CN115488494A - Method for confirming focus of ultrafast laser micro-nano processing platform - Google Patents
Method for confirming focus of ultrafast laser micro-nano processing platform Download PDFInfo
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- CN115488494A CN115488494A CN202110678524.6A CN202110678524A CN115488494A CN 115488494 A CN115488494 A CN 115488494A CN 202110678524 A CN202110678524 A CN 202110678524A CN 115488494 A CN115488494 A CN 115488494A
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- micro
- ultrafast laser
- nano
- laser
- control computer
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000003384 imaging method Methods 0.000 claims abstract description 20
- 238000005259 measurement Methods 0.000 claims abstract description 13
- 238000005070 sampling Methods 0.000 claims description 10
- 238000005516 engineering process Methods 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- 238000003754 machining Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
- B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Microscoopes, Condenser (AREA)
Abstract
A method for confirming a focal point of an ultrafast laser micro-nano processing platform comprises the following steps: confirming the z coordinate of the imaging focal plane; estimating and setting a measurement range and measurement precision; performing ultrafast laser proofing; identifying a point with the best processing effect through comparison, and obtaining the defocusing amount of the point; and setting the defocusing amount before laser processing, and executing the laser processing. The invention can accurately find the laser focus position and has the characteristics of convenient query, time saving and reliability.
Description
Technical Field
The invention belongs to ultrafast laser micro-nano machining, and particularly relates to a method for confirming a focus of an ultrafast laser micro-nano machining platform.
Background
The ultrafast laser micro-nano processing technology is a new processing technology and has the advantages of high processing precision, small heat effect and difficult occurrence of crystallization oxidation. The ultrafast laser micro-nano processing platform mainly comprises six parts, namely an ultrafast laser, a transmission light path, a microscope objective, a micro-nano moving platform, an imaging system and a general control computer.
The microscope objective is used in an imaging system to image a focal plane. On the other hand, laser emitted by the ultrafast laser is focused on a processing plane through the microscope objective, and the processes of material removal, cladding, welding and the like are realized. The micro-nano moving platform is used for bearing and moving the material to be processed.
Due to the instability of the mode of the ultrafast laser, the aging of a circuit, the influence of the plane flatness of a reflector in a light path, the wave band of laser emitted by the ultrafast laser is different from that of visible light, the wave band coverage range of the ultrafast laser is wide, and the like. The focal plane of the imaging system and the focal point of the ultrafast laser which emits laser and focuses the laser through the objective lens are often not completely consistent, even have larger errors. Such errors cannot be tolerated in the field of micro-nano machining.
Disclosure of Invention
The invention aims to provide a method for confirming the focal point of an ultrafast laser micro-nano processing platform, which can find the laser focal point for the ultrafast laser micro-nano processing platform and has the characteristics of convenience in query, time saving and reliability. .
The technical scheme of the invention is as follows:
a method for confirming a focus of an ultrafast laser micro-nano processing system, wherein the ultrafast laser micro-nano processing system comprises an ultrafast laser, a microscope objective, a micro-nano moving platform, an imaging system and a general control computer, the general control computer is respectively connected with the ultrafast laser, the micro-nano moving platform and the imaging system, and the method is characterized by comprising the following steps:
1) Placing a sample to be processed on an object stage of the micro-nano moving platform, imaging the sample to be processed by using an imaging system, and acquiring the ordinate of the micro-nano moving platform at the moment by the general control computer as z 0 ；
2) The maximum defocus amount d is set on the general control computer 1 The minimum defocus amount is d 2 And the measurement accuracy is delta z Under the control of the general control computer, the ultrafast laser micro-nano processing systems respectively use (x) 0 ,y 0 ,z 0 +d 2 ),(x 1 ,y 1 ,z 0 +d 2 +δ z )，(x 2 ,y 2 ,z 0 +d 2 +2δ z )，……，(x n ,y n ,z 0 +d 1 ) Point sampling, wherein (x, y, z) coordinates of a sampling point are formed and recorded into a picture of the sampling point by the microscope objective and the imaging system and sent to the general control computer for storage;
3) The image of the sampling point shows the range of the ultrafast laser on the sample to be processed, and according to the standard that the sampling point with the minimum action range has the most appropriate defocusing distance, the z coordinate of the point with the best processing effect is selected by artificial identification or image recognition technology and recorded as z coordinate t Then z is t -z 0 The defocusing amount of the ultrafast laser micro-nano processing system is obtained.
