CN115416275A - Array micro-nano structure processing device and method of laser combination pulse sequence - Google Patents
Array micro-nano structure processing device and method of laser combination pulse sequence Download PDFInfo
- Publication number
- CN115416275A CN115416275A CN202211071951.9A CN202211071951A CN115416275A CN 115416275 A CN115416275 A CN 115416275A CN 202211071951 A CN202211071951 A CN 202211071951A CN 115416275 A CN115416275 A CN 115416275A
- Authority
- CN
- China
- Prior art keywords
- plate
- heat conducting
- rod
- screw
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002086 nanomaterial Substances 0.000 title claims abstract description 40
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 54
- 238000003825 pressing Methods 0.000 claims abstract description 33
- 230000000694 effects Effects 0.000 claims abstract description 20
- 238000009434 installation Methods 0.000 claims abstract description 11
- 238000005192 partition Methods 0.000 claims description 16
- 238000009413 insulation Methods 0.000 claims description 12
- 238000007639 printing Methods 0.000 claims description 8
- 238000007723 die pressing method Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000004804 winding Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 6
- 238000004134 energy conservation Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000007613 environmental effect Effects 0.000 abstract description 4
- 238000003754 machining Methods 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/002—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Landscapes
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Abstract
The invention relates to a device and a method for processing an array micro-nano structure of a laser combined pulse sequence, wherein the device comprises a supporting shell, a laser is fixedly arranged in the supporting shell, a light path system is arranged on the lower side of the laser, a light-transmitting mould pressing plate is arranged at the lower end of the light path system in a propping manner and is arranged in an installation hole, the installation hole is formed in an upper base, the upper base is fixedly connected in the supporting shell, and a fixing mechanism is arranged on the upper base and is used for detachably arranging the light-transmitting mould pressing plate in the installation hole; the light-transmitting mould pressing plate is detachably arranged relative to the upper base, so that in the actual working process, when the upper base and the light-transmitting mould pressing plate are singly damaged, only damaged parts need to be replaced, and the effects of energy conservation and environmental protection are achieved; the light-transmitting mould pressing plates with different sizes can be replaced in a detachable mode, so that the equipment is suitable for machining of the surface array micro-nano structures of materials with multiple specifications, and production investment can be greatly reduced.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a device and a method for processing an array micro-nano structure of a laser combination pulse sequence.
Background
The micro-nano structure on the surface of the material can enable the material to have the characteristics which are not possessed by the conventional surface, such as hydrophobicity, antifriction, antibacterial property and the like, while giving play to the inherent performance, and the material is widely applied to the manufacture of functional parts. The micro-nano structure has great influence on the surface performance of the material and can be prepared by methods such as chemical etching, vapor deposition, laser processing and the like. Due to good mechanical and physical and chemical properties, the ceramic is an important research field for micro-nano structure processing. As a typical hard and brittle material, the laser processing method which has the advantages of non-contact, no tool abrasion, high efficiency and easy on-line control of process parameters has obvious advantages, and is more incomparable to array micro-nano structure processing with high repeatability than other methods. Patent CN201210491845.6 discloses a method and a device for forming a plastic part microstructure based on laser heating, wherein technological parameters are accurately controlled through the action of the thermal effect of laser so as to rapidly melt the surface of a material matrix, and then the microstructure is formed and processed through an extrusion forming device. However, since the light-transmitting molded plate is fixed on the upper base and has no detachable performance, in the actual use process, when the light-transmitting molded plate is damaged, the upper base and the light-transmitting molded plate need to be discarded at the same time, which is not beneficial to the effects of energy saving and consumption reduction, and meanwhile, the same equipment cannot realize the surface processing of materials with multiple specifications. In order to solve the problems, the invention provides a device and a method for processing an array micro-nano structure of a laser combination pulse sequence.
Disclosure of Invention
(1) Technical problem to be solved
The invention aims to overcome the defects of the prior art, adapt to practical requirements, and provide a device and a method for processing an array micro-nano structure of a laser combined pulse sequence so as to solve the technical problems.
(2) Technical scheme
In order to realize the purpose of the invention, the technical scheme adopted by the invention is as follows:
the utility model provides a laser combination pulse sequence's array micro-nano structure processingequipment, includes the support casing, the internal fixed laser that is provided with of support casing, and the downside of laser is equipped with optical path system, optical path system's lower extreme is contradicted and is provided with printing opacity moulded board, printing opacity moulded board sets up in the mounting hole, and the mounting hole sets up on the upper base, upper base fixed connection is in the support casing, and is provided with fixed establishment on the upper base for with the dismantled and assembled setting of printing opacity moulded board in the mounting hole.
Furthermore, the fixing mechanism comprises a first screw and a first threaded hole, the first screw is inserted in the first threaded hole in a threaded manner, the first threaded hole is formed in the upper base, a rotating plate is fixedly connected to the side wall of the first screw, and the rotating plate is movably arranged in a second supporting groove formed in the upper base; a screw hole II is formed in the first screw, a screw is inserted into the screw hole II in an inserted mode, and fixing pieces are arranged in the first screw, the screw and the rotating plate.
