CN115388938A - Temperature and pressure sensor - Google Patents

Temperature and pressure sensor Download PDF

Info

Publication number
CN115388938A
CN115388938A CN202210824998.1A CN202210824998A CN115388938A CN 115388938 A CN115388938 A CN 115388938A CN 202210824998 A CN202210824998 A CN 202210824998A CN 115388938 A CN115388938 A CN 115388938A
Authority
CN
China
Prior art keywords
temperature
cover plate
diaphragm
pressure sensor
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210824998.1A
Other languages
Chinese (zh)
Inventor
李勇
陈兴宇
许洋溢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China Railway Wuhan Technology Co ltd
Original Assignee
China Railway Wuhan Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China Railway Wuhan Technology Co ltd filed Critical China Railway Wuhan Technology Co ltd
Priority to CN202210824998.1A priority Critical patent/CN115388938A/en
Publication of CN115388938A publication Critical patent/CN115388938A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00Measuring or testing not otherwise provided for
    • G01D21/02Measuring two or more variables by means not covered by a single other subclass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24Housings ; Casings for instruments
    • G01D11/245Housings for sensors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24Housings ; Casings for instruments
    • G01D11/26Windows; Cover glasses; Sealings therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The invention provides a temperature and pressure sensor, comprising: the temperature probe is located at one end of the shell, the temperature pressure sensor core is located at the middle of the shell, the temperature probe is connected with the temperature pressure sensor core, and the temperature pressure sensor core is connected with the conditioning circuit. The temperature probe is used for collecting temperature variation values, the temperature and pressure sensor core is used for collecting pressure variation values, the data of the temperature probe is connected to the conditioning circuit, the conditioning circuit plays a role in signal processing and feedback, pressure testing and temperature testing are integrated in the same sensor, pressure of gas and liquid can be tested during temperature detection, the structure is simplified, the installation space of a client side is reduced, and the purchase cost of products is reduced.

Description

Temperature and pressure sensor
Technical Field
The invention relates to the technical field of sensors, in particular to a temperature and pressure sensor.
Background
With the rapid development of science and technology, the application range of the sensor is increasingly wide, in the sensor in the prior art, generally, each type of sensor (pressure sensor or temperature sensor) can only detect one type (pressure or temperature), and for the situation that multiple types of sensors are required to detect simultaneously, multiple different types of sensors are required to be arranged to detect, the space occupancy rate of the multiple types of sensors is large, and the structure is complex.
Disclosure of Invention
The invention aims to solve the technical problem of providing a temperature and pressure sensor aiming at the defects of the prior art.
The technical scheme for solving the technical problems is as follows: a warm-pressure sensor comprising: the temperature probe is located at one end of the shell, the temperature pressure sensor core is located at the middle of the shell, the temperature probe is connected with the temperature pressure sensor core, and the temperature pressure sensor core is connected with the conditioning circuit.
The technical scheme adopted by the invention has the beneficial effects that: the temperature probe is used for collecting temperature change values, the temperature and pressure sensor core is used for collecting pressure change values, the data of the temperature probe is connected to the conditioning circuit, the conditioning circuit performs signal processing and feedback, and the shell is used for client connection and internal part assembly protection, so that protection and installation effects are achieved. Pressure test and temperature test are integrated in the same sensor, the pressure of gas and liquid can be tested at the same time of temperature detection, the structure is simplified, the installation space of a client is reduced, and the purchase cost of products is reduced.
Further, a connector is mounted at the other end of the housing.
The beneficial effect of adopting the further technical scheme is that: the connector is used for connecting an external client side, plays a role in installation, facilitates installation and maintenance of the sensor, improves installation efficiency and reduces cost.
Further, a sealing ring is arranged between the temperature and pressure sensor core body and the temperature probe.
The beneficial effect of adopting the further technical scheme is that: the sealing ring plays a role in sealing, the sealing performance is improved, and the stability and the reliability of the sensor are improved.
Furthermore, a shell thread is arranged on the outer side wall of one end of the shell.
The beneficial effect of adopting the further technical scheme is that: the setting of shell screw thread, the installation and the maintenance of the shell of being convenient for improve the stability and the reliability of sensor.
Furthermore, one end of the shell is provided with a first cavity, the middle part of the shell is provided with a second cavity, the first cavity is communicated with the second cavity, one end of the temperature probe is positioned in the first cavity, the other end of the temperature probe is positioned in the second cavity, and the second end of the temperature probe is connected with the temperature and pressure sensor core body.
The beneficial effect of adopting the further technical scheme is that: the arrangement of cavity is convenient for installation and maintenance of sensor internal elements, improves the stability and the reliability of sensor. One end of the temperature probe is positioned in the first cavity, and the temperature probe is protected.
Further, a boss is arranged between the first cavity and the second cavity, and a gap is arranged between the boss and the side wall of the temperature probe.
The beneficial effect of adopting the further technical scheme is that: the arrangement of the lug boss improves the load intensity of the shell. The gap is arranged so that pressure can act on the diaphragm of the temperature and pressure sensor core.
Further, the warm-pressing sensor core and the conditioning circuit are located in the second cavity, and the warm-pressing sensor core is located between the conditioning circuit and the temperature probe.
The beneficial effect of adopting the further technical scheme is that: the conditioning circuit is used for converting the collected temperature and pressure signals into back-end identifiable signals.
Further, the temperature and pressure sensor core comprises: the temperature sensor comprises a cover plate, a diaphragm, a cover plate electrode line with a temperature acquisition function and a diaphragm electrode, wherein the cover plate electrode line is printed on the cover plate, the diaphragm electrode is printed on the diaphragm, the diaphragm is installed in the cover plate, and the temperature probe and the conditioning circuit are connected with the cover plate electrode line.
The beneficial effect of adopting the further technical scheme is that: the cover plate electrode circuit on the cover plate and the diaphragm electrode on the diaphragm form a capacitance structure, and when the diaphragm deforms under stress, the capacitance value changes, so that pressure measurement is realized. Pressure test and temperature test are integrated in the same core body, the pressure of gas and liquid can be tested at the same time of temperature detection, the structure is simplified, the installation space of a client is reduced, and the product purchase cost is reduced.
Furthermore, a gap is formed between the cover plate electrode circuit and the diaphragm electrode, and the diaphragm electrode and the cover plate electrode circuit are correspondingly arranged; the cover plate is a ceramic cover plate, and the diaphragm is a ceramic diaphragm; the cover plate is provided with a plurality of first windows convenient for transmission of temperature signals and pressure signals, a first temperature signal connector and a pressure signal connector are installed in the first windows, and the conditioning circuit is connected with the cover plate electrode circuit through the first temperature signal connector and the pressure signal connector; the diaphragm is provided with a pair of second windows which are convenient for the signal transmission of the temperature probe and the conditioning circuit, a second temperature signal connector is installed in the second window, and the temperature probe is connected with the cover plate electrode circuit through the second temperature signal connector.
The beneficial effect of adopting the further technical scheme is that: a gap is formed between the cover plate electrode circuit and the diaphragm electrode, so that the cover plate electrode circuit on the cover plate and the diaphragm electrode on the diaphragm form a capacitance structure, and when the diaphragm is stressed and deformed, the capacitance value changes, and pressure measurement is realized. The diaphragm electrode and the cover plate electrode circuit are correspondingly arranged, so that pressure testing and temperature testing are integrated in the same core body, the pressure of gas and liquid can be tested at the same time of temperature detection, the structure is simplified, the installation space of a client is reduced, and the product purchase cost is reduced. The cover plate is a ceramic cover plate, the diaphragm is a ceramic diaphragm, the installation and the maintenance of the core structure are facilitated, the core sensitivity is improved, the detection precision is improved, and the cost is reduced. The arrangement of the first window facilitates installation and maintenance of the first temperature signal connector and the pressure signal connector, and facilitates connection of the core inner element and the core outer element. The second window is arranged, so that the second temperature signal connector can be conveniently installed and maintained, the core body internal element can be conveniently connected with the temperature probe, and the temperature probe and the conditioning circuit can be conveniently subjected to signal transmission.
Furthermore, the cover plate is provided with first glass, the diaphragm is provided with second glass, the electrode circuit of the cover plate is positioned between the first glass and the cover plate, the diaphragm electrode is positioned between the second glass and the diaphragm, and the middle of the cover plate is provided with a counter bore.
The beneficial effect of adopting the further technical scheme is that: the arrangement of the glass facilitates the installation and maintenance of the cover plate and the diaphragm, prevents the damage of an electrode circuit of the cover plate and an electrode of the diaphragm, and improves the insulating property. The counter bore is used as a positioning reference during mold opening, and production is facilitated. The stability and the reliability of core are improved, and the detection precision is improved.
Advantages of additional aspects of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a schematic structural diagram of a sensor according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a cover plate according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a cover plate electrode circuit according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a cover plate electrode circuit and a cover plate assembly according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a first glass according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a combination of a first glass and a cover plate according to an embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a diaphragm according to an embodiment of the present invention.
Fig. 8 is a schematic structural diagram of a diaphragm electrode according to an embodiment of the present invention.
Fig. 9 is a schematic structural diagram of a combination of a diaphragm electrode and a diaphragm according to an embodiment of the present invention.
Fig. 10 is a schematic structural view of a second glass according to an embodiment of the present invention.
Fig. 11 is a schematic structural diagram of a second glass and membrane combination according to an embodiment of the present invention.
Fig. 12 is a schematic structural diagram of a core according to an embodiment of the present invention.
Fig. 13 is a second schematic structural diagram of a core according to an embodiment of the present invention.
The reference numbers illustrate: 1. a cover plate; 2. a membrane; 3. a cover plate electrode line; 4. a membrane electrode; 5. a first glass; 6. a second glass; 7. a first positioning groove; 8. a second positioning groove; 9. a first window; 10. a first temperature signal connector; 11. a pressure signal connector; 12. a second window; 13. a second temperature signal connector; 14. a counter bore; 15. a housing; 16. a temperature probe; 17. a temperature and pressure sensor core; 18. a conditioning circuit; 19. a connector; 20. a seal ring; 21. housing threads; 22. a first cavity; 23. a second cavity; 24. a boss; 25. a gap.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1, an embodiment of the present invention provides a temperature and pressure sensor, including: the temperature probe 16, the temperature pressure sensor core 17 and the conditioning circuit 18 are all installed in the shell 15, the temperature probe 16 is located at one end of the shell 15, the temperature pressure sensor core 17 and the conditioning circuit 18 are located in the middle of the shell 15, the temperature probe 16 is connected with the temperature pressure sensor core 17, and the temperature pressure sensor core 17 is connected with the conditioning circuit 18.
The technical scheme adopted by the invention has the beneficial effects that: the temperature probe is used for collecting temperature change values, the temperature and pressure sensor core is used for collecting pressure change values, the data of the temperature probe is connected to the conditioning circuit, the conditioning circuit plays a role in signal processing and feedback, and the shell is used for connecting a client and assembling and protecting internal parts, so that the protection and installation effects are achieved. Pressure test and temperature test are integrated in the same sensor, the pressure of gas and liquid can be tested at the same time of temperature detection, the structure is simplified, the installation space of a client is reduced, and the product purchase cost is reduced.
The range of the ceramic core body can be selected according to the requirement of a customer. The length of the temperature probe can be customized according to the requirements of customers. The resistance value of the temperature probe changes along with the change of the temperature to form a variable resistor; the capacitance value of the pressure core (temperature and pressure sensor core) changes along with the change of pressure to form a variable capacitor; and (3) introducing the 2 changed signal values into a conditioning circuit for signal processing, and then outputting signals (voltage, current and the like) which can be identified by the client. Thereby realizing the temperature and pressure measurement of the sensor. The pressure test and the temperature test of the ceramic capacitive sensor are integrated, and the pressure test and the temperature test are integrated in the same sensor. And the installation space of the client and the product purchase cost are reduced.
Further, as shown in fig. 1, a connector 19 is mounted to the other end of the housing 15.
The beneficial effect of adopting the further technical scheme is that: the connector is used for connecting an external client side, plays a role in installation, facilitates installation and maintenance of the sensor, improves installation efficiency and reduces cost.
The connectors can be customized according to customer requirements, and the connectors are welded together.
As shown in fig. 1, a sealing ring 20 is further provided between the temperature and pressure sensor core body 17 and the temperature probe 16.
The beneficial effect of adopting the further technical scheme is that: the sealing ring plays a role in sealing, improves the sealing performance and improves the stability and the reliability of the sensor.
The temperature probe is placed in the inner cavity of the shell, the sealing ring can be an O-shaped ring, and the O-shaped ring is placed in the inner cavity of the shell.
As shown in fig. 1, further, an outer side wall of one end of the housing 15 is provided with a housing thread 21.
The beneficial effect of adopting the further technical scheme is that: the setting of shell screw thread, the installation and the maintenance of the shell of being convenient for improve the stability and the reliability of sensor.
The housing threads can be customized to the customer's needs.
As shown in fig. 1, further, one end of the outer shell 15 is provided with a first cavity 22, the middle of the outer shell 15 is provided with a second cavity 23, the first cavity 22 is communicated with the second cavity 23, one end of the temperature probe 16 is located in the first cavity 22, the other end of the temperature probe 16 is located in the second cavity 23, and the second end of the temperature probe 16 is connected to the warm-pressure sensor core 17.
The beneficial effect of adopting the further technical scheme is that: the arrangement of cavity is convenient for installation and maintenance of sensor internal elements, improves the stability and the reliability of sensor. One end of the temperature probe is positioned in the first cavity, and the temperature probe is protected.
As shown in fig. 1, further, a boss 24 is provided between the first cavity 22 and the second cavity 23, and a gap 25 is provided between the boss 24 and the side wall of the temperature probe 16.
The beneficial effect of adopting the further technical scheme is that: the arrangement of the boss improves the load strength of the shell. The gap is arranged so that pressure can act on the diaphragm of the temperature and pressure sensor core.
The gap 25 between the boss 24 and the side wall of the temperature probe 16 is a first gap.
As shown in fig. 1, further, the temperature and pressure sensor core 17 and the conditioning circuit 18 are located in the second cavity 23, and the temperature and pressure sensor core 17 is located between the conditioning circuit 18 and the temperature probe 16.
The beneficial effect of adopting the further technical scheme is that: the conditioning circuit is used for converting the collected temperature and pressure signals into identifiable signals at the rear end.
The temperature probe is placed in the inner cavity of the shell; the O-shaped ring is placed in the inner cavity of the shell; the ceramic core body and the conditioning circuit PCB are welded together; welding the connectors together; after welding, the materials are put into the inner cavity of the shell; then riveting is carried out; and dotting a circle of silica gel on the riveted interface surface.
Function of the various components: the shell plays a role in protection and installation; the temperature probe plays a role in temperature testing; the O-shaped ring plays a role in sealing; the ceramic plays a role in pressure testing and connecting the data of the temperature probe to the conditioning circuit; the conditioning circuit plays a role in signal processing and feedback; the connector plays a mounting role; silica gel plays waterproof dustproof effect.
As shown in fig. 2 to 13, further, the temperature and pressure sensor core 17 includes: the temperature sensor comprises a cover plate 1, a diaphragm 2, a cover plate electrode line 3 with a temperature acquisition function and a diaphragm electrode 4, wherein the cover plate electrode line 3 is printed on the cover plate 1, the diaphragm electrode 4 is printed on the diaphragm 2, the diaphragm 2 is installed in the cover plate 1, and the temperature probe 16 and the conditioning circuit 18 are connected with the cover plate electrode line 3.
The beneficial effect of adopting the further technical scheme is that: the cover plate electrode circuit on the cover plate and the diaphragm electrode on the diaphragm form a capacitance structure, and when the diaphragm deforms under stress, the capacitance value changes, so that pressure measurement is realized. Pressure test and temperature test are integrated in the same core body, the pressure of gas and liquid can be tested at the same time of temperature detection, the structure is simplified, the installation space of a client is reduced, and the product purchase cost is reduced.
As shown in fig. 2 to 13, further, a gap is provided between the cover plate electrode line 3 and the diaphragm electrode 4, and the diaphragm electrode 4 and the cover plate electrode line 3 are correspondingly disposed; the cover plate 1 is a ceramic cover plate, and the diaphragm 2 is a ceramic diaphragm; a plurality of first windows 9 convenient for transmission of temperature signals and pressure signals are arranged on the cover plate 1, a first temperature signal connector 10 and a pressure signal connector 11 are installed in the plurality of first windows 9, and the conditioning circuit 18 is connected with the cover plate electrode circuit 3 through the first temperature signal connector 10 and the pressure signal connector 11; a pair of second windows 12 for facilitating signal transmission between the temperature probe 16 and the conditioning circuit 18 are arranged on the diaphragm 2, a second temperature signal connector 13 is installed in the second windows 12, and the temperature probe 16 is connected with the cover plate electrode line 3 through the second temperature signal connector 13.
The beneficial effect of adopting the further technical scheme is that: a gap is formed between the cover plate electrode circuit and the diaphragm electrode, so that the cover plate electrode circuit on the cover plate and the diaphragm electrode on the diaphragm form a capacitance structure, and when the diaphragm deforms under stress, the capacitance value changes, and pressure measurement is realized. The diaphragm electrode and the cover plate electrode circuit are correspondingly arranged, so that pressure testing and temperature testing are integrated in the same core body, the pressure of gas and liquid can be tested simultaneously in temperature detection, the structure is simplified, the installation space of a client is reduced, and the product purchase cost is reduced. The cover plate is a ceramic cover plate, the diaphragm is a ceramic diaphragm, the installation and the maintenance of the core structure are facilitated, the core sensitivity is improved, the detection precision is improved, and the cost is reduced. The arrangement of the first window facilitates installation and maintenance of the first temperature signal connector and the pressure signal connector, and facilitates connection of the core inner element and the core outer element. The second window is arranged, so that the second temperature signal connector can be conveniently installed and maintained, the core body internal element can be conveniently connected with the temperature probe, and the temperature probe and the conditioning circuit can be conveniently subjected to signal transmission.
The gap between the cover plate electrode line 3 and the diaphragm electrode 4 is a second gap.
As shown in fig. 2 to 13, further, a first glass 5 is disposed on the cover plate 1, a second glass 6 is disposed on the membrane 2, the cover plate electrode line 3 is located between the first glass 5 and the cover plate 1, the membrane electrode 4 is located between the second glass 6 and the membrane 2, and a counter bore 14 is disposed in the middle of the cover plate 1.
The beneficial effect of adopting the further technical scheme is that: the arrangement of the glass facilitates the installation and maintenance of the cover plate and the diaphragm, prevents the damage of an electrode circuit of the cover plate and an electrode of the diaphragm, and improves the insulating property. The counter bore is used as a positioning reference during mold opening, and production is facilitated. The stability and the reliability of core are improved, and the detection precision is improved.
The cover plate electrode circuit 3 is connected with a temperature probe for acquiring a temperature change value. The core can be the ceramic core, and the range of ceramic core can carry out the lectotype according to customer's demand. The length of the temperature probe can be customized according to the requirements of customers. The resistance value of the temperature probe changes along with the change of the temperature to form a variable resistor; the capacitance value of the pressure core body is distributed along with the change of the pressure to form a variable capacitor; and (3) introducing the 2 changed signal values into a conditioning circuit for signal processing, and then outputting signals (voltage, circuit and the like) which can be recognized by a client. Thereby realizing the temperature and pressure measurement of the sensor.
The first glass and the second glass must be of the same construction. The diaphragm sealing cover is characterized in that a first positioning groove 7 is formed in the cover plate 1, a second positioning groove 8 is formed in the diaphragm 2, and the first positioning groove 7 is matched with the second positioning groove 8. The setting of constant head tank for when the installation leads the diaphragm, the diaphragm of being convenient for is installed in the apron, improves the installation precision, improves the installation effectiveness.
The number of the first temperature signal connectors may be two, the number of the pressure signal connectors 11 may be three, and the three pressure signal connectors 11 may be adjacently disposed.
The conditioning circuit is used for converting the collected temperature and pressure signals into identifiable signals at the rear end. The second temperature signal connector 13 is connected with a temperature probe. The temperature and pressure sensor is a sensor with temperature and pressure detection functions. The connection structure of the components of the conditioning circuit is conventional and will not be described herein.
The cover plate 1 is a cylindrical cylinder with an opening at one end, and the diaphragm 2 is of a circular plate structure. The load intensity of the core body is improved, the internal elements of the core body are prevented from being damaged by external force, the core body is convenient to install and produce, and the reliability of the core body is improved.
The cover plate electrode circuit is printed on the cover plate, the diaphragm electrode is printed on the cover plate, the first glass is printed on the cover plate, the second glass is printed on the diaphragm, and the core body is manufactured after the pins are sealed and glued.
The working characteristics are as follows: the pressure test of gas and liquid can be realized to 2 windows (second window) through the bottom, the signal of leading-in temperature probe is into the conditioning circuit.
The working principle is as follows: the cover plate and the electrode printed on the diaphragm are sealed and connected to form a capacitor, when the diaphragm is stressed to form micro-deformation, the capacitance value changes, and the capacitance signal is amplified through signal conditioning to obtain a required signal, so that pressure measurement is realized.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A warm-pressure sensor, comprising: the temperature probe is located at one end of the shell, the temperature pressure sensor core is located at the middle of the shell, the temperature probe is connected with the temperature pressure sensor core, and the temperature pressure sensor core is connected with the conditioning circuit.
2. The temperature-pressure sensor as claimed in claim 1, wherein the other end of the housing is mounted with a connector.
3. The temperature-pressure sensor according to claim 1, wherein a sealing ring is arranged between the temperature-pressure sensor core body and the temperature probe.
4. The temperature-pressure sensor according to claim 1, wherein the outer wall of one end of the housing is provided with housing threads.
5. The warm-pressing sensor according to claim 1, wherein a first cavity is formed at one end of the housing, a second cavity is formed in the middle of the housing, the first cavity is communicated with the second cavity, one end of the temperature probe is located in the first cavity, the other end of the temperature probe is located in the second cavity, and the second end of the temperature probe is connected with the warm-pressing sensor core.
6. The warm-pressure sensor according to claim 5, wherein a boss is arranged between the first cavity and the second cavity, and a gap is arranged between the boss and the side wall of the temperature probe.
7. The warm-pressure sensor according to claim 5, wherein the warm-pressure sensor core and the conditioning circuit are located in the second cavity, and the warm-pressure sensor core is located between the conditioning circuit and the temperature probe.
8. The warm-pressure sensor according to claim 1, wherein the warm-pressure sensor core comprises: the temperature sensor comprises a cover plate, a diaphragm, a cover plate electrode circuit with a temperature acquisition function and a diaphragm electrode, wherein the cover plate electrode circuit is printed on the cover plate, the diaphragm electrode is printed on the diaphragm, the diaphragm is installed in the cover plate, and the temperature probe and the conditioning circuit are connected with the cover plate electrode circuit.
9. The temperature-pressure sensor according to claim 8, wherein a gap is formed between the cover plate electrode circuit and the diaphragm electrode, and the diaphragm electrode and the cover plate electrode circuit are correspondingly arranged; the cover plate is a ceramic cover plate, and the diaphragm is a ceramic diaphragm; the cover plate is provided with a plurality of first windows convenient for transmission of temperature signals and pressure signals, a first temperature signal connector and a pressure signal connector are installed in the first windows, and the conditioning circuit is connected with the cover plate electrode circuit through the first temperature signal connector and the pressure signal connector; the diaphragm is provided with a pair of second windows which are convenient for the signal transmission of the temperature probe and the conditioning circuit, a second temperature signal connector is installed in the second windows, and the temperature probe is connected with the cover plate electrode circuit through the second temperature signal connector.
10. The temperature-pressure sensor according to claim 8, wherein a first glass is provided on the cover plate, a second glass is provided on the diaphragm, the cover plate electrode line is located between the first glass and the cover plate, the diaphragm electrode is located between the second glass and the diaphragm, and a counter bore is provided in a middle portion of the cover plate.
CN202210824998.1A 2022-07-13 2022-07-13 Temperature and pressure sensor Pending CN115388938A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210824998.1A CN115388938A (en) 2022-07-13 2022-07-13 Temperature and pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210824998.1A CN115388938A (en) 2022-07-13 2022-07-13 Temperature and pressure sensor

Publications (1)

Publication Number Publication Date
CN115388938A true CN115388938A (en) 2022-11-25

Family

ID=84117121

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210824998.1A Pending CN115388938A (en) 2022-07-13 2022-07-13 Temperature and pressure sensor

Country Status (1)

Country Link
CN (1) CN115388938A (en)

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2179710C2 (en) * 2000-03-07 2002-02-20 Государственный инженерный университет Армении Method of in-operation adjustment of absolute-pressure capacitance sensor for determination of flying vehicle altitude
CN1760642A (en) * 2005-10-28 2006-04-19 中国船舶重工集团公司第七一一研究所 Temperature-pressure sensor
CN2784883Y (en) * 2005-02-04 2006-05-31 桂林电子工业学院 Floating type voltage and temperature monitoring probe for accumulator battery
DE102005060652A1 (en) * 2005-12-19 2007-06-21 Robert Bosch Gmbh Combined pressure and temperature module for use with motor vehicles having a CO2 based air conditioning system has a pressure sensor arranged around a central temperature sensor
US20100162821A1 (en) * 2008-12-26 2010-07-01 Yusuke Takeuchi Mems device and method for fabricating the same
WO2012071693A1 (en) * 2010-11-29 2012-06-07 Wu Maoting Pressure and temperature measuring device
KR20120067393A (en) * 2010-12-16 2012-06-26 대양전기공업 주식회사 A pressure sensor module packaging having metal diaphragm
EP2921837A1 (en) * 2014-03-20 2015-09-23 Azbil Corporation Electrostatic capacitance type pressure sensor
CN108398161A (en) * 2018-03-21 2018-08-14 江苏盛仕铭科技有限公司 A kind of temperature, pressure one transmitter
CN211147881U (en) * 2019-11-07 2020-07-31 常州市雷利压力控制器有限公司 Ceramic temperature and pressure sensor
CN111595384A (en) * 2020-06-03 2020-08-28 山东电工电气集团有限公司 Temperature and pressure integrated sensor for oil-immersed bushing
CN112729388A (en) * 2020-12-22 2021-04-30 常州天川机电科技有限公司 Digital three-parameter safety monitoring probe
CN214173453U (en) * 2021-08-02 2021-09-10 南京新力感电子科技有限公司 Temperature and pressure integrated sensor
CN214251100U (en) * 2021-02-05 2021-09-21 新乡北方车辆仪表有限公司 Temperature and pressure integrated sensor
CN113514664A (en) * 2021-07-27 2021-10-19 美卓伦仪表(常州)有限公司 Built-in temperature and pressure detection ultrasonic flow velocity sensor and mounting method
CN113984255A (en) * 2021-11-05 2022-01-28 深圳信息职业技术学院 Packaging structure of pressure sensor chip with temperature compensation
CN216645457U (en) * 2022-01-26 2022-05-31 廊坊市金装机械设备有限公司 Temperature and pressure integrated sensor
CN216917177U (en) * 2022-01-06 2022-07-08 江苏鼎力华业测控技术有限公司 Temperature and pressure integrated sensor for pressure tank car

