CN115420584A - Method for detecting microstructure state of material by using laser shock wave - Google Patents
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- 239000000463 material Substances 0.000 title claims abstract description 75
- 230000035939 shock Effects 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000013078 crystal Substances 0.000 claims abstract description 39
- 238000001514 detection method Methods 0.000 claims abstract description 11
- 230000000877 morphologic effect Effects 0.000 claims abstract description 10
- 238000002635 electroconvulsive therapy Methods 0.000 claims abstract description 9
- 230000009191 jumping Effects 0.000 claims description 12
- 230000003746 surface roughness Effects 0.000 claims description 7
- 238000012512 characterization method Methods 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 description 8
- 238000002679 ablation Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007431 microscopic evaluation Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
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Abstract
The invention discloses a method for detecting the microstructure state of a material by using laser shock waves, which comprises the steps of carrying out laser shock treatment on a to-be-detected area of the material to be detected so as to enable the laser shock area on the surface of the material to generate plastic deformation; judging whether the number of crystal grains in the laser impact area is within a preset number range or not; establishing a plurality of laser impact paths in a laser impact area, and performing laser impact point by point along each laser impact path in sequence to obtain the size and morphological characteristics of a single crystal grain; and finishing the detection to obtain the microstructure information of the material. The method omits the pretreatment such as chemical corrosion or electrolytic corrosion, and improves the convenience of the representation of the microstructure in the material from the treatment angle of the material to be detected; the shape and performance characteristics of the microstructure in the material can be simultaneously represented, and the judgment of the mechanical property difference of various microstructures can be completed through one-time complete detection.
Description
Technical Field
The invention relates to the field of material microstructure detection, in particular to a method for detecting a material microstructure state by using laser shock waves.
Background
The microstructure state directly reflects the work-making performance of a metal material and is an important aspect of metal material performance analysis and failure study. At present, the structural characteristics of the grain boundary and the precipitated phase of the metal material are generally represented by instruments and equipment such as a metallographic microscope or a scanning electron microscope, however, when the microstructure is observed by adopting the above means, the surface of the material needs to be subjected to chemical corrosion or electrolytic corrosion treatment, which increases the technical difficulty of material characteristic research. In addition, when the material is characterized by adopting a microscopic imaging means, the analysis or acquisition of mechanical performance characteristics of different structural characteristics in the material can not be realized except for the acquisition of the shape and the appearance state of the microscopic structure of the material. The fine grain strengthening is one of the important ways of strengthening the performance of the metal material, the grain size is a physical quantity for representing the grain size of the metal material, and the accurate quantitative representation of the grain size plays an important role in analyzing the grain refinement degree of the metal material. Based on the above, how to perform microscopic analysis on a metal material by adopting a simpler and more convenient technical means and realize high-throughput characterization of material internal structural feature information becomes a problem to be solved by technical personnel.
Disclosure of Invention
The invention aims to provide a method for detecting the microstructure state of a material by using laser shock waves.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for detecting the microstructural state of a material using laser shock waves, the method comprising the steps of:
step S10: carrying out laser shock treatment on a to-be-detected area of a material to be detected so as to enable the laser shock area on the surface of the material to generate plastic deformation;
step S20: judging whether the number of the crystal grains in the laser impact area is within the range of the preset number, and skipping to the step S40, or carrying out laser impact of the area of the pulse-variable laser beam on the laser impact area again;
step S20 specifically includes the following steps:
step S21: observing the laser impact area, judging whether the number of crystal grains in the laser impact area is within the range of the preset number, if so, skipping to the step S40, and if not, skipping to the step S22;
step S22: adjusting the area of the pulse laser beam to repeatedly carry out laser shock on the area;
step S23: judging whether the number of crystal grains in the laser impact area is within the range of the preset number after the laser impact in the step S22, if so, jumping to the step S40, and if not, jumping to the step S24;
step S24: judging whether the adjustment of the area of the pulse laser beam reaches a limit value, if not, jumping to the step S22, and if so, jumping to the step S30;
step S30: establishing a plurality of laser impact paths in a laser impact area, and performing laser impact point by point along each laser impact path in sequence to obtain the size and morphological characteristics of a single crystal grain;
step S40: and finishing the detection to obtain the microstructure information of the material.
Preferably, step S30 specifically includes:
s31, selecting a laser impact origin in the laser impact area, and creating a plurality of laser impact paths which are diffused outwards through the laser impact origin;
step S32: setting the area of the pulse laser beam, sequentially carrying out point-by-point laser impact from the laser impact origin along one of the laser impact paths determined in the step S31 to obtain the position of the boundary point of the grain boundary, and repeating the above processes until the position of the boundary point of the grain boundary of each laser impact path is obtained;
step S33: and connecting the determined grain boundary edge points in sequence by adopting a smooth curve to finish the quantitative characterization of the grain boundary shape and the size in the material.