Further, the mounting includes first supporting ring, no. three screw holes have been seted up on the interior rampart of first supporting ring, and first supporting ring establishes outside No. two screws through No. three screw hole thread bushes, first supporting ring activity sets up the support inslot that sets up on a screw, and the one end of fixedly connected with direction subassembly on the up end of first supporting ring, the other end fixed connection of direction subassembly supports the roof in groove on one, the lateral wall fixedly connected with supporting plate of first supporting ring, and supporting plate activity sets up the support inslot that sets up on the rotor plate No. three, fixedly connected with supports the touch pole on the up end of supporting plate, and the activity of the touch pole is pegged graft on the rotor plate.
Further, the guide assembly comprises a guide rod, a guide cylinder and a guide spring, the guide rod is movably inserted into the guide cylinder, the guide spring is wound and connected outside the guide rod, and two ends of the guide spring are respectively and fixedly connected to the side wall of the guide rod and the outer side wall of the guide cylinder.
Further, the mounting hole is the loudspeaker column structure, and the lateral wall of mounting hole has seted up the constant head tank, it is provided with the locating piece to slide in the constant head tank, and locating piece fixed connection is on the lateral wall of printing opacity moulded board.
Further, no. two support inslots and be provided with heat conduction mechanism, heat conduction mechanism includes a heat-conducting plate and heat conduction pole, the lateral wall fixedly connected with heat conduction pole of a heat-conducting plate, and the heat conduction pole activity is pegged graft on the rotor plate, the heat conduction pole winds outward and is connected with a spring, and the both ends of a spring fixed connection respectively on the lateral wall of heat conduction pole and No. three support the lateral wall in groove, the heat conduction pole is located No. three one end fixedly connected with temperature control device who supports the inslot, and articulates the one end that has a push-and-pull rod on the lower terminal surface of heat conduction pole, the other end of a push-and-pull rod articulates on the up end of bearing plate.
Furthermore, an insulating mechanism is arranged in the second support groove.
Further, the insulating mechanism includes an insulating sleeve, the insulating sleeve is fixedly sleeved outside the heat conducting rod, the insulating sleeve is fixedly inserted on the sealing insulating box, the sealing insulating box is fixedly sleeved outside the first heat conducting plate, one side, away from the first heat conducting plate, of the sealing insulating box is fixedly inserted with a second heat conducting plate, a partition plate is arranged between the second heat conducting plate and the first heat conducting plate, the partition plate is movably inserted on a top plate of the sealing insulating box, the lower end of the partition plate is abutted to be provided with an arc-shaped heat conducting plate, the arc-shaped heat conducting plate is hinged to the inner bottom wall of the sealing insulating box, one end of a second spring is fixedly connected to the side wall of the arc-shaped heat conducting plate, the other end of the second spring is fixedly connected to the inner bottom wall of the sealing insulating box, a connecting component is arranged on the side wall of the partition plate, one end of a second push-pull rod is hinged to the connecting component, the other end of the second push-pull rod is hinged to the outer side wall of the second support ring, the second support ring is movably sleeved outside the insulating sleeve, and two ends of the third spring are fixedly connected to the side wall of the second support ring and the side wall of the insulating sleeve respectively.
Further, coupling assembling includes transverse rod and vertical rod, transverse rod fixed connection is on the lateral wall of partition panel, and the free end fixedly connected with vertical rod of transverse rod, vertical rod fixed connection is on the up end of sliding block, and the sliding block slides and sets up in the sliding tray that sets up on sealed insulating box, the sliding block with No. two push-and-pull rods are connected.
Further, the processing method of the array micro-nano structure is characterized by comprising the following steps:
the method comprises the following steps: aligning the positioning block and the positioning groove, and installing the light-transmitting molded plate in the installation hole;
step two: screwing a first screw, wherein the first screw can drive the rotating plate to rotate, so that the rotating plate moves to the position right below the positioning block;
step three: screwing the second screw, so that the bearing plate moves upwards due to the movement of the second screw, the collision column moves out of the rotating plate due to the upward movement of the bearing plate, the collision of the positioning block is completed, and the light-transmitting molded plate is fixed in the mounting hole;
step four: when the first heat conducting plate moves outwards the rotating plate, the arc-shaped heat conducting plate is pulled by the second spring to rotate anticlockwise, so that the first heat conducting plate is communicated with the second heat conducting plate to complete heat conduction;
step five: the upward movement of the bearing plate can drive the first heat conducting plate to move outwards the rotating plate to contact with the light-transmitting mould pressing plate, so that the temperature conduction is completed, and the temperature is sensed through the temperature control device, so that the temperature of the light-transmitting mould pressing plate is controlled.
(3) Has the beneficial effects that:
according to the invention, the structure of the existing array micro-nano structure processing device of the laser combination pulse sequence is improved, and when the improved array micro-nano structure processing device of the laser combination pulse sequence is used, the light-transmitting mould pressing plate is detachably arranged relative to the upper base, so that in the actual working process, when the upper base and the light-transmitting mould pressing plate are singly damaged, only damaged parts need to be replaced, and the effects of energy conservation and environmental protection are achieved; the light-transmitting mould pressing plates with different sizes can be replaced in a detachable mode, so that the equipment is suitable for machining of the surface array micro-nano structures of materials with multiple specifications, and production investment can be greatly reduced.
After the light-transmitting mould pressing plate is arranged in the mounting hole, the fixing mechanism is adjusted, the light-transmitting mould pressing plate can be locked in the mounting hole by adjusting the fixing mechanism, the structural design of the fixing mechanism is simple and reasonable, and the effect of simplicity and easiness in operation can be achieved during operation.
The combined structure of the positioning block and the positioning groove is additionally arranged on the light-transmitting mould pressing plate and the mounting hole, and the combined structure can be arranged to position the light-transmitting mould pressing plate in the mounting hole, so that the adjustment time can be shortened, and meanwhile, the light-transmitting mould pressing plate and the mounting hole can be arranged in the combined structure.
The temperature control device is provided with the heat conduction mechanism and used for sensing the temperature on the light-transmitting mould pressing plate in real time, so that the intelligent temperature control effect is achieved, specifically, when the temperature control device senses that the temperature on the light-transmitting mould pressing plate is too high, the laser can be controlled to stop working, and through the arrangement of the heat conduction mechanism, the effects of energy conservation and consumption reduction can be achieved on the premise that the micro-nano structure processing of the array is carried out on the surface of a material.
According to the invention, the insulating mechanism is arranged outside the heat conducting mechanism and used for achieving a heat insulation effect on the heat conducting mechanism, and particularly, when no heat is generated during non-working on the light-transmitting molded plate, the insulating mechanism completes sealing on the heat conducting mechanism and isolates heat from being conducted to the heat conducting mechanism, so that the working of the temperature control device is avoided, and the working accuracy of the equipment is ensured.
Drawings
FIG. 1 is a schematic structural diagram of an array micro-nano structure processing device and method of a laser combined pulse sequence according to an embodiment of the invention;
FIG. 2 is an enlarged schematic view of an array micro-nano structure processing device and method of a laser combination pulse sequence, wherein the structure A in FIG. 1 is shown in a figure;
FIG. 3 is a schematic diagram of an array micro-nano structure processing device and method of a laser combined pulse sequence according to the invention, and an interface of an assembly structure of an upper base and a light-transmitting molded plate in FIG. 1 is shown;
FIG. 4 is an enlarged schematic diagram of a structure B in FIG. 3 according to the device and method for processing an array micro-nano structure of a laser combination pulse sequence;
FIG. 5 is a schematic diagram of a heat conducting mechanism in the array micro-nano structure processing device and method of the laser combination pulse sequence;
FIG. 6 is a schematic diagram of a structure of an array micro-nano structure processing device and method of a laser combination pulse sequence, and an insulating mechanism is arranged outside a heat conduction mechanism in FIG. 5.
The reference numbers are as follows:
the laser module comprises a supporting shell 1, a laser 2, an optical path system 3, a light-transmitting die pressing plate 4, an upper base 5, a mounting hole 7, a fixing mechanism 8, a first screw 81, a first threaded hole 82, a second screw 83, a second threaded hole 84, a first supporting ring 85, a third threaded hole 86, a first supporting groove 87, a rotating plate 88, a second supporting groove 89, a third supporting groove 810, a supporting plate 811, a contact column 812, a guide assembly 813, a positioning block 9, a positioning groove 10, a heat conducting mechanism 11, a first heat conducting plate 111, a heat conducting rod 112, a first spring 113, a first push-pull rod 114, a temperature control device 115, an insulating mechanism 12, an insulating sleeve 121, a sealing insulating box 122, a second heat conducting plate 123, an arc heat conducting plate 124, a second spring 125, a partition plate 126, a connecting assembly 127, a second push-pull rod 128, a second supporting ring 129 and a third spring 1210.
Detailed Description
The invention will be further illustrated with reference to the following figures 1-6 and examples:
a laser combined pulse sequence array micro-nano structure processing device comprises a supporting shell 1, wherein a laser 2 is fixedly arranged in the supporting shell 1, a light path system 3 is arranged on the lower side of the laser 2, a light-transmitting molded plate 4 is arranged at the lower end of the light path system 3 in a butting mode, the light-transmitting molded plate 4 is arranged in an installation hole 7, the installation hole 7 is formed in an upper base 5, the upper base 5 is fixedly connected in the supporting shell 1, a fixing mechanism 8 is arranged on the upper base 5 and used for detachably arranging the light-transmitting molded plate 4 in the installation hole 7, the structure of the existing laser combined pulse sequence array micro-nano structure processing device is improved, and the light-transmitting molded plate 4 is detachably arranged relative to the upper base 5 when the improved laser combined pulse sequence array micro-nano structure processing device is used, so that in the actual working process, when the upper base 5 and the light-transmitting molded plate 4 are singly damaged, only damaged parts need to be replaced, and the effects of energy conservation and environmental protection are achieved; the light-transmitting mould pressing plates 4 with different sizes can be replaced in a detachable mode, so that the equipment is suitable for processing the micro-nano structures of the surface arrays of the materials with multiple specifications, and production investment can be greatly reduced.
