CN115426828A

CN115426828A - Passive heat dissipation type AC power supply for mining machine

Info

Publication number: CN115426828A
Application number: CN202110606666.1A
Authority: CN
Inventors: 鲁群
Original assignee: AA Power Inc
Current assignee: AA Power Inc
Priority date: 2021-05-14
Filing date: 2021-05-27
Publication date: 2022-12-02
Also published as: CN219514449U

Abstract

The invention provides a passive heat dissipation type AC power supply for an ore machine, which comprises: a power supply housing, at least one power cell and at least one internal thermally conductive member disposed within the power supply housing; wherein the power supply housing is fixedly mounted to the mine casing, the internal heat-conducting members are directly and/or indirectly connected to internal side walls of the power supply housing, and each of the power units is in thermal communication with one or more of the internal heat-conducting members to direct generated heat into the power supply housing through the internal heat-conducting members. By using the method, the power supply can dissipate heat without any active heat dissipation mode, so that the power consumption and the cost of the power supply are obviously reduced, the working noise is reduced, the service life of the power supply is prolonged, and the reliability of the power supply is improved.

Description

Passive heat dissipation type AC power supply for mining machine

Technical Field

The invention belongs to the field of power supplies, and particularly relates to a passive heat dissipation type AC power supply for an ore machine.

Background

This section is intended to provide a background or context to the embodiments of the invention that are recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.

With the increasing popularity of virtual currency, the power consumption requirement of an ore machine for generating virtual currency is increased, and in such a high-power-consumption ore machine, a power supply with active heat dissipation is generally required, for example, a fan is installed inside the power supply for heat dissipation, however, such active heat dissipation easily causes large system power consumption and reliability reduction. Taking the fan heat dissipation method as an example, it has a series of disadvantages: (1) The power supply fan causes an increase in cost and an increase in power consumption. (2) Power supply fans as wearing parts are prone to field failures. (3) In mines and IDC data rooms, environmental factors such as moisture and dust are one of the important causes of power failure, and power supply fans can bring dust and moist air into the power supply and deposit inside the power supply, easily causing damage to the power supply. In addition, it is understood that other active heat dissipation power supplies, such as power supplies using water cooling, also have the above-mentioned problems of high power consumption and reduced reliability of the system.

Therefore, how to provide an AC power source for an ore machine without using an active heat dissipation device is a problem to be solved.

Disclosure of Invention

In view of the problems in the prior art, a passive heat dissipation type AC power supply for an ore machine is provided, by which the problems can be solved.

The present invention provides the following.

A passive heat dissipating AC power source for a mining machine, the AC power source comprising: a power supply housing, at least one power cell and at least one internal thermally conductive member disposed within the power supply housing; wherein the power supply housing is fixedly mounted to the mine casing, the internal heat-conducting members are directly and/or indirectly connected to internal side walls of the power supply housing, and each of the power units is in thermal communication with one or more of the internal heat-conducting members to direct generated heat into the power supply housing through the internal heat-conducting members.

Preferably, the one or more internal heat conducting components comprise: the PCB board is close to the first inside wall setting of power casing, and directly and/or indirectly be connected to the inside wall of power casing, one or more the power unit sets up the PCB board is kept away from the first side of first inside wall.

Preferably, a first heat conducting medium is filled between the PCB board and the first inner side wall.

Preferably, the inner heat-conducting member includes: one or more thermally conductive structures having at least one side end portion connected to an inner side wall of the power supply housing in a heat transfer manner, and a main portion extending toward an inside of the power supply housing; wherein one or more of the power cells are coupled in heat transfer relation with the body portion of the thermally conductive structure to conduct heat generated by the power cells into the power supply housing.

Preferably, a PCB board disposed adjacent to a first inner sidewall of the power supply housing has an opening therein, one side end portion of one or more of the heat conductive structures is connected to the first inner sidewall in a heat transfer manner, and a main body portion of the heat conductive structure passes through the opening of the PCB board to extend to be connected to the power unit in a heat transfer manner.

Preferably, a concave receiving portion is formed on the main body portion of one or more of the heat conducting structures, and one or more of the power cells are at least partially embedded in the concave receiving portion, wherein the concave shape of the concave receiving seat is configured to be engaged with at least a portion of the surface of the power cell embedded therein.

Preferably, the inner heat-conducting member further comprises: a second heat-conducting medium by which one or more of the power cells are thermally coupled to an interior sidewall of the power supply housing and/or a body portion of the heat-conducting structure.

Preferably, the PCB board disposed near the first inner side wall of the power supply housing has an opening thereon, the first end of one or more of the power units is indirectly connected to the first inner side wall through the second heat-conducting medium, and the second end extends toward the inside of the power supply housing through the opening of the PCB board.

Preferably, the one or more power cells comprise: and a first power unit belonging to a patch type power semiconductor element, the first power unit being disposed on the first side of the PCB board.

Preferably, the power unit includes: a second power unit belonging to a through-hole type power semiconductor element, the second power unit being connected to the main body portion of the heat conductive structure and/or the inner sidewall of the power supply case in a heat transfer manner through the second heat conductive medium, and pins of the second power unit being inserted into pin through-holes of a PCB board.

Preferably, the power unit includes: a third power cell including a magnetic core and a winding; wherein the magnetic core is thermally connected to the PCB board and/or to the first region of the body portion of the thermally conductive structure and/or to an inner side wall of the power supply housing by the second thermally conductive medium; and the winding is connected in a heat transfer manner to the PCB board and/or to the second area of the main body part of the heat conducting structure.

Preferably, the power unit includes: the windings are connected to the PCB board in a heat transfer manner by soldering the windings to the PCB board.

Preferably, the power unit includes: a fourth power cell belonging to an electrolytic capacitor, the fourth power cell being disposed on the first side of the PCB board and/or being disposed in heat transfer connection with a body portion of the heat conducting structure and/or being disposed in heat transfer connection with an inner side wall of the power supply housing through the second heat conducting medium.

Preferably, a thermal conductive adhesive is filled between at least a portion of an outer sidewall of the fourth power unit and the first side of the PCB, such that the fourth power unit is thermally connected to the first side by the thermal conductive adhesive.

Preferably, a plurality of heat fins are provided on at least one outer side wall of the power supply housing.

The embodiment of the application adopts at least one technical scheme which can achieve the following beneficial effects: the power supply has the advantages that any active heat dissipation mode is not needed, heat generated by the power unit of the power supply is led out to the power supply shell completely by the aid of the internal heat conducting parts arranged inside the power supply shell, heat is dissipated through external natural air circulation, and power consumption and cost of the power supply are reduced remarkably.

It should be understood that the above description is only an overview of the technical solutions of the present invention, so as to clearly understand the technical means of the present invention, and thus can be implemented according to the content of the description. In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

The advantages and benefits described herein, as well as other advantages and benefits, will be apparent to those of ordinary skill in the art upon reading the following detailed description of the exemplary embodiments. The drawings are only for purposes of illustrating exemplary embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:

FIG. 1 is an external schematic view of a mining machine with a passive heat dissipating AC power source according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of an internal configuration of a passive heat dissipating AC power source for a mining machine in accordance with an embodiment of the present invention;

FIG. 3 is another schematic illustration of an internal configuration of a passive heat dissipating AC power source for a mining machine in accordance with an embodiment of the present invention;

FIG. 4 is a side view of an internal schematic view of the passive heat dissipating AC power source for the mining machine of FIG. 2;

FIG. 5 is a top view of the schematic internal configuration of the passive heat dissipating AC power source for a mining machine of FIG. 2.

In the drawings, like or corresponding reference characters designate like or corresponding parts.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

In the description of the embodiments of the present application, it is to be understood that terms such as "including" or "having" are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof disclosed in the specification, and are not intended to preclude the presence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

Unless otherwise stated, "/" indicates an OR meaning, e.g., A/B may indicate A or B; "and/or" herein is merely an association relationship describing an associated object, and means that there may be three relationships, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone.

The terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more unless otherwise specified.

It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.

FIG. 1 illustrates an exemplary external structural schematic of a mining machine with a passive heat dissipating AC power source. FIG. 2 illustrates a schematic diagram of the internal structure of a passive heat dissipating AC power supply for a mining machine, wherein the top wall and two side walls of the power supply housing are hidden for ease of illustration of the power supply internal structure. Fig. 3 is another directional view of the internal structural schematic diagram of the passive heat dissipation AC power source for a mining machine shown in fig. 2, fig. 4 is a side view of the internal structural schematic diagram of the passive heat dissipation AC power source for a mining machine shown in fig. 2, and fig. 5 is a top view of the internal structural schematic diagram of the passive heat dissipation AC power source for a mining machine shown in fig. 2.

Referring to fig. 1 to 5, an embodiment of the present invention provides a passive heat dissipation type AC power supply for an ore mining machine, which specifically includes a power supply housing 1, and a plurality of power units (such as 321,322, 33, 34) and a plurality of internal heat conducting components (such as 41, 42, 431, 432, 441, 442, 443) disposed inside the power supply housing.

The power supply housing 1 is fixedly mounted above the outer shell of the mining machine 2. In other embodiments, the power supply housing 1 may be installed below or on the left and right sides of the outer shell of the mining machine 2, which is not particularly limited in this application. The machine is a virtual currency machine.

The power units are arranged in a cavity inside the power supply housing 1 and are electrically connected with the mining machine 2 for supplying power to the mining machine 2. The internal heat conducting members are also disposed in a cavity inside the power supply housing 1 and may be directly and/or indirectly connected to the inner side walls (e.g., 11, 12, 13) of the power supply housing 1. By indirect connection is meant that one internal heat conducting member may also be connected to the inner side wall of the power supply housing via another internal heat conducting member. Each power cell is coupled in heat transfer relation to one or more internal heat conducting members to conduct generated heat to the power supply housing through the internal heat conducting members.

In other words, each power cell is connected to the inner side wall of the power supply casing 1 in a heat transfer manner by one or more internal heat conduction members, and each power cell and the power supply casing 1 are electrically isolated from each other. By heat transfer connected is meant that heat can be communicated between several bodies connected in a heat transfer manner. By electrically isolated is meant that no voltage difference is generated between each power cell and the power supply housing 1.

It should be noted that, in fig. 2, a part of the inner side wall of the power supply housing 1 is hidden, however, the internal heat conducting member may also be directly and/or indirectly connected to the hidden inner side wall, and the embodiment does not give a corresponding example for convenience of illustration, however, for a person skilled in the art, a possible connection relationship between the internal heat conducting member and the hidden inner side wall may be directly inferred.

In the above embodiment, no active heat dissipation manner is required, and the heat generated by the power unit of the power supply is conducted to the power supply housing by the internal heat conduction component arranged inside the power supply housing, and is dissipated by external natural air circulation. Because active heat dissipation equipment such as a fan and the like is avoided, the power consumption and the cost of the power supply are obviously reduced, the working noise is reduced, the service life of the power supply is prolonged, and the reliability is improved. It is understood that the active heat dissipation means includes, but is not limited to, active heat dissipation devices having a heat dissipation fan, a liquid cooling device, etc. disposed inside or outside the power source. In addition, the active heat dissipation method may also include heat dissipation of the power source using active heat dissipation components of other machines (such as mining machines), which also causes power loss, but is added to other machines.

The internal heat-conducting member and the heat-conducting path formed by the same of the present application will be described in detail with reference to fig. 2 to 5.

In some embodiments, referring to fig. 2, the internal heat conducting component may comprise a PCB board 41. The PCB board 41 may be any one of known PCB boards such as FR-4, a metal substrate, and the like. The PCB board 41 is disposed adjacent to the first inner side wall 11 of the power supply housing 1, and is directly and/or indirectly connected to the inner side wall of the power supply housing 1. Preferably, the first heat transfer medium 42 may be filled between the PCB 41 and the first inner sidewall 11. The first heat-conducting medium may be an insulating heat-conducting medium such as a heat-conducting glue, a heat-conducting sponge, or the like. Referring to fig. 2, both side edges of the PCB 41 may be directly connected with the inner sidewall 12 and the inner sidewall 13, respectively, a second side surface of the PCB 41 is disposed facing the first inner sidewall 11, and the second side surface of the PCB 41 may be indirectly connected with the first inner sidewall 11 through the first conductive medium 42. Several power cells, such as a first power cell (not shown), a second power cell (321, 322) and so on, may be arranged at a first side 411 of the PCB 41, which first side 411 is a side surface of the PCB 41 remote from the first inner side wall 11. Therefore, heat generated by the power unit disposed on the PCB 41 can be transferred from the PCB 41 to the power supply case 1, thereby achieving heat dissipation.

In other embodiments, the power units disposed on the first side 411 are not limited to the first power unit (not shown), the second power unit (321, 322), and other power units including power semiconductor elements, power magnetic elements and electrolytic capacitors may be disposed on the first side 411 of the PCB 41, and fig. 2 to 5 are only exemplary embodiments of the present application, and the present application is not particularly limited to the type and number of one or more power units disposed on the PCB.

In other embodiments, the PCB board 41 may also be located further away from the mining machine 2 to avoid heat dissipated by the mining machine 2 itself from adversely affecting the power supply heat dissipation. For example, the first inner side wall 11 may be located at the bottom of the power supply housing 1, and the PCB board 41 may be spaced apart from the power supply 2 to some extent when the passive heat dissipating AC power supply is installed on the left and right sides or below the outer shell of the power supply 2. For another example, the first inner side wall 11 may not be located at the bottom of the power supply housing 1, but at the top or peripheral side of the power supply housing, and the PCB board 41 may also be located away from the mining machine 2. Fig. 2 to 5 are merely illustrative examples of the present application, and the present application does not specifically limit the position of the first inner side wall 11 and the power supply installation position.

In some embodiments, referring to fig. 2-5, the internal heat conducting member may further include a heat conducting structure, such as a heat conducting structure 431 and a heat conducting structure 432, and it can be seen that at least one side end portion of the heat conducting structure is fixedly connected to the inner side wall of the power supply housing, and the main body portion extends towards the inside of the power supply housing 1. For example, the heat conducting structure 431 is taken as an example to be described, the heat conducting structure 431 is a wall-shaped structure with a certain thickness, the lower end part of the wall-shaped structure is connected to the inner side wall 11, the side end part of the wall-shaped structure is connected to the inner side wall 13, and the one or more second power units 322 are connected with the main body part of the heat conducting structure 431 in a heat transfer manner to realize heat conduction. The shape and position of the heat conducting structure are not limited, and in short, the heat generated by one or more power units can be respectively conducted into the power supply shell 1 by using the heat conducting structure, so that high-efficiency heat dissipation is realized.

Preferably, in order to achieve a more compact layout in the power supply housing, the PCB 41 may further have an opening therein, one side end of the one or more heat conducting structures is fixedly connected to the first inner side wall 11 of the power supply housing 1, and a main portion thereof passes through the opening of the PCB 41 to extend to be connected with the one or more power units in a heat transfer manner. For example, referring to fig. 5, the lower end of the heat conducting structure 432 is connected to the first inner side wall 11, and the main body portion thereof extends upward through the opening of the PCB board 41 to be connected in heat transfer with the fourth power unit 34.

In other embodiments, one or more heat conducting structures (not shown) may be connected to the inner sidewall above the PCB 41 at only one end, and the heat conducting structure need not pass through the opening in the PCB.

Preferably, in order to improve the heat conduction efficiency of the heat conduction structure, a concave receiving portion may be formed at a body portion of the one or more heat conduction structures, so that the one or more power cells may be at least partially inserted into the concave receiving portion and connected to the concave receiving portion, wherein the concave shape of the concave receiving seat is configured to be a shape that is fitted to at least a portion of the surface of the power cell inserted therein. For example, referring to fig. 5, the heat conducting structure 432 has the concave receiving portion at the main body portion, the fourth power unit 34 has a cylindrical shape, and the concave shape of the concave receiving portion may be an arc-shaped concave shape that is matched with at least a part of the surface of the fourth power unit 34, so that the fourth power unit 34 can be partially embedded in the concave receiving portion. This increases the heat-conducting contact area and thus provides the heat-conducting efficiency of the heat-conducting structure.

In some embodiments, the inner heat conducting member may further comprise a second heat conducting medium (441, 442, 443), which may be an insulating heat conducting medium such as a heat conducting glue, a heat conducting sponge, or the like. In particular, one or more power cells may be connected in a heat transfer manner to any one or more interior side walls of the power supply housing 1 via the second heat conducting medium, or may be connected in a heat transfer manner to a body portion of a heat conducting structure via the second heat conducting medium. In particular, it may be adhered to the inner side wall or the heat conducting structure by the second heat conducting medium. For example, the second power unit 321 is adhered to the inner sidewall by a second heat transfer medium 441, and the other second power unit 322 is adhered to the heat transfer structure 431 by another second heat transfer medium 442. It can be appreciated that when the power cells are adhered to the inner side wall, since heat of one or more power cells can be directly conducted into the power supply housing, a heat conduction path is shortened, and heat dissipation efficiency is further improved.

Alternatively, referring to fig. 5, the PCB 41 may have an opening 412 thereon, the first end portion (the bottom end portion in this embodiment) of the third power unit 33 may be indirectly connected to the first inner sidewall 11 through the filled second heat transfer medium 443, and the second end portion (the top end portion in this embodiment) extends toward the inside of the power supply housing 1 through the opening 412 of the PCB 41. Therefore, high-efficiency heat dissipation can be realized, and the internal compactness of the power supply is ensured.

Each of the power cells and the thermal conduction paths thereof according to the embodiments of the present invention will be described in detail with reference to fig. 2 to 5.

In some embodiments, the first power unit (not shown) belongs to a chip type power semiconductor element, such as a resistor, an inductor, a capacitor, a diode, a transistor, etc. which may be a chip type power element, may be disposed on the first side 411 of the PCB board 41, and more specifically, may be Mounted on the first side 411 of the PCB board 41 by using Surface Mount Technology (SMT). The heat generated by the first power unit during operation can be conducted out to the power supply housing 1 through the PCB 41 or through the PCB 41 and the first conductive medium 42, so as to dissipate the heat.

In some embodiments, fig. 2-5 show an exemplary second power unit 321 belonging to a through-hole type power semiconductor element, the second power unit 321 being disposed above the first side 411 of the PCB 41, the second power unit 321 being indirectly connected to the inner sidewall by a second heat conducting medium 441, thereby forming an electrical isolation between the second power unit 321 and the power supply housing 1. In order to more efficiently dissipate heat, the heat dissipation contact area between the second heat transfer medium 441 and the second power unit 321 may be increased, and it is preferable that the entire side surface having the largest area of the second power unit 321 be adhered to the inner sidewall through the second heat transfer medium 441. The pins of the second power unit 321 are inserted into the pin through holes of the PCB board 41 from the first side 411. Based on this, the heat generated by the second power unit 321 can be transferred to the power supply housing 1 through the second heat conducting medium 441, thereby achieving high-efficiency heat dissipation.

In some embodiments, fig. 2-5 show another exemplary second power unit 322 belonging to a Through-Hole type power semiconductor element, the second power unit 322 is disposed above the first side 411 of the PCB board, specifically mounted on the PCB board 41 using Through Hole Technology (Through Hole Technology), and a heat conducting structure 431 may extend from an inner sidewall to the vicinity of the second power unit 322, such that the second power unit 322 is connected with a main portion of the heat conducting structure 431 in a heat transfer manner, for example, may be adhered to the heat conducting structure 431 by a second heat conducting medium 442, thereby forming an electrical isolation. In order to more efficiently dissipate heat, the heat dissipation contact area between the heat conducting structure 431 and the second power unit 322 may be enlarged, and it is preferable that the wall-shaped heat conducting structure 431 of fig. 2 is selected and the side of the second power unit 322 having the largest surface area is integrally attached to the heat conducting structure 431. The pins of the second power unit 322 are inserted into the pin through holes reserved on the PCB 41 from the first side 411, and are soldered to the other side of the PCB 41 after being temporarily fixed, thereby forming reliable solder joints and establishing long-term mechanical and electrical connections. Therefore, the heat generated by the second power unit 322 can be transferred to the power supply housing 1 through the heat conducting structure 431, and high-efficiency heat dissipation is achieved.

In some embodiments, a third power cell is also included, including a magnetic core and a winding; wherein the magnetic core may have various types of thermally conductive paths, including but not limited to: the heat-conducting structure is connected to the PCB board in a heat-transferring manner, connected to the first region of the main body portion of the heat-conducting structure in a heat-transferring manner, and connected to the inner side wall of the power supply housing in a heat-transferring manner through the second heat-conducting medium. The magnetic core can dissipate heat according to a single or combined heat conduction path. The winding may be thermally coupled to the PCB board and may also be thermally coupled to a second region of the body portion of the thermally conductive structure that is not coincident with the first region. The windings can also dissipate heat in a single or combined heat conducting path. .

In some embodiments, an exemplary third power unit 33 is shown in fig. 4, which belongs to a planar power magnetic element, and specifically includes a core 331 and a winding 332, wherein the core 331 may pass through the opening 412 of the PCB 41 and be thermally connected to the first inner side wall 11 through the second conductive medium 443, and the winding 332 may be soldered to the PCB 41, so as to guide heat thereof into the PCB 41. The present embodiment is described by taking the third power unit 33 as an example, but the shape and the installation position thereof are not particularly limited.

In some embodiments, another exemplary third power unit (not shown) may also be included, which may also be a wound-type power magnetic element, which may include a magnetic core (not shown) and a winding (not shown) wound on the magnetic core, wherein the magnetic core and the winding may be respectively connected to the first region and the second region of the same thermally conductive structure (not shown) in a heat transfer manner. Thereby, heat generated by the magnetic core and the winding may be transferred to the power supply case 1 through the heat conductive structure. Thereby achieving high efficiency heat dissipation.

In some embodiments, another exemplary third power unit (not shown) may be included, which may also be a wound-type power magnetic element, such as a magnetic core (not shown) and a winding (not shown) wound on the magnetic core. The core is interconnected to the body portion of some thermally conductive structure (not shown) and the windings are indirectly connected to the first side of the PCB board through a thermally conductive medium (not shown). For example, a bottom end portion of the heat conductive structure (not shown) may be interconnected with the first inner sidewall 11, the body portion may extend upward through the opening of the PCB board 41 and form a concave receiving portion (not shown) at a top end portion thereof, a concave shape of the concave receiving portion may be fitted with a lower shape of the magnetic core such that the magnetic core is embedded therein. Further, in order to improve the heat conduction efficiency, a heat conductive paste (not shown) may be injected between the outer peripheral side of the winding (not shown) exposed to the outside and the first side 411, so that heat generated from the winding is introduced into the PCB board 41 through the heat conductive paste and is introduced into the power supply case 1 through the PCB board 41.

The above embodiments exemplarily list the heat conducting paths of several third power units, but are not limited thereto.

In some embodiments, referring to fig. 2-5, a fourth power cell 34 belonging to an electrolytic capacitor may also be included, which fourth power cell 34 may be disposed on the first side 411 of the PCB board 41 to conduct heat away from the PCB board 41 to the power supply enclosure 1. May also be provided to interconnect with a main portion of the heat conducting structure 432 to conduct heat from the heat conducting structure 432 to the power supply enclosure 1, and may also be indirectly connected to the first inner side wall 11 through a second heat conducting medium (not shown) to conduct heat from the second heat conducting medium (not shown) to the power supply enclosure 1. Further, in order to improve the heat conduction efficiency, a heat conduction glue (not shown) may be injected between at least a portion of an outer side wall of the fourth power unit 34 and the first side 411 of the PCB 41, for example, between an outer peripheral side of the fourth power unit 34 exposed to the outside and the first side 411, so that the heat generated by the fourth power unit 34 may be further introduced into the power supply housing 1 through the PCB with higher heat conduction efficiency.

In some embodiments, referring to fig. 1, the passive heat dissipating AC power supply may further include a plurality of heat dissipating fins 14 disposed on at least one outer sidewall of the power supply housing 1. Specifically, the heat sink fins may be disposed on the outer sidewalls of all non-specific functional areas of the power supply housing, wherein the specific functional areas may include, for example, a socket area, a mounting area, and the like. Whereby the heat dissipation efficiency can be further improved.

While the spirit and principles of the invention have been described with reference to several particular embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, nor is the division of aspects, which is for convenience only as the features in such aspects cannot be combined to advantage. The invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A passive heat dissipating AC power source for a mining machine, the AC power source comprising: a power supply housing, at least one power cell and at least one internal thermally conductive member disposed within the power supply housing;

wherein the power supply housing is fixedly mounted to a mine casing, the internal thermally conductive member is directly and/or indirectly connected to an interior sidewall of the power supply housing, and each of the power units is in thermal communication with one or more of the internal thermally conductive members to direct generated heat into the power supply housing through the internal thermally conductive member.

2. The AC power source of claim 1, wherein said one or more internal thermally conductive components comprise:

the PCB board is close to the first inside wall setting of power casing, and direct and/or indirect connection to the inside wall of power casing, one or more the power unit sets up the PCB board is kept away from the first side of first inside wall.

3. The AC power supply of claim 2, wherein a first heat conducting medium is filled between said PCB board and said first inner side wall.

4. The AC power source of claim 1, wherein said internal heat conducting member comprises:

one or more heat conducting structures, at least one side end part of the heat conducting structure is connected to the inner side wall of the power supply shell in a heat transfer mode, and a main body part of the heat conducting structure extends towards the inside of the power supply shell;

wherein one or more of the power cells are coupled in thermal communication with the body portion of the thermally conductive structure to conduct heat generated by the power cells into the power supply housing.

5. The AC power supply of claim 4,

the PCB board arranged close to the first inner side wall of the power supply shell is provided with an opening, one side end part of one or more heat conduction structures is connected to the first inner side wall in a heat transfer mode, and the main body part of the heat conduction structures penetrates through the opening of the PCB board to extend to be connected with the power unit in a heat transfer mode.

6. The AC power supply of claim 4,

a concave receiving portion is formed on the body portion of one or more of the heat conducting structures, and one or more of the power cells are at least partially embedded in the concave receiving portion, wherein the concave shape of the concave receiving seat is configured to be interfitted with at least part of the surface of the power cell embedded therein.

7. The AC power source of claim 4, wherein said internal heat conducting component further comprises:

a second heat-conducting medium by which one or more of the power cells are thermally coupled to an interior sidewall of the power supply housing and/or a body portion of the heat-conducting structure.

8. The AC power supply of claim 7,

the PCB board arranged close to the first inner side wall of the power supply shell is provided with an opening, the first end parts of one or more power units are indirectly connected to the first inner side wall through the second heat-conducting medium, and the second end parts penetrate through the opening of the PCB board and extend towards the inside of the power supply shell.

9. The AC power supply of claim 2 or 3, wherein the one or more power cells comprise:

and the first power unit belongs to a patch type power semiconductor element, and is arranged on the first side surface of the PCB.

10. The AC power supply of claim 7, wherein the power unit comprises:

a second power unit belonging to a through-hole type power semiconductor element, the second power unit being connected to the main body portion of the heat conductive structure and/or the inner sidewall of the power supply case in a heat transfer manner through the second heat conductive medium, and pins of the second power unit being inserted into pin through-holes of a PCB board.

11. The AC power supply of claim 7, wherein the power unit comprises:

a third power cell comprising a magnetic core and a winding; wherein the content of the first and second substances,

the magnetic core is connected to the PCB board in a heat transfer mode, and/or is connected to the first area of the main body part of the heat conducting structure in a heat transfer mode, and/or is connected to the inner side wall of the power supply shell in a heat transfer mode through the second heat conducting medium; and the number of the first and second groups,

the winding is thermally connected to the PCB board and/or to the second region of the body portion of the thermally conductive structure.

12. The AC power supply of claim 11, wherein the power unit comprises:

the windings are connected to the PCB board in a heat transfer manner by soldering the windings to the PCB board.

13. The AC power supply of claim 7 or 8, wherein the power unit comprises:

a fourth power cell belonging to an electrolytic capacitor, the fourth power cell being disposed on the first side of the PCB board and/or being disposed in heat transfer connection with a body portion of the heat conducting structure and/or being disposed in heat transfer connection with an inner side wall of the power supply housing through the second heat conducting medium.

14. The AC power supply of claim 13,

filling a heat-conducting glue between at least a part of an outer side wall of the fourth power unit and the first side face of the PCB, so that the fourth power unit is connected to the first side face in a heat transfer mode through the heat-conducting glue.

15. The AC power supply of claim 1, further comprising: a plurality of heat fins disposed on at least one exterior sidewall of the power supply housing.