CN115491645A - Film coating system and method based on magnetron sputtering - Google Patents

Film coating system and method based on magnetron sputtering Download PDF

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Publication number
CN115491645A
CN115491645A CN202211138872.5A CN202211138872A CN115491645A CN 115491645 A CN115491645 A CN 115491645A CN 202211138872 A CN202211138872 A CN 202211138872A CN 115491645 A CN115491645 A CN 115491645A
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China
Prior art keywords
target
coated
pipeline
permanent magnet
magnetron sputtering
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CN202211138872.5A
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Chinese (zh)
Inventor
王江
付天佐
钟轶强
陈义武
程元芬
孟树文
田振刚
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404 Co Ltd China National Nuclear Corp
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404 Co Ltd China National Nuclear Corp
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Priority to CN202211138872.5A priority Critical patent/CN115491645A/en
Publication of CN115491645A publication Critical patent/CN115491645A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention provides a film coating system and a method based on magnetron sputtering, wherein the system comprises: the supporting unit is arranged in a vacuum chamber required by film coating, a permanent magnet is arranged outside the supporting unit in a surrounding mode, and a runway-shaped closed magnetic field is formed on the surface of the target by the permanent magnet; the target is annularly arranged outside the permanent magnet; the to-be-coated pipeline is sleeved outside the target material, and one end of the to-be-coated pipeline is fixedly connected with the vacuum chamber through a clamp; and the power supply is electrically connected with the target material, an electric field is generated in the vacuum chamber after the target material is electrified, and atoms on the surface of the target material escape and are sputtered onto the inner wall of the pipeline to be coated to form a film under the action of the magnetic field and the electric field generated by the permanent magnet. The scheme provided by the invention can improve the uniformity of the film thickness during film coating.

Description

Film coating system and method based on magnetron sputtering
Technical Field
The invention relates to the technical field of vacuum coating, in particular to a coating system and a coating method based on magnetron sputtering.
Background
When the magnetron sputtering coating is carried out on the inner wall of the small-bore pipe, the thickness of the film directly determines the performance of functional films such as an anti-corrosion film and the like, and meanwhile, the uniformity of the thickness of the film is required to be at a higher level for the balance of the performance of the film at each position of the inner wall of the pipe; meanwhile, the relation between the film coating time of the inner wall of the small-aperture pipe and the thickness of the film is difficult to quickly determine, multiple trial tests are often needed, and the loss of manpower, material resources and financial resources brought by the tests is high.
Disclosure of Invention
The invention aims to provide a film coating system and method based on magnetron sputtering so as to improve the uniformity of the thickness of a film and reduce the film coating cost.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a magnetron sputtering-based coating system comprises:
the supporting unit is arranged in a vacuum chamber required by film coating, a permanent magnet is annularly arranged outside the supporting unit, and a runway-shaped closed magnetic field is formed on the surface of the target by the permanent magnet;
the target is annularly arranged outside the permanent magnet;
the to-be-coated pipeline is sleeved outside the target material and is fixedly connected with the vacuum chamber through a clamp;
the power supply, the negative pole of power with the target electricity is connected, the positive pole of power with the vacuum chamber electricity is connected, and form the electric field between target and the vacuum chamber, under the magnetic field that the permanent magnet produced and the combined action of electric field, the atom on target surface escapes and sputter to deposit the film on the inner wall of waiting to plate the membrane pipeline.
Optionally, the coating system based on magnetron sputtering further includes:
the sleeve is arranged between the target and the permanent magnet and sleeved outside the permanent magnet;
the sleeve has an opening through which the support unit and the permanent magnet pass, and a cavity that accommodates the support unit and the permanent magnet.
Optionally, the target is annularly arranged on the outer wall of the sleeve, and one end of the target is fixed on the outer wall of the sleeve through a metal hoop.
Optionally, a cooling water flow passage is arranged at a gap between the sleeve and the permanent magnet.
Optionally, the clamp includes:
the cylinder body is a cylinder with a cavity structure for accommodating the pipeline to be coated;
the flange is fixedly connected with one end of the cylinder;
and the bottom cover is in threaded connection with the other end of the cylinder.
