded of the plastic package carrier 1 around the periphery of the area, wherein the area is internally provided with a first plane 11, and the bottom surface of the line groove is a second plane 12. In the present embodiment, the shape of the first plane 11 matches the shape of the tape bonding surface of the chip 2, and since the second plane 12 is a circular groove etched around the outside of the first plane 11, the shape of the second plane 12 also matches the shape of the tape bonding surface of the chip 2, so that when the insulating paste 3 overflows from the first plane 11, the second plane 12 can effectively receive the overflowing insulating paste 3. The line groove of the present embodiment can be understood as a semi-closed groove having a certain width, so as to ensure that the overflowing insulating glue 3 can be effectively accommodated.
It should be noted that although the second plane 12 is lower than the first plane 11 and appears as an annular groove structure formed around the first plane 11, the second plane 12 is different from the lead groove of the prior plastic carrier 1 for connecting the substrate for die bonding, and the plastic carrier 1 of the embodiment of the present invention may also have the lead groove as in the prior art on the basis of having the first plane 11 and the second plane 12. Or in other words, the first plane 11 and the second plane 12 of the present invention can be understood as an improvement to the base island used for die bonding in the prior art, and the plastic carrier 1 may still have structures other than the base island, and the embodiment of the present invention is not limited herein.
Step S22, etching a plurality of point grooves 13 on a first plane 11, wherein the lowest surface of each point groove 13 is higher than the lowest surface of the plastic package carrier 1, pressing insulating particles 4 into each point groove 13, and placing parts of the insulating particles 4 outside the point grooves 13;
since the insulating glue 3 between the bottom of the chip 2 and the plastic package carrier 1 mainly serves to isolate the impedance value between the input end and the ground, the thickness of the insulating glue 3 is a key factor influencing the isolation effect of the insulating glue 3. In the related art, the thickness of the insulating glue 3 for packaging the power consumption device is generally increased to improve the insulating and isolating effect, but the thickness and the shape are uncontrollable only by increasing the thickness of the insulating glue 3, so that the problem of cavities or uneven thickness of glue is caused.
Based on fig. 3, as shown in fig. 4, the embodiment of the present invention employs the insulating particles 4 and the plurality of point grooves 13 to cooperate with each other, so as to effectively ensure the uniformity of the thickness of the insulating glue 3 and reduce the colloid void phenomenon. Specifically, if only adding insulating particles 4 in insulating paste 3, because insulating particles 4 have mobility, the uniformity of insulating particles 4 in insulating paste 3 laid on first plane 11 cannot be guaranteed, and then the thickness of insulating paste 3 on first plane 11 is also difficult to guarantee, and simultaneously the requirement on the size of insulating particles 4 is also higher, insulating particles 4 with too large particle size can influence the thickness of viscose and the bonding effect with chip 2 and plastic package carrier 1, and insulating particles 4 with too small particle size are then more easily moved when insulating paste 3 is not dry, and influence the uniformity of distribution thereof. However, according to the implementation method of the present invention, the position of the insulating particles 4 can be fixed by using the dot recesses 13, wherein one part of the insulating particles 4 is pressed into the dot recesses 13 and the other part is disposed outside the dot recesses 13, so that the thickness of the insulating paste 3 coated on the first plane 11 can be defined by the thickness of the insulating particles 4 disposed outside the dot recesses 13, and thus the thickness of the insulating paste 3 coated on the first plane 11 can be effectively controlled, and the selection range of the particle size of the insulating particles 4 is wider. In addition, since the dot recesses 13 and the number of the insulating particles 4 are in one-to-one relationship, by controlling the number and distribution of the dot recesses 13 on the first plane 11, the uniformity of the insulating particles 4 in the insulating paste 3 spread on the first plane 11 can be effectively controlled.
In a preferred embodiment, as shown in fig. 4, a plurality of point grooves 13 are uniformly distributed on the first plane 11. In this embodiment, a plurality of positions to be etched of the point recess 13 may be marked on the first plane 11, wherein the plurality of positions are uniformly distributed on the first plane 11, and then each position is etched to obtain the plurality of point recesses 13. Based on the uniform distribution of the dot recesses 13 on the first plane 11, when the insulating particles 4 are mounted on the dot recesses 13, the uniformity of the insulating particles 4 in the insulating paste 3 spread on the first plane 11 can be ensured.
In the embodiment of the present invention, the dot recess 13 may be understood as a semi-closed recess, that is, the upper opening is flush with the surface of the first plane 11, the bottom is closed, and the lowest point of the dot recess 13 is higher than the lowest surface of the plastic package carrier 1, so that a perforation phenomenon does not occur. Point recess 13 can be an arc recess, and when insulating granule 4 just is spherical, insulating granule 4 shape just matches with this arc recess, and the depth of the arc recess of sculpture can just be greater than the radius of this spherical insulating granule 4, so can effectively restrict this insulating granule 4.
Of course, the above described implementation has higher requirements on the shape of the point recess 13 and the insulating particles 4, and a preferred implementation is: cleaning the surfaces of the point grooves 13 by blowing air, and coating insulating glue 3 in each point groove 13; then, when the insulating paste 3 in the dot recesses 13 is in a semi-solidified state, the insulating particles 4 are pressed into each of the dot recesses 13.
Wherein, the control of the insulating glue 3 in a semi-solidified state can be realized by the following steps: after insulating glue 3 is point-coated in each point groove 13, the plastic package carrier 1 is sequentially baked and heated and softened for the first time, so that the insulating glue 3 in the point grooves 13 is in a semi-solidified state. In the process, moisture on the plastic package carrier 1 can be effectively removed based on the first baking of the plastic package carrier 1, and the probability of generating cavities due to the moisture when the insulating glue is coated on the plastic package carrier 1 subsequently is further reduced.
It should be noted that, in the embodiments of the present invention, controlling the insulating paste 3 to be in the semi-solidified state does not absolutely limit the state where the insulating paste 3 is in the semi-solidified state, and the insulating paste 3 in the semi-solidified state has a higher viscosity than the insulating paste 3 in the completely uncured state, and when the insulating paste 3 in the dot recesses 13 is in the semi-solidified state, the insulating particles 4 are pressed into each dot recess 13, so that the insulating particles 4 can be well adhered to the insulating paste 3, and are not easily displaced.
Step S23, the insulating glue 3 is repeatedly dispensed to the first plane 11, so that the insulating glue 3 is fully distributed on the surfaces of the insulating particles 4 and the first plane 11 among the insulating particles 4;
after the insulating particles 4 are pressed into each of the dot recesses 13 in step S22, a structure in which a plurality of insulating particles 4 are fixed on the first plane 11 is formed. Next, in the embodiment of the present invention, the insulating glue 3 is dispensed to the first plane 11 for multiple times, and the dispensing manner may be that dispensing is performed between the insulating particles 4 and the gaps between the insulating particles 4, so that the insulating glue 3 is attached to the first plane 11 between the insulating particles 4, when the insulating glue 3 is spread over the entire first plane 11, the insulating glue 3 also connects the adjacent insulating particles 4 together, and dispensing is performed from bottom to top on the first plane 11, so that the insulating glue 3 is finally spread over the surfaces of the insulating glues 3. The step of dispensing on the first plane 11 from bottom to top can be understood as that the first plane 11 is fully paved with the insulating glue 3, so that the insulating glue 3 is fully distributed at the bottom of each insulating particle 4 and in the point groove 13 which is not fully filled to form a first insulating glue 3 layer, and then dispensing is performed on the first insulating glue 3 layer, so that the new insulating glue 3 is not only attached to the first insulating glue 3 layer, but also permeates among the insulating particles 4 until permeating on the surface of each insulating particle 4. This kind of mode is glued to layering point can effectively hold the setting speed of insulating cement 3 and the volume of control insulating cement, avoids the glue film to be extruded to and can effectively reduce the cavity in the insulating cement, make insulating cement 3 and insulating granule 4 and first plane 11's adhesive effect more, it is even firm again with insulating granule 4 and first plane 11 bonded promptly.
In the related art, the internal stress of the adhesive structure is one of the important reasons for the damage of the adhesive structure, wherein the internal stress includes a shrinkage stress, as shown in fig. 5, in the glue surface structure formed in step 23, the plurality of insulating particles 4 doped in the insulating glue 3 form a protruding structure to well distribute the shrinkage stress of the insulating glue 3, so that the insulating glue 3 is not easy to generate a cavity phenomenon in the curing process, and when the cavity phenomenon occurs, the cavity of the insulating glue 3 is not easy to expand due to the dragging of the insulating particles 4, thereby effectively solving the cavity problem that the insulating glue 3 is easy to generate based on the existing die bonding method.
In an embodiment of the present invention, the step of dispensing the insulating paste 3 to the first plane 11 for multiple times further includes:
and (3) performing multiple points of the insulating glue 3 on the first plane 11 and leveling, wherein the highest point of the leveled insulating glue 3 is greater than or equal to that of the insulating particles 4. The floating process can not only homogenize the insulating adhesive 3 on the first plane 11, but also take away part of the redundant insulating adhesive 3, and is beneficial to controlling the thickness and the uniformity of the insulating adhesive 3 on the first plane 11.
Step S24, when the insulating adhesive 3 on the first plane 11 is in a semi-solidified state, placing the chip 2 on the semi-solidified adhesive surface, so that the chip 2 is adhered to the first plane 11.
In an embodiment of the present invention, after the insulating paste 3 is applied to the first plane 11 for multiple times, so that the insulating paste 3 is fully distributed on the surface of each insulating particle 4 and the first plane 11 between the insulating particles 4, controlling the insulating paste 3 on the first plane 11 to be in a semi-solidified state may be implemented by the following steps: and sequentially carrying out secondary baking and secondary heating softening on the plastic package carrier 1 to enable the insulating glue 3 on the first plane 11 to be in a semi-solidified state.
As shown in fig. 6, when the insulating adhesive 3 on the first plane 11 is in a semi-solidified state, the chip 2 is placed on the adhesive surface of the first plane 11, and a slight downward pressure is applied to the chip 2, so that the chip 2 and the plastic package carrier 1 are firmly bonded.
In addition, through failure analysis of the insulating glue 3, it is found that the falling gold plating doped in the insulating glue 3 is also one of important factors influencing the failure of the insulating glue 3, and the falling gold plating is easy to cause breakdown and electric leakage of the insulating glue 3. Because the gold plating layer mainly comes from the back of the chip 2, the related technology generally adopts a solution that the gold plating layer on the back of the chip 2 has no definite purpose, and the gold plating layer is removed as much as possible and then bonded under the condition that the insulating adhesive 3 is needed for bonding, although the method can avoid the gold plating layer mixed in the insulating adhesive 3 in the bonding process of the chip 2 and the plastic package carrier 1, the method is limited to the device having no definite purpose for the gold plating layer on the back of the chip 2, the application range is narrow, and the removal of the gold plating layer on the back of the chip 2 is not only troublesome, but also easily damages the chip 2.
In view of this, in order to solve the problem that the conductive property of the insulating paste 3 is reduced due to the conductive of the peeling gold-plating layer doped in the insulating paste 3, in an embodiment of the present invention, when the insulating paste 3 on the first plane 11 is in a semi-solidified state, the chip 2 is placed on the semi-solidified paste surface, and the implementation step of adhering the chip 2 to the first plane 11 further provides the following feasible methods:
when the insulating glue 3 on the first plane 11 is in a semi-solidified state, a magnetic pressing plate (not shown) is arranged above the chip 2, and the chip 2 is pressed on the glue surface in the semi-solidified state under the condition that the magnetic pressing plate is electrified;
and controlling the pressing temperature and the pressing force of the pressing plate, so that after the chip 2 is bonded with the first plane 11, the pressing plate is demagnetized and is left from the chip 2 for a preset time.
In the embodiment of the invention, the magnetic laminated plate is arranged above the chip 2, then the magnetic laminated plate is magnetized, the chip 2 is pressed on the semi-solidified rubber surface on the first plane 11 by the laminated plate under the condition of magnetic conduction, and the laminated plate has attraction to the gold plating layer on the chip 2 at the moment, so that the gold plating layer is not easy to separate from the chip 2 and is doped into the insulating rubber 3 on the first plane 11.
In the process that the chip 2 and the plastic package carrier 1 are pressed by the pressing plate, the embodiment of the invention controls the pressing temperature and/or the pressing force of the pressing plate, namely only the pressure temperature of the pressing plate can be controlled, only the pressing force can be controlled, and the pressing temperature and the pressing force can be controlled simultaneously, so that the chip 2 and the first plane 11 of the plastic package carrier 1 are bonded firmly. In this process, the pressing temperature is transmitted to the environment through the pressing plate, wherein the pressing temperature is not influenced by the chip 2 and can accelerate the solidification of the insulating adhesive 3, and the embodiment of the present invention is not limited herein. The pressing force is not limited in the embodiment of the present invention, and the pressing force is not limited in the light of not affecting the chip 2 and improving the adhesion effect of the chip 2 on the adhesive surface, and considering that the pressing plate has a self weight, the pressing force can be increased or decreased according to the self weight of the pressing plate. The means of pressboard magnetic conduction can be realized based on the electro-magnet, realizes pressboard magnetic conduction to other parts circular telegrams on pressboard or the pressboard promptly, realizes canceling magnetic conduction promptly to other parts outage on pressboard or the pressboard.