Preferably, in step S32, when the laser impact path is laser-impacted point by point, and the laser impact point has a different plastic deformation degree from the inside of the crystal grain, the point is marked as a grain boundary edge point.
Preferably, in step S31, the number of the created laser shock paths is more than 6, and the included angles between the clockwise adjacent laser shock paths are equal.
Preferably, the predetermined number of crystal grains in the laser impact region is in the range of 3 to 20.
Preferably, in step S22, if the number of the crystal grains in the irradiation region is smaller than the minimum value of the preset number range of the crystal grains, the area of the pulse laser beam is adjusted and expanded.
Preferably, in step S22, if the number of the crystal grains in the irradiation region is greater than the maximum value of the preset number range of the crystal grains, the area of the pulse laser beam is adjusted and reduced.
Preferably, the surface roughness of the material to be detected is Ra 0.15 or less.
The invention has the beneficial effects that: the method is suitable for various occasions of quantitative detection of different microscopic characteristics with different mechanical strengths in the material, omits pretreatment such as chemical corrosion or electrolytic corrosion and the like, and improves the convenience degree of the representation of the internal microstructure of the material from the treatment angle of the material to be detected; the shape and performance characteristics of the microstructure in the material can be represented at the same time, and the mechanical property difference of various microstructures can be judged by one-time complete detection.
Drawings
The drawings are further illustrative of the invention and the content of the drawings does not constitute any limitation of the invention.
FIG. 1 is a flow diagram of a method of one embodiment of the present invention;
FIG. 2 is a schematic view of the microstructure characteristics of the laser impact area when the number of the crystal grains is 3-20 according to one embodiment of the present invention;
FIG. 3 is a schematic view of the microstructure characteristics of the laser impact area when the number of the crystal grains is greater than 20 according to one embodiment of the present invention;
FIG. 4 is a schematic view of the microstructure features of the laser shock region when the number of die is less than 3 according to one embodiment of the present invention;
FIG. 5 is a schematic diagram of the selection of the laser shock origin and the creation of the laser shock path in step S31 according to one embodiment of the present invention;
FIG. 6 is a schematic diagram of obtaining boundary points in step S31 according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of the line connecting the grain boundary edge points in step S31 according to one embodiment of the present invention.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Example 1
In this embodiment, referring to fig. 1, a method for detecting a microstructure state of a material by using a laser shock wave includes the following steps:
step S10: carrying out laser shock treatment on a to-be-detected area of a material to be detected so as to enable the laser shock area on the surface of the material to be subjected to plastic deformation;
step S20: judging whether the number of the crystal grains in the laser impact area is within the range of the preset number, and skipping to the step S40, or carrying out laser impact of the area of the pulse-variable laser beam on the laser impact area again;
step S20 specifically includes the following steps:
step S21: observing the laser impact area by using a surface three-dimensional shape detection instrument, judging whether the number of crystal grains in the laser impact area is within a preset number range, referring to the attached figures 2-4, if so, skipping to the step S40, and if not, skipping to the step S22;
step S22: adjusting the area of the pulse laser beam to repeatedly carry out laser shock on the area;
step S23: judging whether the number of crystal grains in the laser impact area is within the range of the preset number after the laser impact in the step S22, if so, jumping to the step S40, and if not, jumping to the step S24;
step S24: judging whether the adjustment of the area of the pulse laser beam reaches a limit value, if not, jumping to the step S22, and if so, jumping to the step S30;
step S30: creating a plurality of laser impact paths in a laser impact area, and sequentially carrying out laser impact point by point along each laser impact path so as to obtain the size and morphological characteristics of a single crystal grain;
step S40: and finishing the detection to obtain the microstructure information of the material.
The method is mainly oriented to quantitative characterization of microstructure characteristics such as grain boundaries and precipitates in the metal material, and focuses on grain size indexes which have important influence on material performance.
The main technical principle of the method is as follows: for the traditional metal structure material, the strength of the grain boundary is obviously higher than that of the grain interior at room temperature, so that the grain boundary and the grain interior have different degrees of plastic deformation under the same external force action; adopting pulse laser induced shock waves as external force on the surface of the material, wherein the plastic deformation of different microstructures on the surface of the material is obviously different due to laser shock; the basic type and morphological characteristics of the internal organization structure of the material can be quantitatively estimated from boundary characteristics caused by deformation differences of microstructures with different scales.
The method is suitable for all occasions of quantitative detection of different microscopic characteristics with different mechanical strengths in the material, and the microscopic characteristics of the holes, the precipitation phase and the mechanical strength of the material matrix are different except the grain boundary characteristics related in the technical description of the invention.
Preferably, with reference to fig. 5 to 7, step S30 specifically includes:
s31, selecting a laser impact origin in the laser impact area, and creating a plurality of laser impact paths which are diffused outwards through the laser impact origin;
step S32: setting the irradiation area of the pulse laser beam to 100 μm 2 ～200μm 2 Sequentially carrying out point-by-point laser impact from the laser impact origin along one of the laser impact paths determined in the step S31, marking the point as a grain boundary edge point and acquiring the position of the grain boundary edge point when the laser impact point has a plastic deformation degree different from that of the inside of the crystal grain, and repeating the above processes until the position of the grain boundary edge point in each laser impact path is acquired;
step S33: and connecting the determined grain boundary edge points in sequence by adopting a smooth curve to finish the quantitative characterization of the grain boundary shape and the size in the material.
Therefore, when the microstructure characteristics of the laser impact area can not be obtained after the laser impact area is subjected to multiple times of laser impact with variable laser beam area, namely the grain size is larger than 2000 μm in the laser impact area 2 In the case of (3), the size and morphological characteristics of the individual crystal grains can be obtained by the present steps S31 to S33.
The intersection point of the plastic deformation path obtained by the laser shock treatment and the grain boundary in the material inevitably shows different plastic deformation degree from the inside of the grain, and the position of the grain boundary edge point is determined according to the intersection point. The boundary point is the laser impact point which has the shortest distance with the laser impact origin on the laser impact path and has different plastic deformation degrees with the inside of the crystal grain.
Preferably, in step S31, the number of the created laser shock paths is more than 6, and the included angles between the clockwise adjacent laser shock paths are equal. The grain boundary edge points are more uniform, and after the grain boundary edge points are sequentially connected in the step S33, the connection line is closer to the form of the grain boundary, so that the accuracy of obtaining the form of the grain boundary is improved.
Preferably, the predetermined number of crystal grains in the laser impact region is in the range of 3 to 20. Thus, the present embodiment is suitable for the grain size of the material to be detected to be 20 μm 2 And 2000 μm 2 The detection is carried out in the same time, and the application range is wide.
Preferably, in step S22, if the number of crystal grains in the irradiation region is smaller than the minimum value of the preset number range of crystal grains, adjusting and expanding the area of the pulse laser beam; and if the number of the crystal grains in the irradiation area is larger than the maximum value of the preset number range of the crystal grains, adjusting and reducing the area of the pulse laser beam. So that the number of the crystal grains in the laser impact area is in accordance with the range of the preset number, and the microstructure information such as the morphological characteristics of the crystal grains and the like can be directly obtained.
Preferably, the laser shock absorbing layer and the restraint layer are made of black adhesive tape and deionized water respectively. Ensuring that the surface of the material to be detected has no ablation area after laser shock treatment.
Preferably, the surface roughness of the material to be detected is Ra 0.15 or less. And grinding and polishing the surface of the material to be detected to make the surface roughness of the material to be detected not greater than Ra 0.15.
Example 2
This embodiment is exemplified by detecting the grain characteristics inside a material.
The material to be detected is subjected to preprocessing such as grinding and polishing before laser impact surface processing, so that the surface roughness of the material to be detected is less than Ra 0.12. Performing laser shock treatment on the material area to be detected, determining the materials of the absorption layer and the restraint layer as a black adhesive tape and deionized water, and determining the laser energy of 5J, the pulse width of 18ns and the beam irradiation area of 1500 mu m in laser parameters 2 And ensures that no ablation area exists on the surface of the material to be detected after laser impact surface treatment.
A white light interferometer is adopted to observe a laser impact area, the grain boundary in the irradiation area is clear and distinguishable, the number of grains is 10, and microstructure information such as grain morphological characteristics and the like can be obtained.
Example 3
This embodiment is exemplified by detecting the grain characteristics inside a material.
The material to be detected is subjected to preprocessing such as grinding and polishing before laser impact surface processing, so that the surface roughness of the material to be detected is less than Ra 0.12. Performing laser shock treatment on the material area to be detected, determining the materials of the absorption layer and the restraint layer as a black adhesive tape and deionized water, and determining the laser energy of 5J, the pulse width of 18ns and the beam irradiation area of 1500 mu m in laser parameters 2 And ensures that no ablation area exists on the surface of the material to be detected after laser impact surface treatment.
A white light interferometer is adopted to observe a laser impact area, the grain boundary in the irradiation area is clear and distinguishable, and the number of grains is about 40. Reducing the area of the pulse beam to 700 μm 2 And performing laser impact on the laser impact area again, wherein the number of the grains in the irradiation area is changed into 16 after the secondary laser impact, and the microstructure information such as the morphological characteristics of the grains can be obtained.
Example 4
The material to be detected is subjected to pre-treatment such as grinding and polishing before laser impact surface treatment, so thatThe surface roughness of the material to be detected is less than Ra 0.12. Performing laser shock treatment on the material area to be detected, determining the materials of the absorption layer and the restraint layer as a black adhesive tape and deionized water, and determining the laser energy of 5J, the pulse width of 18ns and the beam irradiation area of 1500 mu m in laser parameters 2 And ensures that no ablation area exists on the surface of the material to be detected after laser impact surface treatment.
When a white light interferometer is used for observing a laser impact area, crystal boundaries in the irradiation area are clear and distinguishable, and the condition that the whole crystal grains are in the irradiation area to be detected cannot be obtained.
The irradiation area of the pulse laser beam is changed to be 150 mu m 2 Randomly determining a point in a laser impact area as a laser impact origin, taking the point as a circle center as 8 diameter paths as laser impact paths, and sequentially carrying out point-by-point laser impact along the laser impact paths to obtain a plurality of grain boundary edge points, wherein included angles among the 8 laser impact paths are 22.5 degrees, and the determined grain boundary edge points are connected by adopting a smooth curve to obtain the size and morphological characteristics of a single crystal grain.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive step, and these embodiments will fall within the scope of the present invention.
Claims (8)
1. A method for detecting the microstructure state of a material using laser shock waves, the method comprising the steps of:
step S10: carrying out laser shock treatment on a to-be-detected area of a material to be detected so as to enable the laser shock area on the surface of the material to be subjected to plastic deformation;
step S20: judging whether the number of the crystal grains in the laser impact area is within the range of the preset number, and skipping to the step S40, or carrying out laser impact of the area of the pulse-variable laser beam on the laser impact area again;
step S20 specifically includes the following steps:
step S21: observing the laser impact area, judging whether the number of crystal grains in the laser impact area is within the range of the preset number, if so, skipping to the step S40, and if not, skipping to the step S22;
step S22: adjusting the area of the pulse laser beam to repeatedly carry out laser shock on the area;
step S23: judging whether the number of crystal grains in the laser impact area is within the range of the preset number after the laser impact in the step S22, if so, jumping to the step S40, and if not, jumping to the step S24;
step S24: judging whether the adjustment of the area of the pulse laser beam reaches a limit value, if not, jumping to the step S22, and if so, jumping to the step S30;
step S30: establishing a plurality of laser impact paths in a laser impact area, and performing laser impact point by point along each laser impact path in sequence to obtain the size and morphological characteristics of a single crystal grain;
step S40: and finishing the detection to obtain the microstructure information of the material.
2. The method for detecting the microstructure state of the material by using the laser shock wave as claimed in claim 1, wherein the step S30 specifically comprises:
s31, selecting a laser impact origin in the laser impact area, and creating a plurality of laser impact paths which are diffused outwards through the laser impact origin;
step S32: setting the area of the pulse laser beam, sequentially carrying out point-by-point laser impact from the laser impact origin along one of the laser impact paths determined in the step S31 to obtain the position of the boundary point of the grain boundary, and repeating the above processes until the position of the boundary point of the grain boundary of each laser impact path is obtained;
step S33: and connecting the determined grain boundary edge points in sequence by adopting a smooth curve to finish the quantitative characterization of the grain boundary shape and the size in the material.
3. The method for detecting the microstructure state of the material using the laser shock wave as set forth in claim 2, wherein the point is marked as a grain boundary edge point when the laser shock point occurs a different degree of plastic deformation from the inside of the grain when the laser shock path is laser shocked point by point in step S32.
4. The method for detecting the microstructure state of the material by using the laser shock wave as claimed in claim 2, wherein the number of the laser shock paths created in step S31 is 6 or more, and the included angles between the clockwise adjacent laser shock paths are equal.
5. The method for detecting the microstructure state of a material using laser shock waves as set forth in claim 2, wherein the predetermined number of the grains in the laser shock region is in the range of 3 to 20.
6. The method of claim 1, wherein in step S22, if the number of the crystal grains in the irradiation region is a minimum value smaller than the predetermined number range of the crystal grains, the area of the pulse laser beam is adjusted to be enlarged.
7. The method for detecting the microstructure state of a material using laser shock waves as set forth in claim 1, wherein in step S22, the area of the pulse laser beam is adjusted to be reduced if the number of the crystal grains in the irradiated region is a maximum value larger than a predetermined number range of the crystal grains.
8. The method for detecting the microstructure state of a material using laser shock waves as set forth in claim 1, wherein the surface roughness of the material to be detected is Ra 0.15 or less.
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