Optionally, the flange is fixedly connected to the top of the vacuum chamber.
Optionally, the length of the cylinder is greater than that of the pipeline to be coated; when coating is carried out, the pipeline to be coated is inserted into the cylinder from bottom to top, and the pipeline to be coated is accommodated in the cavity structure through the screw connection of the cylinder and the bottom cover.
Optionally, an opening through which the target passes is formed in the bottom cover, and a diameter of the opening is equal to an inner diameter of the pipe to be coated.
Optionally, the pipe to be coated and the target are coaxially assembled.
The embodiment of the invention also provides a coating method based on magnetron sputtering, which is applied to the coating system, and the method comprises the following steps:
providing a target material;
the target material penetrates through a pipeline to be coated;
the permanent magnet is fixed on a supporting unit at the top of the vacuum chamber and forms a runway-shaped closed magnetic field on the surface of the target material;
and in a preset coating time, controlling a power supply to supply power to the target, controlling the current to be in a current range required by glow discharge, and under the combined action of an electric field and a magnetic field, performing magnetron sputtering on the surface of the target, wherein atoms on the surface of the target escape and are sputtered onto the inner wall of the pipeline to be coated to deposit and form a film.
The scheme of the invention at least comprises the following beneficial effects:
according to the scheme, the permanent magnet is arranged on the supporting unit in the vacuum chamber, and the target and the pipeline to be coated are sleeved outside the permanent magnet in sequence; when coating is carried out, the target is electrified, magnetron sputtering is carried out on the surface of the target under the combined action of an electric field and a magnetic field, atoms on the surface of the target escape and sputter onto the inner wall of the pipeline to be coated and deposit to form a film, so that the uniformity of the thickness of the film is improved.
Drawings
FIG. 1 is a front view of a partial structure of a coating system according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a portion of a coating system according to an alternative embodiment of the present invention;
FIG. 3 is a front view of a clamp provided in an alternative embodiment of the present invention;
FIG. 4 is a schematic view of an alternative embodiment of the present invention providing an assembly of a fixture with a pipe to be coated;
FIG. 5 is a graph showing the relationship between the thickness of a thin film and the coating time according to an alternative embodiment of the present invention.
The reference numbers illustrate: 1. a support unit; 2. a sleeve; 3. metal clamp, 4, target material; 5. a permanent magnet; 6. a cooling water flow passage; 7. a pipeline to be coated with a film; 8. a flange; 9. a bolt and a nut; 10. a cylinder body; 11. a bottom cover; 12. the top of the vacuum chamber.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
As shown in fig. 1 and fig. 2, an embodiment of the present invention provides a magnetron sputtering-based coating system, including:
the supporting unit 1 is arranged in a vacuum chamber required by film coating, a permanent magnet 5 is annularly arranged outside the supporting unit 1, and the permanent magnet 5 forms a runway-shaped closed magnetic field on the surface of the supporting unit 4;
the target 4 is annularly arranged outside the permanent magnet 5;
the pipeline 7 to be coated is sleeved outside the target 4, and the pipeline 7 to be coated is fixedly connected with the vacuum chamber through a clamp;
a power supply, a negative electrode of which is electrically connected with the target 4 and a positive electrode of which is electrically connected with the vacuum chamber, and an electric field is formed between the target 4 and the vacuum chamber; under the combined action of the magnetic field generated by the permanent magnet 5 and the electric field, atoms on the surface of the target 4 escape and are sputtered onto the inner wall of the pipeline 7 to be coated to deposit and form a film.
