CN115461187A - 激光加工装置 - Google Patents

激光加工装置 Download PDF

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Publication number
CN115461187A
CN115461187A CN202180031389.4A CN202180031389A CN115461187A CN 115461187 A CN115461187 A CN 115461187A CN 202180031389 A CN202180031389 A CN 202180031389A CN 115461187 A CN115461187 A CN 115461187A
Authority
CN
China
Prior art keywords
laser processing
processing head
laser
moving
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180031389.4A
Other languages
English (en)
Chinese (zh)
Inventor
坂本刚志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Publication of CN115461187A publication Critical patent/CN115461187A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
CN202180031389.4A 2020-04-28 2021-03-31 激光加工装置 Pending CN115461187A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020079498A JP7430570B2 (ja) 2020-04-28 2020-04-28 レーザ加工装置
JP2020-079498 2020-04-28
PCT/JP2021/013839 WO2021220706A1 (ja) 2020-04-28 2021-03-31 レーザ加工装置

Publications (1)

Publication Number Publication Date
CN115461187A true CN115461187A (zh) 2022-12-09

Family

ID=78281182

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180031389.4A Pending CN115461187A (zh) 2020-04-28 2021-03-31 激光加工装置

Country Status (5)

Country Link
JP (1) JP7430570B2 (ko)
KR (1) KR20230002713A (ko)
CN (1) CN115461187A (ko)
TW (1) TW202205404A (ko)
WO (1) WO2021220706A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102660028B1 (ko) * 2022-12-22 2024-04-23 (주)엘투케이플러스 다중 스케일 레이저 가공 시스템 및 이에 구비되는 레이저 가공 제어 장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0760469A (ja) * 1993-08-31 1995-03-07 Toshiba Corp レーザ加工装置
JP3450081B2 (ja) * 1995-02-28 2003-09-22 東海工業ミシン株式会社 レーザー加工機
JP4110219B2 (ja) 2002-08-30 2008-07-02 株式会社東京精密 レーザーダイシング装置
JP5456510B2 (ja) 2010-02-23 2014-04-02 株式会社ディスコ レーザ加工装置
CN106862777A (zh) 2017-03-24 2017-06-20 河南工业大学 一种激光切割机和自动化切割装置

Also Published As

Publication number Publication date
TW202205404A (zh) 2022-02-01
KR20230002713A (ko) 2023-01-05
JP7430570B2 (ja) 2024-02-13
WO2021220706A1 (ja) 2021-11-04
JP2021171804A (ja) 2021-11-01

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