In this embodiment, the fixing mechanism 8 includes a first screw 81 and a first threaded hole 82, the first screw 81 is inserted in the first threaded hole 82 in a threaded manner, the first threaded hole 82 is formed on the upper base 5, a rotating plate 88 is fixedly connected to a side wall of the first screw 81, and the rotating plate 88 is movably disposed in a second supporting groove 89 formed on the upper base 5; the first screw 81 is provided with a second threaded hole 84, a second screw 83 is inserted into an internal thread of the second threaded hole 84, fixing parts are arranged in the first screw 81, the second screw 83 and the rotating plate 88, each fixing part comprises a first supporting ring 85, a third threaded hole 86 is formed in the inner annular wall of the first supporting ring 85, the first supporting ring 85 is sleeved outside the second screw 83 through the third threaded hole 86 in a threaded manner, the first supporting ring 85 is movably arranged in a first supporting groove 87 formed in the first screw 81, one end of a guide assembly 813 is fixedly connected to the upper end face of the first supporting ring 85, the other end of the guide assembly 813 is fixedly connected to the top wall of the first supporting groove 87, a supporting plate 811 is fixedly connected to the side wall of the first supporting ring 85, the supporting plate 811 is movably arranged in a third supporting groove 810 formed in the rotating plate 88, contact columns 812 are fixedly connected to the upper end face of the supporting plate 811, the contact columns are movably inserted into the rotating plate 88, after the light-transmitting plate 4 is installed in the installation hole 7, the fixing mechanism 8 is adjusted, the adjusting mechanism 8 can lock the light-transmitting plate 4 in the installation hole, and the simple operation mechanism can be operated easily, and the simple structure is achieved.
In this embodiment, direction subassembly 813 includes guide bar, guide cylinder and guide spring, and the guide bar activity is pegged graft in the guide cylinder, and the guide spring winding is connected outside the guide bar, and guide spring's both ends respectively fixed connection on the lateral wall of guide bar and on the lateral wall of guide cylinder.
In the embodiment, the mounting hole 7 is of a horn-shaped structure, the side wall of the mounting hole 7 is provided with the positioning groove 10, the positioning block 9 is arranged in the positioning groove 10 in a sliding mode, and the positioning block 9 is fixedly connected to the side wall of the light-transmitting molded plate 4.
In this embodiment, the heat conducting mechanism 11 is disposed in the second supporting groove 89, the heat conducting mechanism 11 includes a first heat conducting plate 111 and a heat conducting rod 112, the side wall of the first heat conducting plate 111 is fixedly connected with the heat conducting rod 112, the heat conducting rod 112 is movably inserted into the rotating plate 88, the heat conducting rod 112 is externally wound with a first spring 113, two ends of the first spring 113 are respectively and fixedly connected to the side wall of the heat conducting rod 112 and the side wall of the third supporting groove 810, one end of the heat conducting rod 112 located in the third supporting groove 810 is fixedly connected with the temperature control device 115, the lower end surface of the heat conducting rod 112 is hinged with one end of the first push-pull rod 114, and the other end of the first push-pull rod 114 is hinged to the upper end surface of the supporting plate 811.
In this embodiment, an insulating mechanism 12 is disposed inside the second supporting groove 89, the insulating mechanism 12 includes an insulating sleeve 121, the insulating sleeve 121 is fixedly sleeved outside the heat conducting rod 112, the insulating sleeve 121 is fixedly inserted into the sealed insulating box 122, the sealed insulating box 122 is fixedly sleeved outside the first heat conducting plate 111, a second heat conducting plate 123 is fixedly inserted into one side of the sealed insulating box 122 away from the first heat conducting plate 111, a partition plate 126 is disposed between the second heat conducting plate 123 and the first heat conducting plate 111, the partition plate 126 is movably inserted into a top plate of the sealed insulating box 122, a lower end of the partition plate 126 abuts against an arc-shaped heat conducting plate 124, the arc-shaped heat conducting plate 124 is hinged to an inner bottom wall of the sealed insulating box 122, one end of a second spring 125 is fixedly connected to a side wall of the arc-shaped heat conducting plate 124, the other end of the second spring 125 is fixedly connected to an outer side wall of the second heat conducting plate 128, the other end of the second spring 125 is fixedly connected to an inner bottom wall of the sealed insulating box 122, the partition plate 126 is provided with an end of the second push-pull rod 128, the insulating sleeve 127 is movably sleeved outside the insulating sleeve 121, the insulating sleeve is connected to an insulating mechanism 1210, and the insulating sleeve 12 is used for preventing heat conducting mechanism 12 from being wound on the outer side wall of the insulating mechanism 11, and the insulating mechanism from being disposed on the insulating sleeve 1210, and the insulating mechanism 12.
In this embodiment, the connecting assembly 127 includes a transverse rod and a vertical rod, the transverse rod is fixedly connected to the side wall of the partition plate 126, the vertical rod is fixedly connected to the free end of the transverse rod, the vertical rod is fixedly connected to the upper end surface of the sliding block, the sliding block is slidably disposed in a sliding groove formed in the sealed insulating box 122, and the sliding block is connected to the second push-pull rod 128.
The application also provides a processing method of the array micro-nano structure, which comprises the following steps:
the method comprises the following steps: aligning the positioning block 9 and the positioning groove 10, and installing the light-transmitting mould pressing plate 4 in the installation hole 7;
step two: screwing the first screw 81, wherein the first screw 81 drives the rotating plate 88 to rotate, so that the rotating plate 88 moves to the position right below the positioning block 9;
step three: screwing the second screw 83, wherein the movement of the second screw 83 enables the supporting plate 811 to move upwards, and the upward movement of the supporting plate 811 enables the contact column 812 to move out of the rotating plate 88, completes the contact on the positioning block 9, and fixes the light-transmitting die pressing plate 4 in the mounting hole 7;
step four: when the first heat conducting plate 111 moves outwards the rotating plate 88, the arc heat conducting plate 124 is pulled by the second spring 125 to rotate anticlockwise, so that the first heat conducting plate 111 is communicated with the second heat conducting plate 123 to complete heat conduction;
step five: the upward movement of the supporting plate 811 carries the first heat conducting plate 111 to move outward of the rotating plate 88, contacting the transparent mold pressing plate 4, completing the temperature conduction, and sensing the temperature through the temperature control device 115, thereby realizing the temperature control of the transparent mold pressing plate 4.
The invention has the beneficial effects that:
according to the invention, the structure of the existing array micro-nano structure processing device of the laser combination pulse sequence is improved, and when the improved array micro-nano structure processing device of the laser combination pulse sequence is used, the light-transmitting mould pressing plate 4 is detachably arranged relative to the upper base 5, so that in the actual working process, when the upper base 5 and the light-transmitting mould pressing plate 4 are singly damaged, only damaged parts need to be replaced, and the effects of energy conservation and environmental protection are achieved; the light-transmitting mould pressing plates 4 with different sizes can be replaced in a detachable mode, so that the equipment is suitable for processing of the surface array micro-nano structures of materials with multiple specifications, and production investment can be greatly reduced.
In the invention, after the light-transmitting mould pressing plate 4 is arranged in the mounting hole 7, the fixing mechanism 8 is adjusted, the light-transmitting mould pressing plate 4 can be locked in the mounting hole 7 by adjusting the fixing mechanism 8, and the fixing mechanism 8 has simple and reasonable structural design and can achieve the effect of simple and easy operation during operation.
The invention adds the combined structure of the positioning block 9 and the positioning groove 10 on the light-transmitting mould pressing plate 4 and the mounting hole 7, and the combined structure can position the light-transmitting mould pressing plate 4 in the mounting hole 7, thereby reducing the adjustment time and simultaneously positioning the light-transmitting mould pressing plate 4 and the mounting hole 7 through the combined structure.
The heat conduction mechanism 11 is arranged for sensing the temperature on the light-transmitting mould pressing plate 4 in real time, so that the effect of intelligent temperature control is achieved, specifically, when the temperature control device 115 senses that the temperature on the light-transmitting mould pressing plate 4 is too high, the laser 2 is controlled to stop working, and through the arrangement of the heat conduction mechanism 11, the effects of energy saving and consumption reduction can be achieved on the premise that the array micro-nano structure processing can be carried out on the surface of a material.
According to the invention, the insulating mechanism 12 is arranged outside the heat conducting mechanism 11, and the insulating mechanism 12 is arranged to realize the heat insulation effect on the heat conducting mechanism 11, specifically, when no heat is generated during non-working on the light-transmitting die pressing plate 4, the insulating mechanism 12 completes sealing on the heat conducting mechanism 11 to isolate the heat from being conducted to the heat conducting mechanism 11, so that the temperature control device 115 is prevented from working, and the working accuracy of the equipment is ensured.
The embodiments of the present invention are disclosed as the preferred embodiments, but not limited thereto, and those skilled in the art can easily understand the spirit of the present invention and make various extensions and changes without departing from the spirit of the present invention.
Claims (8)
1. The utility model provides a laser combination pulse sequence's array micro-nano structure processingequipment, includes support casing (1), its characterized in that, support casing (1) internal fixation and be provided with laser instrument (2), and the downside of laser instrument (2) is equipped with optical path system (3), the lower extreme conflict of optical path system (3) is provided with printing opacity moulded board (4), printing opacity moulded board (4) set up in mounting hole (7), and mounting hole (7) set up on upper base (5), upper base (5) fixed connection is in supporting casing (1), and is provided with fixed establishment (8) on upper base (5) for with printing opacity moulded board (4) dismantled and assembled setting in mounting hole (7).
2. The array micro-nano structure processing device of the laser combination pulse sequence according to claim 1, characterized in that: the fixing mechanism (8) comprises a first screw (81) and a first threaded hole (82), the first screw (81) is in threaded connection with the first threaded hole (82), the first threaded hole (82) is formed in the upper base (5), a rotating plate (88) is fixedly connected to the side wall of the first screw (81), and the rotating plate (88) is movably arranged in a second supporting groove (89) formed in the upper base (5); the first screw (81) is provided with a second threaded hole (84), the second threaded hole (84) is internally threaded and connected with a second screw (83) in an inserting manner, a fixing part is arranged in the first screw (81), the second screw (83) and the rotating plate (88), the fixing part comprises a first supporting ring (85), the inner ring wall of the first supporting ring (85) is provided with a third threaded hole (86), the first supporting ring (85) is sleeved outside the second screw (83) through the third threaded hole (86) in a threaded manner, the first supporting ring (85) is movably arranged in a first supporting groove (87) formed in the first screw (81), the upper end surface of the first supporting ring (85) is fixedly connected with one end of a guide component (813), the other end of the guide component (813) is fixedly connected on the top wall of the first supporting groove (87), the side wall of the first supporting ring (85) is fixedly connected with a supporting plate (811), the supporting plate (811) is movably arranged on the rotating plate (88), the inner supporting groove (811) is movably arranged on the rotating plate (88), the guide component (813) is fixedly connected with a guide rod (812), and the guide rod (813) is abutted against the guide rod (813) and the guide rod (811) is movably arranged on the outer supporting rod (88), and two ends of the guide spring are respectively and fixedly connected to the side wall of the guide rod and the outer side wall of the guide cylinder.
3. The array micro-nano structure processing device of the laser combination pulse sequence according to claim 2, characterized in that: mounting hole (7) are loudspeaker column structure, and the lateral wall of mounting hole (7) has seted up constant head tank (10), it is provided with locating piece (9) to slide in constant head tank (10), and locating piece (9) fixed connection is on the lateral wall of printing opacity moulded board (4).
4. The array micro-nano structure processing device of the laser combination pulse sequence according to claim 3, characterized in that: be provided with heat conduction mechanism (11) in No. two support grooves (89), heat conduction mechanism (11) are including a heat-conducting plate (111) and heat conduction rod (112), the lateral wall fixedly connected with heat conduction rod (112) of a heat-conducting plate (111), and heat conduction rod (112) activity is pegged graft on rotor plate (88), heat conduction rod (112) outer winding is connected with spring (113) No. one, and the both ends of spring (113) fixed connection respectively on the lateral wall of heat conduction rod (112) and the lateral wall of No. three support groove (810), one end fixedly connected with temperature control device (115) that heat conduction rod (112) are located No. three support groove (810), and articulated on the lower terminal surface of heat conduction rod (112) have the one end of push-and-pull rod (114) No. one, the other end of push-and-pull rod (114) articulates on the up end of bearing plate (811).
5. The array micro-nano structure processing device of the laser combination pulse sequence according to claim 2, characterized in that: an insulating mechanism (12) is arranged in the second support groove (89).
6. The array micro-nano structure processing device of the laser combination pulse sequence according to claim 5, characterized in that: the insulation mechanism (12) comprises an insulation sleeve (121), the insulation sleeve (121) is fixedly sleeved outside the heat conducting rod (112), the insulation sleeve (121) is fixedly inserted on the sealed insulation box (122), the sealed insulation box (122) is fixedly sleeved outside the first heat conducting plate (111), one side, away from the first heat conducting plate (111), of the sealed insulation box (122) is fixedly inserted with a second heat conducting plate (123), a partition plate (126) is arranged between the second heat conducting plate (123) and the first heat conducting plate (111), the partition plate (126) is movably inserted on a top plate of the sealed insulation box (122), the lower end of the partition plate (126) is abutted with an arc-shaped heat conducting plate (124), the arc-shaped heat conducting plate (124) is hinged on the inner bottom wall of the sealed insulation box (122), one end of a second spring (125) is fixedly connected on the side wall of the arc-shaped heat conducting plate (124), the other end of the second spring (125) is fixedly connected on the inner bottom wall of the sealed insulation box (122), a connecting component (127) is arranged on the side wall of the partition plate (126), the outer side wall of the second spring (125) is hinged on the outer side wall of the second spring (128), the second spring (125) is hinged on the outer side wall of the second support ring (128), and a push-pull rod (128) is hinged on the support component (128), and the second support ring (128) is hinged on the support ring (128), and a third spring (1210) is wound outside the insulating sleeve (121), and two ends of the third spring (1210) are respectively and fixedly connected to the side wall of the second support ring (129) and the side wall of the insulating sleeve (121).
7. The array micro-nano structure processing device of the laser combination pulse sequence according to claim 6, characterized in that: coupling assembling (127) includes transverse rod and vertical rod, transverse rod fixed connection is on the lateral wall of partition panel (126), and the free end fixed connection of transverse rod has the vertical rod, vertical rod fixed connection is on the up end of sliding block, and the sliding block slides and sets up in the sliding tray that sets up on sealed insulating case (122), the sliding block with No. two push-and-pull rod (128) are connected.
8. The method for processing the array micro-nano structure of the laser combination pulse sequence according to any one of claims 1 to 7, which comprises the following steps:
the method comprises the following steps: aligning the positioning block (9) and the positioning groove (10), and installing the light-transmitting die pressing plate (4) in the installation hole (7);
step two: screwing the first screw (81), wherein the first screw (81) can drive the rotating plate (88) to rotate, so that the rotating plate (88) moves to the position under the positioning block (9);
step three: screwing the second screw (83), wherein the bearing plate (811) moves upwards by the movement of the second screw (83), and the contact column (812) moves out of the rotating plate (88) by the upward movement of the bearing plate (811) and completes the contact on the positioning block (9), so that the light-transmitting die pressing plate (4) is fixed in the mounting hole (7);
step four: when the first heat conducting plate (111) moves outwards to the rotating plate (88), the arc-shaped heat conducting plate (124) is pulled by the second spring (125) to rotate anticlockwise, so that the first heat conducting plate (111) is communicated with the second heat conducting plate (123) to complete heat conduction;
step five: the upward movement of the supporting plate (811) can drive the first heat conducting plate (111) to move towards the outside of the rotating plate (88) to contact the light-transmitting mould pressing plate (4) to finish the temperature conduction, and the temperature is sensed through the temperature control device (115) to realize the temperature control of the light-transmitting mould pressing plate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211071951.9A CN115416275B (en) | 2022-09-02 | 2022-09-02 | Array micro-nano structure processing device and method for laser combined pulse sequence |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211071951.9A CN115416275B (en) | 2022-09-02 | 2022-09-02 | Array micro-nano structure processing device and method for laser combined pulse sequence |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115416275A true CN115416275A (en) | 2022-12-02 |
| CN115416275B CN115416275B (en) | 2023-08-18 |
Family
ID=84203011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211071951.9A Active CN115416275B (en) | 2022-09-02 | 2022-09-02 | Array micro-nano structure processing device and method for laser combined pulse sequence |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115416275B (en) |
Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007205360A (en) * | 2007-05-15 | 2007-08-16 | Ebara Corp | Centrifugal pump |
| CN101495292A (en) * | 2006-08-03 | 2009-07-29 | 旭硝子株式会社 | Process for producing mold |
| TW201124256A (en) * | 2010-01-07 | 2011-07-16 | Richell Corp | Mold for and method of manufacturing small components |
| CN102962583A (en) * | 2012-11-28 | 2013-03-13 | 江苏大学 | Method and device for forming plastic part microstructure based on laser heating |
| US20130148925A1 (en) * | 2011-12-09 | 2013-06-13 | Martin H. Muendel | Varying beam parameter product of a laser beam |
| WO2013162351A1 (en) * | 2012-04-23 | 2013-10-31 | Fook Khean Wong | Safety power socket |
| CN107877010A (en) * | 2017-12-15 | 2018-04-06 | 广东工业大学 | A kind of processing unit (plant) of micro-nano hole array |
| CN108162375A (en) * | 2017-12-26 | 2018-06-15 | 伯奈聚合材料盐城有限公司 | A kind of plastic material embossing device |
| CN207705496U (en) * | 2018-01-12 | 2018-08-07 | 广州东威自动化技术有限公司 | A kind of control coordination system device of unified monitoring and communication |
| CN108501361A (en) * | 2017-02-28 | 2018-09-07 | 香港理工大学 | Nano-micro structure part rapid molding device and quick molding method |
| CN108724343A (en) * | 2018-08-06 | 2018-11-02 | 德清信佑易汽车配件有限公司 | A kind of tyre patch cutting tool |
| CN109846066A (en) * | 2019-03-13 | 2019-06-07 | 倪晋挺 | A kind of more pattern compacting composable molds |
| CN110744755A (en) * | 2019-10-25 | 2020-02-04 | 山东大学 | Three-module composite function micro-nano imprinting experiment system and method |
| CN111352485A (en) * | 2020-03-25 | 2020-06-30 | 漳州麻吉网络信息服务有限公司 | Signal transmission device based on internet of things |
| CN111359284A (en) * | 2020-03-30 | 2020-07-03 | 安徽东旭大别山农业科技有限公司 | Filter equipment in camellia edible oil production process |
| CN111977306A (en) * | 2020-08-12 | 2020-11-24 | 马鞍山铭成科技信息咨询有限公司 | Chain material conveying platform that stability is high |
| CN212410650U (en) * | 2020-08-17 | 2021-01-26 | 容泰半导体(江苏)有限公司 | Novel integrated circuit frock clamp |
| CN112296685A (en) * | 2020-03-02 | 2021-02-02 | 周云飞 | Automatic surface polishing and efficient drilling device for automobile brake disc |
| CN112428345A (en) * | 2020-11-04 | 2021-03-02 | 合肥酷显智能科技有限公司 | Perforating device is used in electronic device chip production and processing |
| CN112731613A (en) * | 2020-12-30 | 2021-04-30 | 福建省腾恒光电有限公司 | Optical lens assembly convenient for adjusting distance |
| CN112811795A (en) * | 2021-01-07 | 2021-05-18 | 长春理工大学 | Laser heating micro-nano photonics device mould pressing processing device and method |
| CN213263221U (en) * | 2020-09-03 | 2021-05-25 | 苏州亚昌电气科技有限公司 | Coding strip-sticking device for boiler control disc |
| CN113400632A (en) * | 2021-06-30 | 2021-09-17 | 深圳大学 | Hot stamping device and hot stamping method |
| CN215294723U (en) * | 2021-06-17 | 2021-12-24 | 安徽兆利光电科技有限公司 | Ceiling lamp convenient to installation |
-
2022
- 2022-09-02 CN CN202211071951.9A patent/CN115416275B/en active Active
Patent Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101495292A (en) * | 2006-08-03 | 2009-07-29 | 旭硝子株式会社 | Process for producing mold |
| JP2007205360A (en) * | 2007-05-15 | 2007-08-16 | Ebara Corp | Centrifugal pump |
| TW201124256A (en) * | 2010-01-07 | 2011-07-16 | Richell Corp | Mold for and method of manufacturing small components |
| US20130148925A1 (en) * | 2011-12-09 | 2013-06-13 | Martin H. Muendel | Varying beam parameter product of a laser beam |
| WO2013162351A1 (en) * | 2012-04-23 | 2013-10-31 | Fook Khean Wong | Safety power socket |
| CN102962583A (en) * | 2012-11-28 | 2013-03-13 | 江苏大学 | Method and device for forming plastic part microstructure based on laser heating |
| CN108501361A (en) * | 2017-02-28 | 2018-09-07 | 香港理工大学 | Nano-micro structure part rapid molding device and quick molding method |
| CN107877010A (en) * | 2017-12-15 | 2018-04-06 | 广东工业大学 | A kind of processing unit (plant) of micro-nano hole array |
| CN108162375A (en) * | 2017-12-26 | 2018-06-15 | 伯奈聚合材料盐城有限公司 | A kind of plastic material embossing device |
| CN207705496U (en) * | 2018-01-12 | 2018-08-07 | 广州东威自动化技术有限公司 | A kind of control coordination system device of unified monitoring and communication |
| CN108724343A (en) * | 2018-08-06 | 2018-11-02 | 德清信佑易汽车配件有限公司 | A kind of tyre patch cutting tool |
| CN109846066A (en) * | 2019-03-13 | 2019-06-07 | 倪晋挺 | A kind of more pattern compacting composable molds |
| CN110744755A (en) * | 2019-10-25 | 2020-02-04 | 山东大学 | Three-module composite function micro-nano imprinting experiment system and method |
| CN112296685A (en) * | 2020-03-02 | 2021-02-02 | 周云飞 | Automatic surface polishing and efficient drilling device for automobile brake disc |
| CN111352485A (en) * | 2020-03-25 | 2020-06-30 | 漳州麻吉网络信息服务有限公司 | Signal transmission device based on internet of things |
| CN111359284A (en) * | 2020-03-30 | 2020-07-03 | 安徽东旭大别山农业科技有限公司 | Filter equipment in camellia edible oil production process |
| CN111977306A (en) * | 2020-08-12 | 2020-11-24 | 马鞍山铭成科技信息咨询有限公司 | Chain material conveying platform that stability is high |
| CN212410650U (en) * | 2020-08-17 | 2021-01-26 | 容泰半导体(江苏)有限公司 | Novel integrated circuit frock clamp |
| CN213263221U (en) * | 2020-09-03 | 2021-05-25 | 苏州亚昌电气科技有限公司 | Coding strip-sticking device for boiler control disc |
| CN112428345A (en) * | 2020-11-04 | 2021-03-02 | 合肥酷显智能科技有限公司 | Perforating device is used in electronic device chip production and processing |
| CN112731613A (en) * | 2020-12-30 | 2021-04-30 | 福建省腾恒光电有限公司 | Optical lens assembly convenient for adjusting distance |
| CN112811795A (en) * | 2021-01-07 | 2021-05-18 | 长春理工大学 | Laser heating micro-nano photonics device mould pressing processing device and method |
| CN215294723U (en) * | 2021-06-17 | 2021-12-24 | 安徽兆利光电科技有限公司 | Ceiling lamp convenient to installation |
| CN113400632A (en) * | 2021-06-30 | 2021-09-17 | 深圳大学 | Hot stamping device and hot stamping method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115416275B (en) | 2023-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102716964B (en) | Metal vibration film forming equipment | |
| CN115416275A (en) | Array micro-nano structure processing device and method of laser combination pulse sequence | |
| CN219416272U (en) | Wireless intelligent monitoring station | |
| CN219074994U (en) | General clamping and positioning mechanism for cutting battery cell electrode lugs | |
| CN214294401U (en) | Inserted injection-blow mould | |
| CN201366789Y (en) | Integrated circuit element packing tube extrusion die | |
| CN101340467A (en) | Mobile phone, mobile phone panel and manufacturing method thereof | |
| CN210291328U (en) | Intelligent high-speed infrared ball camera | |
| CN215818872U (en) | Storage constant temperature controller | |
| CN201876812U (en) | Film with bulge for computer keyboard | |
| CN214078822U (en) | Automobile exhaust gas recirculation valve machining die | |
| CN215242339U (en) | Extrusion die is used in production of PC board | |
| CN213137524U (en) | Durable long-life UV transparent tile production heat forming mechanism | |
| CN213766398U (en) | Cement constant temperature standard curing box | |
| CN212707778U (en) | High-precision positioning device for injection mold | |
| CN217332938U (en) | Optical splitter box | |
| CN220720112U (en) | Silica gel mold convenient to demolding | |
| CN220823001U (en) | Solar frame assembly | |
| CN216068458U (en) | Module locking device for injection molding combined die | |
| CN220245902U (en) | Precise aspherical glass lens molding device | |
| CN217142222U (en) | Universal cylinder fixing device for hot core box | |
| CN220178006U (en) | Efficient special-shaped necking machine | |
| CN212408516U (en) | Municipal administration environmental protection lighting apparatus for energy saving | |
| CN217018546U (en) | Die-casting forming die for metal hardware processing | |
| CN218603573U (en) | Fast assembly's switch structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Chengyong Inventor before: Wang Chengyong Inventor before: Wang Hongjian Inventor before: Lin Huatai |
|
| CB03 | Change of inventor or designer information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |