CN115499052A

CN115499052A - L-waveband low-orbit satellite multi-channel TR assembly

Info

Publication number: CN115499052A
Application number: CN202211143255.4A
Authority: CN
Inventors: 许堂明; 谭勇; 左地平; 白吟蕊
Original assignee: Chongqing Liangjiang Satellite Mobile Communication Co Ltd
Current assignee: Chongqing Liangjiang Satellite Mobile Communication Co Ltd
Priority date: 2022-09-20
Filing date: 2022-09-20
Publication date: 2022-12-20

Abstract

The application discloses L wave band low orbit satellite multichannel TR subassembly, including first module, first module includes three at least receiver boards, three at least transmitter boards and radio frequency interface: the three receiving plates and the three transmitting plates are sequentially and alternately arranged to form a circular structure; the radio frequency interface specifically comprises three receiving interfaces and three transmitting interfaces; the receiving interfaces and the transmitting interfaces are alternately arranged to form a circular structure; the three receiving plates are respectively and correspondingly connected with the three receiving interfaces to form receiving channels; the three transmitting plates are respectively and correspondingly connected with the three transmitting interfaces to form transmitting channels. Through setting up receiver plate and the transmitter plate that alternate arrangement forms circular structure in proper order, set up radio frequency interface and correspond with receiver plate and transmitter plate and be connected and form receiving channel and transmitting channel respectively, TR subassembly receiving and dispatching passageway simultaneous working adopts the receiving and dispatching pilot frequency to realize full duplex communication, through integrated three receiving and dispatching passageway in the subassembly, reduces the size, improves the integrated level, satisfies the antenna array face demand of arranging simultaneously.

Description

L-waveband low-orbit satellite multi-channel TR assembly

Technical Field

The application relates to the field of satellite communication, in particular to an L-band low-orbit satellite multichannel TR component.

Background

The low earth orbit satellite is provided with an L-band digital phased array, so that the functions of signal receiving and transmitting, digital beam forming, channelization, subband mapping, physical layer modulation and demodulation and the like of a mobile communication service and a data acquisition service are completed, and the voice and data communication and data acquisition Internet of things services are supported. The satellite earth-based satellite communication system has a DBF digital processing function and achieves satellite earth coverage through beam forming. In order to realize the DBF function, each transmit-receive channel needs a set of independent TR components, and the beamforming is realized in the baseband.

In the prior art, a receiver adopts one-time frequency conversion, the conditions that gain, power consumption and the like cannot meet the requirements of the current low-orbit communication satellite can be generated, in order to meet the power consumption and the gain, a receiving end firstly carries out two-time down-conversion, filtering and numerical control on signals of a plurality of channels and then sends the signals into an AD (analog-to-digital) module, a transmitting end filters the signals output by the DA module and then carries out two-time up-conversion output, and although the signals can be received and sent, the problems of power consumption increase, heat control management difficulty caused by large heat productivity, cost increase and reliability reduction caused by the increase of devices and the like can be caused due to the adoption of the two-time frequency conversion.

A traditional L-waveband high-power TR component adopts a gallium nitride power tube, so that the working voltage is large, a plurality of working voltage rails are arranged, a plurality of protection devices are arranged, the size is large, the power consumption is high, the reliability is low, and multi-channel integration is difficult to perform. The products with higher reliability mostly adopt bare chip devices, and the cost is high and the large-scale production is difficult. The number of the channels is one receiving and one transmitting, two receiving and two transmitting or four receiving and four transmitting, and the channels are square in structure. The external radio frequency cable of TR subassembly connects the duplexer of large size, and the radio frequency cable can bring extra loss, is difficult to integrate to in the large-scale digital phased array. Amplitude and phase of each channel need to be calibrated in a digital phased array system, in a traditional DBF system, an amplitude and phase control function is realized in a baseband, and a TR component is not provided with a gain control device. In a low-earth-orbit satellite communication system, the gain required by a receiving channel is very large, and how to perform calibration is also a problem to be solved.

Disclosure of Invention

The technical problem that this application will be solved is that traditional TR subassembly appearance restriction, be difficult to integrate the multichannel to in the restricted space, aim at provides an L wave band low orbit satellite multichannel TR subassembly, through set up three receiver plates and three transmitter plates in every TR subassembly, set up radio frequency interface and include that receiving interface and transmitter interface alternate arrangement form circular structure and be connected formation receiving channel and transmitting channel respectively with receiver plate and transmitter plate, through receiving channel alternate arrangement in the subassembly integrated a plurality of receiving and dispatching passageways, improve the integrated level when reducing the size.

