CN115407850A - Double-reflux heat pipe radiator - Google Patents

Abstract

The invention discloses a double-reflux heat pipe radiator, which belongs to the technical field of radiators and comprises the following components: the heat exchanger comprises a first heat transfer part, a first circulation loop, a second heat transfer part, a second circulation loop and a heat dissipation fan. The first heat transfer portion has a fluid receiving cavity formed therein, and the first circulation circuit communicates with the cavity inside the first heat transfer portion. The second heat transfer portion is disposed above the first heat transfer portion, a fluid accommodating cavity independent from the first heat transfer portion is formed in the second heat transfer portion, and the second circulation loop is communicated with the cavity in the second heat transfer portion. The heat dissipation fan is arranged above the second heat transfer part, and after heat is transferred to the second heat transfer part from the first heat transfer part, the heat dissipation fan carries out air cooling heat dissipation. The invention solves the technical problem of poor heat dissipation effect of the heat radiator in the prior art.

Description

Double-reflux heat pipe radiator

Technical Field

The invention relates to the technical field of radiators, in particular to a double-reflux heat pipe radiator.

Background

In the DIY field of computer accessories, water cooling is always the first choice for configuring a computer for high-end feisters, compared with air cooling, the water cooling has a good heat dissipation effect on CPU over frequency, a traditional water cooling radiator comprises a water cooling bar, a cold head and a water pump, the water cooling bar is installed on a computer case, and the cold head is connected with the CPU and absorbs heat generated by the CPU.

The traditional water pump installation mode of the water-cooling radiator mainly comprises the following four modes: the water pump is integrated into the cold head, and the internal space of the cold head integrated with the water pump is limited, so that only a miniature water pump with lower power can be used, and the water pump lift of the water-cooled radiator is insufficient, and the heat dissipation efficiency is far lower than that of a split water-cooled radiator with the water pump and the water-cooled head independent; secondly, the water pump is integrated on the water pipe, and the situation that the lift of the water pump is insufficient exists in the mode; thirdly, the water pump is integrated on the water cooling bar, so that the water pump and the water cooling bar form an integrated structure, the structure of the water cooling bar is complex due to the mode, the risk of leakage of water cooling liquid is higher, the production cost is higher than that of a water cooling radiator in other modes, and when the water pump cannot work normally, the whole water cooling bar needs to be replaced, so that the use cost of a customer is overhigh; and the water pump, the cold head and the cold discharge of the water-cooled radiator are connected through water pipes and are independent from each other, the heat dissipation efficiency is the highest among all types of water-cooled radiators, but the production cost is also the highest, and in addition, as the split water-cooled components are numerous and the installation mode is complex, a huge installation space is needed, a user needs to spend more funds to purchase a large-scale high-end case, and as pipelines are numerous, the problem of leakage of water-cooled liquid is easy to occur.

Based on this, chinese patent CN114047811A discloses a water-cooling radiator, and it includes cold head, water-cooling row and water pump, the water-cooling row includes cold row body, fan assembly and fan lid, the cold row body is equipped with radiating area and water pump installing zone, the upside of radiating area is located to the fan assembly, the concave lower mounting groove that corresponds with the shape of water pump that is equipped with of upper surface of water pump installing zone, lower mounting groove and fan assembly are located same one side of cold row body, the water pump is removable locates down in the mounting groove, the removable lid of fan lid is located on the cold row body, the fan shelters from the outside that district and water pump sheltered from the district and cover respectively and locate fan assembly and water pump, the water pump is connected with the cold head through first hose, the cold head passes through the second hose and is connected with the cold row body. The water pump installation area is arranged on the cold drainage body, and the water pump is detachably fixed on the cold drainage body, so that only the water cold drainage and the cold head need to be respectively fixed during installation; meanwhile, the water pump can be conveniently replaced when the water pump cannot work normally.

However, although the above-mentioned water-cooled heat sink can reduce the cost of users, it can still improve the heat dissipation effect. Specifically, the above-mentioned disclosed water-cooling radiator is through setting up the water pump installing zone on the cold row body to accessible fan cover fixes the water pump on the cold row body, thereby only need fix respectively water-cooling row and cold head when the installation, convenience simple to use. In addition, the water pump can select a high-power water pump component as a split type water-cooled radiator, and compared with a water pump and cold head integrated water-cooled radiator, a water pump and water pipe integrated water-cooled radiator and a water pump and water cooling drainage integrated water-cooled radiator, the independent water pump arranged on the water pump can provide a larger lift for the water-cooled radiator, and the heat dissipation efficiency is greatly improved. Meanwhile, the internal structure of the water cooling radiator does not need to be changed, so that the complexity of the water cooling radiator is reduced, and the production cost of an enterprise is reduced; when the water pump can not work normally, the water pump can be replaced conveniently, and the space required by installation is not increased, so that a user does not need to purchase a larger machine case to reduce the use cost of the machine case. However, the core performance of the radiator is the heat dissipation effect, and the heat dissipation efficiency can be further improved by optimizing the structural arrangement of the heat transfer component while the heat dissipation fan is added.

Disclosure of Invention

Accordingly, a need exists to provide a dual-reflow heat pipe heat sink for solving the technical problem of poor heat dissipation effect of the heat sink in the prior art.

A dual-reflow heat pipe heat sink, comprising: the heat exchanger comprises a first heat transfer part, a first circulation loop, a second heat transfer part, a second circulation loop and a heat radiation fan. The first heat transfer portion has a fluid receiving cavity formed therein, and the first circulation circuit communicates with the cavity inside the first heat transfer portion. The second heat transfer portion is disposed above the first heat transfer portion, a fluid accommodating cavity independent of the first heat transfer portion is formed inside the second heat transfer portion, and the second circulation loop is communicated with the cavity inside the second heat transfer portion. The heat dissipation fan is arranged above the second heat transfer part, and after heat is transferred to the second heat transfer part from the first heat transfer part, the heat dissipation fan carries out air cooling heat dissipation.

Further, the first circulation loop has a first fluid inlet, a first inflow line, a first fluid outlet, and a first outflow line.

Furthermore, the first fluid inlet is movably connected with the first inflow pipeline.

Furthermore, the first fluid outlet is movably connected with the first outflow pipeline.

Furthermore, the first fluid inlet and the first fluid outlet are respectively disposed at two sides of the first heat transfer portion.

Further, the second circulation loop has a second fluid inlet, a second inflow line, a second fluid outlet, and a second outflow line.

Furthermore, the second fluid inlet is movably connected with the second inflow pipeline.

Furthermore, the second fluid outlet is movably connected with the second outflow pipeline.

Furthermore, the second fluid inlet and the second fluid outlet are respectively disposed at two sides of the second heat transfer portion.

Furthermore, an auxiliary heat dissipation part is arranged between the heat dissipation fan and the second heat transfer part; the auxiliary heat dissipation part is respectively connected with the second heat transfer part and the heat dissipation fan, and a plurality of heat dissipation fins are uniformly distributed in the auxiliary heat dissipation part.

In summary, the dual-reflux heat pipe radiator of the present invention is respectively provided with a first heat transfer portion, a first circulation loop, a second heat transfer portion, a second circulation loop and a heat dissipation fan; the first heat transfer part, the second heat transfer part and the heat dissipation fan are sequentially stacked, and the first heat transfer part and the second heat transfer part respectively form mutually independent fluid accommodating cavities inside; then the first circulation loop and the second circulation loop are respectively communicated with a fluid containing cavity; the fluid which is injected in advance in the fluid containing cavity can circularly flow between the first circulation loop and the second circulation loop; thereby, first heat transfer portion can carry out preliminary heat absorption cooling to the external heat source, then, makes again second heat transfer portion is right first heat transfer portion carries out heat absorption cooling once more, and finally, makes again cooling fan is right second heat transfer portion dispels the heat the cooling to this calorific capacity that can the effective control external heat source. Therefore, the double-reflux heat pipe radiator solves the technical problem of poor radiating effect of the radiator in the prior art.

Drawings

FIG. 1 is a schematic structural diagram of a dual-reflow heat pipe heat sink according to the present invention;

fig. 2 is a schematic structural view of a dual-reflow heat pipe radiator in another direction according to the present invention.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will recognize without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being permanently connected, detachably connected, or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1 to 2, a dual-reflow heat pipe heat sink of the present invention includes: a first heat transfer part 1, a first circulation circuit 2, a second heat transfer part 3, a second circulation circuit 4, and a heat radiation fan 5. A fluid accommodating cavity is formed inside the first heat transfer part 1, and the first circulation loop 2 communicates with the cavity inside the first heat transfer part 1. The second heat transfer portion 3 is disposed above the first heat transfer portion 1, and a fluid receiving cavity independent from the first heat transfer portion 1 is formed inside the second heat transfer portion 3, and the second circulation circuit 4 communicates with the cavity inside the second heat transfer portion 3. The heat dissipation fan 5 is disposed above the second heat transfer portion 3, and after the heat is transferred from the first heat transfer portion 1 to the second heat transfer portion 3, the heat is dissipated by air cooling by the heat dissipation fan 5.

Specifically, the first heat transfer portion 1 may be connected to an external heat source to be cooled, so that heat of the external heat source may be transferred to the inside of the first heat transfer portion 1. Thereafter, the fluid injected in advance in the fluid accommodating cavity formed inside the first heat transfer part 1 may absorb heat, and the fluid after temperature rise may be carried away from the inside of the first heat transfer part 1 by the first circulation circuit 2, and the first circulation circuit 2 injects the external cryogenic fluid into the inside of the first heat transfer part 1 again. Specifically, the temperature of the fluid is gradually increased in the process of the circulation alternating flow of the fluid in the first circulation loop 2 and the first heat transfer part 1, so that the heat absorption efficiency of the fluid is affected; at this time, the heat causing the additional temperature rise is continuously transferred from the first heat transfer portion 1 to the second heat transfer portion 3 and absorbed by the fluid previously injected in the fluid receiving cavity inside the second heat transfer portion 3; similarly, the fluid after the temperature rise is carried away from the second heat transfer portion 3 by the second circulation circuit 2; at the same time, the second circulation circuit 2 injects a low-temperature fluid into the second heat transfer portion 3. That is, the fluid in each of the first heat transfer portion 1 and the second heat transfer portion 3 can be circulated by the first circulation circuit 2 and the second circulation circuit 4 corresponding to the two portions. Then, the cooling fan 5 disposed above the second heat transfer portion 3 performs air cooling and cooling. Therefore, the heat dissipation and temperature control can be effectively carried out on an external heat source.

Further, the first circulation loop 2 has a first fluid inlet 201, a first inflow pipe 202, a first fluid outlet 203, and a first outflow pipe 204. The first fluid inlet 201 is movably connected with the first inflow pipeline 202; the first fluid outlet 203 is movably connected with the first outflow pipeline 204; the first fluid inlet 201 and the first fluid outlet 203 are respectively disposed at both sides of the first heat transfer part 1. Specifically, the first circulation loop 2 is respectively provided with the first fluid inlet 201 and the first fluid outlet 203 on two sides of the first heat transfer portion 1, so as to guide the fluid inside the first heat transfer portion 1 to circulate. In addition, the first inflow pipeline 202 and the first outflow pipeline 204 are movably connected with the first fluid inlet 201 and the first fluid outlet 203, respectively, so that a user can replace different types of external circulation pipelines quickly.

Similarly, the second circulation circuit 4 has a second fluid inlet 401, a second inflow line 404, a second fluid outlet 403, and a second outflow line 404. The second fluid inlet 401 is movably connected with the second inflow pipeline 404; the second fluid outlet 403 is movably connected with the second outflow pipeline 404; the second fluid inlet 401 and the second fluid outlet 403 are disposed on both sides of the second heat transfer portion 1, respectively. Specifically, the second circulation circuit 4 is provided with the second fluid inlet 401 and the second fluid outlet 403 on both sides of the second heat transfer portion 1, respectively, so as to guide the fluid inside the second heat transfer portion 1 to circulate. In addition, the second inflow pipeline 404 and the second outflow pipeline 404 are movably connected with the second fluid inlet 401 and the second fluid outlet 403 respectively, so that a user can replace different types of external circulation pipelines quickly

Further, an auxiliary heat dissipation part 6 is arranged between the heat dissipation fan 5 and the second heat transfer part 3; the auxiliary heat dissipation part 6 is respectively connected with the second heat transfer part 3 and the heat dissipation fan 5, and a plurality of heat dissipation fins are uniformly distributed in the auxiliary heat dissipation part 6. Specifically, in order to improve the air supply effect of the heat dissipation fan 5, a plurality of heat dissipation fins and further the auxiliary heat dissipation portion 6 may be disposed between the second heat transfer portion 3 and the heat dissipation fan 5, so that a heat transfer buffer layer is formed between the second heat transfer portion 3 and the heat dissipation fan 5, and at the same time, the heat dissipation fan 5 can form an effective heat dissipation air duct, thereby cooling the second heat transfer portion 3 by air cooling.

In summary, the dual-backflow heat pipe radiator of the present invention is respectively provided with a first heat transfer portion 1, a first circulation loop 2, a second heat transfer portion 3, a second circulation loop 4 and a heat dissipation fan 5; the first heat transfer part 1, the second heat transfer part 3 and the heat dissipation fan 5 are sequentially stacked, and the first heat transfer part 1 and the second heat transfer part 3 respectively form mutually independent fluid accommodating cavities inside; then the first circulation loop 2 and the second circulation loop 4 are respectively communicated with a fluid containing cavity; the fluid which is injected in advance in the fluid containing cavity can circularly flow between the first circulation loop 2 or the second circulation loop 4; thereby, first heat transfer portion 1 can carry out preliminary heat absorption cooling to the external heat source, then makes second heat transfer portion 3 is right first heat transfer portion 1 carries out heat absorption cooling once more, finally makes again cooling fan 5 is right second heat transfer portion 3 carries out the heat dissipation cooling to this calorific capacity that can effectively control the external heat source. Therefore, the double-reflux heat pipe radiator solves the technical problem of poor radiating effect of the radiator in the prior art.

All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is specific and detailed, but not to be understood as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A double-reflux heat pipe radiator is characterized by comprising: a first heat transfer part (1), a first circulation circuit (2), a second heat transfer part (3), a second circulation circuit (4) and a heat radiation fan (5); a fluid containing cavity is formed inside the first heat transfer part (1), and the first circulation loop (2) is communicated with the cavity inside the first heat transfer part (1); the second heat transfer part (3) is arranged above the first heat transfer part (1), a fluid accommodating cavity independent of the first heat transfer part (1) is formed inside the second heat transfer part (3), and the second circulation loop (4) is communicated with the cavity inside the second heat transfer part (3); the heat dissipation fan (5) is arranged above the second heat transfer part (3), and after heat is transferred to the second heat transfer part (3) from the first heat transfer part (1), air cooling heat dissipation is carried out by the heat dissipation fan (5).

2. A dual-reflow heat pipe heat sink in accordance with claim 1, wherein: the first circulation circuit (2) has a first fluid inlet (201), a first inflow line (202), a first fluid outlet (203) and a first outflow line (204).

3. A dual-reflow heat pipe heat sink in accordance with claim 2, wherein: the first fluid inlet (201) is movably connected with the first inflow pipeline (202).

4. A dual-reflow heat pipe heat sink in accordance with claim 3, wherein: the first fluid outlet (203) is movably connected with the first outflow pipeline (204).

5. The dual-reflow heat pipe heat sink of claim 4, wherein: the first fluid inlet (201) and the first fluid outlet (203) are respectively arranged at two sides of the first heat transfer part (1).

6. A dual-reflow heat pipe heat sink in accordance with claim 5, wherein: the second circuit (4) has a second fluid inlet (401), a second inflow line (404), a second fluid outlet (403), and a second outflow line (404).

7. A dual-return heatpipe heatsink as claimed in claim 6, wherein: the second fluid inlet (401) is movably connected with the second inflow pipeline (404).

8. A dual-return heatpipe heatsink as claimed in claim 7, wherein: the second fluid outlet (403) is movably connected with the second outflow pipeline (404).

9. A dual-return heatpipe heatsink as claimed in claim 8, wherein: the second fluid inlet (401) and the second fluid outlet (403) are respectively disposed on both sides of the second heat transfer portion (1).

10. A dual-return heatpipe heatsink as claimed in claim 9, wherein: an auxiliary heat dissipation part (6) is arranged between the heat dissipation fan (5) and the second heat transfer part (3); the auxiliary heat dissipation part (6) is respectively connected with the second heat transfer part (3) and the heat dissipation fan (5), and a plurality of heat dissipation fins are uniformly distributed in the auxiliary heat dissipation part (6).

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