CN216927556U - Passive heat dissipation type AC power supply for IT equipment - Google Patents

Abstract

The present invention provides a passive heat dissipation type AC power supply for IT equipment, comprising: a power supply housing, at least one power cell and at least one internal heat conducting component disposed within the power supply housing; the internal heat conducting members are directly and/or indirectly connected to the interior side walls of the power supply housing, and each power cell is in heat transfer connection with one or more of the internal heat conducting members to conduct generated heat to the power supply housing through the internal heat conducting members. By the method, the power supply shell can guide the received heat into the application environment of the IT equipment, the power supply of the IT equipment can be radiated without any active radiating mode, the power consumption and the cost of the power supply are obviously reduced, the working noise is reduced, and the service life and the reliability of the AC power supply for the IT equipment are prolonged.

Description

Passive heat dissipation type AC power supply for IT equipment

Technical Field

The utility model belongs to the field of power supplies, and particularly relates to a passive heat dissipation type AC power supply for IT equipment.

Background

This section is intended to provide a background or context to the embodiments of the utility model that are recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.

An Internet Data Center (IDC) server generally needs to use a power supply with active heat dissipation in an IT device with high power consumption, for example, a fan is installed inside the power supply to dissipate heat, however, the active heat dissipation easily causes large system power consumption and reliability reduction. Taking the fan heat dissipation method as an example, it has a series of disadvantages: (1) the power supply fan causes an increase in cost and an increase in power consumption. (2) Power supply fans as wearing parts are prone to field failures. (3) In the IDC data room, environmental factors such as moisture and dust are one of the important causes of power failure, and the power supply fan can bring dust and moisture air into the power supply and deposit in the power supply, easily causing damage to the power supply. In addition, it is understood that other active heat dissipation power supplies, such as power supplies using water cooling, also have the above-mentioned problems of high power consumption and reduced reliability of the system.

Therefore, IT is an urgent problem to provide an AC power supply in IT equipment without using an active heat dissipation device.

SUMMERY OF THE UTILITY MODEL

In view of the above problems in the prior art, a passive heat dissipation type AC power supply for IT equipment is proposed, by which the above problems can be solved.

The present invention provides the following.

A passive heat dissipating AC power supply for IT equipment, comprising: a power supply housing, at least one power cell and at least one internal heat conducting component disposed within the power supply housing; wherein the internal heat conducting members are directly and/or indirectly connected to the inner side walls of the power supply housing, and each power cell is in heat transfer connection with one or more of the internal heat conducting members to conduct generated heat to the power supply housing through the internal heat conducting members.

Preferably, the power supply housing is connected in a heat-transferring manner to the housing of the IT equipment and/or to the heat-dissipating component of the IT equipment and/or to the rack of the IT equipment.

Preferably, at least one cavity is formed inside the housing of the IT device, the cavity includes a plurality of cavity walls and a first cavity opening opened to the outside of the housing of the IT device, the AC power source is pluggable installed in the cavity through the first cavity opening, and at least one outer sidewall of the power source housing is connected to the cavity walls in a heat transfer manner.

Preferably, a flexible heat conducting medium is provided between the at least one chamber wall and the at least one outer side wall of the power supply housing.

Preferably, the receptacle further comprises a second receptacle opening that opens into the housing of the IT device, the power housing forming at least two power housing openings to provide fluid communication between the first receptacle opening, the second receptacle opening and the at least two power housing openings.

Preferably, the IT equipment is pluggably mounted in the IT equipment rack, the AC power supply is pluggably mounted in a power supply cabinet of the IT equipment rack, and a flexible heat-conducting medium is provided between at least one inner side wall of the power supply cabinet and at least one outer side wall of the power supply housing.

Preferably, the IT device is a server device or an IDC server device.

Preferably, at least one outer side wall of the power supply shell is provided with a plurality of radiating fins.

Preferably, the PCB board is disposed near the first inner side wall of the power supply housing and is directly and/or indirectly connected to the inner side wall of the power supply housing, and the one or more power units are disposed at a first side of the PCB board far from the first inner side wall.

Preferably, a first heat conducting medium is filled between the PCB board and the first inner side wall.

Preferably, the power supply further comprises one or more heat conducting structures, wherein at least one side end part of each heat conducting structure is connected to the inner side wall of the power supply shell in a heat transfer mode, and a main body part of each heat conducting structure extends towards the inside of the power supply shell; wherein the one or more power cells are in thermal transfer connection with the body portion of the thermally conductive structure to conduct heat generated by the power cells into the power supply housing.

Preferably, the PCB board disposed adjacent to the first inner sidewall of the power supply housing has an opening therein, one side end portion of the one or more heat conductive structures is connected to the first inner sidewall in a heat transfer manner, and a main body portion of the heat conductive structure passes through the opening of the PCB board to extend to be connected to the power unit in a heat transfer manner.

Preferably, a concave receptacle is formed in a body portion of the one or more thermally conductive structures, into which the one or more power cells are at least partially embedded, wherein the concave shape of the concave receptacle is configured to interfit with at least a portion of a surface of the power cell embedded therein.

Preferably, the inner heat-conducting member further comprises: a second heat conducting medium by which the one or more power cells are connected in a heat transfer manner to the inner side walls of the power supply housing and/or the body portion of the heat conducting structure.

Preferably, a protrusion is formed inward from an inner sidewall of the power supply housing, and the one or more power cells are connected to the protrusion on the inner sidewall in a heat transfer manner through the second heat transfer medium.

Preferably, the PCB board disposed adjacent to the first inner side wall of the power supply housing has an opening thereon, the first end of the one or more power units is indirectly connected to the first inner side wall through the second heat-conducting medium, and the second end extends toward the inside of the power supply housing through the opening of the PCB board.

Preferably, the power unit includes: and the first power unit belongs to a patch type power semiconductor element and is arranged on the first side surface of the PCB.

Preferably, the power unit includes: and a second power unit belonging to the through-hole type power semiconductor element, the second power unit being connected to the main body portion of the heat conductive structure and/or the inner sidewall of the power supply case in a heat transfer manner through a second heat conductive medium, and pins of the second power unit being inserted into the pin through-holes of the PCB.

Preferably, the power unit includes: a third power cell including a magnetic core and a winding; wherein the magnetic core is connected to the PCB board in a heat transfer manner, and/or is connected to the first region of the body portion of the heat conducting structure in a heat transfer manner, and/or is connected to the inner side wall of the power supply housing in a heat transfer manner through a second heat conducting medium; and the winding is connected to the PCB board in a heat transfer manner and/or to the second region of the body portion of the heat conducting structure in a heat transfer manner.

Preferably, the windings are connected to the PCB board in a heat transfer manner by soldering the windings to the PCB board.

Preferably, the power unit includes: and a fourth power unit belonging to the electrolytic capacitor, the fourth power unit being disposed on the first side of the PCB board and/or being disposed in heat transfer connection with the main body portion of the heat conducting structure and/or being disposed in heat transfer connection with an inner side wall of the power supply housing through a second heat conducting medium.

Preferably, a heat conductive glue is filled between at least a part of an outer side wall of the fourth power unit and the first side of the PCB board, so that the fourth power unit is connected to the first side in a heat transfer manner through the heat conductive glue.

The embodiment of the application adopts at least one technical scheme which can achieve the following beneficial effects: the power supply has the advantages that any active heat dissipation mode is not needed, heat generated by the power unit of the power supply is led out to the power supply shell completely by the aid of the internal heat conducting parts arranged inside the power supply shell, and heat dissipation is achieved through external natural air circulation, so that power consumption and cost of the power supply are reduced remarkably, working noise is reduced, service life of an AC power supply for IT equipment is prolonged, and reliability is improved.

It should be understood that the above description is only an overview of the technical solutions of the present invention, so that the technical means of the present invention can be more clearly understood and implemented according to the content of the specification. In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

The advantages and benefits described herein, as well as other advantages and benefits, will be apparent to those of ordinary skill in the art upon reading the following detailed description of the exemplary embodiments. The drawings are only for purposes of illustrating exemplary embodiments and are not to be construed as limiting the utility model. Also, like reference numerals are used to refer to like elements throughout. In the drawings:

FIG. 1 is a schematic diagram of an external configuration of a passive heat dissipating AC power supply for IT equipment according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of the internal structure of a passive heat dissipating AC power supply for IT equipment according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of another internal structure of a passive heat dissipating AC power supply for IT devices according to an embodiment of the present invention;

FIG. 4 is another schematic diagram of the internal structure of a passive heat dissipation AC power supply for IT equipment according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of an external configuration of a passive heat dissipating AC power supply for an IT device in accordance with another embodiment of the present invention;

FIG. 6 is a schematic diagram of an external configuration of an IT device with a passive heat dissipating AC power supply in accordance with an embodiment of the present invention;

FIG. 7 is a schematic diagram of the internal structure of an IT device with a passive heat dissipating AC power supply in accordance with an embodiment of the present invention;

in the drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

In the description of the embodiments of the present application, it is to be understood that terms such as "including" or "having" are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof disclosed in the specification, and are not intended to preclude the presence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

A "/" indicates an OR meaning, for example, A/B may indicate A or B; "and/or" herein is merely an association describing an associated object, and means that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone.

The terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present application, "a plurality" means two or more unless otherwise specified.

It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.

Fig. 1 shows an external configuration diagram of a passive heat-dissipating AC power supply 1 for IT equipment according to an embodiment of the present invention. Fig. 2 shows a schematic diagram of the internal structure of a passive heat-dissipating AC power supply 1 for IT equipment according to an embodiment of the present invention, in which the top wall of the power supply housing is hidden for the convenience of showing the internal structure of the power supply. Fig. 3 is a top view of the internal structure diagram shown in fig. 2. Fig. 4 is a side view of the internal structure diagram shown in fig. 2.

Referring to fig. 1 to 4, an embodiment of the utility model provides a passive heat dissipation type AC power supply 1 for IT equipment, which specifically includes a power supply housing 10, and a plurality of power units (e.g., 32, 33, 34) and a plurality of internal heat conducting components (e.g., 41, 42, 43, 44) disposed inside the power supply housing.

The power units are disposed in the cavity inside the power supply housing 10, and the power units are electrically connected to the IT device and used for supplying power to the IT device. The internal heat conducting components are also disposed in a cavity inside the power supply housing 10 and may be directly and/or indirectly connected to the inner side walls (e.g., 11, 12, 13) of the power supply housing 10. By indirect connection is meant that one internal heat conducting member may also be connected to the inner side wall of the power supply housing via another internal heat conducting member. Each power cell is coupled in heat transfer relation with one or more internal heat conducting members to conduct generated heat to the power supply housing through the internal heat conducting members.

In other words, each power cell is thermally connected to the inner side wall of the power supply casing 10 by one or more internal heat conducting members, and each power cell and the power supply casing 10 are electrically isolated from each other. By heat transfer connected is meant that heat can be communicated between several bodies connected in a heat transfer manner. By electrically isolated, it is meant that no voltage difference is created between each power cell and the power supply housing 10.

It should be noted that, in fig. 2, a part of the inner side wall of the power supply housing 10 is hidden, however, the internal heat conducting member may also be directly and/or indirectly connected to the hidden inner side wall, and the embodiment does not give a corresponding example for convenience of illustration, however, for a person skilled in the art, a possible connection relationship between the internal heat conducting member and the hidden inner side wall may be directly inferred.

In the above embodiment, no active heat dissipation manner is needed, the heat generated by the power unit of the power supply is conducted to the power supply housing by completely relying on the internal heat conduction component arranged inside the power supply housing, and the heat dissipation is realized through external natural air circulation or through the application environment of the IT device. Therefore, the power consumption and the cost of the power supply can be obviously reduced, the working noise is reduced, and more importantly, the service life and the reliability of the power supply of the IT equipment are increased. It is understood that the active heat dissipation means includes, but is not limited to, active heat dissipation devices having heat dissipation fans, liquid cooling devices, etc. disposed inside or outside the power source.

In some embodiments, the IT device may be a server device, and in particular may be an IDC (Internet Data Center) server device. In some embodiments, to further improve the heat dissipation efficiency of the AC power source, the power supply housing 10 needs to further conduct heat into the application environment of the IT equipment, and in particular, the power supply housing may be connected in a heat transfer manner to the housing of the IT equipment and/or the heat dissipation component of the IT equipment and/or the rack of the IT equipment, thereby ensuring heat conduction efficiency.

In other embodiments, the power supply housing 10 may not exchange heat with the application environment of the IT device, and may independently dissipate heat, which is not limited in this application.

FIG. 5 is a schematic diagram of an external configuration of a passive heat dissipation AC power supply for an IT device according to another embodiment of the present invention.

In some embodiments, referring to fig. 5, to further improve the heat dissipation efficiency of the AC power source, a plurality of heat dissipation fins 14 are provided on at least one outer sidewall of the power source housing. Specifically, the heat sink fins may be disposed on the outer sidewalls of all non-specific functional areas of the power supply housing, wherein the specific functional areas may include, for example, a socket area, a mounting area, and the like. Whereby the heat dissipation efficiency can be further improved.

FIG. 6 illustrates an external schematic of an IT device with a passive heat dissipating AC power supply in accordance with an embodiment of the present invention. FIG. 7 illustrates a schematic diagram of the internal structure of an IT device with passive heat dissipating AC power in which the top wall of the server housing is hidden for ease of illustration of the power supply external structure, in accordance with an embodiment of the present invention.

The heat dissipation path of the passive heat dissipation type AC power supply in the IT device will be described in detail with reference to fig. 6 to 7.

In some embodiments, at least one cavity 21 is formed inside the housing 20 of the IT device, the cavity 21 comprising a plurality of cavity walls and a first cavity opening 211 that opens to the outside of the housing 20 of the IT device. The chamber wall is connected in a heat-transferring manner to the housing of the server or can be formed as part of the chamber wall by part of the housing of the IT device. The AC power supply 1 is insertably mounted in the cavity 21 through said first cavity opening 211, and at least one outer side wall of the power supply casing 10 is connected in a heat transfer manner to the cavity wall for transferring heat to the casing of the server for heat dissipation.

In some embodiments, a flexible heat conducting medium (not shown) is disposed between at least one cavity wall of the cavity 21 and at least one outer side wall of the power supply housing 10, for example, the flexible heat conducting medium may be disposed between a bottom wall of the power supply housing 10 and a bottom wall of the cavity 21 to increase heat conducting efficiency. The flexible heat conducting medium may be made of a heat conducting oily substance, a heat conducting sponge and other flexible materials, so that the power supply housing 10 of the AC power supply may be freely inserted into the cavity 21 or pulled out from the cavity 21.

In some embodiments, referring to fig. 7, the receptacle 21 further comprises a second receptacle opening 212 that opens into the interior of the IT device housing 20, and the power supply housing 10 has at least two power supply housing openings (not shown) formed therein to provide fluid communication between the first receptacle opening 211, the second receptacle opening 212, and the at least two power supply housing openings. Preferably, the power supply housing 20 is open at one end and an opposite end, such as at the end having the power supply socket, to form a straight fluid path. By providing fluid communication, a fluid path may be further formed within the cavity 21 through which natural air may flow to carry away some of the heat.

In some embodiments, heat dissipating components such as heat dissipating fins, heat conducting structures, heat conducting media, and the like may also be included inside and outside the housing of the IT device. The AC power source may also be disposed inside or outside the IT device's housing and thermally coupled to any one or more of the heat dissipating components described above.

In the above embodiment, referring to fig. 6, a plurality of IT devices may be stacked together. However, in other embodiments, the IT device may be removably mounted in an IT device rack, the AC power source may be removably mounted in a power cabinet of the IT device rack, and a flexible heat transfer medium may be disposed between at least one interior sidewall of the power cabinet and at least one exterior sidewall of the power housing. The flexible heat-conducting medium may be made of a heat-conducting oily substance, a heat-conducting sponge, or other flexible materials, so that the power supply housing 10 of the AC power supply may be freely inserted into or pulled out of the power supply cabinet.

The inner heat-conducting member and the heat-conducting path formed by the same of the present application will be described in detail with reference to fig. 2 to 4.

In some embodiments, referring to fig. 2-4, the internal heat conducting component may comprise a PCB board 41. The PCB board 41 may be any one of known PCB boards such as FR-4, a metal substrate, and the like. The PCB board 41 is disposed adjacent to the first inner sidewall 11 of the power supply housing 10 and is directly and/or indirectly connected to the inner sidewall of the power supply housing 10. In fig. 2, the first inner sidewall 11 is a bottom inner sidewall of the power supply housing 10. Preferably, a first heat transfer medium 42 may be filled between the PCB board 41 and the first inner sidewall 11. The first heat transfer medium 42 may be an insulating heat transfer medium such as a heat transfer paste, a heat transfer sponge, or the like. The second side of the PCB 41 is disposed facing the first inner sidewall 11, and the second side of the PCB 41 may be indirectly connected with the first inner sidewall 11 through the first conductive medium 42. Several power units such as a first power unit (not shown), a second power unit 32, etc. may be disposed at a first side of the PCB 41, which is a side surface of the PCB 41 away from the first inner side wall 11. Thus, heat generated by the power unit disposed on the PCB 41 can be transferred from the PCB 41 to the power supply case 10, thereby achieving heat dissipation.