And for different laser paths and lasers with different wavelength pulse lengths, proper measurement ranges and measurement accuracy are set, and the processing system can automatically or semi-automatically perform laser proofing.
The invention has the following technical effects:
in the field of ultrafast laser micro-nano processing, no related method is available for confirming the position relationship between a focus and an imaging plane, the invention can confirm the focus of an ultrafast laser micro-nano processing system, and the precision of micro-nano processing is improved. The data of the confirmed focus is stored in the general control computer, and the method has the characteristics of convenience in query, time saving and reliability.
Drawings
FIG. 1 is a schematic diagram of an ultrafast laser micro-nano processing platform in the prior art
FIG. 2 is a schematic diagram of the difference between the focal point and the imaging plane of a laser
FIG. 3 is a flow chart of a method for confirming a focus of an ultrafast laser micro-nano processing platform
Detailed Description
The present invention will be described in detail with reference to examples, but it should be understood that the scope of the present invention is not limited by the examples.
The inventor finds that the laser focus of the laser is inconsistent with the imaging plane in the process of implementing the invention, if a manual proofing method is adopted to find the focus, the process is tedious and time-consuming, and the found focus can only obtain the absolute value of the z coordinate of the platform and has no relative relation with the imaging plane, so that the found focus is not easy to apply to subsequent processing. While laser instability may require a focus re-seek due to a path change that is time consuming. In order to overcome the problems, the invention provides a method for confirming the focus of an ultrafast laser micro-nano machining platform, which can quickly, conveniently and accurately find the laser focus and apply the laser focus to laser machining.
In order to reduce the measurement time during the specific implementation, a larger measurement range and a larger measurement precision are selected at the beginning in the process of searching the laser focus, the proofing control is executed, and the point with the best processing effect and two adjacent points are found by contrasting and selecting the sample. With these two points as a new measurement range, a smaller measurement accuracy is selected, the proofing control is executed again, and the desired focal position can be obtained by comparing the samples, usually twice.
Finding the laser focus of an objective lens to be amplified, placing a stainless steel sheet on a micro-nano mobile platform, controlling the z-axis motion of the platform through a main control computer, observing the imaging of an imaging system, clicking to confirm focusing when the picture is clear, obtaining the coordinates of three (x, y, z) axes at the moment (2000um, 8000um, 11123um), inputting the minimum defocusing amount of-1000 um, the maximum defocusing amount of 1000um, measuring the precision of 100um, and generating samples at (2000um, 8000um, 10123um), (2200um, 8000um, 10223um), (2400um, 8000um, 10323um), (8230, 8230, (6000um, 8000um, 12323um). After the proofing is finished, the images of the proofing points are observed, and the proofing effect at the positions (3400um, 8000um and 10823um) is the best, so that the defocusing amount is 10823-11123= -200um.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (2)
1. A method for confirming a focus of an ultrafast laser micro-nano processing system, wherein the ultrafast laser micro-nano processing system comprises an ultrafast laser, a microscope objective, a micro-nano moving platform, an imaging system and a general control computer, the general control computer is respectively connected with the ultrafast laser, the micro-nano moving platform and the imaging system, and the method is characterized by comprising the following steps:
1) Placing a sample to be processed on an object stage of the micro-nano moving platform, imaging the sample to be processed by using an imaging system, and acquiring the ordinate of the micro-nano moving platform at the moment by the general control computer as z 0 ；
2) The maximum defocus amount d is set on the general control computer 1 The minimum defocus amount is d 2 And the measurement accuracy is delta z Under the control of the general control computer, the ultrafast laser micro-nano processing systems respectively use (x) 0 ,y 0 ,z 0 +d 2 ),(x 1 ,y 1 ,z 0 +d 2 +δ z )，(x 2 ,y 2 ,z 0 +d 2 +2δ z )，……，(x n ,y n ,z 0 +d 1 ) Point sampling, wherein (x, y, z) coordinates of a sampling point are formed and recorded into a picture of the sampling point by the microscope objective and the imaging system and sent to the general control computer for storage;
3) The picture of the sampling point shows the range of the ultrafast laser on the sample to be processed, and according to the standard that the sampling point with the minimum action range has the most appropriate defocusing distance, the z coordinate of the point with the best processing effect is selected by manual identification or image recognition technology and recorded as z coordinate t Then z is t -z 0 The defocusing amount of the ultrafast laser micro-nano processing system is obtained.
2. The apparatus of claim 1, wherein: and for different laser paths and lasers with different wavelength pulse lengths, proper measurement ranges and measurement accuracy are set, and the processing system can automatically or semi-automatically perform laser proofing.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110678524.6A CN115488494A (en) | 2021-06-18 | 2021-06-18 | Method for confirming focus of ultrafast laser micro-nano processing platform |
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| CN202110678524.6A CN115488494A (en) | 2021-06-18 | 2021-06-18 | Method for confirming focus of ultrafast laser micro-nano processing platform |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202291842U (en) * | 2011-09-28 | 2012-07-04 | 江苏大学 | Rapid centering device for laser focus position |
| CN104002039A (en) * | 2014-04-29 | 2014-08-27 | 深圳市大族激光科技股份有限公司 | Method for acquiring laser focal point through laser gear |
| CN106125246A (en) * | 2016-07-19 | 2016-11-16 | 湖北三江航天红峰控制有限公司 | A kind of from the method seeking laser focal plane |
| CN106141427A (en) * | 2015-04-27 | 2016-11-23 | 维嘉数控科技（苏州）有限公司 | Automatically the method obtaining laser spot |
| CN109926711A (en) * | 2019-04-25 | 2019-06-25 | 大族激光科技产业集团股份有限公司 | A kind of method of automatic acquisition laser spot and the automatic processing unit (plant) for obtaining laser spot |
| CN209841188U (en) * | 2019-05-09 | 2019-12-24 | 西安理工大学 | Laser focus searching device |
| CN112415735A (en) * | 2020-03-16 | 2021-02-26 | 中国科学院深圳先进技术研究院 | Real-time automatic focusing system for microscope |
| CN112719576A (en) * | 2020-12-10 | 2021-04-30 | 欣旺达电动汽车电池有限公司 | Method, device and system for searching laser welding focus and storage medium |
-
2021
- 2021-06-18 CN CN202110678524.6A patent/CN115488494A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202291842U (en) * | 2011-09-28 | 2012-07-04 | 江苏大学 | Rapid centering device for laser focus position |
| CN104002039A (en) * | 2014-04-29 | 2014-08-27 | 深圳市大族激光科技股份有限公司 | Method for acquiring laser focal point through laser gear |
| CN106141427A (en) * | 2015-04-27 | 2016-11-23 | 维嘉数控科技（苏州）有限公司 | Automatically the method obtaining laser spot |
| CN106125246A (en) * | 2016-07-19 | 2016-11-16 | 湖北三江航天红峰控制有限公司 | A kind of from the method seeking laser focal plane |
| CN109926711A (en) * | 2019-04-25 | 2019-06-25 | 大族激光科技产业集团股份有限公司 | A kind of method of automatic acquisition laser spot and the automatic processing unit (plant) for obtaining laser spot |
| CN209841188U (en) * | 2019-05-09 | 2019-12-24 | 西安理工大学 | Laser focus searching device |
| CN112415735A (en) * | 2020-03-16 | 2021-02-26 | 中国科学院深圳先进技术研究院 | Real-time automatic focusing system for microscope |
| CN112719576A (en) * | 2020-12-10 | 2021-04-30 | 欣旺达电动汽车电池有限公司 | Method, device and system for searching laser welding focus and storage medium |
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