In this embodiment, the vacuum chamber may be a vacuum chamber in a magnetron sputtering furnace body, and provides a closed environment required by coating for the pipeline 7 to be coated; the supporting unit 1 can be connected to the top 12 of the vacuum chamber through a flange, and the supporting unit 1 rotates when the coating is carried out; the supporting unit 1 can be a cuboid or a cylinder, and a cavity can be formed in the supporting unit 1 to reduce the weight of the supporting unit and facilitate rotation during film coating; the supporting unit 1 can be made of corrosion-resistant, waterproof and nonmagnetic materials; the outer ring of the supporting unit 1 is provided with a plurality of permanent magnets 5, and the permanent magnets 5 can form a runway-shaped closed magnetic field near the surface of the target 4;
further, the target 4 is arranged on the periphery of the permanent magnet 5, the material of the target 4 can be metal copper, the target 4 can be a complete and integrally formed cylindrical structure, and can also be formed by splicing a plurality of targets with the same size; the length of the target 4 is greater than that of the permanent magnet 5, so as to ensure that the length of the magnetic field generated by the permanent magnet 5 does not exceed the length of the target 4, further ensure that sputtering regions formed on the surface of the target 4 are all within the length range of the target 4, ensure that atoms sputtered out during film coating are target atoms, and ensure the purity of the film; the dimensions of the target 4 here may be: the inner diameter is 24mm, the outer diameter is 29mm, the length is 90mm, preferably, a coating target material with the length of 270mm can be formed by splicing 3 target materials with the size, a runway-shaped sputtering area with the length of about 23cm can be formed on the surface of the target material in the coating process, the spliced length of the 3 target materials 4 is larger than the length of the pipeline to be coated 7, the runway-shaped sputtering area can cover the pipeline to be coated 7 in length, and it should be known that when a single target material is used, the length of the single target material is larger than the length of the pipeline to be coated 7, so that the thickness of a film deposited on the inner wall of the pipeline to be coated 7 in the length direction is uniform; the pipeline 7 to be coated can be fixedly connected to the top 12 of the vacuum chamber through a clamp, and the inner diameter of the pipeline 7 to be coated is larger than the outer diameter of the target 4; the two ends of the pipeline 7 to be coated can be positioned in the sputtering area by adjusting the height of the clamp; the pipe 7 to be coated may be made of stainless steel, and the size thereof may be: the outer diameter is 50mm, the wall thickness is 0.5mm, and the length is 200mm;
when the device is installed, the pipeline 7 to be coated is sleeved outside the target 4, so that the inner wall of the pipeline 7 to be coated is coated, the deposition on the outer wall of the pipeline is avoided, the pollution to the outer wall of the pipeline in the coating process is reduced, meanwhile, the utilization rate of the target during magnetron sputtering coating can be improved, and the coating efficiency is improved; preferably, the length of the pipeline 7 to be coated is smaller than that of the permanent magnet 5, so as to ensure that a film can be formed on the inner wall of the pipeline 7 to be coated, and simultaneously ensure that both ends of a sputtering region formed by the target 4 are positioned outside the length of the pipeline 7 to be coated, so as to ensure that the sputtering rate of the target atoms is uniformly distributed within the length range of the pipeline 7 to be coated, and improve the uniformity of the thickness of the film;
when coating is carried out, under the combined action of the magnetic field generated by the permanent magnet 5 and the electric field generated between the target 4 and the vacuum chamber after the target 4 is electrified, the surface of the target 4 generates a magnetron sputtering phenomenon, so that atoms on the surface of the target 4 can escape and sputter onto the inner wall of the pipeline 7 to be coated to form a film.
In an alternative embodiment of the present invention, the target 4 is coaxially assembled with the pipeline 7 to be coated.
In this embodiment, the target 4 and the pipeline 7 to be coated are coaxially arranged, and when coating is performed, the permanent magnet 5 is driven by the supporting unit 1 to rotate, so that the racetrack-shaped closed magnetic field formed on the surface of the target 4 also rotates at a constant speed, and a film is uniformly formed on the inner wall of the pipeline to be coated; in the actual installation process, when the pipeline 7 to be coated is sleeved outside the target 4, the distance between the inner wall of the pipeline 7 to be coated and the outer wall of the target 4 is ensured to be uneven by less than 10%.
In an optional embodiment of the present invention, the magnetron sputtering-based coating system may further include:
the sleeve 2 is arranged between the target 4 and the permanent magnet 5, and is sleeved outside the permanent magnet 5;
the sleeve 2 has an opening through which the support unit 1 and the permanent magnet 5 pass, and a cavity that accommodates the support unit 1 and the permanent magnet 5.
In this embodiment, the sleeve 2 may be a cylinder with an opening and a cavity, and one end of the opening of the sleeve 2 is fixedly connected to the top 12 of the vacuum chamber; the diameter of the sleeve 2 is larger than that of the permanent magnet 5, and the sleeve is sleeved outside the permanent magnet 5; preferably, the sleeve 2 can be made of waterproof, corrosion-resistant and nonmagnetic materials, such as stainless steel and the like;
further, the target 4 is annularly arranged on the outer wall of the sleeve 2, and it should be noted that the target 4 may be configured as a cylindrical structure with a diameter larger than that of the sleeve 2 so as to be sleeved outside the sleeve 2, or may be formed by splicing a plurality of cylindrical structures with shorter lengths; the lower end of the target 4 is fixed on the outer wall of the sleeve 2 through a metal hoop 3.
In an alternative embodiment of the present invention, as shown in fig. 2, a cooling water channel 6 is provided at the gap between the sleeve 2 and the permanent magnet 5.
In this embodiment, since the diameter of the sleeve 2 is greater than that of the permanent magnet 5, a cooling water flow channel 6 may be formed at a gap position between the sleeve 2 and the permanent magnet 5, and in the coating process, cooling water may be injected into the cooling water flow channel 6 to cool the target 4, so as to avoid affecting the quality of the film due to the temperature rise of the target 4 in the coating process; meanwhile, the sleeve 2 is arranged, so that the target 4 is not directly contacted with cooling water, and further, metal which reacts with water can be used as the target, and meanwhile, when the target is replaced, the whole column target does not need to be disassembled, so that the target is more convenient to replace.
In an alternative embodiment of the present invention, the clamp is described, as shown in fig. 3 and 4, the clamp includes:
the cylinder 10 is a cylinder with a cavity structure for accommodating the pipeline 7 to be coated;
a flange 8 fixedly connected with one end of the cylinder 10;
and a bottom cover 11 screwed with the other end of the cylinder 10.
In this embodiment, a cavity through which the pipeline 7 to be coated penetrates is arranged inside the cylinder 10; the first end of the cylinder 10 and the flange 8 can be welded and fixed, or can be integrally formed, the first end of the cylinder 10 is fixedly connected with the top 12 of the vacuum chamber through the flange 8, and the second end is sealed through the bottom cover 11, so that the pipe 7 to be coated in the cylinder 10 can be supported;
further, the length of the cylinder 10 is greater than that of the pipeline 7 to be coated; when coating is carried out, the pipeline 7 to be coated is inserted into the barrel 10 from bottom to top, the barrel 10 is in threaded connection with the bottom cover 11, and the pipeline 7 to be coated is accommodated in the cavity;
preferably, an external thread is arranged on the outer wall of the second end of the cylinder 10, an internal thread is arranged on the inner side of the bottom cover 11, the pipeline 7 to be coated is fixed in the cavity structure of the cylinder 10 through the threaded matching of the external thread and the internal thread, and meanwhile, the position of the pipeline 7 to be coated is limited through the matching of the inner wall of the cylinder 10 and the outer wall of the pipeline 7 to be coated, so that the coaxiality of the pipeline 7 to be coated and the target 4 is ensured, and the uniformity of the thickness of the film is ensured.
In an optional embodiment of the present invention, an opening through which the target 4 passes is formed in the bottom cover 11, and the diameter of the opening is equal to the inner diameter of the pipeline 7 to be coated, so that the bottom cover 11 can seal the pipeline 7 to be coated in the cylinder 10, and the coaxiality between the pipeline 7 to be coated and the target 4 is adjusted; preferably, the difference between the inner diameter of the cylinder 10 and the outer diameter of the pipeline 7 to be coated is not more than 1mm.
In an alternative embodiment of the invention, as shown in fig. 3, the flange 8 is fixedly connected to the top of the vacuum chamber.
In this embodiment, the flange 8 may be threadably secured to the vacuum chamber top 12 by a plurality of bolt and nuts 9; by adjusting the height of the bolt and the nut 9, the two ends of the pipeline 7 to be coated are both positioned in the sputtering area formed by the target 4, so that the inner wall of the pipeline 7 to be coated can be uniformly deposited to form a film; meanwhile, the coaxiality of the pipeline 7 to be coated and the target 4 can be adjusted by adjusting the connecting position of the bolt and the nut 9 and the top 12 of the vacuum chamber, the unevenness of the distances between different positions on the inner wall of the pipeline 7 to be coated and the surface of the target 4 is not more than 10%, and the film thickness uniformity of sputtering atomic deposition film forming is improved.
The embodiment of the invention also discloses a coating method based on magnetron sputtering, which is applied to the coating system of any one of the embodiments, and the method comprises the following steps:
step 11; providing a target 4;
step 12; the target 4 penetrates through a pipeline 7 to be coated;
step 13; the permanent magnet 5 is fixed on the supporting unit 1 at the top of the vacuum chamber, and the permanent magnet 5 forms a runway-shaped closed magnetic field on the surface of the target 4;
step 14; and in a preset coating time, controlling a power supply to supply power to the target 4, controlling the current to be in a current range required by glow discharge, generating magnetron sputtering on the surface of the target 4 under the combined action of an electric field and a magnetic field, and enabling atoms on the surface of the target 4 to escape and sputter on the inner wall of the pipeline 7 to be coated to deposit and form a film.
In this embodiment, a permanent magnet 5 is fixed outside a support unit 1, a sleeve 2 is sleeved outside the permanent magnet 5 and the support unit 1, a target 4 is sleeved outside the sleeve 2, and one end of the target 4 is fixedly connected with the sleeve 2 through a metal hoop 3; clamping the pipeline 7 to be coated by a clamp, adjusting the height of a bolt and a nut 9 on the clamp to enable two ends of the pipeline 7 to be coated to be positioned in a sputtering area formed by the target 4, and simultaneously adjusting the position of the bolt and the nut 9 on the clamp to ensure that the unevenness of the distance between different positions on the inner wall surface of the pipeline 7 to be coated and the surface of the target 4 is not more than 10%;
controlling a power supply to supply power to the target 4 within a preset coating time, controlling the current to be within a current range required by glow discharge, and under the combined action of an electric field and a rotating magnetic field generated by the permanent magnet 5, allowing atoms on the surface of the target 4 to escape and sputter on the inner wall of the pipeline 7 to be coated to form a film;
when coating is carried out, the vacuum degree in the vacuum chamber is related to the specific structure of equipment, the vacuum gauge mounting positions of different equipment are different, and the pressures of the coating gas on the surface of the coating target material are different; preferably, the vacuum degree is controlled to be not more than 5Pa;
the control precision of the preset coating current is better than 5%, so that the coating rates of sputtering areas on the surface of the target 4 at different angles are kept consistent in the rotating process, and the uniformity of the film forming thickness is improved; preferably, the preset coating current is controlled to be not more than 1A so as to keep the electric field intensity relatively constant, and avoid the phenomenon that the uniformity of the film thickness is influenced due to different coating rates at different moments because the ion density generated by the coating gas is changed due to the change of the electric field intensity;
the preset coating time can be set according to the requirement of the actually required film thickness; in specific application, under the condition that the process parameters are not changed, a relation curve of the film thickness and the time under specific process parameters can be drawn through a plurality of coating tests with different coating times, and under the condition that the process parameters are not different, the relation curve can be referred to determine the corresponding required coating time when the film thickness is a required fixed value.
Preferably, the preset coating time may be set to 10min, 20min, 40min and 60min, respectively, the steps 11 to 14 are repeated within the corresponding preset coating time, and a graph of the relationship between the thickness of the film and the time within the preset coating time of 10min to 60min is obtained as shown in fig. 5;
further, according to the relation curve chart, when film coating is carried out under similar process conditions, corresponding target film coating time can be obtained through an interpolation method according to the required target film thickness, a film coating test is carried out according to the obtained target film coating time, the film thickness obtained through the test is compared with the required target film thickness, the film coating time is adjusted according to the difference between the film coating time and the required target film thickness, film coating is carried out according to the adjusted film coating time, and the target film thickness is ensured to be obtained;
according to the embodiment of the invention, the fixture and the coating current with high control precision are used, so that the thickness uniformity control of the film generated by magnetron sputtering coating on the inner wall of the small-aperture pipeline can be realized, and the thickness uniformity of the film is improved; the required coating time under similar process conditions can be determined by obtaining the relation curve of the film thickness and the time, so that the loss of manpower, material resources and financial resources caused by multiple trial tests is avoided, and the coating cost is reduced.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A coating system based on magnetron sputtering is characterized by comprising:
the device comprises a supporting unit (1), wherein the supporting unit (1) is arranged in a vacuum chamber required by film coating, a permanent magnet (5) is arranged outside the supporting unit (1) in a surrounding manner, and the permanent magnet (5) forms a runway-shaped closed magnetic field on the surface of a target (4);
the target (4) is annularly arranged outside the permanent magnet (5);
the to-be-coated pipeline (7) is sleeved outside the target (4), and the to-be-coated pipeline (7) is fixedly connected with the vacuum chamber through a clamp;
a power supply, wherein the cathode of the power supply is electrically connected with the target (4), the anode of the power supply is electrically connected with the vacuum chamber, and an electric field is formed between the target (4) and the vacuum chamber; under the combined action of the magnetic field generated by the permanent magnet (5) and the electric field, atoms on the surface of the target (4) escape and are sputtered onto the inner wall of the pipeline (7) to be coated to deposit and form a film.
2. The magnetron sputtering based coating system of claim 1, further comprising:
the sleeve (2) is arranged between the target (4) and the permanent magnet (5), and is sleeved outside the permanent magnet (5);
the sleeve (2) has an opening through which the support unit (1) and the permanent magnet (5) pass, and a cavity that accommodates the support unit (1) and the permanent magnet (5).
3. The magnetron sputtering-based coating system according to claim 2, wherein the target (4) is arranged around the outer wall of the sleeve (2), and one end of the target (4) is fixed on the outer wall of the sleeve (2) by a metal clamp (3).
4. The magnetron sputtering based coating system according to claim 2, wherein a cooling water flow passage (6) is provided at a gap between the sleeve (2) and the permanent magnet (5).
5. The magnetron sputtering based coating system of claim 1, wherein the fixture comprises:
the cylinder body (10), the cylinder body (10) is a cylinder with a cavity structure for accommodating the pipeline (7) to be coated;
the flange (8) is fixedly connected with one end of the cylinder body (10);
and the bottom cover (11) is in threaded connection with the other end of the barrel (10).
6. The magnetron sputtering based coating system according to claim 5, wherein the flange (8) is fixedly connected to the top of the vacuum chamber.
7. The magnetron sputtering based coating system according to claim 5, characterized in that the length of the cylinder (10) is greater than the length of the pipe (7) to be coated; when coating is carried out, the pipeline (7) to be coated is inserted into the barrel (10) from bottom to top, and the pipeline (7) to be coated is accommodated in the cavity structure through the screw joint of the barrel (10) and the bottom cover (11).
8. The magnetron sputtering-based coating system according to claim 5, wherein the bottom cover (11) is provided with an opening for the target (4) to pass through, and the diameter of the opening is equal to the inner diameter of the pipeline (7) to be coated.
9. The magnetron sputtering based coating system according to claim 1, characterized in that the pipe (7) to be coated is mounted coaxially to the target (4).
10. A magnetron sputtering-based coating method, applied to the coating system according to any one of claims 1 to 9, comprising:
providing a target (4);
the target (4) penetrates through a pipeline (7) to be coated;
the permanent magnet (5) is fixed on the supporting unit (1) at the top of the vacuum chamber, and a runway-shaped closed magnetic field is formed on the surface of the target (4) by the permanent magnet (5);
and in a preset coating time, controlling a power supply to supply power to the target (4), controlling the current to be in a current range required by glow discharge, generating magnetron sputtering on the surface of the target (4) under the combined action of an electric field and a magnetic field, and enabling atoms on the surface of the target (4) to escape and sputter onto the inner wall of the pipeline (7) to be coated to deposit and form a film.
CN202211138872.5A 2022-09-19 2022-09-19 Film coating system and method based on magnetron sputtering Pending CN115491645A (en)

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