In other embodiments, the power units disposed on the first side may not be limited to the first power unit (not shown), the second power unit 32, and other power units including power semiconductor elements, power magnetic elements, and electrolytic capacitors may also be disposed on the first side of the PCB 41, and fig. 2 to 4 are only exemplary embodiments for providing the present application, and the present application is not particularly limited to the type and number of one or more power units disposed on the PCB.

In other embodiments, the first inner sidewall 11 may not be located at the bottom of the power supply housing 10, but located at the top or the peripheral side of the power supply housing, and fig. 2 to 4 are only an exemplary embodiment of the present application, and the position of the first inner sidewall 11 is not particularly limited.

In some embodiments, the internal heat conducting member may further include a heat conducting structure, at least one side end portion of the heat conducting structure is fixedly connected to an inner side wall of the power supply housing, and the main body portion extends toward the inside of the power supply housing. Referring to fig. 2 to 4, for example, a heat conducting structure 43 is taken as an example for description, a bottom end portion and a side end portion of the heat conducting structure 43 are respectively connected with the inner side wall 11 and the inner side wall 13 in a heat transfer manner, and the power unit 34 is connected with the heat conducting structure 43 in a heat transfer manner to realize heat conduction.

Preferably, in order to improve the heat conduction efficiency of the heat conduction structure, a concave receiving portion may be formed at a body portion of the heat conduction structure so that the power cell may be at least partially inserted into the concave receiving portion and connected to the concave receiving portion, wherein the concave shape of the concave receiving seat is configured to be a shape that is fitted to at least a part of a surface of the power cell inserted therein. For example, referring to fig. 5, the heat conducting structure 43 has the concave receiving portion on the main body portion, the fourth power unit 34 has a cylindrical shape, and the concave shape of the concave receiving portion may be an arc-shaped concave shape that is matched with at least a part of the surface of the fourth power unit 34, so that the fourth power unit 34 can be partially embedded in the concave receiving portion. This increases the heat-conducting contact area and thus provides the heat-conducting efficiency of the heat-conducting structure.

For another example, the heat conducting structure may be a wall-like structure (not shown) having a certain thickness, an end portion of which is connected to an inner sidewall of the power supply housing, and one or more power semiconductor elements of a through hole type may be connected in a heat transfer manner with a main body portion of the heat conducting structure to achieve heat conduction. The shape and position of the heat conducting structure and the type of the connected power units are not limited in the present application, and in short, the heat generated by one or more power units can be respectively conducted into the power supply housing 10 by using the above heat conducting structure, so as to achieve high efficiency heat dissipation.

Preferably, in order to achieve a more compact layout in the power supply housing, the PCB 41 may further have an opening therein, one end of the one or more heat conducting structures is fixedly connected to the first inner side wall 11 of the power supply housing 10, and a main portion thereof passes through the opening of the PCB 41 to extend to be connected with the one or more power units in a heat transfer manner. For example, referring to fig. 5, the lower end portion of the heat conductive structure 4 may be connected to the first inner sidewall 11 by a heat conductive medium, and a main body portion thereof extends upward through the opening of the PCB board 41 to be connected in heat transfer with the fourth power unit 34.

In other embodiments, one or more of the heat conducting structures may have only one side end connected to the inner side wall above the PCB 41, and the heat conducting structure need not pass through the opening in the PCB.

In some embodiments, the inner heat conducting member may further comprise a second heat conducting medium, which may be an insulating heat conducting medium such as a heat conducting glue, a heat conducting sponge, or the like. Specifically, one or more power cells may be thermally connected to any one or more inner side walls of the power supply casing 10 through the second heat transfer medium, or may be thermally connected to a main body portion of the heat transfer structure through the second heat transfer medium. In particular, it may be adhered to the inner side wall or the heat conducting structure by the second heat conducting medium. For example, the second power cell 32 is adhered to the inner sidewall 12 by a second heat transfer medium 44. It can be understood that when the power units are adhered to the inner side wall, since heat of one or more power units can be directly conducted into the power supply shell, the heat conducting path is shortened, and the heat dissipation efficiency is further improved.

In some embodiments, the protrusion 15 may be formed inward from an inner sidewall of the power supply housing, and the plurality of second power cells 32 are thermally connected to the protrusion 15 on the inner sidewall through the second heat transfer medium 44. Thus, it is possible to reduce mounting errors caused by mounting the second power unit 32 to some extent, and also to enlarge the heat dissipation surface area of the power supply case.

Alternatively, referring to fig. 3, the PCB board 41 may have an opening (not shown) thereon, the first end portion (the bottom end portion in this embodiment) of the third power unit 33 may be indirectly connected to the first inner sidewall 11 through the filled second heat-conducting medium (the second heat-conducting medium may be the same medium as the first heat-conducting medium here), and the second end portion (the top end portion in this embodiment) extends toward the inside of the power supply housing 10 through the opening 412 of the PCB board 41. Therefore, high-efficiency heat dissipation can be realized, and the internal compactness of the power supply is ensured.

Each power unit and its heat conduction path of the embodiments of the present invention are described in detail below with reference to fig. 2 to 4.

In some embodiments, the first power unit (not shown) belongs to a chip type power semiconductor element, such as a resistor, an inductor, a capacitor, a diode, a transistor, etc., which may be a chip type power element, may be disposed on the first side of the PCB board 41, and more specifically, may be Mounted on the first side of the PCB board 41 by using Surface Mount Technology (SMT). The heat generated by the first power unit during operation can be conducted out to the power supply housing 10 through the PCB 41 or through the PCB 41 and the first conductive medium 42, so as to dissipate the heat.

In some embodiments, fig. 2-4 illustrate an exemplary second power cell 32 belonging to a through-hole type power semiconductor element, the second power cell 32 being disposed over a first side of the PCB board 41, the second power cell 32 being indirectly connected to the inner side wall 12 by a second heat-conducting medium 44, thereby forming an electrical isolation between the second power cell 32 and the power supply housing 10. In order to more efficiently dissipate heat, the heat dissipation contact area between the second heat transfer medium 44 and the second power unit 32 may be enlarged, and the side of the second power unit 32 having the largest area may be preferably entirely adhered to the inner sidewall through the second heat transfer medium 44. The pins of the second power unit 32 are inserted into the pin through holes of the PCB board 41 from the first side. Based on this, the heat generated by the second power unit 32 can be transferred to the power supply housing 10 through the second heat-conducting medium 44, and high-efficiency heat dissipation is achieved.

In some embodiments, fig. 2 to 4 show a further exemplary second power unit (not shown), which also belongs to a Through-Hole type power semiconductor element, which may be arranged above the first side of the PCB board, in particular mounted on the PCB board 41 using Through-Hole Technology (Through Hole Technology), and may be connected in a heat-transferring manner to a body portion of a heat-conducting structure (not shown) extending from the inner side wall, e.g. may be adhered tightly thereto by a further second heat-conducting medium, thereby forming an electrical isolation.

In some embodiments, a third power cell is also included, including a magnetic core and a winding; wherein the magnetic core may have various types of thermally conductive paths, including but not limited to: the heat sink assembly is thermally coupled to the PCB board, thermally coupled to the first region of the body portion of the thermally conductive structure, and thermally coupled to the inner sidewall of the power supply housing via a second thermally conductive medium. The magnetic core can dissipate heat according to a single or combined heat conduction path. The winding may be thermally coupled to the PCB board and may also be thermally coupled to a second region of the body portion of the thermally conductive structure that is not coincident with the first region. The windings may also dissipate heat in a single or combined heat conducting path.

In some embodiments, referring to fig. 2 to 4, an exemplary third power unit 33 is illustrated, which belongs to a planar power magnetic component, and specifically includes a magnetic core 331 and a winding 332, wherein the magnetic core 331 may pass through an opening (not shown) of the PCB 41 and be thermally connected to the first inner side wall 11 through a conductive medium, and the winding 332 may be soldered to the PCB 41, so as to guide heat thereof into the PCB 41. The present embodiment is described by taking the third power unit 33 as an example, but the shape and the installation position thereof are not particularly limited.

In some embodiments, another exemplary third power unit (not shown) may also be included, which may also be a wound-type power magnetic element, which may include a magnetic core (not shown) and a winding (not shown) wound on the magnetic core, wherein the magnetic core and the winding may be respectively connected to the first region and the second region of the same thermally conductive structure (not shown) in a heat transfer manner. Thereby, heat generated from the magnetic core and the winding can be transferred to the power supply case 10 through the heat conductive structure. Thereby achieving high efficiency heat dissipation.

In some embodiments, another exemplary third power unit (not shown) may be included, which may also be a wound-type power magnetic element, such as a magnetic core (not shown) and a winding (not shown) wound on the magnetic core. The core is interconnected to the body portion of some thermally conductive structure (not shown) and the windings are indirectly connected to the first side of the PCB board through a thermally conductive medium (not shown). For example, a bottom end portion of the heat conductive structure (not shown) may be interconnected with the first inner sidewall 11, the body portion may extend upward through the opening of the PCB board 41 and form a concave receiving portion (not shown) at a top end portion thereof, a concave shape of the concave receiving portion may be fitted with a lower shape of the magnetic core such that the magnetic core is embedded therein. Further, in order to improve the heat conduction efficiency, a heat conductive paste (not shown) may be injected between the outer peripheral side of the winding (not shown) exposed to the outside and the first side surface, so that heat generated from the winding is conducted to the PCB board 41 through the heat conductive paste and is conducted to the power supply case 1 through the PCB board 41.

The above embodiments exemplify the heat conducting paths of several third power units, but are not limited thereto.

In some embodiments, referring to fig. 2-4, a fourth power cell 34 belonging to an electrolytic capacitor may also be included, which fourth power cell 34 may be disposed on the first side of the PCB board 41 to conduct heat away from the PCB board 41 to the power supply enclosure 1. May also be arranged to interconnect with a body portion of the heat conducting structure 43 to conduct heat away from the heat conducting structure 43 to the power supply housing 1, and may also be indirectly connected to the first inner side wall 11 via another second heat conducting medium (not shown) to conduct heat away from the second heat conducting medium (not shown) to the power supply housing 1. Further, in order to improve the heat conduction efficiency, a heat conduction glue (not shown) may be injected between at least a portion of an outer side wall of the fourth power unit 34 and the first side surface of the PCB 41, for example, between an outer peripheral side of the fourth power unit 34 exposed to the outside and the first side surface, so that heat generated by the fourth power unit 34 may be further introduced into the power supply housing 1 through the PCB with higher heat conduction efficiency.

While the spirit and principles of the utility model have been described with reference to several particular embodiments, it is to be understood that the utility model is not limited to the disclosed embodiments, nor is the division of aspects, which is for convenience only as the features in such aspects may not be combined to benefit. The utility model is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims (22)

1. A passive heat dissipating AC power source for IT equipment, the AC power source comprising: a power supply housing, at least one power cell and at least one internal thermally conductive member disposed within the power supply housing;

wherein the internal heat conducting members are directly and/or indirectly connected to the inner side walls of the power supply housing, and each of the power cells is connected in heat transfer with one or more of the internal heat conducting members to conduct generated heat to the power supply housing through the internal heat conducting members.

2. The AC power supply of claim 1, wherein the IT device is a server device or an IDC server device.

3. The AC power supply of claim 1 or claim 2, wherein the power supply housing is thermally coupled to a housing of the IT device and/or a heat dissipating component of the IT device and/or a rack of the IT device.

4. The AC power supply of claim 3,

at least one cavity is formed inside the IT equipment shell, the cavity comprises a plurality of cavity walls and a first cavity opening which is opened to the outside of the IT equipment shell, the AC power supply is installed in the cavity in a pluggable mode through the first cavity opening, and at least one outer side wall of the power supply shell is connected to the cavity walls in a heat transfer mode.

5. The AC power supply of claim 4,

and a flexible heat-conducting medium is arranged between at least one accommodating cavity wall and at least one outer side wall of the power supply shell.

6. The AC power supply of claim 4,

the cavity further comprises a second cavity opening which is open towards the interior of the shell of the IT device, and the power supply shell forms at least two power supply shell openings so that fluid communication is achieved among the first cavity opening, the second cavity opening and the at least two power supply shell openings.

7. The AC power supply of claim 3,

the IT equipment is installed in the rack of the IT equipment in a pluggable manner, the AC power supply is installed in the power cabinet of the rack of the IT equipment in a pluggable manner, and a flexible heat-conducting medium is arranged between at least one inner side wall of the power cabinet and at least one outer side wall of the power shell.

8. The AC power supply of claim 1 or 2,

and at least one outer side wall of the power supply shell is provided with a plurality of radiating fins.

9. The AC power source of claim 1 or 2, wherein said internal heat conducting member comprises:

the PCB board is close to the first inside wall setting of power casing, and directly and/or indirectly be connected to the inside wall of power casing, one or more the power unit sets up the PCB board is kept away from the first side of first inside wall.

10. The AC power supply of claim 9, wherein a first heat conducting medium is filled between said PCB board and said first inner side wall.

11. The AC power source of claim 9, wherein said internal heat conducting member comprises:

one or more heat conducting structures, at least one side end part of the heat conducting structure is connected to the inner side wall of the power supply shell in a heat transfer mode, and a main body part of the heat conducting structure extends towards the inside of the power supply shell;

wherein one or more of the power cells are coupled in thermal communication with the body portion of the thermally conductive structure to conduct heat generated by the power cells into the power supply housing.

12. The AC power supply of claim 11,

the PCB board arranged close to the first inner side wall of the power supply shell is provided with an opening, one side end part of one or more heat conduction structures is connected to the first inner side wall in a heat transfer mode, and the main body part of the heat conduction structures penetrates through the opening of the PCB board to extend to be connected with the power unit in a heat transfer mode.

13. The AC power supply of claim 12,

a concave receptacle is formed in the body portion of one or more of the thermally conductive structures into which one or more of the power cells is at least partially embedded, wherein the concave receptacle is shaped to interfit with at least a portion of a surface of the power cell embedded therein.

14. The AC power source of claim 11, wherein said internal heat conducting member further comprises:

a second heat-conducting medium by which one or more of the power cells are thermally coupled to an interior sidewall of the power supply housing and/or a body portion of the heat-conducting structure.

15. The AC power supply of claim 14,

a protrusion is formed inward from an inner side wall of the power supply housing, and one or more of the power cells are thermally connected to the protrusion on the inner side wall through the second heat transfer medium.

16. The AC power supply of claim 14,

the PCB board arranged close to the first inner side wall of the power supply shell is provided with an opening, the first end parts of one or more power units are indirectly connected to the first inner side wall through the second heat-conducting medium, and the second end parts penetrate through the opening of the PCB board and extend towards the inside of the power supply shell.

17. The AC power supply of claim 9, wherein the power unit comprises:

and the first power unit belongs to a patch type power semiconductor element, and is arranged on the first side surface of the PCB.

18. The AC power supply of claim 14, wherein the power unit comprises:

a second power unit belonging to a through-hole type power semiconductor element, the second power unit being connected to the main body portion of the heat conductive structure and/or the inner sidewall of the power supply case in a heat transfer manner through the second heat conductive medium, and pins of the second power unit being inserted into pin through-holes of a PCB board.

19. The AC power supply of claim 14, wherein the power unit comprises:

a third power cell comprising a magnetic core and a winding; wherein the content of the first and second substances,

the magnetic core is connected to the PCB board in a heat transfer mode, and/or is connected to the first area of the main body part of the heat conducting structure in a heat transfer mode, and/or is connected to the inner side wall of the power supply shell in a heat transfer mode through the second heat conducting medium; and the winding is connected in a heat transfer manner to the PCB board and/or to the second region of the body portion of the heat conducting structure.

20. The AC power source of claim 19, wherein said windings are thermally coupled to said PCB by soldering said windings to said PCB.

21. The AC power supply of any one of claims 14-16, wherein the power unit comprises:

a fourth power cell belonging to an electrolytic capacitor, the fourth power cell being disposed on the first side of the PCB board and/or being disposed in heat transfer connection with a body portion of the heat conducting structure and/or being disposed in heat transfer connection with an inner side wall of the power supply housing through the second heat conducting medium.

22. The AC power supply of claim 21,

filling a heat-conducting glue between at least a part of an outer side wall of the fourth power unit and the first side face of the PCB, so that the fourth power unit is connected to the first side face in a heat transfer mode through the heat-conducting glue.

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