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2179710C2 (en) * 2000-03-07 2002-02-20 Государственный инженерный университет Армении Method of in-operation adjustment of absolute-pressure capacitance sensor for determination of flying vehicle altitude
CN2784883Y (en) * 2005-02-04 2006-05-31 桂林电子工业学院 Floating type voltage and temperature monitoring probe for accumulator battery
CN1760642A (en) * 2005-10-28 2006-04-19 中国船舶重工集团公司第七一一研究所 Temperature-pressure sensor
DE102005060652A1 (en) * 2005-12-19 2007-06-21 Robert Bosch Gmbh Combined pressure and temperature module for use with motor vehicles having a CO2 based air conditioning system has a pressure sensor arranged around a central temperature sensor
US20100162821A1 (en) * 2008-12-26 2010-07-01 Yusuke Takeuchi Mems device and method for fabricating the same
WO2012071693A1 (en) * 2010-11-29 2012-06-07 Wu Maoting Pressure and temperature measuring device
KR20120067393A (en) * 2010-12-16 2012-06-26 대양전기공업 주식회사 A pressure sensor module packaging having metal diaphragm
EP2921837A1 (en) * 2014-03-20 2015-09-23 Azbil Corporation Electrostatic capacitance type pressure sensor
CN108398161A (en) * 2018-03-21 2018-08-14 江苏盛仕铭科技有限公司 A kind of temperature, pressure one transmitter
CN211147881U (en) * 2019-11-07 2020-07-31 常州市雷利压力控制器有限公司 Ceramic temperature and pressure sensor
CN111595384A (en) * 2020-06-03 2020-08-28 山东电工电气集团有限公司 Temperature and pressure integrated sensor for oil-immersed bushing
CN112729388A (en) * 2020-12-22 2021-04-30 常州天川机电科技有限公司 Digital three-parameter safety monitoring probe
CN214251100U (en) * 2021-02-05 2021-09-21 新乡北方车辆仪表有限公司 Temperature and pressure integrated sensor
CN113514664A (en) * 2021-07-27 2021-10-19 美卓伦仪表(常州)有限公司 Built-in temperature and pressure detection ultrasonic flow velocity sensor and mounting method
CN214173453U (en) * 2021-08-02 2021-09-10 南京新力感电子科技有限公司 Temperature and pressure integrated sensor
CN113984255A (en) * 2021-11-05 2022-01-28 深圳信息职业技术学院 Packaging structure of pressure sensor chip with temperature compensation
CN216917177U (en) * 2022-01-06 2022-07-08 江苏鼎力华业测控技术有限公司 Temperature and pressure integrated sensor for pressure tank car
CN216645457U (en) * 2022-01-26 2022-05-31 廊坊市金装机械设备有限公司 Temperature and pressure integrated sensor

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
唐力强;李民强;陈建群;李鹏;: "基于厚膜技术的双电容陶瓷压力传感器", 仪表技术与传感器, no. 07, 25 July 2006 (2006-07-25) *
常慧敏;李民强;王英先;关柯;高理升;: "一种厚膜电容式压力敏感芯片", 仪表技术与传感器, no. 11, 15 November 2009 (2009-11-15) *

Similar Documents

Publication Publication Date Title
US10634569B2 (en) Pressure-measuring device with improved reliability and associated calibration method
KR20110040546A (en) Vertical pressure sensor
CN211234817U (en) Temperature and pressure sensor
KR20230116933A (en) Sensor assembly and valve unit
CN210243062U (en) Dual-redundancy differential pressure sensor
EP0352240B1 (en) A very-high-pressure transducer, particularly for detecting the pressure of a hydraulic fluid
CN105973525A (en) High-reliability piezoresistive pressure sensor
CN115388938A (en) Temperature and pressure sensor
CN115342966A (en) Temperature and pressure sensor core and mounting method
CN110988439A (en) Detection head and alternating voltage detection device
US6722205B2 (en) Unitary pressure sensor housing and assembly
CN116576998A (en) Shaft force sensor
CN219348004U (en) Sensor with temperature and pressure dual current output
CN112304475A (en) Controllable contact pin type pressure sensor for pressure detection
CN215338686U (en) Miniaturized high-precision silicon resonance pressure sensor structure
CN218628724U (en) Dual-redundancy pressure sensor structure
CN220018565U (en) Temperature and pressure compound sensor
CN220982524U (en) Pressure sensor system
CN211954540U (en) Intelligent monocrystalline silicon pressure differential pressure transmitter
CN220418710U (en) Pressure sensor
CN218628423U (en) High-pressure-resistant temperature and pressure integrated sensor
CN211741394U (en) Detection head and alternating voltage detection device
CN220187895U (en) Diaphragm type pressure sensor
CN220380654U (en) Low pressure sensor
CN216410434U (en) Temperature sensor structure

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination