CN115466865B - Method for preparing high-strength high-conductivity Cu-Cr-Sn alloy based on low-temperature plastic deformation and graded aging - Google Patents
Method for preparing high-strength high-conductivity Cu-Cr-Sn alloy based on low-temperature plastic deformation and graded aging Download PDFInfo
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- 229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 36
- 230000032683 aging Effects 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000000956 alloy Substances 0.000 claims abstract description 61
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 60
- 238000005096 rolling process Methods 0.000 claims abstract description 47
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000010949 copper Substances 0.000 claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 claims abstract description 33
- 239000002245 particle Substances 0.000 claims abstract description 28
- 238000005098 hot rolling Methods 0.000 claims abstract description 21
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000007788 liquid Substances 0.000 claims abstract description 20
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 20
- 238000003801 milling Methods 0.000 claims abstract description 17
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 claims abstract description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000002791 soaking Methods 0.000 claims abstract description 14
- 229910052786 argon Inorganic materials 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims abstract description 10
- 238000010791 quenching Methods 0.000 claims abstract description 10
- 230000000171 quenching effect Effects 0.000 claims abstract description 10
- 238000005266 casting Methods 0.000 claims abstract description 9
- 238000003723 Smelting Methods 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000011651 chromium Substances 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 13
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 6
- 229910052718 tin Inorganic materials 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 239000002994 raw material Substances 0.000 description 8
- 238000005728 strengthening Methods 0.000 description 8
- 230000006698 induction Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000005097 cold rolling Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229910000599 Cr alloy Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 229910019580 Cr Zr Inorganic materials 0.000 description 1
- 229910019817 Cr—Zr Inorganic materials 0.000 description 1
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 1
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 1
- 229910017824 Cu—Fe—P Inorganic materials 0.000 description 1
- 229910018098 Ni-Si Inorganic materials 0.000 description 1
- 229910018529 Ni—Si Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003137 locomotive effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/02—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling heavy work, e.g. ingots, slabs, blooms, or billets, in which the cross-sectional form is unimportant ; Rolling combined with forging or pressing
- B21B1/026—Rolling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/02—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling heavy work, e.g. ingots, slabs, blooms, or billets, in which the cross-sectional form is unimportant ; Rolling combined with forging or pressing
- B21B1/06—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling heavy work, e.g. ingots, slabs, blooms, or billets, in which the cross-sectional form is unimportant ; Rolling combined with forging or pressing in a non-continuous process, e.g. triplet mill, reversing mill
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B37/00—Control devices or methods specially adapted for metal-rolling mills or the work produced thereby
- B21B37/56—Elongation control
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/002—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working by rapid cooling or quenching; cooling agents used therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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- Y02E30/30—Nuclear fission reactors
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Abstract
The application provides a method for preparing a high-strength high-conductivity Cu-Cr-Sn alloy based on low-temperature plastic deformation and graded aging, and relates to the technical field of high-strength high-conductivity copper alloy. A method for preparing a high-strength high-conductivity Cu-Cr-Sn alloy based on low-temperature plastic deformation and graded aging comprises the following steps: vacuum smelting copper particles, copper-chromium intermediate alloy and tin particles under the protection of argon, casting after smelting, and milling the surface after cooling to obtain an alloy cast ingot; heating the obtained alloy cast ingot, performing hot rolling treatment, and then quenching; soaking the quenched alloy in liquid nitrogen, and then performing low-temperature rolling; and (5) placing the alloy subjected to low-temperature rolling in a muffle furnace for graded aging treatment. The high-strength high-conductivity Cu-Cr-Sn alloy prepared by the method has tensile strength of more than 600MPa, hardness of more than 150 and conductivity of more than 80 percent, and meets the performance requirement of lead frame materials for large-scale integrated circuits.
Description
Technical Field
The application relates to the technical field of high-strength and high-conductivity copper alloy for lead frames, in particular to a method for preparing high-strength and high-conductivity Cu-Cr-Sn alloy based on low-temperature plastic deformation and graded aging.
Background
The lead frame can connect the internal chip of the integrated circuit with the external circuit, and is one of the most important and core raw materials of the integrated circuit. Copper alloy materials have been used as lead frame materials for electronics, and have been the mainstream lead frame materials because of their excellent electrical and thermal conductivity and good processing properties, as a substitute for fe—ni materials. The main copper alloy series include Cu-Fe-P, cu-Ni-Si, cu-Cr-Zr/Sn, cu-Ag and the like. The Cu-Cr-Zr/Sn alloy is a precipitation strengthening copper alloy, has good mechanical property and conductivity, and is an excellent lead frame material.
With the development of integrated circuits in large scale and ultra-large scale, the development of lead frame materials in the direction of finer pitches and multi-terminal numbers is accompanied by the requirement that the thickness of the lead frame materials is further thinned to 0.05-0.15 mm, which is required to put higher requirements on the strength and electrical/thermal conductivity of the lead frame materials. The higher strength and hardness of the lead frame can ensure the stable requirement of supporting and fixing the chip; the higher electrical/thermal conductivity reduces the capacitance and inductance effects and ensures high integration and efficient heat dissipation of the high density integrated circuit. Ideally good leadframe material strength should be greater than 600MPa, hardness HV should be greater than 130, and electrical conductivity (IACS) should be greater than 80%. However, it is difficult to achieve this with the alloys produced by the conventional techniques.
Disclosure of Invention
The invention aims to provide a method for preparing a high-strength high-conductivity Cu-Cr-Sn alloy based on low-temperature plastic deformation and graded aging, and the Cu-Cr-Sn alloy produced by the method meets the technical requirements of lead frames for large-scale integrated circuits.
It is another object of the present application to provide a Cu-Cr-Sn alloy obtained by the above method.
The technical problem of the application is solved by adopting the following technical scheme.
In one aspect, embodiments of the present application provide a method for preparing a high-strength and high-conductivity Cu-Cr-Sn alloy based on low-temperature plastic deformation and classified aging, including the steps of:
vacuum smelting copper particles, copper-chromium intermediate alloy and tin particles under the protection of argon, casting after smelting, and milling the surface after cooling to obtain an alloy cast ingot;
heating the obtained alloy cast ingot, performing hot rolling treatment, and then quenching;
soaking the quenched alloy in liquid nitrogen, and then performing low-temperature rolling;
and (3) placing the alloy subjected to low-temperature rolling in a muffle furnace for grading aging treatment to obtain the high-strength high-conductivity Cu-Cr-Sn alloy.
On the other hand, the embodiment of the application provides the high-strength high-conductivity Cu-Cr-Sn alloy obtained by the preparation method.
Compared with the prior art, the embodiment of the application has at least the following advantages or beneficial effects:
according to the method, the copper particles, the copper-chromium intermediate alloy and the tin particles are subjected to vacuum melting, high-temperature rolling, low-temperature rolling and graded aging treatment, so that microscopic defects such as looseness and shrinkage cavity in the cast alloy can be eliminated, and the cast alloy has uniform and fine precipitation phases after high-temperature and low-temperature rolling, so that the strengthening effect on the whole Cu-Cr-Sn alloy is achieved. The copper strip prepared by the method has the precipitated phases which are highly uniform and dispersed, and in addition, a certain amount of deformed tissues exist in the matrix, so that a better strengthening effect is achieved. The tensile strength is more than 600MPa, the hardness HV is more than 150, the conductivity (IACS) is more than 80 percent, the performance is superior to that of the same type of products, and the performance requirement of the lead frame material for the large-scale integrated circuit is met.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a photograph showing a precipitated phase in a matrix of a high-strength and high-conductivity Cu-Cr-Sn alloy obtained in example 4 of the present invention;
FIG. 2 is a mechanical drawing curve of a high-strength and high-conductivity Cu-Cr-Sn alloy obtained in example 4 of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below. The specific conditions are not noted in the examples and are carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail with reference to specific examples.
A method for preparing a high-strength high-conductivity Cu-Cr-Sn alloy based on low-temperature plastic deformation and graded aging comprises the following steps:
vacuum smelting copper particles, copper-chromium intermediate alloy and tin particles under the protection of argon, casting after smelting, and milling the surface after cooling to obtain an alloy cast ingot;
heating the obtained alloy cast ingot, performing hot rolling treatment, and then quenching;
soaking the quenched alloy in liquid nitrogen, and then performing low-temperature rolling;
and (3) placing the alloy subjected to low-temperature rolling in a muffle furnace for grading aging treatment to obtain the high-strength high-conductivity Cu-Cr-Sn alloy.
According to the method, the copper particles, the copper-chromium intermediate alloy and the tin particles are subjected to vacuum melting, high-temperature rolling, low-temperature rolling and graded aging treatment, so that microscopic defects such as looseness and shrinkage cavity in the cast alloy can be eliminated, and the cast alloy has uniform and fine precipitation phases after high-temperature and low-temperature rolling, so that the strengthening effect on the whole Cu-Cr-Sn alloy is achieved. The copper strip prepared by the method has the precipitated phases which are highly uniform and dispersed, and in addition, a certain amount of deformed tissues exist in the matrix, so that a better strengthening effect is achieved. The tensile strength is more than 600MPa, the hardness HV is more than 150, the conductivity (IACS) is more than 80 percent, the performance is superior to that of the same type of products, and the performance requirement of the lead frame material for the large-scale integrated circuit is met.
In some embodiments of the present application, the mass ratio of the copper particles, the copper-chromium intermediate alloy and the tin particles is (80-90): (10-18): 0.2. compared with the current high-chromium alloy, the chromium content in the Cu-Cr-Sn alloy is obviously lower, and experiments show that the Cu-Cr-Sn alloy prepared by the chromium content has better conductivity and strength, and is suitable for the fields of lead frames, electric locomotive wires and the like.
In some embodiments of the present application, the copper-chromium master alloy has a chromium content of 4.5 to 5wt%.
In some embodiments of the present application, the vacuum melting temperature is 1180 to 1250 ℃ and the vacuum degree is 8 to 10MPa.
In some embodiments of the present application, the casting temperature is 1100-1160 ℃, and the casting mold is a water-cooled copper mold.
In some embodiments of the present application, the milling amount of the milling surface is 1-1.2 mm on the upper surface and 1-0.8 mm on the lower surface, and the milling amount is 0.6-0.8 mm on the side surface.
In some embodiments of the present application, the hot rolling is performed at a temperature of 950 to 1000 ℃ and the deformation amount of the hot rolling is 20%. Experiments prove that 20% of hot rolling quantity is enough to eliminate microscopic defects such as looseness, shrinkage cavity and the like in the cast alloy, and the process steps are reduced on the basis of ensuring the quality of the cast alloy.
In some embodiments of the present application, the alloy is immersed in liquid nitrogen for 12-20 min, and the low-temperature rolling is performed by multiple passes with a total deformation of 75-87.5%, and the alloy is immersed in liquid nitrogen for 12-20 min after each pass. The solid solution atoms can be locked at the original position by low-temperature rolling, and the precipitated phases can be more uniform and finer in the subsequent aging process, so that an excellent strengthening effect is achieved. The soaking is carried out in the low-temperature environment of liquid nitrogen before each rolling, so that a better effect can be achieved.
In some embodiments of the present application, the above-mentioned step aging treatment is specifically: aging for 2 hours at 300-350 ℃ and aging for 1 hour at 480-520 ℃. The fractional aging can regulate and control the precipitation kinetics behavior of solid solution atoms, and the morphology and the density of a precipitated phase are better controlled through the fractional aging.
A high-strength high-conductivity Cu-Cr-Sn alloy is prepared by the method.
The features and capabilities of the present application are described in further detail below in connection with the examples.
Example 1
Copper particles, intermediate alloy of copper and chromium (Cr content is 5 wt%) and pure tin particles are put into a crucible of a vacuum induction melting furnace according to the proportion of 90:10:0.2, vacuumized to below 10pa, and then argon is injected for protection. Then the temperature is raised to 1180 ℃, and the raw materials are cast into a water-cooled copper mould at 1160 ℃ after being completely melted. Taking out the workpiece after natural cooling to mill the surface, wherein the milling amount is 1mm on the upper surface and the lower surface and 0.8mm on the left side and the right side; thereby obtaining an alloy ingot. The obtained alloy ingot was heated to 980 ℃, subjected to hot rolling treatment with a deformation amount of 20%, and then subjected to quenching treatment. Soaking the alloy obtained by hot rolling in liquid nitrogen for about 15min, and then taking out to perform low-temperature rolling, wherein the rolling deformation is 50%; then soaking the steel plate into liquid nitrogen again for 15min, and rolling once again in a way of 50% rolling deformation. Subsequently, the rolled alloy was placed in a muffle furnace for 2h at 350 ℃ followed by 1h at 450 ℃.
Example 2
Copper particles, a copper chromium (Cr content of 5 wt%) master alloy and pure tin particles were mixed according to a ratio of 90:10: the mixture is put into a crucible of a vacuum induction melting furnace according to the proportion of 0.2, vacuumized to less than 10pa, and then argon is injected for protection. Then the temperature is raised to 1180 ℃, and the raw materials are cast into a water-cooled copper mould at 1160 ℃ after being completely melted. Taking out the workpiece after natural cooling to mill the surface, wherein the milling amount is 1mm on the upper surface and the lower surface and 0.8mm on the left side and the right side; thereby obtaining an alloy ingot. The obtained alloy ingot was heated to 980 ℃, subjected to hot rolling treatment with a deformation amount of 20%, and then subjected to quenching treatment. Soaking the alloy obtained by hot rolling in liquid nitrogen for 16min, and then taking out to perform low-temperature rolling, wherein the rolling deformation is 50%; then soaking the steel plate into liquid nitrogen again for 14min, and rolling once again in a way of 50% rolling deformation. Subsequently, the rolled alloy was placed in a muffle furnace for 2h at 300 ℃ followed by 1h at 480 ℃.
Example 3
Copper particles, a copper chromium (Cr content of 5 wt%) master alloy and pure tin particles were mixed according to 80:18: the mixture is put into a crucible of a vacuum induction melting furnace according to the proportion of 0.2, vacuumized to 8pa, and then argon is injected for protection. Then the temperature is raised to 1200 ℃, and the raw materials are cast into a water-cooled copper mould at 1160 ℃ after being completely melted. Taking out the workpiece after natural cooling to mill the surface, wherein the milling amount is 1mm on the upper surface and the lower surface and 0.8mm on the left side and the right side; thereby obtaining an alloy ingot. The obtained alloy ingot was heated to 980 ℃, subjected to hot rolling treatment with a deformation amount of 20%, and then subjected to quenching treatment. Soaking the alloy obtained by hot rolling in liquid nitrogen for 20min, and then taking out to perform low-temperature rolling, wherein the rolling deformation is 50%; then soaking the steel plate into liquid nitrogen again for 15min, and rolling once again in a way of 50% rolling deformation. Subsequently, the rolled alloy was placed in a muffle furnace for 2h at 300 ℃ followed by 1h at 480 ℃.
Example 4
Copper particles, a copper chromium (Cr content of 5 wt%) master alloy and pure tin particles were mixed according to 80:18: the mixture is put into a crucible of a vacuum induction melting furnace according to the proportion of 0.2, vacuumized to 10Pa, and then argon is injected for protection. And then heating, and casting the raw materials into a water-cooled copper mold after all the raw materials are melted. Taking out the workpiece after natural cooling to mill the surface, wherein the milling amount is 1mm on the upper surface and the lower surface and 0.8mm on the left side and the right side; thereby obtaining an alloy ingot. The obtained copper billet was heated to 950 ℃, subjected to hot rolling treatment with a deformation amount of 20%, and then the rolled copper billet was subjected to quenching treatment. Immersing the copper plate obtained by hot rolling in liquid nitrogen for about 15min, and then taking out for low-temperature rolling, wherein the rolling deformation is 50%; the soaking in liquid nitrogen and rolling were then repeated 2 times, with each pass of rolling deformation of 50%. Subsequently, the rolled plate was placed in a muffle furnace for 2 hours at 300℃and then for 1 hour at 480 ℃.
The high-strength high-conductivity Cu-Cr-Sn alloy prepared in the embodiment is observed, the photograph of the precipitated phase is shown in figure 1, and the surface of the alloy has the precipitated phase with high density and homogeneous distribution as shown in figure 1.
The high-strength high-conductivity Cu-Cr-Sn alloy prepared in the example was subjected to copper drawing, and the curve thereof is shown in FIG. 2.
Example 5
Copper particles, copper chromium (Cr content of 4.5 wt%) master alloy and pure tin particles were mixed according to 80:18: the mixture is put into a crucible of a vacuum induction melting furnace according to the proportion of 0.2, vacuumized to 9Pa, and then argon is injected for protection. Then the temperature is raised to 1200 ℃, and the raw materials are cast into a water-cooled copper mould at 1160 ℃ after being completely melted. Taking out the workpiece after natural cooling to mill the surface, wherein the milling amount is 1mm on the upper surface and the lower surface and 0.8mm on the left side and the right side; thereby obtaining an alloy ingot. The obtained copper billet was heated to 1000 c, subjected to hot rolling treatment with a deformation amount of 20%, and then subjected to quenching treatment. Immersing the copper plate obtained by hot rolling in liquid nitrogen for about 15min, and then taking out for low-temperature rolling, wherein the rolling deformation is 50%; the soaking in liquid nitrogen and rolling were then repeated 2 times, with each pass of rolling deformation of 50%. Subsequently, the rolled plate was placed in a muffle furnace for 2 hours at 300℃and then for 1 hour at 520 ℃.
Example 6
Copper particles, copper chromium (Cr content of 4.5 wt%) master alloy and pure tin particles were mixed according to 80:18: the mixture is put into a crucible of a vacuum induction melting furnace according to the proportion of 0.2, vacuumized to 9Pa, and then argon is injected for protection. Then the temperature is raised to 1200 ℃, and the raw materials are cast into a water-cooled copper mould at 1160 ℃ after being completely melted. Taking out the workpiece after natural cooling to mill the surface, wherein the milling amount is 1mm on the upper surface and the lower surface and 0.8mm on the left side and the right side; thereby obtaining an alloy ingot. The obtained copper billet was heated to 1000 c, subjected to hot rolling treatment with a deformation amount of 20%, and then subjected to quenching treatment. Rolling the copper plate obtained by hot rolling at room temperature, wherein the rolling deformation is 50%; the rolling was then repeated 2 times with a rolling deformation of 50% per pass. Subsequently, the rolled plate was placed in a muffle furnace for 2 hours at 300℃and then for 1 hour at 520 ℃.
Experimental example
The high-strength and high-conductivity Cu-Cr-Sn alloys prepared in examples 1 to 5 were subjected to performance test, and the results are shown in Table 1.
TABLE 1
As can be seen from Table 1, the high-strength and high-conductivity Cu-Cr-Sn alloys prepared in examples 1 to 5 have stable performance, wherein the strength HV reaches 165 or more, the tensile strength reaches 550MPa or more, and the conductivity reaches 83%, all of which meet the good standards of lead frame materials, and the high-strength and high-conductivity Cu-Cr-Sn alloys prepared by the preparation method have excellent and stable performance. Example 6 the hardness, tensile strength and electrical conductivity of the final product were all reduced by cold rolling at room temperature. It is explained that soaking in liquid nitrogen before each cold rolling operation in the cold rolling step of the present application has a better effect.
In summary, the embodiment of the application provides a method for preparing a high-strength high-conductivity Cu-Cr-Sn alloy based on low-temperature plastic deformation and graded aging. According to the method, the copper particles, the copper-chromium intermediate alloy and the tin particles are subjected to vacuum melting, high-temperature rolling, low-temperature rolling and graded aging treatment, so that microscopic defects such as looseness and shrinkage cavity in the cast alloy can be eliminated, and the cast alloy has uniform and fine precipitation phases after high-temperature and low-temperature rolling, so that the strengthening effect on the whole Cu-Cr-Sn alloy is achieved. The copper strip prepared by the method has the precipitated phases which are highly uniform and dispersed, and in addition, a certain amount of deformed tissues exist in the matrix, so that a better strengthening effect is achieved. The tensile strength is more than 600MPa, the hardness HV is more than 150, the conductivity (IACS) is more than 80 percent, the performance is superior to that of the same type of products, and the performance requirement of the lead frame material for the large-scale integrated circuit is met.
The embodiments described above are some, but not all, of the embodiments of the present application. The detailed description of the embodiments of the present application is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
Claims (6)
1. The method for preparing the high-strength high-conductivity Cu-Cr-Sn alloy based on low-temperature plastic deformation and graded aging is characterized by comprising the following steps of:
the copper particles, the copper-chromium intermediate alloy and the tin particles are mixed according to the mass ratio of (80-90): (10-18): 0.2, vacuum smelting under the protection of argon, casting after smelting, and milling the surface after cooling to obtain an alloy cast ingot; the chromium content of the copper-chromium intermediate alloy is 4.5-5 wt%;
heating the obtained alloy cast ingot, performing hot rolling treatment, and then quenching;
soaking the quenched alloy in liquid nitrogen, and then performing low-temperature rolling; the alloy is soaked in liquid nitrogen for 12-20 min, the low-temperature rolling is multi-pass rolling with the total deformation of 75-87.5%, and the alloy is soaked in liquid nitrogen for 12-20 min after each rolling;
placing the alloy subjected to low-temperature rolling in a muffle furnace for grading aging treatment to obtain the high-strength high-conductivity Cu-Cr-Sn alloy; the grading aging treatment specifically comprises the following steps: aging for 2 hours at 300-350 ℃ and aging for 1 hour at 480-520 ℃.
2. The method for preparing the high-strength and high-conductivity Cu-Cr-Sn alloy based on low-temperature plastic deformation and fractional aging according to claim 1, wherein the vacuum melting temperature is 1180-1250 ℃ and the vacuum degree is 8-10 Pa.
3. The method for preparing the high-strength and high-conductivity Cu-Cr-Sn alloy based on low-temperature plastic deformation and graded aging according to claim 1, wherein the casting temperature is 1100-1160 ℃, and the casting die is a water-cooled copper die.
4. The method for preparing the high-strength high-conductivity Cu-Cr-Sn alloy based on low-temperature plastic deformation and graded aging according to claim 1, wherein the milling quantity of the milling surface is 1-1.2 mm on the upper surface and the lower surface, and the milling quantity of the milling surface is 0.6-0.8 mm on the side surface.
5. The method for preparing a high-strength and high-conductivity Cu-Cr-Sn alloy based on low-temperature plastic deformation and classified aging according to claim 1, wherein the temperature of hot rolling is 950-1000 ℃, and the deformation amount of the hot rolling is 20%.
6. A high strength, high conductivity Cu-Cr-Sn alloy, characterized in that it is prepared by the method of any one of claims 1-5.
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