CN115500022A - Expansion and shrinkage processing method and device for PCB - Google Patents

Abstract

A method and a device for harmomegathus processing of a PCB board comprise the following steps: collecting the actual expansion and shrinkage target distance of a positioning target in the key process of manufacturing the PCB; calculating an actually measured harmomegathus coefficient according to the actual harmomegathus target distance and the theoretical harmomegathus target distance; and calculating the predicted expansion and shrinkage coefficient, and using the predicted expansion and shrinkage coefficient as the initial expansion and shrinkage coefficient of the PCBs of other batches with the same material number to calibrate the expansion and shrinkage in the PCB manufacturing process. In the embodiment of the invention, because of the key process of manufacturing the PCB, the actual harmomegathus target distance of the positioning target is collected after the laminated board is laminated every time, the harmomegathus abnormity can be found in time, and the actually measured harmomegathus coefficient is calculated according to the actual harmomegathus target distance and the theoretical harmomegathus target distance; the predicted expansion and shrinkage coefficient is calculated according to the actually measured expansion and shrinkage coefficient, the calculated predicted expansion and shrinkage coefficient is more accurate, the expansion and shrinkage change of the PCB in the whole manufacturing process can be accurately fed back, the expansion and shrinkage of the PCB are predicted on the premise of a big data algorithm, the expansion and shrinkage coefficient can be predicted more accurately, cost is saved, and yield is improved.

Description

Expansion and shrinkage processing method and device for PCB

Technical Field

The invention relates to a PCB (printed circuit board), in particular to a method and a device for processing expansion and contraction of the PCB.

Background

Electronic products are increasingly light, thin, short and small, and a Printed Circuit Board (PCB) as a main body for carrying electronic components increasingly exhibits the following characteristics in design: 1. a high multi-layer; 2. multiple lamination (blind buried via structure); 3. the lines are thinner and thinner, and the distance is smaller and smaller; 4. the core (substrate) and the PP (prepreg) as the base material of the printed wiring are becoming thinner and thinner.

The expansion and shrinkage of the PCB are always a difficult control point in the PCB manufacturing process, because the factors influencing the deformation of the board are many, such as the characteristics of the material, and the expansion and shrinkage coefficients of the board have large difference under different temperature and pressure conditions, especially for thin base materials; manufacturing environment, such as temperature and humidity; manufacturing processes, such as high temperature and high pressure in the lamination process; wet processes such as electroplating, cleaning, micro-etching, internal stress release of etching process, mechanical external force of grinding process after hole plugging, etc.; manufacturing parameters such as temperature, pressure, etc. can cause deformation of the sheet.

The traditional management of the harmomegathus is to use X-ray (X-ray) to irradiate the target of the inner layer after lamination to feed back the harmomegathus coefficient of the inner layer. For multiple laminated plates, only the data of the X-ray irradiated inner layer target of the last lamination can be used as the basis for feeding back the expansion and contraction coefficient of the inner layer and judging whether the expansion and contraction are good or not. However, this method has obvious disadvantages, and cannot feed back the expansion and shrinkage variation of the PCB during the whole process and find the expansion and shrinkage abnormality in time.

Disclosure of Invention

The invention provides a method and a device for expanding and contracting a PCB (printed circuit board) aiming at the defects of the prior art.

According to a first aspect of the present invention, there is provided a method for harmomegathus processing of a PCB, comprising:

collecting the actual harmomegathus target distance of a positioning target in the key process of manufacturing the PCB, wherein the key process comprises the target shooting of an X-ray target shooting machine after lamination, and the actual harmomegathus target distance of the positioning target comprises the actual harmomegathus target distance of the positioning target after the lamination of a laminated board each time;

calculating an actually measured expansion and contraction coefficient according to the actual expansion and contraction target distance and the theoretical expansion and contraction target distance;

and calculating a predicted expansion and shrinkage coefficient according to the actually measured expansion and shrinkage coefficient, and using the predicted expansion and shrinkage coefficient as an initial expansion and shrinkage coefficient of the PCBs of the other batches with the same material number to calibrate the expansion and shrinkage in the PCB manufacturing process.

Further, the calculating the measured expansion and contraction coefficient according to the actual expansion and contraction target distance and the theoretical expansion and contraction target distance includes:

arranging a positioning target on a laminated board, using a target shooting machine to shoot the positioning target, and respectively obtaining the shot long edge actual measurement target distance and the shot short edge actual measurement target distance of the laminated board;

calculating according to the actual target distance of the long target edge and the theoretical target distance of the long target edge to obtain an actual measurement expansion and contraction coefficient of the long target edge, and calculating according to the actual measurement target distance of the short target edge and the theoretical target distance of the short target edge to obtain an actual measurement expansion and contraction coefficient of the short target edge;

and calculating to obtain a target long side actual measurement expansion and contraction coefficient median Ax and a target short side actual measurement expansion and contraction coefficient median Ay of the whole batch of plates according to the target long side actual measurement expansion and contraction coefficient and the target short side actual measurement expansion and contraction coefficient.

Further, the measured expansion and contraction coefficient of the long edge of the target is calculated by the following formula:

the actually measured expansion and contraction coefficient of the target short edge is calculated by the following formula:

wherein common X (n) represents the actual measurement expansion and contraction coefficient of the long target edge of the nth PCB, the actual measurement target distance (n) of the long edge represents the actual measurement target distance of the long edge of the nth PCB, the theoretical target distance (n) of the long edge represents the theoretical target distance of the long edge of the nth PCB, common Y (n) represents the actual measurement expansion and contraction coefficient of the short target edge of the nth PCB, the actual measurement target distance (n) of the short edge represents the actual measurement target distance of the short edge of the nth PCB, and the theoretical target distance (n) of the short edge represents the theoretical target distance of the short edge of the nth PCB;

the actual measurement expansion and contraction coefficient median Ax of the long target edge is calculated by the following formula:

Ax＝median(Common X1,Common X2,…，Common Xn，…，Common Xm) ⑶

the actual measurement median of the harmomegathus coefficient Ay of the target short edge is calculated by the following formula:

Ay＝median(Common Y1,Common Y2,…，Common Yn，…，Common Ym) ⑷

wherein Common Xn represents the actual measurement expansion and contraction coefficient of the long target shooting edge of the nth PCB, common Yn represents the actual measurement expansion and contraction coefficient of the short target shooting edge of the nth PCB, n is more than or equal to 1 and less than or equal to m, and n is a natural number. Further, the laminated board comprises one or more laminated boards, for the plurality of laminated boards, the target locating target is hit again by the target shooting machine after each lamination, and the median value of the target hitting measured expansion and contraction coefficient is calculated according to data after each lamination.

Further, the calculating the actual harmomegathus coefficient according to the actual harmomegathus target distance and the theoretical harmomegathus target distance further includes:

optical measurement is carried out during the PCB forming, and the formed long edge actual measurement target distance and the formed short edge actual measurement target distance of the optical expansion and contraction target of the PCB are respectively obtained;

calculating according to the formed long-edge measured target distance and the formed long-edge theoretical target distance to obtain a formed long-edge measured expansion coefficient, and calculating according to the formed short-edge measured target distance and the formed short-edge theoretical target distance to obtain a formed short-edge measured expansion coefficient;

and calculating to obtain a median Zx of the measured expansion and contraction coefficient of the long forming edge and a median Zy of the measured expansion and contraction coefficient of the short forming edge of the whole batch of plates according to the measured expansion and contraction coefficient of the long forming edge and the measured expansion and contraction coefficient of the short forming edge.

Further, the calculating the actual harmomegathus coefficient according to the actual harmomegathus target distance and the theoretical harmomegathus target distance further includes:

after lamination is completed, acquiring actual measurement coordinates of four measurement targets of each layer of core board of the PCB relative to the center of the board;

and calculating the long edge actual measurement expansion and contraction coefficient and the short edge actual measurement expansion and contraction coefficient of each layer of core plate according to the actual measurement coordinates and the theoretical target distance of the measurement target.

Further, the measured expansion and contraction coefficient of the long edge and the measured expansion and contraction coefficient of the short edge of each layer of core board are respectively obtained by the following formula:

wherein Sxn represents the measured expansion and contraction coefficient of the long side of the nth inner layer, syn represents the measured expansion and contraction coefficient of the short side of the nth inner layer, the theoretical target distance X (n) represents the theoretical target distance of the long side of the nth inner layer, and the theoretical target distance Y (n) represents the theoretical target distance of the short side of the nth inner layer, (X11 (n), Y11 (n)), (X12 (n), Y12 (n)), (X21 (n), Y21 (n)), (X22 (n), Y22 (n)) are the coordinates of the four measuring targets of the upper left, the upper right, the lower left and the lower right of the nth inner layer.

Further, the predicted expansion and contraction coefficient is obtained by calculating the following formula:

Stxn(new)＝(Stxn-Sxn)+(Ax-Zx) ⑺

Styn(new)＝(Styn-Syn)+(Ay-Zy) ⑻

wherein Stxn (new) represents the predicted expansion and contraction coefficient of the long side of the nth inner layer, styn (new) represents the predicted expansion and contraction coefficient of the short side of the nth inner layer, stxn represents the initial expansion and contraction coefficient of the long side of the nth inner layer, and Styn represents the initial expansion and contraction coefficient of the short side of the nth inner layer.

Furthermore, the key processing procedure also comprises drilling by a laser drilling machine, outer layer LD I, resistance welding LDI, X-ray measurement after hole plugging grinding and secondary element measurement after forming;

after calculating the actually measured expansion and contraction coefficient according to the actual expansion and contraction target distance and the theoretical expansion and contraction target distance, the method also comprises the following steps:

the actually measured expansion and contraction coefficient comprises a long edge actually measured expansion and contraction coefficient and a short edge actually measured expansion and contraction coefficient;

respectively calculating to obtain a long-side measured expansion and contraction coefficient median value and a short-side measured expansion and contraction coefficient median value according to the long-side measured expansion and contraction coefficient and the short-side measured expansion and contraction coefficient;

and calculating to obtain a long-side control median according to the formed long-side measured expansion and contraction coefficient median Zx and the long-side measured expansion and contraction coefficient median, and calculating to obtain a short-side control median according to the formed short-side measured expansion and contraction coefficient median Zy and the short-side measured expansion and contraction coefficient median.

And in the key manufacturing process, warning information is given for products exceeding the value ranges of the long side control median and the short side control median.

According to a second aspect of the present invention, there is provided a harmomegathus processing device for a PCB board, comprising:

the acquisition module is used for acquiring the actual expansion and shrinkage target distance of a positioning target in a key process for manufacturing the PCB, wherein the key process comprises X-ray target shooting machine target shooting after lamination, laser drilling machine drilling, outer layer LDI, resistance welding LDI, X-ray measurement after hole plugging grinding and secondary element measurement after forming;

the processing module is used for calculating an actual measurement expansion and contraction coefficient according to the actual expansion and contraction target distance and the theoretical expansion and contraction target distance and processing the product in the key manufacturing process according to the actual measurement expansion and contraction coefficient;

and the prediction module is used for calculating a predicted expansion and contraction coefficient according to the actually measured expansion and contraction coefficient, and using the predicted expansion and contraction coefficient as an initial expansion and contraction coefficient of the PCBs in other batches with the same material number so as to calibrate the expansion and contraction in the PCB manufacturing process.

Due to the adoption of the technical scheme, the invention has the beneficial effects that:

the embodiment of the invention provides a method and a device for processing expansion and contraction of a PCB, comprising the following steps: collecting the actual harmomegathus target distance of a positioning target in the key process of manufacturing the PCB, wherein the key process comprises the shooting of an X-ray shooting machine after lamination, and the actual harmomegathus target distance of the positioning target comprises the actual harmomegathus target distance of the positioning target after each lamination of a laminated board; calculating an actually measured expansion and contraction coefficient according to the actual expansion and contraction target distance and the theoretical expansion and contraction target distance; and calculating a predicted expansion and contraction coefficient, and using the predicted expansion and contraction coefficient as an initial expansion and contraction coefficient of the PCBs of the other batches with the same material number so as to calibrate the expansion and contraction in the PCB manufacturing process. In the key process for manufacturing the PCB, because the actual harmomegathus target distance of the positioning target is collected after each lamination of the laminated board, the harmomegathus abnormality can be found in time, and the actually measured harmomegathus coefficient is calculated according to the actual harmomegathus target distance and the theoretical harmomegathus target distance; the predicted expansion and shrinkage coefficient is calculated according to the actually measured expansion and shrinkage coefficient, the calculated predicted expansion and shrinkage coefficient is more accurate, the expansion and shrinkage change of the PCB in the whole manufacturing process can be accurately fed back, the expansion and shrinkage of the PCB are predicted on the premise of a big data algorithm, the expansion and shrinkage coefficient can be predicted more accurately, cost is saved, and yield is improved.

Drawings

Fig. 1 is a flowchart of a harmomegathus processing method for a PCB board according to an embodiment of the present invention;

fig. 2 is a flowchart of calculating an actually measured expansion and contraction coefficient in the expansion and contraction processing method for the PCB according to the first embodiment of the present invention;

fig. 3 is a flowchart of calculating a median of a measured expansion and contraction coefficient in the expansion and contraction processing method for the PCB according to an embodiment of the present invention;

fig. 4 is a flowchart of calculating an actually measured expansion and contraction coefficient in the expansion and contraction processing method for the PCB according to the first embodiment of the present invention;

fig. 5 is a flowchart of management and control according to an actually measured expansion and contraction coefficient in the expansion and contraction processing method for the PCB according to the first embodiment of the present invention;

fig. 6 is a schematic diagram of a program module of an apparatus for processing expansion and contraction of a PCB according to a second embodiment of the present invention in one implementation;

fig. 7 is a schematic diagram of program modules of an expansion and contraction processing apparatus for a PCB according to a second embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. Wherein like elements in different embodiments have been given like element numbers associated therewith. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, one skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present invention have not been shown or described in this specification in order not to obscure the core of the present invention with unnecessary detail, and it is not necessary for those skilled in the art to describe in detail these related operations, so that they can be fully understood from the description in the specification and the general knowledge of those skilled in the art.

Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of clearly describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where a certain sequence must be followed.

The ordinal numbers used herein for the components, such as "first," "second," etc., are used merely to distinguish between the objects described, and do not have any sequential or technical meaning. The term "connected" and "coupled" as used herein includes both direct and indirect connections (couplings), unless otherwise specified.

The first embodiment is as follows:

as shown in fig. 1, an implementation manner of the method for processing expansion and contraction of a PCB according to an embodiment of the present invention includes the following steps:

step 102: in the key process of manufacturing the PCB, the actual expansion and shrinkage target distance of the positioning target is collected. In one embodiment, the critical process comprises post-lamination X-ray target shooting, and the acquiring the actual harmomegathus target distance of the positioning target comprises acquiring the actual harmomegathus target distance of the positioning target after each lamination of the laminated plate.

In one embodiment, the following key processes are required as key points for data collection:

1. laminated X-ray target shooting machine target shooting

And (4) after lamination, the X-ray target shooting machine can carry out the target shooting of the drilled positioning holes, and the positioning targets at the four corners of the board are grabbed during the target shooting. The design of the positioning targets is typically designed at the four corners of the plate, with the various inner layers overlapping in the vertical direction.

2. Drilling hole of laser drilling machine

The positioning targets at the four corners of the plate are grabbed during laser drilling, and the positioning targets are generally designed at the four corners of the plate.

During laser drilling, the machine equipment can generate data in real time, and the data are the actual measurement target distance and the theoretical target distance of the long edge and the short edge of the positioning target.

By the same principle, the data of the whole batch of plates are analyzed, and the measured median values Bx and By (in ppm) of the harmomegathus coefficient of the long side and the short side of the whole batch can be obtained.

3. Outer LDI

Similarly, the stage equipment can generate data in real time in the outer-layer LDI (laser direct imaging), and the data are the actual measurement target distance and the theoretical target distance of the long side and the short side of the positioning target.

The data of the whole batch of plates are analyzed, and the measured median values Cx and Cy (in ppm) of the expansion and contraction coefficients of the long side and the short side of the whole batch can be obtained.

4. Two-dimensional optical measurement before molding

And performing quadratic optical measurement before forming, wherein the equipment can grab the target at the edge of the plate and generate data in real time, and the data is the actual measurement target distance and the theoretical target distance of the long edge and the short edge of the positioning target.

The data of the whole batch of boards are analyzed, and the measured median coefficients Zx and Zy (in ppm) of the harmomegathus coefficient of the whole batch of long and short sides can be obtained.

5. Other processes

In the same way, data collection can be performed for other processes, such as LDI, X-ray measurement after hole-filling polishing, etc. The measured median value of the expansion and contraction coefficient can be represented by Dx, dy, ex, ey, \8230.

Step 104: and calculating the actually measured expansion and shrinkage coefficient according to the actual expansion and shrinkage target distance and the theoretical expansion and shrinkage target distance.

Step 106: and calculating the predicted expansion and shrinkage coefficient, and using the predicted expansion and shrinkage coefficient as the initial expansion and shrinkage coefficient of the PCBs of other batches with the same material number to calibrate the expansion and shrinkage in the PCB manufacturing process.

Further, as shown in fig. 2, step 104 may include the steps of:

step 202: and setting a positioning target on the laminated board, shooting the positioning target by using a shooting machine, and respectively obtaining the shot long-edge actual measurement target distance and the shot short-edge actual measurement target distance of the laminated board.

Step 204: and calculating according to the actual target distance of the long target edge and the theoretical target distance of the long target edge to obtain the actual harmomegathus coefficient of the long target edge, and calculating according to the actual target distance of the short target edge and the theoretical target distance of the short target edge to obtain the actual harmomegathus coefficient of the short target edge.

In one embodiment, the measured expansion and contraction coefficient of the long target edge is calculated by the following formula:

the equation is multiplied by 1000000 to convert the product into ppm unit, which is the same as the following.

The actually measured expansion and contraction coefficient of the target short side is calculated by the following formula:

wherein common X (n) represents the actual measurement expansion and contraction coefficient of the long target edge of the nth PCB, the actual measurement target distance (n) of the long edge represents the actual measurement target distance of the long edge of the nth PCB, the theoretical target distance (n) of the long edge represents the theoretical target distance of the long edge of the nth PCB, common Y (n) represents the actual measurement expansion and contraction coefficient of the short target edge of the nth PCB, the actual measurement target distance (n) of the short edge represents the actual measurement target distance of the short edge of the nth PCB, and the theoretical target distance (n) of the short edge represents the theoretical target distance of the short edge of the nth PCB;

step 206: and calculating to obtain a practical measured expansion and shrinkage coefficient median Ax of the long target side and a practical measured expansion and shrinkage coefficient median Ay of the short target side of the whole batch of plates according to the practical measured expansion and shrinkage coefficient of the long target side and the practical measured expansion and shrinkage coefficient of the short target side.

In one embodiment, the median Ax of the measured expansion and contraction coefficients of the long target edge is calculated by the following formula:

Ax＝median(Common X1,Common X2,…，Common Xn，…，Common Xm) ⑶

and (3) calculating the median Ay of the actually measured harmomegathus coefficient of the short side of the target by the following formula:

Ay＝median(Common Y1,Common Y2,…，Common Yn，…，Common Ym) ⑷

wherein Common Xn represents the actual measurement expansion and contraction coefficient of the long target shooting edge of the nth PCB, common Yn represents the actual measurement expansion and contraction coefficient of the short target shooting edge of the nth PCB, n is more than or equal to 1 and less than or equal to m, and n is a natural number.

Further, the laminated board comprises one or more laminated boards, for the laminated boards, the target shooting machine carries out target shooting on the positioning target again after each lamination, and the median value of the measured expansion and contraction coefficient of the target shooting is calculated according to data after each lamination.

For multiple laminated plates, an X-ray targeting process is carried out after each lamination, so that data after each lamination can be collected and a measured median expansion and contraction coefficient value can be calculated. In the same way, the median coefficient of expansion and contraction of the first sub-sheet lamination is marked as A1x and A1y, the median coefficient of expansion and contraction of the second sub-sheet lamination is marked as A2x and A2y, and so on.

Further, as shown in fig. 3, step 104 may further include the following steps:

step 302: and (3) carrying out optical measurement during the forming of the PCB, and respectively obtaining the formed long-edge actual measurement target distance and the formed short-edge actual measurement target distance of the optical expansion and shrinkage target of the PCB.

Step 304: and calculating according to the actual measurement target distance of the long forming edge and the theoretical target distance of the long forming edge to obtain the actual measurement expansion and contraction coefficient of the long forming edge, and calculating according to the actual measurement target distance of the short forming edge and the theoretical target distance of the short forming edge to obtain the actual measurement expansion and contraction coefficient of the short forming edge.

Step 306: and calculating to obtain a median Zx of the measured expansion and contraction coefficient of the long forming edge and a median Zy of the measured expansion and contraction coefficient of the short forming edge of the whole batch of plates according to the measured expansion and contraction coefficient of the long forming edge and the measured expansion and contraction coefficient of the short forming edge.

Further, as shown in fig. 4, step 104 may further include the following steps:

step 402: after lamination is completed, acquiring actual measurement coordinates of four measurement targets of each layer of core board of the PCB relative to the center of the board;

step 404: and respectively calculating the long edge actual measurement expansion and contraction coefficient and the short edge actual measurement expansion and contraction coefficient of each layer of core plate according to the actual measurement coordinates and the theoretical target distance of the measurement target.

In one embodiment, the measured expansion and contraction coefficient of the long side of each core plate is calculated by the following formula:

the actually measured expansion and contraction coefficient of the short edge of each layer of core plate is obtained by calculating according to the following formula:

wherein Sxn represents the measured expansion and contraction coefficient of the long side of the nth inner layer, syn represents the measured expansion and contraction coefficient of the short side of the nth inner layer, the theoretical target distance X (n) represents the theoretical target distance of the long side of the nth inner layer, and the theoretical target distance Y (n) represents the theoretical target distance of the short side of the nth inner layer, (X11 (n), Y11 (n)), (X12 (n), Y12 (n)), (X21 (n), Y21 (n)), (X22 (n), and Y22 (n)) are the coordinates of the four measurement targets of the nth inner layer. The center of the PCB is taken as the center (0, 0), (X11 (n), Y11 (n)), (X12 (n), Y12 (n)), (X21 (n), Y21 (n)), (X22 (n), Y22 (n)) of a plane coordinate system, and the coordinates of four measurement targets of the upper left, the upper right, the lower left and the lower right of the nth inner layer are respectively.

Further, the prediction expansion and contraction coefficient can be specifically obtained by calculating according to the following formula:

Stxn(new)＝(Stxn-Sxn)+(Ax-Zx) ⑺

Styn(new)＝(Styn-Syn)+(Ay-Zy) ⑻

wherein Stxn (new) represents the long side predicted expansion and contraction coefficient of the nth inner layer, styn (new) represents the short side predicted expansion and contraction coefficient of the nth inner layer, stxn represents the long side initial expansion and contraction coefficient of the nth inner layer, and Styn represents the short side initial expansion and contraction coefficient of the nth inner layer.

In one embodiment, step 104 may be followed by:

step 105: and processing the product in the key manufacturing process according to the actually measured expansion and contraction coefficient.

Furthermore, the key processing procedure can also comprise drilling by a laser drilling machine, outer layer LDI, solder resistance LDI, X-ray measurement after hole plugging grinding and secondary element measurement after forming; as shown in fig. 5, step 105 may include the following steps:

step 502: the measured expansion and contraction coefficients comprise a long-side measured expansion and contraction coefficient and a short-side measured expansion and contraction coefficient, and a long-side measured expansion and contraction coefficient median value and a short-side measured expansion and contraction coefficient median value are respectively calculated according to the long-side measured expansion and contraction coefficient and the short-side measured expansion and contraction coefficient;

step 504: and calculating to obtain a long-side control median according to the formed long-side measured expansion and contraction coefficient median Zx and the long-side measured expansion and contraction coefficient median, and calculating to obtain a short-side control median according to the formed short-side measured expansion and contraction coefficient median Zy and the short-side measured expansion and contraction coefficient median.

Step 506: in the key process, warning information is given to products exceeding the value ranges of the long-side control median and the short-side control median.

In the traditional expansion and shrinkage control mode, for multiple laminated plates, only the data of the X-ray irradiated inner layer target of the last lamination can be used as the basis for feeding back the expansion and shrinkage coefficient of the inner layer and judging whether the alignment is good or not. If the PCB has poor alignment before the manufacturing process, the defective products will flow into the subsequent manufacturing process continuously, resulting in waste of working hours and manufacturing process. The invention monitors each key process, predicts the accurate expansion and contraction coefficient, gives early warning in real time, and is beneficial to saving cost, improving yield and improving process capability.

After the data collection phase, the process can be managed. In particular the governing median, can be calculated from the large amount of data acquired during the data collection phase. The specific operation and calculation mode is as follows:

1. OPE punching after inner layer etching (i.e. lamination locating hole punching)

After the inner layer etching process is completed, the positioning holes are punched on the plate edges. Typically at the four corners of the board or at the center of the board edges.

The control median of the plate for fixed-distance target shooting is a long-edge target distance theoretical value and a short-edge target distance theoretical value.

Boards that exceed the regulatory limits (typically +/-0.5mil, mil length units, 1mil =1/1000 inch) are highlighted and given warning information.

The upper and lower limits of control can be adjusted according to the actual conditions of the plate (such as the layer, the minimum hole ring, the requirements of the finished products of customers, and the like).

2. Laminated X-ray target shooting machine target shooting

And (3) target shooting by the laminated X-ray (X-ray) target shooting machine, wherein the control median of the long side is marked as delta Ax, and the control median of the short side is marked as delta Ay. The calculation formula is as follows:

δAx＝Ax-Zx

δAy＝Ay-Zy

where δ Ax represents the long-side control median value after the last lamination, and δ Ay represents the short-side control median value after the last lamination.

The regulatory limits are typically +/-100ppm (the regulatory limits can be adjusted according to the actual conditions of the panel (e.g., level, minimum hole ring, surface treatment, customer end product requirements, etc.).

The panels that exceed the regulatory limits will be highlighted and warning information given.

For multiple laminated boards, the control median mode of the long side and the short side of the sub-board is as follows:

first lamination:

δA1x＝A1x-Zx

δA1y＝A1y-Zy

and (3) second lamination:

δA2x＝A2x-Zx

δA2y＝A2y-Zy

and so on. The upper and lower limits of the control are the same as the last lamination.

3. Outer LDI

The control median of the outer LDI long and short sides is respectively marked as: δ Bx and δ By. The calculation formula is as follows:

δBx＝Bx-Zx

δBy＝By-Zy

the regulatory limits are typically +/-50ppm (the regulatory limits can be adjusted according to the actual conditions of the panel).

The panels that exceed the regulatory upper and lower limits may be highlighted and given warning information.

4. Two-dimensional optical measurement before molding

In a two-dimensional optical measurement before forming, the control median of the long and short sides should be 0 (i.e. the finished product size meets the size designed by the customer).

The regulatory limits are typically +/-100ppm (the regulatory limits can be adjusted according to the actual conditions of the panel).

The panels that exceed the regulatory limits will be highlighted and warning information given.

5. Other processes

Similarly, the present invention can also be used to control other processes, such as solder mask LDI, X-ray measurement after via hole polishing, etc. The control median values can be represented by delta Dx, delta Dy, delta Ex, delta Ey, \ 8230, respectively.

The calculation formula is as follows:

δDx＝Dx-Zx

δDy＝Dy-Zy

δEx＝Ex-Zx

δEy＝Ey-Zy

……

the panels that exceed the regulatory upper and lower limits may be highlighted and given warning information.

The key processing of the invention comprises X-ray target shooting machine target shooting after lamination, laser drilling machine drilling, outer layer LDI, resistance welding LDI, X-ray measurement after hole plugging grinding and quadratic element optical measurement after forming.

The second embodiment:

as shown in fig. 6 and 7, an implementation manner of the apparatus for processing expansion and contraction of a PCB according to an embodiment of the present invention includes an acquisition module 610, a processing module 620, and a prediction module 630.

The collecting module 610 is used for collecting the actual harmomegathus target distance of the positioning target in the key process of manufacturing the PCB, wherein the key process comprises the shooting of an X-ray (X-ray) shooting machine after lamination, and the collection of the actual harmomegathus target distance of the positioning target comprises the collection of the actual harmomegathus target distance of the positioning target after each lamination of the laminated board;

the processing module 620 is configured to calculate an actually measured harmomegathus coefficient according to the actual harmomegathus target distance and the theoretical harmomegathus target distance;

the prediction module 630 is configured to calculate a predicted expansion and contraction coefficient according to the measured expansion and contraction coefficient, and use the predicted expansion and contraction coefficient as an initial expansion and contraction coefficient of the PCBs in the other batches with the same material number to calibrate the expansion and contraction in the PCB manufacturing process.

Further, the expansion and contraction processing apparatus for a PCB provided in the embodiment of the present invention may further include a control module 640.

The control module 640 is used for processing the product in the critical process according to the actually measured expansion and contraction coefficient.

Those skilled in the art will appreciate that all or part of the functions of the various methods in the above embodiments may be implemented by hardware, or may be implemented by computer programs. When all or part of the functions of the above embodiments are implemented by a computer program, the program may be stored in a computer-readable storage medium, and the storage medium may include: a read only memory, a random access memory, a magnetic disk, an optical disk, a hard disk, etc., and the program is executed by a computer to realize the above functions. For example, the program may be stored in a memory of the device, and when the program in the memory is executed by the processor, all or part of the functions described above may be implemented. In addition, when all or part of the functions in the above embodiments are implemented by a computer program, the program may be stored in a storage medium such as a server, another computer, a magnetic disk, an optical disk, a flash disk, or a removable hard disk, and may be downloaded or copied to a memory of a local device, or may be version-updated in a system of the local device, and when the program in the memory is executed by a processor, all or part of the functions in the above embodiments may be implemented.

The present invention has been described in terms of specific examples, which are provided to aid in understanding the invention and are not intended to be limiting. For a person skilled in the art to which the invention pertains, several simple deductions, modifications or substitutions may be made according to the idea of the invention.

Claims (10)

1. A collapsible processing method for a PCB board is characterized by comprising the following steps:

collecting the actual harmomegathus target distance of a positioning target in the key process of manufacturing the PCB, wherein the key process comprises the shooting of an X-ray shooting machine after lamination, and the actual harmomegathus target distance of the positioning target comprises the actual harmomegathus target distance of the positioning target after each lamination of a laminated board;

calculating an actually measured expansion and contraction coefficient according to the actual expansion and contraction target distance and the theoretical expansion and contraction target distance;

and calculating a predicted expansion and contraction coefficient according to the actually measured expansion and contraction coefficient, and using the predicted expansion and contraction coefficient as an initial expansion and contraction coefficient of the PCB of the other batches with the same material number so as to calibrate the expansion and contraction in the PCB manufacturing process.

2. The method of claim 1, wherein the calculating the measured target distance from the actual target distance and the theoretical target distance comprises:

arranging a positioning target on a laminated board, using a target shooting machine to shoot the positioning target, and respectively obtaining the shot long edge actual measurement target distance and the shot short edge actual measurement target distance of the laminated board;

calculating according to the actual measurement target distance of the long target edge and the theoretical target distance of the long target edge to obtain an actual measurement harmomegathus coefficient of the long target edge, and calculating according to the actual measurement target distance of the short target edge and the theoretical target distance of the short target edge to obtain an actual measurement harmomegathus coefficient of the short target edge;

and calculating to obtain a target long side actual measurement expansion and contraction coefficient median Ax and a target short side actual measurement expansion and contraction coefficient median Ay of the whole batch of plates according to the target long side actual measurement expansion and contraction coefficient and the target short side actual measurement expansion and contraction coefficient.

3. The method of claim 2, wherein the measured expansion and contraction coefficient of the long side of the target is calculated by the following formula:

the actually measured expansion and contraction coefficient of the target short edge is calculated by the following formula:

wherein common X (n) represents the actual measurement expansion and contraction coefficient of the long target edge of the nth PCB, the actual measurement target distance (n) of the long edge represents the actual measurement target distance of the long edge of the nth PCB, the theoretical target distance (n) of the long edge represents the theoretical target distance of the long edge of the nth PCB, common Y (n) represents the actual measurement expansion and contraction coefficient of the short target edge of the nth PCB, the actual measurement target distance (n) of the short edge represents the actual measurement target distance of the short edge of the nth PCB, and the theoretical target distance (n) of the short edge represents the theoretical target distance of the short edge of the nth PCB;

the actual measurement expansion and contraction coefficient median Ax of the long target edge is calculated by the following formula:

Ax＝median(Common X1,Common X2,…，Common Xn，…，Common Xm) ⑶

the actual measurement harmomegathus coefficient median Ay of the target short side is calculated by the following formula:

Ay＝median(Common Y1,Common Y2,…，Common Yn，…，Common Ym) ⑷

wherein Common Xn represents the actually measured expansion and contraction coefficient of the long target side of the nth PCB, common Yn represents the actually measured expansion and contraction coefficient of the short target side of the nth PCB, n is more than or equal to 1 and less than or equal to m, and n is a natural number.

4. The method of claim 2, wherein the laminate comprises one or more laminates, and for multiple laminates, the target positioning machine performs target practice again after each lamination, and the median measured target shrinkage coefficient is calculated according to data after each lamination.

5. The method of claim 2, wherein the calculating the measured expansion and contraction coefficient according to the actual expansion and contraction target distance and the theoretical expansion and contraction target distance further comprises:

optical measurement is carried out during the PCB forming, and the formed long edge actual measurement target distance and the formed short edge actual measurement target distance of the optical expansion and contraction target of the PCB are respectively obtained;

calculating according to the formed long-edge measured target distance and the formed long-edge theoretical target distance to obtain a formed long-edge measured expansion coefficient, and calculating according to the formed short-edge measured target distance and the formed short-edge theoretical target distance to obtain a formed short-edge measured expansion coefficient;

and calculating to obtain a median Zx of the measured expansion and contraction coefficient of the long forming edge and a median Zy of the measured expansion and contraction coefficient of the short forming edge of the whole batch of plates according to the measured expansion and contraction coefficient of the long forming edge and the measured expansion and contraction coefficient of the short forming edge.

6. The method of claim 5, wherein calculating the measured target-to-target ratio based on the actual target-to-target distance and the theoretical target-to-target distance further comprises:

after lamination is completed, acquiring actual measurement coordinates of four measurement targets of each layer of core board of the PCB relative to the center of the board;

and calculating the long edge actual measurement expansion and contraction coefficient and the short edge actual measurement expansion and contraction coefficient of each layer of core plate according to the actual measurement coordinates and the theoretical target distance of the measurement target.

7. The method of claim 6, wherein the measured expansion and contraction coefficients of the long side and the short side of each core are calculated by the following formulas:

wherein Sxn represents the measured expansion and contraction coefficient of the long side of the nth inner layer, syn represents the measured expansion and contraction coefficient of the short side of the nth inner layer, the theoretical target distance X (n) represents the theoretical target distance of the long side of the nth inner layer, and the theoretical target distance Y (n) represents the theoretical target distance of the short side of the nth inner layer, (X11 (n), Y11 (n)), (X12 (n), Y12 (n)), (X21 (n), Y21 (n)), (X22 (n), Y22 (n)) are the coordinates of the four measuring targets of the upper left, the upper right, the lower left and the lower right of the nth inner layer.

8. The method of claim 7, wherein the predicted harmomegathus coefficient is calculated by the following formula:

Stxn(new)＝(Stxn-Sxn)+(Ax-Zx) (7)

Styn(new)＝(Styn-Syn)+(Ay-Zy) (8)

wherein Stxn (new) represents the predicted expansion and contraction coefficient of the long side of the nth inner layer, styn (new) represents the predicted expansion and contraction coefficient of the short side of the nth inner layer, stxn represents the initial expansion and contraction coefficient of the long side of the nth inner layer, and Styn represents the initial expansion and contraction coefficient of the short side of the nth inner layer.

9. The method of claim 1, wherein the critical processes further include laser drill drilling, outer layer LDI, solder mask LDI, X-ray measurement after hole-filling grinding, and two-dimensional optical measurement after molding;

after calculating the actually measured expansion and contraction coefficient according to the actual expansion and contraction target distance and the theoretical expansion and contraction target distance, the method also comprises the following steps:

the actually measured expansion and contraction coefficient comprises a long edge actually measured expansion and contraction coefficient and a short edge actually measured expansion and contraction coefficient;

respectively calculating to obtain a long-side measured expansion and contraction coefficient median value and a short-side measured expansion and contraction coefficient median value according to the long-side measured expansion and contraction coefficient and the short-side measured expansion and contraction coefficient;

calculating to obtain a long-side control median according to the formed long-side measured expansion and contraction coefficient median Zx and the long-side measured expansion and contraction coefficient median, and calculating to obtain a short-side control median according to the formed short-side measured expansion and contraction coefficient median Zy and the short-side measured expansion and contraction coefficient median;

and in the key process, warning information is given for products exceeding the value ranges of the long-side control median and the short-side control median.

10. An expansion and contraction processing device for a PCB (printed circuit board), comprising:

the collecting module is used for collecting the actual harmomegathus target distance of the positioning target in the key process of manufacturing the PCB, wherein the key process comprises the shooting of an X-ray shooting machine after lamination, and the actual harmomegathus target distance of the positioning target comprises the actual harmomegathus target distance of the positioning target after each lamination of the laminated board;

the processing module is used for calculating an actually measured harmomegathus coefficient according to the actual harmomegathus target distance and the theoretical harmomegathus target distance;

and the prediction module is used for calculating a predicted expansion and contraction coefficient according to the actually measured expansion and contraction coefficient, and using the predicted expansion and contraction coefficient as an initial expansion and contraction coefficient of the PCBs in other batches with the same material number so as to calibrate the expansion and contraction in the PCB manufacturing process.

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