The application is realized by the following technical scheme:

an L-band low-orbit satellite multichannel TR assembly comprises a first module, wherein the first module comprises at least three receiving plates, at least three transmitting plates and a radio frequency interface:

the three receiving plates and the three transmitting plates are sequentially and alternately arranged to form a circular structure;

the radio frequency interface specifically comprises three receiving interfaces and three transmitting interfaces;

the receiving interfaces and the transmitting interfaces are alternately arranged to form a circular structure;

the three receiving plates are respectively and correspondingly connected with the three receiving interfaces to form receiving channels;

the three transmitting plates are respectively and correspondingly connected with the three transmitting interfaces to form transmitting channels.

This application is based on satellite-borne platform's DBF system, TR subassembly receiving and dispatching passageway simultaneous working, adopt the receiving and dispatching different frequency to realize FDD full duplex communication, through set up three dash receiver and three expelling plate in every TR subassembly, three dash receiver and three expelling plate are arranged in turn and are formed circular structure, it specifically includes that three receiving interface and three expelling interface structure are connected respectively with dash receiver and expelling plate and are formed receiving channel and expelling passage to set up radio frequency interface, through receiving and dispatching passageway alternate arrangement in the subassembly integrated a plurality of receiving and dispatching passageways, the improvement integrated level when reducing the size, satisfy the antenna array face demand of arranging simultaneously.

Furthermore, the circular arrangement structure formed by the receiving plate and the transmitting plate is arranged in a first cavity assembly, and the first cavity assembly comprises a first cavity, a first upper cover plate and a first lower cover plate which are enclosed together to form a cavity.

Further, a power panel is arranged in the first cavity assembly, the power panel is used for an integrated circuit and providing power, the power panel is provided with a simulated temperature sensor, and the simulated temperature sensor is used for reporting temperature simulation information of each TR assembly to an external baseband module. The baseband module adjusts the calibration quantity in real time according to the temperature of each TR component, compensates the influence brought by temperature change, and the analog temperature sensor has high reliability, can meet the reliability requirement and reduce the cost at the same time.

Furthermore, each receiving radio frequency interface and each transmitting radio frequency interface are uniformly arranged at 60 degrees. The occupied space of the channel is reduced.

Further, radio frequency interface sets up the one end of keeping away from first cavity at first lower apron, radio frequency interface is connected with the duplexer subassembly, the duplexer subassembly includes three duplexer, and three duplexer forms the ring structure of arranging, every the duplexer includes a receiving channel and a transmission channel, and two adjacent receiving radio frequency interface and transmission radio frequency interface in the duplexer corresponds radio frequency interface. The receiving and transmitting channel position of the radio frequency interface and the connector position of the duplexer component are applied in a one-to-one mode, the duplexer component is directly connected, a radio frequency cable for mutual use is omitted, the cost can be reduced, and the index performance of transmitting power and receiving noise coefficient is improved.

Furthermore, the TR component is fixedly connected with the duplexer component, and the contact surface of the duplexer component and the TR component is coated with heat-conducting silicone grease. The duplexer and the contact surface of the TR are coated by using heat-conducting silicone grease, so that the heat conductivity can be improved.

Further, still include the second module, the second module includes intermediate frequency interface and second cavity subassembly:

the second cavity assembly comprises a second cavity, a second upper cover plate and a second lower cover plate;

the intermediate frequency interface is arranged at one end, far away from the second cavity, of the second upper cover plate and is used for connecting an external local oscillator module and a baseband module;

an intermediate frequency plate is arranged between the second upper cover plate and the second cavity and is used for amplifying, attenuating and filtering intermediate frequency signals;

and a frequency conversion plate is arranged between the second lower cover plate of the second cavity and used for carrying out up/down conversion treatment on the transmitting and receiving signals.

Furthermore, the intermediate frequency interface includes three receiving intermediate frequency interfaces, three transmitting intermediate frequency interfaces, a receiving local oscillator interface and a transmitting local oscillator interface, the receiving intermediate frequency interface is connected with the receiving board, the transmitting intermediate frequency interface is connected with the transmitting board, the receiving local oscillator interface is connected with the receiving channel, and the transmitting local oscillator interface is connected with the transmitting channel.

Furthermore, the radio frequency interface between the first module and the second module is communicated through an SMP connector, the SMP connector is a threaded connector, and a threaded hole matched with the SMP connector is formed in the TR component. The vertical interconnection structure eliminates an external radio frequency cable, reduces the connection loss of the part, improves the final transmitting power and reduces the noise coefficient of the whole machine. The SMP connector is matched with the threaded hole, and is fixed on the shell of the TR component, so that stress between the SMP connector and the PCB is reduced.

Furthermore, numerical control attenuators are arranged in the transmitting channel and the receiving channel and used for adjusting the dynamic range of signals, the numerical control attenuators respectively and independently control the receiving channel and the transmitting channel, power detectors are arranged in the transmitting channel and used for detecting the transmitting power of each transmitting channel in real time. The power detector outputs detection voltage, the detection voltage is reported to an external baseband module, and the baseband module converts transmission power according to the detection voltage.

Compared with the prior art, the application has the following advantages and beneficial effects:

1. compare with other single channels or multichannel TR subassembly, arrange the design according to complete machine phased array antenna array face, adopt the three channels to rotate the alternate arrangement design in proper order, the maximize utilizes available space, and the demand of arranging of extensive digital phased array is more laminated in this application.

2. A primary frequency conversion framework is adopted, AD and DA are not integrated, and intermediate frequency input and output in the whole machine are connected with a baseband part through a bundling radio frequency cable;

3. the single power supply is adopted for working, the reliability is high, and the cost of the satellite-borne secondary power supply can be reduced;

4, the gain is higher, the power consumption is lower, the self-grinding low-power consumption chip is adopted to reduce the power consumption, the gain of a single chip is higher and can reach more than 30dB, and the high-gain amplifier can also reduce the using number of the amplifiers and further reduce the power consumption;

5, the self-developed power amplifier has the advantages of small heat productivity, good heat dissipation effect, high efficiency which can reach more than 50% under P-1 and low heat productivity brought by high efficiency.

Drawings

In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that for a person skilled in the art, other related drawings can be obtained from these drawings without inventive effort. In the drawings:

FIG. 1 is an exploded view of a multichannel TR assembly in an embodiment of the present application;

FIG. 2 is a diagram illustrating an arrangement of transmit/receive channels of a multi-channel TR module in an embodiment of the present application;

FIG. 3 is a cross-sectional view of an SMP connector installation and interconnection in an embodiment of the present application;

fig. 4 is a simulation diagram of phase consistency of the present vibrating network in the embodiment of the present application.

Reference numbers and corresponding part names in the figures:

1. an intermediate frequency interface; 2. a second upper cover plate; 3. an intermediate frequency plate; 4. a radio frequency insulator; 5. a second cavity; 6. a frequency conversion plate; 7. a second lower cover plate; 8. an SMP connector; 9. a low frequency cable; 10. a first upper cover plate; 11. a launch plate; 12. receiving a plate; 13. a first cavity; 14. a power panel; 15. a first lower cover plate; 16. a radio frequency interface; 17. a receiving channel; 18. and (3) transmitting the channel.

Detailed Description

To make the purpose, technical solution and advantages of the present application more apparent, the present application is further described in detail below with reference to examples and drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present application and are not used as limitations of the present application.

Example 1

As shown in fig. 1 and fig. 2, the present embodiment provides an L-band low-earth satellite multichannel TR assembly, which includes a first module, the first module includes at least three receiving boards 12, at least three transmitting boards 11, and a radio frequency interface 16:

the three receiving plates 12 and the three transmitting plates 11 are sequentially and alternately arranged to form a circular structure;

the radio frequency interface 16 specifically includes three receiving interfaces and three transmitting interfaces;

the three receiving plates 12 are respectively and correspondingly connected with the three receiving interfaces to form a receiving channel 17;

the three transmitting plates 11 are respectively connected with the three transmitting interfaces to form transmitting channels 18.

This application is based on satellite-borne platform's DBF system, TR subassembly receiving and dispatching passageway simultaneous working, adopt the receiving and dispatching different frequency to realize FDD full duplex communication, through set up three dash receiver 12 and three expelling plate 11 in every TR subassembly, three dash receiver 12 and three expelling plate 11 arrange in turn and form circular structure, it specifically includes three receiving interface and three expelling interface structure and dash receiver 12 and expelling plate 11 and is connected formation receiving channel 17 and expelling channel 18 respectively to set up radio frequency interface 16, through receiving and dispatching passageway alternate arrangement at the subassembly integrated a plurality of receiving and dispatching passageways, improve the integrated level when reducing the size, satisfy the antenna array face demand of arranging simultaneously.

In some possible embodiments, the radio frequency interface 16 employs an SMP-J connector and the intermediate frequency interface 1 employs an SSMA-J connector.

In some possible embodiments, the circular arrangement of the receiving plate 12 and the transmitting plate 11 is provided in a first cavity assembly comprising a first cavity 13, a first upper cover plate 10 and a first lower cover plate 15 enclosing together to form a cavity.

In some possible embodiments, a power board 14 is disposed in the first cavity assembly, the power board 14 is used for an integrated circuit and providing power, and the power board 14 is provided with an analog temperature sensor for reporting temperature analog information of each TR assembly to an external baseband module. The baseband module adjusts the calibration quantity in real time according to the temperature of each TR component and compensates the influence caused by temperature change, so that an analog temperature sensor is adopted instead of a digital temperature sensor, the reliability of the analog temperature sensor is high, the reliability of a common digital temperature sensor is low, the common digital temperature sensor cannot be qualified for on-orbit tasks, and the price of an aerospace grade digital temperature sensor is too high. The use of the analog temperature sensor can meet the reliability requirement and reduce the cost at the same time.

The power board 14 is also used to mount LDO regulators, PMOS switches, control drivers, etc. to provide clean, reliable 5V, 3.3V power for each channel. In order to improve the isolation between the channels, each channel is independently provided with the LDO, the reliability can be improved by the method, and the problem that all the channels cannot be used once the LDO fails when only one LDO is used in all the channels is solved. Six SMP connectors 8 connected with the duplexer penetrate through the metal shell and are welded on the power panel 14, and then are connected with a glass insulator welded on the cavity B through a section of microstrip transmission line and transmitted to the receiving board 12 and the transmitting board 11 through the glass insulator. The two ends of the glass insulator are respectively welded with a power supply board 14, a receiving board 12 and a transmitting board 11. In this manner, the power strip 14 may also provide radio frequency signal relay functionality.

In some possible embodiments, each receiving radio frequency interface 16 and each transmitting radio frequency interface 16 are arranged at 60 ° intervals. The occupied space of the channel is reduced.

In some possible embodiments, the radio frequency interface 16 is disposed at an end of the first lower cover plate 15 away from the first cavity 13, the radio frequency interface 16 is connected to a duplexer assembly, the duplexer assembly includes three duplexers, the three duplexers form a circular arrangement, each duplexer includes a receiving channel 17 and a transmitting channel 18, and one duplexer corresponds to two adjacent receiving radio frequency interfaces 16 and transmitting radio frequency interfaces 16 of the radio frequency interface 16. The receiving and transmitting channel position of the radio frequency interface 16 and the position of the connector 8 of the duplexer component are applied one-to-one, and the duplexer component is directly connected, so that a radio frequency cable for mutual use is omitted, the cost can be reduced, and the index performance of transmitting power and receiving noise coefficient can be improved. The reason why the three duplexers form the circular ring arrangement structure arrangement lies in that three duplexers are arranged in the duplexer assembly, and for enabling the size of the duplexer assembly to be minimum, the three duplexers are circularly arranged, and the interval between every two duplexers is 120 degrees.

In some possible embodiments, the TR component is fixedly connected with the duplexer component, and the contact surface of the duplexer component and the TR component is coated with heat-conducting silicone grease. The TR subassembly passes through the M3 fix with screw on the duplexer subassembly, and the duplexer uses heat conduction silicone grease coating with the TR contact surface, can improve the heat conductivity like this. And after the duplexer component and the TR component are fixed into a whole by using screws, the duplexer component and the TR component are mounted on the external phased array antenna mounting plate by using screws. And the duplexer assembly is used as a radiator of the TR assembly, heat generated by the TR assembly is conducted to the duplexer and then conducted to the external phased array antenna mounting plate, and the external phased array antenna thermal control unit is used for carrying out overall thermal control management. The arrangement of radio frequency ports of the TR component is determined according to the position of a receiving and transmitting port of the duplexer component, and the TR component and the duplexer are directly vertically connected with each other by an SMP connector 8. The structure design eliminates the external radio frequency cable, reduces the connection loss of the part, improves the final transmitting power and reduces the noise coefficient of the whole machine.

In the application, the TR component adopts a single power supply to supply power, so that the satellite-borne secondary power supply cost is favorably reduced. Each transceiving channel is provided with an independent power circuit, and each channel can independently turn on/off the power supply.

In some possible embodiments, the apparatus further comprises a second module, the second module comprising the intermediate frequency interface 1 and a second cavity assembly:

the second cavity assembly comprises a second cavity 5, a second upper cover plate 2 and a second lower cover plate 7;

the intermediate frequency interface 1 is arranged at one end, far away from the second cavity 5, of the second upper cover plate 2, and the intermediate frequency interface 1 is used for connecting an external local oscillation module and a baseband module;

an intermediate frequency plate 3 is arranged between the second upper cover plate 2 and the second cavity 5, and the intermediate frequency plate 3 is used for amplifying, attenuating and filtering intermediate frequency signals;

a frequency conversion plate 6 is arranged between the second lower cover plate 7 of the second cavity 5, and the frequency conversion plate 6 is used for carrying out up/down frequency conversion treatment on the receiving and transmitting signals.

As shown in fig. 4, the frequency conversion board 6 includes a mixer, a local oscillator power divider and a local oscillator driver amplifier for performing the intermediate frequency/radio frequency spectrum shifting. The length error of the local oscillator networks is within 0.5mm, and the phase difference between the local oscillator networks is within 1.3 degrees through the simulation verification of the three-dimensional electromagnetic field.

The intermediate frequency board 3 contains an intermediate frequency amplifier, an LC filter, an amplitude and phase consistency debugging bit and the like.

The power consumption of a single receiving channel 17 is 0.45W, and the receiving gain is larger than 90dB under low power consumption; the single transmit channel 18 consumes 6.9W at P-1 transmit power.

After the signals input by the intermediate frequency and the intermediate frequency plate 3 continue to be subjected to filtering amplification and other processing, the signals are sent to the frequency conversion plate 6 through the radio frequency insulator 4 to be subjected to up-conversion processing, and signal processing such as amplification and attenuation is carried out, wherein the radio frequency insulator 4 is arranged in the second cavity 5. The signal output by the frequency conversion board 6 is output to the emission board 11 through the SMP connector 8, and is output through the SMP connector 8 after being subjected to filtering, power amplification, power detection, isolation protection and the like.

Signals received by the antenna enter a receiving board 12 firstly, are subjected to amplification, filtering and other processing and then are sent to a frequency conversion board 6 through an SMP connector 8, are sent to an intermediate frequency board 3 through a radio frequency insulator 4 after down conversion, continue to be subjected to amplification, filtering, amplitude and phase consistency adjustment and other processing and finally are output through an SSMA connector 8.

In some possible embodiments, the intermediate frequency interface 1 includes three receiving interfaces, three transmitting interfaces, one receiving local oscillator interface and one transmitting local oscillator interface, the receiving interfaces are connected to the receiving board 12, the transmitting interfaces are connected to the transmitting board 11, the receiving local oscillator interface is connected to the receiving channel 17, and the transmitting local oscillator interface is connected to the transmitting channel 18.

As shown in fig. 3, the radio frequency interface 16 between the first module and the second module is communicated through an SMP connector 8, the SMP connector 8 is a screw-type connector, and a screw hole matched with the SMP connector 8 is arranged on the TR component. The vertical interconnection structure eliminates an external radio frequency cable, reduces the connection loss of the part, improves the final transmitting power and reduces the noise coefficient of the whole machine. And arranging the SMP connector 8 to be matched with the threaded hole, and fixing the SMP connector 8 on the shell of the TR component, thereby reducing the stress between the SMP connector 8 and the PCB. The power and control lines are interconnected by a low frequency cable 9. In order to improve the reliability, all the SMP connectors 8 are not directly welded on the PCB, but the SMP connectors 8 are fixed on the metal shell in a mode that the connectors 8 are screwed into the metal shell in a rotating mode by selecting threaded connectors and forming matched threaded holes in the metal shell, so that the stress between the SMP connectors 8 and the PCB is reduced.

In some possible embodiments, each transceiving channel is provided with an independent numerical control attenuator, and the numerical control attenuators are used for adjusting the dynamic range of signals, so that convenience is brought to the complete machine calibration of the phased array antenna. In order to reduce control lines and improve reliability, the numerical control attenuators of the receiving channel 18 and the transmitting channel 18 are respectively and independently controlled, the numerical control attenuators of all the receiving channels 17 are simultaneously controlled, and the numerical control attenuators of the transmitting channels 18 are simultaneously controlled.

The transmitting channels 18 are each provided with a power detector for detecting the transmitting power of each transmitting channel 18 in real time. The isolator is connected with a 20dB coupler after output, the coupled signal is sent into a power detector, the power detector outputs detection voltage and reports the detection voltage to an external baseband module, and the baseband module converts transmission power according to the detection voltage.

The above-mentioned embodiments, objects, technical solutions and advantages of the present application are further described in detail, it should be understood that the above-mentioned embodiments are only examples of the present application, and are not intended to limit the scope of the present application, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present application should be included in the scope of the present application.

Claims

1. An L-band low-orbit satellite multichannel TR assembly, comprising a first module, wherein the first module comprises at least three receiving boards (12), at least three transmitting boards (11) and a radio frequency interface (16):

the three receiving plates (12) and the three transmitting plates (11) are sequentially and alternately arranged to form a circular structure;

the radio frequency interface (16) specifically comprises three receiving interfaces and three transmitting interfaces;

the three receiving plates (12) are respectively and correspondingly connected with the three receiving interfaces to form receiving channels (17);

the three transmitting plates (11) are respectively and correspondingly connected with the three transmitting interfaces to form transmitting channels (18).

2. The L-band low-orbit satellite multichannel TR assembly of claim 1, wherein the circular arrangement of the receiver plate (12) and the transmitter plate (11) is disposed in a first cavity assembly comprising a first cavity (13), a first upper cover plate (10), and a first lower cover plate (15) enclosed together to form a cavity.

3. The L-band low-orbit satellite multichannel TR assembly according to claim 2, wherein a power panel (14) is disposed within the first cavity assembly, the power panel (14) is used for integrated circuits and providing power, the power panel (14) is provided with analog temperature sensors, and the analog temperature sensors are used for reporting temperature analog information of each TR assembly to an external baseband module.

4. The L-band low-orbit satellite multichannel TR assembly of claim 2, wherein each receiving interface and each transmitting interface are uniformly aligned at 60 °.

5. The L-band low-orbit satellite multichannel TR component as claimed in claim 3, wherein the radio frequency interface (16) is disposed at one end of the first lower cover plate (15) far away from the first cavity (13), the radio frequency interface (16) is connected with the duplexer component, the duplexer component comprises three duplexers, the three duplexers form a circular ring arrangement structure, each duplexer comprises a receiving channel (17) and a transmitting channel (18), and one duplexer corresponds to two adjacent receiving interfaces and two adjacent transmitting interfaces in the radio frequency interface (16).

6. The L-band low-orbit satellite multichannel TR assembly according to claim 4, wherein the TR assembly is fixedly connected with a duplexer assembly, and a contact surface of the duplexer assembly and the TR assembly is coated with heat-conducting silicone grease.

7. The L-band low-orbit satellite multichannel TR assembly of claim 1, further comprising a second module comprising an intermediate frequency interface (1) and a second cavity assembly:

the second cavity assembly comprises a second cavity (5), a second upper cover plate (2) and a second lower cover plate (7);

the intermediate frequency interface (1) is arranged at one end, far away from the second cavity (5), of the second upper cover plate (2), and the intermediate frequency interface (1) is used for connecting an external local oscillation module and a baseband module;

an intermediate frequency plate (3) is arranged between the second upper cover plate (2) and the second cavity (5), and the intermediate frequency plate (3) is used for amplifying, attenuating and filtering intermediate frequency signals;

and a frequency conversion plate (6) is arranged between the second lower cover plate (7) of the second cavity (5), and the frequency conversion plate (6) is used for carrying out up/down frequency conversion treatment on the transmitting and receiving signals.

8. The L-band low-orbit satellite multichannel TR assembly according to claim 7, wherein the intermediate frequency interface (1) comprises three receiving interfaces, three transmitting interfaces, a receiving local oscillator interface and a transmitting local oscillator interface, the receiving interfaces are connected with the receiving board (12), the transmitting interfaces are connected with the transmitting board (11), the receiving local oscillator interface is connected with the receiving channel (17), and the transmitting local oscillator interface is connected with the transmitting channel (18).

9. The L-band low-orbit satellite multichannel TR assembly according to claim 7, wherein the radio frequency interfaces (16) between the first and second modules are communicated through SMP connectors (8), the SMP connectors (8) are screw-type connectors (8), and the TR assembly is provided with threaded holes matched with the SMP connectors (8).

10. The L-band low-orbit satellite multichannel TR assembly according to claim 1, wherein each of the transmit channel (18) and the receive channel (17) has a digitally controlled attenuator disposed therein for adjusting the dynamic range of the signal, the digitally controlled attenuators independently control the receive channel (17) and the transmit channel (18), the transmit channel (18) has a power detector disposed therein for detecting the transmit power of each transmit channel (18) in real time.