After the chip 2 is effectively adhered to the first plane 11, the magnetic flux is removed from the laminated board, and then the laminated board is separated from the chip 2 after waiting for a preset time. The advantage of waiting this preset time to compare and canceling the magnetic conduction and leaving the laminated board off chip 2 soon is that the condition that the magnetic margin on the laminated board takes away the gold-plated layer on chip 2 can be effectively reduced.
Further, in the embodiment of the present invention, an insulating film (not shown) may be further interposed between the pressing plate and the chip 2, wherein the thickness of the insulating film does not affect the magnetic attraction force of the magnetic plate on the back gold layer of the chip 2 after the magnetic plate is energized. Set up the insulating film between laminated board and chip 2, some impurity that the insulating film can completely cut off on the laminated board adsorbs on chip 2, avoid appearing influencing the electric potential etc. of chip 2, simultaneously, the insulating film also can restrict the laminated board to have too big magnetic attraction but not influence the magnetic attraction to chip 2 back of the body gold layer to chip 2.
In fact, in the embodiment of the present invention, the plastic package carrier 1 with the chip 2 mounted thereon may be baked for the third time, so that the plastic package carrier 1, the insulating glue 3, and the chip 2 are firmly bonded.
In order to ensure the obtained effects of the first plane 11 and the second plane 12 and to not affect other areas of the plastic package carrier 1, it is further optimized that the following method is further provided in an embodiment of the present invention:
before etching the surface to be bonded of the plastic package carrier 1, covering the area which is not required to be mounted on the plastic package carrier 1 with a mask, and leaving the area which is required to be etched on the first plane 11 and the second plane 12;
after the chip 2 is firmly bonded to the first plane 11, the mask covering the plastic package carrier 1 is removed.
In this embodiment, the area on the plastic package carrier 1 where no die bonding is required is covered with the mask, so that the mask can effectively protect the area on the plastic package carrier 1 where no die bonding is required, and the area on the plastic package carrier 1 where no die bonding is required is prevented from being damaged by mistake during etching. Meanwhile, the thickness of the insulating glue 3 in the first plane 11 and the second plane 12 can be further controlled by using the mask, and the insulating glue 3 is also controlled not to be dotted or climb to an area which does not need to be mounted on the plastic package carrier 1.
If the method for manufacturing the height difference between the first plane 11 and the second plane 12 by only etching the second plane 12 is adopted, the first plane 11 can be covered with a mask before the second plane 12 is etched, and the mask on the first plane 11 is removed after the second plane 12 is etched.
It should be noted that, in the above embodiments, the chip 2 may refer to the chip 2, and the solution indicated in the embodiments of the present invention is a lead or a packaging solution before wire bonding.
In addition, in above implementation scheme, can push down the suction nozzle as far as possible when the point is scribbled the insulating glue and promote the point again, so also can effectively improve cavity and the roughness problem in the insulating glue.
It should be noted that, in this specification, the embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The technical solutions provided by the present invention are described in detail above, and the principle and the implementation manner of the present invention are described in this document by using specific examples, and the description of the above examples is only for assisting understanding of the present invention, and the content of the present description should not be construed as limiting the present invention. While various modifications of the illustrative embodiments and applications herein will be apparent to those skilled in the art, it is not desired to be exhaustive or exhaustive that all such modifications and variations are within the scope of the invention.
Claims (10)
1. A method of fluid dispensing-based microelectronic device packaging, the method comprising:
etching the surface to be bonded of the plastic package carrier to obtain a first plane and a second plane which are connected with each other, wherein the first plane is higher than the second plane;
etching a plurality of point grooves on the first plane, wherein the lowest surface of each point groove is higher than the lowest surface of the plastic package carrier, and insulating particles are pressed into each point groove, and part of each insulating particle is arranged outside each point groove;
dispensing insulating glue on the first plane for multiple times to enable the insulating glue to be fully distributed on the surfaces of the insulating particles and the first plane among the insulating particles;
and when the insulating glue on the first plane is in a semi-solidification state, placing a chip on the glue surface in the semi-solidification state, so that the chip is adhered to the first plane.
2. The method for packaging a microelectronic device based on fluid dispensing as claimed in claim 1, wherein the step of etching the surface to be bonded of the plastic carrier to obtain the first plane and the second plane which are connected with each other comprises:
determining an area corresponding to the surface to be bonded of the chip on the surface to be bonded of the plastic package carrier;
and etching a circle of line groove on the surface to be bonded of the plastic package carrier around the periphery of the area, wherein a first plane is arranged in the area, and the bottom surface of the line groove is a second plane.
3. The method of claim 1, wherein placing the die on the semi-solidified adhesive surface while the insulating adhesive on the first surface is in a semi-solidified state, the step of adhering the die to the first surface comprises:
when the insulating glue on the first plane is in a semi-solidification state, a pressing plate capable of being electrified is arranged above the chip, and the chip is pressed on the glue surface in the semi-solidification state under the condition that the pressing plate is electrified;
and controlling the pressing temperature and/or the pressing force of the pressing plate, so that after the chip is bonded with the first plane, the pressing plate is demagnetized and is left from the chip for a preset time.
4. The method of claim 3,
the laminated board with it has the insulating film to separate between the chip, wherein, the thickness of insulating film does not influence the laminated board is right after magnetic communication the magnetic attraction of chip back of the body gold layer.
5. The method of claim 1,
the step of pressing insulating particles into each of the dot recesses includes:
coating insulating glue in each point groove;
and when the insulating glue in the point grooves is in a semi-solidified state, pressing the insulating particles into each point groove.
6. The method of packaging a microelectronic device according to claim 1 or 5, wherein said plurality of point recesses are uniformly distributed on said first plane.
7. The method of claim 5, wherein the step of dispensing an insulating paste into each of the dispensing grooves further comprises:
and sequentially baking and heating and softening the plastic package carrier for the first time to enable the insulating glue in the point groove to be in a semi-solidified state.
8. The method of claim 1, wherein the step of dispensing the insulating paste multiple times to the first plane further comprises:
and (4) after the insulating glue is repeatedly dripped on the first plane and leveled, the highest point of the leveled insulating glue is more than or equal to that of the insulating particles.
9. The method of claim 1, wherein dispensing the insulating paste onto the first surface a plurality of times such that the insulating paste is spread over the surface of each insulating particle and behind the first surface between each insulating particle further comprises:
and sequentially carrying out secondary baking and secondary heating softening on the plastic packaging carrier to enable the insulating adhesive on the first plane to be in a semi-solidified state.
10. The method of claim 1, further comprising:
before etching the surface to be bonded of the plastic packaging carrier, covering the area, which does not need to be provided with the chip, of the plastic packaging carrier by using a mask, and vacating the area, which needs to be etched, of the first plane and the second plane;
and after the chip is firmly adhered to the first plane, removing the mask covering the plastic package carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211391279.1A CN115513072B (en) | 2022-11-08 | 2022-11-08 | Microelectronic device packaging method based on fluid dispensing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211391279.1A CN115513072B (en) | 2022-11-08 | 2022-11-08 | Microelectronic device packaging method based on fluid dispensing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115513072A CN115513072A (en) | 2022-12-23 |
| CN115513072B true CN115513072B (en) | 2023-03-24 |
Family
ID=84513687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211391279.1A Active CN115513072B (en) | 2022-11-08 | 2022-11-08 | Microelectronic device packaging method based on fluid dispensing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115513072B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002006902A2 (en) * | 2000-07-17 | 2002-01-24 | Board Of Regents, The University Of Texas System | Method and system of automatic fluid dispensing for imprint lithography processes |
| JP2003286456A (en) * | 2002-03-28 | 2003-10-10 | Asahi Kasei Corp | Conductive adhesive sheet having anisotropy and its manufacturing method |
| CN101000878A (en) * | 2007-01-05 | 2007-07-18 | 江苏长电科技股份有限公司 | Method for gluing and chip loading on lead frame of integrated circuit or discrete device |
| JP2012227271A (en) * | 2011-04-18 | 2012-11-15 | Cmk Corp | Insulating/heat dissipating substrate for power module |
| JP2014146674A (en) * | 2013-01-29 | 2014-08-14 | Stanley Electric Co Ltd | Method of manufacturing heat dissipation substrate |
| CN106169449A (en) * | 2015-05-22 | 2016-11-30 | 南茂科技股份有限公司 | Thin film flip chip package and heat dissipation method thereof |
| CN110783304A (en) * | 2019-11-19 | 2020-02-11 | 广东气派科技有限公司 | Packaging welding structure for solving high reliability requirement of 5G GaN chip welding |
| CN214378392U (en) * | 2021-01-27 | 2021-10-08 | 广东气派科技有限公司 | Chip packaging structure with thick hidden mounting adhesive |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040262781A1 (en) * | 2003-06-27 | 2004-12-30 | Semiconductor Components Industries, Llc | Method for forming an encapsulated device and structure |
| JP2010062365A (en) * | 2008-09-04 | 2010-03-18 | Hitachi Ltd | Semiconductor device and method of manufacturing the same |
-
2022
- 2022-11-08 CN CN202211391279.1A patent/CN115513072B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002006902A2 (en) * | 2000-07-17 | 2002-01-24 | Board Of Regents, The University Of Texas System | Method and system of automatic fluid dispensing for imprint lithography processes |
| JP2003286456A (en) * | 2002-03-28 | 2003-10-10 | Asahi Kasei Corp | Conductive adhesive sheet having anisotropy and its manufacturing method |
| CN101000878A (en) * | 2007-01-05 | 2007-07-18 | 江苏长电科技股份有限公司 | Method for gluing and chip loading on lead frame of integrated circuit or discrete device |
| JP2012227271A (en) * | 2011-04-18 | 2012-11-15 | Cmk Corp | Insulating/heat dissipating substrate for power module |
| JP2014146674A (en) * | 2013-01-29 | 2014-08-14 | Stanley Electric Co Ltd | Method of manufacturing heat dissipation substrate |
| CN106169449A (en) * | 2015-05-22 | 2016-11-30 | 南茂科技股份有限公司 | Thin film flip chip package and heat dissipation method thereof |
| CN110783304A (en) * | 2019-11-19 | 2020-02-11 | 广东气派科技有限公司 | Packaging welding structure for solving high reliability requirement of 5G GaN chip welding |
| CN214378392U (en) * | 2021-01-27 | 2021-10-08 | 广东气派科技有限公司 | Chip packaging structure with thick hidden mounting adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115513072A (en) | 2022-12-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102075993B1 (en) | Method of Fabricating White LED Devices | |
| JP4361658B2 (en) | Mounting board and mounting method | |
| US7494845B2 (en) | Method of forming a thin wafer stack for a wafer level package | |
| KR100317648B1 (en) | Semiconductor device having die adhesively bonded by electrically insulating tape, method and apparatus for die bonding | |
| TW201338213A (en) | Method for manufacturing LED package | |
| CN103199187B (en) | A kind of LED encapsulation substrate and encapsulating structure and preparation method thereof | |
| KR20120008054A (en) | Methods and apparatus for forming uniform layers of phosphor material on an led encapsulation structure | |
| JP4595265B2 (en) | Manufacturing method of semiconductor device | |
| CN108615706A (en) | A kind of wafer singualtion method | |
| KR101426434B1 (en) | Manufacturing method of semiconductor light emitting device | |
| US3615946A (en) | Method of embedding semiconductor chip within a dielectric layer flush with surface | |
| CN115513072B (en) | Microelectronic device packaging method based on fluid dispensing | |
| JP2001015531A (en) | Semiconductor device and manufacture thereof | |
| WO2019041366A1 (en) | Method for manufacturing coil, coil, and electronic device | |
| CN116154048A (en) | Method for preparing LED device based on surface patch | |
| JP2007281116A (en) | Method of manufacturing semiconductor device | |
| TW202119890A (en) | Multiayer circuit board and manufacturing method thereof | |
| TW202245157A (en) | Packaging substrate and semiconductor device comprising of the same | |
| JP2008108782A (en) | Electronic equipment and manufacturing method thereof | |
| JP2014203868A (en) | Semiconductor device and semiconductor device manufacturing method | |
| TWI240392B (en) | Process for packaging and stacking multiple chips with the same size | |
| CN212676244U (en) | Die bonding structure | |
| CN102254840A (en) | Semiconductor device and manufacture method thereof | |
| CN103094220A (en) | Storage device, semiconductor device and manufacturing method thereof | |
| KR20130077058A (en) | Led package and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |