CN115512973A - Winding type electrolytic capacitor packaging structure and winding type corrosion-resistant negative electrode foil thereof - Google Patents
Winding type electrolytic capacitor packaging structure and winding type corrosion-resistant negative electrode foil thereof Download PDFInfo
- Publication number
- CN115512973A CN115512973A CN202110694713.2A CN202110694713A CN115512973A CN 115512973 A CN115512973 A CN 115512973A CN 202110694713 A CN202110694713 A CN 202110694713A CN 115512973 A CN115512973 A CN 115512973A
- Authority
- CN
- China
- Prior art keywords
- layer
- conductive
- zinc
- wound
- nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 title claims abstract description 114
- 230000007797 corrosion Effects 0.000 title claims abstract description 82
- 238000005260 corrosion Methods 0.000 title claims abstract description 82
- 239000003990 capacitor Substances 0.000 title claims abstract description 55
- 238000004804 winding Methods 0.000 title claims abstract description 45
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 96
- 239000000463 material Substances 0.000 claims abstract description 91
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 87
- 239000011701 zinc Substances 0.000 claims abstract description 87
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 87
- 150000001875 compounds Chemical class 0.000 claims abstract description 76
- 150000004767 nitrides Chemical class 0.000 claims description 23
- 229910052782 aluminium Inorganic materials 0.000 claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 22
- 229910052721 tungsten Inorganic materials 0.000 claims description 22
- 239000010937 tungsten Substances 0.000 claims description 22
- 239000010936 titanium Substances 0.000 claims description 20
- 229910052719 titanium Inorganic materials 0.000 claims description 20
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 18
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 18
- 229910052804 chromium Inorganic materials 0.000 claims description 18
- 239000011651 chromium Substances 0.000 claims description 18
- 229910052750 molybdenum Inorganic materials 0.000 claims description 18
- 239000011733 molybdenum Substances 0.000 claims description 18
- 229910052715 tantalum Inorganic materials 0.000 claims description 18
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 18
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 18
- 239000008151 electrolyte solution Substances 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 12
- CAVCGVPGBKGDTG-UHFFFAOYSA-N alumanylidynemethyl(alumanylidynemethylalumanylidenemethylidene)alumane Chemical compound [Al]#C[Al]=C=[Al]C#[Al] CAVCGVPGBKGDTG-UHFFFAOYSA-N 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 8
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims description 8
- 229910003468 tantalcarbide Inorganic materials 0.000 claims description 8
- 238000012360 testing method Methods 0.000 claims description 8
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 6
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 claims description 6
- GPBUGPUPKAGMDK-UHFFFAOYSA-N azanylidynemolybdenum Chemical compound [Mo]#N GPBUGPUPKAGMDK-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 6
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 4
- 238000010998 test method Methods 0.000 claims description 4
- QIJNJJZPYXGIQM-UHFFFAOYSA-N 1lambda4,2lambda4-dimolybdacyclopropa-1,2,3-triene Chemical compound [Mo]=C=[Mo] QIJNJJZPYXGIQM-UHFFFAOYSA-N 0.000 claims 4
- 229910039444 MoC Inorganic materials 0.000 claims 4
- SJKRCWUQJZIWQB-UHFFFAOYSA-N azane;chromium Chemical compound N.[Cr] SJKRCWUQJZIWQB-UHFFFAOYSA-N 0.000 claims 4
- UFGZSIPAQKLCGR-UHFFFAOYSA-N chromium carbide Chemical compound [Cr]#C[Cr]C#[Cr] UFGZSIPAQKLCGR-UHFFFAOYSA-N 0.000 claims 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 4
- 229910003470 tongbaite Inorganic materials 0.000 claims 4
- -1 tungsten nitride Chemical class 0.000 claims 4
- 230000003628 erosive effect Effects 0.000 claims 1
- 230000008901 benefit Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229910017105 AlOxNy Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910019966 CrOxNy Inorganic materials 0.000 description 2
- 229910010303 TiOxNy Inorganic materials 0.000 description 2
- CXOWYMLTGOFURZ-UHFFFAOYSA-N azanylidynechromium Chemical compound [Cr]#N CXOWYMLTGOFURZ-UHFFFAOYSA-N 0.000 description 2
- IVHJCRXBQPGLOV-UHFFFAOYSA-N azanylidynetungsten Chemical compound [W]#N IVHJCRXBQPGLOV-UHFFFAOYSA-N 0.000 description 2
- 229910002090 carbon oxide Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- CNEOGBIICRAWOH-UHFFFAOYSA-N methane;molybdenum Chemical compound C.[Mo] CNEOGBIICRAWOH-UHFFFAOYSA-N 0.000 description 2
- FXNGWBDIVIGISM-UHFFFAOYSA-N methylidynechromium Chemical compound [Cr]#[C] FXNGWBDIVIGISM-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
- H01G9/151—Solid electrolytic capacitors with wound foil electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
Abstract
The invention discloses a winding type electrolytic capacitor packaging structure and a winding type corrosion-resistant negative electrode foil thereof. The winding type electrolytic capacitor packaging structure comprises a winding type capacitor, a packaging structure, a first conductive pin and a second conductive pin. The wound capacitor includes a wound positive electrode foil and a wound corrosion-resistant negative electrode foil. The wound capacitor is accommodated in the package structure. The first conductive pin and the second conductive pin are electrically contacted with the winding type capacitor. The wound corrosion-resistant negative electrode foil comprises a conductive substrate, two zinc-containing material layers respectively arranged on two opposite surfaces of the conductive substrate, and two conductive compound layers respectively arranged on the two zinc-containing material layers. Thereby, the overall structural strength of the wound corrosion-resistant negative electrode foil can be improved by the use of the zinc-containing material layer.
Description
Technical Field
The present invention relates to a capacitor package structure and a wound negative electrode foil thereof, and more particularly, to a wound electrolytic capacitor package structure and a wound corrosion-resistant negative electrode foil thereof.
Background
Capacitors have been widely used in basic components of consumer appliances, computer motherboards, power supplies, communication products, automobiles, etc., and their main functions include filtering, bypassing, rectifying, coupling, decoupling, phase inversion, etc., which are one of the indispensable components in electronic products. However, the negative electrode foil of the winding type capacitor in the related art is easily corroded by the electrolyte solution to reduce its original thickness, and when the thickness of the negative electrode foil is reduced, the overall structural strength of the negative electrode foil is also reduced.
Disclosure of Invention
The present invention provides a winding type electrolytic capacitor packaging structure and a winding type corrosion-resistant negative electrode foil thereof, aiming at the defects of the prior art.
In order to solve the above technical problems, one of the technical solutions of the present invention is to provide a winding type electrolytic capacitor package structure, which includes: a winding capacitor, a package structure, a first conductive pin and a second conductive pin. The winding type capacitor comprises a winding type positive electrode foil, a winding type corrosion-resistant negative electrode foil and two winding type insulating separation papers, wherein one of the two winding type insulating separation papers is arranged between the winding type positive electrode foil and the winding type corrosion-resistant negative electrode foil, and one of the winding type positive electrode foil and the winding type corrosion-resistant negative electrode foil is arranged between the two winding type insulating separation papers. The wound capacitor is accommodated in the package structure. The first conductive pin comprises a first embedded part accommodated in the packaging structure and a first exposed part exposed outside the packaging structure, and the first conductive pin is electrically contacted with one of the coiled positive electrode foil and the coiled corrosion-resistant negative electrode foil. The second conductive pin comprises a second embedded part accommodated in the packaging structure and a second exposed part exposed outside the packaging structure, and the second conductive pin is electrically contacted with the other one of the coiled positive electrode foil and the coiled corrosion-resistant negative electrode foil. The wound corrosion-resistant negative electrode foil comprises a conductive substrate, two zinc-containing material layers respectively arranged on two opposite surfaces of the conductive substrate, and two conductive compound layers respectively arranged on the two zinc-containing material layers.
In order to solve the above technical problem, another technical solution of the present invention is to provide a winding type electrolytic capacitor package structure, including: a winding capacitor, a package structure, a first conductive pin and a second conductive pin. The wound capacitor includes a wound positive electrode foil and a wound corrosion-resistant negative electrode foil. The wound capacitor is accommodated in the package structure. The first conductive pin is electrically contacted with one of the coiled positive electrode foil and the coiled corrosion-resistant negative electrode foil. The second conductive pin is electrically contacted with the other one of the coiled positive electrode foil and the coiled corrosion-resistant negative electrode foil. The coiled corrosion-resistant negative electrode foil comprises a conductive substrate, two zinc-containing material layers respectively arranged on two opposite surfaces of the conductive substrate, and two conductive compound layers respectively arranged on the two zinc-containing material layers.
In order to solve the above technical problem, another technical solution of the present invention is to provide a winding type electrolytic capacitor package structure, which includes: a winding capacitor, a package structure, a first conductive pin and a second conductive pin. The wound capacitor includes a wound positive electrode foil and a wound corrosion-resistant negative electrode foil. The wound capacitor is accommodated in the package structure. The first conductive pin is electrically contacted with one of the coiled positive electrode foil and the coiled corrosion-resistant negative electrode foil. The second conductive pin is electrically contacted with the other one of the coiled positive electrode foil and the coiled corrosion-resistant negative electrode foil. The coiled corrosion-resistant negative electrode foil comprises a conductive substrate, two zinc-containing material layers respectively arranged on two opposite surfaces of the conductive substrate, and two conductive compound layers respectively arranged on the two zinc-containing material layers.
In order to solve the above technical problem, another aspect of the present invention is to provide a wound corrosion-resistant negative electrode foil, including: a conductive substrate, two zinc-containing material layers and two conductive compound layers. The two zinc-containing material layers are respectively arranged on the two opposite surfaces of the conductive substrate to respectively contact the two opposite surfaces of the conductive substrate. Two conductive compound layers are respectively disposed on the two zinc-containing material layers to respectively contact the two zinc-containing material layers. Wherein the conductive compound layer is at least one of a nitride layer, a carbide layer, a carbonitride layer, an oxynitride layer, and an oxycarbide layer. Wherein the nitride layer is at least made of nitride (nitride), and the nitride is selected from the group consisting of silicon nitride (Si 3N 4), titanium nitride (TiN), aluminum nitride (AlN), titanium aluminum nitride ((Ti, al) N), chromium nitride (CrN), molybdenum nitride (MoN), tungsten nitride (WN), and tantalum nitride (TaN); wherein the carbide layer is made of at least carbide (carbide) selected from the group consisting of titanium carbide (TiC), aluminum carbide (AlC), chromium carbide (CrC), molybdenum carbide (MoC), tungsten carbide (WC), and tantalum carbide (TaC); wherein the carbonitride layer is made of at least one carbonitride (TiCxNy) selected from the group consisting of titanium carbonitride (TiCxNy), aluminum carbonitride (A1 CxNy), chromium carbonitride (CrCxNy), molybdenum carbonitride (MoCxNy), tungsten carbonitride (WCxNy), and tantalum carbonitride (TaCxNy); wherein the oxynitride layer is at least made of oxynitride, and the oxynitride is selected from the group consisting of titanium oxynitride (TiOxNy), aluminum oxynitride (AlOxNy), chromium oxynitride (CrOxNy), molybdenum oxynitride (MoOxNy), tungsten oxynitride (WOxNy), and tantalum oxynitride (TaOxNy); wherein the oxycarbide layer is made of at least one oxycarbide (carbon oxide) selected from the group consisting of titanium oxycarbide (TiOxCy), aluminum oxycarbide (AlOxCy), chromium oxycarbide (CrOxCy), molybdenum oxycarbide (MoOxCy), tungsten oxycarbide (WOxCy), and tantalum oxycarbide (TaOxCy); wherein the zinc-containing material layer is a pure zinc material layer or a zinc alloy material layer, and the coiled corrosion-resistant negative electrode foil is an annealed negative electrode foil; wherein the structural strength of the zinc-containing material layer is greater than the structural strength of the conductive compound layer, and the structural strength of the conductive compound layer is greater than the structural strength of the conductive substrate; wherein the conductive substrate has an electrical conductivity greater than that of the zinc-containing material layer, and the zinc-containing material layer has an electrical conductivity greater than that of the conductive compound layer; wherein, the adhesion between the zinc-containing material layer and the conductive substrate and the adhesion between the zinc-containing material layer and the conductive compound layer are both larger than the adhesion between the conductive material used for manufacturing the conductive substrate and the conductive material used for manufacturing the conductive compound layer.
One of the benefits of the winding-type electrolytic capacitor packaging structure and the winding-type corrosion-resistant negative electrode foil thereof provided by the invention is that the overall structural strength (or the overall structural rigidity) of the winding-type corrosion-resistant negative electrode foil can be improved by using the zinc-containing material layer through the technical scheme that the winding-type corrosion-resistant negative electrode foil comprises a conductive substrate, two zinc-containing material layers respectively arranged on two opposite surfaces of the conductive substrate, and two conductive compound layers respectively arranged on the two zinc-containing material layers. It is to be noted that the conductive compound layer can be used to prevent the conductive substrate from being corroded by being contacted by the electrolyte solution, so that the thickness of the conductive substrate can be protected from being changed by the conductive compound layer.
For a better understanding of the features and technical content of the present invention, reference is made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.
Drawings
Fig. 1 is a schematic view of a wound capacitor of the wound electrolytic capacitor package structure according to the present invention.
Fig. 2 is a schematic view of a package structure of a wound electrolytic capacitor according to the present invention.
Fig. 3 is a schematic diagram of a wound corrosion-resistant negative foil of a wound electrolytic capacitor package structure according to a first embodiment of the invention.
Fig. 4 is an enlarged schematic view of the portion IV of fig. 3.
Fig. 5 is an enlarged schematic view of a portion V of fig. 3.
Fig. 6 is a schematic view of a wound corrosion-resistant negative foil of a wound electrolytic capacitor package structure according to a second embodiment of the present invention.
Fig. 7 is an enlarged schematic view of a VII portion of fig. 6.
Fig. 8 is an enlarged schematic view of section VIII of fig. 6.
Detailed Description
The following description is provided by way of specific embodiments of the present disclosure on "packaging structure of winding type electrolytic capacitor and winding type corrosion-resistant negative electrode foil", and those skilled in the art can understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modifications and variations in various respects, all without departing from the present invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments are further detailed to explain the technical matters related to the present invention, but the disclosure is not intended to limit the scope of the present invention. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
[ first embodiment ]
Referring to fig. 1 to 5, a first embodiment of the present invention provides a winding type electrolytic capacitor package structure Z, which includes: a winding type capacitor 1, a package structure 2, a first conductive pin 3 and a second conductive pin 4.
First, as shown in fig. 1, the wound capacitor 1 includes a wound positive electrode foil 11, a wound corrosion-resistant negative electrode foil 12, and two wound insulating separator sheets 13. Further, one of the two rolled insulating separator sheets 13 is disposed between the rolled positive electrode foil 11 and the rolled corrosion-resistant negative electrode foil 12, and one of the rolled positive electrode foil 11 and the rolled corrosion-resistant negative electrode foil 12 is disposed between the two rolled insulating separator sheets 13. For example, as shown in fig. 1, a rolled positive foil 11 is disposed between two rolled insulating separator sheets 13. The wound insulating separator paper 13 may be a separator paper or a paper foil to which an electrolytic solution is attached by an impregnation method. However, the present invention is not limited to the above-mentioned examples.
Further, as shown in fig. 1 and fig. 2, the wound capacitor 1 is accommodated in the package structure 2. For example, the package structure 2 includes a housing structure 20 (such as an aluminum housing or other metal housing), but the invention is not limited thereto. In addition, the first conductive pin 3 includes a first embedded portion 31 accommodated inside the package structure 2 and a first exposed portion 32 exposed outside the package structure 2, and the first conductive pin 3 electrically contacts one of the wound positive foil 11 and the wound corrosion-resistant negative foil 12. In addition, the second conductive pin 4 includes a second embedded portion 41 accommodated inside the package structure 2 and a second exposed portion 42 exposed outside the package structure 2, and the second conductive pin 4 electrically contacts with the other one of the wound positive foil 11 and the wound corrosion-resistant negative foil 12.
In addition, as shown in fig. 3 to 5, the rolled corrosion-resistant negative foil 12 includes a conductive substrate 120, two zinc-containing material layers 121, and two conductive compound layers 122. Two zinc-containing material layers 121 are respectively disposed on the opposite surfaces of the conductive substrate 120 to respectively contact the opposite surfaces of the conductive substrate 120. Two conductive compound layers 122 are respectively disposed on the two zinc-containing material layers 121 to respectively contact the two zinc-containing material layers 121. For example, the thickness of the rolled corrosion-resistant negative electrode foil 12 is less than or equal to 50 μm, and the thickness of the conductive compound layer 122 formed on the rolled corrosion-resistant negative electrode foil 12 may be between 10nm and 2000nm (another preferred thickness range is between 10nm and 500 nm). In addition, both surfaces of the conductive substrate 120 may be the roughened surfaces 12000 formed by machining (e.g., rolling, embossing, etc.), and the roughness of the roughened surfaces 12000 may be less than or equal to 50 μm. Thereby, since the surface area of the conductive substrate 120 is increased by the formation of the roughened surface 12000, so that the adhesion strength of the zinc-containing material layer 121 to the conductive substrate 120 can be improved, the zinc-containing material layer 121 is not easy to detach from the conductive substrate 120, so as to effectively improve the reliability of the wound corrosion-resistant negative electrode foil 12 (i.e. improve the adhesion of the zinc-containing material layer 121 to the conductive substrate 120). However, the present invention is not limited to the above-mentioned examples.
In addition, as shown in fig. 4 or 5, the conductive substrate 120 may be an Al material, and the conductive substrate 120 has no oxide layer and no corrosion layer. That is, before the conductive substrate 120 is not oxidized, two zinc-containing material layers 121 may be previously disposed on the two roughened surfaces 12000 of the conductive substrate 120, respectively. For example, the zinc-containing material layer 121 can be a pure zinc material layer or a zinc alloy material layer. In addition, after a structural strength test is performed by a "structural strength tester" (or after a structural rigidity test is performed by a structural rigidity tester), the structural strength (or structural rigidity) of the zinc-containing material layer 121 may be greater than that of the conductive compound layer 122, and the structural strength (or structural rigidity) of the conductive compound layer 122 may be greater than that of the conductive substrate 120. In addition, after a conductivity test by a "conductivity tester", the conductivity (conductivity) of the conductive substrate 120 is greater than that of the zinc-containing material layer 121, and the conductivity of the zinc-containing material layer 121 is greater than that of the conductive compound layer 122. Further, after an adhesion test is performed by an adhesion tester (e.g., a cross-cut adhesion tester), both the adhesion between the zinc-containing material layer 121 and the conductive substrate 120 and the adhesion between the zinc-containing material layer 121 and the conductive compound layer 122 are greater than the adhesion between the conductive material used to fabricate the conductive substrate 120 and the conductive material used to fabricate the conductive compound layer 122 (that is, the adhesion between the conductive substrate 120 and the conductive compound layer 122 when the conductive substrate 120 and the conductive compound layer 122 are connected to each other). Thereby, the overall structural strength (or overall structural rigidity) of the rolled corrosion-resistant negative electrode foil 12 can be improved by the use of the zinc-containing material layer 121. It is noted that the rolled corrosion resistant negative foil 12 may be selected from an annealed negative foil or an unannealed negative foil. However, the present invention is not limited to the above-mentioned examples.
For example, the conductive compound layer 122 may be an electrolyte solution barrier layer with a thickness between 10nm and 2000nm for preventing the conductive substrate 120 (or the zinc-containing material layer 121) from being corroded by the contact of the electrolyte solution, so the thickness of the conductive substrate 120 (or the zinc-containing material layer 121) may not be changed by the protection of the conductive compound layer 122. That is, since the conductive substrate 120 (or the zinc-containing material layer 121) may be reduced in its original thickness by being protected by the conductive compound layer 122 from being corroded by the electrolyte solution, even if the thickness of the conductive compound layer 122 used in the present invention is only 10nm, the conductive substrate 120 may be reduced in its original thickness by being protected by the conductive compound layer 122 from being corroded by the electrolyte solution, so that the rolled corrosion-resistant negative electrode foil 12 may still maintain the structural strength capable of satisfying the subsequent processing conditions. However, the present invention is not limited to the above-mentioned examples.
For example, the conductive compound layer 122 may be at least one of a nitride layer, a carbide layer, a carbonitride layer, an oxynitride layer, and an oxycarbide layer. However, the present invention is not limited to the above-mentioned examples.
More specifically, when the conductive compound layer 122 is a nitride layer, the nitride layer is at least made of nitride (nitride), and the nitride is selected from the group consisting of silicon nitride (Si 3N 4), titanium nitride (TiN), aluminum nitride (AlN), titanium aluminum nitride ((Ti, al) N), chromium nitride (CrN), molybdenum nitride (MoN), tungsten nitride (WN), and tantalum nitride (TaN). However, the present invention is not limited to the above-mentioned examples.
More specifically, when the conductive compound layer 122 is a carbide layer, the carbide layer is made of at least carbide (carbide), and the carbide may be selected from the group consisting of titanium carbide (TiC), aluminum carbide (AlC), chromium carbide (CrC), molybdenum carbide (MoC), tungsten carbide (WC), and tantalum carbide (TaC). However, the present invention is not limited to the above-mentioned examples.
More specifically, when the conductive compound layer 122 is a carbonitride layer, the carbonitride layer is made of at least carbonitride (carbonitride), and the carbonitride may be selected from the group consisting of titanium carbonitride (TiCxNy), aluminum carbonitride (AlCxNy), chromium carbonitride (CrCxNy), molybdenum carbonitride (MoCxNy), tungsten carbonitride (WCxNy), and tantalum carbonitride (TaCxNy). However, the present invention is not limited to the above-mentioned examples.
More specifically, when the conductive compound layer 122 is an oxynitride layer, the oxynitride layer is made of oxynitride, and the oxynitride is selected from the group consisting of titanium oxynitride (TiOxNy), aluminum oxynitride (AlOxNy), chromium oxynitride (CrOxNy), molybdenum oxynitride (MoOxNy), tungsten oxynitride (WOxNy), and tantalum oxynitride (TaOxNy). However, the present invention is not limited to the above-mentioned examples.
More specifically, when the conductive compound layer 122 is an oxycarbide layer, the oxycarbide layer is at least made of oxycarbide (carbon oxide), and the oxycarbide is selected from the group consisting of titanium oxycarbide (TiOxCy), aluminum oxycarbide (AlOxCy), chromium oxycarbide (CrOxCy), molybdenum oxycarbide (MoOxCy), tungsten oxycarbide (WOxCy), and tantalum oxycarbide (TaOxCy). However, the present invention is not limited to the above-mentioned examples.
It is noted that the wound corrosion-resistant negative electrode foil 12 has a "rate of change in electrostatic capacity" of 1 to 10% and a "rate of change in withstand voltage" of 0 to 5% before and after the test by the water resistance test method of EIAJ RC-2364A, which is a specification of japan electronics and information technology industries association (JEITA).
[ second embodiment ]
As shown in fig. 1, fig. 2, and fig. 6 to fig. 8, a second embodiment of the present invention provides a winding type electrolytic capacitor package structure Z, which includes: a winding type capacitor 1, a package structure 2, a first conductive pin 3 and a second conductive pin 4. As can be seen from the comparison between fig. 7 and fig. 4, and the comparison between fig. 8 and fig. 5, the greatest difference between the second embodiment and the first embodiment of the present invention is: in the second embodiment, the conductive substrate 120 has an oxide layer 1200 without an etch layer. That is, after the conductive substrate 120 has been oxidized to form the oxide layer 1200, the two zinc-containing material layers 121 are then disposed on the two roughened surfaces 12000 of the conductive substrate 120, respectively.
It is to be noted that, regardless of whether "the conductive substrate 120 has no oxide layer and no corrosion layer (first embodiment)" or "the conductive substrate 120 has the oxide layer 1200 and no corrosion layer (second embodiment)", the overall structural strength (or overall structural rigidity) of the wound corrosion-resistant negative electrode foil 12 can be improved by using the zinc-containing material layer 121. In addition, the conductive compound layer 122 may serve to prevent the conductive substrate 120 (or the zinc-containing material layer 121) from being corroded by contact with the electrolyte solution, so the thickness of the conductive substrate 120 (or the zinc-containing material layer 121) may be protected by the conductive compound layer 122 without being changed (that is, the conductive substrate 120 (or the zinc-containing material layer 121) may be reduced in its original thickness by protection of the conductive compound layer 122 without being corroded by the electrolyte solution), so that the wound corrosion-resistant negative electrode foil 12 still maintains structural strength capable of satisfying subsequent processing conditions.
[ advantageous effects of the embodiments ]
One of the advantages of the present invention is that the winding type electrolytic capacitor packaging structure Z and the winding type corrosion-resistant negative electrode foil 12 thereof provided by the present invention can improve the overall structural strength (or the overall structural rigidity) of the winding type corrosion-resistant negative electrode foil 12 by using the zinc-containing material layer 121 through the technical scheme that the winding type corrosion-resistant negative electrode foil 12 includes the conductive substrate 120, the two zinc-containing material layers 121 respectively disposed on the two opposite surfaces of the conductive substrate 120, and the two conductive compound layers 122 respectively disposed on the two zinc-containing material layers 121. It is to be noted that the conductive compound layer 122 can be used to prevent the conductive substrate 120 from being corroded by being contacted by the electrolyte solution, so the thickness of the conductive substrate 120 can be protected from being changed by the conductive compound layer 122.
The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.
Claims (10)
1. A winding type electrolytic capacitor package structure, characterized by comprising:
a wound capacitor, said wound capacitor comprising a wound positive foil, a wound corrosion-resistant negative foil, and two wound insulating separator sheets, one of said two wound insulating separator sheets being disposed between said wound positive foil and said wound corrosion-resistant negative foil, one of said wound positive foil and said wound corrosion-resistant negative foil being disposed between said two wound insulating separator sheets;
a package structure, wherein the wound capacitor is accommodated in the package structure;
a first conductive pin, including a first embedded portion housed inside the package structure and a first exposed portion exposed outside the package structure, electrically contacting one of the wound anode foil and the wound corrosion-resistant cathode foil; and
a second conductive pin, wherein the second conductive pin comprises a second embedded part accommodated inside the package structure and a second exposed part exposed outside the package structure, and the second conductive pin is electrically contacted with the other one of the wound anode foil and the wound corrosion-resistant cathode foil;
the wound corrosion-resistant negative electrode foil comprises a conductive substrate, two zinc-containing material layers respectively arranged on two opposite surfaces of the conductive substrate, and two conductive compound layers respectively arranged on the two zinc-containing material layers.
2. The winding type electrolytic capacitor packaging structure according to claim 1,
wherein the thickness of the coiled corrosion-resistant negative foil is less than or equal to 50 μm, both surfaces of the conductive substrate are roughened surfaces, and the roughness of the roughened surfaces is less than or equal to 50 μm;
the conductive substrate is made of aluminum material, and the conductive substrate has no oxide layer and no corrosion layer, or the conductive substrate has an oxide layer and no corrosion layer;
wherein the conductive compound layer is an electrolyte solution barrier layer with a thickness of 10nm to 2000nm for preventing the conductive substrate from being corroded by the contact of the electrolyte solution, so that the thickness of the conductive substrate is not changed by the protection of the conductive compound layer;
wherein the wound corrosion-resistant negative electrode foil is subjected to a water resistance test method of Japan electronic information technology industry Association before and after a test to obtain a rate of change in electrostatic capacity of 1 to 10% and a rate of change in withstand voltage of 0 to 5%;
the zinc-containing material layer is a pure zinc material layer or a zinc alloy material layer, and the wound corrosion-resistant negative electrode foil is an annealed negative electrode foil;
wherein the zinc-containing material layer has a structural strength greater than that of the conductive compound layer, and the conductive compound layer has a structural strength greater than that of the conductive substrate;
wherein the conductive substrate has an electrical conductivity greater than that of the zinc-containing material layer, and the zinc-containing material layer has an electrical conductivity greater than that of the conductive compound layer;
wherein the adhesion force between the zinc-containing material layer and the conductive substrate and the adhesion force between the zinc-containing material layer and the conductive compound layer are both greater than the adhesion force between the conductive material used for manufacturing the conductive substrate and the adhesion force between the conductive material used for manufacturing the conductive compound layer.
3. The winding type electrolytic capacitor packaging structure according to claim 1,
wherein the conductive compound layer is at least one of a nitride layer, a carbide layer, a carbonitride layer, an oxynitride layer, and an oxycarbide layer;
wherein the nitride layer is made of at least a nitride selected from the group consisting of silicon nitride, titanium nitride, aluminum nitride, titanium aluminum nitride, chromium nitride, molybdenum nitride, tungsten nitride, and tantalum nitride;
wherein the carbide layer is made of at least carbide selected from the group consisting of titanium carbide, aluminum carbide, chromium carbide, molybdenum carbide, tungsten carbide, and tantalum carbide;
wherein the carbonitride layer is made of at least carbonitride selected from the group consisting of titanium carbonitride, aluminum carbonitride, chromium carbonitride, molybdenum carbonitride, tungsten carbonitride, and tantalum carbonitride;
wherein the oxynitride layer is made of at least oxynitride, and the oxynitride is selected from the group consisting of titanium oxynitride, aluminum oxynitride, chromium oxynitride, molybdenum oxynitride, tungsten oxynitride, and tantalum oxynitride;
wherein the oxycarbide layer is made of at least one oxycarbide selected from the group consisting of titanium oxycarbide, aluminum oxycarbide, chromium oxycarbide, molybdenum oxycarbide, tungsten oxycarbide, and tantalum oxycarbide.
4. A winding type electrolytic capacitor package structure, characterized by comprising:
a wound capacitor comprising a wound positive foil and a wound corrosion resistant negative foil;
a package structure, wherein the wound capacitor is accommodated in the package structure;
a first conductive pin electrically contacting one of the wound anode foil and the wound corrosion-resistant cathode foil; and
a second conductive pin electrically contacting the other of the wound anode foil and the wound corrosion-resistant cathode foil;
the wound corrosion-resistant negative electrode foil comprises a conductive substrate, two zinc-containing material layers respectively arranged on two opposite surfaces of the conductive substrate, and two conductive compound layers respectively arranged on the two zinc-containing material layers.
5. The packaging structure for rolled electrolytic capacitor according to claim 4,
wherein the thickness of the wound corrosion-resistant negative electrode foil is less than or equal to 50 μm, both surfaces of the conductive substrate are roughened surfaces, and the roughness of the roughened surfaces is less than or equal to 50 μm;
the conductive substrate is made of aluminum material, and the conductive substrate has no oxide layer and no corrosion layer, or the conductive substrate has an oxide layer and no corrosion layer;
wherein the conductive compound layer is an electrolyte solution barrier layer with a thickness of 10nm to 2000nm for preventing the conductive substrate from being corroded by the contact of the electrolyte solution, so that the thickness of the conductive substrate is not changed by the protection of the conductive compound layer;
wherein the wound corrosion-resistant negative electrode foil has a change rate of electrostatic capacity of 1 to 10% and a change rate of withstand voltage of 0 to 5% before and after a test by a water resistance and water resistance test method of Japan electronic information technology industry Association;
the zinc-containing material layer is a pure zinc material layer or a zinc alloy material layer, and the wound corrosion-resistant negative electrode foil is an annealed negative electrode foil;
wherein the zinc-containing material layer has a structural strength greater than that of the conductive compound layer, and the conductive compound layer has a structural strength greater than that of the conductive substrate;
wherein the conductive substrate has an electrical conductivity greater than that of the zinc-containing material layer, and the zinc-containing material layer has an electrical conductivity greater than that of the conductive compound layer;
wherein the adhesion force between the zinc-containing material layer and the conductive substrate and the adhesion force between the zinc-containing material layer and the conductive compound layer are both greater than the adhesion force between the conductive material used for manufacturing the conductive substrate and the adhesion force between the conductive material used for manufacturing the conductive compound layer.
6. The packaging structure for rolled electrolytic capacitor according to claim 4,
wherein the conductive compound layer is at least one of a nitride layer, a carbide layer, a carbonitride layer, an oxynitride layer, and an oxycarbide layer;
wherein the nitride layer is made of at least a nitride selected from the group consisting of silicon nitride, titanium nitride, aluminum nitride, titanium aluminum nitride, chromium nitride, molybdenum nitride, tungsten nitride, and tantalum nitride;
wherein the carbide layer is made of at least carbide selected from the group consisting of titanium carbide, aluminum carbide, chromium carbide, molybdenum carbide, tungsten carbide, and tantalum carbide;
wherein the carbonitride layer is made of at least carbonitride selected from the group consisting of titanium carbonitride, aluminum carbonitride, chromium carbonitride, molybdenum carbonitride, tungsten carbonitride, and tantalum carbonitride;
wherein the oxynitride layer is made of oxynitride, and the oxynitride is selected from the group consisting of titanium oxynitride, aluminum oxynitride, chromium oxynitride, molybdenum oxynitride, tungsten oxynitride, and tantalum oxynitride;
wherein the oxycarbide layer is made of at least one oxycarbide selected from the group consisting of titanium oxycarbide, aluminum oxycarbide, chromium oxycarbide, molybdenum oxycarbide, tungsten oxycarbide, and tantalum oxycarbide.
7. A winding type electrolytic capacitor package structure, characterized by comprising:
a wound capacitor comprising a wound positive foil and a wound corrosion resistant negative foil;
a package structure, wherein the wound capacitor is accommodated in the package structure;
a first conductive pin electrically contacting one of the wound positive foil and the wound corrosion-resistant negative foil; and
a second conductive pin electrically contacting the other of the wound anode foil and the wound corrosion-resistant cathode foil;
the wound corrosion-resistant negative electrode foil comprises a conductive substrate, two zinc-containing material layers respectively arranged on two opposite surfaces of the conductive substrate, and two conductive compound layers respectively arranged on the two zinc-containing material layers.
8. The winding type electrolytic capacitor packaging structure according to claim 7,
wherein the thickness of the coiled corrosion-resistant negative foil is less than or equal to 50 μm, both surfaces of the conductive substrate are roughened surfaces, and the roughness of the roughened surfaces is less than or equal to 50 μm;
wherein the conductive substrate is an aluminum material, and the conductive substrate has no oxide layer and no corrosion layer, or the conductive substrate has an oxide layer and no corrosion layer;
wherein the conductive compound layer is an electrolyte solution barrier layer with a thickness of 10nm to 2000nm for preventing the electrolyte solution from contacting and eroding the conductive substrate, so that the thickness of the conductive substrate is not changed by the protection of the conductive compound layer;
wherein the wound corrosion-resistant negative electrode foil has a change rate of electrostatic capacity of 1 to 10% and a change rate of withstand voltage of 0 to 5% before and after a test by a water resistance and water resistance test method of Japan electronic information technology industry Association;
wherein the zinc-containing material layer is a pure zinc material layer or a zinc alloy material layer, and the coiled corrosion-resistant negative electrode foil is an annealed negative electrode foil;
wherein the zinc-containing material layer has a structural strength greater than that of the conductive compound layer, and the conductive compound layer has a structural strength greater than that of the conductive substrate;
wherein the conductive substrate has an electrical conductivity greater than that of the zinc-containing material layer, and the zinc-containing material layer has an electrical conductivity greater than that of the conductive compound layer;
wherein the adhesion between the zinc-containing material layer and the conductive substrate and the adhesion between the zinc-containing material layer and the conductive compound layer are both greater than the adhesion between the conductive material used to fabricate the conductive substrate and the adhesion between the conductive material used to fabricate the conductive compound layer.
9. The winding type electrolytic capacitor packaging structure according to claim 7,
wherein the conductive compound layer is at least one of a nitride layer, a carbide layer, a carbonitride layer, an oxynitride layer, and an oxycarbide layer;
wherein the nitride layer is made of at least a nitride selected from the group consisting of silicon nitride, titanium nitride, aluminum nitride, titanium aluminum nitride, chromium nitride, molybdenum nitride, tungsten nitride, and tantalum nitride;
wherein the carbide layer is made of at least carbide selected from the group consisting of titanium carbide, aluminum carbide, chromium carbide, molybdenum carbide, tungsten carbide, and tantalum carbide;
wherein the carbonitride layer is made of at least carbonitride selected from the group consisting of titanium carbonitride, aluminum carbonitride, chromium carbonitride, molybdenum carbonitride, tungsten carbonitride, and tantalum carbonitride;
wherein the oxynitride layer is made of at least oxynitride, and the oxynitride is selected from the group consisting of titanium oxynitride, aluminum oxynitride, chromium oxynitride, molybdenum oxynitride, tungsten oxynitride, and tantalum oxynitride;
wherein the oxycarbide layer is made of at least one oxycarbide selected from the group consisting of titanium oxycarbide, aluminum oxycarbide, chromium oxycarbide, molybdenum oxycarbide, tungsten oxycarbide, and tantalum oxycarbide.
10. A rolled corrosion-resistant negative electrode foil, comprising:
a conductive substrate;
two zinc-containing material layers respectively arranged on the two opposite surfaces of the conductive substrate to respectively contact the two opposite surfaces of the conductive substrate; and
two conductive compound layers respectively disposed on the two zinc-containing material layers to respectively contact the two zinc-containing material layers;
wherein the conductive compound layer is at least one of a nitride layer, a carbide layer, a carbonitride layer, an oxynitride layer, and an oxycarbide layer;
wherein the nitride layer is made of at least a nitride selected from the group consisting of silicon nitride, titanium nitride, aluminum nitride, titanium aluminum nitride, chromium nitride, molybdenum nitride, tungsten nitride, and tantalum nitride;
wherein the carbide layer is made of at least carbide selected from the group consisting of titanium carbide, aluminum carbide, chromium carbide, molybdenum carbide, tungsten carbide, and tantalum carbide;
wherein the carbonitride layer is made of at least carbonitride selected from the group consisting of titanium carbonitride, aluminum carbonitride, chromium carbonitride, molybdenum carbonitride, tungsten carbonitride, and tantalum carbonitride;
wherein the oxynitride layer is made of at least oxynitride, and the oxynitride is selected from the group consisting of titanium oxynitride, aluminum oxynitride, chromium oxynitride, molybdenum oxynitride, tungsten oxynitride, and tantalum oxynitride;
wherein the oxycarbide layer is made of at least one oxycarbide selected from the group consisting of titanium oxycarbide, aluminum oxycarbide, chromium oxycarbide, molybdenum oxycarbide, tungsten oxycarbide, and tantalum oxycarbide;
wherein the zinc-containing material layer is a pure zinc material layer or a zinc alloy material layer, and the coiled corrosion-resistant negative electrode foil is an annealed negative electrode foil;
wherein the zinc-containing material layer has a structural strength greater than that of the conductive compound layer, and the conductive compound layer has a structural strength greater than that of the conductive substrate;
wherein the conductive substrate has an electrical conductivity greater than that of the zinc-containing material layer, and the zinc-containing material layer has an electrical conductivity greater than that of the conductive compound layer;
wherein the adhesion between the zinc-containing material layer and the conductive substrate and the adhesion between the zinc-containing material layer and the conductive compound layer are both greater than the adhesion between the conductive material used to fabricate the conductive substrate and the adhesion between the conductive material used to fabricate the conductive compound layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110694713.2A CN115512973A (en) | 2021-06-22 | 2021-06-22 | Winding type electrolytic capacitor packaging structure and winding type corrosion-resistant negative electrode foil thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110694713.2A CN115512973A (en) | 2021-06-22 | 2021-06-22 | Winding type electrolytic capacitor packaging structure and winding type corrosion-resistant negative electrode foil thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115512973A true CN115512973A (en) | 2022-12-23 |
Family
ID=84499297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110694713.2A Pending CN115512973A (en) | 2021-06-22 | 2021-06-22 | Winding type electrolytic capacitor packaging structure and winding type corrosion-resistant negative electrode foil thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115512973A (en) |
-
2021
- 2021-06-22 CN CN202110694713.2A patent/CN115512973A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7428139B2 (en) | Solid electrolytic capacitor | |
| JP2006190878A (en) | Electrolyte capacitor and manufacturing method thereof | |
| US7846218B2 (en) | Method of manufacturing electrolytic capacitor | |
| JP4487818B2 (en) | Metallized film capacitors | |
| US20130076478A1 (en) | Fuse element | |
| TWI748923B (en) | Winding electrolytic capacitor package structure and winding anti-corrosive negative foil | |
| US8208242B2 (en) | Electrode foil and capacitor using the same | |
| TWI731825B (en) | Winding electrolytic capacitor package structure and winding anti-corrosive negative foil | |
| JP4915947B2 (en) | Metallized film capacitors | |
| CN115512973A (en) | Winding type electrolytic capacitor packaging structure and winding type corrosion-resistant negative electrode foil thereof | |
| CN1754235B (en) | Solid electrolytic capacitor | |
| JP3439064B2 (en) | Solid electrolytic capacitors | |
| CN114694974A (en) | Winding type electrolytic capacitor packaging structure and winding type corrosion-resistant negative electrode foil thereof | |
| JP3016421B2 (en) | Aluminum cathode foil for electrolytic capacitors | |
| JP4671339B2 (en) | Multilayer solid electrolytic capacitor | |
| US7885054B2 (en) | Solid electrolytic capacitor | |
| TWI635521B (en) | Capacitor package structure and antioxidative composite electrode foil thereof | |
| US9023186B1 (en) | High performance titania capacitor with a scalable processing method | |
| JPH03150822A (en) | Aluminum electrode for electrolytic capacitor | |
| TWI695395B (en) | Capacitor assembly structure and method thereof | |
| JPH03150820A (en) | Aluminum electrode for electrolytic capacitor | |
| TWI698891B (en) | Capacitor package structure and antioxidative composite electrode foil thereof | |
| JP7143674B2 (en) | metallized film and film capacitors | |
| JP4398561B2 (en) | Aluminum electrolytic capacitor | |
| US20230017039A1 (en) | Solid electrolytic capacitor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication |