CN115464543A - Polishing method of spliced high-purity aluminum tube target - Google Patents
Polishing method of spliced high-purity aluminum tube target Download PDFInfo
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- CN115464543A CN115464543A CN202211294094.9A CN202211294094A CN115464543A CN 115464543 A CN115464543 A CN 115464543A CN 202211294094 A CN202211294094 A CN 202211294094A CN 115464543 A CN115464543 A CN 115464543A
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 152
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 152
- 238000000034 method Methods 0.000 title claims abstract description 84
- 238000005498 polishing Methods 0.000 title claims abstract description 59
- 238000009991 scouring Methods 0.000 claims abstract description 39
- 229910000679 solder Inorganic materials 0.000 claims abstract description 27
- 229910052738 indium Inorganic materials 0.000 claims abstract description 26
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 25
- 230000003746 surface roughness Effects 0.000 claims abstract description 25
- 239000010963 304 stainless steel Substances 0.000 claims abstract description 13
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 claims abstract description 13
- 244000137852 Petrea volubilis Species 0.000 claims description 35
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 16
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 238000007790 scraping Methods 0.000 claims description 7
- 238000004544 sputter deposition Methods 0.000 abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 8
- 238000007517 polishing process Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 239000010431 corundum Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- WNUPENMBHHEARK-UHFFFAOYSA-N silicon tungsten Chemical compound [Si].[W] WNUPENMBHHEARK-UHFFFAOYSA-N 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
- B24B29/06—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for elongated workpieces having uniform cross-section in one main direction
- B24B29/08—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for elongated workpieces having uniform cross-section in one main direction the cross-section being circular, e.g. tubes, wires, needles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a polishing method of a spliced high-purity aluminum pipe target, which comprises the steps of sequentially carrying out first abrasive paper treatment, second abrasive paper treatment and scouring pad treatment on the surface of the spliced high-purity aluminum pipe target to obtain the polished spliced high-purity aluminum pipe target; the spliced high-purity aluminum tube target sequentially comprises a 304 stainless steel inner tube, an indium solder layer and a high-purity aluminum tube from inside to outside; the purity of the high-purity aluminum pipe is more than or equal to 99.9wt%. The polishing method provided by the invention is simple to operate, the surface roughness of the polished spliced high-purity aluminum tube target meets the requirement, the grains are consistent, the sputtering use requirement of the aluminum tube target is met, and the polishing method has a large-scale industrial popularization and application prospect.
Description
Technical Field
The invention relates to the technical field of semiconductor tube targets, in particular to a polishing method of a spliced high-purity aluminum tube target.
Background
The spliced high-purity aluminum pipe target for the semiconductor is divided into two parts, wherein the inner lining pipe is made of stainless steel, and the outer pipe is made of sectional high-purity aluminum. The inner pipe and the outer pipe are combined through brazing and welding, and the sputtering machine can be normally used at a client side. The sectional type high-purity aluminum is divided into 5 sections or even more sections during welding, and after each section is polished, the required roughness is required to be achieved, and the color and the texture of the spliced target material of each section are required to be consistent. However, in the process of extruding and welding the aluminum tube target, local tiny damage to the surface of the product is inevitable, and the welding process is easy to be contaminated by solder and oxides. Local tiny damage, if not removed, can cause abnormal discharge during sputtering of the product.
CN104032275A discloses a spliced rotary target and a forming method thereof. The spliced rotary target comprises an inner tube, a target blank coaxial with the inner tube and a jointing layer arranged between the inner tube and the target blank, the target blank is composed of at least two target blank sections, and a splicing surface is arranged at a joint between the two target blank sections. By changing the shape of the splicing part, the influence of the time accumulation of the splicing seam is dispersed to a larger area region, and the film quality difference of the splicing part is reduced, so that the possibility of poor devices is reduced, and the product percent of pass is improved. But does not disclose a method of polishing a tiled, rotating target.
CN113084674A discloses an automatic polishing process method for an aluminum-containing target, which comprises the following steps: and automatically polishing the sputtering surface of the aluminum-containing target by adopting automatic polishing equipment, wherein the automatic polishing process comprises four polishing procedures, and the granularity of abrasive belts used for polishing is gradually reduced to obtain the polished aluminum-containing target. The process method adopts abrasive belts of different models to automatically polish the sputtering surface of the target according to the selection of the material of the target, the granularity of the used abrasive belts is reduced in sequence, and the controllability of the roughness of the polished sputtering surface is ensured through the control of the polishing process parameters, so that the roughness of the sputtering surface of the aluminum-containing target can reach 0.2-0.7 mu m, and the subsequent use requirements are met; the polishing process is carried out automatically, the stability is good, manual operation is reduced, the production efficiency is improved, and the yield of target production can be improved.
CN112809455A discloses a polishing method of a tungsten silicon target and a sputtering surface thereof, the polishing method includes a first water grinding polishing, a second water grinding polishing and a third water grinding polishing which are performed back and forth; the number of round trips is 15-25; the running speeds of the target materials of the first water mill polishing, the second water mill polishing and the third water mill polishing are respectively and independently 0.1-0.3 m/s and are respectively and independently carried out by adopting water mill abrasive belts; the rotating speed of the water grinding abrasive belt is 10-30 r/min, and the specification comprises a No. 600 white corundum abrasive belt or a No. 800 white corundum abrasive belt; the first water mill polishing, the second water mill polishing and the third water mill polishing are respectively and independently accompanied with cooling water to flush the sputtering surface of the target; the scouring rate of the cooling water is 600-800 mL/min, and the temperature is 5-25 ℃. The polishing method greatly reduces the roughness of the sputtering surface of the target, avoids the cracking phenomenon of the target, reduces the production cost and is easy to popularize and apply.
At present, no method for effectively polishing and grinding the spliced aluminum target and completely consistent color lines after treatment exists.
Therefore, the development of the polishing method of the spliced high-purity aluminum tube target, which can ensure that the surface roughness of the polished spliced tube target meets the requirements and the lines are consistent, thereby ensuring the surface quality of the product, is of great significance.
Disclosure of Invention
In view of the problems in the prior art, the invention provides a polishing method of a spliced high-purity aluminum tube target, which comprises the steps of sequentially polishing the spliced high-purity aluminum tube target by using specific abrasive paper and scouring pad, so that the surface roughness of the polished target meets the requirement and the grains are consistent, thereby achieving the purposes of ensuring the surface quality of the product and improving the qualified rate of the product.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a polishing method of a spliced high-purity aluminum pipe target, which comprises the steps of sequentially carrying out first abrasive paper treatment, second abrasive paper treatment and scouring pad treatment on the surface of the spliced high-purity aluminum pipe target to obtain the polished spliced high-purity aluminum pipe target;
the spliced high-purity aluminum tube target sequentially comprises a 304 stainless steel inner tube, an indium solder layer and a high-purity aluminum tube from inside to outside; the purity of the high-purity aluminum pipe is more than or equal to 99.9wt%.
The polishing method of the spliced high-purity aluminum tube target sequentially performs first abrasive paper treatment, second abrasive paper treatment and scouring pad treatment on the spliced high-purity aluminum tube target which sequentially comprises a 304 stainless steel inner tube, an indium solder layer and a high-purity aluminum tube from inside to outside, so that the surface roughness of the polished spliced high-purity aluminum tube target meets the requirement, the grains are consistent, and the use requirement of aluminum tube target sputtering is met. The polishing method is simple to operate and suitable for large-scale popularization and application.
Preferably, the spliced high-purity aluminum tube target is scraped from the surface of the indium solder and fixed on a lathe before the first sand paper treatment.
According to the invention, the splicing type high-purity aluminum tube target is preferably scraped to remove the residual indium solder on the surface before the first sand paper treatment is carried out on the splicing type high-purity aluminum tube target, so that the condition that the tube wall of the aluminum tube target is rough due to excessive indium solder in the polishing process is prevented, and finally, the polished product can not meet the sputtering use requirement.
The method adopts a scraper knife and a white steel knife in sequence to scrape off the residual indium solder on the surface of the spliced high-purity aluminum tube target.
The fixing method comprises the steps that one end of the spliced high-purity aluminum tube target is fastened and clamped by using a three-jaw chuck, and the other end of the spliced high-purity aluminum tube target is propped and fastened by using a conical ejector pin.
Preferably, the first sandpaper treatment is performed using 180# sandpaper.
Preferably, the 180# sandpaper comprises 180# alumina sandpaper.
Preferably, the rotational speed of the lathe during the first sanding process is 400 to 600r/min, such as 400r/min, 450r/min, 480r/min, 500r/min, 550r/min, or 600r/min, but is not limited to the recited values, and other values not recited in this range are equally applicable.
According to the invention, the rotating speed of the lathe in the first sand paper treatment process is preferably 400-600 r/min, the rotating speed is lower than the lower limit of the rotating speed, the polishing roughness can not meet the requirement, and the rotating speed is higher than the upper limit of the rotating speed, so that the tube target is easy to bend.
Preferably, the first sandpaper treatment is repeated 2 to 3 times, and may be 2 or 3 times, for example.
Preferably, the surface roughness Ra of the spliced high-purity aluminum tube target after the first sand paper treatment is 1 to 3 μm, and may be, for example, 1 μm, 1.2 μm, 1.5 μm, 2 μm, 2.5 μm, or 3 μm, but is not limited to the above-mentioned values, and other values not listed in the above-mentioned value range are also applicable.
Preferably, the second sandpaper treatment was performed using 320# sandpaper.
Preferably, the 320# sandpaper comprises 320# alumina sandpaper.
According to the invention, the 180# aluminum oxide abrasive paper is preferably used in the first abrasive treatment, and the 320# aluminum oxide abrasive paper is preferably used in the second abrasive treatment, so that the gradient transition advantage is achieved, and the surface of the pipe body is not easily scratched. If the first sandpaper treatment used 320# alumina sandpaper, the polishing efficiency would be slow and the rough marks would not be easily removed.
Preferably, the rotational speed of the lathe during the second sanding process is 400r/min or less, such as 400r/min, 350r/min, 330r/min, 300r/min, 200r/min, or 100r/min, but not limited to the values listed, and other values not listed within this range are equally applicable.
According to the invention, the rotating speed of the lathe in the second sand paper treatment process is preferably below 400r/min, so that the grains of the polished spliced high-purity aluminum pipe target are consistent, and the sputtering use requirement of the aluminum pipe target is met.
Preferably, the second sanding process is repeated 3 more times, for example, it may be 3, 4, 5 or 6 times.
Preferably, the scouring pad treatment is performed using 180# scouring pad.
Preferably, the rotational speed of the lathe during the scouring pad treatment is 400r/min or less, for example 400r/min, 350r/min, 330r/min, 300r/min, 200r/min or 100r/min, but is not limited to the values listed, and other values not listed in this range are also applicable.
The rotating speed of a lathe in the scouring pad treatment process is preferably below 400r/min, so that the obtained polished spliced high-purity aluminum tube target has consistent lines, and the sputtering use requirement of the aluminum tube target is met.
Preferably, the polished surface roughness Ra of the spliced high-purity aluminum tube target is less than or equal to 0.8 μm, and may be, for example, 0.8 μm, 0.7 μm, 0.6 μm, 0.5 μm, 0.2 μm, or 0.1 μm, but is not limited to the values listed, and other values not listed in the numerical range are also applicable.
As a preferable embodiment of the present invention, the polishing method includes:
scraping residual indium solder on the surface of the spliced high-purity aluminum pipe target, fastening and clamping one end of the spliced high-purity aluminum pipe target by using a three-jaw chuck, and propping and fastening the other end of the spliced high-purity aluminum pipe target by using a conical thimble;
sequentially carrying out first abrasive paper treatment on the surface of the spliced high-purity aluminum pipe target by using 180# aluminum oxide abrasive paper, carrying out second abrasive paper treatment on the surface of the spliced high-purity aluminum pipe target by using 320# aluminum oxide abrasive paper and carrying out scouring pad treatment on the surface of the spliced high-purity aluminum pipe target by using 180# scouring pad to obtain a polished spliced high-purity aluminum pipe target with the surface roughness Ra of less than or equal to 0.8 mu m; the spliced high-purity aluminum tube target sequentially comprises a 304 stainless steel inner tube, an indium solder layer and a high-purity aluminum tube from inside to outside; the purity of the high-purity aluminum tube is more than or equal to 99.9wt%;
the rotating speed of the lathe in the first sand paper processing process is 400-600 r/min; the first sand paper treatment is repeated for 2-3 times; the surface roughness Ra of the spliced high-purity aluminum tube target after the first sand paper treatment is 1-3 mu m; the rotating speed of the lathe in the second sand paper treatment process is below 400r/min; repeating the second sandpaper treatment more than 3 times; the rotating speed of the lathe in the scouring pad treatment process is below 400r/min.
Compared with the prior art, the invention has at least the following beneficial effects:
the polishing method of the spliced high-purity aluminum tube target provided by the invention is simple to operate, the surface roughness Ra of the polished spliced high-purity aluminum tube target is less than or equal to 0.8 mu m, the grains are consistent, the sputtering use requirement of the aluminum tube target is met, and the polishing method has a large-scale industrial popularization and application prospect.
Drawings
FIG. 1 is a schematic structural diagram of a spliced high-purity aluminum tube target according to the present invention.
FIG. 2 is a top view of a spliced high purity aluminum tube target of the present invention.
In the figure: 1-a high purity aluminum tube; 2-304 stainless steel inner tube; a 3-indium solder layer.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
The structural schematic diagram of the spliced high-purity aluminum tube target is shown in figure 1, and the top view is shown in figure 2.
The spliced high-purity aluminum tube target sequentially comprises a 304 stainless steel inner tube 2, an indium solder layer 3 and a high-purity aluminum tube 1 from inside to outside.
The present invention is described in further detail below. The following examples are merely illustrative of the present invention and do not represent or limit the scope of the claims, which are defined by the claims.
Example 1
The embodiment provides a polishing method of a spliced high-purity aluminum tube target, which comprises the following steps:
scraping residual indium solder on the surface of the spliced high-purity aluminum pipe target, fastening and clamping one end of the spliced high-purity aluminum pipe target by using a three-jaw chuck, and propping and fastening the other end of the spliced high-purity aluminum pipe target by using a conical thimble;
sequentially carrying out first abrasive paper treatment on the surface of the spliced high-purity aluminum pipe target by using 180# aluminum oxide abrasive paper, carrying out second abrasive paper treatment by using 320# aluminum oxide abrasive paper and carrying out scouring pad treatment by using 180# scouring pad to obtain a polished spliced high-purity aluminum pipe target; the spliced high-purity aluminum tube target sequentially comprises a 304 stainless steel inner tube, an indium solder layer and a high-purity aluminum tube from inside to outside; the purity of the high-purity aluminum pipe is 99.9wt%;
the rotating speed of a lathe in the first sand paper processing process is 500r/min; the first sandpaper treatment was repeated 2 times; the surface roughness Ra of the spliced high-purity aluminum tube target treated by the first abrasive paper is 1.6 mu m; the rotating speed of the lathe in the second sand paper treatment process is 400r/min; the second sandpaper treatment was repeated 5 times; the rotating speed of the lathe in the scouring pad treatment process is 300r/min.
Example 2
The embodiment provides a polishing method of a spliced high-purity aluminum tube target, which comprises the following steps:
scraping residual indium solder on the surface of the spliced high-purity aluminum pipe target, fastening and clamping one end of the spliced high-purity aluminum pipe target by using a three-jaw chuck, and propping and fastening the other end of the spliced high-purity aluminum pipe target by using a conical thimble;
sequentially carrying out first abrasive paper treatment on the surface of the spliced high-purity aluminum pipe target by using 180# aluminum oxide abrasive paper, carrying out second abrasive paper treatment by using 320# aluminum oxide abrasive paper and carrying out scouring pad treatment by using 180# scouring pad to obtain the polished spliced high-purity aluminum pipe target; the spliced high-purity aluminum tube target sequentially comprises a 304 stainless steel inner tube, an indium solder layer and a high-purity aluminum tube from inside to outside; the purity of the high-purity aluminum pipe is 99.92wt%;
the rotating speed of a lathe in the first sand paper treatment process is 400r/min; the first sandpaper treatment was repeated 3 times; the surface roughness Ra of the spliced high-purity aluminum tube target after the first sand paper treatment is 3 mu m; the rotating speed of the lathe in the second sand paper treatment process is 400r/min; the second sandpaper treatment was repeated 4 times; the rotating speed of the lathe in the scouring pad treatment process is 400r/min.
Example 3
The embodiment provides a polishing method of a spliced high-purity aluminum pipe target, which comprises the following steps:
scraping residual indium solder on the surface of the spliced high-purity aluminum pipe target, fastening and clamping one end of the spliced high-purity aluminum pipe target by using a three-jaw chuck, and propping and fastening the other end of the spliced high-purity aluminum pipe target by using a conical thimble;
sequentially carrying out first abrasive paper treatment on the surface of the spliced high-purity aluminum pipe target by using 180# aluminum oxide abrasive paper, carrying out second abrasive paper treatment by using 320# aluminum oxide abrasive paper and carrying out scouring pad treatment by using 180# scouring pad to obtain a polished spliced high-purity aluminum pipe target; the spliced high-purity aluminum tube target sequentially comprises a 304 stainless steel inner tube, an indium solder layer and a high-purity aluminum tube from inside to outside; the purity of the high-purity aluminum pipe is 99.95wt%;
the rotating speed of a lathe in the first sand paper processing process is 470r/min; the first sandpaper treatment was repeated 3 times; the surface roughness Ra of the spliced high-purity aluminum tube target after the first sand paper treatment is 1 mu m; the rotating speed of the lathe in the second sand paper treatment process is 200r/min; the second sandpaper treatment was repeated 6 times; the rotating speed of the lathe in the scouring pad treatment process is 300r/min.
Example 4
The embodiment provides a polishing method of a spliced high-purity aluminum pipe target, which comprises the following steps:
scraping residual indium solder on the surface of the spliced high-purity aluminum pipe target, fastening and clamping one end of the spliced high-purity aluminum pipe target by using a three-jaw chuck, and propping and fastening the other end of the spliced high-purity aluminum pipe target by using a conical thimble;
sequentially carrying out first abrasive paper treatment on the surface of the spliced high-purity aluminum pipe target by using 180# aluminum oxide abrasive paper, carrying out second abrasive paper treatment by using 320# aluminum oxide abrasive paper and carrying out scouring pad treatment by using 180# scouring pad to obtain a polished spliced high-purity aluminum pipe target; the spliced high-purity aluminum tube target sequentially comprises a 304 stainless steel inner tube, an indium solder layer and a high-purity aluminum tube from inside to outside; the purity of the high-purity aluminum pipe is 99.97wt%;
the rotating speed of a lathe in the first sand paper processing process is 600r/min; the first sandpaper treatment was repeated 2 times; the surface roughness Ra of the spliced high-purity aluminum tube target after the first sand paper treatment is 2.2 mu m; the rotating speed of the lathe in the second sand paper treatment process is 310r/min; the second sandpaper treatment was repeated 3 times; the rotating speed of a lathe in the scouring pad treatment process is 260r/min.
Example 5
The embodiment provides a polishing method of a spliced high-purity aluminum tube target, which comprises the following steps:
scraping residual indium solder on the surface of the spliced high-purity aluminum pipe target, fastening and clamping one end of the spliced high-purity aluminum pipe target by using a three-jaw chuck, and propping and fastening the other end of the spliced high-purity aluminum pipe target by using a conical thimble;
sequentially carrying out first abrasive paper treatment on the surface of the spliced high-purity aluminum pipe target by using 180# aluminum oxide abrasive paper, carrying out second abrasive paper treatment by using 320# aluminum oxide abrasive paper and carrying out scouring pad treatment by using 180# scouring pad to obtain a polished spliced high-purity aluminum pipe target; the spliced high-purity aluminum tube target sequentially comprises a 304 stainless steel inner tube, an indium solder layer and a high-purity aluminum tube from inside to outside; the purity of the high-purity aluminum pipe is 99.94wt%;
the rotating speed of a lathe in the first sand paper processing process is 520r/min; the first sandpaper treatment was repeated 2 times; the surface roughness Ra of the spliced high-purity aluminum tube target after the first sand paper treatment is 2.6 mu m; the rotating speed of the lathe in the second sand paper treatment process is 100r/min; the second sandpaper treatment was repeated 5 times; the rotating speed of the lathe in the scouring pad treatment process is 100r/min.
Example 6
This example provides a polishing method of a spliced high-purity aluminum tube target, which is the same as that of example 1 except that 180# alumina sandpaper treated with first sandpaper is replaced with 320# alumina sandpaper.
Example 7
This example provides a polishing method of a spliced high-purity aluminum tube target, which is the same as that of example 1 except that the rotating speed of the lathe during the first sand paper treatment is replaced by 700r/min, namely 500 r/min.
Example 8
This example provides a polishing method of a spliced high-purity aluminum tube target, which is the same as that of example 1 except that the rotating speed of the lathe during the first sand paper treatment is changed from 500r/min to 300r/min.
Example 9
This example provides a polishing method of a spliced high-purity aluminum tube target, which is the same as that of example 1 except that the rotation speed of the lathe during the second sand paper treatment is changed from 400r/min to 500 r/min.
Example 10
This example provides a polishing method of a spliced high-purity aluminum tube target, which is the same as that of example 1 except that the rotating speed of a lathe during the scouring pad treatment is changed from 300r/min to 500 r/min.
Comparative example 1
This comparative example provides a polishing method of a spliced high-purity aluminum tube target, which is the same as that of example 1 except that the second sandpaper treatment is omitted.
Comparative example 2
This comparative example provides a polishing method of a spliced high-purity aluminum tube target, which is the same as that of example 1 except that the scouring pad treatment is omitted.
The surface roughness results and the texture of the polished spliced high-purity aluminum tube targets obtained in the above examples and comparative examples are shown in table 1.
TABLE 1
| Surface roughness Ra (mum) | Pattern condition | |
| Example 1 | 0.2 | Has consistent lines |
| Example 2 | 0.4 | Has consistent grains |
| Example 3 | 0.5 | Has consistent lines |
| Example 4 | 0.7 | Has consistent lines |
| Example 5 | 0.8 | Has consistent lines |
| Example 6 | 1.4 | Non-uniform texture |
| Example 7 | 1.3 | Lines are not uniform |
| Example 8 | 1.7 | Lines are not uniform |
| Example 9 | 1.9 | Lines are not uniform |
| Example 10 | 2.1 | Lines are not uniform |
| Comparative example 1 | 1.8 | Lines are not uniform |
| Comparative example 2 | 1.8 | Lines are not uniform |
As can be seen from table 1:
(1) It can be seen from the comprehensive examples 1-5 that the polishing method of the spliced high-purity aluminum tube target provided by the invention is simple to operate, the surface roughness Ra of the polished spliced high-purity aluminum tube target is less than or equal to 0.8 μm, and the grains are consistent, so that the sputtering use requirement of the aluminum tube target is met;
(2) It can be seen from the combination of examples 1 and 6 that when the 180# alumina abrasive paper treated by the first abrasive paper is replaced by 320# alumina abrasive paper, the surface roughness Ra of the spliced high-purity aluminum tube target is greatly increased to 1.4 μm, and the grains are not consistent;
(3) It can be seen from the combination of the embodiment 1 and the embodiments 7 to 10 that when the rotation speed of the lathe in the first sandpaper processing process is not within the range defined by the present invention, the rotation speed of the lathe in the second sandpaper processing process is too high, and the rotation speed of the lathe in the scouring pad processing process is too high, the surface roughness Ra of the spliced high-purity aluminum tube target is greatly increased, and the grains are inconsistent;
(4) It can be seen from the combination of example 1 and comparative examples 1-2 that the omission of the second sandpaper treatment or the omission of the scouring pad treatment results in a spliced high-purity aluminum tube target with a large surface roughness and inconsistent texture.
In conclusion, the polishing method of the spliced high-purity aluminum tube target sequentially adopts specific sand paper and scouring pad to polish the spliced high-purity aluminum tube target, and the rotating speed of a specific lathe is adopted in the processing process, so that the surface roughness of the polished target material meets the requirement, and the grains are consistent, thereby achieving the purposes of ensuring the surface quality of the product and improving the qualified rate of the product.
The applicant declares that the above description is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be understood by those skilled in the art that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention disclosed herein fall within the scope and disclosure of the present invention.
Claims (10)
1. The polishing method is characterized by comprising the steps of sequentially carrying out first abrasive paper treatment, second abrasive paper treatment and scouring pad treatment on the surface of the spliced high-purity aluminum pipe target to obtain the polished spliced high-purity aluminum pipe target;
the spliced high-purity aluminum tube target sequentially comprises a 304 stainless steel inner tube, an indium solder layer and a high-purity aluminum tube from inside to outside; the purity of the high-purity aluminum pipe is more than or equal to 99.9wt%.
2. The polishing method according to claim 1, wherein the spliced high-purity aluminum tube target is subjected to first sand paper treatment to scrape off residual indium solder on the surface and fix the indium solder on a lathe.
3. The polishing method of claim 2, wherein the fixing method comprises tightly clamping one end of the spliced high-purity aluminum pipe target by using a three-jaw chuck, and tightly pressing the other end of the spliced high-purity aluminum pipe target against a conical ejector pin.
4. The polishing method according to any one of claims 1 to 3, wherein the first sandpaper treatment is performed using 180# sandpaper;
preferably, the 180# sandpaper comprises 180# alumina sandpaper.
5. The polishing method according to any one of claims 1 to 4, wherein the rotation speed of the lathe during the first sand paper treatment is 400 to 600r/min;
preferably, the first sandpaper treatment is repeated 2 to 3 times;
preferably, the surface roughness Ra of the spliced high-purity aluminum tube target after the first sand paper treatment is 1-3 μm.
6. The polishing method according to any one of claims 1 to 5, wherein the second sandpaper treatment is performed using 320# sandpaper;
preferably, the 320# sandpaper comprises 320# alumina sandpaper.
7. The polishing method according to any one of claims 1 to 6, wherein the rotation speed of the lathe during the second sand paper treatment is 400r/min or less;
preferably, the second sandpaper treatment is repeated 3 or more times.
8. The polishing method according to any one of claims 1 to 7, wherein the scouring pad treatment is performed using 180# scouring pad.
9. The polishing method according to any one of claims 1 to 8, wherein the rotation speed of a lathe during the scouring pad treatment is 400r/min or less;
preferably, the surface roughness Ra of the polished splicing type high-purity aluminum tube target is less than or equal to 0.8 mu m.
10. The polishing method according to any one of claims 1 to 9, characterized in that the polishing method comprises:
scraping residual indium solder on the surface of the spliced high-purity aluminum pipe target, fastening and clamping one end of the spliced high-purity aluminum pipe target by using a three-jaw chuck, and propping and fastening the other end of the spliced high-purity aluminum pipe target by using a conical thimble;
sequentially carrying out first abrasive paper treatment on the surface of the spliced high-purity aluminum pipe target by using 180# aluminum oxide abrasive paper, carrying out second abrasive paper treatment by using 320# aluminum oxide abrasive paper and carrying out scouring pad treatment by using 180# scouring pad to obtain a polished spliced high-purity aluminum pipe target with the surface roughness Ra of less than or equal to 0.8 mu m; the spliced high-purity aluminum tube target sequentially comprises a 304 stainless steel inner tube, an indium solder layer and a high-purity aluminum tube from inside to outside; the purity of the high-purity aluminum pipe is more than or equal to 99.9wt%;
the rotating speed of the lathe in the first sand paper processing process is 400-600 r/min; the first sand paper treatment is repeated for 2-3 times; the surface roughness Ra of the spliced high-purity aluminum tube target after the first sand paper treatment is 1-3 mu m; the rotating speed of the lathe in the second sand paper processing process is below 400r/min; repeating the second sandpaper treatment more than 3 times; the rotating speed of the lathe in the scouring pad treatment process is below 400r/min.
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