CN115443545A - 一种单光子雪崩二极管及其制造方法、光检测器件及系统 - Google Patents

一种单光子雪崩二极管及其制造方法、光检测器件及系统 Download PDF

Info

Publication number
CN115443545A
CN115443545A CN202080099980.9A CN202080099980A CN115443545A CN 115443545 A CN115443545 A CN 115443545A CN 202080099980 A CN202080099980 A CN 202080099980A CN 115443545 A CN115443545 A CN 115443545A
Authority
CN
China
Prior art keywords
doping
material layer
doped
layer
single photon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080099980.9A
Other languages
English (en)
Inventor
何志宏
高桥秀和
杨玉怀
谢承志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN115443545A publication Critical patent/CN115443545A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
    • H01L31/101Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/102Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
    • H01L31/107Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier working in avalanche mode, e.g. avalanche photodiodes

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)

Abstract

一种单光子雪崩二极管,包括第一掺杂结构(111)、第二掺杂结构(130)、第一掺杂材料层(110)、第二掺杂材料层(120)和覆盖材料(141)。第一掺杂结构(111)和第一掺杂材料层(110)的掺杂类型相反,第一掺杂结构(111)的存在会改变第一掺杂材料层(110)内部的电场,尤其是改变了第一掺杂材料层(110)中的横向电场,使第一掺杂材料层(110)中的横向电势梯度增大,同时覆盖材料促进光生载流子从边缘向中心移动,促进光生载流子向第二掺杂结构(130)的聚集,从而容易经过雪崩区被第二掺杂结构(130)所接收,降低了有效吸收区与高电场区域的大小的关联度。从而可以减少载流子移动时间,降低移动载流子移动过程中的损耗,提高电荷收集效率,提高光探测效率,减少时间抖动,提高测距精度。

Description

PCT国内申请,说明书已公开。

Claims (26)

  1. PCT国内申请,权利要求书已公开。
CN202080099980.9A 2020-07-17 2020-07-17 一种单光子雪崩二极管及其制造方法、光检测器件及系统 Pending CN115443545A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/102748 WO2022011694A1 (zh) 2020-07-17 2020-07-17 一种单光子雪崩二极管及其制造方法、光检测器件及系统

Publications (1)

Publication Number Publication Date
CN115443545A true CN115443545A (zh) 2022-12-06

Family

ID=79554458

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080099980.9A Pending CN115443545A (zh) 2020-07-17 2020-07-17 一种单光子雪崩二极管及其制造方法、光检测器件及系统

Country Status (2)

Country Link
CN (1) CN115443545A (zh)
WO (1) WO2022011694A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114497265B (zh) * 2022-02-11 2023-03-28 中国科学院半导体研究所 一种雪崩光电探测器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150028443A1 (en) * 2013-07-23 2015-01-29 Sifotonics Technologies Co., Ltd. A Ge-Si Avalanche Photodiode With Silicon Buffer Layer And Edge Electric Field Buffer Region
CN105810775A (zh) * 2014-12-31 2016-07-27 湘潭大学 一种基于cmos图像传感器工艺的np型单光子雪崩二极管
CN106449770A (zh) * 2016-12-07 2017-02-22 天津大学 防止边缘击穿的环形栅单光子雪崩二极管及其制备方法
CN109411550A (zh) * 2018-10-11 2019-03-01 重庆亚川电器有限公司 一种p阱/逆掺杂深n阱的cmos spad光电器件
US10424568B1 (en) * 2018-06-19 2019-09-24 Globalfoundries Singapore Pte. Ltd. Image sensor with stacked SPAD and method for producing the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103094398B (zh) * 2013-02-05 2015-05-20 武汉电信器件有限公司 一种免扩散的雪崩光电二极管及其制备方法
CN104810377B (zh) * 2015-03-04 2018-03-06 南京邮电大学 一种高集成度的单光子雪崩二极管探测器阵列单元
CN106298816A (zh) * 2016-10-11 2017-01-04 天津大学 集成淬灭电阻的单光子雪崩二极管及其制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150028443A1 (en) * 2013-07-23 2015-01-29 Sifotonics Technologies Co., Ltd. A Ge-Si Avalanche Photodiode With Silicon Buffer Layer And Edge Electric Field Buffer Region
CN105810775A (zh) * 2014-12-31 2016-07-27 湘潭大学 一种基于cmos图像传感器工艺的np型单光子雪崩二极管
CN106449770A (zh) * 2016-12-07 2017-02-22 天津大学 防止边缘击穿的环形栅单光子雪崩二极管及其制备方法
US10424568B1 (en) * 2018-06-19 2019-09-24 Globalfoundries Singapore Pte. Ltd. Image sensor with stacked SPAD and method for producing the same
CN109411550A (zh) * 2018-10-11 2019-03-01 重庆亚川电器有限公司 一种p阱/逆掺杂深n阱的cmos spad光电器件

Also Published As

Publication number Publication date
WO2022011694A1 (zh) 2022-01-20

Similar Documents

Publication Publication Date Title
US11271031B2 (en) Back-illuminated single-photon avalanche diode
WO2022011701A1 (zh) 一种单光子雪崩二极管及其制造方法、光检测器件及系统
EP3544064B1 (en) Photodetector and light detection and ranging
KR20110136786A (ko) 반도체 광검출 소자
EP3809472A1 (en) A single-photon avalanche diode and a sensor array
US11011656B2 (en) Photodiode device and photodiode detector
CN115443545A (zh) 一种单光子雪崩二极管及其制造方法、光检测器件及系统
CN110888139A (zh) 用于光敏装置的非连续布局
KR101762431B1 (ko) 크로스톡 방지 구조를 가지는 실리콘 광전자 증배센서
KR102653478B1 (ko) 단일 광자 검출 소자, 전자 장치, 및 라이다 장치
KR102668639B1 (ko) 아발란치 광검출 소자, 전자 장치, 및 라이다 장치
WO2022113515A1 (ja) センサデバイス
US20240069168A1 (en) SINGLE PHOTON DETECTION ELEMENT, ELECTRONIC DEVICE, AND LiDAR DEVICE
US20240105741A1 (en) Single photon avalanche diode, electronic device, and lidar device
KR20230103524A (ko) 단일 광자 검출 픽셀 및 이를 포함하는 단일 광자 검출 픽셀 어레이
KR101762430B1 (ko) 이면 조사형 실리콘 광전자 증배센서 및 그 제조방법
KR20230032808A (ko) 단일 광자 검출 소자, 단일 광자 검출기, 및 단일 광자 검출기 어레이
KR20240044332A (ko) 단광자 아발란치 다이오드, 전자 장치, 및 라이다 장치
CN117936621A (zh) 光电转换器件及其制备方法、光电检测装置、电子设备
KR20220072257A (ko) 이미지 센싱 장치
CN116960211A (zh) 光电转换器件、感测装置及其制造方法
JP2021513747A (ja) 可視撮像アレイにおけるクロストーク緩和のためのセグメント化チャネルストップグリッド

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination